GE Industrial Solutions KBVW006A0B User Manual

GE

Data Sheet

KBVW006A0B Series (Sixteenth-Brick) DC-DC Converter Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

BARRACUDA* SERIES

RoHS Compliant

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Over current/Over temperature/Over voltage protections

(Auto-restart) (preferred)

 Surface Mount version (-S)

 Heat Plate version (-H)

 For additional options, see Table 2 (Device Options) under

“Ordering Information” section.

Features

 Wide input voltage range: 36-75 Vdc

 Monotonic startup into prebiased load

 Output Voltage adjust: 80% to 110% of V

 Remote sense

 Constant switching frequency

 Positive remote On/Off logic

 Input under/over voltage protection

 Output overcurrent and overvoltage protection

 Over-temperature protection

 Industry standard, DOSA compliant footprint

33.0 mm x 22.9 mm x 9.3 mm

(1.30 x 0.90 x 0.366 in)

 Low profile height and reduced component skyline

 High efficiency: 91.0%

 Wide operating temperature range (-40°C to 85°C)

 Compliant to RoHS EU Directive 2002/95/EC (-Z versions)

 Compliant to ROHS EU Directive 2002/95/EC with lead

solder exemption (non-Z versions)

 Compliant to IPC-9592A (May 2010), Category 2, Class II

#

 UL

60950-1, 2nd Ed. Recognized, CSA† C22.2 No.

60950-1-07 Certified, and VDE

‡

(EN60950-1, 2nd Ed.)

Licensed

 CE mark meets 2006/95/EC directive

 Meets the voltage and current requirements for ETSI

300-132-2 and complies with and licensed for Basic
insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3

PoE standards

**

 ISO

9001 and ISO 14001 certified manufacturing

facilities

o,nom

§

¤

Description

The KBVW006A0B, Sixteenth-brick low-height power module is an isolated dc-dc converters that can deliver up to 6A of output
current and provide a precisely regulated output voltage of 12.0V over a wide range of input voltages (V
modules achieve typical full load efficiency of 91%. The open frame modules construction, available in both surface-mount and
through-hole packaging, enable designers to develop cost and space efficient solutions.

*

Trademark of General Electric Company

# UL is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standards Associ ation.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V .

§

This product is intended for integration into end-user eq uipment. All of the required procedures of end-use equipm ent should be followed.
¤ IEEE and 802 are registered trademarks of the Instit ute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International O rganization of Standards

July 9, 2013 ©2012 General Electric Company. All rights reserved.

IN

= 36 - 75Vdc). The

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

(see Thermal Considerations section)

Storage Temperature All T

I/O Isolation voltage (100% factory Hi-Pot tested) All

IN

IN,trans

A

stg

 

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 36 48 75 Vdc

Maximum Input Current

(VIN= V

Input No Load Current

(VIN = 48V, IO = 0, module enabled)

Input Stand-by Current All

(VIN = 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

IN, min

to V

IN, max

, IO=I

O, max

)

All I

All I

IN,max

IN,No load

8 10 mA

I

IN,stand-by

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-55 125 °C

2250 Vdc

2.8 Adc

45 mA

Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
See Test configuration section)

Input Ripple Rejection (120Hz) All 50 dB

IN, min

to V

IN, max, IO

= I

;

Omax

All 30 mA

p-p

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part
of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a
maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy
and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet
for further information.

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 2

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN= 48V IO=I

, TA=25°C) All V

O, max

O, set

Output Voltage

(Over all operating input voltage, resistive load, and

All V

O

temperature conditions until end of life)

Output Regulation

Line (VIN=V
Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

O, max

ref=TA, min

) All

IN, max

)

to T

) All

A, max

All

Output Ripple and Noise

(Co=1uF,ceramic+10uF,tantalum,VIN=V

to T

T

A=TA, min

A, max

)

IN, min

to V

IN, max

, IO= I

O, max

,

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance1 All C

Output Current All I
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, max

I

O, lim

O, s/c

o

Efficiency

VIN=48V, TA=25°C, IO=I

Switching Frequency All f

O, max , VO

= V

All η 91.0 %

O,set

sw

Dynamic Load Response

(Co=1uF,ceramic+10uF,tantalum,dIo/dt=0.1A/s; VIN = 48V;
T

=25°C)

