GE Industrial Solutions EHHD020A0F User Manual

GE

Data Sheet

EHHD020A0FHammerhead™ Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

RoHS Compliant

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Over current/Over temperature/Over voltage protections

(Auto-restart) (preferred)

 Heat plate versions (-H)

 Surface Mount version (-S)

Features

 Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)
 Compliant to REACH Directive (EC) No 1907/2006
 Flat and high efficiency curve
 Industry standard, DOSA compliant footprint

57.9mm x 22.8mm x 7.6mm
(2.28 in x 0.9 in x 0.30 in)

 Low profile height and reduced component skyline
 Ultra wide input voltage range: 18-75 V
 Tightly regulated output
 Remote sense
 Output Voltage adjust: 80% to 110% of V
 Constant switching frequency
 Positive remote On/Off logic
 Input under/over voltage protection
 Output overcurrent and overvoltage protection
 Overtemperature protection
 No reverse current during output shutdown
 Wide operating temperature range (-40°C to 85°C)
 Suitable for cold wall cooling using suitable Gap Pad applied

directly to top side of module

 ANSI/UL*60950-1-2011 and CAN/CSA† C22.2 No. 60950-1-

07, Second Edition + A1:2011 (MOD), dated March 19, 2011;
and DIN EN 60950-1 (VDE‡ 0805 Teil 1):2011-01; EN 60950­1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE
0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950­1(ed.2);am1:2009

 CE mark meets 2006/95/EC directive
 Meets the voltage and current requirements for ETSI 300-

132-2 and complies with and licensed for Basic insulation
rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3

standards

**

 ISO

9001 and ISO 14001 certified manufacturing facilities

dc

O,nom

§

¤

PoE

Description

The EHHD020A0F [Hammerhead™] Series, eighth-brick, low-height power modules are isolated dc-dc converters
that provide a single, precisely regulated output voltage over an ultra wide input voltage range of 18-75V
EHHD020A0F provides 3.3V
for reliability and quality, while also using the latest in technology, and component and process standardization to achieve highly
competitive cost. The open frame module construction, available in both surface-mount and through-hole packaging, enable
designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 91% at

=24Vdc or at VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage,

V

IN

overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink
attachment to achieve higher output current in high temperature applications.

* UL is a registere d trademark of Underwr iters Labor atories, I nc.

†

CSA is a registered trademark of Canadian Standards Association.

‡

VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

§

This product is intended for integration into end-user e quipment . All of the required procedures of end-us e equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the Internat ional Organization of Standards

nominal output voltage rated for 20Adc output current. The module incorporates GE’s vast heritage

dc

. The

dc

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 1

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

Maximum Heat Plate Operating Temperature -18H, H T

(see Thermal Considerations section)

Storage Temperature All T

Altitude* All

I/O Isolation voltage (100% factory Hi-Pot tested) All

IN

IN,trans

A

C

stg

 

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-40 110 °C

-55 125 °C

4000 m

2250 Vdc

* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 18 24/48 75 Vdc

Maximum Input Current

(VIN= V

Input No Load Current

(VIN = 48V, IO = 0, module enabled)

Input Stand-by Current All

(VIN = 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

IN, min

to V

IN, max

, VO= V

O, set

, IO=I

O, max

)

All I

All I

I

IN,stand-by

IN

IN,No load

4.4 5.0 Adc

70 mA

5 8 mA

Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
Test configuration section)

Input Ripple Rejection (120Hz) All 50 dB

IN, min

to V

IN, max, IO

= I

Omax

; See

All 30 mA

p-p

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part
of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a
maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy
and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet
for further information.

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 2

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN= 24V to 48V IO=I

O, max

, TA=25°C)

All V

O, set

Output Voltage

(Over all operating input voltage, resistive load, and temperature

All V

O

conditions until end of life)

Output Regulation

Line (VIN=V
Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

O, max

ref=TA, min

) All

IN, max

)

to T

) All

A, max

All

Output Ripple and Noise

(VIN=V

IN, min

to V

IN, max

, IO= I

O, max

, TA=T

A, min

to T

)

A, max

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance All C

Output Current All I

Output Current Limit Inception (Hiccup Mode )
(VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, max

