HP EliteDesk 705 QuickSpecs

QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Overview

Not all configuration components are available in all regions/countries.
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Page 1
HP EliteDesk 705 G4 Desktop Mini Business PC
1.
USB Type-C™ (charge support up to 5V/3A)
5.
Universal Audio Jack with CTIA headset support
2.
USB 3.1 Gen 1 Type A
6.
Hard Drive activity light
3.
USB 3.1 Gen 1 Type A (charge support up to 5V/1.5A)
7.
Dual-state power button
4.
Headset Connector
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 2
HP EliteDesk 705 G4 Desktop Mini Business PC
1.
DisplayPort™ 1.2
7.
WLAN External Antenna Punchout
2.
USB 3.1 Gen 1 Type A
8.
Standard lock slot (10 mm)
3.
Configurable Option card slot (Choice of DisplayPort™ 1.2,
HDMI™ 2.0, VGA, USB Type-C with alt mode display, Discrete Graphics Option Card with DisplayPort™ 1.4) (Availability
depends on model)
9.
10.
11.
Cover Release Thumbscrew WLAN Internal Antenna Padlock Loop
4.
USB 3.1 Gen 1 Type A allows for wake from S4 with keyboard/mouse when connected and enabled in BIOS
5.
RJ-45 Network Adapter
6.
Power connector
Not Shown
Slots
(1) Internal M.2 2230 connector for WLAN (1) Internal M.2 SSD storage (2230 or 2280 connector)
Bays
(1) 2.5- inch SATA drive Bay
Mounting
Support for
- VESA 100 mounting system on bottom of PC chassis
- VESA Sleeve
- Quick Release Bracket
- B300/B500 Mounting bracket
- 100mm VESA Plate Integrated
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
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HP EliteDesk 705 G4 Microtower
1.
5.25-inch Half-Height Drive Bay (behind bezel)
6.
Universal Audio Jack with CTIA headset support
2.
Slim optical drive (optional)
7.
USB 2.0 port (charge support up to 5V/1.5A)
3.
SD 4 Card Reader (optional)
8.
USB 2.0 port
4.
Dual-state power button
9.
USB 3.1 Gen 1 ports (2)
5.
Hard Drive activity light
10.
USB Type-C™ port (charge support up to 5V/3A)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Overview
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 4
HP EliteDesk 705 G4 Microtower
1.
Audio-out jack for powered audio devices
6.
USB 2.0 ports with wake from S4 (2)
2.
Dual-Mode DisplayPort™ 1.2 (2)
7.
Standard lock slot
3.
Optional port (DisplayPort™ 1.2, HDMI, VGA or USB Type-C™) (USB­C™ option has alt mode DisplayPort™ 1.2 or 15W output) - shown
here with VGA port installed
8.
RJ-45 Network Adapter
9.
Optional serial port - shown here installed
4.
USB 3.1 Gen1 ports (2)
10.
Power connector
5.
USB 2.0 ports (2)
11.
Audio-in
Not shown
Slots
Bays
(1) PCI Express x16 graphics connectors
(2) 2.5" internal storage drive bay
(3) PCI Express x1
(1) 3.5” internal storage drive bay (convertible to 2.5”)
(1) internal M.2 SSD storage (2230 or 2280 connector) (1) internal M.2 WLAN (2230 connector)
(1) 9.5mm slim optical drive bay (1) 5.25" external half-height drive bay
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Standard Features and Configurable Components (availability may vary by country)

