GE Industrial Solutions Austin Microlynx II SMT User Manual

Page 1
Data Sheet September 10, 2013
Austin Microlynx
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A Output Current
TM
II SMT Non-isolated Power Modules:
RoHS Compliant
EZ-SEQUENCETM
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Flexible output voltage sequencing EZ-
SEQUENCE
Delivers up to 6A output current
High efficiency – 96% at 3.3V full load (V
Small size and low profile:
27.9 mm x 11.4 mm x 7.24 mm
(1.10 in x 0.45 in x 0.285 in)
Low output ripple and noise
High Reliability:
Calculated MTBF = 12.8M hours at 25
Output voltage programmable from 0.75 Vdc to
3.63Vdc via external resistor
Line Regulation: 0.3% (typical)
Load Regulation: 0.4% (typical)
Temperature Regulation: 0.4 % (typical)
Remote On/Off
Output overcurrent protection (non-latching)
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA
60950-1-03 Certified, and VDE (EN60950-1) Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
TM
C22.2 No.
0805:2001-12
= 5.0V)
IN
o
C Full-load
Description
Austin MicroLynxTM II SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (V enable designers to implement various types of output voltage sequencing when powering multiple modules on board.
CSA is a reg istered trademark of Canadian Standards Associat ion.
VDE is a t rademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Orga nization of Standards
= 2.4 – 5.5Vdc). Austin MicroLynxTM II has a sequencing feature, EZ-SEQUENCETM that
IN
Document No: DS03-107 ver. 1.04
PDF name:
microlynx_II_smt_ds.pdf
Page 2
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All V
Continuous
IN
Sequencing voltage All Vseq -0.3 V
Operating Ambient Temperature All T
A
-0.3 5.8 Vdc
Vdc
IN,max
-40 85 °C
(see Thermal Considerations section)
Storage Temperature All T
stg
-55 125 °C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage Vo,set 3.63 VIN 2.4
Maximum Input Current All I
(VIN= V
Input No Load Current V
IN, min
to V
IN, max
, IO=I
)
O, max
= 0.75 Vdc I
O,set
IN,max
IN,No load
6.0 Adc
20 mA
5.5 Vdc
(VIN = V
Input Stand-by Current All I
(VIN = V
, Io = 0, module enabled) V
IN, nom
, module disabled)
IN, nom
= 3.3Vdc I
O,set
IN,No load
IN,stand-by
45 mA
0.6 mA
Inrush Transient All I2t 0.04 A2s
Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V V
= I
IN, max, IO
; See Test configuration section)
Omax
IN, min
to
All 35 mAp-p
Input Ripple Rejection (120Hz) All 30 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast­acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information.
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Page 3
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All V
(VIN=
IN, min
, IO=I
, TA=25°C)
O, max
Output Voltage All V
(Over all operating input voltage, resistive load, and temperature conditions until end of life)
Adjustment Range All V
Selected by an external resistor
O, set
O, set
O
Output Regulation
Line (VIN=V
Load (IO=I
Temperature (T
IN, min
O, min
to V
to I
ref=TA, min
) All
IN, max
) All
O, max
to T
) All ⎯ 0.4
A, max
Output Ripple and Noise on nominal output
(VIN=V
IN, nom
and IO=I
O, min
to I
O, max
Cout = 1μF ceramic//10μFtantalum capacitors)
RMS (5Hz to 20MHz bandwidth) All
Peak-to-Peak (5Hz to 20MHz bandwidth) All
External Capacitance
ESR 1 m All C
ESR 10 m All C
Output Current All I
Output Current Limit Inception (Hiccup Mode ) All I
(VO= 90% of V
)
O, set
Output Short-Circuit Current All I
(VO≤250mV) ( Hiccup Mode )
Efficiency V
VIN= V
IO=I
, TA=25°C V
IN, nom
= V
O, max , VO
V
O,set
V
V
V
= 0.75Vdc η 81.2 %
O, set
= 1.2Vdc η 86.8 %
O, set
= 1.5Vdc η 88.8 %
O,set
= 1.8Vdc η 89.7 %
O,set
