GE Industrial Solutions EHHD024A0A User Manual

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Page 1

Datasheet

EHHD024A0A HAMMERHEAD* Series; DC-DC Converter Power Modules

18-75Vdc Input; 5Vdc, 24A, 120W Output

RoHS Compliant

Applications

 Distributed Power Architectures

 Wireless Networks

 Enterprise Networks including Power over Ethernet (PoE)

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Over current/Over temperature/Over voltage protections

(Auto-restart) (preferred)

 1/8

Brick Heat plate for 1/8th heatsinks

 1/4th Brick heat plate with unthreaded inserts

 Surface Mount version (-S)

Features

 Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)

 Compliant to REACH Directive (EC) No 1907/2006

 Flat and high efficiency curve  Industry standard, DOSA compliant footprint

58.4mm x 22.8mm x 8.9mm (2.30 in x 0.9 in x 0.35 in)

 Ultra wide input voltage range: 18-75 V  Tightly regulated output  Remote sense  Output Voltage adjust: 90% to 110% of V  Constant switching frequency  Positive remote On/Off logic  Output overcurrent and overvoltage protection  Overtemperature protection  Wide operating temperature range (-40°C to 85°C)  Suitable for cold wall cooling using suitable Gap Pad applied

directly to top side of module

 ANSI/UL

60950-1-2011 and CAN/CSA† C22.2 No. 60950-107, Second Edition + A1:2011 (MOD), dated March 19, 2011; and DIN EN 60950-1 (VDE‡ 0805 Teil 1):2011-01; EN 609501:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE 0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 609501(ed.2);am1:2009

 CE mark meets 2006/95/EC directive  Meets the voltage and current requirements for ETSI 300-

132-2 and complies with and licensed for Basic insulation rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3

standards

 ISO

9001 and ISO 14001 certified manufacturing facilities

O,nom

PoE

Description

The EHHD024A0A [HAMMERHEAD*] Series, eighth-brick, low-height power modules are isolated dc-dc converters which provide a single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75V nominal output voltage rated for 24A

output current. The module incorporates GE’s vast heritage for reliability and quality, while

also using the latest in technology, and component and process standardization to achieve highly competitive cost. The open frame module construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 91% at V features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick or quarter-brickheat sink attachment to achieve higher output current in high temperature applications.

Trademark of General Electric Corporation.

UL is a registered trademark of Underwriters Laboratories, Inc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards

. The EHHD024A0A provides 5Vdc

=24Vdc and VIN=48Vdc. Standard

Page 2

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

Maximum Heat Plate Operating Temperature -18H, H T

(see Thermal Considerations section)

Storage Temperature All T

Altitude* All

I/O Isolation voltage (100% factory Hi-Pot tested) All

IN,trans

stg

⎯ ⎯

* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 18 24/48 75 Vdc

Maximum Input Current

(VIN= V

Input No Load Current

VIN = 24Vdc, (IO = 0, module enabled)

VIN = 48V, (IO = 0, module enabled)

Input Stand-by Current All

(VIN = 24 to 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

IN, min

to V

IN, max

, VO= V

O, set

, IO=I

O, max

)

All I

IN,No load

IN,stand-by

5 11 mA

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-40 105 °C

-55 125 °C

4000 m

2250 Vdc

7.3 7.8 Adc

120

Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12μH source impedance; V See Test configuration section)

Input Ripple Rejection (120Hz) All 60 dB

IN, min

to V

IN, max, IO

= I

Omax

;

All 30 mA

p-p

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 15 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.

Page 3

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Electrical Specifications (continued)

Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA = 25°C conditions.

