Page 1
Data Sheet
October 2, 2009
Austin Microlynx
2.4Vdc – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A Output Current
TM
II SIP Non-isolated Power Modules:
RoHS Compliant
EZ-SEQUENCE
TM
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Flexible output voltage sequencing EZ-
SEQUENCE
Delivers up to 6A output current
High efficiency – 96% at 3.3V full load (V
Small size and low profile:
25.4 mm x 12.7mm x 6.68 mm
(1.00 in x 0. 5 in x 0.263 in)
Low output ripple and noise
High Reliability:
Calculated MTBF = 12.8M hours at 25
Programmable Output voltage
Line Regulation: 0.3% (typical)
Load Regulation: 0.4% (typical)
Temperature Regulation: 0.4 % (typical)
Remote On/Off
Output overcurrent protection (non-latching)
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA
60950-1-03 Certified, and VDE
(EN60950-1) Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
TM
†
C22.2 No.
‡
0805:2001-12
= 5.0V)
IN
o
C Full-load
Description
Austin MicroLynxTM II SIP power modules are non-isolated dc-dc converters that can deliver up to 6A of output
current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated output voltage
programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (V
5.5Vdc). Austin MicroLynx
various types of output voltage sequencing when powering multiple modules on board. Their open-frame
construction and small footprint enable designers to develop cost- and space-efficient solutions. In addition to
sequencing, standard features include remote On/Off, programmable output voltage and over current protection.
* UL is a re gistered trademark of Underwriters Laboratories, Inc.
†
CSA is a reg istered trademark of Canadian Standards Associ ation.
‡
VDE is a t rademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Orga nization of Standards
TM
II has a sequencing feature, EZ-SEQUENCETM that enable designers to implement
Document No: DS04-024 ver. 1.23
PDF name: microlynx_II_sip_ds.pdf
= 2.4 –
IN
Page 2
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3. 63Vdc Output; 6A output current
TM
II SIPNon-isolated Power Modules:
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All V
Continuous
IN
Sequencing voltage All Vseq -0.3 V
Operating Ambient Temperature All T
A
-0.3 5.8 Vdc
Vdc
IN,max
-40 85 °C
(see Thermal Considerations section)
Storage Temperature All T
stg
-55 125 °C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage Vo,set ≤ 3.63 VIN 2.4
Maximum Input Current All I
(VIN= V
Input No Load Current V
IN, min
to V
IN, max
, IO=I
) 6.0
O, max
= 0.75 Vdc I
O,set
IN,max
IN,No load
Adc
20 mA
⎯
5.5 Vdc
(VIN = V
Input Stand-by Current All I
(VIN = V
, Io = 0, module enabled) V
IN, nom
, module disabled)
IN, nom
= 3.3Vdc I
O,set
IN,No load
IN,stand-by
45 mA
0.6 mA
Inrush Transient All I2t 0.04 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; V
V
= I
IN, max, IO
; See Test configuration section)
Omax
IN, min
to
All 35 mAp-p
Input Ripple Rejection (120Hz) All 30 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being
part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to
achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fastacting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in
this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be
used. Refer to the fuse manufacturer’s data sheet for further information.