Not all configuration components are available in all regions/countries.
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HP EliteDesk 705 G4 Small Form Factor Business PC
1.
9.5mm slim optical drive (optional)
6.
USB 2.0 port (charge support up to 5V/1.5A)
2.
SD 4 card reader (optional)
7.
Universal Audio Jack with CTIA headset support
3.
USB Type-C™ (charge support up to 5V/3A)
8.
Hard Drive activity light
4.
USB 3.1 Gen 1 ports (2)
9.
Dual-state power button
5.
USB 2.0 port
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 6
HP EliteDesk 705 G4 Small Form Factor Business PC
1.
Audio-in connector
7.
RJ-45 Network Adapter
2.
Audio-out connector for powered audio devices
8.
USB 2.0 ports with wake from S4 (2)
3.
Dual-Mode DisplayPort™ 1.2 (2)
9.
USB 3.1 Gen 1 (2
4.
Serial Port - shown here not installed
10.
USB 2.0 (2)
5.
Standard lock slot
11.
Power connector
6.
Optional port (DisplayPort™ 1.2, HDMI, VGA or USB Type­C™) (USB-C™ option has alt mode DisplayPort™ 1.2 or 15W output) - shown here with HDMI port installed
Not shown
Slots
Bays
(1) PCI Express x16 graphics connectors
(1) 3.5” internal storage drive bay (convertible to two 2.5”1)
(1) PCI Express x1
(1) 9.5mm slim optical drive bay
(1) internal M.2 SSD storage (2230 or 2280 connector) (1) internal M.2 WLAN (2230 connector)
1. SFF can be configured with either (1) 3.5” or (2) 2.5” internal storage drive (2.5-inch drive needs adapter that can only be purchased when configuring the PC from factory with a 2.5” drive)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
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AT A GLANCE
Choice of three form factors: Microtower, Small Form Factor and Desktop Mini
Latest AMD® Ryzen™ PRO and Athlon PRO Processor with Radeon™ Vega Graphics
1
7th generation of AMD® Pro A-Series APU
DDR4 Synchronous Dynamic Random Access Memory (SDRAM) (Transfer rates up to 2933 MT/s)
1
Processor support up to 65W on DM; up to 95W on MT/SFF
Integrated AMD® Radeon™ Vega Graphics (AMD® Radeon™ on 7th gen) and optional Radeon™ RX discrete graphics
Support for up to three monitors via two standard DisplayPort™ 1.2 connectors with multi-stream
2
and an optional third
video port connector which provides the following choices: HDMI, VGA, DisplayPort™ 1.2, or USB Type-C™ with DisplayPort™ 1.2 for all platforms; USB Type-C™ with DisplayPort™ 1.2 for 705 G4 DM 35W (see Ports section for port
availability by platform)
Selection of discrete graphic cards to configure systems to up to 7 displays (MT, SFF and DM 35W)
AMD® Radeon™ discrete graphics enabling viewing immersive VR
MT and SFF models can be configured with dual data drives in a RAID (limited configurations)
Industry-standard AMD® DASH manageability
HP Sure Click
HP Sure Start Gen4
HP Sure Run
HP Sure Recover
HP BIOSphere Gen4
HP Client Security Manager Gen4
High efficiency energy saving power supply options
ENERGY STAR® certified. EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country4. Search keyword generator on HP’s 3rd party option store for
solar generator accessories at http://www.hp.com/go/options.
CCC, CECP and SEPA Certified
PC chassis and all internal components and modules are manufactured with low halogen content
3
Arsenic-free
Dust filter available (MT, SFF and DM 35W)
Lengthy purchase lifecycles and image stability
Protected by HP Services, including limited warranties up to 3-3-3 (terms and conditions vary by country; certain
restrictions and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support
Integrated Conexant Audio Codec
Compliance with CE (Class B) / FCC (Class B) / UL (UL609501) / CSA (CSA C22.2 No.60950-1-07) / ICES-003 / CCC / VCCI (Class
B) / KCC (Class B)
1. Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. AMD’s numbering is not a measurement of clock speed.
2. DisplayPort multi-stream monitors ‘daisy-chained’ together.
3. External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase may not be low halogen.
4. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit www.epeat.net for more information
NOTE: See important legal disclosures for all listed specs in their respective features sections.
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
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PRODUCT NAME
HP EliteDesk 705 G4 Microtower Business PC HP EliteDesk 705 G4 Small Form Factor Business PC HP EliteDesk 705 G4 Desktop Mini Business PC
OPERATING SYSTEM
Preinstalled
Windows® 10 Pro 641 Windows® 10 Pro 64 (National Academic License)2 Windows® 10 Home 641 Windows® 10 Home Single Language 641 FreeDos
Web-supported only
Windows® 7 64 bit Windows 10 Enterprise 64
1. Not all features are available in all editions or versions of Window. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com/.
2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10 Anniversary Update. Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.
NOTE: Your product does not support Windows 8 or Windows 7. In accordance with Microsoft’s support policy, HP does not support the Windows® 8 or Windows 7 operating system on products configured with Intel® and AMD® 7th generation and forward processors or provide any Windows® 8 or Windows 7 drivers on http://www.support.hp.com
CHIPSET
DM
SFF
MT
AMD® B350 FCH
X
X
X
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 9
PROCESSORS
AMD® Ryzen™ with AMD®Radeon™ Vega Graphics APU and CPU*
DM
SFF
MT
AMD Ryzen™ 7 PRO 2700X CPU* (4.1 GHz Max Boost, 3.6 GHz base frequency, 20 MB, 95W, Eight-Core)
X X
AMD Ryzen™ 7 PRO 2700 CPU* (4.1 GHz Max Boost, 3.2 GHz base frequency, 20 MB, 65W, Eight-Core)
X X
AMD Ryzen™ 5 PRO 2600 CPU* (3.9 GHz Max Boost, 3.4 GHz base frequency, 19 MB, 65W, Six-Core)
X X
AMD® Ryzen™ 5 PRO 2400G APU with AMD®Radeon™ Vega Graphics (3.9 GHz Max boost,
3.6 GHz base frequency, 6MB, 65W, Quad Core)
X X X
AMD® Ryzen™ 5 PRO 2400GE APU with AMD®Radeon™ Vega Graphics (3.8 GHz Max boost,
3.2 GHz base frequency, 6MB, 35W, Quad Core)
X
AMD® Ryzen™ 3 PRO 2200G APU with AMD®Radeon™ Vega Graphics (3.7 GHz Max boost,
3.5 GHz base frequency, 6MB, 65W, Quad Core)
X X X
AMD® Ryzen™ 3 PRO 2200GE APU AMD®Radeon™ Vega Graphics (3.6 GHz Max boost, 3.2 GHz base frequency, 6MB, 35W, Quad Core)
X
AMD® Athlon™ PRO 200GE APU with AMD®Radeon™ Vega Graphics (3.2 GHz Max boost,
3.2 GHz base frequency, 5MB, 35W, Dual Core)
X
7th Generation of AMD® Pro A-Series APU1
DM
SFF
MT
AMD® PRO A10-9700E APU with AMD® Radeon™ Graphics (3.5 GHz Max boost, 3.0 GHz base frequency, 2MB, 35W, Quad Core)
X
AMD® PRO A10-9700 APU with AMD® Radeon™ Graphics (3.8 GHz Max boost, 3.5 GHz base frequency, 2MB, 65W, Quad Core)
X X
AMD® PRO A8-9600 APU with AMD® Radeon™ Graphics (3.4 GHz Max boost, 3.1 GHz base frequency, 2MB, 65W, Quad Core)
X X
AMD® PRO A6-9500 APU with AMD® Radeon™ Graphics (3.8 GHz Max boost, 3.5 GHz base frequency, 1MB, 65W, Dual core)
X X
AMD® PRO A6-9500E APU with AMD® Radeon™ Graphics (3.4 GHz Max boost, 3.2 GHz base frequency, 1MB, 35W, Dual core)
X
6th Generation of AMD® Pro A-Series APU1
DM
SFF
MT
AMD® PRO A12-8870E APU with AMD® Radeon™ Graphics (3.8 GHz Max boost, 2.9 GHz base frequency, 2MB, 35W, Quad Core)
X
AMD® PRO A12-8870 APU with AMD® Radeon™ Graphics (4.2 GHz Max boost, 3.7 GHz base frequency, 2MB, 65W, Quad Core)
X
AMD® PRO A10-8770E APU with AMD® Radeon™ Graphics (3.5 GHz Max boost, 2.8 GHz base frequency, 2MB, 35W, Quad Core)
X
AMD® PRO A10-8770 APU with AMD® Radeon™ Graphics (3.8 GHz Max boost, 3.5 GHz base frequency, 2MB, 65W, Quad Core)
X
AMD® PRO A6-8570E APU with AMD® Radeon™ Graphics (3.4 GHz Max boost, 3.0 GHz base frequency, 1MB, 35W, Dual Core)
X
AMD® PRO A6-8570 APU with AMD® Radeon™ Graphics (3.8 GHz Max boost, 3.5 GHz base frequency, 1MB, 65W, Dual Core)
X
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 10
1. Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. AMD’s numbering is not a measurement of clock speed.
*. AMD® Ryzen PRO CPU requires discrete graphic card attached.
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 11
GRAPHICS
System Integrated Graphics
DM
SFF
MT
AMD® Radeon™ R5 Graphics
X X X
AMD® Radeon™ R7 Graphics
X X X
AMD Radeon™ Vega 8 Graphics
X X X
AMD Radeon™ Vega 11 Graphics
X X X
Optional Discrete Graphics Solutions
DM
SFF
MT
AMD® Radeon™ RX 550 4GB FH PCIe x16
X X
AMD® Radeon™ RX 560X 4GB GDDR5
X
AMD® Radeon™ RX 580 4GB FH PCIe x16
X
AMD® Radeon™ RX 580 8GB FH GDDR5
X
AMD® Radeon™ R7 430 2GB VGA+DP Graphics Card
X X
AMD® Radeon™ R7 430 2GB GDDR5 64bit DP+VGA
X X
AMD® Radeon™ R7 430 2GB GDDR5 64bit 2DP
X X
AMD® Radeon™ R7 430 2GB 2DP Graphics Card
X X
AMD® Radeon 520 1GB VGA + DP Graphics Card
X
NVIDIA GeForce GTX 1060 3GB GFX
X
NVIDIA GeForce GT 730 2GB DP DVI PCIe x8 GFX
X X
NVIDIA® GeForce® RTX 2060 6GB DP+HDMI+DVI-D
X
NOTE: As of 2019, AMD Radeon™ RX 560 is renamed to AMD Radeon™ RX 560X
STORAGE
3.5 inch SATA Hard Disk Drives (HDD)
DM
SFF
MT
HDD 1TB 7200RPM SATA-3 3.5in
X
X
HDD 2TB 7200RPM SATA-3 3.5in
X
X
HDD 500GB 7200RPM 3.5in
X
X
HP 1TB 7200rpm 3.5 SATA 6.0Gb/s NCQ Smart IV Hard Drive (16MB)
X
X
HP 500GB 7200rpm 3.5 SATA 6.0Gb/s Smart IV Hard Drive
X
X
2.5 inch SATA Hard Disk Drives (HDD)
DM
SFF
MT
500 GB 5400RPM 2.5in SATA SSHD
X X X
1 TB 5400RPM 2.5in SATA SSHD
X X X
2 TB 5400RPM 2.5in SATA SSHD
X
2.5 inch Solid State Drives (SSD)
DM
SFF
MT
HDD 500GB 7200RPM 2.5in
X X X
HDD 1TB 7200RPM 2.5in
X X X
HDD 2TB 5400RPM 2.5in
X X
HDD 500GB 7200RPM 2.5in Self Encrypted Drive OPAL2*
X X X
HDD 500GB 7200RPM 2.5in Federal Information Processing Standard*
X X X
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
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NOTE: Storage Drivelock does not work with Self Encrypting or Optane based storage.
2.5 inch SATA Solid State Hybrid Drives (SSHD)
DM
SFF
MT
HDD 500GB 5400RPM 2.5in SSHD
X X X
HDD 1TB 5400RPM 2.5in SSHD
X X X
HDD 2TB 5400RPM 2.5in SSHD
2.5 inch Solid State Drives (SSD)
DM
SFF
MT
SSD 128GB 2.5in SATA Three Layer Cell
X X X
SSD 256GB 2.5in SATA Three Layer Cell
X X X
SSD 512GB 2.5in SATA Three Layer Cell
X X X
SSD 256GB 2.5in SATA Self Encrypted OPAL2 TLC*
X X X
SSD 512GB 2.5in SATA Self Encrypted OPAL2 TLC*
X X X
SSD 256GB 2.5in Federal Information Processing Standard*
X X X
SSD 512GB 2.5in Federal Information Processing Standard*
X X X
NOTE: Storage Drivelock does not work with Self Encrypting or Optane based storage.
M.2 PCIe NMVe Solid State Drives (SSD)
DM
SFF
MT
SSD 128GB M.2 2280 PCIe NVMe
X X
SSD 256GB M.2 2280 PCIe NVMe
X X X
SSD 512GB M.2 2280 PCIe NVMe
X X X
SSD 128GB M.2 2280 PCIe-3x2 NVMe Three Layer Cell
X X
SSD 256GB M.2 2280 PCIe NVMe Three Layer Cell
X X X
SSD 512GB M.2 2280 PCIe NVMe Three Layer Cell
X X X
SSD 1TB M.2 2280 PCIe NVMe Three Layer Cell
X X X
SSD 256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell*
X X X
SSD 512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell*
X X
HP 9.5mm Slim DVD-ROM Drive
X X
HP 9.5mm Slim SuperMulti DVD Writer Drive
X X
HP 9.5mm Slim Blu-Ray Writer Drive
X
X
NOTE: Storage Drivelock does not work with Self Encrypting or Optane based storage.
Media Card Reader
DM
SFF
MT
SD 4.0 with 5-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I, UHS-II)
X
X
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
MEMORY
Max Memory Configuration
DM
SFF
MT
DDR4-2666 (Transfer rates up to 2666 MT/s), 32 GB, 2 SODIMM
1
X
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 13
DDR4-2666 (Transfer rates up to 2666 MT/s), 64 GB, 4 DIMM
X X
Memory Configuration
DM
SFF
MT
4GB (1x4GB) 2666 DDR4 1.2v DIMM
X X
8GB (2x4GB) 2666 DDR4 1.2v DIMM
X X
8GB (1x8GB) 2666 DDR4 1.2v DIMM
X X
16GB (2x8GB) 2666 DDR4 1.2v DIMM
X X
16GB (1x16GB) 2666 DDR4 1.2v DIMM
X X
32GB (2x16GB) 2666 DDR4 1.2v DIMM
X X
32GB (4x8GB) 2666 DDR4 1.2v DIMM
X X
64GB (4x16GB) 2666 DDR4 1.2v DIMM
X X
DM
SFF
MT
4 GB (1 x 4 GB) 2666 DDR4 SODIMM1
X
8 GB (2 x 4 GB) 2666 DDR4 SODIMM1
X
8 GB (1 x 8 GB) 2666 DDR4 SODIMM1
X
16 GB (2 x 8 GB) 2666 DDR4 SODIMM1
X
16 GB (1 x 16 GB) 2666 DDR4 SODIMM1
X
32 GB (2 x 16 GB) 2666 DDR4 SODIMM1`
X
1. Transfer rates up to 2133 MT/s: for processors with AMD Pro A-Series APU; Transfer rates up to 2666MT/s: for processors with AMD
Ryzen™ with AMD Radeon™.
NETWORKING/COMMUNICATIONS
Ethernet (RJ-45)
DM
SFF
MT
Realtek® RTL8111EPH (standard)
X X X
Wireless1
DM
SFF
MT
Intel® 3168 802.11 AC 1x1 with Bluetooth® 4.0 (Brazil)
X X
Intel® 7265 802.11AC 2x2 with Bluetooth® M.2 Combo Card non-vPro™ (Brazil)
X X
Intel® 9260 802.11 AC 2x2 +Bluetooth® 5 PCIe non-vPro™
X X X
Realtek® 802.11 AC 1x1 with Bluetooth® 4.2 LE M.2 PCIe
X X X
Realtek® 802.11 AC 2x2 with Bluetooth® 4.2 LE M.2 PCIe
X X
Intel® 8260 802.11AC 2x2 DualBand PCIe x1 Combo Card
X
Intel® 8260 802.11AC 2x2 DualBand M.2 Combo Card
X
1. Wireless access point and Internet service required and not included. Availability of public wireless access points limited. The specifications for the 802.11ac WLAN are draft specifications and are not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with other 802.11ac WLAN devices
KEYBOARDS AND POINTING DEVICES
Keyboards
DM
SFF
MT
HP Conferencing USB Keyboard
X X X
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
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Page 14
HP Wireless Collaboration Keyboard
X X X
HP USB and PS/2 Washable Keyboard
X X X
HP USB Smart Card (CCID) Keyboard
X X X
HP USB Business Slim Keyboard
X X X
HP USB Keyboard
X X X
HP PS/2 Business Slim Keyboard
X X
HP Wireless Business Slim Keyboard and Mouse
X X X
Mouse
DM
SFF
MT
HP PS/2 Mouse
X X
HP USB Optical Mouse
X X X
HP USB Premium Mouse
X X X
HP 1000dpi Laser Mouse USB
X X X
HP USB and PS/2 Washable Mouse
X X X
Antimicrobial USB Mouse1
X X X
HP Hardened USB Mouse1
X X X
1. Not available in all regions
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 15
SECURITY
DM
SFF
MT
Trusted Platform Module (TPM) 2.0 (Infineon SLB9670). Common Criteria EAL4+ Certified. FIPS 140-2 Level 2 Certified
X X X
PORTS
I/O Ports – Standard
DM
SFF
MT
USB 2.0
N/A
2 including 1 fast charging
(front);
4 including 2 wake from S4
(rear)
2 including 1 fast charging
(front);
4 including 2 wake from S4
(rear)
USB 3.1 Gen 1
2 front; 4 rear
2 front; 2 rear
2 front; 2 rear
USB 3.0 Type-C™ (15W)
1 front; 1 rear (option)
1 front; 1 rear (option)
1 front; 1 rear (option)
Video
2 DisplayPort™ 1.2 (rear),
1 Configurable video port (rear)
(Choice of DisplayPort™ 1.4,
HDMI™ 2.0, VGA, or USB Type-
C™ with alt mode display)
For models with discrete
graphics:
1 DisplayPort™ 1.4 (rear)
2 DisplayPort™ 1.2 (rear),
1 Configurable video port
(rear) (Choice of DisplayPort™
1.2, HDMI™ 2.0, VGA, or USB
Type-C with alt mode
display port or 15W output)
2 DisplayPort™ 1.2 (rear), 1 Configurable video port
(rear) (Choice of DisplayPort™
1.2, HDMI™ 2.0, VGA, USB
Type-C with alt mode display
port or 15W output)
Audio
1 Headset (front),
1 Universal Audio Jack with
CTIA headset support (front)
1 Headset (front);
1 Audio-out (rear),
1 Audio-in (rear)
1 Headset (front);
1 Audio-out (rear),
1 Audio-in (rear)
Network Interface
RJ45
RJ45
RJ45
I/O Ports – Optional
DM
SFF
MT
Serial (RS-232)
1 (rear)(option)
1 (rear) (option)
1 (rear) (option)
Serial (RS-232) and PS/2 combination
N/A
1 (rear) (option)
1 (rear) (option)
I/O Ports – Internal Ports
DM
SFF
MT
Internal SATA storage connector(s)
N/A 3 4
Internal SATA storage connector(s)
N/A 3 4
Internal SATA storage connector (Data and Power)
1
N/A
N/A
NOTE: For Desktop Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5" SATA drive, please select a DM SATA Drive Bracket (available as both factory configured and after market option).
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 16
Slots
DM
SFF
MT
M.2 PCIe
(1) M.2 PCIe x1 2230 (for WLAN)
(1) M.2 PCIe x2 2280/2230
Combo (for storage)
(1) M.2 PCIe x1 2230 (for WLAN)
(1) M.2 PCIe x2 2280/2230
Combo (for storage)
(1) M.2 PCIe x1 2230 (for
WLAN)
(1) M.2 PCIe x2 2280/2230
Combo (for storage)
PCI Express x1 (v3.0)
N/A 1 3
PCI Express x16 (v3.0)
N/A
1
1
Bays
DM
SFF
MT
5.25" Half Height ODD
N/A
N/A
1
9.5mm Slim ODD
N/A
1
1
Secure Digital (SD) Reader
N/A
1
1
2.5” internal storage drive
1 (optional)
23
2
3.5” internal storage drive
N/A
1
1
NOTE: SFF can be configured with either (1) 3.5” or (2) 2.5” internal storage drive (2.5-inch drive needs adapter that can only be purchased when configuring the PC from factory with a 2.5" drive.) NOTE: The MT can support a single graphics card up to 75W. When configured with dual graphics cards support is limited to 35W for each.
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 17
SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
BIOS
HP BIOSphere Gen417 HP DriveLock & Automatic DriveLock20 BIOS Update via Network Master Boot Record Security Power On Authentication HP Secure Erase18 Absolute Persistence Module19 Pre-boot Authentication HP Wireless Wakeup
Software HP Native Miracast Support15 HP LAN-Wireless Protection HP Velocity
HP Hotkey Support – CMIT HP Recovery Manager HP JumpStart HP Support Assistant21 HP Noise Cancellation Software Buy Office
Manageability Features HP Driver Packs22 HP System Software Manager (SSM) HP BIOS Config Utility (BCU) HP Client Catalog HP Manageability Integration Kit Gen223 Ivanti Management Suite
24
HP Cloud Recovery37
Client Security Software HP Client Security Suite Gen425 including: HP Security Manager26 (including Credential Manager, HP Password Manager, HP Spare Key) HP Device Access Manager HP Power On Authentication Microsoft Defender27
Security Management HP Secure Erase18 TPM 2.0 Embedded Security Chip shipped with Windows 10 (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)32 SATA 0,1 port disablement (viaBIOS) RAID configurations33 Serial, USB enable/disable (viaBIOS) Power-on password (viaBIOS) Setup password (viaBIOS) Support for chassis padlocks and cable lock devices Integrated hood sensor HP Sure Start Gen430 HP Sure Run35 HP Sure Recover
36
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 18
15. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming
17. HP BIOSphere Gen4 requires Intel® or AMD® 8th Gen processors. Features may vary depending on the platform and configurations.
18. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation method.
19. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/computrace-agreement. Data Delete is an optional service provided by
Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from Absolute Software.
20. Storage Drivelock does not work with Self Encrypting or Optane based storage.
21. HP Support Assistant requires Windows and Internet access.
22. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
23. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html
24. Ivanti Management Suite subscription required.
25. HP Client Security Suite Gen 4 requires Windows and Intel® or AMD® 8th generation processors.
26. HP Password Manager requires Internet Explorer or Chrome or FireFox. Some websites and applications may not be supported. User may need to enable or allow the add-on / extension in the internet browser.
27. Windows Defender Opt in Windows 10 and internet connection required for updates.
30. HP Sure Start Gen4 is available on HP EliteDesk products equipped with Intel® 8th generation or AMD processors
32. Firmware TPM is version 2.0. Hardware TPM is v1.2, which is a subset of the TPM 2.0 specification version v0.89 as implemented by Intel Platform Trust Technology (PTT).
33. RAID configuration is optional and does require a second hard drive. RAID 1 is pre-installed and functionality will require a second hard drive.
35. HP Sure Run is available on HP Elite products equipped with 8th generation Intel® or AMD® processors.
36. HP Sure Recover is available on HP Elite PCs with 8th generation Intel® or AMD® processors and requires an open, wired network connection. Not available on platforms with multiple internal storage drives, Intel® Optane™. You must back up important files, data, photos, videos, etc. before use to avoid loss of data.
37. HP Cloud Recovery is available for HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open, wired network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail please refer to: https://support.hp.com/us-en/document/c05115630
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 19
ENVIRONMENTAL & INDUSTRY
Environmental Data HP EliteDesk 700 Desktop Mini G4 series
Eco-Label Certifications & declarations
This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country. Search keyword generator on HP’s 3rd party
option store for solar generator accessories at http://www.hp.com/go/options.
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption (in accordance with US ENERGY STAR® test method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
10.789
10.858
10.739
Normal Operation (Long idle)
10.488
10.538
10.458
Sleep
0.815
0.851
0.81
Off
0.756
0.809
0.74
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
36.7905
37.0258
36.62
Normal Operation (Long idle)
35.7641
35.9346
35.6618
Sleep
2.7792
2.9019
2.7621
Off
2.578
2.7587
2.5234
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured – Idle
3.1
20
Fixed Disk – Random writes
4.4
33
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 20
Batteries used in the product do not contain: Mercury greater the1ppm by weight Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell) Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive ­2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains 0% post-consumer recycled plastic (by wt.)
• This product is 95.1% recycle-able when properly disposed of at end of life.
Packaging Materials
External:
PAPER/Corrugated
Internal:
PLASTIC/EPE (Expanded Polyethylene)
PLASTIC/Polyethylene low density
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 21
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
Environmental Data HP EliteDesk 700 Small Form Factor G4 series
Eco-Label Certifications & declarations
This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country. Search keyword generator on HP’s 3rd party
option store for solar generator accessories at http://www.hp.com/go/options.
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption (in accordance with US ENERGY STAR® test method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
22.49
22.24
22.35
Normal Operation (Long idle)
21.1
21.25
20.87
Sleep
1.05
1.06
1.05
Off
1.08
1.09
1.08
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 22
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
76.6909
75.8384
76.2135
Normal Operation (Long idle)
71.951
72.4625
71.1667
Sleep
3.5805
3.6146
3.5805
Off
3.6828
3.7169
3.6828
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured – Idle
3.9
28
Fixed Disk – Random writes
4.4
33
Active Mode *Pinnacle Ridge with GT730 graphic card
3.7
28
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain: Mercury greater the1ppm by weight Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell) Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive ­2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains 0% post-consumer recycled plastic (by wt.)
• This product is 95.1% recycle-able when properly disposed of at end of life.
Packaging Materials
External:
PAPER/Corrugated
Internal:
PLASTIC/EPE (Expanded Polyethylene)
PLASTIC/Polyethylene low density
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 23
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 24
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 25
Environmental Data HP EliteDesk 700 MicroTower G4 series
Eco-Label Certifications & declarations
This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country. Search keyword generator on HP’s 3rd party
option store for solar generator accessories at http://www.hp.com/go/options.
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
System Configuration
The configuration used for the Energy Consumption and Declared Noise Emissions data for the Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption (in accordance with US ENERGY STAR® test method)
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
22.22
22.682
23.569
Normal Operation (Long idle)
21.409
21.432
21.753
Sleep
1.3327
1.2579
1.2692
Off
0.9518
0.8825
0.9171
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation*
115VAC, 60Hz
230VAC, 50Hz
100VAC, 50Hz
Normal Operation (Short idle)
75.7702
77.3456
80.3703
Normal Operation (Long idle)
73.0047
73.0831
74.1777
Sleep
4.5445
4.2894
4.328
Off
3.2456
3.0093
3.1273
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(L
WAd
, bels)
Sound Pressure
(L
pAm
, decibels)
Typically Configured – Idle
3.9
28
Fixed Disk – Random writes
4.4
33
Longevity and Upgrading
This product can be upgraded, possibly extending its useful life by several years. Upgradeable features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries
This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 26
Mercury greater the1ppm by weight Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell) Battery type: Lithium
Additional Information
• This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive ­2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains 0% post-consumer recycled plastic (by wt.)
• This product is 95.1% recycle-able when properly disposed of at end of life.
Packaging Materials
External:
PAPER/Corrugated
Internal:
PLASTIC/EPE (Expanded Polyethylene)
PLASTIC/Polyethylene low density
Material Usage
This product does not contain any of the following substances in excess of regulatory limits (refer to the HP General Specification for the Environment at http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 27
Packaging Usage
HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment. Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_ Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Standard Features and Configurable Components (availability may vary by country)
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 28
SERVICE AND SUPPORT
On-site Warranty15: Three-year (3-3-3) limited warranty delivers three years of on-site, next business day16 service for parts and labor and includes free support 24 x 717. Three-year onsite and labor are not available in all countries. Service offers terms up to 5 years by choosing an optional HP Care Pack. To choose the right level of service for your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.18
15. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region.
16. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
17. Technical telephone support applies only to HP-configured and third-party HP qualified hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.
18. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided with your HP Product.
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HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications - Graphics

