GE Industrial Solutions EHHD015A0A User Manual

GE
Data Sheet
EHHD015A0A Hammerhead™ Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Features
Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)
Compliant to REACH Directive (EC) No 1907/2006
Flat and high efficiency curve Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 7.6mm (2.28 in x 0.9 in x 0.30 in)
Low profile height and reduced component skyline Ultra wide input voltage range: 18-75 V
dc
Tightly regulated output Remote sense
RoHS Compliant
Output Voltage adjust: 80% to 110% of V
O,nom
Constant switching frequency
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Industrial Equipment
Positive remote On/Off logic Input under/over voltage protection Output overcurrent and overvoltage protection Overtemperature protection No reverse current during output shutdown Wide operating temperature range (-40°C to 85°C) Suitable for cold wall cooling using suitable Gap Pad applied
directly to top side of module
ANSI/UL*60950-1-2011 and CAN/CSA† C22.2 No. 60950-1-
Options
Negative Remote On/Off logic (preferred)
Over current/Over temperature/Over voltage protections
(Auto-restart) (preferred)
Heat plate versions (-H)
Surface Mount version (-S)
07, Second Edition + A1:2011 (MOD), dated March 19, 2011; and DIN EN 60950-1 (VDE‡ 0805 Teil 1):2011-01; EN 60950­1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE 0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950­1(ed.2);am1:2009
§
CE mark meets 2006/95/EC directive Meets the voltage and current requirements for ETSI 300-
132-2 and complies with and licensed for Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3
standards
**
ISO
9001 and ISO 14001 certified manufacturing facilities
Description
The EHHD015A0A [Hammerhead™] Series, eighth-brick, low-height power modules are isolated dc-dc converters which provide a single, precisely regulated output voltage over an ultra wide input voltage range of 18-75V EHHD015A0A provides 5V
nominal output voltage rated for 15Adc output current. The module incorporates GE’s vast heritage for
dc
reliability and quality, while also using the latest in technology, and component and process standardization to achieve highly competitive cost. The open frame module construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 90% at
=24Vdc and VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage,
V
IN
overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to achieve higher output current in high temperature applications.
* UL is a registered trademark of Underwriters Laboratories, Inc.
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§
This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards
. The
dc
¤
PoE
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 1
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All V
Transient, operational (100 ms) All V
Operating Ambient Temperature All T
Maximum Heat Plate Operating Temperature -18H, H T
(see Thermal Considerations section)
Storage Temperature All T
Altitude* All
I/O Isolation voltage (100% factory Hi-Pot tested) All
IN
IN,trans
A
C
stg
-0.3 80 Vdc
-0.3 100 Vdc
-40 85 °C
-40 105 °C
-55 125 °C
4000 m
2250 Vdc
* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 18 24/48 75 Vdc
Maximum Input Current
(VIN= V
Input No Load Current
(VIN = 48V, IO = 0, module enabled)
Input Stand-by Current All
(VIN = 48V, module disabled)
Inrush Transient All I2t 0.5 A2s
IN, min
to V
IN, max
, VO= V
O, set
, IO=I
O, max
)
All I
All I
IN,No load
I
IN,stand-by
IN
4.4 5.0 Adc
70 mA
5 8 mA
Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V Test configuration section)
Input Ripple Rejection (120Hz) All 50 dB
IN, min
to V
IN, max, IO
= I
Omax
; See
All 30 mA
p-p
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 2
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN= 24V to 48V IO=I
O, max
, TA=25°C)
All V
O, set
Output Voltage
(Over all operating input voltage, resistive load, and temperature
All V
O
conditions until end of life)
Output Regulation
Line (VIN=V Load (IO=I
Temperature (T
IN, min
O, min
to V
to I
O, max
ref=TA, min
) All
IN, max
)
to T
) All
A, max
All
Output Ripple and Noise
(VIN=V
IN, min
to V
IN, max
, IO= I
O, max
, TA=T
A, min
to T
)
A, max
RMS (5Hz to 20MHz bandwidth) All
Peak-to-Peak (5Hz to 20MHz bandwidth) All
External Capacitance All C
Output Current All I
Output Current Limit Inception (Hiccup Mode ) (VO= 90% of V Output Short-Circuit Current
(VO≤250mV) ( Hiccup Mode )
) 5.0
O, set
All I
O, max
O
I
O, lim
O, s/c
Efficiency
VIN=24V, TA=25°C, IO=7.5A, VO = 5.0V All η 90.5 %
VIN=24V, TA=25°C, IO=15A, VO = 5.0V All η 90.5 %
VIN=48V, TA=25°C, IO=7.5A, VO = 5.0V All η 89.0 %
VIN=48V, TA=25°C, IO=15A, VO = 5.0V All η 90.0 %
Switching Frequency All f
sw
Dynamic Load Response
(dIo/dt=0.1A/s; VIN = 24V or 48V; TA=25°C; CO>100μF)
Load Change from Io= 50% to 75% or 25% to 50% of I
o,max
Peak Deviation All V
Settling Time (Vo<10% peak deviation)
All t
pk
s
4.92 5.0 5.08 V
4.85
  