LINEAGE POWER 2
Page 3
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All V
(VIN=
IN, min
, IO=I
, TA=25°C)
O, max
Output Voltage All V
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Adjustment Range All V
Selected by an external resistor
O, set
O, set
O
Output Regulation
Line (VIN=V
Load (IO=I
Temperature (T
IN, min
O, min
to V
to I
ref=TA, min
) All
IN, max
) All
O, max
to T
) All ⎯ 0.4
A, max
Output Ripple and Noise on nominal output
(VIN=V
IN, nom
and IO=I
O, min
to I
O, max
Cout = 1μF ceramic//10μFtantalum capacitors)
RMS (5Hz to 20MHz bandwidth) All
Peak-to-Peak (5Hz to 20MHz bandwidth) All
External Capacitance
ESR ≥ 1 mΩ All C
ESR ≥ 10 mΩ All C
Output Current All I
Output Current Limit Inception (Hiccup Mode ) All I
(VO= 90% of V
)
O, set
Output Short-Circuit Current All I
(VO≤250mV) ( Hiccup Mode )
Efficiency V
VIN= V
IO=I
, TA=25°C V
IN, nom
= V
O, max , VO
V
O,set
V
V
V
= 0.75Vdc η 81.0 %
O, set
= 1.2Vdc η 87.0 %
O, set
= 1.5Vdc η 89.0 %
O,set
= 1.8Vdc η 90.0 %
O,set
= 2.5Vdc η 93.0 %
O,set
= 3.3Vdc η 96.0 %
O,set
Switching Frequency All f
O, max
O, max
o
O, lim
O, s/c
sw
Dynamic Load Response
(dIo/dt=2.5A/μs; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 50% to 100% of
Io,max; 1μF ceramic// 10 μF tantalum
All V
pk
Peak Deviation
Settling Time (Vo<10% peak deviation)
(dIo/dt=2.5A/μs; VIN = V
IN, nom
; TA=25°C)
Load Change from Io= 100% to 50%of Io,max:
1μF ceramic// 10 μF tantalum
All t
All V
s
pk
Peak Deviation
Settling Time (Vo<10% peak deviation)
All t
s
-2.0
–3.0
⎯
⎯
+2.0 % V
+3.0 % V
0.7525 3.63 Vdc
⎯
⎯
⎯
⎯
0.3
0.4
⎯
⎯
⎯
10 15 mV
40 50 mV
% V
% V
% V
⎯ ⎯
⎯ ⎯
1000 μF
3000 μF
0 6 Adc
⎯
⎯
220
2
⎯
⎯
⎯
⎯
⎯
⎯
⎯
300
130
25
130
25
⎯
⎯
⎯ μs
⎯
⎯ μs
pk-pk
% I
Adc
kHz
mV
mV
O, set
O, set
O, set
O, set
O, set
rms
o
LINEAGE POWER 3
Page 4
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Dynamic Load Response
(dIo/dt=2.5A/μs; V VIN = V
Load Change from Io= 50% to 100% of Io,max;
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
(dIo/dt=2.5A/μs; VIN = V
Load Change from Io= 100% to 50%of Io,max:
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation)
IN, nom
IN, nom
; TA=25°C)
; TA=25°C)
All V
All t
All V
All t
pk
s
pk
s
⎯
⎯
⎯
⎯
50
50
50
50
⎯
⎯ μs
⎯
⎯ μs
mV
mV
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (IO=I
per Telecordia SR-332 Issue 1: Method 1 Case 3
Weight
, TA=25°C) 12,841,800 Hours
O, max
⎯
2.8 (0.1)
⎯
g (oz.)
LINEAGE POWER 4
Page 5
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal interface
Device code with Suffix “4” – Positive logic
(On/Off is open collector/drain logic input;
Signal referenced to GND - See feature description
Input High Voltage (Module ON) All VIH ― ― V
Input High Current All IIH ― ― 10 μA
Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V
Input Low Current All IIL ― 0.2 1 mA
Device Code with no suffix – Negative Logic
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Input High Voltage (Module OFF) All VIH 1.5 ― V
Input High Current All IIH 0.2 1 mA
Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc
Input low Current All IIL ― 10 μA
Turn-On Delay and Rise Times
(IO=I
Case 1: On/Off input is set to Logic Low (Module
O, max , VIN
= V
= 25 oC, )
IN, nom, TA
All Tdelay ― 3.9 ― msec
ON) and then input power is applied (delay from
instant at which V
Case 2: Input power is applied for at least one second
=V
IN
until Vo=10% of Vo,set)
IN, min
All Tdelay ― 3.9 ― msec
and then the On/Off input is set to logic Low (delay from
instant at which Von/Off=0.3V until Vo=10% of Vo, set)
Output voltage Rise time (time for Vo to rise from 10%
of V
o,set to 90% of Vo, set)
All Trise
Output voltage overshoot – Startup ―
IO= I
; VIN = 2.4 to 5.5Vdc, TA = 25 oC
O, max
Sequencing Delay time
Delay from V
to application of voltage on SEQ pin All TsEQ-delay 10 msec
IN, min
Tracking Accuracy (Power-Up: 2V/ms) All
(Power-Down: 1V/ms) All
(V
IN, min
to V
IN, max
; I
to I
O, min
VSEQ < Vo)
O, max
Overtemperature Protection
(See Thermal Consideration section)
Input Undervoltage Lockout
Turn-on Threshold All
Turn-off Threshold All
SEQ –Vo |
|V
SEQ –Vo |
|V
All T
ref
V
IN, max
Vdc
IN,max
― 4.2 8.5 msec
1
% V
O, set
100 200 mV
200 400 mV
⎯
150
⎯
°C
2.2 V
2.0 V
LINEAGE POWER 5
Page 6
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Characteristic Curves
The following figures provide typical characteristics for the Austin MicroLynxTM II SIP modules at 25ºC.