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Page 29
GRAPHICS
AMD® Radeon™ 5 Graphics (Integrated on AMD® PRO A6-9500E & PRO A6-9500 APUs)
AMD® Radeon™ R7 Graphics (Integrated on AMD® PRO A10-9700E & PRO A10-9700 APUs) AMD Radeon™ Vega 8 Graphics (Integrated on AMD® Ryzen™ 3 PRO 2200GE & Ryzen™ 3 PRO 2200G APUs) AMD Radeon™ Vega 11 Graphics (Integrated on AMD® Ryzen™ 5 PRO 2400GE & Ryzen™ 5 PRO 2400G APUs)
Multi Display Support
Maximum of 3 displays supported by the integrated graphics
DisplayPort
Two DisplayPort outputs are standard. One DisplayPort output is optional. AMD® PRO APUs and AMD® Ryzen™ APUs support DP1.2 features including DP++, Audio, MST, HBR2, HDCP1.4 and a maximum resolution of 5128x3880@30Hz or 3840x2160@60Hz.
VGA Port (Optional)
Maximum Resolution of 2048x1536 at 60Hz
HDMI (Optional)
AMD® PRO APUs support HDMI 2.0 features and AMD® Ryzen™ APUs support HDMI 2.0a features.
All support HDCP1.4, audio and a maximum resolution of 4096x2160@60Hz
USB-C (Optional)
Supports DisplayPort Alt Mode
Memory
512MB when less than 8GB of system memory is installed 1GB when 8GB or more of system memory is installed
Maximum Color Depth
up to 10 bits
Graphics/Video API Support
AMD® PRO APUs: DirectX 12 OpenCL 1.2 OpenGL 4.1 Dedicated decoding of the H.264 format at up to 4K and 60Hz. Encoding H.264 video supported at 1080p120, 1440p60, and 2160p60
AMD® Ryzen™ APUs: DirectX 12 Vulkan 1.0 OpenCL 2.0 OpenGL 4.5 Hardware-based decode of HEVC/H.265 main10 profile videos at resolutions up to 3840x2160 at 60Hz with 10-bit color for HDR content. Dedicated decoding of the H.264 format at up to 4K and 60Hz. Decoding the VP9 format at resolutions up to 3840x2160 using a hybrid approach where the video and shader engines collaborate to offload work from the CPU. Encode HEVC/H.265 at 1080p240, 1440p120, and 2160p60. Encoding H.264 video is also supported at 1080p120, 1440p60, and 2160p60
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HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications - Graphics
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Page 30
AMD® Radeon RX550 4GB FH PCIe x16
Engine Clock
1183MHz
Memory Clock
7 Gbps
Memory Size(width)
4 GB(128-bit)
Memory Type
GDDR5
Max. Resolution(HDMI)
4096x2160 @ 60Hz
Max. Resolution(DP)
5120x2880 @ 60Hz
Multi Display Support
3 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
HDMI, DPx2
Cooling(active/passive)
Active fan-sink(Active cooling with dynamic speed)
Total power consumption(W)
<62W
PCB form-factor with bracket
ATX (Full height) PCB with ATX single slot bracket
AMD® Radeon™ RX 560X
Architecture
Discrete GPU AMD® GPU drives the integrated panel and all of the graphics output ports
DisplayPort
Multimode capable; supports HDCP, HDR, Display Port Audio (6 streams max), DisplayPort HBR3 link rates and Multi-Stream Technology for a maximum of 5 displays (including the integrated panel and all attached displays)
HDMI
Supports HDMI 2.0b features Supports HDCP 2.2, HDR
Memory
4GByte, 128bit wide GDDR5
Maximum Color Depth
up to 12 bits/color
Graphics/Video API Support
DirectX 12 OpenCL 2.0 OpenGL 4.5 AMD® Unified Video Decoder (UVD)
Rear I/O connector
1 DP
Max. Resolution (VGA)
2048 x 1536@60Hz
Max. Resolution (HDMI)
4096 x 2160@60Hz
Max. Resolution (DP)
5120 x 2880@60Hz
AMD® Radeon RX580 4GB FH PCIe x16
Engine Clock
1266 MHz
Memory Clock
8gbs
Memory Size(width)
4 GB(256-bit)
Memory Type
128M x 32 GDDR5
Max. Resolution(HDMI)
4096x2160@60Hz
Max. Resolution(DP)
5120x3200@60Hz
Multi Display Support
4 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
DP*3 + HDMI
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
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Technical Specifications - Graphics
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Total power consumption(W)
<150W
PCB form-factor with bracket
ATX (Full height) PCB with ATX dual slot bracket
AMD® Radeon™ RX580 8GB GDDR5 Graphics Card
Engine Clock
1266 MHz
Memory Clock
4000 MHz
Memory Size(width)
8 GB (256-bit)
Memory Type
256M x 32 GDDR5
Max. Resolution(HDMI)
4096x2160@60Hz
Max. Resolution(DP)
5120x3200@60Hz
Multi Display Support
4 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
HDMI + DPx3
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<150W
PCB form-factor with bracket
ATX (Full height) PCB with ATX dual slot bracket
AMD® Radeon R7 430 2GB VGA+DP Graphics Card
Engine Clock
780 MHz
Memory Clock
1100 MHz
Memory Size(width)
2 GB(128-bit)
Memory Type
128M x 32 GDDR5
Max. Resolution(VGA)
2048x1536
Max. Resolution(DP)
4096x2160@60Hz
Multi Display Support
2 displays
HDCP Compliance
yes
Rear I/O connectors(bracket)
VGA+DP
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<50W
PCB form-factor with bracket
LP PCB with FH/LP bracket
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Technical Specifications - Graphics
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AMD® Radeon™ R7 430 2GB GDDR5 DP+VGA Graphics Card
Engine Clock
780 MHz
Memory Clock
1100 MHz
Memory Size(width)
2 GB(64-bit)
Memory Type
256M x 32 GDDR5
Max. Resolution(VGA)
2048x1536
Max. Resolution(DP)
4096x2160@60Hz
Multi Display Support
2 displays
HDCP Compliance
yes
Rear I/O connectors(bracket)
DP+VGA
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<50W
PCB form-factor with bracket
LP PCB with FH/LP bracket
AMD® Radeon™ R7 430 2GB GDDR5 2DP Graphics Card
Engine Clock
780 MHz
Memory Clock
1100 MHz
Memory Size(width)
2 GB(64-bit)
Memory Type
256M x 32 GDDR5
Max. Resolution(DP)
4096x2160@60Hz
Multi Display Support
2 displays
HDCP Compliance
yes
Rear I/O connectors(bracket)
DPx2
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<50W
PCB form-factor with bracket
LP PCB with FH/LP bracket
AMD® Radeon R7 430 2GB 2DP Graphics Card
Engine Clock
780 MHz
Memory Clock
1100 MHz
Memory Size(width)
2 GB(128-bit)
Memory Type
128M x 32 GDDR5
Max. Resolution(DP)
4096x2160@60Hz
Multi Display Support
2 displays
HDCP Compliance
yes
Rear I/O connectors(bracket)
2DP
Cooling(active/passive)
Active fan-sink(Active cooling with dynamic speed)
Total power consumption(W)
<50W
PCB form-factor with bracket
LP PCB with FH/LP bracket
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HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications - Graphics
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Page 33
AMD® Radeon™ 520 1GB Graphics Card
Engine Clock
780 MHz
Memory Clock
1100 MHz
Memory Size(width)
1GB(32-bit)
Memory Type
256M x 32 GDDR5
Max. Resolution(VGA)
2048x1536
Max. Resolution(DP)
4096x2160@60Hz
Multi Display Support
2 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
VGA+DP
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<50W
PCB form-factor with bracket
LP PCB with FH/LP bracket
NVIDIA® GeForce® GTX 1060 3 GB Graphics Card
Engine Clock
1506 MHz
Memory Clock
4004 MHz
Memory Size(width)
3 GB(192-bit)
Memory Type
128M x 32 GDDR5
Max. Resolution(DVI)
2560x1600@60Hz
Max. Resolution(HDMI)
4096x2160@60Hz
Max. Resolution(DP)
5120x3200@60Hz
Multi Display Support
4 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
DVI-D+HDMI+DPx3
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<120W
PCB form-factor with bracket
ATX (Full height) PCB with ATX dual slot bracket
NVIDIA® GeForce® GT730 2GB DP DVI PCIe x8 GFX
Engine Clock
902 MHz
Memory Clock
1250 MHz
Memory Size(width)
2 GB (64-bit)
Memory Type
256Mx32 GDDR5
Max. Resolution(DVI)
2560 x 1600 x 30 bpp @ 60Hz (Dual Link)
Max. Resolution(DP)
4096 x 2160 x 24 bpp @ 60 Hz (DP1.2)
Multi Display Support
Up to 2 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
DL DVI-I + DP
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
35 W
PCB form-factor with bracket
2-pin fan connector for fan sink power/speed control
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HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications - Graphics
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NVIDIA® GeForce® RTX 2060 6 GB Graphics Card
Engine Clock
1680 MHz
Memory Clock
7000 MHz
Memory Size(width)
6 GB(192-bit)
Memory Type
256M x 32 GDDR6
Max. Resolution(DVI)
2560x1600@60Hz
Max. Resolution(HDMI)
4096x2160@60Hz
Max. Resolution(DP)
7680x4320@60Hz
Multi Display Support
3 displays
HDCP Compliance
Yes
Rear I/O connectors(bracket)
DVI+HDMI+DP
Cooling(active/passive)
Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W)
<170W
PCB form-factor with bracket
ATX (Full height) PCB with ATX dual slot bracket
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications - Storage

