The MB90099 is an on-screen display controller for displaying text and graphics on the TV screen. The threechannel output control function, compact package and low vo ltage operation make this device suitable for onscreen displays in portable devices including camera-integrated VTRs and digital still cameras.
DS04-28828-3E
The MB90099 controls a display area of 28 characters b y 12 lines, and provides 1,024 diff erent char acters, each
composed of 12 × 18 dots. All 1,024 characters in font R OM can be set b y the user . The displa y functions include
a wealth of characters with qualifying functions such as character background shading (shadow casting) and
individual character size setting, with 16-color display selection for each character. Also included are the line
background, screen background, and sprite character functions, pro viding a wide v ariety of screen displa y capabilities.
FEATURES
■
• Character screen
configuration :
• Character types : 1,024 characters (integrated in ROM, user definable through the entire area)
PACKAGE
■
28 characters × 12 lines (maximum)
(Continued)
20-pin plastic SSOP20-pin plastic FLGA
(FPT-20P-M03) (LGA-20P-M01)
MB90099
(Continued)
• Font configuration : 12 × 18 dots (font ROM comfiguration)
Horizontal/vertical character display size setting enabled.
Two horizontal width settings (S/L) per character.
S size : 6 dots
L size : 12 dots
Two vertical height settings (HA/HB) per line.
HA : 18 dots
HB : 12 dots
• Display modes : Character trimming : Enabled/Disabled (set for each line)
Character background :
None/Solid-fill/Shaded background (concave) /Shaded background (convex)
(set for each character)
Horizontal character merge/independent display with shaded bac kground (set f or
each character)
V ertical line merge/independent display with shaded background (set for each line)
Character background displa y extended to line spacings : Enabled/Disabled (set f or
each line)
• Character screen
display position
control :
• Sprite character
control :
Line background :
None/Solid-fill/Shaded background (concave) /Shaded background (convex)
(set for each line)
(Display extends into left and right screen margins and into line spacings)
Character enlargement :
4 types : Normal, Double width, Double height, Double width × double height (set
for each line)
Enlarged character dot interpolation function (set for each line)
Horizontal display position :
Control in 2-dot units (movable through the entire screen)
Vertical display position :
Control in 2-dot units (movable through the entire screen)
Line spacing control :
Control in 1-dot units (set between 0 to 7 dots for each line, applied simultaneously
to two areas above and below the line)
Sprite character display : Enable/Disabled
Sprite character types : 256 types (character codes 000
Sprite character trimming : Enabled/Disabled
Sprite character configuration : 2 types : 1 character/Stack of 2 characters
Sprite character horizontal display position : Control in 1-dot units (mov ab le through
the entire screen)
to 0FFH)
H
• Screen background
control :
2
Sprite character vertical display position : Control in 1-dot units (movable through
the entire screen)
Screen background color : Enabled/Disabled
• Display colors : Character color : 16 colors (set for each character)
Character trimming color : 16 colors (set for each line)
Character background color : 16 colors (set for each character) *
Line background color : 16 colors (set for each line)
Screen background color : 16 colors
Sprite character color : 16 colors
Sprite character trimming color : 16 colors
Shaded background frame highlight color : 16 colors
Shaded background frame shadow color : 16 colors
• Display signal
output :
• External interface : 16-bit serial input :
• Package : SSOP-20
• Supply voltage : 2.4 V to 3.6 V
Color signal output : 4 bits (supports 16 colors)
Display period signals : 3 channels (output selector circuit provided)
Chip select
Serial clock
Serial data
FLGA-20
MB90099
* : Character background color (color code) = “0” is transparent (displays lower-layer color) .
3
MB90099
PIN ASSIGNMENTS
■
(TOP VIEW)
SCLK
CS
SIN
RESET
V
DD
SDR
N.C.
EXD
TEST
GND
SIN
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
SSOP-20
(FPT-20P-M03)
(TOP VIEW)
CS
HSYNC
SCLK
A2 A3 A4 A5
B1B6
VSYNC
HSYNC
VSYNC
VC0
VC1
VC2
BLKA
VC3
BLKB
TESTO
BLKC
VC0
RESET
V
DD
SDR
N.C.
EXD
C1C6
D1D6
E1E6
F1F6
G1G6
H2 H3 H4 H5
TEST
GND
BLKC
TESTO
FLGA-20
(LGA-20P-M01)
VC1
VC2
BLKA
VC3
BLKB
4
PIN DESCRIPTIONS
■
MB90099
Pin no.
