Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Pin Assignments
Top View
OUT
ILIM
FAULT
1
PAD
2
3
U-DFN2020-6
GND
EN
Top View
1
2
3
SOT26
6
IN
5
GND
EN
4
6
5
4
OUTIN
ILIM
FAU LT
Features
Up to 2.1A Maximum Load Current
Accurate Adjustable Current Limit, 75mA - 2360mA
±6% Accurate Adjustable Current Limit, 1.63A with R
Constant-Current (AP2552/53) During Over-Current
Output Latch-Off (AP2552A/53A) at Over-Current
Fast Short-Circuit Response Time: 2µs (typ)
Reverse Current Blocking During Shutdown and Reverse Current
Limiting During Enable
Operating Range: 2.7V - 5.5V
Built-in Soft-Start with 3ms Typical Rise Time
Over-Current , Output Over-Voltage and Thermal Protection
Fault Report (FAULT) with Blanking Time
ESD Protection: 2kV HBM, 500V CDM
Active Low (AP2552/52A) or Active High (AP2553/53A) Enable
Ambient Temperature Range: -40ºC to +85°C
SOT26 and U-DFN2020-6 Package: Available in “Green”Molding
EN — 3 — 4 I Enable input, logic high turns on power switch.
— — Pad Pad —
Pin Number
3 — 4 — I Enable input, logic low turns on power switch.
4 4 3 3 O
2 of 16
www.diodes.com
I/O Function
Input, connect a 0.1µF or greater ceramic capacitor from
IN to GND as close to IC as possible.
Active-low open-drain output, asserted during overcurrent, over-temperature, or reverse-voltage conditions.
Use external resistor to set current-limit threshold;
recommended 10k≦RLIM≦232k.
No internal connection; recommend to connect to GND
externally for improved power dissipation. . It should not
be used as electrical ground conduction path.
Notes: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
5. External capacitors need to be connected to the output, EVM board was tested with capacitor 2.2uF 50V 0805. This level is a pass test only and not a
limit.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when
handling and transporting these devices.
Maximum Continuous Load Current Internal Limited A
Note: 6. The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power and ground planes with
2-ounce copper traces on top and bottom of the board.
Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
IN
I
OUT
VENV
,EN
VIH
VIL
R
LIM
IO
TA
TJ
Input Voltage 2.7 5.5 V
Continuous Output Current (-40°C TA +85°C)
Enable Voltage 0 5.5 V
High-Level Input Voltage on EN or
Low-Level Input Voltage on EN or
EN
EN
Current-Limit Threshold Resistor Range
(1% initial tolerance)
= +25°C, VIN = 2.7V to 5.5V, VEN = 0V or VEN = VIN, R
A
= 10k, unless otherwise specified.)
FAULT
Symbol Parameter Test Conditions (Note 7) Min Typ Max Unit
Supply
V
V
I
UVLO
UVLO
SHDN
I
Q
I
REV
Input UVLO
Input UVLO Hysteresis
Input Shutdown Current
Input Quiescent Current
Reverse Leakage Current
VIN rising
VIN decreasing
= 5.5V, disabled, OUT = open
V
IN
= 5.5V, enabled, OUT = open, R
V
IN
V
= 5.5V, enabled, OUT = open, R
IN
Disabled, V
= 0V, V
IN
OUT
= 5.5V, I
= 20k
LIM
= 210k
LIM
at VIN
REV
2.4 2.65 V
25
0.1 1 µA
100 140 µA
80 120 µA
0.01 1 µA
Power Switch
70 95
135
80 105
150
1.1 1.5 ms
0.7 1 ms
0.5 ms
0.5 ms
R
DS(ON)
Switch On-Resistance
Output Turn-On Rise Time
tR
Output Turn-Off Fall Time
tF
SOT26 package,
U-DFN2020-6 package
V
= 5.5V, CL = 1µF, R
IN
VIN = 2.7V, CL = 1µF, R
V
= 5.5V, CL = 1µF, R
IN
VIN = 2.7V, CL = 1µF, R
T
= +25°C, V
J
= 5.0V
IN
-40°C TA +85°C
= +25°C, V
T
J
= 5.0V
IN
-40°C TA +85°C
= 100. See Figure 1
LOAD
= 100.
LOAD
= 100. See Figure 1
LOAD
= 100.
LOAD
0.1
0.1
Current Limit
2200 2365 2542
1540 1632 1730
1180 1251 1326
1160 1251 1340
500 530 562
485 529 573
121 142 162
50 75 100
2620
1820
1380
570
150
75
2
mA
I
LIMIT
I
SHORT
t
SHORT
Current-Limit Threshold
(maximum DC output current),
= V
V
OUT
IN
-0.5V
Short-Circuit Current Limit, OUT
Connected to GND
Short-Circuit Response Time
R
= 10k -40°C TA +85°C
LIM
R
= 15k -40°C TA +85°C
LIM
T
= +25°C
R
= 20k
LIM
R
= 49.9k
LIM
R
= 210k
LIM
I
shorted to IN or GND
LIM
= 10k
R
LIM
R
= 15k
LIM
R
= 20k
LIM
R
= 49.9k
LIM
R
= 210k
LIM
I
shorted to IN or GND
LIM
V
= 0V to I
OUT
OUT
= I
(OUT shorted to ground)
LIMIT
J
-40°C TA +85°C
T
= +25°C
J
-40°C TA +85°C
See Figure 2
Enable Pin
I
LEAK-EN
tON
t
OFF
EN Input Leakage Current
Turn-On Time
Turn-Off Time
V
IN
= 5V, V
= 0V and 6V
EN
-0.5
CL = 1µF, RL = 100. See Figure 1
CL = 1µF, RL = 100. See Figure 1
0.5 µA
3 ms
1 ms
Output Discharge
R
R
DIS_LATCH
Notes: 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.