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN= 24V to 48V IO=I

O, max

, TA=25°C)

All V

O, set

Output Voltage

(Over all operating input voltage, resistive load, and temperature

All V

conditions until end of life)

Adjustment Range (*Vin > 20V) All V Selected by external resistor

O, adj

Output Regulation

Line (VIN=V

Load (IO=I

Temperature (T Output Ripple and Noise on nominal output

Measured with 10uF Tantalum||1uF ceramic

(VIN=24 to 48, IO=80% I

IN, min

O, min

to V

to I

ref=TA, min

) All

O, max

IN, max

)

to T

) All

A, max

All

, TA=25)

O, max

RMS (5Hz to 20MHz bandwidth) All 30 mV

Peak-to-Peak (5Hz to 20MHz bandwidth) All 100 mV

External Capacitance All C

Output Current All I

Output Current Limit Inception (Hiccup Mode ) (VO= 90% of V Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

) 5

O, set

All I

O, max

O, lim

O, s/c

Efficiency

VIN=24V, TA=25°C, IO=24A, VO = 5V All η 92 %

VIN=48V, TA=25°C, IO=24A, VO = 5V All η 91.5 %

Switching Frequency All f

Dynamic Load Response

(dIo/dt=0.1A/μs; VIN = 24V or 48V; TA=25°C; CO>100μF)

Load Change from Io= 50% to 75% or 25% to 50% of I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

All t

4.93 5 5.07 V

-3.0

⎯

+3.0 % V

-10 +10* % V

⎯ ⎯ ⎯ ⎯ ⎯ ⎯

⎯

±0.2 % V ±0.2 % V ±1.5

10,000 μF

% V

O, set

rms

pk-pk

0 24 Adc

26.5 29 Adc

1.2 A

rms

280 kHz

⎯

800

⎯

% V

μs

O, set

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso

⎯

⎯ ⎯

1000

⎯ ⎯

⎯

MΩ

2250 Vdc

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (I

=80%I

, TA=40°C, airflow = 200 lfm, 90% confidence)

O, max

All FIT 112.7

All MTBF 8,869,389 Hours

Weight (Open Frame) All 23(0.8) g (oz.)

Weight (with Heatplate) All 37(1.3) g (oz.)

/Hour

Page 4

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V

Signal referenced to V

Negative Logic: device code suffix “1”

Logic Low = module On, Logic High = module Off

Positive Logic: No device code suffix required

Logic Low = module Off, Logic High = module On

Turn-On Delay and Rise Times

(IO=I

Case 1: Input power is applied for at least 1 second,

Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T instant at which V

Output voltage Rise time (time for Vo to rise from 10% of V

Output voltage overshoot – Startup IO= I Remote Sense Range All V

Output Overvoltage Protection

Overtemperature Protection – Hiccup Auto Restart

Input Undervoltage Lockout All V

– Module complies with 7Vmax with Trim Pin short to Sense+, with and without external cap. For Open Loop condition max OVP was 7.3V with min. 220µF external cap

to V

IN, min

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

O, max , VIN=VIN, nom, TA

and then the On/Off input is set from OFF to ON

= on/off pin transition until VO = 10% of V

delay

to 90% of V

o,set

; VIN=V

O, max

Turn-on Threshold

Turn-off Threshold

; open collector or equivalent,

IN, max

terminal)

IN-

on/off

⎯

-0.7

2.5 5 6.7 Vdc

⎯ ⎯

0.15 mA

⎯

0.6 Vdc

20 μA

= 25oC)

IN, min

o, set

to V

)

O, set

from

= V

IN, min

until Vo=10% of V

delay

O,set

)

, TA = 25 oC

IN, max

All T

All

All V

Open

frame

Heat

Plate

All T

— 35 — msec

delay

— 35 - msec

delay

rise

SENSE

O, limit

ref

UVLO

— 20 msec

— 3 % V

10 % V

5.9

⎯

7.0 Vdc

135 OC

120 OC

⎯

17.5 V

15 15.5 Vdc

O, set

Hysteresis 1 2 Vdc

Input Overvoltage Lockout All V Turn-on Threshold 76 79

Turn-off Threshold

Hysteresis 1 2

OVLO

Vdc

⎯

81 Vdc

⎯

Page 5

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Characteristic Curves

The following figures provide typical characteristics for the EHHD024A0A (5V, 24A) at 25 OC. The figures are identical for either positive or negative remote On/Off logic.

Vin=18V

EFFICIENCY, η (%)

0 4 8 12 16 20 24

Vin=24V

Vin=36V

OUTPUT CURRENT, IO (A) TIME, t (200µs/div)

Figure 1. Converter Efficiency versus Output Current.