I

O, lim

O, s/c

O

Efficiency

VIN=24V, TA=25°C, IO=10A, VO = 3.3V All η 91.0 %

VIN=24V, TA=25°C, IO=20A, VO = 3.3V All η 91.0 %

VIN=48V, TA=25°C, IO=10A, VO = 3.3V All η 89.5 %

VIN=48V, TA=25°C, IO=20A, VO = 3.3V All η 91.0 %

Switching Frequency All f

sw

Dynamic Load Response

(dIo/dt=0.1A/s; VIN = 24V or 48V; TA=25°C; CO>100μF)

Load Change from Io= 50% to 75% or 25% to 50% of I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

All t

pk

s

3.24 3.30 3.36 V

3.20

 

 




0





10 30 mV

35 100 mV


3.40 V

±0.2 % V
±0.2 % V
±1.0

5,000 μF

% V

dc

dc

O, set

O, set

O, set

rms

pk-pk

0 20 Adc

21 24 26 Adc

5 A

rms

300 kHz




5

200




% V

s

O, set

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso

iso



100

 

1000

 



2250 Vdc

pF

MΩ

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I
Case 3 (I

Weight (Open Frame) All 19 (0.7) g (oz.)

Weight (with Heatplate) All 30 (1.1) g (oz.)

=80%I

O

, TA=40°C, airflow = 200 lfm, 90% confidence)

O, max

9

All FIT 317.3 10

All MTBF 3,151,604 Hours

/Hours

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 3

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On

Turn-On Delay and Rise Times

(IO=I

Case 1: Input power is applied for at least 1 second,

Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied
(T

Output voltage Rise time (time for Vo to rise from 10%
of V

Output voltage overshoot – Startup
IO= I
Remote Sense Range All V

Output Voltage Adjustment Range All 80 110 % V

Output Overvoltage Protection

Overtemperature Protection – Hiccup Auto Restart

Heat Plate

Input Undervoltage Lockout All V

to V

IN, min

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

O, max , VIN=VIN, nom, TA

and then the On/Off input is set from OFF to ON

(T

= on/off pin transition until VO = 10% of V

delay

= VIN reaches V

delay

to 90% of V

o,set

; VIN=V

O, max

Turn-on Threshold

Turn-off Threshold

; open collector or equivalent,

IN, max

terminal)

IN-

on/off

on/off

on/off

on/off

 

-0.7

2.5

 




0.15 mA

0.6 Vdc

6.7 Vdc

25 μA

= 25oC)

— 20 — msec

delay

— 20 150 msec

delay

rise

SENSE

O, limit

T

ref

T

ref

UVLO

— 18 25 msec

— 3 % V

10 % V

3.8



4.3 Vdc

135 OC

120 OC



17 18 V

14 15 16 Vdc

O, set

O, set

O, set

dc

IN, min

)

O, set

All T

All T

until Vo=10% of V

IN, min

)

o, set

to V

, TA = 25oC

IN, max

O,set

)

All T

All

All V

Open

frame

Heat

Plate

Hysteresis 1 2 Vdc

Input Overvoltage Lockout All V

Turn-on Threshold 76 79

Turn-off Threshold

Hysteresis 1 2

OVLO

Vdc

Vdc





81 83 Vdc



April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 4

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Characteristic Curves

The following figures provide typical characteristics for the EHHD020A0F (3.3V, 20A) at 25oC. The figures are identical for either
positive or negative remote On/Off logic.

Io(A) (5A/div)

EFFICIENCY,  (%)

OUTPUT CURRENT, IO (A) TIME, t (200µs/div)

Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load

(V) (100mV/div)

O

OUTPUT VOLTAGE OUTPUT CURRENT

V

Change from 50% to 75% to 50% of full load, Vin=48V,

>100μF.

C

O

(V) (50mV/div)

O

V

OUTPUT VOLTAGE

TIME, t (2s/div)

Figure 2. Typical output ripple and noise (I

(V) (100mV/div) Io(A) (5A/div)

O

V

OUTPUT VOLTAGE OUTPUT CURRENT

TIME, t (200µs/div) TIME, t (10ms/div)

o = Io,max).

Figure 3. Transient Response to 0.1A/µS Dynamic Load Change
from 50% to 75% to 50% of full load, Vin=24V, C

>100μF.