A

Load Change from Io= 50% to 75% or 25% to 50% of I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

1. See Note 2 under Feature Specifications.

All t

pk

s

11.67 12.0 12.25 V

11.64

 


 




0

0





40

120




12.36 V

±0.2 % V
±0.2 % V
±1.0




2,000 μF

6 Adc

105 120 140

2.5 A

% V

mV

mV

% I

dc

dc

O, set

O, set

O, set

pk-pk

rms

rms

o

350 kHz




360

200




mV

s

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso

iso



10

 

1000

 



2250 Vdc

pF

MΩ

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 3:
Method

I Case 3 (I

=80%I

O

, TA=40°C, airflow = 200 lfm, 90%

O, max

confidence)

All FIT 89.8 10

All MTBF 11,133,281 Hours

Weight (Open Frame) All 13 (0.46) g (oz.)

Weight (with Heatplate) All 21 (0.74) g (oz)

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 3

9

/Hours

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On

Turn-On Delay1 and Rise Times

(IO=I

Case 1: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (T
instant at which On/Off signal is ON until V

IN, min

to V

; open collector or equivalent,

IN, max

terminal)

IN-

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum leakage current All I

O, max , VIN=VIN, nom, TA

= 25oC)

= 10% of V

O

delay

= from

).

O, set

All T

on/off

on/off

on/off

on/off

delay

 

-0.7

2.4




 

— 20 — msec

0.15 mA

0.6 Vdc

15 Vdc

25 μA

Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (T

= V

instant at which V

IN

IN, min

until Vo=10% of V

delay

from

O,set

)

Output voltage Rise time (time for Vo to rise from 10%
of V

to 90% of V

o,set

o, set

)

Output voltage overshoot – Startup
IO= I

O, max

; VIN=V

IN, min

to V

, TA = 25 oC

IN, max

Prebiased Output Load Performance:

Output Start up characteristic

Back Bias current drawn from output (Module Enabled) All -50

Back Bias current drawn from output (Module Disabled) All -50

Remote Sense Range All V

All T

All T

All

— — 150 msec

delay

rise

— 5 12 msec

— 3 % V

All Monotonic

mA
mA

10 % V

SENSE

Output Voltage Adjustment Range All 80 110 % V

Output Overvoltage Protection

Overtemperature Protection – Hiccup Auto Restart All T

Input Undervoltage Lockout All V

Turn-on Threshold

Turn-off Threshold

Hysteresis 1 2

1. The module has an adaptable extended Turn-On Delay interval, T
the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2)
toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, T
module restarts with input voltage removed from the module for the preceding 1 second.

2. The module requires a minimum of 220
OVP maximum limits during startup into open loop fault conditions.

All V

O, limit

ref

UVLO

13.8





135

16.5 Vdc





27.5 30

32 34.5 V




, of 25mS. The extended T

delay

will occur when the module restarts following either: 1)

delay

, will occur whenever a

delay

μF external output capacitor to prevent shutdown during no load to full load transients and to avoid exceeding the

O

Vdc

Vdc

O, set

O, set

O, set

C

dc

dc

dc

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 4

OUTPUT CURRENT

OUTPUT VOLTAGE

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Characteristic Curves

The following figures provide typical characteristics for the module at 25oC. The figures are identical for either positive or negative
remote On/Off logic.

(V) (200mV/div)

O

EFFICIENCY,  (%)

OUTPUT CURRENT, IO (A) TIME, t (200µs/div)

Figure 1. Converter Efficiency versus Output Current.

Io(A) (2A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

Figure 4. Transient Response to 0.1A/µS Dynamic Load Change
from 50% to 75% to 50% of full load, Vin=48V.

(V) (50mV/div)

O

V

OUTPUT VOLTAGE

TIME, t (2s/div)

Figure 2. Typical output ripple and noise (I

(V) (200mV/div)

O

Io(A) (2A/div) V

TIME, t (200µs/div) TIME, t (20ms/div)

o

= I

o,max

).

Figure 3. Transient Response to 0.1A/µS Dynamic Load
Change from 25% to 50% to 25% of full load, Vin=48V.

