No.60950-1-07, Second Edition + A1:2011 (MOD) Certified
IEC 60950-1:2005 (2nd edition) + A1:2009 and EN 609501:2006 +A11:2009 +A1:2010 +A12:2011, and VDE‡0805
(EN60950-1 3rd edition) Licensed
CE mark meets 2006/95/EC directive
Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation
rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3
PoE standards
ISO** 9001 and ISO 14001 certified manufacturing facilities
to 75Vdc
dc
=48Vdc)
IN
§
o,nom
¤
Description
The KHHD006A0A series power modules are isolated DOSA compliant 1/16th brick dc-dc converters that operate over an ultrawide input voltage range of 18 V
-75Vdc and provide a single precisely regulated output voltage at 5.0Vdc. The output is fully
dc
isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency
of 90% typical at full load. Built-in filtering for both input and output minimizes the need for external filtering. The module is fully
self-protected with output over-current and over-voltage, over-temperature and input under voltage shutdown control. Optional
features include negative or positive on/off logic and SMT connections.
* UL is a registered trademark of Underwriters Laboratories, Inc.
†
CSA is a registered trademark of Canadian Standards Association.
‡
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment. All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards.
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage (Continuous) All V
Transient (100ms) All V
Operating Ambient Temperature All T
(see Thermal Considerations section)
Storage Temperature All T
Altitude* All
I/O Isolation Voltage (100% factory Hi-Pot tested) All
IN
IN, trans
A
stg
⎯⎯
* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.
Electrical Specifications
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 18 24/48 75 Vdc
Input No Load Current
(VIN = 48Vdc IO = 0A, module enabled)
Input Stand-by Current
(VIN = 24 to 48Vdc, module disabled)
Maximum Input Current (VIN=18Vdc, IO= I
Inrush Transient All I2t 0.05 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; V
see Test configuration section)
Input Ripple Rejection (120Hz) All 60 dB
) All I
O,MAX
=0V to 75Vdc, IO= I
IN
Omax
;
All I
All I
All 30 mA
IN,No load
6 8 mA
IN,stand-by
IN, MAX
-0.3 80 Vdc
-0.3 100 Vdc
-40 85 °C
-55 125 °C
4000 m
2250 Vdc
40 50 mA
2.5 Adc
p-p
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of
complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 5A.
(see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input
current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
General Specifications
Parameter Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3
(I
O
=80%I
, TA=40°C, airflow = 200 lfm, 90% confidence)
O, max
Weight
FIT >270 10
MTBF >3,600,000 Hours
⎯
13 (0.46)
⎯
Feature Specifications
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions. See Feature Descriptions for
additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
IN, min
to V
; open collector or equivalent,
IN, max
terminal)
IN-
9
/Hours
g (oz.)
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (V
= -0.7Vdc) All I
on/off
Logic Low - On/Off Voltage All V
Logic High Voltage (I
= 0Adc) All V
on/off
Logic High maximum allowable leakage current All I
on/off
on/off
on/off
on/off
⎯⎯
-0.7
2.4
⎯ ⎯
⎯
⎯
0.15 mA
0.8 Vdc
7 Vdc
25 μA
Turn-On Delay and Rise Times
(IO=80% of I
Case 1: Input power is applied for at least 1second, and then the
On/Off input is set from OFF to ON (T
= 10% of V
V
O
Case 2: On/Off input is set to Module ON, and then input power is
applied
= VIN reaches V
(T
delay
Output voltage Rise time (time for Vo to rise from 10%
of V
o,set
Output Voltage Overshoot
(IO=80% of I
Output Overvoltage Protection
Input Undervoltage Lockout
Turn-on Threshold All V
Turn-off Threshold All V
Hysterisis All V
)
O, max
T
O, set
= on/off pin transition until
delay
)
All
All
until VO = 10% of V
IN, min
to 90% of V
O, max
)
o, set
, VIN= 24 to 48Vdc)
O,set
)
All T
All V
delay
Case1
T
delay
Case2
O, limit
uv/on
uv/off
rise
hyst
⎯
⎯
⎯
6.0
⎯
14 15
⎯
25 50 ms
35 50 ms
5 10 ms
3 % V
⎯
17 18 V
2.0
7.0 Vdc
⎯
⎯
Vdc
Vdc
dc
O, set
Note: 1.The module requires a minimum of 680 μF external output capacitor to avoid exceeding the OVP maximum limits during startup into open
loop fault conditions.
