HP Elite x2 1012 G1 Quickspecs

QuickSpecs

HP Elite x2 1012 G1

Overview

Not all configuration components are available in all regions/countries.

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Page 1

HP Elite x2 1012 G1

1.

Combo Headset

6.

Kickstand

2.

USB A

7.

ClickPad

3.

SD Card Slot

8.

Front Camera

4.

USB Type-C™

9.

Microphones

5.

Power LED

10.

Camera LED

1.

Tip

7.

Volume Up/Volume down

2.

Erase

8.

SIM card slot

3.

Select

9.

Lock Slot

4.

Clip

10.

There is no slot in there, it’s just to open the kickstand.

5.

Application Launch Button (Default OneNote)

11.

Tether

6.

Power

QuickSpecs

HP Elite x2 1012 G1

Overview

Not all configuration components are available in all regions/countries.

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Page 2

1.

Camera

3.

Fingerprint Reader (optional)

2.

Camera Flash

Advanced Keyboard

1.

Smartcard Slot

2.

ClickPad/NFC area

QuickSpecs

HP Elite x2 1012 G1

Overview

Not all configuration components are available in all regions/countries.

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Travel Keyboard

1.

ClickPad

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

Not all configuration components are available in all regions/countries.

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At A Glance

 Designed for excellent mobility this stylish and thin 2-in-1 design is built to the standards of Elite durability
 The quiet fanless design and 10 hours of battery life

1

lets you work, surf, and connect with colleagues

 Windows 10 versions, Web support for Windows 8.1
 6

th

Generation Intel® Core™ M processors, some with vPro™ support2

 12.0" diagonal ultra-slitm LED-backlit Full HD (1920 x 1280) Multi-Touch Display
 Solid State Drives up to 512 GB , PCLe NVMe drives support up to 256GB
 Weight starting at 820g for Tablet
 Height starting at 8.05mm for Tablet
 MIL-STD 810G tested

o MIL STD is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for

military use. MIL STD test results are not a guarantee of future performance under these test conditions. Damage
from drops requires separately purchase Accidental Damage Protection HP Care Pack.


 Audio by Bang & Olufsen
 Dual microphone array with HP Advanced Noise Reduction Software
 Front and Back facing camera and webcam
 Supports a broad range of wireless broadband and Wi-Fi options for connectivity on the go
 Optimized security using industry standard technologies such as TPM2.0, optional integrated fingerprint reader and an

optional smart card reader in the optional Advanced keyboard

 Protect your device and data using the latest HP security technology solutions: HP Sure Start, HP BIOSphere and HP Client

Security.

 Standard commercial 1 year limited warranty with extended service available with optional HP Care Packs.

NOTE: See important legal disclosures for all listed specs in their respective features sections.

1

Windows 10 MM14 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery will
naturally decrease with time and usage. See www.bapco.com for additional details.

2

vPro™ support not available on all configurations.

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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PRODUCT NAME

HP Elite x2 1012 G1

OPERATING SYSTEM

Preinstalled

Windows 10 Pro 64*
Windows 10 Home 64*

Web-only Support

Windows 10 Pro 64
Windows 10 Home 64
Windows 10 Enterprise 64
Windows 8.1 Pro 64
Windows 8.1 64
Windows 8.1 Enterprise 64

* Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately
purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is
automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for
updates. See http://http://www.microsoft.com

PROCESSOR*

Intel® Core™ M processor, 6th Generation processors:

Intel® Core™ M7-6Y75 with Intel HD Graphics 515
(1.2 GHz, up to 3.1 GHz with Intel Turbo Boost Technology**, 4 MB cache, 2 cores), vPro™ Support

Intel® Core™ M5-6Y57 with Intel HD Graphics 515
(1.1 GHz, up to 2.8 GHz with Intel Turbo Boost Technology**, 4 MB cache, 2 cores), vPro™ Support

Intel® Core™ M5-6Y54 with Intel HD Graphics 515***
(1.1 GHz, up to 2.7 GHz with Intel Turbo Boost Technology**, 4 MB cache, 2 cores)

Intel® Core™ M3-6Y30 with Intel HD Graphics 515
(0.9 GHz, up to 2.2 GHz with Intel Turbo Boost Technology**, 4 MB cache, 2 cores)

* Multi-Core is designed to improve performance of certain software products. Not all customers or software applications will
necessarily benefit from use of this technology.. Performance and clock frequency will vary depending on application
workload and your hardware and software configurations. Intel’s numbering is not a measurement of higher performance.
** Intel® Turbo Boost technology requires a PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost
performance varies depending on hardware, software and overall system configuration. See

http://www.intel.com/technology/turboboost for more information.

***Available for SMB store and Channel only. Not recommended for corporate enterprise deployments.

CHIPSET

Integrated with processor

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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GRAPHICS

Intel® HD Graphics 515

DISPLAY

Internal

Touch screen

12.0" diagonal BrightView LED-backlit WUXGA UWVA eDP 1.3 Ultra-slim (1920 x 1280 – Full HD*) Touch screen Chemically­strengthened Corning® Gorilla® Glass 4 top cover directly bonded to display

Refresh Rate

60 Hz

Brightness

340 nits (typical)

Pixel Resolution

Format

1920 x 1280 (WUXGA+)

Configuration

RGB Stripe

Interface

eDP 1.3

LCD Mode

IPS/FFS/VA

PPI

192 ppi

Viewing Angle

UWVA 85/85/85/85 (Left/Right/Down/Up)

External

24-bit + 8 bit alpha channel (standard)

Up to 30-bit per pixel color depth (Wide Color Gamut)

* HD content required to view HD images.

NOTE: Resolutions are dependent upon monitor capability, and resolution and color depth settings.

STORAGE AND DRIVES

Internal Storage*

Supports M.2 SSD SS 2280
128 GB SATA III Solid State Drive
180 GB SATA III Solid State Drive
180 GB SATA III SED OPAL2 Solid State Drive
256 GB SATA III Solid State Drive
256 GB SATA III Solid State Drive PCle NVMe
256 GB SATA III SED OPAL2 Solid State Drive
512 GB SATA III Solid State Drive

* For SSD's, GB=1 billion bytes. TB=1 trillion bytes. Actual formatted capacity is less. Up to 16 GB (for Windows 7) and up to 30
GB (for Windows 8 and 10) of system disk is reserved for system recovery software.

Expansion Storage

Micro SD Media Reader Slot - Supports microSD, microSDHC, microSDXC, supporting expansion up to 200GB

MEMORY

LPDDR3-1866 (Transfer rates up to 1866 MT/s)
Supports Dual Channel Memory
Soldered Down

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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Standard
4 GB Total System Memory
8 GB Total System Memory

Maximum
Up to 8 GB

NETWORKING/COMMUNICATIONS

Wireless

Support for a broad range of secure, integrated wireless LAN and wireless WAN options featuring support for the latest
industry standards. Broadband Wireless (WWAN) requires a Windows operating system and is available in select countries as
a standard, factory configurable feature only. Integrated Bluetooth is also available (factory configurable only) and is
supported via combo card.

Wireless WAN (WWAN)*

HP hs3110 HSPA+ Intel® Mobile Broadband*
HP lt4120 Qualcomm® Snapdragon™ X5 LTE Mobile Broadband*
HP lt4225 LTE/EV-DO Gobi™ 4G Mobile Broadband*
HP lt4226 LTE/HSPA+ Gobi™ 4G Mobile Broadband*

Wireless LAN (WLAN)**

Intel® Dual Band Wireless-AC 8260 802.11a/b/g/n/ac (2x2) WiFi and Bluetooth® 4.2 Combo;
Intel® Tri Band Wireless-AC 18260 802.11a/b/g/n/ac (2x2) and Bluetooth® 4.2 + WiGig Combo;

* WWAN is an optional feature and requires factory configuration. WWAN connection requires wireless data service contract,
network support, and is not available in all areas. Contact service provider to determine the coverage area and availability.
Connection speeds will vary due to location, environment, network conditions, and other factors. 4G LTE not available on all
products, in all regions
**Wireless access point and Internet service is required and is not included. Availability of public wireless access points
limited.
***The WiGig-compatible notebook or tablet must be positioned within 1.2 m (4 ft) and without obstruction in the line of sight
of the wireless dock. HP Advanced Wireless Docking is compatible with the HP Elite x2 1012 G1 with an optional installed
Intel Tri Band Wireless AC with WiGig Combo card available at the time of purchase.