(V) (5V/div)

On/Off

(V) (5V/div) V

O

OUTPUT VOLTAGE On/Off VOLTAGE

V

TIME, t (5ms/div)

Figure 5. Typical Start-up Using Remote On/Off, negative logic
version shown (V

IN

= 48V, Io = I

o,max

).

(V) (20V/div)

IN

(V) (5V/div) V

O

OUTPUT VOLTAGE INPUT VOLTAGE

V

Figure 6. Typical Start-up Using Input Voltage (VIN = 48V, I
I

o,max

).

o

=

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 5

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Test Configurations

SCOP E

Vout+

Vout-

33-10 0μF

CURRENT PROBE

RESISTIVE
LOAD

R

V

O

R

x 100 %

Vin+

Vin-

contactRdistribution

R

contactRdistribution

LOAD

TO OSCILLO SCOPE

L

TEST

12μH

CS 220μF

BATTERY

NOTE: M easure inpu t reflect ed ripple cur rent with a simulated

E.S .R.< 0.1 

@ 20° C 100kHz

source inductance (L
possible battery impedance. Measure current as shown
abov e.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

COPPER STRIP

V O (+)

V O ( – )

NOTE: A ll voltage measurements to be taken a t the mod ule

1uF

10uF

GROUND PLANE

termin als, a s sho wn above. If so ckets are use d then
Kelvi n conn ections are requ ired at the mo dule termin als
to av oid meas urement error s due to s ocket contact
resistance.

Figure 8. Output Ripple and Noise Test Setup.

R

R

contact

distribution

R

R

contact

distribution

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.

Vin+

V

IN

Vin-

Figure 9. Output Voltage and Efficiency Test Setup.

. I

V

O

Efficiency

=



VIN. I

O

IN

Design Considerations

Input Filtering

The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power module.
For the test configuration in Figure 7 a 33-100μF
electrolytic capacitor (ESR<0.7 at 100kHz), mounted
close to the power module helps ensure the stability of
the unit. Consult the factory for further application
guidelines.

Safety Considerations

For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.
UL60950-1, CSA C22.2 No.60950-1, and VDE0805­1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 V

), for the module’s output to be considered as

75V

dc

meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages,
including the ac mains.

 One V

pin and one V

IN

both the input and output pins are to be kept
floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the

whole system (combination of supply source and
subject module), as required by the safety agencies,
to verify that under a single fault, hazardous
voltages do not appear at the module’s output.

Note: Do not ground either of the input pins of the

module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.

The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.

All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the UL60950
A.2 for reduced thickness.

For input voltages exceeding 60 V
equal to 75 V

, these converters have been evaluated to

dc

the applicable requirements of BASIC INSULATION
between secondary DC MAINS DISTRIBUTION input
(classified as TNV-2 in Europe) and unearthed SELV
outputs.

The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded input
lead.

Feature Description

Remote On/Off

Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the

Data Sheet

and less than or equal to

dc

pin are to be grounded, or

OUT

but less than or

dc

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 6

E

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the module
off during a logic high and on during a logic low.

SUPPLY

I

I

CONTACT

RESISTANCE

Figure 11. Circuit Configuration for remote sense .

.

UV/ON

UV/OFF

I

on/off

V

Vin+

ON/OFF

on/off

Vin-

Vout+

TRIM

Vout-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to control
the voltage (V

(-) terminal (see Figure 10). Logic low is -

V

IN

0.75V ≤ V

) between the ON/OFF terminal and the

on/off

≤ 0.6V. The maximum I

on/off

on/off

during a logic
low is 0.15mA; the switch should maintain a logic low
level whilst sinking this current.

During a logic high, the typical maximum V

on/off

generated by the module is 3.9V, and the maximum
allowable leakage current at V

= 2.4V is 25μA.

on/off

If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V

(-).

IN

Remote Sense

Remote sense minimizes the effects of distribution losses
by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:

(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

[V

O

Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim. The amount of power delivered by the
module is defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the
module remains at or below the maximum rated power
(Maximum rated power = Vo,set x Io,max).