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Characteristic Curves
The following figures provide typical characteristics for the KHHD006A0A (5.0V, 6A) at 25oC. The figures are identical for either
positive or negative remote On/Off logic.
(A)
IN
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A) INPUT VOLTAGE, VIN (V)
Figure 1. Converter Efficiency versus Output Current.
75Vin
48Vin
24Vin
(V) (50mV/div)
O
V
OUTPUT VOLTAGE
18Vin
TIME, t (2μs/div) TIME, t (500μs/div)
o
= I
Figure 3. Typical output ripple and noise (I
( (V) (2V/div)
O
o,max
INPUT CURRENT, I
Figure 2. Converter Input Current versus Input Voltage.
(V) (200mV/div)
O
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) V
).Figure 4. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, Vin=48V.
(V) (2V/div)
O
V) (2V/div) V
On/Off
V
TIME, t (10ms/div) TIME, t (10ms/div)
Figure 5.Typical Start-up Using Remote On/Off, negative
logic version shown (V
Figure 6. Typical Start-up Using Input Voltage (V
I
o,max
).
IN
= 48V, Io=
GE
Data Sheet
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Test Configurations
Vout+
V
Vout-
x 100 %
CURRENT PROBE
33μF
SC O PE
O
Vin+
Vin-
RESISTI V E
LO A D
R
contact Rdistribution
R
contact Rdistribution
R
TO OSCILLOSCOPE
L
TEST
12μH
CS 220μF
BATTERY
NOTE: Measure input reflected ripple current with a simulated
E.S.R.<0.1Ω
@ 20°C 100kHz
source inductance (L
possible battery impedance. Measure current as shown
above.
) of 12μH. Capacitor CS offsets
TEST
Figure 7. Input Reflected Ripple Current Test Setup.
C OP PER STRIP
V
(+)
O
1uF .
V
( – )
O
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
10uF
GROUND PLANE
Figure 8. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket c ontact
resistance.
Vin+
V
IN
Vin-
Figure 9. Output Voltage and Efficiency Test Setup.
. I
V
O
Efficiency
=
η
VIN. I
O
IN
LOAD
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. Highly inductive source impedance can
affect the stability of the power module. For the test
configuration in Figure 7, a 33μF electrolytic capacitor
(ESR<0.7Ω at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in
compliance with the spacing and separation requirements of
the end-use safety agency standard, i.e., UL 60950-1-3, CSA
C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements
for safety extra-low voltage (SELV), all of the following must be
true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
One V
pin and one V
IN
the input and output pins are to be kept floating.
The input pins of the module are not operator accessible.
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the output
pins and ground.
The power module has extra-low voltage (ELV) outputs when all
inputs are ELV.
For input voltages exceeding –60 Vdc but less than or equal to
–75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as TNV-2
in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum 6A
fast acting fuse in the ungrounded lead.
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the on/off pin,
and off during a logic low. Negative logic remote on/off, device
code suffix “1”, turns the module off during a logic high and on
during a logic low.
Vin+
I
on/off
V
on/off
ON/OFF
Vin-
Figure 10. Circuit configuration for using Remote On/Off
Implementation.
To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage
) between the ON/OFF terminal and the VIN(-) terminal.
(V
on/off
Logic low is 0V ≤ V
≤ 0.8V. The maximum I
on/off
logic low is 0.15mA, the switch should be maintain a logic low
level whilst sinking this current.
