Diodes AP2501, AP2511 User Manual

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AP2501/AP2511

2.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2501 and AP2511 are single channel current-limited

integrated high-side power switches optimized for Universal Serial

Bus (USB) and other hot-swap applications. The family of devices

complies with USB standards and is available with both polarities of

Enable input.

The devices have fast short-circuit response time for improved

overall system robustness, and have integrated output discharge

function to ensure completely controlled discharging of the output

voltage capacitor. They provide a complete protection solution for

applications subject to heavy capacitive loads and the prospect of

short circuit, and offer reverse current blocking, over-current, over-

temperature and short-circuit protection, as well as controlled rise

time and under-voltage lockout functionality. A 7ms deglitch

capability on the open-drain Flag output prevents false over-current

reporting and does not require any external components.

All devices are available in SO-8, MSOP-8, MSOP-8EP,

U-DFN3030-8 and U-DFN2020-6 packages.

Features

 Single channel current-limited power switch

 Output discharge function

 Fast short-circuit response time: 2µs

 3.7A accurate current limiting (typ)

 Reverse current blocking

 70mΩ on-resistance (typ)

 Input voltage range: 2.7V – 5.5V

 Built-in soft-start with 0.6ms typical rise time

 Over-current and thermal protection

 Fault report (FLG) with blanking time (7ms typ)

 ESD protection: 2kV HBM, 200V MM

 Active low (AP2501) or active high (AP2511) enable

 Ambient temperature range: -40°C to +85°C

 SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:

Available in “Green” Molding Compound (No Br, Sb)

 Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 UL Recognized, File Number E322375

 IEC60950-1 CB Scheme Certified

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Pin Assignments

(Top View)

GND

IN IN

EN

1

2

3

4

8

7

6

5

NC

OUT OUT

FLG

U-DFN3030-8

Typ e E

(Top View)

GND

IN

EN

U-DFN2020-6

Note: Latter with exposed pad

Applications

 LCD TVs & Monitors

 Set-Top-Boxes, Residential Gateways

 Laptops, Desktops, Servers, e-Readers

 Printers, Docking Stations, HUBs

(Top View)

GND

IN

EN

(SO-8)

(Top View)

1

2

3

4

MSOP-8/MSOP-8EP

(dotted line)

NC

OUT

FLG

NC

8

OUT

7

6

OUT

5

FLG

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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Typical Applications Circuit

Enable Active High (AP2511)

Power Supply

2.7V to 5.5V

10k

Available Options

Part Number Channel

AP2501 1 Active Low

AP2511 1 Active High

Enable Pin

(EN)

OFF

IN

0.1uF

FLG

ON

EN

Recommended Maximum

Continuous Load Current (A)

OUT

GND

2.5A 3.7A

0.1uF 120uF

Typical Current Limit

(A)

AP2501/AP2511

Load

Package

SO-8

MSOP-8

MSOP-8EP U-DFN3030-8 U-DFN2020-6

Pin Descriptions

Pin Number

Pin Name

GND 1 1 2 Ground

IN 2, 3 2, 3

EN 4 4 3 Enable Input. Active low (AP2501) or active high (AP2511).

FLG 5 5

OUT 6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally)

NC 8 8 6 No internal connection; recommend tie to OUT pins.

Exposed Pad Exposed Pad Not applicable Exposed Pad

MSOP-8EP,

U-DFN3030-8

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

SO-8,

MSOP-8

U-DFN2020-6

1 Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to

GND as close as possible. (all IN pins must be tied together externally)

4 Over-temperature and over-current fault reporting with 7ms deglitch; active

low open-drain output. FLG is disabled for 7ms after turn-on.

Exposed pad. It should be externally connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path.

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Function

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Functional Block Diagram

AP2501/AP2511

IN

UVLO

Current

Sense

Discharge

OUT

Control

EN

Driver

Thermal

Current

Limit

FLG

Deglitch

Sense

GND

Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Rating Unit

ESD HBM Human Body Model ESD Protection 2 kV

ESD MM Machine Model ESD Protection 200 V

VIN Input Voltage (Note 4) -0.3 to +6.5 V

V

Output Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V

OUT

V

Enable Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V

EN , VFLG

I

Maximum Continuous Load Current Internal Limited A

LOAD

T

Maximum Junction Temperature 150 °C

JMAX

TST Storage Temperature Range (Note 5) -65 to +150 °C

Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V

5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices

from -65°C to +150°C)

ST

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Unit

V

IN

I

OUT

VIH High-Level Input Voltage on EN 2.0 VIN V

VIL Low-Level Input Voltage on EN 0 0.8 V

TA Operating Ambient Temperature (Note 6), -40 +85 °C

Input voltage 2.7 5.5 V

Output Current 0 2.5 A

Note: 6. T

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

A(MAX)

= +70°C if V

≤ 4.1V and I

IN

= 2.5A to keep device from going into thermal protection.

OUT

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AP2501/AP2511

Electrical Characteristics (@ T

Symbol Parameter Conditions (Note 7) Min Typ Max Unit

V

Input UVLO VIN rising 1.6 2.0 2.4 V

UVLO

ΔV

Input UVLO Hysteresis VIN decreasing 50 mV

UVLO

I

R

I

SHORT

T

I

LEAK-EN

I

LEAK-O

T

R

T

Notes: 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V discharge function offers a resistive discharge path for the external storage capacitor for limited time.

