HP HSMH-T400, HSMH-T500, HSMH-T600, HSMH-T700, HSME-T700 Datasheet
...
Surface Mount LED Indicator
H
Technical Data
Features
• Compatible with Automatic
Placement Equipment
• Compatible with Infrared
and Vapor Phase Reflow
Solder Processes
• Packaged in 12 mm or 8 mm
tape on 7" or 13" Diameter
Reels
• EIA Standard Package
• Low Package Profile
• Nondiffused Package
Excellent for Backlighting
and Coupling to Light Pipes
Description
These solid state surface mount
indicators are designed with a flat
top and sides to be easily handled
by automatic placement
equipment. A glue pad is provided
for adhesive mounting processes.
They are compatible with
convective IR and vapor phase
reflow soldering and conductive
epoxy attachment processes.
The package size and configuration conform to the EIA-535
BAAC standard specification for
case size 3528 tantalum
capacitors. The folded leads
HSMD-TX00
HSME-TX00
HSMG-TX00
HSMH-TX00
HSMS-TX00
HSMY-TX00
permit dense placement and
provide an external solder joint
for ease of inspection.
These devices are nondiffused,
providing high intensity for
applications such as backlighting,
light pipe illumination, and front
panel indication.
Device Selection Guide
DH AS High High
AlGaAs Efficiency Performance Emerald
Red Red Orange Yellow Green Green
HSMH- HSMS- HSMD- HSMY- HSMG- HSME- Description
T400 T400 T400 T400 T400 T400 12 mm Tape, 7" Reel,
2000 Devices
T500 T500 T500 T500 T500 T500 12 mm Tape, 13" Reel,
8000 Devices
T600 T600 T600 T600 T600 T600 8 mm Tape, 7" Reel,
2000 Devices
T700 T700 T700 T700 T700 T700 8 mm Tape, 13" Reel,
8000 Devices
1-204
5964-9359E
Package Dimensions
3.5 ± 0.2
(0.138 ± 0.008)
2.8 ± 0.2
(0.110 ± 0.008)
0.7
(0.028)
0.8 ± 0.3
(0.031 ± 0.012)
(2 PLACES)
MIN.
(0.087)
3.1
(0.122)
(0.004)
NOM.
2.2
0.1
1.3
(0.050)
MIN.
NOM.
NOM.
Tape and Reel Specifications
Hewlett Packard surface mount
LEDs are packaged tape and reel
in accordance with EIA-481A,
Taping of Surface Mount
2.7
NOM.
(0.106)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. THE LEADS ARE COPPER ALLOY, 85% Sn/15% Pb PLATING.
CATHODE NOTCH
1.9 ± 0.2
(0.075 ± 0.008)
2.2 ± 0.1
(0.087 ± 0.004)
Components for Automatic
Placement. This packaging
system is compatible with tapefed automatic pick and place
systems. Each reel is sealed in a
vapor barrier bag for added
protection. Bulk packaging in
vapor barrier bags is available
upon special request.
CATHODE
PITCH: 4 mm (0.157 IN.)
CARRIER TAPE WIDTH:
12 mm (0.472 IN.) OR 8 mm (0.315 IN.)
USER FEED
DIRECTION
HEWLETT
hp
PACKARD
REEL DIAMETER:
178 mm (7 IN.) OR 330 mm (13 IN.)
1-205
Absolute Maximum Ratings at T
= 25°C
A
DH AS High High
AlGaAs Efficiency Perf. Emerald
Parameter Red Red Orange Yellow Green Green Units
DC Forward 30 30 30 30 30 30 mA
Current
[1]
Peak Forward 300 90 90 60 90 90 mA
Current
[2]
Average 20 25 25 20 25 25 mA
Forward
Current
[2]
LED Junction 95 °C
Temperature
Transient
Forward
Current
[3]
(10 µs Pulse) 500 mA
Reverse Voltage 5 V
(IR = 100 mA)
Operating -40 to +85 -20 to +85 °C
Temperature
Range
Storage -40 to +85 °C
Temperature
Range
Reflow Soldering
Temperature
Convective IR 235°C Peak, above 185°C for 90 seconds.
Vapor Phase 215°C for 3 minutes.
Notes:
1. Derate dc current linearly from 50°C: For AlGaAs red, high efficiency red, and green devices at 0.67 mA/°C. For yellow devices at
0.44 mA/°C.
2. Refer to Figure 5 showing Maximum Tolerable Peak Current vs. Pulse duration to establish pulsed operating conditions.
3. The transient peak current is the maximum non-recurring peak current the device can withstand without damaging the LED die and
wire bond. The device should not be operated at peak currents above the Absolute Maximum Peak Forward Current.
1-206
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