AUDIO/MULTIMEDIA

Audio

Audio by Bang & Olufsen
Dual speakers (top facing)
Dual microphone array with echo cancellation, noise suppression
Headphone line-out and microphone-in (combo)
HP Advanced Noise Reduction Software

Camera – Front
Integrated 2 MP (1080p)

 1080p format for video
 2 MP for still capture
 Supports videoconferencing* and still image capture
 High quality fixed focus lens
 Video capture at various resolutions up to 1920x1080 resolution (1080p) and up to 30 fps
 M-JPEG compression supports higher frame rates for video capture and videoconferencing*

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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 Improved low light sensitivity
 Improved dynamic range

Camera – Back
Integrated 5 MP (1080p)

 1080p format for video
 5 MP for still capture
 Supports videoconferencing* and still image capture
 High quality auto focus lens
 Video capture at various resolutions up to 1920x1080 resolution (1080p) and up to 30fps
 M-JPEG compression supports higher frame rates for video capture and videoconferencing*
 Improved low light sensitivity
 Improved dynamic range

* Internet access required.

ACTIVE PEN

HP Active Pen with Bluetooth® App Launch

Pen Technology

Wacom

Digitizer

N/A, shared with touch

Dimensions

147.29 x 9.5 mm

Weight

17.5 g

Power

AAAA battery and 319 coin cell x2

System Requirements

Windows 8.1/10

Tip Diameter

1 mm

Pressure Sensitivity
(Y/N)

Yes (2048 levels)

Buttons (Y/N)

Yes, 3

Resolution

2540 ppi

Hover Capability (Y/N)

Yes

Hover Height (mm)

10mm+ (max to 15mm)

Off Screen Writing
Supported (Y/N)

8 mm+

Palm Rejection (Y/N)

Yes

Tilt Angle (Y/N)

Yes

3D Input Support (Y/N)

Change to >60° from vertical

Battery Life Based on
Continuous Usage

7.5 month+ with 1 hour non-stop usage per day

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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OPTIONAL KEYBOARDS

Optional HP Elite x2 1012 G1 Travel Keyboard*

Kit contents

HP Elite x2 1012 G1 Travel Keyboard and documentation

Weight

.848 lb (385 g)

Optional HP Elite x2 1012 Advanced Keyboard *

Kit contents

HP Elite x2 1012 Advanced Keyboard and documentation

Key Features

Smart card reader FIPS-201 compliant.

Security - Near Field Communications (NFC) Module

Weight

.992 lb (450 g)

*Sold only as an optional feature

Keyboard Features (common to both Travel and Advanced Keyboards)

 Backlit
 HP Dura Keys
 ClickPad™ (91 x 51 mm) with image sensor, multi-touch gestures enabled, on/off function and LED indicator
 150° viewing angle
 Docking connector to tablet
 Full size 81/82-key island-style backlit keyboard with full row of function keys and LED indicators

Function Keys

F1 - Blank
F2 - Blank
F3 - Sleep
F4 - Display Switching
F5 - Mute
F6 - Volume Down
F7 - Volume Up
F8 - Mic Mute
F9 - Brightness Down
F10 - Brightness Up
F11 - Backlight Toggle
F12 - Wireless On/Off

ClickPad

Glass with chemical etched surface
Supports 2-way scroll
Taps enabled as default
Gestures enabled by default - 2 Finger Scrolling, 2 Finger Zoom (Pinch)

SOFTWARE AND SECURITY

Preinstalled Software with Windows Operating System

HP BIOS

HP BIOSphere1
HP Sure Start with Dynamic Protection
HP DriveLock | HP Automatic DriveLock
HP BIOS Protection2
HP SpareKey

3

BIOS Update via Network

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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Master Boot Record Security
Power On Authentication
Pre-Boot Security
Secure Erase4
Hybrid Boot (Windows 8.1 only)
Measured Boot (Windows 8.1 only)
Secure Boot (Windows 8.1 only)
Absolute Persistence Module5

MultiMedia

Cyberlink Power2Go
Cyberlink Power DVD

Communication

HP Mobile Connect Pro

6

Intel WiDi Software7

HP Value Add Software

HP ePrint Driver 8
HP Hotkey Support
HP Support Assistant
HP Recovery Manager (Windows 7 only)
HP Recovery Disc Creator (Windows 7 only)
HP Noise Reduction Software

3rd Party

Foxit PhantomPDF Express for HP

Microsoft Products
Buy Office

Bing Search
Skype9

Manageability

HP Driver Packs 10
HP SoftPaq Download Manager (SDM)
HP System Software Manager (SSM)10
HP BIOS Config Utility (BCU)10
HP Client Catalog10
HP CIK for Microsoft SCCM10
LANDESK Management

11

HP Touchpoint Manager12

For more information on HP Client Management Solutions refer to: http://www.hp.com/go/clientmanagement.

Client Security Software

HP Client Security

 HP Security Manager (including Credential Manager and Password Manager)
 HP Drive Lock
 HP Fingerprint Sensor
 HP Password Manager
 Absolute Persistence Module
 Power On Authentication

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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 Microsoft Security Essentials

13

 Microsoft Defender

13

Standard

TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified)
HP Fingerprint Reader (selected models)

For more information on HP Client Security Software Suite, refer to http://www.hp.com/go/clientsecurity.

1. HP BIOSphere features may vary depending on the PC platform & configuration.

2. HP BIOS Protection requires a HPTools partition for automatic recovery.

3. Requires initial user set up.

4. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88.

5. BIOS Absolute Persistence module is shipped turned off, and will be activated when customers purchase and activate a

subscription. Service may be limited. Check with Absolute for availability outside the U.S. The optional subscription
service of Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/computrace-agreement. If Data Delete is utilized, the Recovery
Guarantee payment is null and void. In order to use the Data Delete service, customers must first sign a Pre­Authorization Agreement and either create a PIN or purchase one or more RSA SecurID tokens from Absolute Software.

6. HP Mobile Connect Pro is only available on preconfigured devices with WWAN. For geographic availability refer to

www.hp.com/go/mobileconnect

7. Integrated Intel Wi-Di feature is available on select configurations only and requires separately purchased projector, TV

or computer monitor with an integrated or external Wi-Di receiver. External Wi-Di receivers connect to the projector, TV
or computer monitor via a standard HDMI cable, also sold separately.

8. Requires an Internet connection to HP web-enabled printer and HP ePrint account registration (for a list of eligible

printers, supported documents and image types and other HP ePrint details, see

http://www.hp.com/go/businessmobileprinting).

9. Skype is not offered in China.

10. Not preinstalled, however available for download at http://www.hp.com/go/clientmanagement

11. LANDesk is an optional feature sold separately. Managed devices must be connected to the management server.

Location based functionality requires active LANdesk maintenance service. Wipe functionality performs a "Windows 8
Reset" and requires Windows 8. Lock performs a Windows "Lock Computer."

12. HP Touchpoint Manager requires purchase of a subscription and supports Android™, iOS and Windows 7 or higher

operating systems and PCs, notebooks, tablets and smartphones from various manufacturers. Not available in all
countries see www.hp.com/touchpoint for availability information.

13. Opt in and internet connection required for updates.

POWER

Power Supply

45W USB Type-C™ AC Adapter

 USB Type-C™ DC integrated cord (1.8m)
 AC Power cord (0.45m)
 AC Adapter Weight: 200g

Tablet – Battery
HP 4-cell, Long Life 40 WHr Li-Ion

 Voltage – 7.7 V

Battery Life*

Windows 10 battery time:
Up to 10 hours and 15 minutes*

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

Not all configuration components are available in all regions/countries.