91
88
85
82
79
76
73
EFFICIENCY, η (%)
70
0 12 3456
VIN=2.4V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current
(Vout = 0.75Vdc).
94
91
88
85
82
79
76
73
EFFICIENCY, η (%)
70
0123456
VIN=2.4V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A)
Figure 2. Converter Efficiency versus Output Current
(Vout = 1.2Vdc).
98
95
92
89
86
83
80
EFFICIENCY, η (%)
77
74
0 123456
OUTPUT CURRENT, IO (A)
Figure 4. Converter Efficiency versus Output Current
(Vout = 1.8Vdc).
98
95
92
89
86
83
80
77
EFFICIENCY, η (%)
74
0 123456
OUTPUT CURRENT, IO (A)
Figure 5. Converter Efficiency versus Output Current
(Vout = 2.5Vdc).
VIN=2.4V
VIN=5V
VIN=5.5V
VIN=3 V
VIN=5V
VIN=5.5 V
94
91
88
85
82
79
76
73
EFFICIENCY, η (%)
70
0 123456
VIN=2.4V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A)
Figure 3. Converter Efficiency versus Output Current
(Vout = 1.5Vdc).
98
95
92
89
86
83
80
EFFICIENCY, η (%)
77
74
0 123456
VIN=4 .5V
VIN=5V
VIN=5.5V
OUTPUT CURRENT, IO (A)
Figure 6. Converter Efficiency versus Output Current
(Vout = 3.3Vdc).
LINEAGE POWER 6
Page 7
Data Sheet
(V)
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Characteristic Curves (continued)
The following figures provide typical characteristics for the MicroLynxTM II SIP modules at 25ºC.
7
6
(A)
5
IN
4
3
2
1
INPUT CURRENT, I
0
1 1.75 2.5 3.25 4 4.75 5.5
Figure 7. Input voltage vs. Input Current
INPUT VOLTAGE, V
IN
(Vout =2.5Vdc).
Io =6 A
Io =3 A
Io =0 A
(V) (100mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUT VOLTAGE
I
TIME, t (5 μs/div)
Figure 10. Transient Response to Dynamic Load
Change from 50% to 100% of full load (Vo = 3.3Vdc).
(V) (20mV/div)
O
V
OUTPUT VOLTAGE
TIME, t (2μs/div)
Figure 8. Typical Output Ripple and Noise
(Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A).
(V) (20mV/div)
O
OUTPUT VOLTAGE
V
TIME, t (2μs/div)
Figure 9. Typical Output Ripple and Noise
(Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A).
(V) (100mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUT VOLTAGE
I
TIME, t (5 μs/div)
Figure 11. Transient Response to Dynamic Load
Change from 100% to 50% of full load (Vo = 3.3 Vdc).
(V) (100mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUT VOLTAGE
I
TIME, t (10μs/div)
Figure 12. Transient Response to Dynamic Load
Change from 50% to 100% of full load (Vo = 3.3 Vdc,
Cext = 2x150 μF Polymer Capacitors).
LINEAGE POWER 7
Page 8
Data Sheet
μ
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MicroLynxTM II SIP modules at 25ºC.
(V) (2V/div)
(V) (100mV/div)
O
(A) (2A/div) V
O
OUTPUT CURRENT, OUTPUTVOLTAGE
I
TIME, t (10μs/div)
Figure 13. Transient Response to Dynamic Load
Change from 100% of 50% full load (Vo = 3.3Vdc, Cext
= 2x150
F Polymer Capacitors).
IN
(V) (1V/div) V
o
V
OUTPUT VOLTAGE, INPUT VOLTAGE
TIME, t (2 ms/div)
Figure 16. Typical Start-Up with application of Vin
(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
(V) (2V/div)
On/off
V) (1V/div) V
O
V
OUTPUT VOLTAGE On/Off VOLTAGE
TIME, t (2 ms/div)
Figure 14. Typical Start-Up Using Remote On/Off
(Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A).