Vin=48V

Vin=75V

(V) (200mV/div)

Io(A) (5A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

Figure 4. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V.

48Vin

(V) (50mV/div)

OUTPUT VOLTAGE

TIME, t (2μs/div)

= I

o,max

Figure 2. Typical output ripple and noise (I

(V) (200mV/div)

Io(A) (5A/div) V

OUTPUT CURRENT OUTPUT VOLTAGE

TIME, t (200µs/div) TIME, t (10ms/div)

). Figure 5. Typical Start-up Using Remote On/Off, negative logic

Figure 3. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=24V

(V) (5V/div)

On/Off

(V) (2V/div) V

OUTPUT VOLTAGE On/Off VOLTAGE

version shown (V

= 48V, Io = I

TIME, t (10ms/div)

o,max

(V) (20V/div)

(V) (2V/div) V

OUTPUT VOLTAGE INPUT VOLTAGE

Figure 6. Typical Start-up Using Input Voltage (VIN = 48V, Io=

o,max

Page 6

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Test Configurations

Vout+

Vout-

33-10 0μF

CURRENT PROBE

RESISTIVE LOAD

contact Rdistribution

x 100 %

Vin +

Vin-

LOAD

TO OSCILLOSCOPE

TEST

12μH

CS 220μF

BAT TERY

NOTE: M easure inpu t reflected ri pple current wi th a simula ted

E.S .R.< 0.1 Ω

@ 20 °C 10 0kHz

source inductance (L possi ble batt ery impedance . Measure cur rent as s hown abov e.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

COPPER STRIP

V O (+)

SCOP E

V O ( – )

NOTE: A ll volt age mea surements to be t aken at the mod ule

1uF

10uF

GRO UND PLANE

termin als, a s sho wn abov e. If sockets ar e used then Kelvi n conn ections are requ ired at the mo dule termin als to av oid me asureme nt errors due to sock et conta ct resistance.

Figure 8. Output Ripple and Noise Test Setup.

contact

distribution

contact

distribution

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.

Vin+

Vin-

Figure 9. Output Voltage and Efficiency Test Setup.

. I

Efficiency

VIN. I

Design Considerations

Input Filtering

The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 100μF electrolytic capacitor (ESR<0.7Ω at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE08051(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including the ac mains.

 One V

 The input pins of the module are not operator

 Another SELV reliability test is conducted on the whole

Note: Do not ground either of the input pins of the module

The power module has extra-low voltage (ELV) outputs when all inputs are ELV.

All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum 15 A fast-acting fuse in the ungrounded lead.

pin and one V

both the input and output pins are to be kept floating.

accessible.

system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output.

without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground.

Datasheet

pin are to be grounded, or

OUT

Page 7

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Feature Descriptions

Remote On/Off

Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low.

Vin+

on/off

ON/OFF

Vin-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage

) between the ON/OFF terminal and the VIN(-) terminal

on/off

(see Figure 10). Logic low is 0V ≤ V

during a logic low is 0.15mA; the switch should

on/off

maintain a logic low level whilst sinking this current. During a logic high, the typical maximum V

by the module is 5V, and the maximum allowable leakage current at V

= 5V is 1μA.

on/off

If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to V

Remote Sense

Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table:

(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V

Vout+

TRIM

Vout-

≤ 0.6V. The maximum

generated

on/off

(-).

The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).

SUPPLY

CONTACT

RESISTANCE

Figure 11. Circuit Configuration for remote sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, V

Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V

UV/OFF

Overtemperature Protection

To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point, Tref, exceeds 120°

and 124

C (Figure 13, typical) or 105 OC (Figure 14, typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart upon cool-down to a safe temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second.

Datasheet

SENSE(+)

SENSE(–)

I(+)

VO(+)

I(-)

O(–)

DISTRIBUTION LOSS

LOAD

CONTACT AND

UV/ON

Page 8

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Feature Descriptions (continued)

If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% I

Output Voltage Programming

Trimming allows the output voltage set point to be increased or decreased from the default value; this is accomplished by connecting an external resistor between the TRIM pin and either the V

VIN(+)

ON/OFF

VIN(-)

VO(+)

VOTRIM

VO(-)

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (R pin and the V

(-) (or Sense(-)) pin decreases the output

voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.

