GE Industrial Solutions KHHD004A2B User Manual

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 4.2A, 50W Output

RoHS Compliant

Applications

 Wireless Networks

 Hybrid power architectures

 Optical and Access Network Equipment

 Enterprise Networks including Power over Ethernet (PoE)

 Industrial markets

Options

 Negative Remote On/Off logic (preferred)

 Surface Mount/Tape and Reel (-SR Suffix)

 Auto-restart Over current/Over voltage protections

(preferred)

 Shorter through hole pin trim

Features

 Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)

 Compliant to REACH Directive (EC) No 1907/2006

 Compliant to IPC-9592A (September2008), Category 2, Class II

 Ultra-wide Input Voltage Range, 18V

 No minimum load

 High efficiency – 90% at full load (V

 Constant switching frequency

 Low output ripple and noise

 Small Size and low profile, follows DOSA standard 1/16th

footprint

33.0 mm x 22.9 mm x 9.3 mm
(1.30 in x 0.9 in x 0.37 in)

 Surface mount (SMT) or Through hole (TH)

 Reflow process compliant, both SMT and TH versions

 Positive Remote On/Off logic

 Output overcurrent/voltage protection (hiccup)

 Over-temperature protection

 Output Voltage adjust: 80% to 110% of V

 Wide operating temperature range (-40°C to 85°C)

*

 ANSI/ UL

60950-1-2011 Recognized, CAN/CSA† C22.2
No.60950-1-07, Second Edition + A1:2011 (MOD) Certified IEC
60950-1:2005 (2nd edition) + A1:2009 and EN 60950-1:2006
+A11:2009 +A1:2010 +A12:2011, and VDE
3rd edition) Licensed

 CE mark meets 2006/95/EC directive

 Meets the voltage and current requirements for ETSI 300-

132-2 and complies with and licensed for Basic insulation
rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3

standards

 ISO** 9001 and ISO 14001 certified manufacturing facilities

to 75Vdc

dc

=48Vdc)

IN

o,nom

‡

0805 (EN60950-1

§

¤

PoE

Description

The KHHD004A2B series power modules are isolated DOSA compliant 1/16th brick dc-dc converters that operate over an ultra­wide input voltage range of 18 V
isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency
of 90% typical at full load. Built-in filtering for both input and output minimizes the need for external filtering. The module is fully
self-protected with output over-current and over-voltage, over-temperature and input under voltage shutdown control. Optional
features include negative or positive on/off logic and SMT connections.

* UL is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

§ This product is intended for integration into end-user equipment. All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards.

-75Vdc and provide a single precisely regulated output voltage at 12Vdc. The output is fully

dc

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 1

GE

Data Sheet

KHHD004A2B Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 4.2A, 50W Output

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage (Continuous) All V

Transient (100ms) All V

Operating Ambient Temperature All T

(see Thermal Considerations section)

Storage Temperature All T

Altitude* All

I/O Isolation Voltage (100% factory Hi-Pot tested) All

IN

IN, trans

A

stg

 

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-55 125 °C

4000 m

2250 Vdc

* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.

Electrical Specifications

Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 18 24/48 75 Vdc

Input No Load Current

(IO = 0A, module enabled)

Input Stand-by Current

(VIN = 24 to 48Vdc, module disabled)

Maximum Input Current (VIN=18Vdc, IO= I

Inrush Transient All I2t 0.05 A2s

Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; V
see Test configuration section)

Input Ripple Rejection (120Hz) All 60 dB

) All I

O,MAX

=0V to 75Vdc, IO= I

IN

Omax

;

All I

All I

All 30 mA

IN,No load

IN,stand-by

IN, MAX

40 50 mA

8 mA

3.3 Adc

p-p

EMC, EN55022 See EMC Considerations section

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of
complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6A
(see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input
current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 2

GE

Data Sheet

KHHD004A2B Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 4.2A, 50W Output

Electrical Specifications (continued)

Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.