(V) (2V/div)
On/off
V) (1V/div) V
O
V
OUTPUT VOLTAGE On/Off VOLTAGE
F
igure 15. Typical Start-Up Using Remote On/Off with
TIME, t (2 ms/div)
Low-ESR external capacitors (7x150uF Polymer) (Vin
= 5.0Vdc, Vo = 3.3Vdc, Io = 6A, Co = 1050μF).
(V) (2V/div)
On/off
V) (1V/div) V
O
V
OUTPUT VOLTAGE On/Off VOLTAGE
Figure 17 Typical Start-Up Using Remote On/Off with
Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias
=1.0Vdc).
(A) (5A/div)
O
OUTPUT CURRENT,
I
TIME, t (5ms/div)
Figure 18. Output short circuit Current
(Vin = 5.0Vdc, Vo = 0.75Vdc).
LINEAGE POWER 8
Page 9
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MicroLynxTM II SIP modules.
7.5
6.0
4.5
3.0
1. 5
0.0
OUTPUT CURRENT, Io (A)
20 30 40 50 60 70 80 90
NC
0.5m/ s (100 LFM)
1.0m/s (200 LFM)
AMBIENT TEMPERATURE, TA OC
Figure 19. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 5.0,
Vo=3.3Vdc).
OUTPUT CURRENT, Io (A)
7.5
6.0
4.5
3.0
1. 5
0.0
20 30 40 50 60 70 80 90
NC
0.5m/s (100 LFM)
1.0m/s (200 LFM )
AMBIENT TEMPERATURE, TA OC
Figure 20. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 5.0Vdc,
Vo=0.75 Vdc).
7.5
8
6
5
NC
3
0 .5m/s (100 LFM )
2
1.0m/s (200 LFM)
0
OUTPUT CURRENT, Io (A)
20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE, TA OC
Figure 22. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 3.3dc,
Vo=0.75 Vdc).
6.0
4.5
3.0
1. 5
0.0
OUTPUT CURRENT, Io (A)
20 30 40 50 60 70 80 90
Figure 21. Derating Output Current versus Local
Ambient Temperature and Airflow
NC
0.5m/ s (100 LFM)
1.0m/s (200 LFM )
AMBIENT TEMPERATURE, TA OC
(Vin = 3.3Vdc,
Vo=2.5 Vdc).
LINEAGE POWER 9
Page 10
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Test Configurations
TO OSCILLOSCOPE
L
TEST
1μH
CS 1000μF
BATTERY
NOTE: Measure input reflected ripple current with a simulated
Electrolytic
E.S.R.<0.1Ω
@ 20°C 100kHz
source induct ance (L
possible battery impedance. Measure current as shown
above.
) of 1μH. Capacit or CS offsets
TEST
Figure 23. Input Reflected Ripple Current Test Setup.
COPPER STRIP
V
(+)
O
1uF .
COM
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
10uF
SCOPE
GROUND PLANE
Figure 24. Output Ripple and Noise Test Setup.
R
R
contact
distribution
R
R
contact
distribution
NOTE: All volt age meas urements to be taken at th e module
terminals , as shown above. If socket s are us ed then
Kelvin conn ections are requir ed at the modu le termi nals
to avoid measur ement err ors due to soc ket contact
resistance.
VIN(+)
V
IN
COM
Figure 25. Output Voltage and Efficiency Test Setup.
. I
V
O
Efficiency
=
η
VIN. I
O
IN
COM
V
O
2x100μF
Tantalum
CURRENT PROBE
CIN
RESISTIVE
LOAD
R
V
O
R
x 100 %
VIN(+)
COM
contactRdistribution
R
contactRdistribution
LOAD
Design Considerations
Input Filtering
The Austin MicroLynxTM II SIP module should be
connected to a low-impedance source. A highly
inductive source can affect the stability of the module.
An input capacitance must be placed directly adjacent
to the input pin of the module, to minimize input ripple
voltage and ensure module stability.
To minimize input voltage ripple, low-ESR polymer
and ceramic capacitors are recommended at the input
of the module. Figure 26 shows the input ripple
voltage (mVp-p) for various outputs with 1x150 µF
polymer capacitors (Panasonic p/n: EEFUE0J151R,
Sanyo p/n: 6TPE150M) in parallel with 1 x 47 µF
ceramic capacitor (Panasonic p/n: ECJ-5YB0J476M,
Taiyo- Yuden p/n: CEJMK432BJ476MMT) at full load.
Figure 27 shows the input ripple with 2x150 µF
polymer capacitors in parallel with 2 x 47 µF ceramic
capacitor at full load.