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c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 35
STORAGE
HP 500 GB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive
Capacity
500 GB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
16 MB
Logical Blocks
976,773,168
Seek Time
12 ms (Average)
Height
0.267 in/6.8 mm (nominal)
Width
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
HP 1 TB 7.2K SATA 6.0Gb/s 2.5” Hard Disk Drive
Capacity
1 TB
Rotational Speed
7,200 rpm
Interface
SATA 6 Gb/s
Buffer Size
32 MB
Logical Blocks
1,953,525,168
Seek Time
12 ms (Average)
Height
0.374 in/9.5 mm (nominal)
Width
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
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Technical Specifications - Storage
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HP 500 GB SATA 6G 2.5” 8GB Solid State Hybrid Drive (SSHD)
Capacity
500 GB
Rotational Speed
5,400 rpm
Drive Type
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface
SATA 6 Gb/s
Buffer Size
64 MB
NAND Flash
8 GB
Seek Time
12 ms (Average)
Height
0.267 in/6.8 mm (nominal)
Width
2.75 in/70 mm (nominal)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
HP 1 TB SATA 6G 2.5" 8GB Solid State Hybrid Drive (SSHD)
Capacity
1 TB
Rotational Speed
5,400 rpm
Drive Type
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface
SATA 6 Gb/s
Buffer Size
64 MB
NAND Flash
8 GB
Seek Time
12 ms (Average)
Height
0.374 in/9.5 mm (nominal)
Width
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
HP 2 TB SATA 6G 2.5" 8 GB Solid State Hybrid Drive (SSHD)
Capacity
2 TB
Rotational Speed
5,400 rpm
Drive Type
Solid State Hybrid Drive (SSHD) technology with NAND Flash
Interface
SATA 6 Gb/s
Buffer Size
128 MB
NAND Flash
8 GB
Seek Time
12 ms (Average)
Height
0.374 in/9.5 mm (nominal)
Width
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications - Storage
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NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
HP 2 TB 5.4K SATA 6.0Gb/s 2.5” Hard Disk Drive
Capacity
2 TB
Rotational Speed
5,400 rpm
Interface
SATA 6 Gb/s
Buffer Size
128 MB
Logical Blocks
3,907,050,336
Seek Time
12 ms (Average)
Height
0.374 in/9.5 mm (nominal)
Width
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
500 GB 2.5” FIPS 140-2 SED Solid State Drive
Capacity
500 GB
Architecture
Self-Encrypting (SED) Solid State Drive with SATA interface
Interface
SATA 6 Gb/s
Buffer Size
32 MB
Logical Blocks
976,773,168
Seek Time
12 ms (Average)
Height
0.267 in/6.8 mm (nominal)
Width
2.75 in/70 mm (nominal)
Operating Temperature
41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
HP 9.5mm Slim DVD-ROM Drive
Height
9.5 mm height
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Dimensions (W x H x D)
5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max)
Up to 0.31 lb (140g) without bezel
Read Speeds
DVD+R/-R/+RW/
-RW/+R DL /-R DL Up to 8X DVD-ROM Up to 8X CD-ROM, CD-R Up to 24X CD-RW Up to 24X
Access time (typical reads, including settling)
Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical) Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
Power
Source Slimline SATA DC power receptacle
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Technical Specifications - Storage
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DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions (operating - non-condensing)
Temperature 41° to 122° F (5° to 50° C) Relative Humidity 10% to 80% Maximum Wet Bulb Temperature 84° F (29° C)
HP 9.5mm Slim DVD Writer Drive
Height
9.5 mm height
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D)
5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max)
0.31 lb (140 g)
Read Speeds
DVD-R DL - Up to 6X DVD+R - Up to 8X DVD+RW - Up to 8X DVD+R DL - Up to 6X DVD-R - Up to 8X DVD-RW - Up to 6X CD-R - Up to 24X CD-RW - Up to 10X DVD-RW, DVD+RW - Up to 8X DVD-R DL, DVD+R DL - Up to 8X DVD+R, DVD-R - Up to 8X DVD-ROM DL, DVD-ROM - Up to 8X CD-ROM, CD-R - Up to 24X CD-RW - Up to 24X
Write Speeds
DVD-R DL Up to 6X DVD+R Up to 8X DVD+RW Up to 8X DVD+R DL Up to 6X DVD-R Up to 8X DVD-RW Up to 6X CD-R Up to 24X CD-RW Up to 24X
Access time (typical reads, including settling)
Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical) Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical) Stop Time 6 seconds (typical)
Power
Source Slimline SATA DC power receptacle DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions (operating - non-condensing)
Temperature 41° to 122° F (5° to 50° C) Relative Humidity 10% to 80% Maximum Wet Bulb Temperature 84° F (29° C)
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Technical Specifications - Storage
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HP 9.5mm Slim Blu-Ray Writer Drive
Height
9.5 mm height
Orientation
Either horizontal or vertical
Interface type
SATA/ATAPI
Disc recording capacity
Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL
Dimensions (W x H x D)
5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max)
0.29 lb (132 g)
Write Speeds
BD-R Up to 4X BD-RE Up to 2X BD-R Up to 6X BD-RE Up to 2X DVD-R Up to 8X DVD-RW Up to 6X DVD+R Up to 8X DVD+RW Up to 8X DVD-RAM Up to 5X CD-R Up to 24X CD-RW Up to 10X
Read Speeds
BD-R Up to 6X BD-RE Up to 4X BD-ROM Up to 6X BD-R Up to 6X BD-RE Up to 6X DVD-ROM Up to 8X DVD-R Up to 8X DVD-RW Up to 8X DVD+R Up to 8X DVD+RW Up to 8X BDMV (AACS Compliant Disc) Up to 6x/2x (Read/Play) DVD-RAM Up to 5x DVD-Video (CSS Compliant Disc) Up to 8x/4x (Read/Play) CD-R/RW/ROM Up to 24x CD-DA (DAE) Up to 24X/10X (Read/Play)
Access time (typical reads, including settling)
Random BD-ROM: 205 ms (typical), DVD-ROM: 185 ms (typical), CD-ROM: 165 ms (typical) Full Stroke BD-ROM: 350 ms (typical), DVD-ROM: 345 ms (typical), CD-ROM: 340 ms (typical)
Power
Source Slimline SATA DC power receptacle DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p DC Current 5 VDC -1200 mA typical, 2000 mA maximum
Environmental conditions (operating - non-condensing)
Temperature 41° to 122° F (5° to 50° C) Relative Humidity 10% to 80% Maximum Wet Bulb Temperature 84° F (29° C)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications – Networking and Communications