= 2.5Vdc η 92.5 %
O,set
= 3.3Vdc η 95.4 %
O,set
Switching Frequency All f
O, max
O, max
o
O, lim
O, s/c
sw
Dynamic Load Response
(dIo/dt=2.5A/μs; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 50% to 100% of Io,max; 1μF ceramic// 10 μF tantalum
All V
pk
Peak Deviation
Settling Time (Vo<10% peak deviation)
(dIo/dt=2.5A/μs; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 100% to 50%of Io,max: 1μF ceramic// 10 μF tantalum
All t
All V
s
pk
Peak Deviation
Settling Time (Vo<10% peak deviation)
All t
s
-2.0
–3.0
+2.0 % V
+3.0 % V
0.7525 3.63 Vdc
0.3
0.4
10 15 mV
40 50 mV
% V
% V
% V
1000 μF
5000 μF
0 6 Adc
220
2
300
130
25
130
25
μs
μs
pk-pk
% I
Adc
kHz
mV
mV
O, set
O, set
O, set
O, set
O, set
rms
o
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Page 4
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Dynamic Load Response
(dIo/dt=2.5A/μs; V VIN = V
Load Change from Io= 50% to 100% of Io,max; Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
(dIo/dt=2.5A/μs; VIN = V
Load Change from Io= 100% to 50%of Io,max: Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
IN, nom
IN, nom
; TA=25°C)
; TA=25°C)
All V
All t
All V
All t
pk
s
pk
s
50
50
50
50
μs
μs
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (IO=I
Weight
, TA=25°C) 12,841,800 Hours
O, max
2.8 (0.1)
g (oz.)
mV
mV
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Page 5
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal interface
Device code with Suffix “4” – Positive logic
(On/Off is open collector/drain logic input;
Signal referenced to GND - See feature description section)
Input High Voltage (Module ON) All VIH V
Input High Current All IIH 10 μA
Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V
Input Low Current All IIL 0.2 1 mA
Device Code with no suffix – Negative Logic
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Input High Voltage (Module OFF) All VIH 1.5 ― V
Input High Current All IIH 0.2 1 mA
Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc
Input low Current All IIL ― 10 μA
Turn-On Delay and Rise Times
(IO=I
Case 1: On/Off input is set to Logic Low (Module
O, max , VIN
= V
= 25 oC, )
IN, nom, TA
All Tdelay ― 3.9 ― msec ON) and then input power is applied (delay from instant at which V
Case 2: Input power is applied for at least one second
=V
IN
until Vo=10% of Vo,set)
IN, min
All Tdelay ― 3.9 ― msec and then the On/Off input is set to logic Low (delay from
instant at which Von/Off=0.3V until Vo=10% of Vo, set)
Output voltage Rise time (time for Vo to rise from 10% of V
o,set to 90% of Vo, set)
All Trise
Output voltage overshoot – Startup
IO= I
; VIN = 3.0 to 5.5Vdc, TA = 25 oC
O, max
Sequencing Delay time
Delay from V
to application of voltage on SEQ pin All TsEQ-delay 10 msec
IN, min
Tracking Accuracy (Power-Up: 2V/ms) All
(Power-Down: 1V/ms) All
(V
IN, min
to V
IN, max
; I
to I
O, min
VSEQ < Vo)
O, max
Overtemperature Protection
(See Thermal Considerations section)
Input Undervoltage Lockout
SEQ –Vo |
|V
SEQ –Vo |
|V
All T
ref
Turn-on Threshold All 2.2 V
Turn-off Threshold All
IN, max
IN,max
4.2 8.5 msec
1
100 200 mV
200 400 mV
150
2.0 V
V
Vdc
% V
O, set
°C
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Page 6
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Characteristic Curves
The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25ºC.
91
88
85
82
79
76
73
EFFICIENCY, η (%)
70
0 123456
VIN=2.4V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current (Vout = 0.75Vdc).
94
91
88
85
82
79
76
73
EFFICIENCY, η (%)
70
0 123456
VIN=2.4V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)
Figure 2. Converter Efficiency versus Output Current (Vout = 1.2Vdc).