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* Windows 10 MM14 battery life will vary depending on various factors including product model, configuration, loaded
applications, features, use, wireless functionality, and power management settings. The maximum capacity of the battery
will naturally decrease with time and usage. See www.bapco.com for additional details.

WEIGHTS & DIMENSIONS

Weight*

Tablet only

Starting at 1.8 lbs (820 g)

Tablet with Travel Keyboard

2.65 lbs (1205 g)

Tablet with Advanced Keyboard

2.79 lbs (1270 g)

Dimensions - (w x d x h)*

Tablet

11.8 x 8.4 x 0.3 in (300 x 213.5 x 8.05 mm)

Tablet with Travel Keyboard

11.8 x 8.4 x 0.5 in (300 x 213.5 x 13.45 mm)

Tablet with Advanced Keyboard

11.8 x 8.4 x 0.6 in (300 x 213.5 x 16.45 mm)

NOTE: Height varies depending upon where on the notebook the measurement is made.
Weight varies by configuration and components.

*Values are preliminary and may be updated before product launch.

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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PORTS/SLOTS

Tablet

Ports

1 USB Type-C™, supporting USB 3.1 (supports Thunderbolt™ 3)

1 USB Type-A, supporting USB 3.0

1 Headphone /microphone combo

NOTE: For optimal performance, the HP x2 1012 G1 should charge from a USB Power Delivery, v2 compatible adapter or
power source that offers 12V @ 3A.

Slots

1 Micro SIM drawer (optional)

Micro SD Media Reader Drawer -supports microSD, microSDHC, microSDXC

Lock slot

Advanced Keyboard

Ports

Slots

1 Smart Card Reader

SENSORS

Accelerometer

Magnetometer

Gyro

ALS (Ambient Light Sensor)

Proximity (SAR for WWAN)

Hail Sensor

SERVICE AND SUPPORT

HP Services offers 3-year, 1-year and 90 day limited warranty options depending on country. Batteries have a default one
year limited warranty except for Long Life batteries which will have same 1-year or 3-year limited warranty as the platform.
On-site service and extended coverage is also available. HP Care Pack Services are optional extended service contracts that
go beyond the standard limited warranties. To choose the right level of service for your HP product, use the HP Care Pack
Services Lookup Tool at: http://www.hp.com/go/cpc.

Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date
of hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc.

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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SYSTEM UNIT

Stand-Alone Power
Requirements (AC Power)

Nominal Operating
Voltage

12 V

Average Operating Power

Max Operating Power

< 36 W

Temperature
Operating

32° to 95° F (0° to 35° C) (not writing optical)
41° to 95° F (5° to 35° C) (writing optical)

Non-operating

-4° to 140° F (-20° to 60° C)

Relative Humidity
Operating

10% to 90%, non-condensing

Non-operating

5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature

Shock
Operating

40 G, 2 ms, half-sine

Non-operating

240 G, 2 ms, half-sine

Random Vibration
Operating

1.043 grms

Non-operating

3.50 grms

Altitude (unpressurized)
Operating

-50 to 10,000 ft (-15.24 to 3,048 m)

Non-operating

-50 to 40,000 ft (-15.24 to 12,192 m)

STORAGE AND DRIVES

128 GB* M.2 Solid State
Drive

Drive Weight

10 grams

Capacity

128 GB

Height

0.09 in (2.3mm)

Width

0.87 in (22 mm)

Interface

SATA 3 (6 Gb/s)

Performance
Maximum Sequential Read

Maximum Sequential Write

Up to 540 MB/s

Up to 300 MB/s

Logical Blocks

250,069,680

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; ATA-8; SATA 3.0; DIPM; TRIM; DVESLP

180 GB* M.2 Solid State
Drive

Drive Weight

10 grams

Capacity

180 GB

Height

0.09 in (2.3mm)

Width

0.87 in (22 mm)

Interface

SATA Gen 3 (6 Gb/s)

Performance

Maximum Sequential Read

Maximum Sequential Write

Up to 540 MB/s Compressible
performance)

Up to 490 MB/s (Compressible
performance)

Logical Blocks

351,651,888

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; ATA-8, SATA 3.0; DIPM; TRIM; DEVSLP

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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180 GB* M.2 Solid State
Opal 2 Drive

Drive Weight

10 grams

Capacity

180 GB

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Interface

SATA Gen 3 (6 Gb/s)

Performance

Maximum Sequential Read

Maximum Sequential Write

Up to 540 MB/s (Compressible
performance)

Up to 490 MB/s (Compressible
performance)

Logical Blocks

351,651,888

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TCG OPAL 2.x; ATA-8, SATA 3.0; DIPM; TRIM; DEVSLP

256 GB* M.2 Solid State
Drive

Drive Weight

10 grams

Capacity

256 GB

Height

0.09 (2.3mm)

Width

0.87 in (22 mm)

Interface

SATA Gen 3 (6 Gb/s)

Performance
Maximum Sequential Read

Maximum Sequential Write

Up to 540MB/s

Up to 455 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; ATA-8, SATA 3.0; DIPM; TRIM; DEVSLP

256 GB* M.2 Solid State
Opal 2 Drive

Drive Weight

10 grams

Capacity

256 GB

Height

0.09 (2.3 mm)

Width

0.87 in (22 mm)

Interface

SATA Gen 3 (6 Gb/s)

Performance
Maximum Sequential Read

Maximum Sequential Write

Up to 540 MB/s

Up to 460 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; TCG OPAL 2.x; ATA-8, SATA 3.0; DIPM; TRIM; DEVSLP

256 GB* M.2 Solid State
PCle 3X4 NVMe Drive

Drive Weight

10 grams

Capacity

256 GB

Height

0.09 (2.3 mm)

Width

0.87 in (22 mm)

Interface

SATA Gen 3 (6 Gb/s)

Performance

Maximum Sequential Read

Maximum Sequential Write

Up to 2260 MB/s

Up to 1260 MB/s

Logical Blocks

500,118,192

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; PCle Gen3x4, TRIM, L1.2

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

Not all configuration components are available in all regions/countries.

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512 GB* M.2 Solid State
Drive

Drive Weight

10 grams

Capacity

512 GB

Height

0.09 in (2.3 mm)

Width

0.87 in (22 mm)

Interface

SATA Gen 3 (6 Gb/s)

Performance
Maximum Sequential Read

Maximum Sequential Write

Up to 540 MB/s

Up to 500 MB/s

Logical Blocks

1,000, 215, 216

Operating Temperature

32° to 158°F (0° to 70°C) [ambient temp]

Features

ATA Security; ATA-8, SATA 3.0; DIPM; TRIM; DEVSLP

SECURITY

HP Fingerprint Reader

(Optional – available on
the Tablet)

Mobile Voltage Operation

3.0V-3.6V

Operating Temperature

14° – 167°F (-10° – 75°C)

Current Consumption
Image

36 mA peak

Low Latency Wait for
Finger

950 uA

Capture Rate

30 cm/sec

ESD Resistance

IEC 61000-4-2 4B (±15KV)

Detection Matrix

200*1 (plus another secondary line)
508 dpi
10 mm sensor area

NETWORKING/COMMUNICATIONS

WWAN Modules

HP hs3110 HSPA+ 3G Mobile Broadband Module*

Technology/Operating bands

HSPA+: 2100 (Band1), 1900 (Band 2), 1700 (Band 4), 850 (Band 5), 900 (Band 8) MHz
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 MHz (Band 5), 900 (Band 8) MHz

Wireless protocol standards

E-GPRS: Class B, Multi-slot class 33, coding schemes CS1 - CS4 and MSC1 - MSC9.
UMTS/WCDMA: Release 99 and Release 7

GPS

Standalone, A-GPS

GPS bands

1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz

Maximum data rates

HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)
HSPA: 7.2 Mbps (Download), 5.76 Mbps (Upload)
WCDMA PS: 384 kbps (Download), 384 kbps (Upload)
WCDMA CS: 64 kbps (Download), 64 kbps (Upload)
E-GPRS: 296 kbps (Download), 236.8 kbps (Upload)
GPRS: 107 kbps (Download), 85.6 kbps (Upload)