SSOP FLGA
1A3SCLK I A
2A2 CS
3B1SINIASerial data input pin. This pin has an internal pull-up resistor.
4C1RESET
5D1 V
6E1SDR I C
7F1N.C. Not connected. This pin should be left open.
8G1EXDIBDisplay dot clock input pin.
9H2TESTICLSI test input pin. Input a low level signal during normal use.
10H3GNDGround pin.
11H4BLKCODDisplay period signal output pin for output channel C.
12H5TESTOODLSI test output pin. This pin should be left open during normal use.
13G6BLKBODDisplay period signal output pin for output channel B.
Pin nameI/O
DD
+3 V power supply pin.
Circuit
type
Shift clock input pin for serial transfer. This pin has an internal pullup resistor.
IA
IBReset input pin. Input a low level signal at power-on time.
Chip select pin. Input a low level signal during serial transfer. This
pin has an internal pull-up resistor.
Data input direction select pin for serial transfer. Input a low level
signal at LSB-first transfer mode, or a high level signal at MSB-first
transfer mode.
Function
15E6BLKAODDisplay period signal output pin for output channel A.
14
16
17
18
19A5VSYNC
20A4HSYNCIBHorizontal synchronization signal input pin.
F6
D6
C6
B6
VC3
VC2
VC1
VC0
O
O
O
O
IBVertical synchronization signal input pin.
DColor code signal output pins.
5
MB90099
I/O CIRCUIT TYPES
■
TypeCircuitRemarks
CMOS level, h ysteresis input, pullup resistance
R
A
(25 kΩ to 200 kΩ) .
CMOS level, hysteresis input.
B
CMOS level input.
C
CMOS level output.
D
Output
6
BLOCK DIAGRAM
■
MB90099
SCLK
CS
SIN
SDR
EXD
HSYNC
VSYNC
Serial input control
Display control
Display
memory
(VRAM)
Font ROM
To controllers
Output
control
VC3
VC2
VC1
VC0
BLKC
BLKB
BLKA
TEST
RESET
Test control block
TESTO
7
MB90099
COMPONENT ELEMENTS
■
• Serial input control block
Receives serial commands and data. Decodes commands, and allocates commands and data to the appropriate control blocks.
• Display control block
Performs display control functions synchronized with the input sync signals.
• Display memory (VRAM) block
VRAM memory for character data (24 bits × 28 characters × 12 lines) and line data (24 bits × 12 lines) .
•Font ROM block
ROM memory for display character fonts. Configured for 1,024 characters of 12 dots × 18 dots.
• Output control block
Generates output signals by applying display processing to the font data read from the font ROM.
• Test control block
Circuits for factory testing of the LSI before delivery.
8
ABSOLUTE MAXIMUM RATINGS
■
MB90099
(V
= 0 V)
GND
ParameterSymbol
UnitRemarks
Min.Max.
Rating
Power supply voltageV
Input voltageV
Output voltageV
DD
IN
OUT
V
− 0.5V
GND
V
− 0.5VDD + 0.5V
GND
V
− 0.5VDD + 0.5V
GND
+ 4.0V
GND
Power consumptionPd100mW
Operating temperatureTa−20+70 °C
Storage temperatureTstg−55+150 °C
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
RECOMMENDED OPERATING CONDITIONS
■
(V
= 0 V)
GND
Value
ParameterSymbol
UnitRemarks
Min.Max.
Power supply voltageV
“H” level input voltage 1V
“L” level input voltage 1V
“H” level input voltage 2V
DD
IHS
ILS
IH
2.43.6V
0.8 × V
V
GND
0.7 × V
DD
DD
VDD + 0.3V*1
0.2 × V
DD
VDD + 0.3V*2
V*1
“L” level input voltage 2V
IL
V
GND
0.3 × V
DD
V*2
Operating temperatureTa−20+70 °C
*1 : Input pins excluding TEST and SDR pins.