O

(V) (2V/div)

On/Off

(V) (1V/div) V

O

OUTPUT VOLTAGE On/Off VOLTAGE

V

TIME, t (10ms/div)

Figure 5. Typical Start-up Using Remote On/Off, negative
logic version shown (V

(V) (10V/div)

IN

(V) (1V/div) V

O

OUTPUT VOLTAGE INPUT VOLTAGE

V

Figure 6. Typical Start-up Using Input Voltage (V

IN = 24V or 48V, Io = Io,max).

IN

= 24V, Io

= Io,max).

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 5

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Test Configurations

Vout+

Vout-

33-10 0μF

V

CURRENT PR OBE

RESISTIVE
LOA D

R

contact Rdistribution

O

R

contact Rdistribution

x 100 %

Vin +

Vin-

R

LOAD

TO OSCILL OSCOPE

L

TEST

12μH

CS 220μF

BATTERY

NOTE: M easure i nput r eflected ri pple curr ent with a simula ted

E.S .R.<0 .1

@ 20° C 100kHz

source i nductance (L
possible battery impedance. Measure current as shown
abov e.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

COPPER STRIP

V O (+)

SCOP E

V O ( – )

NOTE: A ll voltage measurements to be take n at the module

1uF

10uF

GRO UND PL ANE

termin als, as sho wn above. If sockets are used th en
Kelvi n conn ections are requ ired at the mo dule termin als
to av oid me asurement err ors due to socket conta ct
resistance.

Figure 8. Output Ripple and Noise Test Setup.

R

R

contact

distribution

R

R

contact

distribution

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then
Kelvin connections are require d at the module terminals
to avoid measurement errors du e to socket contact
resistance.

Vin+

V

IN

Vin-

Figure 9. Output Voltage and Efficiency Test Setup.

V

. I

O

Efficiency

=



VIN. I

O

IN

Design Considerations

Input Filtering

The power module should be connected to a low
ac-impedance source. Highly inductive source impedance
can affect the stability of the power module. For the test
configuration in Figure 7 a 33-100μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the
power module is used, the power module must be installed
in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.
UL60950-1, CSA C22.2 No.60950-1, and VDE0805­1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the
requirements for safety extra-low voltage (SELV), all of the
following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including
the ac mains.

 One V

pin and one V

IN

both the input and output pins are to be kept floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the whole

system (combination of supply source and subject
module), as required by the safety agencies, to verify
that under a single fault, hazardous voltages do not
appear at the module’s output.

Note: Do not ground either of the input pins of the module

without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the
output pins and ground.

The power module has extra-low voltage (ELV) outputs when
all inputs are ELV.

All flammable materials used in the manufacturing of these
modules are rated 94V-0, or tested to the UL60950 A.2 for
reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal
to –75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as
TNV-2 in Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum
10 A fast-acting fuse in the ungrounded lead.

pin are to be grounded, or

OUT

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 6

GE

E

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Feature Descriptions

Remote On/Off

Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the ON/OFF
pin, and off during a logic low. Negative logic remote On/Off,
device code suffix “1”, turns the module off during a logic
high and on during a logic low.

Vin+

I

on/off

V

on/off

ON/OFF

Vin-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage

) between the ON/OFF terminal and the VIN(-) terminal

(V

on/off

(see Figure 10). Logic low is 0V ≤ V

during a logic low is 0.15mA; the switch should

I

on/off

on/off

maintain a logic low level whilst sinking this current.
During a logic high, the typical maximum V

by the module is 6.7V, and the maximum allowable leakage
current at V

= 2.5V is 25μA.

on/off

If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to V

Remote Sense

Remote sense minimizes the effects of distribution losses by
regulating the voltage at the remote-sense connections (See
Figure 11). The voltage between the remote-sense pins and
the output terminals must not exceed the output voltage
sense range given in the Feature Specifications table:

(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

[V

O

Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the trim.

Vout+

TRIM

Vout-

≤ 0.6V. The maximum

generated

on/off

(-).

IN

The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output
voltage of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the maximum
output power of the module remains at or below the
maximum rated power (Maximum rated power = Vo,set x
Io,max).

SENSE(+)

SENSE(–)

V

I(+)

SUPPLY

I

CONTACT

RESISTANCE

Figure 11. Circuit

I

VO(+)

V

I(-)

Configuration for remote sense.