9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

10. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

11. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground

Input Shutdown Current Disabled, OUT = open 0.1 1.0 µA

SHDN

I

Input Quiescent Current Enabled, OUT = open 60 100 µA

Q

Input Leakage Current Disabled, OUT grounded 0.1 1.0 µA

LEAK

I

Reverse Leakage Current Disabled, V

REV

Switch on-resistance

DS(ON)

Over-Load Current Limit (Note 7) V

LIMIT

I

Current limiting trigger threshold Output Current Slew rate (<100A/s) 3.7 A

TRIG

Short-Circuit Current Limit Enabled into short circuit 3.7 A

Short-Circuit Response Time V

SHORT

V

EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V

IL

V

EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V

IH

EN Input leakage VIN = 5V, V

Output leakage current Disabled, V

Output turn-on delay time CL = 1µF, R

D(ON)

TR Output turn-on rise time CL = 1µF, R

Output turn-off delay time CL = 1µF, R

D(OFF)

TF Output turn-off fall time CL = 1µF, R

FLG output FET on-resistance I

FLG

I

FLG Off Current V

FOH

FLG Blanking Time

BLANK

T

Discharge time CL= 1µF, VIN = 5V, disabled to V

DIS

R

Discharge resistance (Note 8) VIN = 5V, disabled, I

DIS

Thermal Shutdown Threshold Enabled 140

SHDN

Thermal Shutdown Hysteresis 20

HYS

Thermal Resistance Junction-to-

θJA

Ambient

= +25°C, VIN = +5.0V, C

A

= 0V, V

IN

V

= 5V, I

IN

VIN = 3.3V, I

= 5V, V

IN

= 0V to I

OUT

= 10mA 20 40 Ω

FLG

= 5V 0.01 1.00 µA

FLG

= 1A

OUT

= 4.5V -40°C≤ TA ≤85°C 2.8 3.7 4.6 A

OUT

= 0V and 5.5V 0.01 1.00 µA

EN

= 0V 0.5 1 µA

OUT

LOAD

Assertion or deassertion due to overcurrent and over-temperature condition

= 0.1µF, CL = 1µF,unless otherwise specified.)

IN

OUT

= 5V, I

at VIN 0.01 1.00 µA

REV

= 25oC 70 78

T

A

-40°C ≤ TA ≤ 85°C 105

= 25oC 90 108

T

= 1A

= I

(OUT shorted to ground) 2 µs

LIMIT

A

-40°C ≤ TA ≤ 85°C 135

= 5Ω 0.1 ms

= 5Ω 0.6 1.5 ms

= 5Ω 0.1 ms

= 5Ω 0.05 0.10 ms

4 7 15 ms

< 0.5V 0.6 ms

OUT

= 1mA 100 Ω

OUT

SO-8 (Note 9) 96

MSOP-8 (Note 9) 130

MSOP-8EP (Note 10) 92

U-DFN3030-8 (Note 10) 84

U-DFN2020-6 (Note 11) 90

mΩ

C

C/W

< V

UVLO

). The

IN

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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Typical Performance Characteristics

AP2501/AP2511

V

EN

V

OUT

50%

T

D(ON)

T

10%

R

Turn-On Delay and Rise Time

Vout 2V/div

Ven 5V/div

Iin 1A/div

Device Enable

V

EN

V

OUT

50%

T

D(ON)

90%

50%

T

D(OFF)

90%

10%

T

F

Figure 1 Voltage Waveforms: AP2501 (left), AP2511 (right)

All Enable Plots are for Enable Active Low

Turn-Off Delay and Fall Time

TA=25°C Vin=5V CL=1uF Rout=2.5Ω

Vout 2V/div

Ven 5V/div

Device Disable

Iin 1A/div

T

10%

50%

T

R

90%

D(OFF)

90%

10%

TA=25°C Vin=5V CL=1uF Rout=2.5Ω

T

F

Turn-On Delay and Rise Time

Vout 2V/div

Device Enable Ven 5V/div

Iin 1A/div

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

TA=25°C Vin=5V CL=120uF Rout=2.5Ω

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Turn-Off Delay and Fall Time

Vout 2V/div

Ven 5V/div

Device Disable

Iin 1A/div

TA=25°C Vin=5V CL=120uF Rout=2.5Ω

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Typical Performance Characteristics (cont.)

Device Enabled Into Short-Circuit

AP2501/AP2511

Inrush Current

Ven 5V/div

Iin 1A/div

Vout 2V/div

Iin 2A/div

FLG 5V/div

Full-Load to Short-Circuit

Transient Response

Output Short Circuit

Device Turns off and Re-enables Into Current-Limit

TA=25°C Vin=5V CL=120uF Rout=1Ω

TA=25°C Vin=5V Rout=2Ω

Ven 5V/div

CL=220uF

Iin 1A/div

CL=470uF

CL=120uF

Short-Circuit to Full-Load

Recovery Response

Output Short Circuit Removed

Vout 2V/div

Iin 2A/div

FLG 5V/div

Short Circuit Present Device Thermal Cycles

TA=25°C Vin=5V CL=120uF,220uF,470uF Rout=2.5Ω

=25°C

T

A

Vin=5V Rout=2Ω

No-Load to Short-Circuit

Transient Response

Vout 2V/div

Iin 2A/div

FLG 5V/div

Output Short Circuit

Device Enable Current-Limit

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

TA=25°C Vin=5V

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Short-Circuit to No-Load

Recovery Response

Output Short Circuit Removed Vout

2V/div

Iin 2A/div

Short Circuit Present Device

FLG 5V/div

Thermal Cycles

=25°C

T

A

Vin=5V

March 2013