FUJITSU MB90099 DATA SHEET

查询MB90099供应商
FUJITSU SEMICONDUCTOR
DATA SHEET
ASSP For Screen Display Control
CMOS
On-Screen Display Controller
MB90099
The MB90099 is an on-screen display controller for displaying text and graphics on the TV screen. The three­channel output control function, compact package and low vo ltage operation make this device suitable for on­screen displays in portable devices including camera-integrated VTRs and digital still cameras.
DS04-28828-3E
The MB90099 controls a display area of 28 characters b y 12 lines, and provides 1,024 diff erent char acters, each composed of 12 × 18 dots. All 1,024 characters in font R OM can be set b y the user . The displa y functions include a wealth of characters with qualifying functions such as character background shading (shadow casting) and individual character size setting, with 16-color display selection for each character. Also included are the line background, screen background, and sprite character functions, pro viding a wide v ariety of screen displa y capa­bilities.
FEATURES
• Character screen configuration :
• Character types : 1,024 characters (integrated in ROM, user definable through the entire area)
PACKAGE
28 characters × 12 lines (maximum)
(Continued)
20-pin plastic SSOP 20-pin plastic FLGA
(FPT-20P-M03) (LGA-20P-M01)
MB90099
(Continued)
• Font configuration : 12 × 18 dots (font ROM comfiguration) Horizontal/vertical character display size setting enabled.
Two horizontal width settings (S/L) per character.
S size : 6 dots L size : 12 dots
Two vertical height settings (HA/HB) per line.
HA : 18 dots HB : 12 dots
• Display modes : Character trimming : Enabled/Disabled (set for each line) Character background :
None/Solid-fill/Shaded background (concave) /Shaded background (convex) (set for each character)
Horizontal character merge/independent display with shaded bac kground (set f or each character)
V ertical line merge/independent display with shaded background (set for each line) Character background displa y extended to line spacings : Enabled/Disabled (set f or
each line)
• Character screen
display position control :
• Sprite character
control :
Line background :
None/Solid-fill/Shaded background (concave) /Shaded background (convex) (set for each line) (Display extends into left and right screen margins and into line spacings)
Character enlargement :
4 types : Normal, Double width, Double height, Double width × double height (set for each line) Enlarged character dot interpolation function (set for each line)
Horizontal display position :
Control in 2-dot units (movable through the entire screen)
Vertical display position :
Control in 2-dot units (movable through the entire screen)
Line spacing control :
Control in 1-dot units (set between 0 to 7 dots for each line, applied simultaneously to two areas above and below the line)
Sprite character display : Enable/Disabled Sprite character types : 256 types (character codes 000 Sprite character trimming : Enabled/Disabled Sprite character configuration : 2 types : 1 character/Stack of 2 characters Sprite character horizontal display position : Control in 1-dot units (mov ab le through
the entire screen)
to 0FFH)
H
• Screen background
control :
2
Sprite character vertical display position : Control in 1-dot units (movable through the entire screen)
Screen background color : Enabled/Disabled
• Display colors : Character color : 16 colors (set for each character) Character trimming color : 16 colors (set for each line) Character background color : 16 colors (set for each character) * Line background color : 16 colors (set for each line) Screen background color : 16 colors Sprite character color : 16 colors Sprite character trimming color : 16 colors Shaded background frame highlight color : 16 colors Shaded background frame shadow color : 16 colors
• Display signal
output :
• External interface : 16-bit serial input :
• Package : SSOP-20
• Supply voltage : 2.4 V to 3.6 V
Color signal output : 4 bits (supports 16 colors) Display period signals : 3 channels (output selector circuit provided)
Chip select Serial clock Serial data
FLGA-20
MB90099
* : Character background color (color code) = “0” is transparent (displays lower-layer color) .
3
MB90099
PIN ASSIGNMENTS
(TOP VIEW)
SCLK
CS
SIN
RESET
V
DD
SDR
N.C.
EXD
TEST
GND
SIN
1 2
3 4
5 6
7 8 9
10
20 19 18 17 16 15 14 13 12 11
SSOP-20
(FPT-20P-M03)
(TOP VIEW)
CS
HSYNC
SCLK
A2 A3 A4 A5
B1 B6
VSYNC
HSYNC VSYNC VC0
VC1 VC2 BLKA VC3 BLKB TESTO BLKC
VC0
RESET
V
DD
SDR
N.C.
EXD
C1 C6 D1 D6 E1 E6 F1 F6 G1 G6
H2 H3 H4 H5
TEST
GND
BLKC
TESTO
FLGA-20
(LGA-20P-M01)
VC1 VC2 BLKA VC3 BLKB
4
PIN DESCRIPTIONS
MB90099
Pin no.
SSOP FLGA
1A3SCLK I A
2A2 CS 3 B1 SIN I A Serial data input pin. This pin has an internal pull-up resistor.
4 C1 RESET 5D1 V
6E1SDR I C
7F1N.C. Not connected. This pin should be left open. 8 G1 EXD I B Display dot clock input pin.
9 H2 TEST I C LSI test input pin. Input a low level signal during normal use. 10 H3 GND Ground pin. 11 H4 BLKC O D Display period signal output pin for output channel C. 12 H5 TESTO O D LSI test output pin. This pin should be left open during normal use. 13 G6 BLKB O D Display period signal output pin for output channel B.
Pin name I/O
DD
+3 V power supply pin.
Circuit
type
Shift clock input pin for serial transfer. This pin has an internal pull­up resistor.