*2 : TEST and SDR input pins.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
9
MB90099
ELECTRICAL CHARACTERISTICS
■
1.DC Characteristics
(V
= 0 V, Ta = −20 °C to +70 °C)
GND
Parameter
“H” level output voltageV
Sym-
bol
OH
Pin nameConditions
VC3, VC2, VC1, VC0,
BLKC, BLKB, BLKA
“L” level output voltageV
“H” level input currentI
OL
IH
SDR,
HSYNC
EXD, TEST,
“L” level input currentI
Pull-up resistanceR
Power supply currentI
IL
RESET
SIN, SCLK, CSVDD = 3.3 V2550200kΩ
PULL
V
CC
DD
Input capacitanceCExcept V
Value
Min.Typ.Max.
= 3.3 V
V
DD
I
=−4 mA
OH
VDD = 3.3 V
I
= 4 mA
OL
VDD = 3.3 V
V
= V
IH
, VSYNC,
DD
VDD = 3.3 V
V
= 0 V
IL
VDD = 2.4 V
f
= 8 MHz
DC
V
= 3.6 V
DD
f
= 8 MHz
DC
, GND16pF
DD
− 0.5V
V
DD
V
GND
0.4V
DD
+10µA
−10µA
5mA
6mA
Unit
V
10
2.AC Characteristics
(1) Serial input timings
(V
= 2.4 V to 3.6 V, V
DD
MB90099
= 0 V, Ta = −20 °C to +70 °C)
GND
ParameterSymbolPin name
Shift clock cycle timet
t
Shift clock pulse width
Shift clock signal rise/fall time
Shift clock start timet
Data setup timet
Data hold timet
Chip select end timet
Chip select signal rise/fall time
CS
0.8 VDD
0.2 VDD
CYC
WCH
t
WCL
t
t
t
CRC
t
CFC
CR
CF
SS
SU
EC
Value
Unit
Min.Max.
SCLK250 ns
100ns
SCLK
100ns
200ns
SCLK
200ns
SCLK100ns
100ns
SIN
H
50ns
CS100ns
200ns
CS
200ns
0.8 VDD
0.2 VDD
SCLK
SIN
tCFC
tSS
tCRtCR
tSU
tWCH
tCYC
tWCL
tCF
tH
0.8 VDD
0.2 VDD
tCRC
tEC
0.8 VDD
0.2 VDD
11
MB90099
(2) Vertical and horizontal sync signal input timing
(V
= 2.4 V to 3.6 V, V
DD
= 0 V, Ta = −20 °C to +70 °C)
GND
ParameterSymbolPin name
Unit
Min.Max.
Value
Horizontal sync signal rise timet
HR
200ns
HSYNC
Horizontal sync signal fall timet
Vertical sync signal rise timet
HF
VR
200ns
200ns
VSYNC
Vertical sync signal fall timet
Horizontal sync signal pulse width *
1
VF
t
WH
HSYNC
200ns
18Dot clock
6µs
Vertical sync signal setup time1 *
(Except for VVE = 1, VHE = 1, HE = 1) *
Vertical sync signal setup time2 *
(VVE = 1, VHE = 1, HE = 1) *
Vertical sync signal detection hold timet
Vertical sync signal pulse widtht
2
3
2
3
t
t
VS
VS
VH
WV
VSYNC41H − 4Dot clock
VSYNC− 61H − 14Dot clock
VSYNC2H
VSYNC220H
*1 : During the horizontal sync signal pulse period, the MB90099 stops its internal operation, disabling writing to the
internal VRAM. Therefore, the horizontal sync signal pulse width and VRAM write cycle (command 2 or command
4 issuance cycle) should be set so that the horizontal sync signal pulse width is shorter than the VRAM write cycle.
*2 : In the vertical sync signal detection cycle, do not change the vertical sync signal (detection edge) when it is
close to the horizontal sync signal edge. This may result in distortion of the display due to fluctuations in the
sync signal.
*3 : VVE, VHE and HE are control bits of Command 13-0 (I/O pin control) .