Parameter Device Symbol Min Typ Max Unit

Output Voltage Set-point

=24 to 48Vdc, IO=I

(V

IN

O, max

,)

All V

O, set

Output Voltage

(Over all operating input voltage, resistive load, and temperature

All V

O

conditions until end of life)
Adjustment Range
Selected by external resistor
Remote Sense Range
Output Regulation

Line (VIN=V

Load (IO=I

Temperature (T

IN, min

O, min

to V

) All

IN, max

to I

) All

O, max

to T

ref=TA, min

) All

A, max

Output Ripple and Noise on nominal output

All V

All

O, adj

+10 % V

Measured with 10uF Tantalum||1uF ceramic

(VIN=24 to 48Vdc, IO=80%I

RMS (5Hz to 20MHz bandwidth)

Peak-to-Peak (5Hz to 20MHz bandwidth)
External Capacitance (see Note 1 in Feature Specifications) All C
Output Current All I
Output Current Limit Inception (Hiccup Mode) All I

Output Short-Circuit Current (VO ≤ 250 mV) All I

Efficiency (VIN=24Vdc, IO=I

Efficiency (VIN=48Vdc, IO=I

Switching Frequency (Fixed)
VIN=24 to 48Vdc, IO= I

O, max

)

O, max

All

) All η 87.0 88.0

O, max

) All η 89.0 90.0

O, max

All f

O, max

o

O, lim

O, s/c

sw

Dynamic Load Response
(Io/t=0.1A/s, VIN=24 to 48Vdc)

Load Change from Io= 50% to 75% or 25% to 50% of I

:

o,max

Peak Deviation All Vpk

Settling Time (Vo<10% peak deviation) All ts

11.82 12.00 12.18 Vdc

-3.0

-20



 

 
 

0
0

4.6










0.05 0.2 % V

0.05 0.2 % V





2.5

350

3.0

400

+3.0 % V

+10 % V

1.0 % V

40 mV

150 mV

2200 μF

4.2 Adc

5.9 Adc









A

%

%

kHz

% V

 s

O, set

O, set

O, set

O, set

O, set

O, set

rms

pk-pk

rms

O, set

Isolation Specifications

Parameter Symbol Min Typ Max Unit

Isolation Capacitance C

Isolation Resistance R

I/O Isolation Voltage All

iso

iso



10

 

1000

 



2250 Vdc

pF

MΩ

General Specifications

Parameter

Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3

=80%I

(I

O

Weight

, TA=40°C, airflow = 200 lfm, 90% confidence)

O, max

Min Typ Max Unit

FIT 261.1 10

9

/Hours

MTBF 3,829,239 Hours



13 (0.46)



g (oz.)

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 3

GE

Data Sheet

KHHD004A2B Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 4.2A, 50W Output

Feature Specifications

Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions. See Feature Descriptions for
additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V

Signal referenced to V

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Turn-On Delay and Rise Times

(IO=80% of I

Case 1: Input power is applied for at least 1second, and then the
On/Off input is set from OFF to ON (T
V

O

to V

IN, min

Logic Low - Remote On/Off Current (V

; open collector or equivalent,

IN, max

terminal)

IN-

= -0.7Vdc) All I

on/off

Logic Low - On/Off Voltage All V

Logic High Voltage (I

= 0Adc) All V

on/off

Logic High maximum allowable leakage current All I

)

O, max

= 10% of V

O, set

= on/off pin transition until

delay

)

All

on/off

on/off

on/off

on/off

T

Case1

delay

 

-0.7

2.4

 



0.15 mA




0.8 Vdc

7 Vdc

25 μA

30 50 ms

Case 2: On/Off input is set to Module ON, and then input power is

applied

= VIN reaches V

(T

delay

until VO = 10% of V

IN, min

O,set

)

Output voltage Rise time (time for Vo to rise from 10%
of V

to 90% of V

o,set

o, set

)

All

All T

Output Voltage Overshoot

(IO=80% of I

Output Overvoltage Protection

, VIN= 24 to 48Vdc)

O, max

1

All V

Input Undervoltage Lockout

Turn-on Threshold All V

Turn-off Threshold All V

Hysterisis All V

T

delay

Case2

O, limit

uv/on

uv/off

rise

hyst





14.0



14 15



20 50 ms

5 10 ms

3 % V



17.0 Vdc

17 18 V



2.0



Vdc

Vdc

O, set

dc

Note: 1.The module requires a minimum of 220 μF external output capacitor to avoid exceeding the OVP maximum limits during startup into open
loop fault conditions.