 
0
10 20 mV
35 80 mV
5.15 % V
±0.2 % V ±0.2 % V ±1.0
5,000 μF
% V
dc
O, set
O, set
O, set
O, set
rms
pk-pk
0 15 Adc
16 19 24 Adc
5 A
rms
330 kHz
 
3
200
 
% V
s
O, set
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All C
Isolation Resistance All R
I/O Isolation Voltage (100% factory Hi-pot tested) All All
iso
iso
100
1000
2250 Vdc
pF
M
General Specifications
Parameter Device Symbol Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (I
=80%I
O
, TA=40°C, airflow = 200 lfm, 90% confidence)
O, max
All FIT 339.0
All MTBF 2,949,583 Hours
Weight (Open Frame) All 19 (0.7) g (oz.)
Weight (with Heatplate) All 30 (1.1) g (oz.)
9
10
/Hour
s
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 3
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=V Signal referenced to V Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On
Turn-On Delay and Rise Times
(IO=I
Case 1: Input power is applied for at least 1 second,
Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T instant at which V
Output voltage Rise time (time for Vo to rise from 10% of V
Output voltage overshoot – Startup IO= I Remote Sense Range All V
Output Voltage Adjustment Range All 80 110 % V
Output Overvoltage Protection
Overtemperature Protection – Hiccup Auto Restart
Input Undervoltage Lockout All V
to V
IN, min
Logic Low - Remote On/Off Current All I
Logic Low - On/Off Voltage All V
Logic High Voltage – (Typ = Open Collector) All V
Logic High maximum allowable leakage current All I
O, max , VIN=VIN, nom, TA
and then the On/Off input is set from OFF to ON
= on/off pin transition until VO = 10% of V
(T
delay
to 90% of V
o,set
; VIN=V
O, max
Turn-on Threshold
Turn-off Threshold
; open collector or equivalent,
IN, max
terminal)
IN-
on/off
on/off
on/off
on/off
-0.7
 