During a logic high, the typical V
is 4.0V, and the maximum allowable leakage current at V
4.0V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V
Overcurrent Protection
To provide protection in a fault (output overload) condition, the
unit is equipped with internal current-limiting circuitry and can
endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. If the unit
is not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power or by toggling the
remote on/off signal. If the unit is configured with the autorestart option (4), it will remain in the hiccup mode as long as
the overcurrent condition exists; it operates normally, once the
output current is brought back into its specified range.
Overtemperature Protection
To provide protection under certain fault conditions, the unit is
equipped with a thermal shutdown circuit. The unit will shut
down if the thermal reference point Tref (Figure 16), exceeds
o
C (typical), but the thermal shutdown is not intended as a
135
guarantee that the unit will survive temperatures beyond its
rating. The module will automatically restart upon cool-down
to a safe temperature.
Vout+
TRIM
Vout-
during a
on/off
generated by the module
on/off
(-).
IN
on/off
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only begin to
operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, V
UV/ON
.
Once operating, the module will continue to operate until the
input voltage is taken below the undervoltage turn-off
threshold, V
UV/OFF
.
Over Voltage Protection
The output overvoltage protection shall consist of circuitry that
independently monitors the output voltage, and shuts the
module down if the output voltage exceeds specified limits.
This protection feature latches in the event of over voltage
across the output. Cycling the on/off pin or input voltage resets
the latching protection feature. If the auto-restart option (4) is
ordered, the module will automatically restart upon an
internally programmed time elapsing.
Output Voltage Programming
Trimming allows the user to increase or decrease the output
voltage set point of the module. This is accomplished by
connecting an external resistor between the TRIM pin and
either the Vout+ pin or the Vout- pin.
Trim Down – Decrease Output Voltage
By connecting an external resistor (R
pin and V
(-) or SENSE(-) pin (see figure 11), the output voltage
O
set point decreases. The following equation determines the
external resistor value to obtain an output voltage change
=
from V
Where
to the desired V
o,set
=
−kRdownadj
511
Δ
=Δ
:
o,desired
−
%
Ω
22.10
−
VV
V
,,
desiredoseto
×
,
seto
Figure 11. Circuit Configuration to Decrease Output Voltage.
) between the TRIM
adj-down
100%
Trim Up – Increase Output Voltage
By connecting an external resistor (R
pin and V
(+) or SENSE(+) pin (see figure 12), the output voltage
O
set point increases. The following equation determines the
external resistor value to obtain an output voltage change
from V
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Feature Descriptions
V
=
R
−
upadj
Where
Figure 12. Circuit Configuration to Increase Output Voltage.
The combination of the output voltage adjustment and the
output voltage initial tolerance must not exceed the allowable
trim range of 80% to 110% of the nominal output voltage as
measured between the Vout+ and Vout- pins.
The KHHD006A0A power modules have a fixed current-limit set
point. Therefore, as the output voltage is adjusted down, the
available output power is reduced.
seto
,
=Δ
Δ×
V
,
seto
(continued)
Δ+××
%225.1
VV
−
,,
setodesiredo
%)100(11.5
511
−
Δ
%
100%
×
−
Ω
k
22.10
Pre-bias Vin Under Voltage Test
The module shall recover from UVLO [Under Voltage Lock Out]
without protective shutdown from OCP or OVP or hard failure,
when subjected to Vin Under Voltage transients with the
following conditions:
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be provided
to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability.
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature, the
module output power is increased, until one (or more) of the
components reaches its maximum derated operating
temperature, as defined in IPC-9592A. This procedure is then
repeated for a different airflow or ambient temperature until a
family of module output derating curves is obtained.
Figure 13. Thermal Test Setup .
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Derating figures showing the maximum output
current that can be delivered by each module versus local
ambient temperature (T
3m/s (600 ft./min) are shown in the respective Characteristics
Curves section.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
Figure 14. Output Current Derating for the Open Frame
KHHD006A0A in the Transverse Orientation; Airflow
Direction from Vin(+) to Vin(-); Vin = 24V.
C2, C3
C5, C6
Figure 17. Suggested Configuration for EN55022 Class B.