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 4

GE

O

/Off

O

G

O

O

G

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Characteristic Curves

The following figures provide typical characteristics for the KHHD004A2B (12.0V, 4.2A) at 25oC. The figures are identical for either
positive or negative remote On/Off logic.

(A)

IN

EFFICIENCY,  (%)

OUTPUT CURRENT, IO (A) INPUT VOLTAGE, VIN (V)

INPUT CURRENT, I

Figure 1. Converter Efficiency versus Output Current. Figure 2. Converter Input Current versus Input Voltage.

(V) (200mV/div)

O

(V) (100mV/div)

O

OUTPUT VOLTAGE

V

TIME, t (2s/div)

Figure 3. Typical output ripple and noise (I

o = Io,max).

Io(A) (1A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

TIME, t (200µs/div)

Figure 4. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, Vin=24V,

>100μF

C

O

E

LTA

(V) (5V/div)

O

UTPUT V

(V) (5V/div )

O

E

LTA
V

(V) (2V/div) V

n

On/Off

V

TIME, t (10ms/div) TIME, t (10ms/div)

Figure 5.Typical Start-up Using Remote On/Off, negative
logic version shown (V

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 5

= 24V or 48V, Io = I

IN

o,max

).

(V) (20V/div) V

IN

INPUT VOLTAGE OUTPUT VOLTAGE

V

Figure 6. Typical Start-up Using Input Voltage (V

o,max).

I

IN

= 48V, Io =

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Test Configurations

Vout+

V

Vout-

x 100 %

CURRENT PROBE

33μF

SC O P E

R

O

R

Vin+

Vin-

RESI STI V E

LO A D

contact Rdistribution

contact Rdistribution

R

LOAD

TO OSCILLOSCOPE

L

TEST

12μH

CS 220μF

BATTERY

NOTE: Measure input reflected ripple current with a simulated

E.S.R.<0.1

@ 20°C 100kHz

source inductance (L
possible battery im pedance. Measure curren t as shown
above.

) of 12μH. Capacitor CS offsets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

C OP PER STRIP

V

(+)

O

1uF .

V

( – )

O

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.

10uF

GROUND PLANE

Figure 8. Output Ripple and Noise Test Setup.

R

R

contact

distribution

R

R

contact

distribution

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.

Vin+

V

IN

Vin-

Figure 9. Output Voltage and Efficiency Test Setup.

V

. I

O

Efficiency

=



VIN. I

O

IN

Design Considerations

Input Source Impedance

The power module should be connected to a low
ac-impedance source. Highly inductive source impedance can
affect the stability of the power module. For the test
configuration in Figure 7, a 33μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the power
module is used, the power module must be installed in
compliance with the spacing and separation requirements of
the end-use safety agency standard, i.e., UL 60950-1-3, CSA
C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3

If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements
for safety extra-low voltage (SELV), all of the following must be
true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including
the ac mains.

 One V

pin and one V

IN

the input and output pins are to be kept floating.

 The input pins of the module are not operator accessible.

 Another SELV reliability test is conducted on the whole

system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.

Note: Do not ground either of the input pins of the module

without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the output
pins and ground.

The power module has extra-low voltage (ELV) outputs when all
inputs are ELV.

For input voltages exceeding –60 Vdc but less than or equal to
–75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as TNV-2
in Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum 6A
fast acting fuse in the ungrounded lead.

pin are to be grounded, or both

OUT

rd

Edition).

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 6

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the on/off pin,
and off during a logic low. Negative logic remote on/off, device
code suffix “1”, turns the module off during a logic high and on
during a logic low.

Vin+

I

on/off

V

on/off

ON/OFF

Vin-

Figure 10. Circuit configuration for using Remote On/Off
Implementation.