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Page 40
NETWORKING AND COMMUNICATIONS
HP EliteDesk 705 G4 Microtower
Realtek RTL8111EPH 10/100/1000 Integrated NIC
Connector
RJ-45
System Interface
PCIe + SMBus
Controller
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
Data rates supported
IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE Compliance
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Jumbo Frame 9K
Performance
Cable Disconnetion: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW
Power
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
MAC/PHY Interconnect
Auto MDI/MDIX Crossover cable detection
Management Interface
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Intel® Ethernet I210-T1 Gigabit Network Adapter
Connector
RJ-45
System Interface
PCIe Express x1
Data rates supported
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Jumbo Frame 9K
QuickSpecs
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Technical Specifications – Networking and Communications
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Power consumption
Cable Disconnection: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW
Power Management
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Intel 9260 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 5.0 Combo1 Non-vPro
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz & 160MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1
IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through CCX4 and CCX Lite
WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
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• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ac VHT160(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22.0 x 30.0 mm
Weight
Type 2230: 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2/5.0 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
QuickSpecs
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Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
Power Management Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Realtek 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 4.2 Combo
1
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
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• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b: +14dBm minimum
• 802.11g: +12dBm minimum
• 802.11a: +12dBm minimum
• 802.11n HT20(2.4GHz): +12dBm minimum
• 802.11n HT40(2.4GHz): +12dBm minimum
• 802.11n HT20(5GHz): +10dBm minimum
• 802.11n HT40(5GHz): +10dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
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BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5) Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of + 4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Power Management Certifications
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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HP EliteDesk 705 G4 Small Form Factor Business PC
Realtek RTL8111EPH 10/100/1000 Integrated NIC
Connector
RJ-45
System Interface
PCIe + SMBus
Controller
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
Data rates supported
IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE Compliance
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Jumbo Frame 9K
Performance
Cable Disconnetion: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW
Power
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
MAC/PHY Interconnect
Auto MDI/MDIX Crossover cable detection
Management Interface
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Intel® 8260 2x2 Dual Band 802.11ac WLAN/ Bluetooth® Combo*
Wireless LAN Standards
IEEE 802.11 ac/a/b/g/n
System Interface
PCIe + SMBus
Interoperability
Wi-Fi® certification
WLAN + Bluetooth® Combo M.2 Card device shall meet all of the requirements to support Bluetooth® 4.1 and backwards compatible with 2.1 with EDR
Frequency Band
802.11b/g/n
2.402-2.482 GHz
802.11a/n/ac
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz (Note: Indonesia does not support this band)
Antenna Interface
With antennas installed in the system, the antenna peak gain is less than +3dBi in the
2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet regulatory limits.
QuickSpecs
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Technical Specifications – Networking and Communications
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Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20
and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz channels. 433Mbps for 1x1 and 867Mbps for 2x2.
Security
IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through V5
WAPI
Note: Check latest software/driver release for updates on supported security features.
Roaming
802.11r Fast Roaming
Output Power (Transmitting)
802.11b: +16dBm minimum
802.11g: +14dBm minimum
802.11a: +14dBm minimum
802.11n HT20 (2.4GHz) : +14dBm minimum
802.11n HT40 (2.4GHz) : +12dBm minimum
802.11n HT20 (5GHz) : +14dBm minimum
802.11n HT40 (5GHz) : +12dBm minimum
802.11ac 80MHz (5GHz) : +12dBm minimum
Notes:
1. RF Tx power have to meet minimum criteria and with +1.5dBm tolerance but -
1.5dBm.
2. RF Parameter will be verified by R&S CMW500 via link mode. .
Power Consumption
Transmit: 2.0 Watts
Receive: 1.6 Watts
Idle mode (PSP): 180 mW (WLAN associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby 10mW (WLAN+BT)
Radio off: 5 mW
Bluetooth® Power Consumption
Peak operating: 330 mW
Receive: 230 mW
USB selective suspend: 17 mW
Power Management
The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the WLAN components. Supports all 802.11 compliant power-save modes. These include the basic Power Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in
802.11e.
Receiver Sensitivity for FER <10%
802.11b, 1Mbps: -94dBm maximum
802.11b, 11Mbps: -86dBm maximum
802.11a/g, 6Mbps: -88dBm maximum
802.11a/g, 54Mbps : -74dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
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Note:
1. Rx sensitivity have to meet maximum criteria and with -1.5dBm tolerance but +1.5dBm.
2. Note: RF Parameter will be verified by R&S CMW500 via link mode.
Form Factors
PCI Express M.2 form factor
Operating Voltage
The card will be powered by a 3.3V, ± 9% supply from the host system.
Temperature
Operating: Non-operating:
14° to 158° F (-10° to 70° C)
-40° to 176° F (-40° to 80° C)
Humidity
Operating: Non-operating:
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating: Non-operating:
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
* Wireless access point and Internet service required and not included. Availability of public wireless access points limited. The specifications for the 802.11ac WLAN are draft specifications and are not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with other 802.11ac WLAN devices.
Intel® Ethernet I210-T1 Gigabit Network Adapter
Connector
RJ-45
System Interface
PCI (Intel® proprietary) + SMBus
Data rates supported
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Jumbo Frame 9K
Power consumption
Cable Disconnection: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW
Power Management
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Security & Manageability
Intel® vPro™ support with appropriate Intel® chipset components
QuickSpecs
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Technical Specifications – Networking and Communications
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Intel® 9260 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 5.0 Combo1 Non-vPro
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz & 160MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ac VHT160(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of
10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2/5.0 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
Power Management Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Intel® 3168 802.11a/b/g/n/ac (1x1) WiFi® and Bluetooth® 4.2 Combo1
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy : 0~79 (1 MHz/CH) BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management Certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Intel® 2 7265 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 4.2 Combo1 Non-vPro
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 54
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy : 0~79 (1 MHz/CH) BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management Certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Realtek 802.11a/b/g/n/ac (1x1) WiFi® and Bluetooth® 4.2 Combo1
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
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Security1
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +14dBm minimum
• 802.11g : +12dBm minimum
• 802.11a : +12dBm minimum
• 802.11n HT20(2.4GHz) : +12dBm minimum
• 802.11n HT40(2.4GHz) : +12dBm minimum
• 802.11n HT20(5GHz) : +10dBm minimum
• 802.11n HT40(5GHz) : +10dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna. One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 57
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications Power Management Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249 ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Intel® 9260 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 5.0 Combo1 Non-vPro
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 58
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz & 160MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ac VHT160(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 59
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2/5.0 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
Power Management Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 60
HP EliteDesk 705 G4 Desktop Mini Business PC
Realtek RTL8111EPH 10/100/1000 Integrated NIC
Connector
RJ-45
System Interface
PCIe + SMBus
Controller
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
Data rates supported
IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE Compliance
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Jumbo Frame 9K
Performance
Cable Disconnetion: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW
Power
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
MAC/PHY Interconnect
Auto MDI/MDIX Crossover cable detection
Management Interface
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Intel® 8260 2x2 Dual Band 802.11ac WLAN/ Bluetooth® Combo*
Wireless LAN Standards
IEEE 802.11 ac/a/b/g/n
System Interface
PCIe + SMBus
Interoperability
Wi-Fi® certification
WLAN + Bluetooth® Combo M.2 Card device shall meet all of the requirements to support Bluetooth® 4.1 and backwards compatible with 2.1 with EDR
Frequency Band
802.11b/g/n
2.402-2.482 GHz
802.11a/n/ac
4.9 – 4.95 GHz (Japan)
5.15 – 5.25 GHz
5.25 – 5.35 GHz
5.47 – 5.725 GHz
5.825 – 5.850 GHz (Note: Indonesia does not support this band)
Antenna Interface
With antennas installed in the system, the antenna peak gain is less than +3dBi in the
2.4GHz band and less than +4dBi in the 5GHz band to allow the device to meet regulatory limits.
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 61
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
802.11n: card will support rates for NSS=1 and NSS=2 for RX and TX for 20
and 40 MHz channels. Short and long guard interval shall be supported.
802.11ac: card will support rates for NSS=1 and NSS=2 for RX and TX for 80 MHz channels. 433Mbps for 1x1 and 867Mbps for 2x2.
Security
IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
AES-CCMP: 128 bit in hardware
802.1x authentication
WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
WPA2 certification
IEEE 802.11i
Cisco Certified Extensions, all versions through V5
WAPI
Note: Check latest software/driver release for updates on supported security features.
Roaming
802.11r Fast Roaming
Output Power (Transmitting)
802.11b: +16dBm minimum
802.11g: +14dBm minimum
802.11a: +14dBm minimum
802.11n HT20 (2.4GHz) : +14dBm minimum
802.11n HT40 (2.4GHz) : +12dBm minimum
802.11n HT20 (5GHz) : +14dBm minimum
802.11n HT40 (5GHz) : +12dBm minimum
802.11ac 80MHz (5GHz) : +12dBm minimum
Notes:
1. RF Tx power have to meet minimum criteria and with +1.5dBm tolerance but -
1.5dBm.
2. RF Parameter will be verified by R&S CMW500 via link mode. .
Power Consumption
Transmit: 2.0 Watts
Receive: 1.6 Watts
Idle mode (PSP): 180 mW (WLAN associated)
Idle mode: 50 mW (WLAN unassociated)
Connect Standby 10mW (WLAN+BT)
Radio off: 5 mW
Bluetooth® Power Consumption
Peak operating: 330 mW
Receive: 230 mW
USB selective suspend: 17 mW
Power Management
The product conforms to the ACPI and PCI Express M.2 bus methods to manage power of the WLAN components. Supports all 802.11 compliant power-save modes. These include the basic Power Save Polling (PSP) in 802.11 and Automatic Power Save Delivery (APSD) defined in
802.11e.
Receiver Sensitivity for FER <10%
802.11b, 1Mbps: -94dBm maximum
802.11b, 11Mbps: -86dBm maximum
802.11a/g, 6Mbps: -88dBm maximum
802.11a/g, 54Mbps : -74dBm maximum
802.11n, MCS07 : -69dBm maximum
802.11n, MCS15 : -66dBm maximum
802.11ac, 1SS, MCS-0 : -86dBm maximum
802.11ac, 1SS, MCS-9 : -61dBm maximum
802.11ac, 2SS, MCS-0 : -83dBm maximum
802.11ac, 2SS, MCS-9 : -58dBm maximum
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Note:
1. Rx sensitivity have to meet maximum criteria and with -1.5dBm tolerance but +1.5dBm.
2. Note: RF Parameter will be verified by R&S CMW500 via link mode.
Form Factors
PCI Express M.2 form factor
Operating Voltage
The card will be powered by a 3.3V, ± 9% supply from the host system.
Temperature
Operating: Non-operating:
14° to 158° F (-10° to 70° C)
-40° to 176° F (-40° to 80° C)
Humidity
Operating: Non-operating:
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating: Non-operating:
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
* Wireless access point and Internet service required and not included. Availability of public wireless access points limited. The specifications for the 802.11ac WLAN are draft specifications and are not final. If the final specifications differ from the draft specifications, it may affect the ability of the notebook to communicate with other 802.11ac WLAN devices.
Intel® 3168 802.11a/b/g/n/ac (1x1) WiFi® and Bluetooth® 4.2 Combo [1]
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
QuickSpecs
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• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight
Type 2230 : 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy : 0~79 (1 MHz/CH) BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
QuickSpecs
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Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management Certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Intel® Ethernet I210-T1 Gigabit Network Adapter
Connector
RJ-45
System Interface
PCI (Intel® proprietary) + SMBus
Data rates supported
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14) 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30) 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40) Auto-Negotiation (Automatic Speed Selection) Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support IEEE 802.1q VLAN support IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable) IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance
TCP/IP/UDP Checksum Offload (configurable) Protocol Offload (ARP & NS) Large send offload and Giant send offload Receiving Side Scaling Jumbo Frame 9K
Power consumption
Cable Disconnetion: 25mW 100Mbps Full Run: 450mW 1000bp Full Run: 1000mW WoL Enable(S3/S4/S5): 50mW WoL Disable(S3/S4/S5): 25mW
Power Management
ACPI compliant – multiple power modes Situation-sensitive features reduce power consumption Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
QuickSpecs
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IT Manageability
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame); Wake-on-LAN from off (Magic Packet only) PXE 2.1 Remote Boot Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30)) Comprehensive diagnostic and configuration software suite Virtual Cable Doctor for Ethernet cable status
Security & Manageability
Intel® vPro™ support with appropriate Intel® chipset components
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Intel® 9260 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 5.0 Combo1 Non-vPro
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, 80MHz & 160MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ac VHT160(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
QuickSpecs
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802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22.0 x 30.0 mm
Weight
Type 2230: 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of
10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2/5.0 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
Power Management Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels
QuickSpecs
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Technical Specifications – Networking and Communications
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Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Intel® 2 7265 802.11a/b/g/n/ac (2x2) WiFi® and Bluetooth® 4.2 Combo [1] Non-vPro
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
• 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
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• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22.0 x 30.0 mm
Weight
Type 2230: 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
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c06040429 DA16287 Worldwide Version 46 July 30, 2020
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Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management Certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
Intel® 3168 802.11a/b/g/n/ac (1x1) WiFi® and Bluetooth® 4.2 Combo1
Wireless LAN Standards
IEEE 802.11a IEEE 802.11b IEEE 802.11g IEEE 802.11n IEEE 802.11ac
Interoperability
Wi-Fi® certified
Frequency Band
802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)
Modulation
Direct Sequence Spread Spectrum BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security3
• IEEE and WiFi® compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Models
Ad-hoc (Peer to Peer) Infrastructure (Access Point Required)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Networking and Communications
Not all configuration components are available in all regions/countries.
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Roaming
IEEE 802.11 compliant roaming between access points
Output Power2
• 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
Power Consumption
• Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management
ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3
802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Antenna type
High efficiency antenna with spatial diversity, mounted in the display enclosure Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN MIMO communications and Bluetooth communications
Form Factor
PCI-Express M.2 MiniCard
Dimensions
Type 2230: 2.3 x 22.0 x 30.0 mm
Weight
Type 2230: 2.8g
Operating Voltage
3.3v +/- 9%
Temperature
Operating Non-operating
14° to 158° F (–10° to 70° C) –40° to 176° F (–40° to 80° C)
Humidity
Operating Non-operating
10% to 90% (non-condensing) 5% to 95% (non-condensing)
Altitude
Operating Non-operating
0 to 10,000 ft (3,048 m) 0 to 50,000 ft (15,240 m)
LED Activity
LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification
4.0/4.1/4.2 Compliant
Frequency Band
2402 to 2480 MHz
Number of Available Channels
Legacy: 0~79 (1 MHz/CH) BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput
Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or 864 kbps symmetric (3-EV5)
QuickSpecs
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Technical Specifications – Networking and Communications
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Transmit Power
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum transmit power of +4 dBm for BR and EDR.
Power Consumption
Peak (Tx) 330 mW Peak (Rx) 230 mW Selective Suspend 17 mW
Electrical Interface
USB 2.0 compliant
Bluetooth Software Supported Link Topology
Microsoft Windows Bluetooth Software Power Management
Microsoft Windows ACPI, and USB Bus Support
Certifications
FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management Certifications
ETS 300 328, ETS 300 826 Low Voltage Directive IEC950 UL, CSA, and CE Mark
Bluetooth Profiles Supported
BT4.1-ESR 5/6/7 Compliance LE Link Layer Ping LE Dual Mode LE Link Layer LE Low Duty Cycle Directed Advertising LE L2CAP Connection Oriented Channels Train Nudging & Interlaced Scan BT4.2 ESR08 Compliance LE Secure Connection- Basic/Full LE Privacy 1.2 –Link Layer Privacy LE Privacy 1.2 –Extended Scanner Filter Policies LE Data Packet Length Extension FAX Profile (FAX) Basic Imaging Profile (BIP)2 Headset Profile (HSP) Hands Free Profile (HFP) Advanced Audio Distribution Profile (A2DP)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications – Input/Output Devices