The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%

−

downtrim

0.5

Where



% ×

=Δ

 

For example, to trim-down the output voltage of the module by 6% to 4.7V, Rtrim-down is calculated as follows:

−

downtrim

Connecting an external resistor (R pin and the V voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%:

Where

(+) (or Sense (+)) pin increases the output



−

uptrim

 



desired

% ×

=Δ

 

(+) pin or the VO(-) pin.

511







−



desired



0.5



511



−=





downtrim

Δ+××

Δ×

%225.1

0.5

−



100



0.5



O, max

trim-up

trim-down

) between the TRIM

trim-down



−

22.10

ΚΩ

22.10

 

100

6% =Δ



ΚΩ

 

ΚΩ=−9.74

) between the TRIM

trim-up

511

%)100(0.511.5

−

− Δ

LOAD



ΚΩ

22.10

 

For example, to trim-up the output voltage of the module by 4% to 5.2V, R

−

uptrim

is calculated is as follows:

trim-up



 

The voltage between the V exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = V

O,max

Thermal Considerations

The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.

Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability.

The thermal data presented here is based on physical measurements taken in a wind tunnel, using automated thermo-couple instrumentation to monitor key component temperatures: FETs, diodes, control ICs, magnetic cores, ceramic capacitors, opto-isolators, and module pwb conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, the module output power is increased, until one (or more) of the components reaches its maximum derated operating temperature, as defined in IPC-9592. This procedure is then repeated for a different airflow or ambient temperature until a family of module output derating curves is obtained.

Datasheet

4% =Δ

+××

511

)4100(0.511.5

4225.1

uptrim

(+) and VO(–) terminals must not

ΚΩ=−3.404



−−

ΚΩ

22.10

 

O,set

Page 9

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Thermal Considerations (continued)

The thermal reference points, T specifications for open frame modules are shown in Figure

13. For reliable operation these temperatures should not exceed 120

C and 124 OC

& T

ref1,

ref

, used in the

ref2

maximum output current that can be delivered by each module versus local ambient temperature (T for natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figures 15 - 21.

Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures.

(A)

OUTPUT CURRENT, I

25 35 45 55 65 75 85

100LFM (0.5m/s)

AMBIENT TEMEPERATURE, TA (oC)

Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from V V

(+); VIN =48V, VO=5V.

out

Datasheet

200LFM

(1.0m/s)

400LFM (2.0m/s)

600LFM (3.0m/s)

)

(-) to

out

ref

AIRFLOW

Figure 13. T Open Frame Module.

Temperature Measurement Locations for

ref

The thermal reference point, T

used in the specifications

ref,

for modules with heatplate is shown in Figure 14. For reliable operation this temperature should not exceed 105

Figure 14. T Module with Heat plate.

Temperature Measurement Location for

ref

Heat Transfer via Convection

Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the

(A)

OUTPUT CURRENT, I

25 35 45 55 65 75 85

100LFM (0.5m/s)

200LFM (1.0m/s)

400LFM

(2.0m/s)

AMBIENT TEMEPERATURE, TA (oC)

Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from V

(+);VIN =48V, VO=5V.

to V

out

(-)

Page 10

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Thermal Considerations (continued)

(A)

OUTPUT CURRENT, I

25 35 45 55 65 75 85

Figure 17. Output Current Derating for the Module with

-18H Heatplate; Airflow in the Transverse Direction from V

(-) to V

out

(A)

OUTPUT CURRENT, I

(+);VIN =48V, VO=5V

out

100LFM (0.5m/s)

200LFM (1.0m/s)

400LFM

(2.0m/s)

AMBIENT TEMEPERATURE, TA (oC)

100LFM (0.5m/s)

200LFM (1.0m/s)

400LFM (2.0m/s)

(A)

OUTPUT CURRENT, I

25 35 45 55 65 75 85

AMBIENT TEMEPERATURE, TA (oC)

Figure 20. Output Current Derating for the Module with

-18 Heatplate; Airflow in the Transverse Direction from V

out

(-) to V

(+);VIN =24V, VO=5V.

out

Heat Transfer via Conduction

The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 22. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 21.