VSYNC : Leading-edge operation (VVE = 0)
HSYNC
VSYNC
HSYNC
: VSYNC detection at the trailing edge (VHE = 1)
tVF
tVS
0.8 VDD
0.2 VDD
tHFtHR
tWH
0.8 VDD
0.2 VDD
tWV
0.8 VDD
0.2 VDD
tVH
tVR
0.8 VDD
0.2 VDD
(Continued)
12
(Continued)
MB90099
VSYNC
HSYNC
VSYNC
HSYNC
: Trailing-edge operation (VVE = 1)
: VSYNC detection at the trailing edge (VHE = 1 and HE = 0)
tVR
tWV
0.2 VDD
0.8 VDD
tVS
0.8 VDD
tHFtHR
tWH
0.2 VDD
VSYNC : Leading-edge operation (VVE = 0)
HSYNC
VSYNC
: VSYNC detection at the leading edge (VHE = 0)
tVF
tVS
0.8 VDD
0.2 VDD
0.8 VDD
0.2 VDD
tWV
tVF
tVH
0.8 VDD
0.2 VDD
tVR
tVH
0.8 VDD
0.2 VDD
tHFtHR
tWH
HSYNC
0.8 VDD
0.2 VDD
0.8 VDD
0.2 VDD
VSYNC : Trailing-edge operation (VVE = 1)
HSYNC
VSYNC
HSYNC
: VSYNC detection at the leading edge (VHE = 0) or (VHE = 1 and HE = 1)
tVR
tWV
0.2 VDD
tVS
0.8 VDD
tHFtHR
tWH
0.8 VDD
0.2 VDD
tVH
0.8 VDD
0.8 VDD
0.2 VDD
tVF
0.2 VDD
Note : The above diagrams assume that I/O pin control command (command 13-0) has set the sync signal input
logic control setting (SIX bit) to negative logic (“0”) . However, if the positive logic setting (SIX bit = “1”) is
used, the H and L levels are reversed.
13
MB90099
(3) Dot clock external input timing
(V
= 2.7 V to 3.3 V, V
DD
= 0 V, Ta = −20 °C to +70 °C)
GND
ParameterSymbolPin name
t
DCYC1
EXD112166ns*1
Dot clock cycle time
t
DCYC2
t
DWH1
EXD5683ns*2
EXD
t
DWL1
Dot clock pulse time
t
DWH2
EXD
t
DWL2
HSYNC, VSYNC setup timet
HSYNC
, VSYNC hold timet
Data output delay time 1t
Data output delay time 2t
Note : The above items assume a supply voltage of V
DS
DH
DD1
DD2
HSYNC,
VSYNC
VC3, VC2, VC1, VC0,
BLKA, BLKB, BLKC
= 2.7 V to 3.3 V.
DD
*1 : Assuming input frequency = dot clock × 1.
*2 : Assuming input frequency = dot clock × 2.
*3 : Assuming input frequency = dot clock × 1 or dot clock × 2.
Value
UnitNote
Min.Max.
48ns
48ns
24ns
24ns
13ns*3
0ns*3
7t
t
DD1
DD2
45ns
ns
*1
*2
*3
14
tDCYC1,tDCYC2
MB90099
tDWH1, tDWH2
tDWH1, tDWH2
EXD input
tDH
tDS
HSYNC input
VSYNC input
Data output
Sync signal
detection period *
tDD1
0.8 VDD
0.2 VDD
tDD2
Output undefined period
(Output transition period)
AC measurement conditions
C = 70 pF
t
= 5 ns
r
t
= 5 ns
f
= 0.8 V
V
OH
VOL = 0.2 V
VIH = 0.8 V
VIL = 0.2 V
DD
DD
DD
DD
* : Do not vary the input sync signal during the sync signal detection period.
Changes in the signal during this period may cause distortion in the display.
Command 0 sets the write address in VRAM, and controls the execution of “VRAM fill”. The write address is
specified by row and column addresses. VRAM fill is activ ated by executing char acter data setting 2 (command 2) .
1514131211109876543210
0000AY3AY2AY1AY0FL00AX4AX3AX2AX1AX0
AY3 to AY0 : Row address (0 to B
AX4 to AX0 : Column address (0 to 1B
FL : VRAM Fill control (0 : OFF, 1 : ON)
• Command 1 (Character data setting 1)
Command 1 specifies character data. The character data is written to VRAM and reflected on the screen by the
execution of command 2 (character data setting 2) .
1514131211109876543210
0001MO1MO0MM1MM0MB3MB2MB1MB0MC3MC2MC1MC0
MO1, MO0 : Character output control
MM1, MM0 : Character background control
(1, 1 : Convexed shaded)
MC3 to MC0 : Character color (16 colors)
MB3 to MB0 : Background color (16 colors)
• Command 2 (Character data setting 2)
)
H
)
H
Command 2 writes additional character data to the location in VRAM spacified by command 0 (VRAM write
address setting ),along with the character data set by command 1 (character data setting 1).