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Page 73
I/O DEVICES
HP EliteDesk 705 G4 Microtower
HP Conferencing Keyboard
1.
Function Keys
6.
End/Decline a Call
2.
F11 Lync or Skype for Business Contact list
1
7.
Answer a Call
3.
F12 Lync or Skype for Business Calendar
2
8.
Microphone Mute
4.
Share Screen
9.
Volume Up/Down
5.
Stop Webcam
10.
Audio Mute
1. Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Contact list
2. Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Calendar
HP USB Premium Keyboard
Physical Characteristics
Keys
104, 105 layout (depending upon country)
Dimensions (L x W x H)
17.04 x 5.55 x 0.52 in (433 x 141 x13.2 mm)
Weight
1.54 lb (698g)
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
35mA (All LED on)
System interface
USB Type A plug connector
ESD
Contact Discharge: 8 KV Air Discharge: 15 KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Low-profile design
Switch actuation
60±10g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
6 ft (1.8 m)
Environmental
Acoustics
43-dBA maximum sound pressure level
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Technical Specifications – Input/Output Devices
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Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
-22° to 140° F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
Approvals
UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic Compliance
TUVGS
Kit Contents
Keyboard, QSP
Warranty Card
Product Notice
Skylab USB Wired Keyboard
Physical Characteristics
Keys
104, 105, 106, 107, 109 layout (depending upon country)
Dimensions (L x W x H)
171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
1.0 cm)
Weight
1.32 lb (0.6± 0.08 kg)
Electrical
Operating voltage
4.4-5.25VDC
Power consumption
50-mA maximum (with 5 VDC power supplied and three LEDs ON)
System interface
USB
ESD
Contact Discharge: 2, 4,6,8KV Air Discharge: 2, 4, 8,10,12.5KV
EMI - RFI
Conforms to FCC rules for a Class B computing device
Mechanical
Keycaps
Low-profile design
Switch actuation
60±10g nominal peak force with tactile feedback
Switch life
10 million keystrokes (Life tester)
Switch type
Contamination-resistant switch membrane
Key-leveling mechanisms
For all double-wide and greater-length keys
Cable length
6 ft (1.8 m)
Microsoft PC 99 - 2001
Mechanically compliant
Environmental
Acoustics
43-dBA maximum sound pressure level
Operating temperature
50° to 122° F (10° to 50° C)
Non-operating temperature
Minus 30 degress to 60 degress Celsius
QuickSpecs
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Technical Specifications – Input/Output Devices
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Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non-condensing at ambient)
Operating shock
40 g, six surfaces
Non-operating shock
80 g, six surfaces
Operating vibration
2-g peak acceleration
Non-operating vibration
4-g peak acceleration
Drop (out of box)
26 in (66 cm) on carpet, six-drop sequence
Drop (in box)
30 in (76.2 cm) on concrete, 16-drop sequence
Approvals
UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic compliance
ANSI HFS 100, ISO 9241-4, and TUVGS
Kit contents
Keyboard, Installation Guide, Warranty card, Safety and Comfort Guide
HP USB Premium Mouse
Dimensions (H x L x W)
4.21 x 2.64 x 1.52 in (107 x 67 x 38.7 mmm)
Weight
0.19lb (90g)
Environmental
Operating temperature
50° to 122°F (10° to 50° C)
Non-operating temperature
-22° to 140°F (-30° to 60° C)
Operating humidity
10% to 90% (non-condensing at ambient)
Non-operating humidity
20% to 80% (non condensing at ambient)
Operating shock
50 g, 6 surfaces
Non-operating shock
80 g, 6 surfaces
Operating vibration
2 g peak acceleration
Non-operating vibration
4 g peak acceleration
Electrical
Operating voltage
5 VDC, +/-5%
Power consumption
12mA
Mechanical
Connector
USB 2.0
Type
3D mouse (3 keys and wheel)
Resolution
800, 1200, 1600 DPI
Sensor
Pixart PAN3606DL
Tracking speed
Tracking acceleration
8G(max), 1G=9.8m/s2
Cable length
6 ft (1.8 m)
Color
Jack Black
Regulatory approvals
Compliant
UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
QuickSpecs
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HP USB Mouse
Dimensions (H x L x W)
37mm*115mm*62.9mm
Weight
90 +10g/- 5 g
Color
Black
Connector
USB
Mechanical
Resolution
800 DPI sensitivity
Buttons
Two primary buttons and clickable scroll wheel
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications – Audio