To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage

) between the ON/OFF terminal and the VIN(-) terminal.

(V

on/off

Logic low is 0V ≤ V

≤ 0.8V. The maximum I

on/off

logic low is 0.15mA, the switch should be maintain a logic low
level whilst sinking this current.

During a logic high, the typical V
is 4.0V, and the maximum allowable leakage current at V

4.0V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V

Overcurrent Protection

To provide protection in a fault (output overload) condition, the
unit is equipped with internal current-limiting circuitry and can
endure current limiting continuously. At the point of
current-limit inception, the unit enters hiccup mode. If the unit
is not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power or by toggling the
remote on/off signal. If the unit is configured with the auto­restart option (4), it will remain in the hiccup mode as long as
the overcurrent condition exists; it operates normally, once the
output current is brought back into its specified range.

Overtemperature Protection

To provide protection under certain fault conditions, the unit is
equipped with a thermal shutdown circuit. The unit will shut
down if the thermal reference point Tref (Figure 16), exceeds

o

C (typical), but the thermal shutdown is not intended as a

135
guarantee that the unit will survive temperatures beyond its
rating. The module will automatically restart upon cool-down
to a safe temperature.

Vout+

TRIM

Vout-

during a

on/off

generated by the module

on/off

(-).

IN

on/off

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only begin to
operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, V

UV/ON

.

Once operating, the module will continue to operate until the
input voltage is taken below the undervoltage turn-off
threshold, V

UV/OFF

.

Over Voltage Protection

The output overvoltage protection shall consist of circuitry that
independently monitors the output voltage, and shuts the
module down if the output voltage exceeds specified limits.
This protection feature latches in the event of over voltage
across the output. Cycling the on/off pin or input voltage resets
the latching protection feature. If the auto-restart option (4) is
ordered, the module will automatically restart upon an
internally programmed time elapsing.

Output Voltage Programming

Trimming allows the user to increase or decrease the output
voltage set point of the module. This is accomplished by
connecting an external resistor between the TRIM pin and
either the Vout+ pin or the Vout- pin.

Trim Down – Decrease Output Voltage

By connecting an external resistor (R
pin and V

(-) or SENSE(-) pin (see figure 11), the output voltage

O

set point decreases. The following equation determines the
external resistor value to obtain an output voltage change

=

from V

Where

to the desired V

o,set





kRdownadj




511





:

o,desired





%








22.10






VV



,,

desiredoseto





V



,

seto



Figure 11. Circuit Configuration to Decrease Output Voltage.

) between the TRIM

adj-down

100%

Trim Up – Increase Output Voltage

By connecting an external resistor (R
pin and V

(+) or SENSE(+) pin (see figure 12), the output voltage

O

set point increases. The following equation determines the
external resistor value to obtain an output voltage change
from V

to the desired V

o,set

o,desired

:

) between the TRIM

adj-up

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 7

G

K

A

F

R

W

F

T

otmTp

aPTwwfo

E

4

n

e



u

o

0

w

A

r

u

U

a

t

e

o

a

V



u

t

u

c

f

+

d

u

u

g

m

d

e

©

s

s

c

o

n

x

d

e

t

e

t

E

a

e

a

m

t

k

a

h

y

e

p

r

e

s

e

l

t

s

m

p

d

p

p

p

a

r

t

e

e

s

s

e

c

n

v

s

s

w

a

a

s

p

t

s

s

c

w

e

e

u

a

o

e

u

a

A

F

n

e

s

v

t

f

u

o

r

r

a

d

m

5

r

n

s

e

u

h

o

M

p

e

o

m

l

e

m

h

c

t

w

e

e

c

p

a

e

m

n

C

h

g

e

h

a

r

u

n

Data Sh

et

HHD00

1

8-75Vdc I

eature D







upadj




here

igure 12. Circ

he combinati
utput voltage

rim range of 8

easured bet

he KHHD004
oint. Therefo
vailable outp

re-bias Vin

he module sh

ithout protec
hen subject
llowing condi

Vin(V)