Maximum output power

HSPA+: 24 dBm
E-GPRS 1800/1900: 26 dBm
E-GPRS 850/900: 27 dBm
GPRS 1800/1900: 30 dBm
GPRS 850/900: 33 dBm

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Maximum power consumption

HSPA+: 1,100 mA (peak); 800 mA (average)
E-GPRS: 2,800 mA (peak); 700 mA (average)

Form Factor

M.2, 3042-S3 Key B

Weight

6 g

Dimensions
(Length x Width x Thickness)

1.65 x 1.18 x 0.09 in (42 x 30 x 2.3 mm)

* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not
available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to
location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

HP lt4120 Qualcomm® Snapdragon™ X5 LTE Mobile Broadband Module*

Technology/Operating bands

LTE: 2100 (Band 1), 1900 (Band 2), 1800 (Band 3),
1700/2100 (Band 4), 850 (Band 5), 2600 (Band 7), 900 (Band 8),
700 (Band 12 lower), 700 (Band 13 upper), 700 (Band 17 lower),
800 (Band 20), 700 (Band 28).
HSPA+: 2100 (Band 1), 1900 (Band 2), 1700/2100 (Band 4),
850 (Band 5), 900 (Band 8) MHz
EV-DO: 850 (BC0), 1900 (BC1) MHz (Only work with Verizon network)
E-GPRS: 1900 (Band 2), 1800 (Band 3), 850 (Band 5), 900 (Band 8)
MHz

Wireless protocol standards

3GPP Release 10 LTE Specification CAT.4, 20MHz BW
WCDMA R99, 3GPP Release 5, 6, 7 and 8 UMTS Specification
1xEVDO Release 0, A and B.
E-GPRS: Class B, Multi-slot class 12, coding schemes CS1 - CS4
and MSC1 - MSC9

GPS

Standalone, A-GPS (MS-A, MS-B and XTRA)

GPS bands

1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz

Maximum data rates

LTE: 150 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21Mbps (Download), 5.76 Mbps (Upload)
CDMA 1xRTT: 153.6 kbps (Download), 153.6 kbps (Upload)
EVDO Rel.A: 3.1 Mbps (Download), 1.8 Mbps (Upload)
EVDO Rel.B: 14.7 Mbps (Download), 5.4Mbps (Upload)
EDGE: 236.8 kbps (Download), 236.8 kbps (Upload)

GPRS: 85.6 kbps(Download), 85.6 kbps (Upload)

Maximum output power

LTE: 23 dBm
HSPA+: 23.5 dBm
1xRTT/EVDO: 24dBm
E-GPRS 1900/1800: 26 dBm
E-GPRS 900/850: 27 dBm
GPRS 1900/1800: 29.5 dBm
GPRS 900/850: 32.5 dBm

Maximum power consumption

LTE: 1,200 mA (peak); 900 mA (average)
HSPA+: 1,100 mA (peak); 800 mA (average)
1xRTT/EVDO: 1,000 mA (peak); 700 mA (average)
E-GPRS: 2,800 mA (peak); 500 mA (average)

Form Factor

M.2, 3042-S3 Key B

Weight

6.2 g

Dimensions

(Length x Width x Thickness)

42 x 30 x 2.3 mm

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* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not available
in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due to location,
environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

HP lt4225 LTE/EV-DO Gobi™ 4G Mobile Broadband Module*

Technology/Operating bands

LTE: 1400 (Band 11), 800 (Band 18, Japan 800 lower)
EV-DO: 800 (BC0), 2100 (BC6) MHz

Wireless protocol standards

3GPP Release 8 LTE Specification
EVDO Release 0 and Release A

GPS

Standalone, A-GPS

GPS bands

1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz

Maximum data rates

LTE: 100 Mbps (Download), 50 Mbps (Upload)
CDMA 1x: 153.6 kbps (Download), 153.6 kbps (Upload)
EVDO Rev.A: 3.1 Mbps (Download), 1.8 Mbps (Upload)

Maximum output power

LTE: 23 dBm
CDMA/EVDO: 24dBm

Maximum power consumption

LTE: 1,200 mA (peak); 900 mA (average)
EVDO: 900mA (peak); 720mA (average)

Form Factor

M.2, 3042-S3 Key B

Weight

6 g

Dimensions

(Length x Width x Thickness)

1.65 x 1.18 x 0.09 in (42 x 30 x 2.3 mm)

* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support, and is not
available in all areas. Contact service provider to determine the coverage area and availability. Connection speeds will vary due
to location, environment, network conditions, and other factors. 4G LTE not available on all products or in all countries.

HP lt4226 LTE/HSPA+ Gobi 4G Module*

Technology/Operating
bands

LTE: 2100 (Band 1), 800 (Band 19, Japan 800 upper), 1450 (Band 21)
HSPA+: 2100 (Band 1), 800 (Band 6), 800 (Band 19) MHz

Wireless protocol
standards

3GPP Release 8 LTE Specification
WCDMA R99, 3GPP Release 5, 6 and 7 UMTS Specification

GPS

Standalone, A-GPS

GPS bands

1575.42 MHz ± 1.023 MHz, GLONASS 1596-1607MHz

Maximum data rates

LTE: 100 Mbps (Download), 50 Mbps (Upload)
DC-HSPA+: 42 Mbps (Download), 5.76 Mbps (Upload)
HSPA+: 21.6 Mbps (Download), 5.76 Mbps (Upload)

Maximum output power

LTE: 23 dBm
HSPA+: 23.5 dBm

Maximum power
consumption

LTE: 1,200 mA (peak); 900 mA (average)
HSPA+: 1,100 mA (peak); 800 mA (average)

Form Factor

M.2, 3042-S3 Key B

Weight

6 g

Dimensions

(Length x Width x
Thickness)

1.65 x 1.18 x 0.09 in (42 x 30 x 2.3 mm)

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* Mobile Broadband is an optional feature. Connection requires wireless data service contract, network support,
and is not available in all areas. Contact service provider to determine the coverage area and availability.
Connection speeds will vary due to location, environment, network conditions, and other factors.
4G LTE not available on all products or in all countries.

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Page 20

WLAN MODULES

Intel® Tri Band Wireless-AC 18260 802.11a/b/g/n/ac (2x2) and Bluetooth® 4.2 + WiGig Combo*

Form Factor

Combo Module, M.2 3030-S3-A

Dimensions

30.00±0.15mm by 30.00±0.15mm by 2.38mm max.

Weight

4 grams

Operating Voltage

3.3 Volts

Wireless LAN Standards

IEEE 802.11ad

Interoperability

Wi-Fi certified MAC and Physical Layer

WiFi Alliance/WiGig Alliance Protocol Adaption Layers (PALs) (Not yet
ratified)

Wireless Display Extension (WDE)
Wireless Serial Extension (WSE)

Note: IP protocol is not supported

Frequency Band

802.11ad
57 – 66 GHz
Note: There are 4 bands (1, 2, 3, 4) but only 2 (bands 2 and 3) are
supported in most of the countries on the planet. HP will support only
bands 2 and 3, 59-64 GHz

Note: Not all countries allow unlicensed operation at these
frequencies

Antenna Structure
(Remote Front End Module,
R-FEM)

Active, Beam Steering Array of 10 x 2 Elements, 8 x 2 Active Elements
Azimuth 8 active elements
Elevation 2 active elements
Vertical tilt of 20 to 30 degrees off of broadside
Horizontal beam steering ±65°, -6dB from peak gain
Vertical beam steering +80° -50°, -6dB from peak gain
Azimuth beam width ~20°, -6dB from peak gain
Elevation beam width ~80°, -6dB from peak gain
Omni (no beam forming) beam width ~110°, -6dB from peak gain
Vertical Polarization
Device side supports one R-FEM
Dock side supports one or two R-FEMs

Data Rates (RAW)