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will
only begin to operate once the input voltage is raised
above the undervoltage lockout turn-on threshold,
V

Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn­off threshold, V

Overtemperature Protection

To provide protection under certain fault conditions, the
unit is equipped with a thermal shutdown circuit. The
unit will shutdown if the thermal reference point Tref
(Figure 13), exceeds 125
shutdown is not intended as a guarantee that the unit
will survive temperatures beyond its rating. The module
can be restarted by cycling the dc input power for at
least one second or by toggling the remote on/off signal
for at least one second. If the auto-restart option (4) is
ordered, the module will automatically restart upon cool­down to a safe temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the latching
protection feature. If the auto-restart option (4) is
ordered, the module will automatically restart upon an
internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power for at least one
second or by toggling the remote on/off signal for at
least one second.
If the unit is configured with the auto-restart option (4), it
will remain in the hiccup mode as long as the
overcurrent condition exists; it operates normally, once
the output current is brought back into its specified
range. The average output current during hiccup is 10%

.

I

O, max

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 7

SENSE(+)

SENSE(–)

I(+)

V

VO(+)

I(-)

V

O(–)

V

DISTRIBUTION LOSS

IO

.

o

C (typical), but the thermal

LOAD

CONTACT AND



GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Pre-Bias Startup

The module starts up monotonically into pre-biased load
from 0.0Vdc up to V

- 0.6Vdc.

out

Output Reverse Current with Pre-Bias Output
Voltage

The module does not sink appreciable current (current
flow into the module) that can compromise the reliability
of the product. This condition is valid for either during
startup or shutdown over the output pre-bias voltage
range of 0.0Vdc up to V

-0.6Vdc. The test conditions for

out

startup or shutdown are applicable for application and
removal of input voltage, V

or by enabling and disabling

in

the module via remote On/Off.

Output Voltage Programming

Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the V

VIN(+)

ON/OFF

VIN(-)

(+) pin or the VO(-) pin.

O

VO(+)

VOTRIM

VO(-)

R

trim-up

R

trim-down

LOAD

Figure 12. Circuit Configuration to Trim Output
Voltage.

Connecting an external resistor (R
TRIM pin and the V
output voltage set point. To maintain set point accuracy,
the trim resistor tolerance should be ±1.0%.

The following equation determines the required external
resistor value to obtain a percentage output voltage
change of ∆%

Where

For example, to trim-down the output voltage of the
module by 8% to 11.04V, Rtrim-down is calculated as
follows:

) between the

(-) (or Sense(-)) pin decreases the

O

R













downtrim



VV

,

V

,

seto

trim-down

511






%



desiredseto








100%






8% 



22.10




output voltage set point. The following equation
determines the required external resistor value to obtain
a percentage output voltage change of ∆%:

R

Where





uptrim






,seto








V



V

For example, to trim-up the output voltage of the module
by 5% to 12.6V, R





R



uptrim




is calculated is as follows:

trim-up

R

The voltage between the V
not exceed the minimum output overvoltage protection
value shown in the Feature Specifications table. This limit
includes any increase in voltage due to remote-sense
compensation and output voltage set-point adjustment
trim.

Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the remote
sense or the trim. The amount of power delivered by the
module is defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can be
increased, which at the same output current would
increase the power output of the module. Care should be
taken to ensure that the maximum output power of the
module remains at or below the maximum rated power
(Maximum rated power = V

Thermal Considerations

The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.

The thermal reference point, T
specifications for open frame modules is shown in Figure

13. For reliable operation this temperature should not
exceed 125

o

C.

Data Sheet



%)100(11.5

511







%225.1

VV



,

setodesired

,

seto





5225.1

uptrim

(+) and VO(–) terminals must

O

x I

O,set

ref,






100%






5% 

511

)5100(0.1211.5

5

8.938

).

O,max

used in the

%







22.10








22.10




511

R





downtrim



8



R

downtrim

Connecting an external resistor (R
TRIM pin and the V

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 8

(+) (or Sense (+)) pin increases the

O



22.10






trim-up

655.53

) between the



GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

(A)

O

Figure 13. T
for Open frame Module.

The thermal reference point, T
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature should
not exceed 110

Temperature Measurement Location

ref

used in the

ref,

o

C.

OUTPUT CURRENT, I

AMBIENT TEMEPERATURE, TA (oC)

Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.

(A)

O

Data Sheet

Figure 14. T
for Module with Heatplate.

Temperature Measurement Location

ref

Heat Transfer via Convection

Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
for natural convection and up to 2m/s (400 LFM) forced
airflow are shown in Figures 15 & 16a.

Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board­Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.