48
48
48
48
48
48
48
48
60
60
60
60
60
60
60
60

Vin

put; 12.0

scriptions

11.5

V




% 




it Configura

n of the outp

initial toleran

% to 110% o

een the Vout

2B power mo

e, as the outp

t power is red

nder Volta

ll recover fro

ive shutdown

d to Vin Un

tions:

Tfall

= 10us

5V

A2B H

100(

seto

,





V

,

seto

Tdip (ms)

5

5
10
10

5

5
10
10

5

5
10
10

5

5
10
10

mmerh

dc, 4.2A, 5

(continued)

%)



%225.1



VV

,,

odesiredo

set








ion to Increa

t voltage adju
e must not ex
the nominal

and Vout- pi

ules have a fi
t voltage is a

ced.

e Test

UVLO [Und

from OCP or

er Voltage

Co (uF)

Tdip

511





100

0

2200

0

2200

0

2200

0

2200

0

2200

0

2200

0

2200

0

2200

ad™ S

0W Outpu



%

e Output Volt

tment and th
eed the allow
utput voltage

s.

ed current-li
justed down,

r Voltage Loc

OVP or hard f

ransients wit

T

rise = 5us





k22.10




Load (A)

0
0
0
0

4.2

4.2

4.2

4.2
0
0
0
0

4.2

4.2

4.2

4.2

ries; DC

ge.

ble

as

it set

he

Out]

ilure,
the

-DC Co

Th

rmal Con

The

ower module

envi

onments; ho

to h

lp ensure reli

Con

iderations incl

pow

r dissipation,

redu

ction in the op

resu

t in an increa

The

hermal data

mea

urements tak

ther

o-couple ins

tem

eratures: FET

cera

mic capacitor

con

uctors, while

tem

erature. For a

mod

ule output po

onents reach

com
tem

erature, as d

repe

ted for a diff

fami

ly of module o

Figu

e 13. Therma

Hea

Transfer vi

Incr

ased airflow

via c

onvection. De

nt that can b

curr
amb

ient temperat

3m/

(600 ft./min)

Curv

es section.

e refer to the

Plea
Proc

ss For Open-

deta

iled discussio

devi

e temperatur

verter P

ideration

operate in a
ever, sufficien
ble operation.

ude ambient t

nd the need
erating tempe
e in reliability.

resented here

en in a wind t

rumentation t
, diodes, cont
, opto-isolato
ontrolling the
given airflow

er is increase

es its maximu

fined in IPC-9
rent airflow o

tput derating

l Test Setup.

Convectio

ver the modul

rating figures

delivered by

re (TA) for nat
re shown in t

pplication N

rame Board-

of thermal as

s.

ower M

ariety of ther

cooling shou

mperature, a
or increased r
rature of the

is based on p
nnel, using au

monitor key
ol ICs, magne
s, and module
ambient airflo

nd ambient t

, until one (or

derated op
92A. This pro
ambient tem
curves is obt

e enhances th

howing the

ach module v
ral convectio
e respective

te “Thermal C

ounted Powe

ects includin

dules

al

d be provided

irflow, module

liability. A
odule will

ysical

tomated

omponent

ic cores,

pwb

rate and

mperature, t
more) of the
rating
edure is then

erature until

ined.

heat transfe

aximum outp

ersus local

and up to
haracteristics

aracterizatio

r Modules” for

maximum

e

t

a

pril 1, 2013

2012 General

lectric Compan

. All rights reser

ed.