The VRAM write address is automatically incremented after command 2 is executed.
1514131211109876543210
0010MRMSM9M8M7M6M5M4M3M2M1M0
MR : Shaded background succeeding character merge control
(0 : Not merged with succeeding character)
(1 : Merged with succeeding character)
MS : Character horizontal size control
(0 : S size, 6 dots)
(1 : L size, 12 dots)
M9 to M0 : Character code
19
MB90099
• Command 3 (Line control data setting 1)
Command 3 specifies line control data. The line control data is written to VRAM and reflected on the screen by
the execution of command 4 (line control data setting 2) .
1514131211109876543210
0011LHSLW2LW1LW0LFDLFCLFBLFALF3LF2LF1LF0
LHS : Line character vertical size type control
(0 : Character vertical size A)
(1 : Character vertical size B)
LW2 to LW0 : Line spacing control
(0 to 7 dots, in 1-dot units)
LF3 to LF0 : Trimming color (16 colors)
LFD, LFC : Trimming output control
(0, 0 : All Off)
(0, 1 : Trimming On for a character only, no character background)
(1, 0 : Trimming On for a solid-fill character or no character background)
(1, 1 : All On)
LFB, LFA : Trimming control
(0, 0 : Trimming Off)
(0, 1 : Reserved (setting prohibited) )
(1, 0 : Reserved (setting prohibited) )
(1, 1 : Eight-direction trimming)
• Command 4 (Line control data setting 2)
Command 4 specifies additional line control data and writes this data, along with the line control data set by
command 3 (line control data setting 1) to the row address in VRAM specified by command 0 (VRAM write
address setting) .
Executing this command will not alter the VRAM write address.
1514131211109876543210
0100LDSLGSLG1LG0LDLELM1LM0L3L2L1L0
LDS : Line character output control (control of a character + trimming + character background)
(0 : Off, 1 : On)
LGS : Line enlargement interpolation control
(0 : Off, 1 : On)
LG1, LG0 : Line enlargement control
(0, 0 : Normal)
(0, 1 : Double width)
(1, 0 : Double height)
(1, 1 : Double width × double height)
LE : Character background extension control
(0 : Normal, 1 : Extended)
LD : Shaded background succeeding line merge control
(0 : Independent)
(1 : Merged with succeeding line)
20
MB90099
LM1, LM0 : Line background control
(0, 0 : Off)
(0, 1 : Solid fill)
(1, 0 : Concaved shaded)
(1, 1 : Convexed shaded)
L3 to L0 : Line background color (16 colors)
VVE : Edge selection for vertical synchronization detection*
1
(0 : Leading edge, 1 : Trailing edge)
VHE : HSYNC edge selection for vertical synchronization detection*
1
(0 : Leading edge, 1 : Trailing edge)
HE : Edge selection for horizontal synchronization operation*
1
(0 : Trailing edge, 1 : Leading edge)
SIX : Logic control for sync signal input
(0 : Negative logic, 1 : Positive logic)
DCX : Logic control for display color signal output
(0 : Positive logic, 1 : Negative logic) *
2
DBX : Logic control for display output period signal
(0 : Positive logic, 1 : Negative logic) *
2
24
MB90099
*1 : When it is set up VVE = 1, VHE = 1 and HE = 1, the vertical sync detection HSYNC edge is the standard of
“Leading edge”.
VVEVHEHEContents of vertical sync detection Position of vertical sync detection*
000Detection of VSYNC Leading edgeHSYNC Leading edge
001Detection of VSYNC Leading edgeHSYNC Leading edge
010Detection of VSYNC Leading edgeHSYNC Trailing edge
011Detection of VSYNC Leading edgeHSYNC Trailing edge
100Detection of VSYNC Trailing edgeHSYNC Leading edge
101Detection of VSYNC Trailing edgeHSYNC Leading edge
110Detection of VSYNC Trailing edgeHSYNC Trailing edge
111Detection of VSYNC Trailing edgeHSYNC Leading edge + 10 clock
* : If there is the change of level for direction of VSYNC pin signal detection in the vicinity of vertical sync
detection, it may occur disorder in the display (deflection of vertical direction) . Input the meaningful edge
of VSYNC signal without this position of vertical sync detection.