A

)

OUTPUT CURRENT, I

Figure 16a. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.

AMBIENT TEMEPERATURE, TA (oC)

Heat Sink Attachment

The heatplate used on the module does not have tapped
holes for heat sink attachment. A heat sink can be
attached using adhesives made for this purpose. When
curing these types of adhesives, do not exceed the
maximum storage temperature of 125

o

C.

Heat Transfer via Conduction

Modules with heat plate option (-H) can also be used in
cold wall applications for heat transfer via conduction
cooling. Fig 16b shows the derating curve for this
application.

(A)

O

OUTPUT CURRENT, I

COLDPLATE TEMEPERATURE, TA (oC)

Figure 16b. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 9

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Surface Mount Information

Pick and Place

The modules use an open frame construction and are
designed for a fully automated assembly process. The
modules are fitted with a label designed to provide a
large surface area for pick and place operations. The
label meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300
also carries product information such as product code,
serial number and the location of manufacture.

o

C. The label

Figure 17. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by
using open frame construction. Even so, these modules
have a relatively large mass when compared to
conventional SMT components. Variables such as nozzle
size, tip style, vacuum pressure and placement speed
should be considered to optimize this process. The
minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component
spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.

Tin Lead Soldering

The power modules are lead free modules and can be
soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions
must be observed when soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
Fig 18). Typically, the eutectic solder melts at 183
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse the
plating on the connection to ensure a reliable solder
joint. There are several types of SMT reflow technologies
currently used in the industry. These surface mount
power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a combination

o

C (see

o

C,

of convection/IR. For reliable soldering the solder reflow
profile should be established by accurately measuring
the modules CP connector temperatures.

300

250

200

15 0

10 0

REFLOW TEMP (C)

50

0

P eak Temp 235oC

Heat zone
max 4

Preheat zone
max 4

Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process

240

235

230

225

220

215

210

MAX TEMP SOLDER (C)

205

200

0 10 203040 5060

Figure 19. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process

Lead Free Soldering

The –Z version of the modules are lead-free (Pb-free) and
RoHS compliant and are both forward and backward
compatible in a Pb-free and a SnPb soldering process.
Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.

Pb-free Reflow Profile

Power Modules (with the exception of modules that
come with heat plate option –H) will comply with J-STD­020 Rev. C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air­convection reflow profile based on the volume and
thickness of the package (Table 4-2). The suggested Pb­free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using Sn/Ag/Cu solder is shown in
Figure 21.

Data Sheet

oCs-1

Soak zone
30-240s

oCs-1

REFLOW TIME (S)

T
205

lim

Cooling
zo ne
1- 4

above

o

C

oCs-1

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 10

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Peak Tem p. 240 -245°C

Ramp dow n

max. 4°C/S ec

217°C

200°C

150°C

Figure 20. Recommended linear reflow profile using
Sn/Ag/Cu solder.

Through-Hole Lead-Free Soldering
Information

The RoHS-compliant, Z option, through-hole products
use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS­compliant components. They are designed to be
processed through single or dual wave soldering
machines. The pins have a RoHS-compliant, pure tin
finish that is compatible with both Pb and Pb-free wave
soldering processes. A maximum preheat rate of 3C/s is
suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is
270C max.

Reflow Lead-Free Soldering Information

The RoHS-compliant through-hole products (with the
exception of modules that come with heat plate option –
H) can be processed with the following paste-through­hole Pb or Pb-free reflow process.

Max. sustain temperature:
245C (J-STD-020C Table 4-2: Packaging
Thickness>=2.5
Peak temperature over 245C is not suggested due to
the potential reliability risk of components under
continuous high-temperature.
Min. sustain duration above 217C: 90 seconds
Min. sustain duration above 180C: 150 seconds
Max. heat up rate: 3C/sec
Max. cool down rate: 4C/sec
In compliance with JEDEC J-STD-020C spec for 2 times
reflow requirement.

mm

/ Volume > 2000

Pb-free Reflow Profile

BMP module (with the exception of modules that come
with heat plate option –H) will comply with J-STD-020
Rev. C (Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification
procedures. BMP will comply with JEDEC J-STD-020C
specification for 3 times reflow requirement. The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The
recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Figure 21.

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 11

mm

3

),

Figure 21. Recommended linear reflow profile using
Sn/Ag/Cu solder.