Pag

8

G

K

1

A

T

()

F

K

D

()

FKD

Tss

F

E

F

c

E

0

n

o

(

)

O

p

(

)

O

p

f

e

e

T

r

w

s

a

V

o

T

e

+

T

e

+

T

b

M

E

h

5

2

e

o

e

o

h

t

a

s

e

u

e

r

h

C

A

e

r

r

v

s

y

K

e

p

p

e

a

e

K

e

o

R

(

p

S

n

e

u

0

K

2

3

W

t

0

4

a

d

p

n

o

d

u

f

S

n

-

y

e

n

P

W

,

t

n

R

n

a

h

d

e

c

n

r

d

m

h

o

a

V

n

0

u

o

e

h

n

T

v

T

o

i

e

n

b

9

e

e

a

Data S

eet

HHD0

8-75Vdc I

hermal C

A

O

OUTPUT CURRENT, I

igure 14. Out
HHD004A2B i

irection from

A

O

4A2B H

put; 12.0

nsiderati

L

CAL AMBIEN

ut Current D
n the Transve
Vin(-) to Vin(

mmer

dc, 4.2A,

ns (contin

TEMPERATUR

rating for th

rse Orientati
); Vin = 24V.

ead™ S

0W Outp

ued)

E, TA (C)

Open Frame

n; Airflow

ries; D

t

-DC Co

s: C1 and C4

Not

Ci

C4 2.2uF, 1

C1,

C2,

C3

C5,

C6

Figu

e 17. Sugges

See Fig

1210Y1
RDHX2

RDHX3
202S48

verter

are low imped

re 7

0V, 1210

50103KXTD

3K302HKT, 22
3K302HKT, 33

334KT, 33nF

ed Configura

ower M

ance SMT cer

V, 10nF, 1500

nF, 3kv
nF, 3000V (Hol

2000V (Joha

ion for EN55

dules

mics.

(*2)

ystone)

son)

22 Class B.

OUTPUT CURRENT, I

igure 15. Out
HHD004A2B i

irection from

he thermal re
hown in Figur
hould not exc

igure 16. T

MC Requi

igure 17 sho

onducted emi

pril 1, 2013

L

CAL AMBIEN

ut Current D
n the Transve
Vin(-) to Vin(

erence point,

16. For relia

ed 119oC.

emperature

ref

ements

s a maximum

sion limits of

TEMPERATUR

rating for th

rse Orientati
); Vin = 48V.

used in the

ref,

le operation t

easuremen

filter configur

N55022 Clas

E, T

(C)

A

Open Frame

n; Airflow

specifications

is temperatu

Location.

tion to meet t
B.

©

012 General El

Figu
abo

For f
plea

is

e

La

The
to b
com
mod
cop
mod
pow

For
she

The
eith

Thr

The
SAC
com

e

singl
RoH

ctric Company.

e 18. KHHD0

e filter, Vin=

urther inform

e refer to the

out Consi

HHD004A2B

used in fine p

onent cleara

ule and the m

er areas on th

ule. Also avoi

r module.

dditional layo

t.

HHD004A2B

r Through-Hol

ugh-Hole

oHS-complia

Sn/Ag/Cu) Pb

onents. The

e or dual wav

-compliant fi

ll rights reserv

4A2B Vin+ Li

8V, Blue=PK,

tion on desig

FLTR100V10 d

erations

ower module

itch system c

ce between t
unting board

e outer layer

placing via in

t guide-lines,

amily of pow

e (TH) or Surfa

oldering I

t (Z codes) th
free solder an
are designed

soldering ma
ish that is co

d.

e EMC signat

ed=Avg.

ing for EMC c
ata sheet (FDS

series are low
rd architectur

e bottom of t

is limited. Avoi

irectly undern

terconnects u

refer to the FL

r modules is a

e Mount (SM

formation

ough-hole pr

RoHS-compl
to be process
chines. The pi

patible with

re using

mpliance,

01-043EPS).

profile in ord

s. As such,

e power
d placing
eath the pow

derneath the

R100V10 dat

ailable for

) soldering.

ducts use the

ant
d through

s have an

oth Pb and Pb

Page

r

r

-

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Layout Considerations (continued)

free wave soldering processes. A maximum preheat rate of
3C/s is suggested. The wave preheat process should be such
that the temperature of the power module board is kept below
210C. For Pb solder, the recommended pot temperature is
260C, while the Pb-free solder pot is 270C max. Not all RoHS­compliant through-hole products can be processed with paste­through-hole Pb or Pb-free reflow process. If additional
information is needed, please consult with your GE
representative for more details.