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AUDIO/MULTIMEDIA
HP EliteDesk 705 G4 Microtower
Type
Integrated
HD Stereo Codec
Synaptics CX20632
Audio I/O Ports
Front: 1 - Headset connector supports a CTIA style headset and is re-taskable as a Line-in, Line­out, Microphone-in or Headphone-out port 1 - Headphone port Rear: Line-out Line-in which is retaskable as a Microphone Input All ports are 3.5mm and support stereo
Internal Speaker Amplifier
2W class D mono amplifier for the internal speaker only. External speakers must be powered externally
Multi-streaming Capable
Playback multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling
Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses
Yes - Uses OS soft wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes
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Technical Specifications – Audio
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HP EliteDesk 705 G4 Small Form Factor Business PC
Type
Integrated
HD Stereo Codec
Conexant CX20632
Audio I/O Ports
Front: 1 - Headset connector supports a CTIA style headset and is re-taskable as a Line-in, Line­out, Microphone-in or Headphone-out port 1 - Headphone port Rear: Line-out Line-in which is retaskable as a Microphone Input All ports are 3.5mm and support stereo
Internal Speaker Amplifier
2W class D mono amplifier for the internal speaker only. External speakers must be powered externally
Multi-streaming Capable
Playback multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling
Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses
Yes - Uses OS soft wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes
HP EliteDesk 705 G4 Desktop Mini Business PC
Type
Integrated
HD Stereo Codec
Conexant CX20632
Audio I/O Ports
Front: 1 - Headset connector supports a CTIA style headset and is re-taskable as a Line-in, Line­out, Microphone-in or Headphone-out port 1 - Headphone port All ports are 3.5mm and support stereo
Internal Speaker Amplifier
2W class D mono amplifier for the internal speaker only. External speakers must be powered
Multi-streaming Capable
Playback multi-streaming can be enabled in the audio control panel to allow independent audio streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling
Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses
Yes - Uses OS soft wavetable
Analog Audio
Yes
# of Channels on Line-Out
Stereo (Left & Right channels)
Internal Speaker
Yes
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications – Power

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Page 79
POWER
HP EliteDesk 705 G4 Microtower
UNIT ENVIRONMENT AND OPERATING CONDITIONS
Temperature Range
Operating : 5°C ~45°C Non-Operating : -40°C ~66°C
Relative Humidity
Operating: 5% to 90% relative humidity at max inlet temperature Non Operating: 5% to 90% relative humidity at max inlet temperature
Maximum Altitude (unpressurized)
Operating: 5000m Non-operating: 50000ft (15240 m)
HP EliteDesk 705 G4 Small Form Factor Business PC
UNIT ENVIRONMENT AND OPERATING CONDITIONS
Temperature Range
Operating : 5°C ~50°C Non-Operating : -40°C ~66°C
Relative Humidity
Operating 5% to 90% relative humidity at max inlet temperature Non-Operating 5% to 90% relative humidity at max inlet temperature
Maximum Altitude (unpressurized)
Operating: 5000m Non-operating: 50,000 ft (15240 m)
HP EliteDesk 705 G4 Desktop Mini Business PC
UNIT ENVIRONMENT AND OPERATING CONDITIONS
Temperature Range
Operating : 5°C ~35°C Non-Operating : -40°C ~66°C
Relative Humidity
Operating 5% to 90% relative humidity at max inlet temperature Non-Operating 5% to 90% relative humidity at max inlet temperature
Maximum Altitude (unpressurized)
Operating: 5000m Non-operating: 50,000 ft (15240 m)
DM
SFF
MT
80 PLUS Platinum
180W active PFC 90/92/89% efficient at 20/50/100% load (115V) 91/93/90% efficient at 20/50/100% load (230V
250W active PFC / 80 PLUS Platinum 400W active PFC / 80 PLUS Platinum 90/92/89% efficient at 20/50/100% load (115V) 91/93/90% efficient at 20/50/100% load (230V)
Operating Voltage Range
90Vac~264Vac
90Vac~264Vac
90Vac~264Vac
Rated Voltage Range
100Vac~240Vac
100Vac~240Vac
100Vac~240Vac
Rated Line Frequency
50HZ~60HZ
50HZ~60HZ
50HZ~60HZ
Operating Line Frequency
47HZ~63HZ
47HZ~63HZ
47HZ~63HZ
Rated Input Current
65W≦1.6A 90W≦1.2A 150WW2.2A
250W≦3A 400W≦5.2A
250W≦3A 400W≦5.2A
Rated Input Current with Energy Efficient* Power Supply
65W≦1.6A 90W≦1.2A 150WW2.2A
250W≦3A 400W≦5.2A
250W≦3A 400W≦5.2A
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Technical Specifications – Power
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DC Output
+19.5V
+12V
+12V
Current Leakage (NFPA 99: 2102)
Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1. Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1.
Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1. Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1.
Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section 10.3.5.1. Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that contact patients in normal use. Per section
10.3.5.1.
Power Supply Fan
N/A
50mm variable speed
70mm variable speed
Power cord length
6.0 ft. (1.83 m)
6.0 ft. (1.83 m)
6.0 ft. (1.83 m)
External Power Adapter
External power supply 65W EPS, 89% average efficiency at 115V & 230Vac 90W EPS, 89% average efficiency at 115V & 230Vac 150W EPS, 89% average efficiency at 115V & 230Vac
Internal power supply
Internal power supply
Dimensions
65W : 113.5mm x 55mm x 30mm 90W : 132.5mm x 57mm x
30.3mm 150W : 167.5mm x 80mm x
40.5mm
200mm x 85mm x 53mm
165mm x 95mm x 73mm The harmonic input current requirements must be met under the following operating conditions: Load Requirements: 50% and 100% Input Voltage: 230Vac/50Hz. For active power factor correction the power factor at 50% &100% loads shall be greater than 0.9 over the entire nominal input voltage range (100-127VAC and 200-240VAC).
Condition
Standard Efficiency
82/85/82%
85/88/85%
87/90/87%
90/92/89%
Input Voltage
10% of Rated Load
-
75%
81%
84%
84%
115Vac/60HZ
20% of Rated Load
-
82%
85%
87%
90%
115Vac/60HZ
50% of Rated Load
-
85%
88%
90%
92%
115Vac/60HZ
PF>0.9
PF>0.9
PF>0.9
PF>0.9
PF>0.95
100% of Rated Load
70%
82%
85%
87%
89%
115Vac/60HZ
PF>0.9
PF>0.9
PF>0.9
PF>0.9
PF>0.9
230Vac/50HZ
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications – Weights and Dimensions

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Page 81
WEIGHTS & DIMENSIONS
DM
SFF
MT
Chassis (W x D x H) Not including bezel
6.97 x 6.89 x 1.35 in 177 x 175 x 34.2 mm
3.7 x 10.6 x 11.7 in 95 x 270 x 296 mm
6.69 x10.79 x 13.3 in 170 x 274 x 338 mm
System Volume
64 cu in
1.05 L
463 cu in
7.6 L
960 cu in
15.74 L
Max System Weight
1.265 kg
5.88 kg
7.14 kg
Max Supported Weight (desktop orientation)
N/A
77 lb 35 kg
77 lb 35 kg
Stand Dimensions
160 x 117 x 18.5 mm
Packaging (W x D x H)
19.57 x 5.04 x 8.78 in 497 x 128 x 223 mm
15.71 x 9.06 x 19.65 in 399 x 230 x 499 mm
15.35 x 11.73 x 19.65 in 390 x 298 x 499 mm
Shipping Weight
2.95 kg
6.49 lb
16.12 lb
7.32 kg
22.64 lb
10.28 kg
Shipping Weight (Molded Pulp)
16.62 lb
7.54kg
23.15 lb
10.5kg
Multipack Packaging (10 units)
20.28x16.54x25 in 515x420x636 mm
Palletization Profile
18-units per layer 5 or 6 layers max depending on details of air freight 90 or 108 units per pallet depending on details of air freight
45.354 x 39.13 x 57.80 in, 1152 x 994 x 1468 mm (include pallet)
6-units per layer 60 per pallet
47.24 x 39.37 x 94.49 in (including pallet) 10 layer max
6-units per layer 42 per pallet
47.24 x 39.37 x 86.85 in (including pallet) 7 layer max
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Technical Specifications Miscellaneous Features

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Page 82
MISCELLANEOUS FEATURES
Management Features
Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.
Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
Dual colored power LED on front of computer to indicate either normal or fault condition
System/Emergency ROM
Flash ROM
CMOS Battery Holder for easy replacement
Flash Recovery with Video Configuration Record Software
5 Aux Power LED on System PCA
Processor ZIF Socket for easy Upgrade
Over-Temp Warning on Screen (Requires IM Agents)
Clear Password Jumper
DIMM Connectors for easy Upgrade
Clear CMOS Button
NIC LEDs (integrated) (Green & Amber)
Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
Color coordinated cables and connectors
Tool-less Hood Removal
Front power switch
System memory can be upgraded without removing the system board or any internal components
Tool-less Hard Drive, CD & Diskette Removal
Green Pull Tabs, and Quick Release Latches for easy Identification
Additional Features
Product can be oriented as either a desktop (horizontal) or a tower (vertical)
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
After Market Options
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c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 83