MCS Rate, Mbit/s Modulation

0 27.5 π/2-BPSK
1 385.0 π/2-BPSK
2 770.0 π/2-BPSK
3 962.5 π/2-BPSK
4 1155.0 π/2-BPSK
5 1251.25 π/2-BPSK
6 1540.0 π/2-QPSK
7 1925.0 π/2-QPSK
8 2310.0 π/2-QPSK
9 2502.5 π/2-QPSK
10 3080.0 π/-16QAM
11 3850.0 π/-16QAM
12 4620.0 π/-16QAM

Network Architecture
Models

Ad-hoc (Peer to Peer)

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Wireless Display Extension (WDE)

WGA WDE support

AV PAL (WDE) as defined by WiGig alliance

AVC/MPEG support ­encoder

WDE supports generation of MPEG-PS /
MPEG-PES packets as described in the
WDE standard
WDE supports AVC (H264) encoder, intra
only, 4:4:4 Chroma subsampling.
Different visually lossless and lossy
scenarios are supported by configuration

AVC/MPEG support –
decoder

H.264 CAVLC 4:4:4 I-only sub sampling is
supported

Type of Interface

Client device side

 DP (Display port) v1.2a – HBR (1, 2, 4

lanes)

Dock device side

 DP v1.2 – HBR (1, 2, 4 lanes)
 HDMI v1.4a (through external Hub or

cable adapter)

 DP++ compatible

Note: DP v1.2 is backward compatible
with DP v1.1a

DP Resolution and Frame
Rate Support

HDMI Resolution and
Frame Rate Support

DP will support the following resolutions
640x480, 1280x720, 1920x1080,
1920x1200, 2560x1440, 2560x1600
and frame rates –
24, 25, 30, 50 and 60 Hz
All resolutions are in progressive mode
(no interlaced supported)
Specifically, the following resolutions and
frame rats will be supported

 640x480p60
 1280x720p60
 1920x1080p60
 1920x1200p60
 2560x1440p60
 2560x1600p60

Note: resolution and refresh rate may
change in situations where there is a bad
link or strict limits on TDP
HDMI supports the following resolution
and frame rates –

 640x480p60
 1280x720p60
 1920x1080p60
 1920x1200p60
 2560x1440p60
 2560x1600p60

Note: resolution and refresh rate may
change in situations where there is a bad
link or strict limits on TDP

Color space support

YCbCr and RGB

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DP & HDMI Color Depth
Support

The following color depths are supported
8 bits per color

Dual display mode

The Output interface (Display Port Multi­Stream Transport, DP MST) has the ability
to support dual display mode – splitting
the video stream is based on external HW
(with monitors that can support it, a daisy
chain approach can be used to support
dual display mode)

Multiple Display Stream
Support (MST)

The following dual display mode via MST
is supported

 2 x (1280x720)
 2 x (1920x1080)
 2 x (1920x1200)

1920x1080 plus 1920x1200

Audio Pass-Through
Support

Support for all relevant Audio formats in
Support for all relevant Audio formats in
Pass-Through mode as defined in the
WDE specification. LPCM (uncompressed
and uncompounded), 2-8 channels,
32KHz – 192KHz, up to 24 bits per sample
(dependent on the number of channels)

Independent Digital Audio
Out Interface (Sink)

Support for an independent digital Audio
Out sink interface, operational upon
insertion of an audio peripheral, and not
dependent on monitor state
(On/Off/Powered-Off)

 4 x I2S Interfaces
 Multiplexed with
 S/PDIF Interface

Selection of Independent
Audio Out Interface

Selection of output interface (I2S or
SPDIF) and on-board audio device
capabilities is configurable on a system
basis through module Flash
Configuration.

AUX/DDC Channel Interface

AUX (DP) / DDC (HDMI) channel is
supported.
Note: FAUX – fast AUX (~7000Mb) is not
required.

Chosen resolution, frame
rate, color space, audio
capabilities

WDE will inform the host graphics of the
best resolution , frame rate, color space
and audio capabilities based on

 Native/Supported monitor

resolutions

 Module Core Capabilities
 Power consumption considerations
 Link status(physical layer rate and

other services)

Hot Plug

Plug and Play through hot plug detection
is not supported

Wireless Serial Extension (WSE)
for support of USB data flow over
wireless link

WGA WSE support

USB PAL (WSE) version 1.2 (June 2013)

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WSE Supported USB Ports

Single USB 2.0/3.0 Root Port

USB Hub

Supports direct connection to an external
USB Hub device. Any USB devices on the
Dock device should be connected to the
external USB Hub.

Port Powering

Module does not support USB device
powering. Any Dock device must be self­powered or powered from an external
USB Hub in the Dock Device. The module
is capable of managing the powering
requirements of USB devices connected to
the Dock USB Hub external to the module.

WSE Supported Devices

USB devices listed in ‘Supported USB
Peripherals over USB’ below are

supported, separately and
simultaneously. It supports control,
interrupt, bulk and isochronous flows
based on the supported device
capabilities.

Number of USB devices
supported on Dock device

At least 12 USB devices

Number of USB Hub Tiers
supported

Maximum number of Hub Tiers connected
to the external Hub in the Dock device is

3. A 4th Tier will only support non Hub
devices.

Supported USB peripherals
over WSE

Device Class

Comment

HID

Supported

Printer

Supported

Communication
Device Class (CDC)

Supported

Mass Storage Class
(MSC)

Supported
Hub

Supported

Audio Class

Supported

USB Video Class
(UVC)

Supported

* Wireless access point and Iternet service required. Availability if public wireless access points limited.
The specifications for the 802.11ac WLAN are draft specifications and are not final. If the final
specifications differ from the draft specifications, it may affect the ability of the notebook to
communicate with other 802.11ac WLAN devices.

Intel® Dual Band Wireless-AC 8260 802.11a/b/g/n/ac (2x2) WiFi and Bluetooth® 4.2 Combo*

Wireless LAN
Standards

IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac

Interoperability

Wi-Fi certified

Frequency Band

802.11b/g/n

 2.402 – 2.482 GHz

Note:
The FCC has declared as of January 1,
2015 products that utilize passive

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scanning on channel 12/13 and are
capable of transmitting must fully
comply with requirements of 15.247 or
otherwise disable those channels.

802.11a/n

 4.9 – 4.95 GHz (Japan)
 5.15 – 5.25 GHz
 5.25 – 5.35 GHz
 5.47 – 5.725 GHz
 5.825 – 5.850 GHz

Note: Indonesia no support this band)

Data Rates

 802.11b: 1, 2, 5.5, 11 Mbps
 802.11g: 6, 9, 12, 18, 24, 36, 48, 54

Mbps

 802.11a: 6, 9, 12, 18, 24, 36, 48, 54

Mbps

 802.11n: MCS 0 ~ MCS 15, (20MHz,

and 40MHz)

 802.11ac : MCS0 ~ MCS9, (1SS, and

2SS) (20MHz, 40MHz, and 80MHz)

Modulation

Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

Security1

 IEEE and WiFi compliant 64 / 128 bit WEP

encryption for a/b/g mode only

 AES-CCMP: 128 bit in hardware
 802.1x authentication
 WPA, WPA2: 802.1x. WPA-PSK, WPA2-

PSK, TKIP, and AES.