V

O(–)

IO

LOAD

CONTACT AND

DISTRIBUTION LOSS

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only
begin to operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, V

UV/ON

.

Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, V

UV/OFF

.

Overtemperature Protection

To provide protection under certain fault conditions, the unit
is equipped with a thermal shutdown circuit. The unit will
shutdown if the thermal reference point, Tref, exceeds 135
(Figure 13, typical) or 120

o

C (Figure 14, typical), but the

o

thermal shutdown is not intended as a guarantee that the
unit will survive temperatures beyond its rating. The module
will automatically restart upon cool-down to a safe
temperature.

Output Overvoltage Protection

The output over voltage protection scheme of the modules
has an independent over voltage loop to prevent single
point of failure. This protection feature latches in the event
of over voltage across the output. Cycling the on/off pin or
input voltage resets the latching protection feature. If the
auto-restart option (4) is ordered, the module will
automatically restart upon an internally programmed time
elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition,
the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can be
restarted by cycling the dc input power for at least one
second or by toggling the remote on/off signal for at least
one second.

C

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 7

GE



Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Feature Descriptions (continued)

If the unit is configured with the auto-restart option (4), it will
remain in the hiccup mode as long as the overcurrent
condition exists; it operates normally, once the output
current is brought back into its specified range. The average
output current during hiccup is 10% I

Output Voltage Programming

Trimming allows the output voltage set point to be
increased or decreased from the default value; this is
accomplished by connecting an external resistor between
the TRIM pin and either the V

VIN(+)

ON/OFF

VIN(-)

VO(+)

VOTRIM

VO(-)

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (R
pin and the V

(-) (or Sense(-)) pin decreases the output

O

voltage set point. To maintain set point accuracy, the trim
resistor tolerance should be ±1.0%.

The following equation determines the required external
resistor value to obtain a percentage output voltage change
of ∆%

R



downtrim

3.3

Where



% 






For example, to trim-down the output voltage of the module
by 6% to 3.10V, Rtrim-down is calculated as follows:

R



downtrim

R

Connecting an external resistor (R
pin and the V
voltage set point. The following equation determines the
required external resistor value to obtain a percentage
output voltage change of ∆%:

R

Where

(+) (or Sense (+)) pin increases the output

O







uptrim




V



desired

% 






(+) pin or the VO(-) pin.

O

511











%





VV



desired



3.3

V



511








downtrim

22.10

6





%225.1

3.3





100



3.3



.

O, max

R

trim-up

R

trim-down

) between the TRIM

trim-down





22.10




100

6%








9.74

) between the TRIM

trim-up

511

%)100(3.311.5







%

LOAD





22.10




For example, to trim-up the output voltage of the module by
4% to 3.43V, R

R



uptrim

The voltage between the V

is calculated is as follows:

trim-up










R

uptrim

(+) and VO(–) terminals must not

O

4% 



511

)4100(3.311.5

4225.1

4

9.219







22.10




exceed the minimum output overvoltage protection value
shown in the Feature Specifications table. This limit includes
any increase in voltage due to remote-sense compensation
and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the trim.
The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output
voltage of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the maximum
output power of the module remains at or below the
maximum rated power (Maximum rated power = V

).

I

O,max

O,set

x

Thermal Considerations

The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability.

The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature,
the module output power is increased, until one (or more) of
the components reaches its maximum derated operating
temperature, as defined in IPC-9592. This procedure is then
repeated for a different airflow or ambient temperature until
a family of module output derating curves is obtained.

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 8

G

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OUTPUT CURRENT, I

AMBIENT TEM

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gure 16. Outp

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odule; Airflo

(+); VIN =48

V

ut

(A)

O

OUTPUT CURRENT, I

Fi

gure 17. Outp

H

atplate; Airfl

V

(+);VIN =4

out

ut Current De

in the Transv

.

AMBIENT TEM

ut Current De

w in the Tra
V.

EPERATURE, TA (

rating for the
erse Directio

EPERATURE, TA (

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out

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out

(

)

pril 4, 2013

©2012 Ge

eral Electric Co

pany. All rights

reserved.

