HP HSMD-H670, HSMD-H690, HSMG-H670, HSMG-H690, HSMY-H670 Datasheet

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Surface Mount Flip Chip LEDs
Technical Data
HSMX-H670 Series HSMX-H690 Series

Features

• Improved Reliability Through Elimination of Internal Wire Bond
• -40 to 85°C Operating Temperature Range
• Small Size
• Industry Standard Footprint
• Diffused Optics
• Compatible with IR Solder Process
• Four Colors Available
• Available in 8 mm Tape on 7" (178 mm) Diameter Reels

Applications

• Keypad Backlighting
• LCD Backlighting
• Symbol Backlighting
• Front Panel Indicator

Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.
The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. The HSMX-H690 adheres to the 1.6 x 0.8 mm
industry standard footprint. The low 0.6 mm profile make this excellent for designs where space is limited.
Both packages are compatible with IR and convective reflow soldering processes.

Device Selection Guide

High
Footprint Efficiency
[1][2]
(mm)
1.6 x 0.8 x 0.6 HSMS-H690 HSMD-H690 HSMY-H690 HSMG-H690
2.0 x 1.25 x 1.1 HSMS-H670 HSMD-H670 HSMY-H670 HSMG-H670
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Red Orange Yellow Green

Package Dimensions

0.40
(0.016)

HSMX-H670 Series

CATHODE MARK
POLARITY
2.00
(0.079)
1.10
1.27
(0.050)
0.50 (0.020)
0.40 (0.016)
0.48 (0.019)
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).
3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05 MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.
(0.043)
1.25
(0.049)

HSMX-H690 Series

POLARITY
1.00
0.30
0.80
1.60
BOTTOMSIDE CATHODE MARK
0.60
TOPSIDE CATHODE MARK
Absolute Maximum Ratings at T
= 25°C
A
Parameter HSMX-H670 HSMX-H690 Units
DC Forward Current
[1]
20 20 mA
Power Dissipation 50 50 mW Reverse Voltage (IR = 100 µA) 5 5 V Operating Temperature Range -40 to +85 -40 to +85 °C
Storage Temperature Range
Notes:
1. Derate linearly as shown in Figure 4 for temperatures above 25°C.
2. Maximum temperature for tape and reel packaging is 60°C.
[2]
-40 to +85 -40 to +85 °C
Optical Characteristics at T
= 25°C
A
Luminous Color, Viewing Luminous
Intensity Peak Dominant Angle Efficacy
IV (mcd) Wavelength Wavelength 2θ
Part @ IF = 20 mA
[1]
λ
(nm) λ
peak
[2]
(nm) Degrees
d
1/2
[3]
η
v
(lm/W)
Number Color Min. Typ. Typ. Typ. Typ.
HSMS-H6X0 High
Efficiency 1.6 5.0 639 626 165 145
Red HSMD-H6X0 Orange 1.6 4.0 606 604 165 380 HSMY-H6X0 Yellow 1.6 5.0 584 586 165 500 HSMG-H6X0 Green 4.0 9.0 566 571 165 595
Notes:
1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package.
2. The dominant wavelength λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
3. θ
is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
1/2
Electrical Characteristics at T
= 25°C
A
Forward Reverse Capacitance
Voltage Breakdown C (pF), Thermal
VF (Volts) VR (Volts) VF = 0, Resistance
Part @ IF = 20 mA @ I
= 100 µA f = 1 MHz Rθ
R
J-PIN
Number Color Typ. Max. Min. Typ.
HSMS-H670 High Efficiency 2.0 2.6 5 6 250 HSMS-H690 Red
HSMD-H670 Orange 2.0 2.6 5 5 250 HSMD-H690
HSMY-H670 Yellow 2.1 2.6 5 5 250 HSMY-H690
HSMG-H670 Green 2.3 2.6 5 5 250 HSMG-H690
(°C/W)
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