Surface Mount Information

Pick and Place

The KHHD-SR series of DC-to-DC power converters use an
open-frame construction and are designed for surface mount
assembly within a fully automated manufacturing process.

The KHHD-SR series modules are designed to use the main
magnetic component surface to allow for pick and place.

Note: All dimensions in mm [in].

Figure 19. Pick and Place Location.

Z Plane Height

The ‘Z’ plane height of the pick and place location is 7.50mm
nominal with an RSS tolerance of +/-0.25 mm.

Nozzle Recommendations

The module weight has been kept to a minimum by using open
frame construction. Even so, they have a relatively large mass
when compared with conventional SMT components.
Variables such as nozzle size, tip style, vacuum pressure and
placement speed should be considered to optimize this
process.

The minimum recommended nozzle diameter for reliable
operation is 5mm. The maximum nozzle outer diameter, which
will safely fit within the allowable component spacing, is

6.5mm.
Oblong or oval nozzles up to 11 x 6 mm may also be used

within the space available.
For further information please contact your local GE Technical

Sales Representative.

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 10

Reflow Soldering Information

These power modules are large mass, low thermal
resistance devices and typically heat up slower than other
SMT components. It is recommended that the customer
review data sheets in order to customize the solder reflow
profile for each application board assembly.

The following instructions must be observed when SMT
soldering these units. Failure to observe these instructions
may result in the failure of or cause damage to the modules,
and can adversely affect long-term reliability.

There are several types of SMT reflow technologies currently
used in the industry. These surface mount power modules
can be reliably soldered using natural forced convection, IR
(radiant infrared), or a combination of convection/IR. The
recommended linear reflow profile using Sn/Pb solder is
shown in Figure 20 and 21. For reliable soldering the solder
reflow profile should be established by accurately measuring
the module’s pin connector temperatures.

300

250

200

150

10 0

REFLOW TEMP (C)

50

0

Pe ak Temp 235oC

Heat zo ne

oCs-1

max 4

Soak zone
30-240s

Pr eheat zone

oCs-1

max 4

REFLOW TIME (S)

T
205

lim

Co oling
zo ne
1- 4

above

o

C

oCs-1

Figure 20. Recommended Reflow Profile for Sn/Pb solder.

240

235

230

225

220

215

210

MAX TEMP SOLDER (C)

205

200

0 10 2030405060

TIME LIMIT (S)

Figure 21. Time Limit, T

, Curve Above 205oC Reflow .

lim

Lead Free Soldering

The –Z version SMT modules of the KHHD004A2B series are
lead-free (Pb-free) and RoHS compliant and are compatible in a
Pb-free soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to the
modules and can adversely affect long-term reliability.

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Surface Mount Information (continued)

Pb-free Reflow Profile

Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic

Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow profile
based on the volume and thickness of the package (table 4-2).
The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure 22.

300

Per J-STD-020 Rev. C

250

200

150

100

Reflow Temp (°C)

50

Heating Zone
1°C/Second

Peak Temp 260°C

* Min. Time Above 235°C
15 Seconds

*Time Above 217°C

60 Seconds

Cooling
Zone

0

Figure 22. Recommended linear reflow profile using

Reflow Time (Seconds)

Sn/Ag/Cu solder.

MSL Rating

The KHHD004A2B series SMT modules have a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages is
detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and
Use of Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are required for
MSL ratings of 2 or greater. These sealed packages should not
be broken until time of use. Once the original package is
broken, the floor life of the product at conditions of  30°C and
60% relative humidity varies according to the MSL rating (see
J-STD-033A). The shelf life for dry packed SMT packages will be
a minimum of 12 months from the bag seal date, when stored
at the following conditions: < 40° C, < 90% relative humidity.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished circuit
board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 11

G

K

A

M

D

T

E

4

n

e

O

f

-

+

a

V

o

s

m

e

©

0

0

e

t

E

a

h

y

t

t

n

v

e

o

Data Sh

et

HHD00

1

8-75Vdc I

echanica

imensions ar
olerances: x.x
x.xx

Top

View

Side

View

A2B H

put; 12.0

l Outline f

in millimeter

mm  0.5 mm

mm  0.25 m

mmerh

dc, 4.2A, 5

r KHHD0

and [inches].