12 0
10 0
80
60
40
Vin = 3.3V
20
Vin = 5.0V
0
Input Ripple Voltage (mVp-p)
Output Voltage (Vdc)
Figure 26. Input ripple voltage for various output
with 1x150 µF polymer and 1x47 µF ceramic
capacitors at the input (80% of Io,max).
Input Ripple Voltage (mVp-p)
Output Voltage (Vdc)
Figure 27. Input ripple voltage for various output
with 2x150 µF polymer and 2x47 µF ceramic
capacitors at the input (80% of Io,max).
01234
12 0
10 0
80
60
40
Vin = 3.3V
20
V in = 5.0V
0
01234
LINEAGE POWER 10
Page 11
Data Sheet
October 2, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Austin MicroLynx
Design Considerations (continued)
Output Filtering
The Austin MicroLynxTM II SIP module is designed for low
output ripple voltage and will meet the maximum output
ripple specification with 1 µF ceramic and 10 µF tantalum
capacitors at the output of the module. However,
additional output filtering may be required by the system
designer for a number of reasons. First, there may be a
need to further reduce the output ripple and noise of the
module. Second, the dynamic response characteristics
may need to be customized to a particular load step
change.
To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at
the output can be used. Low ESR polymer and ceramic
capacitors are recommended to improve the dynamic
response of the module. For stable operation of the
module, limit the capacitance to less than the maximum
output capacitance as specified in the electrical
specification table.
TM
II SIP Non-isolated Power Modules:
Safety Considerations
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards,
i.e., UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE
0850:2001-12 (EN60950-1) Licensed.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements. The power
module has extra-low voltage (ELV) outputs when all
inputs are ELV.
The input to these units is to be provided with a fastacting fuse with a maximum rating of 6A in the positive
input lead
.
LINEAGE POWER 11
Page 12
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Feature Description
Remote On/Off
The Austin LynxTM II SIP power modules feature an
On/Off pin for remote On/Off operation. Two On/Off logic
options are available in the Austin Lynx
modules. Positive Logic On/Off signal, device code suffix
“4”, turns the module ON during a logic High on the
On/Off pin and turns the module OFF during a logic Low.
Negative logic On/Off signal, no device code suffix, turns
the module OFF during logic High on the On/Off pin and
turns the module ON during logic Low.
For positive logic modules, the circuit configuration for
using the On/Off pin is shown in Figure 28. The On/Off
pin is an open collector/drain logic input signal (Von/Off)
that is referenced to ground. During a logic-high (On/Off
pin is pulled high internal to the module) when the
transistor Q1 is in the Off state, the power module is ON.
Maximum allowable leakage current of the transistor
when Von/off = V
is 10µA. Applying a logic-low
IN,max
when the transistor Q1 is turned-On, the power module is
OFF. During this state VOn/Off must be less than 0.3V.
When not using positive logic On/off pin, leave the pin
unconnected or tie to V
IN.
VIN+
ON/OFF
R1
I
ON/OFF
GND
+
V
ON/OFF
Q1
_
Figure 28. Circuit configuration for using positive
logic On/OFF.
For negative logic On/Off devices, the circuit
configuration is shown is Figure 29. The On/Off pin is
pulled high with an external pull-up resistor (typical R
= 5k, +/- 5%). When transistor Q1 is in the Off state, logic
High is applied to the On/Off pin and the power module is
Off. The minimum On/off voltage for logic High on the
On/Off pin is 1.5Vdc. To turn the module ON, logic Low
is applied to the On/Off pin by turning ON Q1. When not
using the negative logic On/Off, leave the pin
unconnected or tie to GND.
R2
R3
R4
Q2
TM
II series
MODULE
PWM Enable
Q3 CSS
pull-up
VIN+
ON/OFF
GND
R
pull-up
I
ON/OFF
V
ON/OFF
Q1
+
_
MODULE
PWM Enable
R1
Q2 CSS
R2
Figure 29. Circuit configuration for using negative
logic On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current limiting
continuously. At the point of current-limit inception, the
unit enters hiccup mode. The unit operates normally once
the output current is brought back into its specified range.
The typical average output current during hiccup is 2A.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, module operation is disabled. The module will begin
to operate at an input voltage above the undervoltage
lockout turn-on threshold.