AFTER MARKET OPTIONS

Graphics Solutions
DM
SFF
TWR
Part Number
AMD® Radeon R7 430 2GB 2DP Card
X
3TK71AA
AMD® Radeon RX550 4GB 2DP Card
X
3MQ82AA
HP DisplayPort To HDMI True 4k Adapter
X X X
2JA63AA
HP DVI Cable Kit
X X
DC198A
HP HDMI Standard Cable Kit
X X X
T6F94AA
HP DisplayPort Cable Kit
X X X
VN567AA
HP DisplayPort To DVI-D Adapter
X X X
FH973AA
HP DisplayPort To VGA Adapter
X X X
AS615AA
Desktop Mini Accessories
DM
SFF
TWR
Part Number
HP Desktop Mini G3 Port Cover Kit
X
1ZE52AA
HP G4 Mini 2.5-inch SATA Drive Bay Kit
X
3TK91AA
HP Desktop Mini LockBox V2
X
3EJ57AA
HP Desktop Mini 500GB HDD/I/O Expansion Module
X
K9Q82AA
HP Desktop Mini DVD-Writer ODD Expansion Module
X
K9Q83AA
HP Desktop Mini I/O Expansion Module
X
K9Q84AA
HP Desktop Mini Security/Dual VESA Sleeve v2
X
2JA32AA
HP Desktop Mini Vertical Chassis Stand
X
G1K23AA
HP DM VESA Power Supply Holder Kit
X
1RL87AA
Desktop Mini Accessories
DM
SFF
TWR
Part Number
Intel® 9260 802.11ac non-vPro PCIe x1 Card
X X
3TK89AA
Realtek 8822BE 802.11ac PCIe x1 Card
X X
3TK90AA
Data Storage Drives
DM
SFF
TWR
Part Number
HP 256GB SATA TLC Non-SED Solid State Drive
X X X
P1N68AA
HP PCIe NVME TLC 256GB SSD M.2 Drive
X X X
1CA51AA
HP PCIe NVME TLC 512GB SSD M.2 Drive
X X X
X8U75AA
HP PCIe NVME TLC 512GB SSD PCIe Drive
X X
Z4L70AA
HP 500GB 7200PRM SATA 6.0Gb/s 3.5” Hard Drive
X X
QK554AA
HP 1TB 7200rpm SATA 6Gb/s 3.5” Hard Drive
X X
QK555AA
HP SATA SuperMulti JB Drive
X
QS208AA
HP 9.5mm Slim Removable SATA 500GB
X X
T7G14AA
HP 9.5mm G3 8/6/4 SFF G4 400 SFF/MT DVD Writer
X
1CA53AA
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
After Market Options
Not all configuration components are available in all regions/countries.
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Page 84
Input Devices
DM
SFF
TWR
Part Number
HP USB (Grey) SmartCard CCID Keyboard
X X
J7H70AA
HP USB Antimicrobial Business Slim Keyboard and Mouse (China Only)
X X
Z9H50AA
HP USB Buisness Slim CCID SmartCard Keyboard
X X
Z9H48AA
HP USB Business Slim (Grey) Keyboard (EMEA Only)
X X
Z9H49AA
HP USB Business Slim Keyboard
X X X
N3R87AA
HP USB Business Slim Keyboard and Mouse and Mousepad
X X X
T4E63AA
HP USB Collaboration Keyboard
X X X
Z9N38AA
HP USB Conferencing Keyboard
X X
K8P74AA
HP USB Keyboard
X X X
QY776AA
HP USB Keyboard and Mouse Healthcare Edition
1VD81AA
HP USB Premium Keyboard
X X X
Z9N40AA
HP USB PS/2 Washable Keyboard & Mouse
X X X
BU207AA
HP Wireless Business Slim Keyboard and Mouse
X X X
N3R88AA
HP Wireless Collaboration Keyboard
X X X
Z9N39AA
HP Wireless Premium Keyboard
X X X
Z9N41AA
HP PS/2 Business Slim Keyboard
X X X
N3R86AA
HP USB Grey v2 Mouse (EMEA only)
X X
Z9H74AA
HP USB Premium Mouse
X X
1JR32AA
HP PS/2 Mouse
X X X
QY775AA
HP USB 1000dpi Laser Mouse
X X X
QY778AA
HP USB Hardened Mouse
X X
P1N77AA
HP USB Mouse
X X X
QY777AA
System Memory
DM
SFF
TWR
Part Number
HP 4GB DDR4-2666 DIMM
X X
3TK85AA
HP 8GB DDR4-2666 DIMM
X X
3TK87AA
HP 16GB DDR4-2666 DIMM
X X
3TK83AA
HP 4GB DDR4-2666 SODIMM
X
3TK86AA
HP 8GB DDR4-2666 SODIMM
X
3TK88AA
HP 16GB DDR4-2666 SODIMM
X
3TK84AA
Multimedia Devices
DM
SFF
TWR
Part Number
HP Business Headset v2
X X X
T4E61AA
HP USB Business Speakers v2
X X X
N3R89AA
Security Devices
DM
SFF
TWR
Part Number
HP Solenoid Lock & Hood Sensor (MT)
X
J6L42AA
HP Business PC Security Lock v3 Kit
X X
3XJ17AA
HP Dual Head Keyed Cable Lock
X X X
T1A64AA
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
After Market Options
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 85
HP Keyed Cable Lock 10mm
X X X
T1A62AA
HP Master Keyed Cable Lock 10mm
X X X
T1A63AA
Stands and Accessories
DM
SFF
TWR
Part Number
HP B300 PC Mounting Bracket
X
2DW53AA
HP B500 PC Mounting Bracket
X
2DW52AA
HP Single Monitor Arm
X
BT861AA
I/O Devices
DM
SFF
TWR
Part Number
HP DisplayPort Port Flex IO
X X X
3TK72AA
HP HDMI Port Flex IO (705)
X X X
3TK75AA
HP Type-C USB 3.1 Gen2 Port Flex IO
X X X
3TK78AA
HP VGA Port Flex IO
X X X
3TK80AA
HP Internal Serial Port Flex IO
X
3TK76AA
HP Serial Port Adapter (2nd Serial Port )
X X
PA716A
HP Internal Serial Port (600/705/800)
X X
3TK82AA
HP PCIe x1 Parallel Port Card
X X
N1M40AA
HP 800/600/400 G3 Serial/ PS/2 Adapter
X X
1VD82AA
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs

Change Log

Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 86
© Copyright 2020 HP Development Company, L.P. All rights reserved.
The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Celeron, Core, Pentium are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth is a trademark of its proprietor, used by HP, Inc. under license. USB Type-C™ and USB-C™ are trademarks of USB Implementers Forum. NVIDIA, GeForce and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection Agency. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in the United States and other countries.
Date
Version History
Action
Description of Change
June 20, 2018
From v1 to v2
Update
Weights & Dimensions
June 28, 2018
From v2 to v3
Added
Environmental tab
July 19, 2018
From v3 to v4
Added
Note for SATA Drive Bracket added to Internal Slots and Ports section
July 27, 2018
From v4 to v5
Remove
Checkmark off the SFF for the RX550 graphics card in the After Market Options section
July 30, 2018
From v5 to v6
Change
Graphic cards info moved to processors section and graphic removed off QS.
August 1, 2018
From v6 to v7
Add/remove
AMD Ryzer™ CPU added to processors USB mentions formatted to last statement requirements
August 9, 2018
From v7 to v8
Update
Processors order re-arranged
August 20, 2018
From v8 to v9
Update
Shipping weight (Molded Pulp) added to to weight and dimensions for SFF and MT Palletization profile updated
August 21, 2018
From v9 to v10
Update
Windows Home removed
August 27, 2018
From v10 to v11
Update
Windows Home re-attached
August 30, 2018
From v11 to v12
Update
Optional Discrete Graphics Solutions table section added GTX1060 and GT730 graphic cards specs added After market options corrected
September 6, 2018
From v12 to v13
Add
System Integrated Graphics and its specs added on both Graphics sections
September 13, 2018
From v13 to v14
Add
2700X CPU*, 2700 CPU* and 2600 CPU* processors information updated.
September 18, 2018
From v14 to v15
Removal
Duplicated AMD Ryzen™ 7 PRO 2700X CPU* removed from
processors
September 19, 2018
From v15 to v16
Add
NVIDIA GeForce GT730 2GB DP DVI PCIe x8 GFX added to Graphics section for MT and SFF
September 27, 2018
From v16 to v17
Update
AMD Radeon RX 560 graphic card added Last bullet added to “At a Glance” section
October 5,2018
From v17 to v18
Update
Memory footnote change from 2400 to 2133
October 9, 2018
From v18 to v19
Update
Max boost and base frequency added to AMD Ryzen and PRO processors
October 11, 2018
From v19 to v20
Update
Footnote 33 updated to Raid 1 configuration
October 17, 2018
From v20 to v21
Update
AMD® Athlon™ PRO 200GE APU with AMD®Radeon added to
processors
October 18, 2018
From v21 to v22
Update
VESA Plate Intergrated added to not shown call outs for Desktop Mini Athlon PRO" Processo added to “At a glance” second bullet
QuickSpecs
HP EliteDesk 705 G4 Business Desktops PCs
Change Log
Not all configuration components are available in all regions/countries.
c06040429 DA16287 Worldwide Version 46 July 30, 2020
Page 87
Foot note no. 4 removed from third bullet at “At a glance”section
AMD Athlon™ PRO 200GE Processor put in AMD® Ryzen™ with
AMD®Radeon processors section
November 14, 2018
From v22 to v23
Update
Max. Resolution added to AMD Radeon™ 560
November 21, 2018
From v23 to v24
Update
SSD Intel Optane 118GB 2280 PCIe NVME (Optane) removed from storage
November 28, 2018
From v24 to v25
Update
Active Mode Row added to SFF Environmental data table
December 17, 2018
From v25 to v26
Update
AMD Radeon™ R7 430 Graphics 2GB GDDR5 64bit 2DP, AMD Radeon™ R7 430 Graphics 2GB GDDR5 64bit DP+VGA and AMD
Radeon™ RX 580 Graphics 8GB GDDR5 Added to graphics
January 2, 2019
From v26 to v27
Update
Max System Weight set for MT and SFF
January 23, 2019
From v27 to v28
Update
AMD® PRO A6-9500 APU Graphics processor added for SFF
February 1, 2019
From v28 to v29
Update
HP PhoneWise, HP WorkWise and HP ePrinter + Jet advantage removed.
February 11, 2019
From v29 to v30
Update
Support for VESA 100 mounting system on bottom of PC chassis” added to mounting in the call outs section for DM
March 11, 2019
From v30 to v31
Update
Type C port USB port (2.0 or 3.0) and PORTS information charging capability statement update and PORTS information, on USB type C port (15W) added.
April 1, 2019
From v31 to v32
Update
DVD and Blue-ray ROM´s added to Storage specs section
April 15, 2019
From v32 to v33
Update
AMO updated
April 16, 2019
From v33 to v34
Update
HP 9.5mm Slim DVD Writer Drive Write speeds updated
May 15, 2019
From v34 to v35
Update
AMD® PRO A12-8870, AMD® PRO A10-8770 APU, AMD® PRO A6­8570 APU and Intel® 8260 802.11AC 2x2 DualBand PCIe x1 Combo added.
May 28, 2019
From v35 to v36
Update
Web-supported only added
June 27, 2019
From v36 to v37
Update
EPEAT references updated RTL8111EPH NIC added on 705 G4 DM section HP Cloud Recovery and footnote added at software section
July 10, 2019
From v37 to v38
Update
Duplicated environmental tables removed Typo corrected in environmental table for SFF
July 29, 2019
From v38 to v39
Update
NVIDIA® GeForce® RTX 2060 6 GB and AMD® Radeon 520 1GB added to Graphics AMD® Radeon™ RX550 4GB made able for SFF
August 20, 2019
From v39 to v40
Update
Bays specs, and references updated Disclaimer added to SFF call outs back image Cable lock slot upgraded to Standard
September 10, 2019
From v40 to v41
Update
Windows 10 Enterprise 64 added to web supported only section
September 17, 2019
From v41 to v42
Update
Note added to Graphics
November 5, 2019
From v42 to v43
Update
EPEAT references updated / Power Factor table added to Power Supply
December 11, 2019
From v43 to v44
Update
Weights and dimensions typos corrected
February 18, 2020
From v44 to v45
Update
Drivelock note and disclaimer added
July 30, 2020
From v45 to v46
Update
DM rear image call out #4 corrected
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