98
95
92
89
86
83
80
EFFICIENCY, η (%)
77
74
0 123456
Figure 4. Converter Efficiency versus Output Current (Vout = 1.8Vdc).
98
95
92
89
86
83
80
77
EFFICIENCY, η (%)
74
0 123456
Figure 5. Converter Efficiency versus Output Current (Vout = 2.5Vdc).
VIN=2.4V
VIN=5V
VIN=5.5V
VIN=3 V
VIN=5V
VIN=5.5 V
94
91
88
85
82
79
76
73
EFFICIENCY, η (%)
70
0 123456
VIN=2.4V
VIN=5V
VIN=5.5V
98
95
92
89
86
83
80
EFFICIENCY, η (%)
77
74
0 123456
VIN=4 .5V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A)
Figure3. Converter Efficiency versus Output Current (Vout = 1.5Vdc).
Figure 6. Converter Efficiency versus Output Current (Vout = 3.3Vdc).
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Page 7
Data Sheet
(V)
September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Characteristic Curves (continued)
The following figures provide typical characteristics for the MicroLynxTM II SMT modules at 25ºC.
7
6
(A)
5
IN
4
3
2
1
INPUT CURRENT, I
0
1 1.75 2.5 3.25 4 4.75 5.5
Figure 7. Input voltage vs. Input Current
INPUT VOLTAGE, V
IN
(Vout =2.5Vdc).
Io =6 A
Io =3 A
Io =0 A
(V) (100mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUT VOLTAGE
I
TIME, t (5 μs/div)
Figure 10. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3Vdc).
(V) (20mV/div)
O
V
OUTPUT VOLTAGE
TIME, t (2μs/div) TIME, t (5 μs/div)
Figure 8. Typical Output Ripple and Noise
(Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A).
(V) (20mV/div)
O
OUTPUT VOLTAGE
V
TIME, t (2μs/div) TIME, t (10μs/div)
Figure 9. Typical Output Ripple and Noise
(Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A).
(V) (100mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUT VOLTAGE
I
Figure 11. Transient Response to Dynamic Load Change from 100% to 50% of full load (Vo = 3.3 Vdc).
(V) (50mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUT VOLTAGE
I
Figure 12. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150 μF Polymer Capacitors).
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Page 8
Data Sheet
μ
September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MicroLynxTM II SMT modules at 25ºC.
(V) (2V/div)
(V) (50mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUTVOLTAGE
I
TIME, t (10μs/div)
Figure 13. Transient Response to Dynamic Load Change from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150
F Polymer Capacitors).
IN
(V) (1V/div) V
o
V
OUTPUT VOLTAGE, INPUT VOLTAGE
TIME, t (2 ms/div)
Figure 16. Typical Start-Up with application of Vin
(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
(V) (2V/div)
On/off
V) (1V/div) V
O
V
OUTPUT VOLTAGE On/Off VOLTAGE
TIME, t (2 ms/div) TIME, t (2 ms/div)
Figure 14. Typical Start-Up Using Remote On/Off
(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
(V) (2V/div)
On/off
V) (1V/div) V
O
V
OUTPUT VOLTAGE On/Off VOLTAGE
F
igure 15. Typical Start-Up Using Remote On/Off with
TIME, t (2 ms/div) TIME, t (5ms/div)
Low-ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A, Co = 1050μF).
(V) (2V/div)
On/off
V) (1V/div) V
O
V
OUTPUT VOLTAGE On/Off VOLTAGE
Figure 17 Typical Start-Up Using Remote On/Off with Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias =1.0Vdc).
(A) (5A/div)
O
OUTPUT CURRENT,
I
Figure 18. Output short circuit Current
(Vin = 5.0Vdc, Vo = 0.75Vdc).
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Page 9
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MicroLynxTM II SMT modules.
7.5
6.0
4.5
3.0
1. 5
0.0
OUTPUT CURRENT, Io (A)
20 30 40 50 60 70 80 90
NC
0.5m/ s (100 LFM)
1.0m/s (200 LFM)
AMBIENT TEMPERATURE, TA OC AMBIENT TEMPERATURE, TA OC
Figure 19. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc).