MSL Rating

The modules have a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture Barrier Bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of  30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.

Post Solder Cleaning and Drying
Considerations

Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001)

Temp

25°C

Ramp up

max. 3°C/S ec

Preheat t ime
100- 150 Sec.

Time

Time Lim ited 90 Sec.

above 217°C

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

EMC Considerations

The circuit and plots in Figure 22 show a suggested configuration to meet the conducted emission limits of EN55022 Class
B.

Note: Customer is ultimately responsible for the proper layout, component selection, rating and verification of the suggeted
parts based on end application.

Reference Description MPN

C1 X7R 2.2uf 100V 1210 SIZE C1210X225K101TX

C2 100uF 100V UPW2A101MPD

C3 2pcs 15nF 1500V in parallel C1210X153K152TX

C4 2pcs 15nF 1500V in parallel C1210X153K152TX

C5 1000pF 50V GRM155R71H102KA01D

C6 10uF 25V TAJD106K025ESA

C7 2pcs 15nF 1500V in parallel C1210X153K152TX

C8 2pcs 15nF 1500V in parallel C1210X153K152TX

C9 X7R 2.2uf 100V 1210 SIZE C1210X225K101TX

C10 X7R 2.2uf 100V 1210 SIZE C1210X225K101TX

Filter Two stage EMI filter FLT007A0

Without Filter With Filter

Figure 22. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 12

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Data Sheet

PIN FUNCTION

1 V
2 On/Off
3 V
4 V
5 Sense
6 Trim
7 Sense
8 Vo

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 13

IN(+)

IN(-)

o(-)

(-)

(+)

(+)

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Mechanical Outline for Surface Mount Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Data Sheet

PIN FUNCTION

1 V
2 On/Off
3 V
4 V
5 Sense
6 Trim
7 Sense
8 Vo

IN(+)

IN(-)

o(-)

(-)

(+)

(+)

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 14

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Data Sheet

PIN FUNCTION

1 V
2 On/Off
3 V
4 V
5 Sense
6 Trim
7 Sense
8 Vo

IN(+)

IN(-)

o(-)

(-)

(+)

(+)

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 15

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Data Sheet

PIN FUNCTION

1 V
2 On/Off
3 V
4 V
5 Sense
6 Trim
7 Sense
8 Vo

IN(+)

IN(-)

o(-)

(-)

(+)

(+)

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 16

GE

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Recommended Pad Layout

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)

8 Vo(+)

Data Sheet

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 17

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Packaging Details:

The SMT modules are supplied in tape & reel as standard. Details of tape dimensions are shown below. Modules are
shipped in quantities of 140 modules per reel.

Tape Dimensions

Dimensions are in millimeters.

Surface Mount Module Tape & Reel Package

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 18

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Packaging Details (continued):

The packaging details of the Through-Hole modules and modules with heat plate are shown below.

Tape Dimensions

Dimensions are in millimeters.

Package Tray for Through-Hole Modules

Package Tray for Modules with Heat Plate

July 9, 2013 ©2012 General Electric Company. All rights reserved. Page 19

GE

Data Sheet

KBVW006A0B Series Sixteenth-Brick Power Modules

36–75Vdc Input; 12.0Vdc Output; 6A Output Current

Ordering Information

Please contact your Lineage Power Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

KBVW006A0B41Z

KBVW006A0B641Z

KBVW006A0B841Z

KBVW006A0B41-HZ

KBVW006A0B41-SRZ

Table 2. Device Coding Scheme and Options

48V (36-75Vdc) 12.0V 6A Negative Through hole

48V (36-75Vdc) 12.0V 6A Negative Through hole

48V (36-75Vdc) 12.0V 6A Negative Through hole

48V (36-75Vdc) 12.0V

48V (36-75Vdc) 12.0V

Output

Voltage

Output

Current

6A

6A

On/Off Logic

Negative Through hole

Negative Surface mount

Connector

Type

Comcodes

CC109170544

150024448

150024014

150021662

150021663

Contact Us

For more information, call us at

USA/Canada:

[phone], or +1 972 244

9288

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

India:
+91.80.28411633

July 9, 2013 ©2012 General Electric Company. All rights reserved. Version 1.6

www.ge.com/powerelectronics