 WPA2 certification
 IEEE 802.11i
 Cisco Certified Extensions, all versions

through CCX4 and CCX Lite

 WAPI

Network Architecture
Models

Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)

Roaming

IEEE 802.11 compliant roaming between access
points

Output Power2

 802.11b : +16dBm minimum
 802.11g : +14dBm minimum
 802.11a : +14dBm minimum
 802.11n HT20(2.4GHz) : +14dBm

minimum

 802.11n HT40(2.4GHz) : +12dBm

minimum

 802.11n HT20(5GHz) : +14dBm minimum
 802.11n HT40(5GHz) : +12dBm minimum

Power Consumption

Transmit: 2.0 W (max)
Receive: 1.6 W (max)

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Idle mode (PSP): 180 mW (WLAN Associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby: 10 mW (WLAN+BT)
Radio disabled: 5 mW

Power Management

ACPI and PCI Express compliant power
management

802.11 compliant power saving mode

Receiver Sensitivity3

802.11b, 1Mbps : -94dBm maximum

802.11b, 11Mbps : -86dBm maximum

802.11g, 6Mbps : -88dBm maximum

802.11g, 54Mbps : -74dBm maximum

802.11a, 6Mbps : -88dBm maximum

802.11a, 54Mbps : -74dBm maximum

802.11n, MCS07 : -69dBm maximum

802.11n, MCS15 : -66dBm maximum

802.11ac, 1SS, MCS-0 : -86dBm maximum

802.11ac, 1SS, MCS-9 : -61dBm maximum

802.11ac, 2SS, MCS-0 : -83dBm maximum

802.11ac, 2SS, MCS-9 : -58dBm maximum

Antenna type

High efficiency antenna with spatial diversity,
mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are
provided to the card to support WLAN MIMO
communications and Bluetooth communications

Form Factor

PCI-Express M.2 MiniCard

Dimensions

Type 2230 : 2.3 x 22.0 x 30.0 mm
Or
Type 1630 : 2.3 x 16.0 x 30.0 mm

Weight

Type 2230 : 2.8g
Or
Type 1630 : 2g

Operating Voltage

3.3v +/- 9%

Temperature

Operating
Non-operating

14° to 158° F (–10° to 70° C)
–40° to 176° F (–40° to 80° C)

Humidity

Operating
Non-operating

10% to 90% (non-condensing)
5% to 95% (non-condensing)

Altitude

Operating
Non-operating

0 to 10,000 ft (3,048 m)
0 to 50,000 ft (15,240 m)

LED Activity

LED Amber – Radio OFF; LED White – Radio ON

1. Check latest software/driver release for updates on supported

security features.

2. Maximum output power may vary by country according to local

regulations.

3. Receiver sensitivity is measured at a packet error rate of 8% for

802.11b (CKK modulation) and a packet error rate of 10% for

802.11a/g (OFDM modulation).

4.

HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology

Bluetooth Specification

4.0/4.1/4.2 Compliant

Frequency Band

2402 to 2480 MHz

Number of Available Channels

Legacy : 0~79 (1 MHz/CH)
BLE : 0~39 (2 MHz/CH)

Data Rates and Throughput

Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps

BLE : 1 Mbps data rate; throughput up to 0.2 Mbps

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Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice
channels

Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps
asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)

Transmit Power

The Bluetooth component shall operate as a Class II Bluetooth device
with a maximum transmit power of + 4 dBm for BR and EDR.

Receiver Sensitivity
Legacy

Modulation

0.01% BER

0.001% BER

GFSK

-80 dBm

-70 dBm

π/4-DQPSK

-80 dBm

-70 dBm

8DPSK

-80 dBm

-70 dBm

Power Consumption

Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW

Range

Legacy Up to 33 ft (10 m)
BLE Up to 99 ft (30 m)

Electrical Interface

USB 2.0 compliant

Bluetooth Software Supported
Link Topology

Microsoft Windows Bluetooth Software

Electrical Interface
Bluetooth Software Supported
Security

Point to Point, Multipoint Pico Nets up to 7 slaves

Full support of Bluetooth Security Provisions

Power Management
Certifications

Microsoft Windows ACPI, and USB Bus Support

Self-configurable to optimize power conservation in all operating
modes, including Standby, Hold, Park, and Sniff

Security

All necessary regulatory approvals for supported countries, including:

Certifications
Bluetooth Profiles Supported

FCC (47 CFR) Part 15C, Section 15.247 & 15.249

Power Management
Certifications

ETS 300 328, ETS 300 826

Low Voltage Directive IEC950

Certifications
Bluetooth Profiles Supported

UL, CSA, and CE Mark

Serial Port Profile (SPP)1
Service Discovery Application Profile (SDAP)
Dial-Up Networking (DUN)

1,2

Generic Object Exchange Profile (GOEP)

1,2

Object Push Profile (OPP)

1,2

Hard Copy Cable Replacement (HCRP)

1,2

Personal Area Networking Profile (PAN)

1,2

Human Interface Device Profile (HID)

1,2

Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)

Audio Video Remote Control Profile (AVRCP)

Bluetooth V4.1/V4.2 support
feature

V4.1: ESR5/6/7 compliant

V4.2: ESR8 compliant, LE Secure Connection – Basic.

* Wireless access point and Iternet service required. Availability if public wireless access points limited. The
specifications for the 802.11ac WLAN are draft specifications and are not final. If the final specifications differ
from the draft specifications, it may affect the ability of the notebook to communicate with other 802.11ac
WLAN devices.

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Environmental
Data

Eco-Label Certifications
& declarations

This product has received or is in the process of being certified to the following
approvals and may be labeled with one or more of these marks:

 IT ECO declaration
 US ENERGY STAR®
 EPEAT <Gold> registered in the United States. See http://www.epeat.net

for registration status in your country.

System Configuration

The configuration used for the Energy Consumption and Declared Noise

Emissions data for the Notebook model is based on a “Typically Configured
Notebook”.

Energy Consumption
(in accordance with US
ENERGY STAR® test
method)

115VAC, 60Hz

230VAC, 50Hz

100VAC, 60Hz

Normal Operation
(Short idle)

6.06 W

6.18 W

6.04 W

Normal Operation (Long
idle)

1.85 W

1.94 W

1.81 W

Sleep

0.39 W

0.42 W

0.37 W

Off

0.27 W

0.3 W

0.26 W

Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered
within the model family. HP computers marked with the ENERGY STAR® Logo are
compliant with the applicable U.S. Environmental Protection Agency (EPA)
ENERGY STAR® specifications for computers. If a model family does not offer
ENERGY STAR® compliant configurations, then energy efficiency data listed is for
a typically configured PC featuring a hard disk drive, a high efficiency power
supply, and a Microsoft Windows® operating system.

Heat Dissipation*

115VAC, 60Hz

230VAC, 50Hz

100VAC, 60Hz

Normal Operation
(Short idle)

21 BTU/hr

21 BTU/hr

21 BTU/hr

Normal Operation (Long
idle)

6 BTU/hr

7 BTU/hr

6 BTU/hr

Sleep

1 BTU/hr

1 BTU/hr

1 BTU/hr

Off

1 BTU/hr

1 BTU/hr

1 BTU/hr

*NOTE: Heat dissipation is calculated based on the measured watts, assuming the
service level is attained for one hour.

Declared Noise
Emissions
(in accordance with
ISO 7779 and ISO 9296)

Sound Power

(L

WAd

, bels)

Sound Pressure

(L

pAm

, decibels)
Typically Configured –
Idle

1.5

8

Fixed Disk – Random
writes

1.8

11

Longevity and
Upgrading

This product can be upgraded, possibly extending its useful life by several years.
Upgradeable features and/or components contained in the product may include:

• 3 USB ports

• 1 PC card slot (type I/II)

• 1 ExpressCard/54 slot

• 1 IEEE 1394 Port

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Technical Specifications

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• 2 SODIMM memory slots

• Optional expansion base docking station

• 1 multi-bay II storage port

• Interchangeable HDD??

<edit list of features as required>

Spare parts are available throughout the warranty period and or for up to “5”
years after the end of production.

Batteries

This battery(s) in this product comply with EU Directive 2006/66/EC

Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight

Battery size: CR2032 (coin cell)
Battery type: Lithium

Additional Information

 This product is in compliance with the Restrictions of Hazardous

Substances (RoHS) directive - 2011/65/EC.

 This HP product is designed to comply with the Waste Electrical and

Electronic Equipment (WEEE) Directive – 2002/96/EC.

 This product is in compliance with California Proposition 65 (State of

California; Safe Drinking Water and Toxic Enforcement Act of 1986).

 This product is in compliance with the IEEE 1680 (EPEAT) standard at the

<gold> level, see www.epeat.net

 Plastics parts weighing over 25 grams used in the product are marked

per ISO11469 and ISO1043.

 This product contains 0% post-consumer recycled plastic (by wt.)
 This product is 97% recycle-able when properly disposed of at end of

life.