OUTPUT CURRENT, Io (A)
7.5
6.0
4.5
3.0
1. 5
0.0 20 30 40 50 60 70 80 90
NC
0 .5m/s ( 100 LFM )
1. 0 m/ s ( 2 0 0 LF M )
AMBIENT TEMPERATURE, TA OC
Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc).
7.5
8
6
5
NC
3
0.5m/ s (100 LFM)
2
1.0m/s (200 LFM)
0
OUTPUT CURRENT, Io (A)
20 30 40 50 60 70 80 90
Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3dc, Vo=0.75 Vdc).
6.0
4.5
3.0
1. 5
0.0
OUTPUT CURRENT, Io (A)
20 30 40 50 60 70 80 90
NC
0.5m/s (100 LFM)
1.0m/s (200 LFM )
AMBIENT TEMPERATURE, TA OC
Figure 21. Derating Output Current versus Local Ambient Temperature and Airflow
(Vin = 3.3Vdc,
Vo=2.5 Vdc).
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Page 10
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Test Configurations
TO OSCILLOSCOPE
L
TEST
1μH
CS 1000μF
BATTERY
NOTE: Measure input reflected ripple current with a simulated
Electrolytic
E.S.R.<0.1Ω
@ 20°C 100kHz
source induct ance (L possible battery impedance. Measure current as shown above.
) of 1μH. Capacit or CS offsets
TEST
Figure 23. Input Reflected Ripple Current Test Setup.
COPPER STRIP
V
(+)
O
1uF .
COM
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance.
10uF
SCOPE
GROUND PLANE
Figure 24. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All volt age meas urements to be taken at th e module
terminals , as shown above. If sock ets are us ed then Kelvin conn ections are requir ed at the modu le termi nals to avoid measur ement err ors due to soc ket contact resistance.
VIN(+)
V
IN
COM
Figure 25. Output Voltage and Efficiency Test Setup.
. I
V
O
Efficiency
=
η
VIN. I
O
IN
V
COM
2x100μF Tantalum
O
CURRENT PROBE
CIN
RESISTIVE LOAD
R
V
O
R
x 100 %
VIN(+)
COM
contactRdistribution
R
contactRdistribution
LOAD
Design Considerations
Input Filtering
The Austin MicroLynxTM II SMT module should be connected to a low-impedance source. A highly inductive source can affect the stability of the module. An input capacitance must be placed directly adjacent to the input pin of the module, to minimize input ripple voltage and ensure module stability.
To minimize input voltage ripple, low-ESR polymer and ceramic capacitors are recommended at the input of the module. Figure 26 shows the input ripple voltage (mVp-p) for various outputs with 1x150 µF polymer capacitors (Panasonic p/n: EEFUE0J151R, Sanyo p/n: 6TPE150M) in parallel with 1 x 47 µF ceramic capacitor (Panasonic p/n: ECJ-5YB0J476M, Taiyo- Yuden p/n: CEJMK432BJ476MMT) at full load. Figure 27 shows the input ripple with 2x150 µF polymer capacitors in parallel with 2 x 47 µF ceramic capacitor at full load.
12 0
10 0
80
60
40
Vin = 3.3V
20
Vin = 5.0V
0
Input Ripple Voltage (mVp-p)
Output Voltage (Vdc)
Figure 26. Input ripple voltage for various output with 1x150 µF polymer and 1x47 µF ceramic capacitors at the input (80% of Io,max).
Input Ripple Voltage (mVp-p)
Output Voltage (Vdc)
Figure 27. Input ripple voltage for various output with 2x150 µF polymer and 2x47 µF ceramic capacitors at the input (80% of Io,max).