Pag

9

GE

,

(

)

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Thermal Considerations (continued)

(A)

O

OUTPUT CURRENT, I

Figure 18. Output Current Derating for the Module with ­18 Heatplate; Airflow in the Transverse Direction from

(-) to V

V

out

AMBIENT TEMEPERATURE, TA (oC)

(+);VIN =48V.

out

A

O

I

OUTPUT CURRENT

(A)

O

OUTPUT CURRENT, I

AMBIENT TEMEPERATURE, TA (oC)

Figure 21. Output Current Derating for the Module with­18 Heatplate; Airflow in the Transverse Direction from
V

out

(-) to V

(+);VIN =24V.

out

Heat Transfer via Conduction

The module can also be used in a sealed environment with
cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 21. This capability is achieved
by insuring the top side component skyline profile achieves
no more than 1mm height difference between the tallest
and the shortest power train part that benefits from contact
with the gap pad material. The output current derating
versus cold wall temperature, when using a gap pad such as
Bergquist GP2500S20, is shown in Figure 22.

Figure 19. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from V

(+); VIN =24V.

V

out

(A)

O

OUTPUT CURRENT, I

Figure 20. Output Current Derating for the Module with
Heatplate; Airflow in the Transverse Direction from V

(+);VIN =24V.

to V

out

AMBIENT TEMEPERATURE, T

AMBIENT TEMEPERATURE, TA (oC)

(oC)

A

out

(-) to

out

(-)

Figure 22. Cold Wall Mounting

(A)

O

OUTPUT CURRENT, I

COLDPLATE TEMEPERATURE, TC (oC)

Figure 23. Derated Output Current versus Cold Wall
Temperature with local ambient temperature around
module at 85C; V

=24V or 48V.

IN

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 10

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Through-Hole Soldering Information

Lead-Free Soldering

The EHHD020A0Fxx RoHS-compliant through-hole products
use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have a
RoHS-compliant finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat rate
of 3C/s is suggested. The wave preheat process should be
such that the temperature of the power module board is
kept below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is 270C
max.

Paste-in-Hole Soldering

The EHHD020A0Fxx module is compatible with reflow paste­in-hole soldering processes shown in Figures 27-29. Since
the EHHD020A0FxxZ module is not packaged per J-STD-033
Rev.A, the module must be baked prior to the paste-in-hole
reflow process. EHHD020A0Fxx-HZ modules are not
compatible with paste-in-hole reflow soldering. Please
contact your GE Sales Representative for further
information.

Surface Mount Information

MSL Rating

The EHHD020A0F-SZ module has a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
provided for the EHHD020A0Fxx-SZ modules. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of  30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages is a minimum of 12 months
from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity

Pick and Place

The EHHD020A0F modules use an open frame construction
and are designed for a fully automated assembly process.
The modules are fitted with a label designed to provide a
large surface area for pick and place operations. The label
meets all the requirements for surface mount processing, as
well as safety standards, and is able to withstand reflow
temperatures of up to 300
information such as product code, serial number and the
location of manufacture.

o

C. The label also carries product

.

Figure 24. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.

Reflow Soldering Information

The surface mountable modules in the EHHD family use our
newest SMT technology called “Column Pin” (CP) connectors.
Figure 25 shows the new CP connector before and after
reflow soldering onto the end-board assembly. The CP is
constructed from a solid copper pin with an integral solder
ball attached, which is composed of tin/lead (Sn/Pb) solder
for non-Z codes, or Sn/Ag

Figure 25. Column Pin Connector Before and After Reflow

Soldering .

The CP connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable SMT
solder joint. Typically, the eutectic solder melts at 183
(Sn/Pb solder) or 217-218
subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of SMT
reflow technologies currently used in the industry. These
surface mount power modules can be reliably soldered
using natural forced convection, IR (radiant infrared), or a
combination of convection/IR. The following instructions
must be observed when SMT soldering these units. Failure to
observe these instructions may result in the failure of or
cause damage to the modules, and can adversely affect
long-term reliability.

/Cu (SAC) solder for –Z codes.

3

EHHD Board

Insulator

Solder Ball

o

C (SAC solder), wets the land, and

End assembly PCB

o

C

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 11

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Surface Mount Information (continued)

Tin Lead Soldering

The EHHD020A0F power modules are lead free modules and
can be soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is recommended
that the customer review data sheets in order to customize
the solder reflow profile for each application board
assembly. The following instructions must be observed
when soldering these units. Failure to observe these
instructions may result in the failure of or cause damage to
the modules, and can adversely affect long-term reliability.