(A)
O
OUTPUT CURRENT, I
LOCAL AMBIENT TEMPERATURE, TA (°C)
Figure 15. Output Current Derating for the Open Frame
KHHD006A0A in the Transverse Orientation; Airflow
Direction from Vin(+) to Vin(-); Vin = 48V.
The thermal reference point, T
shown in Figure 16. For reliable operation this temperature
should not exceed 135
Figure 16. T
ref
o
C.
Temperature Measurement Location.
used in the specifications is
ref,
EMC Requirements
Figure 17 shows a maximum filter configuration to meet the
conducted emission limits of EN55022 Class B.
Notes: C1 and C4 are low impedance SMT ceramics.
Figure 18. EMC signature using above filter, KHHD006A0A.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The KHHD006A0A power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLTR100V10 data
sheet.
The KHHD006A0A family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT) soldering.
Through-Hole Soldering Information
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have an
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Layout Considerations (continued)
RoHS-compliant finish that is compatible with both Pb and Pbfree wave soldering processes. A maximum preheat rate of
3
°C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210
°C. For Pb solder, the recommended pot temperature is
260
°C, while the Pb-free solder pot is 270°C max. Not all RoHS-
compliant through-hole products can be processed with pastethrough-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE
representative for more details.
Surface Mount Information
Pick and Place
The KHHD-SR series of DC-to-DC power converters use an
open-frame construction and are designed for surface mount
assembly within a fully automated manufacturing process.
The KHHD-SR series modules are designed to use the main
magnetic component surface to allow for pick and place.
Note: All dimensions in mm [in].
Figure 19. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by using open
frame construction. Even so, they have a relatively large mass
when compared with conventional SMT components.
Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this
process.
The minimum recommended nozzle diameter for reliable
operation is 5mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is
6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be used
within the space available.
For further information please contact your local GE Technical
Sales Representative.
Reflow Soldering Information
These power modules are large mass, low thermal
resistance devices and typically heat up slower than other
SMT components. It is recommended that the customer
review data sheets in order to customize the solder reflow
profile for each application board assembly.
The following instructions must be observed when SMT
soldering these units. Failure to observe these instructions
may result in the failure of or cause damage to the modules,
and can adversely affect long-term reliability.
There are several types of SMT reflow technologies currently
used in the industry. These surface mount power modules
can be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb solder is
shown in Figure 20 and 21. For reliable soldering the solder
reflow profile should be established by accurately measuring
the module’s pin connector temperatures.
300
250
200
150
10 0
REFLOW TEMP (°C)
50
0
Pe ak Temp 235oC
Heat zo ne
oCs-1
max 4
Soak zone
30-240s
Pr eheat zone
oCs-1
max 4
REFLOW TIME (S)
T
205
lim
Co oling
zo ne
1- 4
above
o
C
oCs-1
Figure 20. Recommended Reflow Profile for Sn/Pb solder.
240
235
230
225
220
215
210
MAX TEMP SOLDER (°C)
205
200
0 10 203040 5060
TIME LIMIT (S)
Figure 21. Time Limit, T
, Curve Above 205oC Reflow .
lim
Lead Free Soldering
The –Z version SMT modules of the KHHD006A0A series are
lead-free (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Surface Mount Information (continued)
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. D
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 22.
300
250
200
150
Reflow Temp (°C)
100
50
Per J-STD-020 Rev. D
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
0
Reflow Time (Seconds)
Figure 22. Recommended linear reflow profile using
Sn/Ag/Cu solder.
MSL Rating
The KHHD006A0A series SMT modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of
≤ 30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished circuit
board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
KHHD006A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5.0Vdc, 6A Output
Packaging Details
The KHHD006A0A series SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown below.
Modules are shipped in quantities of 140 modules per reel.
The KHHD006A0A - series Through Hole versions are supplied in trays as standard. Details of tray dimensions are shown
below. Modules are shipped in quantities of 75 modules per box.
Dimensions are in millimeters.
Tolerances: x.x mm
x.xx mm