Packaging Materials

External:

PAPER/Corrugated

329.5 g

Internal:

PLASTIC/EPE (Expanded Polyethylene)

23.3 g

PLASTIC/Polyethylene low density

14.5 g

The plastic packaging material contains at least 50% recycled content.

The corrugated paper packaging materials contains at least 70% recycled
content.

Material Usage

This product does not contain any of the following substances in excess of
regulatory limits (refer to the HP General Specification for the Environment at

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):

 Asbestos
 Certain Azo Colorants
 Certain Brominated Flame Retardants – may not be used as flame

retardants in plastics

 Cadmium
 Chlorinated Hydrocarbons
 Chlorinated Paraffins
 Formaldehyde
 Halogenated Diphenyl Methanes
 Lead carbonates and sulfates

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HP Elite x2 1012 G1

Technical Specifications

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 Lead and Lead compounds
 Mercuric Oxide Batteries
 Nickel – finishes must not be used on the external surface designed to

be frequently handled or carried by the user.

 Ozone Depleting Substances
 Polybrominated Biphenyls (PBBs)
 Polybrominated Biphenyl Ethers (PBBEs)
 Polybrominated Biphenyl Oxides (PBBOs)
 Polychlorinated Biphenyl (PCB)
 Polychlorinated Terphenyls (PCT)
 Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail

packaging has been voluntarily removed from most applications.

 Radioactive Substances

 Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Packaging Usage

HP follows these guidelines to decrease the environmental impact of product
packaging:

 Eliminate the use of heavy metals such as lead, chromium, mercury and

cadmium in packaging materials.

 Eliminate the use of ozone-depleting substances (ODS) in packaging

materials.

 Design packaging materials for ease of disassembly.
 Maximize the use of post-consumer recycled content materials in

packaging materials.

 Use readily recyclable packaging materials such as paper and corrugated

materials.

 Reduce size and weight of packages to improve transportation fuel

efficiency.

 Plastic packaging materials are marked according to ISO 11469 and DIN

6120 standards.

End-of-life
Management and
Recycling

Hewlett-Packard offers end-of-life HP product return and recycling programs in
many geographic areas. To recycle your product, please go to:

http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office.

Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide
treatment information for each product type for use by treatment facilities. This
information (product disassembly instructions) is posted on the Hewlett Packard
web site at: http://www.hp.com/go/recyclers. These instructions may be used
by recyclers and other WEEE treatment facilities as well as HP OEM customers
who integrate and re-sell HP equipment.

Hewlett-Packard
Corporate
Environmental
Information

For more information about HP’s commitment to the environment:

Global Citizenship Report

http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications

http://www8.hp.com/us/en/hp­information/environment/ecolabels.html

ISO 14001 certificates:

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU
_Product_Design_ISO_14K_Certificate.pdf

and

http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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Page 30

POWER

HP AC Adapter 45W
USB Type-C™

Dimensions (H x W x D)

66mm x 66mm x 28.5mm

Input

90 to 265 VAC

Input Efficiency
+5V out --78.7% min at 115 VAC/230VAC
+12V out—87.4% min at 115 VAC/230VAC
+15V out –87.73% min at 115 VAC/230VAC

Input frequency range

47 to 63 Hz

Input AC current

1.4 A at 90 VAC and maximum load

Output

Output power

45W

DC output

5V/12V/15V

Hold-up time

5 msec at 115 VAC input

Output current limit

<5A, Over voltage protection

7.85V@5Vout
18V@12Vout

20.5V@15Vout

max automatic shutdown

Connector

USB TYPE C connector

Environmental Design

Operating
temperature

32° to 95° F (0° to 35° C)

Non-operating (storage)
temperature

-4° to 121° F (-20° to 85° C)

Altitude

0 to 16,405 ft (0 to 5,000 m)

Humidity

0% to 95%

Storage Humidity

0% to 95%

EMI and Safety
Certifications

CE Mark - full compliance with LVD and EMC directives; Worldwide safety
standards - IEC60950, EN60950, UL60950, Class1, SELV; Agency
approvals - C-UL-US, NORDICS, DENAN, EN55022 Class B, FCC Class B,
CISPR22 Class B, CCC, NOM-1 NYCE; Reliability - failure rate of less than

0.1% annually within the first three years of operation.

HP 4-cell Polymer Battery (40 WHr )

Dimensions (H x W x L)

Weight
Cells/Type

138.15 x 58.90 x 3.81 mm

5.44 x 2.32 x 0.15 inch

0.166 kg/0.37 lb
4-cell Lithium-Ion

Energy

Watt-hour capacity

Voltage : 7.7V
Amp-hour capactity Ah
Watt-hour capacity : 40 WHr
40 WHr

Temperature

Operating (Charging)

32° to 113° F ( 0° to 45° C)

Operating (Discharging)

14° to 140° F ( -10° to 60° C

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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Non-operating

-4° to 140° F ( -20° to 60° C )

Battery recharge time

System in OFF or Standby
Mode <3 hours

Fuel Gauge LED

No

Optional travel
battery available

No

MIL-STD 810G TEST

High Temperature test*

The High Temperature test was performed in accordance with
MIL-STD-810G, Method 501.5, Procedure I (Storage). This test

evaluated the units’ performance while it was being exposed to

high temperature conditions: 71°C (160°F) nonoperational. Test
cycle 24 hours; test consisted of seven cycles.

High Temperature test*

The High Temperature test was performed in accordance with
MIL-STD-810G, Method 501.5, Procedure II (Operation). This test

evaluated the units’ performance while it was being exposed to

high temperature conditions: 60°C (140°F) operational. Four
hours duration.

Low Temperature test*

The Low Temperature test was performed in accordance with
MIL-STD-810G, Method 502.5, Procedure I (Storage). This test
evaluated the unit’s performance while it was being exposed to
low temperature conditions: -51°C (-60°F) nonoperational. Four
hours duration.

Low Temperature test*

The Low Temperature test was performed in accordance with
MIL-STD-810G, Method 502.5, Procedure II (Operation). This test

evaluated the unit’s performance while it was being exposed to

low temperature conditions: -29°C (20°F) operational. Four hour
duration.

Thermal Shock test*

The Thermal Shock test was performed in accordance with MIL­STD-810G, Method 503.5, Procedure I. The objective of this test
was to determine whether the unit could be safely operated
after being exposed to sudden changes in ambient
temperature while non-operational. The high temperature was
set to be 96°C (205°F) and the low temperature to be

-51°C (-60°F); three high-to-low cycles were performed.

Altitude*

The Altitude test was performed in accordance with MIL-STD­810G, Method 500.5, Procedure I (Storage) and II (Operation).
The altitude level simulated for both procedures was 15,000
feet at 57kPa.Four hour duration.

Humidity*

The humidity test was performed in accordance with MIL-STD­810G, Method 507.5, Procedure II. Relative humidity 95%.
Temperature cycled between 86oF and 140oF.Test cycle 24
hours; test consisted of ten cycles.

Drop*

The drop test was performed in accordance with MIL-STD-810G,
Method 516.6, Procedure IV. The objective of this test was to
determine whether the unit was operational after being dropped
from desk height. For this test, 26 drops were performed from

QuickSpecs

HP Elite x2 1012 G1

Technical Specifications

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Page 32

3ft onto every side, angle and edge onto 2” of plywood over
steel over concrete.

Dust*

The dust test was performed in accordance with MIL-STD-810G,
Method 510.5, Procedure I. Test parameters were set so that the
unit was dusted with Arizona Road Dust for six hours while being
operated. Each cycle was one day (24 hours); ten cycles with the
temperature being cycled between 30°C (86°F) and 60°C (140°F);
and relative humidity was a constant 95%.

Vibration*

The vibration test was performed in accordance with MIL-STD­810G, Method 514.6, Procedure I category 4. This test evaluated
the units performance after it has been subjected to higher
levels of vibration while in storage: Operational U.S. highway
truck exposure, 1000 mile Simulation and One hour/axis
duration.