[x.xx in.  0.02

[x.xxx in  0.

ad™ S

0W Outpu

4A2B Surf

in.] (Unless ot

10 in.]

ries; DC

ce-Moun

erwise indica

-DC Co

Module

ed)

verter P

ower M

dules

Bottom

View

PIN FUNCTI

1 V
2 On/Of
3 V
4 V
5 Sense
6 Trim
7 Sense
8 Vo

pril 1, 2013

IN(+)

IN(-)

o(-)

(

)

(

)

(+)

N

2012 General

lectric Compan

. All rights reser

ed.

Page 12

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Mechanical Outline for KHHD004A2B Through Hole Module

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Top

View

Side

View

* Optional PIN Lengths shown In Device Option Table

Bottom View

PIN FUNCTION

1 VIN(+)
2 On/Off
3 VIN(-)
4 Vo(-)
5 Sense(-)
6 Trim
7 Sense(+)
8 Vo(+)

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 13

G

K

A

R

D

T

E

4

n

n

e

a

V

a

s

m

F

e

©

S

0

0

e

t

E

o

h

u

p

u

y

h

t

0

m

n

v

l

a

h

e

o

1

Data Sh

et

HHD00

1

8-75Vdc I

ecomme

imensions ar
olerances: x.x
x.xx

A2B H

put; 12.0

ded Pad L

in millimeter

mm  0.5 mm

mm  0.25 m

mmerh

dc, 4.2A, 5

yout for

and [inches].

[x.xx in.  0.02

[x.xxx in  0.

ad™ S

0W Outpu

urface M

in.] (Unless ot

10 in.]

ries; DC

unt and T

erwise indica

-DC Co

rough Ho

ed)

verter P

e Module

ower M

dules

Surfa

ce Mount Pad

Layout

Thro

gh-Hole Pad

or .025 x .03

For .062 d

rectangular

iameter pin,

in, use a .05

se a .076 dia

Layout

diameter pl

eter plated t

ted through

hrough hole.

ole

pril 1, 2013

2012 General

lectric Compan

. All rights reser

ed.

Page

4

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Packaging Details

The KHHD004A2B series SMT versions are supplied in tape & reel as standard. Details of tape dimensions are shown below.
Modules are shipped in quantities of 140 modules per reel.

Tape Dimensions

Dimensions are in millimeters

.

Reel Dimensions

Outside Diameter: 330mm
Inside Diameter: 178mm
Tape Width: 56mm

Tray Dimensions

The KHHD004A2B - series Through Hole versions are supplied in trays as standard. Details of tray dimensions are shown
below. Modules are shipped in quantities of 75 modules per box.
Dimensions are in millimeters.
Tolerances: x.x mm  0.5 mm (unless otherwise indicated)
x.xx mm  0.25 mm

Material PET (1mm)

Max surface

resistivity

Color Clear

Capacity 25power modules

Min order

quantity

April 1, 2013 ©2012 General Electric Company. All rights reserved. Page 15

9

-1011/PET

10

75pcs (1 box of 3 full

trays + 1 empty top

tray)

GE

Data Sheet

KHHD004A2B Hammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 12.0Vdc, 4.2A, 50W Output

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product codes Input Voltage

KHHD004A2B41Z 24V/48V (18-75Vdc) 4.2A 12.0V Negative Through hole CC109173035
KHHD004A2B41-SRZ 24V/48V (18-75Vdc) 4.2A 12.0V Negative Surface mount CC109173043

Table 2. Device Options

Output

Current

Output

Voltage

Remote On/Off

Logic

Connector

Type

Comcodes

Contact Us

For more information, call us at

USA/Canada:

[phone], or [phone]

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

India:
+91.80.28411633

April 1, 2013 ©2012 General Electric Company. All rights reserved. Version 1.01

www.ge.com/powerelectronics