0.3 1.0 mA
1.2 Vdc
5 V
10 μA
= 25oC)
— 12 — msec
delay
— — 150 msec
delay
rise
SENSE
O, limit
T
ref
T
ref
UVLO
— 5 12 msec
— 3 % V
10 % V
5.7
6.5 Vdc
135 OC
120 OC
17 18 V
14 15 16 Vdc
IN, min
IN
o, set
to V
)
O, set
from
= V
IN, min
until Vo=10% of V
delay
O,set
)
)
, TA = 25 oC
IN, max
All T
All T
All
All V
Open
frame
Heat
Plate
All T
dc
O, set
O, set
O, set
dc
Hysteresis 1 2 Vdc
Input Overvoltage Lockout All V Turn-on Threshold 76 79
Turn-off Threshold
Hysteresis 1 2
OVLO
Vdc
Vdc
81 83 Vdc
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 4
GE
t
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Characteristic Curves
The following figures provide typical characteristics for the EHHD015A0A (5.0V, 15A) at 25 OC. The figures are identical for either positive or negative remote On/Off logic.
(V) (200mV/div)
O
EFFICIENCY, (%)
OUTPUT CURRENT, IO (A) TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load Change
Io(A) (5A/div) V
OUTPUT CURRENT OUTPUT VOLTAGE
from 50% to 75% to 50% of full load, Vin=48V, C
>100μF.
O
(V) (50mV/div)
O
V
OUTPUT VOLTAGE
TIME, t (2s/div)
Figure 2. Typical output ripple and noise (I
(V) (200mV/div)
O
Io(A) (5A/div) V
OUTPUT CURRENT OUTPUT VOLTAGE
TIME, t (200µs/div) TIME, t (10ms/div)
o = Io,max).
Figure 3. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=24V,
>100μF.
C
O
(V) (5V/div)
On/Off
(V) (2V/div) V
O
OUTPUT VOLTAGE On/Off VOLTAGE
V
TIME, t (10ms/div)
Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (V
(V) (20V/div)
IN
(V) (2V/div) V
O
OUTPUT VOLTAGE INPUT VOLTAGE
V
Figure 6. Typical Star
o,max).
I
IN = 48V, Io = Io,max).
-up Using Input Voltage (VIN = 48V, Io =
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 5
GE
Data Sheet
EHHD015A0A Hammerhead™
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Test Configurations
Vout+
Vout-
33-10 0μF
V
CURRENT PROBE
RESISTIVE
LOAD
R
contact Rdistribution
O
R
contact Rdistribution
x 100 %
Vin +
Vin-
R
LOAD
TO OSCILLOSCOPE
L
TEST
12μH
CS 220μF
BATTERY
NOTE: M easure inpu t reflected ri pple current wi th a simula ted
E.S .R.< 0.1
@ 20 °C 100kH z
sourc e inductanc e (L possi ble batt ery impedan ce. Mea sure curre nt as show n abov e.
) of 12μH. Capacito r CS offsets
TEST
Figure 7. Input Reflected Ripple Current Test Setup.
COPPER STRIP
V O (+)
SCOP E
V O ( – )
NOT E: All v oltage me asurem ents to be taken a t the mod ule
1uF
10uF
GROUND PLANE
termin als, as s hown ab ove. If sockets are used then Kelvin c onnections are requ ired at th e module term inals to av oid me asureme nt errors due to sock et conta ct resistance.
Figure 8. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
Vin+
V
IN
Vin-
Figure 9. Output Voltage and Efficiency Test Setup.
V
. I
O
Efficiency
=
VIN. I
O
IN
Series; DC-DC Converter Power Modules
Design Considerations
Input Filtering
The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE0805­1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including the ac mains.
One V
pin and one V
IN
pin are to be grounded, or
OUT
both the input and output pins are to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground.
The power module has extra-low voltage (ELV) outputs when all inputs are ELV.
All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead.
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 6
GE
E
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Feature Descriptions
Remote On/Off
Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low.
Vin+
I
on/off
V
on/off
ON/OFF
Vin-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage
) between the ON/OFF terminal and the VIN(-) terminal
(V
on/off
(see Figure 10). Logic low is 0V ≤ V
during a logic low is 1mA; the switch should maintain a
I
on/off
on/off
logic low level whilst sinking this current. During a logic high, the typical maximum V
by the module is 5V, and the maximum allowable leakage current at V
= 5V is 1μA.
on/off
If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to V
Remote Sense
Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table:
(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
[V
O
Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim.
Vout+
TRIM
Vout-
1.2V. The maximum
generated
on/off
(-).
IN
The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max).
SENSE(+)
SENSE(–)
V
I(+)
SUPPLY
CONTACT
RESISTANCE
I
I
VO(+)
V
I(-)
V
O(–)
IO
LOAD
CONTACT AND
DISTRIBUTION LOSS
Figure 11. Circuit Configuration for remote sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, V
UV/ON
.
Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V
UV/OFF
.
Overtemperature Protection
To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point, Tref, exceeds 135
O
C (Figure 13, typical) or 120 OC (Figure 14, typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart upon cool-down to a safe temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second.
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 7
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Feature Descriptions (continued)
If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% I
Output Voltage Programming
Trimming allows the output voltage set point to be increased or decreased from the default value; this is accomplished by connecting an external resistor between the TRIM pin and either the V
VIN(+)
ON/OFF
VIN(-)
VO(+)
VOTRIM
VO(-)
Figure 12. Circuit Configuration to Trim Output Voltage.
Connecting an external resistor (R pin and the V
(-) (or Sense(-)) pin decreases the output
O
voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%.
The following equation determines the required external resistor value to obtain a percentage output voltage change of %
R
downtrim
0.5
Where
%
 