*2 : Input of an ’L’ level signal to the RESET
• Command 13-1 (Horizontal blanking control 1)
Command 13-1 controls the back porch of the horizontal blanking function.
1514131211109876543210
1101010000BB5BB4BB3BB2BB1BB0
BB5 to BB0 : Back porch control (0 to 126, in 2-dot units)
• Command 13-2 (Horizontal blanking control 2)
Command 13-2 controls the front porch of the horizontal blanking function.
1514131211109876543210
1101100BF8BF7BF6BF5BF4BF3BF2BF1BF0
BF8 to BF0 : Front porch control (0 to 1022, in 2-dot units)
pin will initialize DCX = 0, and DBX = 0.
25
MB90099
3.Notes on Issuing Commands
(1) Initialization
When a reset signal is input (“L” level signal input to the RESET
The contents of VRAM (the character RAM and the line RAM) are undefined.
Immediately after release of the input signal to the MB90099, issue the following commands to initializ e control
operation.
• Dot clock control 1 (command 11-2)
• I/O pin control (command 13-0)
This must be done before setting all command data and all RAM contents. (VRAM settings require normal dot
clock input and normal sync signal input.)
* : The reset input initializes control bits as follows.
Screen output control 1A (command 5-00)
SDS = 0Sprite Off
UDS = 0 Screen background Off
DSP = 0 Character, character background, line background Off
I/O pin control (command 13-0)
DCX = 0 VC0, VC1, VC2, VC3 pins set to positive logic output
DBX = 0 BLKA, BLKB, BLKC pins set to positive logic output
(2) Command refresh
Command data to the MB90099 and the contents of internal VRAM are stored as long as power is supplied to
the MB90099. However, there may be cases in which the serial control, sync, or dot clock signals become
abnormal due to causes such as external noise, preventing the internal registers and VRAM from being set
properly . It is therefore recommended that all command data and VRAM data be refreshed periodically to ensure
that this data is correct.
pin) , the MB90099 enters display-off state(*).
(3) Command issue timing
When any control command, including a VRAM write command such as a character data setting or line control
data setting command is issued, the command is ex ecuted immediately and the result is reflected on the screen.
When such a command is issued during a display period, the display in the relevant field may experience
momentary distor tion. To avoid this, it is recommended that commands be issued during the vertical blanking
interval. However that with a command 5-00 (screen output control 1A) in which one or more of the DSP, SDS,
or UDS control bits is switched from OFF to ON, the display will wait until the next vertical sync signal after the
command is issued and the display will start from the top of the scanning field.
26
CONTENTS OF MB90099-001 (STANDARD PRODUCT) FONT DATA
■
MB90099
27
MB90099
28
MB90099
29
MB90099
30
MB90099
FONT DEVELOPMENT AND DATA RELEASE
■
The MB90099 features the f ont ROM in which all 1024 characters are user-definable . For f ont data dev elopment,
use the OSDC pattern editor Ped/Win. Ped/Win is an OSCD proprietar y pattern editor for use on personal
computers operating Windows95/98/NT4.0 (Japanese language) environments.
The font development and data release flow is illustrated below.
Font development input
OSCD
pattern editor
Ped/Win
(supplied by FUJITSU)
Install
Run
Personal computer
(Windows95/98/NT)
Pattern printing
Printer
Project filePattern file
Font data release
(register with FUJITSU)
3-point data extraction for data release
Mask data specification writing
(1) Font data release
Font data is released in project files only. Pattern files should not be released. A portion of the pattern file data
will be used for data matching in order to verify registration of release data by FUJITSU. For this reason, users
are requested to write a portion of the pattern data content in mask data specifications.
Note : Pattern data output should not be generated until after the completion of font creation and project creation.
Also, the project file should not be updated after pattern file generation is completed. If the project contents
are updated after pattern file generation, pattern files should be generated again.
(2) Project files
After font data and other supplementary data is created, it is stored in a project file. Normally one project file is
created for each model.
•
Project file names
Project file names should be in the format “MB90099-XXX” where “XXX” is a ROM number assigned by
FUJITSU. Users should contact their FUJITSU sales representative. If no ROM number has been assigned,
any number preceded by an alphabetic character may be used. Project files which are developed solely for
test purposes and not intended for font release may be assigned any file name.
•
Comments related to new project files
Comment lines in the form of any desired character strings may be added at the time a project file is created.