01234
12 0
10 0
80
60
40
Vin = 3.3V
20
V in = 5.0V
0
01234
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Page 11
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Design Considerations (continued)
Output Filtering
The Austin MicroLynxTM II SMT module is designed for low output ripple voltage and will meet the maximum output ripple specification with 1 µF ceramic and 10 µF tantalum capacitors at the output of the module. However, additional output filtering may be required by the system designer for a number of reasons. First, there may be a need to further reduce the output ripple and noise of the module. Second, the dynamic response characteristics may need to be customized to a particular load step change.
To reduce the output ripple and improve the dynamic response to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table.
Safety Considerations
For safety agency approval the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standards, i.e., UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12 (EN60950-1) Licensed.
For the converter output to be considered meeting the requirements of safety extra-low voltage (SELV), the input must meet SELV requirements. The power module has extra-low voltage (ELV) outputs when all inputs are ELV.
The input to these units is to be provided with a fast­acting fuse with a maximum rating of 6A in the positive input lead
.
LINEAGE POWER 11
Page 12
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Feature Description
Remote On/Off
The Austin LynxTM II SMT power modules feature an On/Off pin for remote On/Off operation. Two On/Off logic options are available in the Austin Lynx modules. Positive Logic On/Off signal, device code suffix “4”, turns the module ON during a logic High on the On/Off pin and turns the module OFF during a logic Low. Negative logic On/Off signal, no device code suffix, turns the module OFF during logic High on the On/Off pin and turns the module ON during logic Low.
For positive logic modules, the circuit configuration for using the On/Off pin is shown in Figure 28. The On/Off pin is an open collector/drain logic input signal (Von/Off) that is referenced to ground. During a logic-high (On/Off pin is pulled high internal to the module) when the transistor Q1 is in the Off state, the power module is ON. Maximum allowable leakage current of the transistor when Von/off = V
is 10µA. Applying a logic-low
IN,max
when the transistor Q1 is turned-On, the power module is OFF. During this state VOn/Off must be less than 0.3V. When not using positive logic On/off pin, leave the pin unconnected or tie to V
IN.
VIN+
ON/OFF
R1
I
ON/OFF
GND
+
V
ON/OFF
Q1
_
Figure 28. Circuit configuration for using positive logic On/OFF.
For negative logic On/Off devices, the circuit configuration is shown is Figure 29. The On/Off pin is pulled high with an external pull-up resistor (typical R = 5k, +/- 5%). When transistor Q1 is in the Off state, logic High is applied to the On/Off pin and the power module is Off. The minimum On/off voltage for logic High on the On/Off pin is 1.5Vdc. To turn the module ON, logic Low is applied to the On/Off pin by turning ON Q1. When not using the negative logic On/Off, leave the pin unconnected or tie to GND.
R2
R3
R4
Q2
TM
II series
MODULE
PWM Enable
Q3 CSS
pull-up
VIN+
ON/OFF
GND
R
pull-up
I
ON/OFF
V
ON/OFF
Q1
+
_
MODULE
PWM Enable
R1
Q2 CSS
R2
Figure 29. Circuit configuration for using negative logic On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The typical average output current during hiccup is 2A.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit, module operation is disabled. The module will begin to operate at an input voltage above the undervoltage lockout turn-on threshold.
Overtemperature Protection
To provide over temperature protection in a fault condition, the unit relies upon the thermal protection feature of the controller IC. The unit will shutdown if the thermal reference point T the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart after it cools down.
, exceeds 150oC (typical), but
ref
LINEAGE POWER 12
Page 13
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Feature Descriptions (continued)
Output Voltage Programming
The output voltage of the Austin MicroLynx be programmed to any voltage from 0.75 Vdc to 3.63 Vdc by connecting a single resistor (shown as Rtrim in Figure 30) between the TRIM and GND pins of the module. Without an external resistor between TRIM pin and the ground, the output voltage of the module is
0.7525 Vdc. To calculate the value of the resistor Rtrim for a particular output voltage Vo, use the following equation:
Rtrim
7525.0
Vo
21070
= 5110
For example, to program the output voltage of the Austin MicroLynx follows:
TM
II module to 1.8 Vdc, Rtrim is calculated is
21070
= 5110
Rtrim
7525.08.1
Ω= kRtrim 004.15
V
V
(+)
IN
(+)
O
Vout
TM
II SMT can
Ω
 
 
By using a 1% tolerance trim resistor, set point tolerance of ±2% is achieved as specified in the electrical specification. The POL Programming Tool, available at www.lineagepower.com under the Design Tools section, helps determine the required external trim resistor needed for a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the Austin MicroLynx resistor, R for margining-up the output voltage and by connecting a resistor, R pin for margining-down. Figure 31 shows the circuit configuration for output voltage margining. The POL Programming Tool, available at
www.lineagepower.com under the Design Tools
section, also calculates the values of R R
margin-down
Please consult your local Lineage Power technical representative for additional details.