Datasheet

100LFM (0.5m/s)

200LFM (1.0m/s)

400LFM (2.0m/s)

25 35 45 55 65 75 85

AMBIENT TEMEPERATURE, T

(oC)

Figure 18. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from V

(+); VIN =24V, VO=5V.

out

(A)

OUTPUT CURRENT, I

25 35 45 55 65 75 85

100LFM

(0.5m/s)

200LFM (1.0m/s)

400LFM (2.0m/s)

AMBIENT TEMEPERATURE, TA (oC)

out

(-) to

Figure 19. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from V

(+);VIN =24V, VO=5V.

to V

out

(-)

Figure 21. Cold Wall Mounting

(A)

OUTPUT CURRENT, I

20 30 40 50 60 70 80 90

COLDPLATE TEMEPERATURE, TC (oC)

Figure 22. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; V

=24V or 48V.

Page 11

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Through-Hole Soldering Information

Lead-Free Soldering

The EHHD024A0A xx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHScompliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3°C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210°C. For Pb solder, the recommended pot temperature is 260°C, while the Pb-free solder pot is 270°C max.

Paste-in-Hole Soldering

The EHHD024A0A xx module is compatible with reflow paste-in-hole soldering processes shown in Figures 24-26. Since the EHHD024A0A xxZ module is not packaged per JSTD-033 Rev.A, the module must be baked prior to the paste-in-hole reflow process. EHHD024A0A xx-HZ modules are not compatible with paste-in-hole reflow soldering. Please contact your GE Sales Representative for further information.

Surface Mount Information

MSL Rating

The EHHD024A0A -SZ module has a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are provided for the EHHD024A0Axx-SZ modules. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages is a minimum of 12 months from the bag seal date, when stored at the following

conditions: < 40° C, < 90% relative humidity

Pick and Place

The EHHD024A0A modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 also carries product information such as product code, serial number and the location of manufacture.

C. The label

Figure 23. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.

Tin Lead Soldering

The EHHD024A0A power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliablesolder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.

Lead Free Soldering

The –Z version of the EHHD024A0A modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.

Datasheet

Page 12

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

300

250

200

15 0

10 0

REFLOW TEMP (°C)

Peak Temp 235oC

Heat zone

oCs-1

max 4

Soak zone 30-240s

Preheat zone

oCs-1

max 4

REFLOW TIME (S)

T 205

lim

Cooling zo ne 1- 4

above

oCs-1

Figure 24. Reflow Profile for Tin/Lead (Sn/Pb) process.

240

235

230

225

220

215

210

MAX TEMP SOLDER (°C)

205

200

0 10 2030405060

Figure 25. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process

Pb-free Reflow Profile

Power Systems will comply with J-STD-015 Rev. D (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard

provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 26.

300

Per J-STD-0 20 Rev. D

250

Reflow Temp (°C)

200

150

Heating Zone

1°C/Second

100

Peak Temp 260° C

Figure 26. Recommended linear reflow profile using Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001).

Datasheet

* Min. Time Above 235°C

15 Seconds

*Time Above 2 17°C

60 Seconds

Reflow Time (Seconds)

Cooling

Zone

Page 13

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

EMC Considerations

The circuit and plots in Figure 27 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

FLT012A0 FILTER

Figure 27. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT012A0 data sheet (DS05-028).

EHHD024

VIN = 48V, Io = Io,max, L Line VIN = 48V, Io = Io,max, N Line

Page 14

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] *Top side label includes GE name, product designation and date code.

Top

View

Datasheet

Side

View

Bottom

View*

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

VI-

SENSE-

ON/OFF

VI+

TRIM

SENSE+

VO-

VO+

Page 15

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.] * Top side label includes GE name, product designation and date code.

Top

View

Side

View

Datasheet

ottom

View*

VI-

ON/OFF

VI+

VO-

SENSE-

TRIM

SENSE+

VO+

Page 16

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

Top

View

Side

View

Datasheet

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

Bottom

View*

VI-

ON/OFF

VI+

*Bottom side label includes product designation and date code.