Comments will be printed when the font is printed, and can be modified as needed whenev er that Ped/Win is
operating.
31
MB90099
(3) Pattern files
Font data may be placed in patter n files. Because pattern data is saved in the project file, normally it is only
necessary to create a pattern file at the time of font release for the purpose of extracting verification data (writing
to mask data specifications) . Pattern files should not be released.
•
Pattern file loading
Pattern files can be loaded for some OSCD models other than the MB90099.
•
Pattern file output generation
Do not create more than one pattern file for the same project. This may cause errors . In such cases, the
project name should be altered to create another project.
•
Extracting verification data
Three data points, the first and last addresses and one other random address, should be extracted from pattern
file data and written into the mask data specifications. The random address should not include the data values
“00” or “FF.”
Note : P ed/Win displa y functions are based on OSDC specifications, howe ver some displa y specifications ma y not
be identical to actual OSDC specifications. Users should consult specification documents for details.
(Data comparison)
After data release, once ROM mask processing is completed FUJITSU will extract the ROM data used in this
process. Users should verify that the extracted data is identical to the pattern file data that was submitted, and
return a written statement of data comparison indicating whether that data is identical or not . If the data is not
identical, contact FUJITSU’s sales representative immediately . Data errors may cause errors in ES production.
32
ORDERING INFORMATION
■
Part NumberPackageRemarks
MB90099PFV
MB90099
20-pin Plastic SSOP
(FPT-20P-M03)
MB90099LGA
20-pin Plastic FLGA
(LGA-20P-M01)
33
MB90099
PACKAGE DIMENSION
■
20-pin Plastic SSOP
(FPT-20P-M03)
*
6.50±0.10(.256±.004)
20
INDEX
LEAD No.
110
0.65(.026)
0.10(.004)
11
0.24±0.08
(.009±.003)
*
4.40±0.10 6.40±0.20
0.13(.005)
(.252±.008)(.173±.004)
M
* : These dimensions do not include resin protrusion.
0.17±0.03
(.007±.001)
Details of "A" part
+0.20
–0.10
1.25
(Mounting height)
+.008
.049 –.004
"A"
0~8°
0.50±0.20
(.020±.008)
0.45/0.75
(.018/.030)
0.10±0.10
(.004±.004)
0.25(.010)
(Stand off)
C
1999 FUJITSU LIMITED F20012S-3C-5
Dimensions in mm (inches)
(Continued)
34
(Continued)
20-pin plastic FLGA
(LGA-20P-M02)
5.50(.217)
INDEX AREA
4.00(.157)
1.30(.051)
Max.
3.25(.128)
4.55(.179)
3.25(.128)
0.65
(.026)
20-ø0.35(20-ø.014)
3-ø0.45(4-ø.018)
MB90099
6
5
4
3
0.45(.018)
2
1
ABCDEFGH
0.45(.018)
0.08(.003)
C
2001 FUJITSU LIMITED L20001S-c-1-1
Dimensions in mm (inches)
35
MB90099
FUJITSU LIMITED
All Rights Reserved.
The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales
representatives before ordering.
The information and circuit diagrams in this document are
presented as examples of semiconductor device applications, and
are not intended to be incorporated in devices for actual use. Also,
FUJITSU is unable to assume responsibility for infringement of
any patent rights or other rights of third parties arising from the use
of this information or circuit diagrams.
The products described in this document are designed, developed
and manufactured as contemplated for general use, including
without limitation, ordinary industrial use, general office use,
personal use, and household use, but are not designed, developed
and manufactured as contemplated (1) for use accompanying fatal
risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death,
personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic
control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for use requiring
extremely high reliability (i.e., submersible repeater and artificial
satellite).
Please note that Fujitsu will not be liable against you and/or any
third party for any claims or damages arising in connection with
above-mentioned uses of the products.
Any semiconductor devices have an inherent chance of failure. You
must protect against injury, damage or loss from such failures by
incorporating safety design measures into your facility and
equipment such as redundancy, fire protection, and prevention of
over-current levels and other abnormal operating conditions.
If any products described in this document represent goods or
technologies subject to certain restrictions on export under the
Foreign Exchange and Foreign Trade Law of Japan, the prior
authorization by Japanese government will be required for export
of those products from Japan.
F0202
FUJITSU LIMITED Printed in Japan
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