Overtemperature Protection
To provide over temperature protection in a fault
condition, the unit relies upon the thermal protection
feature of the controller IC. The unit will shutdown if the
thermal reference point T
the thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating. The
module will automatically restart after it cools down.
, exceeds 150oC (typical), but
ref
LINEAGE POWER 12
Page 13
Data Sheet
October 2, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Austin MicroLynx
Feature Descriptions (continued)
Output Voltage Programming
The output voltage of the Austin MicroLynxTM II SIP can
be programmed to any voltage from 0.75 Vdc to 3.3 Vdc
by connecting a single resistor (shown as Rtrim in Figure
30) between the TRIM and GND pins of the module.
Without an external resistor between TRIM pin and the
ground, the output voltage of the module is 0.7525 Vdc.
To calculate the value of the resistor Rtrim for a particular
output voltage Vo, use the following equation:
21070
Rtrim
⎢
−
7525.0
Vo
⎣
⎡
= 5110
For example, to program the output voltage of the Austin
MicroLynx
follows:
TM
II module to 1.8 Vdc, Rtrim is calculated is
21070
⎡
= 5110
Rtrim
⎢
−
7525.08.1
⎣
Ω= kRtrim 004.15
V
V
(+)
IN
(+)
O
−
−
Vout
⎤
Ω
⎥
⎦
⎤
⎥
⎦
TM
II SIP Non-isolated Power Modules:
electrical specification. The POL Programming Tool,
available at www.lineagepower.com under the Design
Tools section, helps determine the required external trim
resistor needed for a specific output voltage.
Voltage Margining
Output voltage margining can be implemented in the
Austin MicroLynx
resistor, R
for margining-up the output voltage and by connecting
a resistor, R
pin for margining-down. Figure 31 shows the circuit
configuration for output voltage margining. The POL
Programming Tool, available at
www.lineagepower.com under the Design Tools
section, also calculates the values of R
R
margin-down
Please consult your local Lineage Power technical
representative for additional details.
TM
II modules by connecting a
, from the Trim pin to the ground pin
margin-up
margin-down
for a specific output voltage and % margin.
Austin Lynx or
Lynx II Series
, from the Trim pin to the Output
and
margin-up
Vo
Rmargin-down
Q2
ON/OFF
TRIM
R
trim
GND
Figure 30. Circuit configuration to program output
voltage using an external resistor.
LOAD
Table 1 provides Rtrim values required for some common
output voltages.
Table 1
V
(V)
O, set
0.7525 Open
1.2 41.973
1.5 23.077
1.8 15.004
2.5 6.947
3.3 3.160
By using a 1% tolerance trim resistor, set point
tolerance of ±2% is achieved as specified in the
Rtrim (KΩ)
Trim
Rtrim
GND
Figure 31. Circuit Configuration for margining
Output voltage.
Q1
Rmargin-up
LINEAGE POWER 13
Page 14
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Feature Descriptions (continued)
Voltage Sequencing
Austin MicroLynxTM II series of modules include a
sequencing feature, EZ-SEQUENCE
users to implement various types of output voltage
sequencing in their applications. This is accomplished
via an additional sequencing pin. When not using the
sequencing feature, either tie the SEQ pin to V
it unconnected.
When an analog voltage is applied to the SEQ pin, the
output voltage tracks this voltage until the output reaches
the set-point voltage. The SEQ voltage must be set
higher than the set-point voltage of the module. The
output voltage follows the voltage on the SEQ pin on a
one-to-one volt basis. By connecting multiple modules
together, customers can get multiple modules to track
their output voltages to the voltage applied on the SEQ
pin.
For proper voltage sequencing, first, input voltage is
applied to the module. The On/Off pin of the module is
left unconnected (or tied to GND for negative logic
modules or tied to V
IN for positive logic modules) so that
the module is ON by default. After applying input voltage
to the module, a minimum of 10msec delay is required
before applying voltage on the SEQ pin. During this time,
potential of 50mV (± 10 mV) is maintained on the SEQ
pin. After 10msec delay, an analog voltage is applied to
the SEQ pin and the output voltage of the module will
track this voltage on a one-to-one volt bases until output
reaches the set-point voltage. To initiate simultaneous
shutdown of the modules, the SEQ pin voltage is lowered
in a controlled manner. Output voltage of the modules
tracks the voltages below their set-point voltages on a
one-to-one basis. A valid input voltage must be
maintained until the tracking and output voltages reach
ground potential to ensure a controlled shutdown of the
modules.