For example, to trim-down the output voltage of the module by 6% to 4.7V, Rtrim-down is calculated as follows:
R
downtrim
R
Connecting an external resistor (R pin and the V voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%:
R
Where
(+) (or Sense (+)) pin increases the output
O
uptrim
 
V
desired
%
 
(+) pin or the VO(-) pin.
O
511
%
VV
desired
0.5
V
511
 
downtrim
22.10
6
%225.1
0.5
100
0.5
.
O, max
R
trim-up
R
trim-down
) between the TRIM
trim-down

22.10
 
100
6%

 
9.74
) between the TRIM
trim-up
%)100(0.511.5
511
%
LOAD

22.10
 
For example, to trim-up the output voltage of the module by 4% to 5.2V, R
R
uptrim
The voltage between the V
is calculated is as follows:
trim-up
 
R
uptrim
(+) and VO(–) terminals must not
O
4%
)4100(0.511.5
511
3.404

4
4225.1

22.10
 
exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim.
Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = V
).
I
O,max
O,set
x
Thermal Considerations
The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability.
The thermal data presented here is based on physical measurements taken in a wind tunnel, using automated thermo-couple instrumentation to monitor key component temperatures: FETs, diodes, control ICs, magnetic cores, ceramic capacitors, opto-isolators, and module pwb conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, the module output power is increased, until one (or more) of the components reaches its maximum derated operating temperature, as defined in IPC-9592. This procedure is then repeated for a different airflow or ambient temperature until a family of module output derating curves is obtained.
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 8
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HHD01
8-75Vdc I
hermal C
he thermal re
r open frame
peration thes
5A0A H
put; 5Vdc
nsiderati
erence points, modules is sh
temperature
mmerh
, 15.0A, 75
ns (contin
T
used in th
ref,
wn in Figure
should not e
ad™
Output
ued)
e specificatio
3. For reliabl
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2012 General
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OUTPUT CURRENT, I
Fi
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O
OUTPUT CURRENT, I
Fi
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. All rights reser
AMBIENT TEM
ut Current De in the Transv , VO=5.0V.
AMBIENT TEM
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9
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Thermal Considerations (continued)
(A)
O
OUTPUT CURRENT, I
Figure 18. Output Current Derating for the Module with
-18H Heatplate; Airflow in the Transverse Direction from (-) to V
V
out
(A)
O
OUTPUT CURRENT, I
Figure 19. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from V
(+); VIN =24V, VO=5.0V.
V
out
AMBIENT TEMEPERATURE, TA (oC)
(+);VIN =48V, VO=5.0V
out
AMBIENT TEMEPERATURE, T
(oC)
A
out
(-) to
(A)
O
OUTPUT CURRENT, I
AMBIENT TEMEPERATURE, TA (oC)
Figure 21. Output Current Derating for the Module with
-18 Heatplate; Airflow in the Transverse Direction from V
(-) to V
out
(+);VIN =24V, VO=5.0V.
out
Heat Transfer via Conduction
The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 22. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 23.
(A)
O
OUTPUT CURRENT, I
AMBIENT TEMEPERATURE, TA (oC)
Figure 20. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from V
(+);VIN =24V, VO=5.0V.
to V
out
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 10
out
(-)
Figure 22. Cold Wall Mounting
(A)
O
OUTPUT CURRENT, I
COLDPLATE TEMEPERATURE, TC (oC)
Figure 23. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; V
=24V or 48V.
IN
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Through-Hole Soldering Information
Lead-Free Soldering
The EHHD015A0Axx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max.
Paste-in-Hole Soldering
The EHHD015A0Axx module is compatible with reflow paste-in-hole soldering processes shown in Figures 25-27. Since the EHHD015A0AxxZ module is not packaged per J­STD-033 Rev.A, the module must be baked prior to the paste-in-hole reflow process. EHHD015A0Axx-HZ modules are not compatible with paste-in-hole reflow soldering. Please contact your GE Sales Representative for further information.
Surface Mount Information
MSL Rating
The EHHD015A0A-SZ module has a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling,
Surface Mount Information (continued)
Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are provided for the EHHD015A0Axx-SZ modules. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages is a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity
Pick and Place
The EHHD015A0A modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 information such as product code, serial number and the location of manufacture.
o
C. The label also carries product
.
Figure 24. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available.
Reflow Soldering Information
The surface mountable modules in the EHHD family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 25 shows the new CP connector before and after reflow soldering onto the end-board assembly. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag
Figure 25. Column Pin Connector Before and After Reflow Soldering .
The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183 (Sn/Pb solder) or 217-218 subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
/Cu (SAC) solder for –Z codes.
3
EHHD Board
Insulator
Solder Ball
o
C (SAC solder), wets the land, and
End assembly PCB
o
C
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 11
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Surface Mount Information (continued)
Tin Lead Soldering
The EHHD015A0A power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection to ensure a reliablesolder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
Lead Free Soldering
The –Z version of the EHHD015A0A modules are lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.
300
250
200
15 0
10 0
REFLOW TEMP (C)
50
0
Figure 26. Reflow Profile for Tin/Lead (Sn/Pb) process.
Peak Temp 235oC
Heat zone
oCs-1
max 4
Soak zone 30-240s
Preheat zone
oCs-1
max 4
REFLOW TIME (S)
T
lim
205
Cooling zo ne 1- 4
above
o
C
oCs-1
240
235
230
225
220
215
210
MAX TEMP SOLDER (C)
205
200
0 10 203040 5060
Figure 27. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process
Pb-free Reflow Profile
Power Systems will comply with J-STD-015 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 28.
300
Per J-STD-020 Rev. C
250
200
150
Heating Zone 1°C/Second
100
Reflow Temp (°C)
50
0
Figure 28. Recommended linear reflow profile using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001).
Peak Temp 260°C
* Min. Time Above 235°C 15 Seconds
*Time Above 217°C
60 Se conds
Reflow Time (Seconds)
Cooling Zone
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 12
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
EMC Considerations
The circuit and plots in Figure 29 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.
Figure 29. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
VIN = 48V, Io = Io,max, L Line
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 13
VIN = 48V, Io = Io,max, N Line
GE
Data Sheet
EHHD015A0A Hammerhead™
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] *Top side label includes GE name, product designation and date code.
Series; DC-DC Converter Power Modules
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 14
GE
Data Sheet
EHHD015A0A Hammerhead™
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] * Top side label includes GE name, product designation and date code.
Series; DC-DC Converter Power Modules
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 15
GE
Data Sheet
EHHD015A0A Hammerhead™
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Series; DC-DC Converter Power Modules
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 16
GE
Data Sheet
EHHD015A0A Hammerhead™
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Mechanical Outline for Through-Hole Module with ¼ Brick Heat Plate (-18H Option)
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Series; DC-DC Converter Power Modules
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 17
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Recommended Pad Layout
Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Pin Function
1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin Function
1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+)
8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE
0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE
0.076” PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 18
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Packaging Details
The surface mount versions of the EHHD015A0A (suffix –S) are supplied as standard in the plastic trays shown in Figure 30.
Tray Specification
Material Antistatic coated PVC Max surface resistivity 10 Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays + 1
12
/sq
empty top tray)
Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box for the EHHD015A0A (suffix –S) surface mount module will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules.
Figure 30. Surface Mount Packaging Tray
April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 19
GE
Data Sheet
EHHD015A0A Hammerhead™
Series; DC-DC Converter Power Modules
18-75Vdc Input; 5Vdc, 15.0A, 75W Output
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage
EHHD015A0A41Z 24/48V (18-75Vdc) 5.0V EHHD015A0A641Z 24/48V (18-75Vdc) 5.0V EHHD015A0A41-HZ 24/48V (18-75Vdc) 5.0V EHHD015A0A64Z 24/48V (18-75Vdc) 5.0V EHHD015A0A64-18HZ 24/48V (18-75Vdc) 5.0V EHHD015A0A41-SZ 24/48V (18-75Vdc) 5.0V
Table 2. Device Coding Scheme and Options
Output Voltage
Output
Current
15A 15A 15A 15A 15A 15A
On/Off Logic
Negative Negative Negative
Positive Positive
Negative
Connector
Type
Through hole CC109161485 Through hole 150021782 Through hole CC109161980 Through hole CC109171402 Through hole CC109171410
Surface mount CC109161997
Comcodes
Contact Us
For more information, call us at
USA/Canada:
+1 888 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
India: +91.80.28411633
April 4, 2013 ©2012 General Electric Company. All rights reserved. Version 1.09
www.ge.com/powerelectronics
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