TM
II modules by connecting a
, from the Trim pin to the ground pin
margin-up
margin-down
, from the Trim pin to the Output
and
margin-up
for a specific output voltage and % margin.
Vo
Rmargin-down
Austin Lynx or Lynx II Series
Q2
ON/OFF
GND
TRIM
R
trim
LOAD
Figure 30. Circuit configuration to program output voltage using an external resistor.
Table 1 provides Rtrim values required for some common output voltages.
Table 1
V
(V)
O, set
0.7525 Open
1.2 41.973
1.5 23.077
1.8 15.004
2.5 6.947
3.3 3.160
Rtrim (K)
Trim
Rtrim
GND
Q1
Figure 31. Circuit Configuration for margining Output voltage.
Rmargin-up
LINEAGE POWER 13
Page 14
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Feature Descriptions (continued)
Voltage Sequencing
Austin MicroLynxTM II series of modules include a sequencing feature, EZ-SEQUENCE users to implement various types of output voltage sequencing in their applications. This is accomplished via an additional sequencing pin. When not using the sequencing feature, either tie the SEQ pin to V it unconnected.
When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set-point voltage. The SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one volt basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin.
For proper voltage sequencing, first, input voltage is applied to the module. The On/Off pin of the module is left unconnected (or tied to GND for negative logic modules or tied to V
IN for positive logic modules) so that
the module is ON by default. After applying input voltage to the module, a minimum of 10msec delay is required before applying voltage on the SEQ pin. During this time, potential of 50mV (± 10 mV) is maintained on the SEQ pin. After 10msec delay, an analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a one-to-one volt bases until output reaches the set-point voltage. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules.
When using the EZ-SEQUENCE start-up of the module, pre-bias immunity feature during start-up is disabled. The pre-bias immunity feature of the module relies on the module being in the diode-mode during start-up. When using the EZ-SEQUENCE feature, modules goes through an internal set-up time of 10msec, and will be in synchronous rectification mode when voltage at the SEQ pin is applied. This will result in sinking current in the module if pre-bias voltage is present at the output of the module. When pre-bias immunity during start-up is required, the EZ-SEQUENCE must be disabled. For additional guidelines on using EZ­SEQUENCE
TM
feature of Austin MicroLynxTM II , contact Lineage Power technical representative for preliminary application note on output voltage sequencing using Austin Lynx II series.
TM
that enables
TM
feature to control
IN or leave
TM
TM
feature
LINEAGE POWER 14
Page 15
Data Sheet
A
W
September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Thermal Considerations
Power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation.
Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure
33. Note that the airflow is parallel to the long axis of the module as shown in figure 32. The derating data applies to airflow in either direction of the module’s long axis.
Air Flow
T
(inductor winding)
ref1
Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board­Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures.
25.4_
ind Tunnel
PWBs
x
7.24_
(0.285)
ir
(1.0)
Power Module
76.2_
(3.0)
Probe Location for measuring airflow and ambient temperature
flow
Top View
T
ref2
Bottom View
Figure 32. T
The thermal reference point, T specifications of thermal derating curves is shown in Figure 32. For reliable operation this temperature should not exceed 125
The output power of the module should not exceed the rated power of the module (Vo,set x Io,max).
Temperature measurement location.
ref
used in the
ref 1
o
C.
Figure 33. Thermal Test Set-up.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by various module versus local ambient temperature (T (200 ft./min) are shown in the Characteristics Curves section.