When using the EZ-SEQUENCE
start-up of the module, pre-bias immunity feature during
start-up is disabled. The pre-bias immunity feature of the
module relies on the module being in the diode-mode
during start-up. When using the EZ-SEQUENCE
feature, modules goes through an internal set-up time of
10msec, and will be in synchronous rectification mode
when voltage at the SEQ pin is applied. This will result in
sinking current in the module if pre-bias voltage is present
at the output of the module. When pre-bias immunity
during start-up is required, the EZ-SEQUENCE
must be disabled. For additional guidelines on using EZSEQUENCE
TM
feature of Austin MicroLynxTM II , contact
Lineage Power technical representative for preliminary
application note on output voltage sequencing using
Austin Lynx II series.
TM
that enables
IN or leave
TM
feature to control
TM
TM
feature
LINEAGE POWER 14
Page 15
Data Sheet
A
W
October 2, 2009
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
Austin MicroLynx
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel. The test set-up is shown in Figure
33. Note that the airflow is parallel to the long axis of the
module as shown in figure 32. The derating data applies
to airflow in either direction of the module’s long axis.
Air Flow
TM
II SIP Non-isolated Power Modules:
25.4_
ind Tunnel
PWBs
x
7.24_
(0.285)
ir
(1.0)
76.2_
(3.0)
flow
Power Module
Probe Location
for measuring
airflow and
ambient
temperature
Top View
Bottom View
Figure 32. T
The thermal reference point, T
specifications of thermal derating curves is shown in
Figure 32. For reliable operation this temperature should
not exceed 125
The output power of the module should not exceed the
rated power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame BoardMounted Power Modules” for a detailed discussion of
thermal aspects including maximum device temperatures.
Temperature measurement location.
ref
ref 1
o
C.
T
ref
used in the
Figure 33. Thermal Test Set-up.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by various module versus local ambient
temperature (T
(200 ft./min) are shown in the Characteristics Curves
section.
) for natural convection and up to 1m/s
A
LINEAGE POWER 15
Page 16
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3°C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb
solder, the recommended pot temperature is 260°C, while
the Pb-free solder pot is 270°C max. Not all RoHScompliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with your
Lineage Power technical representative for more details.
LINEAGE POWER 16
Page 17
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Top View
Side View
Bottom View
PIN FUNCTION
1 Vo
2 Trim
3 GND
A SEQ
4 VIN
5 On/Off
LINEAGE POWER 17
Page 18
Data Sheet
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
PIN FUNCTION
1 Vo
2 Trim
3 GND
A SEQ
4 VIN
5 On/Off
Through-Hole Pad Layout – Back view
LINEAGE POWER 18
Page 19
Data Sheet
a
©
October 2, 2009
Austin MicroLynx
2.4 – 5.5Vdc input; 0.75Vdc to 3.63Vdc Output; 6A output current
TM
II SIP Non-isolated Power Modules:
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
Device Code
Input
Voltage
Output
Voltage
Output
Current
Efficiency
3.3V@ 6A
Connector
Type
Comcodes
ATH006A0X 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP 108989018
ATH006A0XZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP CC109104717
ATH006A0X4 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP 108989026
ATH006A0X4Z 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP CC109104725
-Z refers to RoHS-compliant versions.
Asia-Pacific Headquarters
Tel: + 65 6593 7211
World Wide Headquarters
Lineage Power Corporation
601 Shil oh Roa d, Plano, TX 75074, USA
+1-800-526-7 819
(Outsi de U.S.A.: +1-972-244-9428)
www.lineagepower.com
e-mail: techs upport1@lineagepower.com
Linea ge Power res erves th e right to make change s to the prod uct(s) or i nformation c ontained herein without not ice. No l iability is assumed as a result o f their use or
pplication . No righ ts under any patent accompany the sal e of any s uch produc t(s) or informati on.
Linea ge Power D C-DC pro ducts are p rotected unde r various pa tents. Infor mation on these pa tents is av ailable at ww w.line agepower .com/paten ts.
2009 Line age Power Corporation, (Plan o, Texas) All Inte rnation al Rights Reserved.
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Tel: + 49 898 780 672 80
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Tel: + 91 80 2841163 3
LINEAGE POWER 19
Document No: DS04-024 ver. 1.23
PDF name: microlynx_II_sip_ds.pdf
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