IA
I B Reset input pin. Input a low level signal at power-on time.
Chip select pin. Input a low level signal during serial transfer. This pin has an internal pull-up resistor.
Data input direction select pin for serial transfer. Input a low level signal at LSB-first transfer mode, or a high level signal at MSB-first transfer mode.
Function
15 E6 BLKA O D Display period signal output pin for output channel A. 14
16 17 18
19 A5 VSYNC 20 A4 HSYNC I B Horizontal synchronization signal input pin.
F6 D6 C6 B6
VC3 VC2 VC1 VC0
O O O O
I B Vertical synchronization signal input pin.
D Color code signal output pins.
5
MB90099
I/O CIRCUIT TYPES
Type Circuit Remarks
CMOS level, h ysteresis input, pull­up resistance
R
A
(25 k to 200 k) .
CMOS level, hysteresis input.
B
CMOS level input.
C
CMOS level output.
D
Output
6
BLOCK DIAGRAM
MB90099
SCLK CS SIN SDR
EXD
HSYNC VSYNC
Serial input control
Display control
Display memory (VRAM)
Font ROM
To controllers
Output control
VC3 VC2 VC1 VC0 BLKC BLKB BLKA
TEST
RESET
Test control block
TESTO
7
MB90099
COMPONENT ELEMENTS
• Serial input control block Receives serial commands and data. Decodes commands, and allocates commands and data to the appro­priate control blocks.
• Display control block Performs display control functions synchronized with the input sync signals.
• Display memory (VRAM) block VRAM memory for character data (24 bits × 28 characters × 12 lines) and line data (24 bits × 12 lines) .
•Font ROM block ROM memory for display character fonts. Configured for 1,024 characters of 12 dots × 18 dots.
• Output control block Generates output signals by applying display processing to the font data read from the font ROM.
• Test control block Circuits for factory testing of the LSI before delivery.
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ABSOLUTE MAXIMUM RATINGS
MB90099
(V
= 0 V)
GND
Parameter Symbol
Unit Remarks
Min. Max.
Rating
Power supply voltage V Input voltage V Output voltage V
DD
IN
OUT
V
0.5 V
GND
V
0.5 VDD + 0.5 V
GND
V
0.5 VDD + 0.5 V
GND
+ 4.0 V
GND
Power consumption Pd 100 mW Operating temperature Ta −20 +70 °C Storage temperature Tstg −55 +150 °C
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
(V
= 0 V)
GND
Value
Parameter Symbol
Unit Remarks
Min. Max.
Power supply voltage V “H” level input voltage 1 V “L” level input voltage 1 V “H” level input voltage 2 V
DD
IHS
ILS
IH
2.4 3.6 V
0.8 × V V
GND
0.7 × V
DD
DD
VDD + 0.3 V *1
0.2 × V
DD
VDD + 0.3 V *2
V*1
“L” level input voltage 2 V
IL
V
GND
0.3 × V
DD
V*2
Operating temperature Ta −20 +70 °C
*1 : Input pins excluding TEST and SDR pins. *2 : TEST and SDR input pins.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their FUJITSU representatives beforehand.
9
MB90099
ELECTRICAL CHARACTERISTICS
1. DC Characteristics
(V
= 0 V, Ta = −20 °C to +70 °C)
GND
Parameter
“H” level output voltage V
Sym-
bol
OH
Pin name Conditions
VC3, VC2, VC1, VC0, BLKC, BLKB, BLKA
“L” level output voltage V
“H” level input current I
OL
IH
SDR, HSYNC EXD, TEST,
“L” level input current I Pull-up resistance R
Power supply current I
IL
RESET SIN, SCLK, CS VDD = 3.3 V 25 50 200 k
PULL
V
CC
DD
Input capacitance C Except V
Value
Min. Typ. Max.
= 3.3 V
V
DD
I
= 4 mA
OH
VDD = 3.3 V I
= 4 mA
OL
VDD = 3.3 V V
= V
IH
, VSYNC,
DD
VDD = 3.3 V V
= 0 V
IL
VDD = 2.4 V f
= 8 MHz
DC
V
= 3.6 V
DD
f
= 8 MHz
DC
, GND 16 pF
DD
0.5 V
V
DD
V
GND
0.4 V
DD
+10 µA
−10 µA
 5mA
 6mA
Unit
V
10
2. AC Characteristics
(1) Serial input timings
(V
= 2.4 V to 3.6 V, V
DD
MB90099
= 0 V, Ta = −20 °C to +70 °C)
GND
Parameter Symbol Pin name
Shift clock cycle time t
t
Shift clock pulse width
Shift clock signal rise/fall time
Shift clock start time t Data setup time t Data hold time t Chip select end time t
Chip select signal rise/fall time
CS
0.8 VDD
0.2 VDD
CYC
WCH
t
WCL
t t
t
CRC
t
CFC
CR
CF
SS
SU
EC
Value
Unit
Min. Max.
SCLK 250 ns
100 ns
SCLK
100 ns
200 ns
SCLK
200 ns
SCLK 100 ns
100 ns
SIN
H
50 ns
CS 100 ns
200 ns
CS
200 ns
0.8 VDD
0.2 VDD
SCLK
SIN
tCFC
tSS
tCR tCR
tSU
tWCH
tCYC
tWCL
tCF
tH
0.8 VDD
0.2 VDD
tCRC
tEC
0.8 VDD
0.2 VDD
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