) for natural convection and up to 1m/s
A
LINEAGE POWER 15
Page 16
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Top View
Side View
Bottom View
PIN FUNCTION
1 On/Off
2 VIN
3 SEQ
4 GND
5 Trim
6 VOUT
Co-planarity (max): 0.102 [0.004]
LINEAGE POWER 16
Page 17
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Surface Mount Pad Layout – Component side view.
LINEAGE POWER 17
Page 18
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Packaging Details
The Austin MicroLynxTM II SMT versions are supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions
Outside Dimensions: 330.2 mm (13.00)
Inside Dimensions: 177.8 mm (7.00”)
Width 44.0 mm (1.73”)
LINEAGE POWER 18
Page 19
Data Sheet September 10, 2013
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Austin MicroLynx
Surface Mount Information
Pick and Place
The Austin MicroLynxTM II SMT modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and placing. The label meets all the requirements for surface mount processing, as well as safety standards and is able to withstand maximum reflow temperature. The label also carries product information such as product code, serial number and location of manufacture.
Figure 34. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and pick & placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MicroLynxTM II SMT power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than
o
235
C. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
TM
II SMT Non-isolated Power Modules:
connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures.
300
250
200
15 0
10 0
REFLOW TEMP (°C)
50
0
Peak T emp 235oC
Heat zone
oCs-1
max 4
Soak zone 30-240s
Preheat zo ne
oCs-1
max 4
REFLOW TIME (S)
Co o ling zo ne
oCs-1
1- 4
T
above
lim
o
205
C
Figure 35. Reflow Profile for Tin/Lead (Sn/Pb) process.
240
235
230
225
220
215
210
MAX TEMP SOLDER (°C)
205
200
0 102030405060
Figure 36. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process.
LINEAGE POWER 19
Page 20
Data Sheet September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MicroLynx II SMT modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 37.
MSL Rating
The Austin MicroLynx II modules have a MSL rating of 2a.
Storage and Handling
The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note (AN04-001).
300
Per J-STD-020 Rev. C
250
200
150
Heat ing Zone 1°C/Second
100
Reflow Temp (°C)
50
0
Peak Temp 260°C
* Min. Time Above 235°C 15 Seconds
*Time Above 217°C
60 Seconds
Reflow Time (Seconds)
Cooling Zone
Figure 37. Recommended linear reflow profile using Sn/Ag/Cu solder.
LINEAGE POWER 20
Page 21
Data Sheet
a
©
September 10, 2013
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SMT Non-isolated Power Modules:
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
Device Code
ATH006A0X-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT 108988358
ATH006A0X-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT CC109104535
ATH006A0X4-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108988366
ATH006A0X4-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108996708
Input
Voltage Range
-Z refers to RoHS compliant parts
Output
Voltage
Output
Current
Efficiency
3.3V@ 6A
On/Off
Logic
Connector
Type
Comcodes
Asia-Pacific Headquarters
Tel: + 65 6593 7211
World Wide Headquarters Lineage Power Corporation
601 Shil oh Roa d, Plano, TX 75074, USA +1-800-526-7 819 (Outsi de U.S.A.: +1-972-244-9428)
www.lineagepower.com e-mail: techs upport1@lineagepower.com
Linea ge Power res erves th e right to make change s to the prod uct(s) or i nformat ion contained herein without not ice. No l iability is assumed as a result o f their use or
pplication . No righ ts under any patent accompany the sal e of an y such produc t(s) or informati on.
Linea ge Power D C-DC pro ducts are p rotected unde r various pa tents. Infor mation on these pa tents is av ailable at ww w.line agepower .com/paten ts.
2009 Line age Power Corporation, (Plan o, Texas) All Inte rnation al Rights Reserved.
Europe, Middle-East and Africa Headquarters
Tel: + 49 898 780 672 80
India Headquarters Tel: + 91 80 2841163 3
LINEAGE POWER 21
Document No: DS03-107 ver. 1.05
PDF name:
microlynx_II_smt_ds.pdf
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