Vibration 2*

The vibration test was performed in accordance with MIL-STD­810G, Method 514.6, Procedure I category 24. This test
evaluated the units performance after it has been subjected to
higher levels of vibration while in storage: Non-operational 0.04
g2/Hz at 20-1000 Hz, -6 dB/octave at 1000-2000 Hz and One
hour/axis duration.

Shock*

The shock test was performed in accordance with IL-STD-810G,
Method 516.6.5, Procedure I. This test objective was to
determine whether the unit could be safely operated after being
exposed to sudden physical shock events while operational. For
this test, 3 shocks were performed across each axis and
direction for a total of 18 shocks -40Gs peak, 11ms.

Freeze/Thaw test*

The Freeze/Thaw test was performed in accordance with MIL­STD-810G, Method 524.54 Procedure III. The objective of
this test was to determine whether the unit could be safely
operated after being exposed to a temperature drop of -10°C
(14°F) for two hours. Unit is removed and checked for operation.

Sand test*

The Sand test was performed in accordance with MIL-STD-810G,
Method 510.5 Procedure II

Explosive Atmosphere*

The Explosive Atmosphere test was performed in accordance
with MIL-STD 810G, Method 511.5 Procedure I.

*MIL STD 810G testing is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for
military use. Test results are not a guarantee of future performance under these test conditions. Damage under the MIL STD test
conditions or any accidental damage requires an optional HP Accidental Damage Protection Care Pack.

COUNTRY OF ORIGIN

China

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HP Elite x2 1012 G1

Technical Specifications

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Page 33

CLEANING

The following cleaning solutions, if used as instructed in the user guide, will not harm the HP Elite x2 1012 G1:

 Dimethyl benzyl ammonium chloride 0.3 percent maximum concentration (for example, disposable wipes, which come in a

variety of brands)

 Alcohol-free glass-cleaning fluid
 Solution of mild soap and water
 Dry microfiber cleaning cloth or a chamois (static-free cloth without oil)
 Static-free cloth wipes

Please refer to the user guide that came with your product for detailed instructions about how to clean your HP Elite x2 1012 G1
using these solutions.

The following cleaning solutions, if used as instructed in the user guide, will not harm the surface of HP Elite x2 1012 Travel
Keyboard and the HP Elite x2 1012 Advanced Keyboard:

Surface side of the keyboards:

 Dimethyl benzyl ammonium chloride 0.3 percent maximum concentration (for example, disposable wipes, which come in a

variety of brands)

 Alcohol-free glass-cleaning fluid
 Solution of mild soap and water
 Dry microfiber cleaning cloth or a chamois (static-free cloth without oil)
 Static-free cloth wipes

Fabric side of the keyboards:

 Solution of mild soap and water
 Dry microfiber cleaning cloth or a chamois (static-free cloth without oil)
 Static-free cloth wipes

QuickSpecs

HP Elite x2 1012 G1

Options and Accessories (sold separately and availability may vary by country)

Not all configuration components are available in all regions/countries.

c04895999 — DA – 15477 — Worldwide — Version 16 – March 22, 2017

Page 34

Type

Description

Part number

Carrying Cases

HP Elite Top Load Colombian Leather Case

T9H72AA

HP Elite Top Load Herringbone Nylon Case

T9H73AA

HP Business Slim Top Load (up to 14.1" x .75" thick)

H5M90AA

HP Slim Ultrabook Messenger (up to 15.6" x .88"/22/5mm)

F3W14AA

HP Slim Ultrabook Top Load (up to 15.6" x .88"/22/5mm)

F3W15AA

HP Slim Ultrabook Backpack (up to 15.6" x .88"/22/5mm)

F3W16AA

HP UltraSlim Tablet Sling

F7Z97AA

HP Essential Top Load Case (up to 15.6’’)

H2W17AA

HP Essential Backpack (up to 15.6’’)

H1D24AA

HP x2 1012 Protective Case

T3P15AA

Input/Output
Devices

HP Active Pen with Bluetooth App Launch Button

T4Z24AA

HP Ultra Mobile Wireless Mouse

H6F25AA

HP 3-Button Laser Mouse

H4B81AA

HP Ultrathin Wireless Mouse

L9V78AA

HP 2.4 GHz Wireless Mouse

L0Z84AA

HP Conferencing Keyboard

K8P74AA

HP Stereo 3.5mm Headset

T1A66AA

HP Stereo USB 3.5mm Headset

T1A67AA

HP Speaker Phone

K7V16AA

HP Wired Headset

K7V17AA

HP H2310 Black In-ear headset

J8H42AA

Adapters

HP USB Graphics Adapter

NL571AA

HP USB Type-C™ to VGA Adapter

N9K76AA

HP USB Type-C™ to HDMI Adapter

N9K77AA

HP USB Type-C™ to DisplayPort Adapter

N9K78AA

HP USB 3.0 to Gigabit LAN adapter

N7P47AA

HP USB-C™ to USB 3.0 adapter

N2Z63AA

HP USB-C™ to HP USB-C to 4.5mm + 3.0mm Combo DC Jack adapter

N2Z65AA

HP Wireless display Adapter

J1V25AA

HP USB-C™ Travel Dock

T0K294AA

Keyboards

HP Elite x2 1012 G1 Travel Keyboard

T4Z25AA

HP Elite x2 1012 Advanced Keyboard

P5Q65AA

USB Stylish Keyboard & Mouse Bundle

H4B80AA

HP Conferencing Keyboard

K8P74AA

HP Wireless keyboard and mouse

G1K29AA

Docking
Stations/Replicators

HP Advanced Wireless Docking Station*

*HP Advanced Wireless Docking is compatible with the HP Elite x2 1012 G1
with an optional installed Intel Tri Band Wireless AC with WiGig Combo card
available at the time of purchase.

F7M97AA

QuickSpecs

HP Elite x2 1012 G1

Options and Accessories (sold separately and availability may vary by country)

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c04895999 — DA – 15477 — Worldwide — Version 16 – March 22, 2017

Page 35

HP Elite USB-C Docking Station

T3V74AA

HP Elite 65W Thunderbolt 3 Dock

P5Q54AA

HP USB-A 3.1 Port Replicator

H1L08AA

HP 3005pr USB 3 Port Replicator

H1L08AA

HP Elite USB-C Dock

Z9R42AA

Power Adapters

HP 45W USB Type-C™ AC Adapter

V5Y26AA

HP Mobile Hot Spot

M5T50AA

HP 45W USB-C Auto Adapter

Z3Q87AA

Storage

HP External USB Optical Drive

F2B56AA

Security

HP Tablet Master Cable Lock

T8X45AA

Others

HP Tablet Cleaning Kit

K6F99AA

QuickSpecs

HP Elite x2 1012 G1

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© Copyright 2017, HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or
other countries. Intel, Core and vPro are trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth is a
trademark ofits proprietor, used by Hewlett-Packard Company under license. USB Type-C™ and USB-C™ are trademarks of USB
Implementers Forum.

QuickSpecs

HP Elite x2 1012 G1

Summary of Changes

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Page 37

Date of change:

Version History:

Description of change:

12/08/2015

From v1 to v2

Multiple edits

12/09/2015

From v2 to v3

Multiple edits

12/16/2015

From v3 to v4

Added BrightView and WUXGA to display specs.

01/20/2016

From v4 to v5

Removed HP USB-C to RJ45/USB3/USB-C Adapter and Display support.

02/11/2016

From v5 to v6

Added disclamer under “HP Advanced Wireless Docking Station”.

02/19/2016

From v6 to v7

Added environmental specs

03/01/2016

From v7 to v8

Multiple edits

03/04/2016

From v8 to v9

Added Fanless design for a quiet computing experience to at a glance.

03/09/2016

From v9 to v10

Added AC adpter weight. Edit to At-a-Glance section.

03/21/2016

From v10 to v11

Option Update

03/22/2016

From v11 to v12

Edit to Storage

04/21/2016

From v12 to v13

Added USB addapters

05/25/2016

From v13 to v14

Added port note

02/14/2017

From v14 to v15

Accessories Section Updated

03/22/2017

From v15 to v16

Technical Specifications Section Updated (Active Pen Resolution)