In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
Typically, the eutectic solder melts at 183
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These surface
mount power modules can be reliably soldered using
natural forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.

Lead Free Soldering

The –Z version of the EHHD020A0F modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.

300

250

200

Peak Temp 235oC

Heat zone

oCs-1

max 4

o

C.

o

C, wets the land,

Cooling
zo ne

oCs-1

1- 4

240

235

230

225

220

215

210

MAX TEMP SOLDER (C)

205

200

0 10 203040 5060

Figure 27. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process.

Pb-free Reflow Profile

Power Systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.

300

Per J-STD-020 Rev. C

250

200

150

Heating Zone
1°C/Second

100

Reflow Temp (°C)

50

Peak Temp 260°C

* Min. Time Above 235°C
15 Seconds

*Time Above 217°C

60 Se conds

Cooling
Zone

15 0

10 0

REFLOW TEMP (C)

50

0

Soak zone
30-240s

Preheat zone

oCs-1

max 4

REFLOW TIME (S)

T

lim

205

above

o

C

Figure 26. Reflow Profile for Tin/Lead (Sn/Pb)
process.

0

Figure 28. Recommended linear reflow profile using

Reflow Time (Seconds)

Sn/Ag/Cu solder.

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 12

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

EMC Considerations

The circuit and plots in Figure 29 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

Figure 29. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

VIN = 48V, Io = I

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 13

o,max

, L Line

VIN = 48V, Io = I

, N Line

o,max

GE

Data Sheet

EHHD020A0F Hammerhead™

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
*Top side label includes GE name, product designation and date code.

Series; DC-DC Converter Power Modules

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 14

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
* Top side label includes GE name, product designation and date code.

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 15

GE

Data Sheet

EHHD020A0F Hammerhead™

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Series; DC-DC Converter Power Modules

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 16

GE

Data Sheet

EHHD020A0F Hammerhead™

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Mechanical Outline for Through-Hole Module with ¼ Brick Heat Plate (-18H Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)

x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Series; DC-DC Converter Power Modules

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 17

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Recommended Pad Layout

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)

8 Vo(+)
NOTES:
FOR 0.030” X 0.025”
RECTANGULAR PIN, USE

0.050” PLATED THROUGH
HOLE DIAMETER
FOR 0.62 DIA” PIN, USE

0.076” PLATED THROUGH
HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 18

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Packaging Details

The surface mount versions of the EHHD020A0F (suffix –S) are
supplied as standard in the plastic trays shown in Figure 30.

Tray Specification

Material Antistatic coated PVC
Max surface resistivity 10
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays + 1

12

/sq

empty top tray)

Each tray contains a total of 12 power modules. The trays are
self-stacking and each shipping box for the EHHD020A0F
(suffix –S) surface mount module will contain 4 full trays plus
one empty hold down tray giving a total number of 48 power
modules.

Figure 30. Surface Mount Packaging Tray

April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 19

GE

Data Sheet

EHHD020A0F Hammerhead™

Series; DC-DC Converter Power Modules

18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

EHHD020A0F41Z 24/48V (18-75Vdc) 3.3V
EHHD020A0F64Z 24/48V (18-75Vdc) 3.3V
EHHD020A0F641Z 24/48V (18-75Vdc) 3.3V
EHHD020A0F41-HZ 24/48V (18-75Vdc) 3.3V
EHHD020A0F641-HZ 24/48V (18-75Vdc) 3.3V
EHHD020A0F64-18HZ 24/48V (18-75Vdc) 3.3V
EHHD020A0F41-SZ 24/48V (18-75Vdc) 3.3V

Table 2. Device Coding Scheme and Options

Output

Voltage

Output

Current

20A Negative
20A
20A Negative
20A Negative
20A Negative
20A
20A Negative

On/Off

Logic

Positive

Positive

Connector

Type

Through hole CC109161477
Through hole CC109171427
Through hole 150022799
Through hole CC109161964
Through hole 150022798
Through hole CC109171435

Surface mount CC109161972

Comcodes

Contact Us

For more information, call us at

USA/Canada:

[phone], or [phone]

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

India:
+91.80.28411633

April 4, 2013 ©2012 General Electric Company. All rights reserved. Version 1.08

www.ge.com/powerelectronics