VO-

SENSE-

TRIM

SENSE+

VO+

**Side

View

**Side label contains product designation and date code.

Page 17

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Mechanical Outline for Through-Hole Module with ¼ Brick Heat Plate (-18H Option)

Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

Top

View

Side

View

Bottom

View*

**Side

View

*For optional pin lengths, see Table 2, Device Coding Scheme and Options

VI-

ON/OFF

VI+

VO-

SENSE-

TRIM

SENSE+

VO+

**Side label contains product designation and date code.

Page 18

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Recommended Pad Layout

Dimensions are in millimeters and [inches]. Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated) x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]

58.4[2.30]

47.2[1.86]

39.0[1.54]

26.1[1.03]

17.9[.70]

5.4[.22]

Pin Function

1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)

22.8 [.90]

[.300]

7.62

3.8

[.15]

11.7

[.46]

3.8[.15]

KEEP

OUT

AREAS

50.80[2.000]

Datasheet

3.81

[.150]

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+)

8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE

0.050” PLATED THROUGH HOLE DIAMETER

FOR 0.62 DIA” PIN, USE

0.076” PLATED THROUGH HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

22.8 [.90]

7.62

[.300]

5.4[.22]

3.8

[.15]

17.9[.70]

26.1[1.03]

11.7 [.46]

3.8[.15]

47.2[1.86]

39.0[1.54]

50.80[2.000]

58.4[2.30]

KEEP

OUT

AREAS

3.81

[.150]

Page 19

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Packaging Details

The surface mount versions of the EHHD024A0A (suffix –S) are supplied as standard in the plastic trays shown in Figure

30.

Tray Specification

Material Antistatic coated PVC Max surface resistivity 10 Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays + 1

Ω/sq

empty top tray)

Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the EHHD024A0A (suffix –S) surface mount module will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules.

Datasheet

Figure 28. Surface Mount Packaging Tray

Page 20

Datasheet

EHHD024A0A Series: DC-DC Converter Power Module

18 to 75Vdc Input; 5Vdc, 24A, 120W Output

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

Output

Voltage

EHHD024A0A 41Z 24/48V (18-75Vdc) 5V 24A Negative Through hole 150029828 EHHD024A0A 41-HZ 24/48V (18-75Vdc) 5V 24A Negative Through hole 150029827 EHHD024A0A 41-18HZ 24/48V (18-75Vdc) 5V 24A Negative Through hole 150029830 EHHD024A0A 41-SZ 24/48V (18-75Vdc) 5V 24A Negative Surface mount 150029829

Table 2. Device Coding Scheme and Options

Characteristic Definition

Form Factor E Family Designator HH Input Voltage D Output Current 024A0

RatingsOptions

Output Voltage A

Pin Length

Action following Protective Shutdown

On/Off Logic

Customer Specific XY

Mechanical Features

RoHS

Character and Position

6 8

Output

Current

= 1 /8th Brick

E HH

= UltraWide Range, 18V-75V

D 024A0

=5V Nominal

A Omit

= Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)

= Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)

= Auto-restart following shutdow n (Overcurrent/ Overvoltage)

Must be ordered

Omit

= Negative Logic

Omit

= 1/8th Brick size heat plate, for use with heat sinks (not available

with -S option)

18H

coldwall applications (not available with -S option)

= Surface Mount connections

S Omit

ZZ = RoHS 6/6 Compliant, Lead free

On/Off Logic

= Hammerhead™ Series

= 024.0 Amps Maximum Output Current

= Default Pin Length shown in Mechanical Outline Figures

= Positive Logic

= Customer Specific Modified Code, Omit for Standard Code

= Standard open Frame Module

= 1/4th Brick size heat plate with unthreaded inserts for use in

= RoHS 5/6, Lead Based Solder Used

Connector

Type

Comcodes

For more information, call us at

USA/Canada:

+1 888 546 3243, or +1 972 244 9288

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

India: +91.80.28411633

www.gecriticalpower.com

GE Industrial Solutions EHHD024A0A User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual