GE Industrial Solutions EHHD006A0B User Manual

GE

Data Sheet

EHHD006A0B Hammerhead* Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Features

 Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)
 Compliant to REACH Directive (EC) No 1907/2006
 Flat and high-efficiency curve

RoHS Compliant

Applications

 Distributed Power Architectures

 Wireless Networks

 Access and Optical Network Equipment

 Industrial Equipment

Options

 Negative Remote On/Off logic (preferred)

 Overcurrent/Overtemperature/Overvoltage protections

(Auto-restart) (preferred)

 Heat plate version (-H)

 Surface Mount version (-S)

 Industry standard, DOSA compliant footprint

57.9mm x 22.8mm x 7.6mm
(2.28 in x 0.9 in x 0.30 in)

 Low-profile height and reduced component skyline
 Ultra-wide input voltage range: 18-75 V
 Tightly regulated output
 Remote sense
 Output voltage adjust: 90% to 110% of V
 Constant switching frequency
 Positive remote On/Off logic
 Input under/overvoltage protection
 Output overcurrent and overvoltage protection
 Overtemperature protection
 No reverse current during output shutdown
 Wide operating temperature range (-40°C to 85°C)
 Suitable for cold wall cooling using suitable Gap Pad applied

directly to top side of module

#

 ANSI/UL

60950-1-2011 and CAN/CSA† C22.2 No. 60950-1­07, Second Edition + A1:2011 (MOD), dated March 19, 2011;
and DIN EN 60950-1 (VDE
1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE
0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950­1(ed.2);am1:2009

 CE mark meets 2006/95/EC directive
 Meets the voltage and current requirements for ETSI 300-

132-2 and complies with and licensed for basic insulation
rating per EN60950-1

 2250 Vdc Isolation tested in compliance with IEEE 802.3

PoE standards

**

 ISO

9001 and ISO 14001 certified manufacturing facilities

dc

O,nom

‡

0805 Teil 1):2011-01; EN 60950-

§

¤

Description

The EHHD006A0B Series, eighth-brick, low-height power modules are isolated DC-DC converters that provide a single, precisely
regulated output voltage over an ultra-wide input voltage range of 18-75V
voltage rated for 6A

output current. The module incorporates GE’s vast heritage for reliability and quality, while also using the

dc

. The EHHD006A0B provides 12Vdc nominal output

dc

latest in technology and component and process standardization to achieve highly competitive cost. The open frame module
construction, available in both surface mount and through-hole packaging, enables designers to develop cost and space efficient
solutions. The module achieves typical full load efficiency greater than 92% at V

=24Vdc and greater than 90% at VIN=48Vdc.

IN

Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to
achieve higher output current in high temperature applications.

*

Trademark Of General Electric Company

UL is a registered trademark of Underwriters Laboratories, Inc.

#

CSA is a registered trademark of Canadian Standards Association.

†

VDE is a trademark of Verband Deutscher Elektrotechniker e. V.

‡

§ This product is intended for integration into en d-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the Internat ional Organization of Standards

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 1

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Absolute Maximum Ratings

Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.

Parameter Device Symbol Min Max Unit

Input Voltage

Continuous All V

Transient, operational (≤100 ms) All V

Operating Ambient Temperature All T

(see Thermal Considerations section)

Storage Temperature All T

Altitude All

I/O Isolation Voltage (100% factory Hi-Pot tested) All

IN

IN,trans

A

stg

 

-0.3 80 Vdc

-0.3 100 Vdc

-40 85 °C

-55 125 °C

4000 m

2250 Vdc

* For higher altitude applications, contact your GE Sales Representative for alternative conditions of use.

Electrical Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions.

Parameter Device Symbol Min Typ Max Unit

Operating Input Voltage All VIN 18 24/48 75 Vdc

Maximum Input Current

(VIN= V

Input No Load Current

(VIN = 48V, IO = 0, module enabled)

Input Stand-by Current All

(VIN = 48V, module disabled)

Inrush Transient All I2t 0.5 A2s

IN, min

to V

IN, max

, VO= V

O, set

, IO=I

O, max

)

All I

All I

IN,No load

I

IN,stand-by

IN

4.4 5.0 Adc

80 mA

5 8 mA

Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
test configuration section)

Input Ripple Rejection (120Hz) All 50 dB

IN, min

to V

IN, max, IO

= I

Omax

; See

All 30 mA

p-p

CAUTION: This power module is not internally fused. An input line fuse must always be used.

This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part
of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included; however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a
maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy
and maximum DC input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data
sheet for further information.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 2

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Electrical Specifications (continued)

Parameter Device Symbol Min Typ Max Unit

Nominal Output Voltage Set-point

VIN= 24V to 48V IO=I

O, max

, TA=25°C)

All V

O, set

Output Voltage

(Overall operating input voltage, resistive load, and temperature

All V

O

conditions until end of life)

Output Regulation

Line (VIN=V
Load (IO=I

Temperature (T

IN, min

O, min

to V

to I

O, max

ref=TA, min

) All

IN, max

)

to T

) All

A, max

All

Output Ripple and Noise

(VIN=V

IN, min

to V

IN, max

, IO= I

O, max

, TA=T

A, min

to T

)

A, max

RMS (5Hz to 20MHz bandwidth) All

Peak-to-Peak (5Hz to 20MHz bandwidth) All

External Capacitance All C

Output Current All I

Output Current Limit Inception (Hiccup Mode )
(VO= 90% of V

O, set

)

Output Short-Circuit Current

(VO≤250mV) ( Hiccup Mode )

All

All I

O, max

I

O, lim

O, s/c

O

Efficiency

VIN=24V, TA=25°C, IO=3A, VO = 12V All η 90.0 %

VIN=24V, TA=25°C, IO=6A, VO = 12V All η 92.5 %

VIN=48V, TA=25°C, IO=3A, VO = 12V All η 90.0 %

VIN=48V, TA=25°C, IO=6A, VO = 12V All η 90.5 %

Switching Frequency All f

sw

Dynamic Load Response

(dIo/dt=0.1A/s; VIN = 24V or 48V; TA=25°C; CO>100μF)

Load Change from Io= 50% to 75% or 25% to 50% of I

o,max

Peak Deviation All V

Settling Time (Vo<10% peak deviation)

All t

pk

s

11.80 12.00 12.24 V

11.64

 

 




0





25 50 mV

75 200 mV


12.36 V

±0.2 % V
±0.2 % V
±1.0

2,000 μF

% V

dc

dc

O, set

O, set

O, set

rms

pk-pk

0 6 Adc

6.6 7.8 9.0 Adc

5 A

rms

280 kHz




3

200




% V

s

O, set

Isolation Specifications

Parameter Device Symbol Min Typ Max Unit

Isolation Capacitance All C

Isolation Resistance All R

I/O Isolation Voltage (100% factory Hi-pot tested) All All

iso

iso



100

 

1000

 



2250 Vdc

pF

MΩ

General Specifications

Parameter Device Symbol Min Typ Max Unit

Calculated Reliability based upon Telcordia SR-332 Issue 3: Method I

=80%I

Case 3 (I

O

Weight (Open Frame) All 19 (0.7) g (oz.)

Weight (with Heat Plate) All 30 (1.1) g (oz.)

, TA=40°C, airflow = 200 lfm, 90% confidence)

O, max

9

All FIT 169.9 10

All MTBF 5,887,341 Hours

/Hours

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 3

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Feature Specifications

Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions. See
Feature Descriptions for additional information.

Parameter Device Symbol Min Typ Max Unit

Remote On/Off Signal Interface

(VIN=V
Signal referenced to V
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On

Turn-On Delay and Rise Times

(IO=I

Case 1: Input power is applied for at least 1 second
then the On/Off input is set from OFF to ON

(T

Case 2: On/Off input is set to Logic Low (Module
ON) then input power is applied
(T

Output voltage Rise time (time for Vo to rise from 10%
of V

Output Voltage Overshoot – Startup
IO= I
Remote Sense Range All V

Output Voltage Adjustment Range All 90 110 % V

Output Overvoltage Protection

Overtemperature Protection – Hiccup Auto Restart

Heat Plate

Input Undervoltage Lockout All V

to V

IN, min

Logic Low - Remote On/Off Current All I

Logic Low - On/Off Voltage All V

Logic High Voltage – (Typ = Open Collector) All V

Logic High maximum allowable leakage current All I

O, max , VIN=VIN, nom, TA

= On/Off pin transition until VO = 10% of V

delay

= VIN reaches V

delay

to 90% of V

o,set

; VIN=V

O, max

Turn-on Threshold

Turn-off Threshold

; open collector or equivalent,

IN, max

terminal)

IN-

on/off  

on/off

on/off

on/off

-0.7

2.5

 




0.15 mA

0.6 Vdc

6.7 Vdc

25 μA

= 25oC)

IN, min

until Vo=10% of V

IN, min

)

o, set

to V

IN, max

)

O, set

All T

All T

)

O,set

All T

, TA = 25 oC

All

All V

Open

frame

Heat

Plate

— 12 — msec

delay

— 25 35 msec

delay

rise

SENSE

O, limit

T

ref

T

ref

UVLO

— 15 25 msec

— 3 % V

10 % V

13.8



16.5 Vdc

135 OC

120 OC



17 18 V

14 15.5 16 Vdc

dc

O, set

O, set

O, set

Hysteresis 1 2.0 Vdc

Input Overvoltage Lockout All V

Turn-on Threshold 76 77

Turn-off Threshold

Hysteresis 1 2

OVLO

Vdc

Vdc





79 81 Vdc



July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 4

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Characteristic Curves

The following figures provide typical characteristics for the EHHD006A0B (12.0V, 6A) at 25oC. The figures are identical for either
positive or negative remote On/Off logic.

Io(A) (1A/div)

(V) (200mV/div)

EFFICIENCY,  (%)

OUTPUT CURRENT, IO (A)

Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load

O

OUTPUT VOLTAGE OUTPUT CURRENT

V

TIME, t (200µs/div)

Change from 50% to 75% to 50% of full load, Vin=48V,

>100μF.

C

O

(V) (100mV/div)

O

OUTPUT VOLTAGE

V

TIME, t (2s/div)

Figure 2. Typical output ripple and noise (I

(V) (200mV/div) Io(A) (1A/div)

O

V

OUTPUT VOLTAGE OUTPUT CURRENT

TIME, t (200µs/div)

o = Io,max).

Figure 3. Transient Response to 0.1A/µS Dynamic Load Change
from 50% to 75% to 50% of full load, Vin=24V, C

>100μF.

O

(V) (5V/div)

On/Off

(V) (5V/div) V

O

OUTPUT VOLTAGE On/Off VOLTAGE

V

TIME, t (10ms/div)

Figure 5. Typical Start-up Using Remote On/Off, negative
logic version shown (V

(V) (20V/div)

IN

(V) (5V/div) V

O

OUTPUT VOLTAGE INPUT VOLTAGE

V

IN = 24V or 48V, Io = Io,max).

TIME, t (10ms/div)

Figure 6. Typical Start-up Using Input Voltage (V

o = Io,max).

I

IN

= 24V,

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 5

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Test Configurations

Vout+

Vout-

33-10 0μF

V

CURRENT PR OBE

SCOP E

R

contact Rdistribution

O

R

contact Rdistribution

x 100 %

Vin +

Vin-

RESISTIVE
LOAD

R

LOAD

TO OSCILL OSCOPE

L

TEST

12μH

CS 220μF

BATTERY

NOTE: M easure i nput r eflected ri pple curr ent with a simula ted

E.S .R.<0 .1

@ 20° C 100kHz

source i nductance (L
possible battery impedance. Measure current as shown
abov e.

) of 12μH. Capacitor CS offs ets

TEST

Figure 7. Input Reflected Ripple Current Test Setup.

COPPER STRIP

V O (+)

V O ( – )

NOTE: A ll vol tage measurem ents to be taken at the module

1uF

10uF

GROUND PLANE

termin als, a s shown ab ove. If sockets are use d then
Kel vin conn ections are requ ired at the mo dule termin als
to av oid measureme nt errors due to socket conta ct
resistance.

Figure 8. Output Ripple and Noise Test Setup.

R

R

contact

distribution

R

R

contact

distribution

NOTE: All voltage measurements to be taken at the module

terminals, as shown above. If sockets are used then
Kelvin connections are require d at the module terminals
to avoid measurement errors du e to socket contact
resistance.

Vin+

V

IN

Vin-

Figure 9. Output Voltage and Efficiency Test Setup.

. I

V

O

Efficiency

=



VIN. I

O

IN

Design Considerations

Input Filtering

The power module should be connected to a low AC
impedance source. Highly inductive source impedance can
affect the stability of the power module. For the test
configuration in Figure 7, a 33-100μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounting close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.

Safety Considerations

For safety-agency approval of the system in which the
power module is used, the power module must be installed
in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.,
UL60950-1, CSA C22.2 No.60950-1, and VDE0805­1(IEC60950-1).

If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the
requirements for safety extra-low voltage (SELV), all of the
following must be true:

 The input source is to be provided with reinforced

insulation from any other hazardous voltages, including
the AC mains.

 One V

pin and one V

IN

pin are to be grounded, or

OUT

both the input and output pins are to be kept floating.

 The input pins of the module are not operator

accessible.

 Another SELV reliability test is conducted on the whole

system (combination of supply source and subject
module) as required by the safety agencies to verify
that under a single fault, hazardous voltages do not
appear at the module’s output.

Note: Do not ground either of the input pins of the module

without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the
output pins and ground.

The power module has extra-low voltage (ELV) outputs when
all inputs are ELV.

All flammable materials used in the manufacturing of these
modules are rated 94V-0 or tested to the UL60950 A.2 for
reduced thickness.

For input voltages exceeding –60 Vdc but less than or equal
to –75 Vdc, these converters have been evaluated to the
applicable requirements of basic insulation between
secondary DC mains distribution input (classified as TNV-2 in
Europe) and unearthed SELV outputs.

The input to these units is to be provided with a maximum
10 A fast-acting fuse in the ungrounded lead.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 6

GE

E

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Feature Descriptions

Remote On/Off

Two remote On/Off options are available. Positive logic turns
the module on during a logic high voltage on the On/Off pin
and off during a logic low. Negative logic remote On/Off,
device code suffix “1”, turns the module off during a logic
high and on during a logic low.

Vin+

I

on/off

V

on/off

ON/OFF

Vin-

Figure 10. Remote On/Off Implementation.

To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage

) between the On/Off terminal and the VIN(-) terminal

(V

on/off

(see Figure 10). Logic low is -0.7V ≤ V
maximum I

during a logic low is 0.15mA and the switch

on/off

should maintain a logic low level while sinking this current.
During a logic high, the typical maximum V

by the module is 5.6V and the maximum allowable leakage
current at V

= 5.6V is 25μA.

on/off

If not using the remote On/Off feature:
For positive logic, leave the On/Off pin open.
For negative logic, short the On/Off pin to V

Remote Sense

Remote sense minimizes the effects of distribution losses by
regulating the voltage at the remote-sense connections (See
Figure 11). The voltage between the remote-sense pins and
the output terminals must not exceed the output voltage
sense range given in the Feature Specifications table:

(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V

[V

O

Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the trim.

≤ 0.6V. The

on/off

Vout+

TRIM

Vout-

generated

on/off

(-).

IN

The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output
voltage of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the maximum
output power of the module remains at or below the
maximum rated power (maximum rated power = Vo,set x
Io,max).

SENSE(+)

SENSE(–)

V

I(+)

VO(+)

SUPPLY

CONTACT

RESISTANCE

I

I

V

I(-)

V

O(–)

IO

LOAD

CONTACT AND

DISTRIBUTION LOSS

Figure 11. Circuit Configuration for Remote Sense .

Input Undervoltage Lockout

At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only
begin to operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, V

UV/ON

.

Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, V

UV/OFF

.

Overtemperature Protection

To provide protection under certain fault conditions, the unit
is equipped with a thermal shutdown circuit. The unit will
shutdown if the thermal reference point, Tref, exceeds

O

C (Figure 13, typical) or 120OC (Figure 14, typical), but

135
the thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating. The
module will automatically restart upon cool-down to a safe
temperature.

Output Overvoltage Protection

The output overvoltage protection scheme of the modules
has an independent overvoltage loop to prevent single point
of failure. This protection feature latches in the event of
overvoltage across the output. Cycling the On/Off pin or
input voltage resets the latching protection feature. If the
auto-restart option (4) is ordered, the module will
automatically restart upon an internally programmed time
elapsing.

Overcurrent Protection

To provide protection in a fault (output overload) condition,
the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, it will latch off following
the overcurrent condition. The module can be restarted by
cycling the DC input power for at least one second or by
toggling the remote On/Off signal for at least one second.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 7

GE



Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

If the unit is configured with the auto-restart option (4), it will
remain in the hiccup mode as long as the overcurrent
condition exists. Once the output current is brought back
into its specified range, the unit will operate normally. The
average output current during hiccup is 10% I

O, max

.

Output Voltage Programming

Trimming allows the output voltage set point to be
increased or decreased from the default value. This is
accomplished by connecting an external resistor between
the TRIM pin and either the V

VIN(+)

ON/OFF

VIN(-)

VO(+)

VOTRIM

VO(-)

Figure 12. Circuit Configuration to Trim Output Voltage.

Connecting an external resistor (R
pin and the V

(-) (or Sense(-)) pin decreases the output

O

voltage set point. To maintain set point accuracy, the trim
resistor tolerance should be ±1.0%.

The following equation determines the required external
resistor value to obtain a percentage output voltage change
of ∆%

R



downtrim

0.12

Where





% 




For example, to trim-down the output voltage of the module
by 6% to 11.28V, Rtrim-down is calculated as follows:

(+) pin or the VO(-) pin.

O

trim-down

511











%





VV



desired

V

0.12

100




R

trim-up

LOAD

R

trim-down

) between the TRIM





22.10




6%

511

R





downtrim



6



R

downtrim

Connecting an external resistor (R
pin and the V

(+) (or Sense (+)) pin increases the output

O

voltage set point. The following equation determines the
required external resistor value to obtain a percentage
output voltage change of ∆%:

R

Where







uptrim




V

desired



0.12



% 






For example, to trim-up the output voltage of the module by
4% to 12.48V, R

is calculated is as follows:

trim-up





%225.1



0.12








22.10




9.74

) between the TRIM

trim-up

511

%)100(0.1211.5





%



100

4%





22.10










R



uptrim




The voltage between the V

)4100(0.1211.5



4225.1

MRuptrim

(+) and VO(–) terminals must not

O

4



16.1







22.10






511

exceed the minimum output overvoltage protection value
shown in the Feature Specifications table. This limit includes
any increase in voltage due to remote-sense compensation
and output voltage set-point adjustment trim.

Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for
the output voltage is not the sum of both. The maximum
increase is the larger of either the remote sense or the trim.
The amount of power delivered by the module is defined as
the voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output
voltage of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the maximum
output power of the module remains at or below the
maximum rated power (maximum rated power = V

).

I

O,max

O,set

x

Thermal Considerations

The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.

Considerations include ambient temperature, airflow,
module power dissipation and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability.

The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature,
the module output power is increased, until one (or more) of
the components reaches its maximum derated operating
temperature, as defined in IPC-9592. This procedure is then
repeated for a different airflow or ambient temperature until
a family of module output derating curves is obtained.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 8

GE

Data Sheet

EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Thermal Considerations (continued)

The thermal reference points, T
for open frame modules is shown in Figure 13. For reliable
operation, these temperatures should not exceed 125

used in the specifications

ref,

o

C.

(A)

O

OUTPUT CURRENT, I

AMBIENT TEMEPERATURE, TA (oC)

Figure 15. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from V
V

(+); VIN =48.

out

(A)

O

OUTPUT CURRENT, I

out

(-) to

AIRFLOW

Figure 13. T
Open Frame Module.

The thermal reference point, T
for modules with a heat plate is shown in Figure 14. For
reliable operation, this temperature should not exceed

O

C.

115

Figure 14. T
Module with Heat plate.

Temperature Measurement Locations for

ref

used in the specifications

ref,

AIRFLOW

Temperature Measurement Location for

ref

Heat Transfer via Convection

Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (T
for natural convection and up to 2m/s (400 ft./min) forced
airflow are shown in Figures 15 - 18.

A

)

AMBIENT TEMEPERATURE, TA (oC)

Figure 16. Output Current Derating for the Module with
Heat plate; Airflow in the Transverse Direction from V
to V

(+);VIN =48V.

out

(A)

O

OUTPUT CURRENT, I

AMBIENT TEMEPERATURE, TA (oC)

Figure 17. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from V
V

(+); VIN =24V.

out

out

out

(-) to

(-)

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 9

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Thermal Considerations (continued)

(A)

O

OUTPUT CURRENT, I

Figure 18. Output Current Derating for the Module with
Heat plate; Airflow in the Transverse Direction from V

(+);VIN =24V.

to V

out

Please refer to the Application Note ‘Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules’ for a detailed discussion of thermal aspects
including maximum device temperatures.

Heat Transfer via Conduction

The module can also be used in a sealed environment with
cooling via conduction from the
module’s top surface through a gap pad material to a
cold wall, as shown in Figure 19. This capability is achieved
by insuring the top side component skyline profile achieves
no more than 1mm height difference between the tallest
and the shortest power train part that benefits from contact
with the gap pad material. The output current derating
versus cold wall temperature, when using a gap pad such as
Bergquist GP2500S20, is shown in Figure 20.

Figure 19. Cold Wall Mounting

AMBIENT TEMEPERATURE, TA (oC)

out

(-)

Through-Hole Soldering Information

Lead-Free Soldering

The EHHD006A0Bxx RoHS-compliant through-hole products
use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines. The pins have a
RoHS-compliant finish that is compatible with both Pb and
Pb-free wave soldering processes. A maximum preheat rate
of 3C/s is suggested. The wave preheat process should be
such that the temperature of the power module board is
kept below 210C. For Pb solder, the recommended pot
temperature is 260C, while the Pb-free solder pot is 270C
max.

Paste-in-Hole Soldering

The EHHD006A0Bxx module is compatible with reflow
paste-in-hole soldering processes shown in Figures 23-25.
Since the EHHD006A0BxxZ module is not packaged per J­STD-033 Rev.A, the module must be baked prior to the
paste-in-hole reflow process. EHHD006A0Bxx-HZ modules
are not compatible with paste-in-hole reflow soldering.
Please contact your GE Sales Representative for further
information.

Surface Mount Information

MSL Rating

The EHHD006A0B-SZ module has a MSL rating of 2a.

Storage and Handling

The recommended storage environment and handling
procedures for moisture-sensitive surface mount packages
is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping
and Use of Moisture/Reflow Sensitive Surface Mount
Devices). Moisture barrier bags (MBB) with desiccant are
provided for the EHHD006A0Bxx-SZ modules. These sealed
packages should not be broken until time of use. Once the
original package is broken, the floor life of the product at
conditions of  30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The shelf life
for dry packed SMT packages is a minimum of 12 months
from the bag seal date, when stored at the following
conditions: < 40° C, < 90% relative humidity

.

Pick and Place

The EHHD006A0Bxx-S modules use an open frame

(A)

O

OUTPUT CURRENT, I

construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and place
operations. The label meets all the requirements for surface
mount processing, as well as safety standards, and is able
to withstand reflow temperatures of up to 300
also carries product information such as product code,
serial number and the location of manufacture.

o

C. The label

Figure 20. Derated Output Current versus Cold Wall
Temperature with Local Ambient Temperature Around
Module at 85C; V

COLDPLATE TEMEPERATURE, T

=24V or 48V.

IN

(oC)

C

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 10

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Surface Mount Information (continued)

cause damage to the modules, and can adversely affect
long-term reliability.

Tin Lead Soldering

The EHHD006A0Bxx-S power modules are lead free modules
and can be soldered either in a lead-free solder process or
in a conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets in
order to customize the solder reflow profile for each
application board assembly. The following instructions must

Figure 21. Pick and Place Location.

Nozzle Recommendations

The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a
relatively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process. The minimum
recommended nozzle diameter for reliable operation is
6mm. The maximum nozzle outer diameter, which will safely
fit within the allowable component spacing, is 9 mm.

Oblong or oval nozzles up to 11 x 9 mm may also be used
within the space available.

Reflow Soldering Information

The surface mountable modules in the EHHD006A0Bxx-S
family use our newest SMT technology called “Column Pin”
(CP) connectors. Figure 22 shows the new CP connector
before and after reflow soldering onto the end-board
assembly. The CP is constructed from a solid copper pin with
an integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag
solder for –Z codes.

EHHD Board

Insulator

Solder Ball

End assembly PCB

Figure 22. Column Pin Connector Before and After Reflow
Soldering.

The CP connector design is able to compensate for large
amounts of planarity and still ensure a reliable SMT solder
joint. Typically, the eutectic solder melts at 183°C (Sn/Pb
solder) or 217-218°C (SAC solder), wets the land, and
subsequently wicks the device connection. Sufficient time
must be allowed to fuse the plating on the connection to
ensure a reliable solder joint. There are several types of SMT
reflow technologies currently used in the industry. These
surface mount power modules can be reliably soldered
using natural forced convection, IR (radiant infrared), or a
combination of convection/IR. The following instructions
must be observed when SMT soldering these units. Failure to
observe these instructions may result in the failure of or

/Cu (SAC)

3

be observed when soldering these units. Failure to observe
these instructions may result in the failure of or cause
damage to the modules, and can adversely affect long-term
reliability.

In a conventional Tin/Lead (Sn/Pb) solder process, peak
reflow temperatures are limited to less than 235°C.
Typically, the eutectic solder melts at 183°C, wets the land,
and subsequently wicks the device connection. Sufficient
time must be allowed to fuse the plating on the connection
to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These surface
mount power modules can be reliably soldered using
natural forced convection, IR (radiant infrared), or a
combination of convection/IR. For reliable soldering, the
solder reflow profile should be established by accurately
measuring the modules CP connector temperatures.

Lead Free Soldering

The –Z version of the EHHD006A0B modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may
result in the failure of or cause damage to the modules and
can adversely affect long-term reliability.

300

250

200

15 0

10 0

REFLOW TEMP (C)

50

0

Peak Temp 235oC

Heat zone

oCs-1

max 4

Soak zone
30-240s

Preheat zone

oCs-1

max 4

REFLOW TIME (S)

T

lim

205

Cooling
zo ne
1- 4

above

o

C

oCs-1

Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 11

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Surface Mount Information (continued)

240

235

230

225

220

215

210

MAX TEMP SOLDER (C)

205

200

0 10 203040 5060

Figure 24. Time Limit Curve Above 205oC for Tin/Lead
(Sn/Pb) process

Pb-free Reflow Profile

Power systems will comply with J-STD-015 Rev. C
(Moisture/Reflow Sensitivity Classification for Nonhermetic
Solid State Surface Mount Devices) for both Pb-free solder
profiles and MSL classification procedures. This standard
provides a recommended forced-air-convection reflow
profile based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu
(SAC). The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.

300

Per J-STD-020 Rev. C

250

200

150

Heating Zone
1°C/Second

100

Reflow T emp (°C )

50

0

Figure 25. Recommended linear reflow profile using
Sn/Ag/Cu solder.

Peak Temp 260°C

* Min. Time Above 235°C
15 Seconds

*Time Above 217°C

60 Seconds

Reflow Time (Seconds)

Cooling
Zone

Post Solder Cleaning and Drying Considerations

Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit board assembly. For guidance on
appropriate soldering, cleaning and drying procedures, refer
to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 12

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

EMC Considerations

The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B.

Figure 26. EMC Considerations

For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).

VIN = 48V, Io = I

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 13

o,max

, L Line

VIN = 48V, Io = I

, N Line

o,max

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Mechanical Outline for Through-Hole Module

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
*Top side label includes GE name, product designation and date code.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 14

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Mechanical Outline for Surface Mount Module (-S Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]
* Top side label includes GE name, product designation and date code.

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 15

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 16

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Recommended Pad Layout

Dimensions are in millimeters and [inches].
Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated)
x.xx mm  0.25 mm [x.xxx in  0.010 in.]

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

SMT Recommended Pad Layout (Component Side View)

Pin Function

1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)

NOTES:

FOR 0.030” X 0.025”
RECTANGULAR PIN, USE

0.050” PLATED THROUGH­HOLE DIAMETER

FOR 0.62 DIA” PIN, USE

0.076” PLATED THROUGH­HOLE DIAMETER

TH Recommended Pad Layout (Component Side View)

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 17

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Packaging Details

The surface mount versions of the EHHD006A0B (suffix –S) are
supplied as standard in the plastic trays shown in Figure 27.

Tray Specification

Material Antistatic coated PVC
Max surface resistivity 10
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays + 1

12

/sq

empty top tray)

Each tray contains a total of 12 power modules. The trays are
self-stacking and each shipping box for the EHHD006A0B
(suffix –S) surface mount module contains 4 full trays plus one
empty hold-down tray giving a total number of 48 power
modules.

Figure 27. Surface Mount Packaging Tray

July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 18

GE

Data Sheet

EHHD006A0B Hammerhead

Series; DC-DC Converter Power Modules

18-75Vdc Input; 12Vdc, 6.0A, 72W Output

Ordering Information

Please contact your GE Sales Representative for pricing, availability and optional features.

Table 1. Device Codes

Product Codes Input Voltage

EHHD006A0B41Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109159364

EHHD006A0B641Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole 150024112

EHHD006A0B41-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109167755

EHHD006A0B641-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole 150024113

EHHD006A0B841-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109171443

EHHD006A0B41-SZ 24/48V (18-75Vdc) 12.0V 6A Negative Surface mount CC109167763

Table 2. Device Coding Scheme and Options

Output

Voltage

Output

Current

On/Off Logic

Connector

Type

Comcodes

Contact Us

For more information, call us at

USA/Canada:

[phone], or [phone]

Asia-Pacific:

+86.021.54279977*808

Europe, Middle-East and Africa:

+49.89.878067-280

India:
+91.80.28411633

July 12, 2013 ©2012 General Electric Company. All rights reserved. Version 1.07

www.ge.com/powerelectronics