The AP2401 and AP2411 are single channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and is available with both polarities of
enable input.
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for applications
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and
under-voltage lockout functionality. A 7ms deglitch capability on the
open-drain Flag output prevents false over-current reporting and does
not require any external components. AP2401 and AP2411 will be
latched off after 7ms deglitch.
All devices are available in SO-8, MSOP-8, MSOP-8EP,
U-DFN3030-8 and U-DFN2020-6 packages.
2.0A SINGLE CHANNEL CURRENT-LIMITED
Pin Assignments
GND
GND
IN
IN
EN
Note: Latter with exposed pad
AP2401/AP2411
POWER SWITCH WITH LATCH-OFF
(Top View)
1
IN
2
IN
3
4
ENFLG
SO-8
(Top View)
1
2
3
4
MSOP-8/MSOP-8EP
(dotted line)
(Top View)
8
7
6
5
NC
OUT
OUT
8
7
6
5
NC
OUT
OUT
FLG
1
Features
Single Channel Current-Limited Power Switch
Output Discharge Function
Output Current Latch-Off when OCP Triggered
Fast Short-Circuit Response Time: 2µs
2.5A Accurate Current Limiting
Reverse Current Blocking
70m On-Resistance
Input Voltage Range: 2.7V - 5.5V
Built-In Soft-Start with 0.6ms Typical Rise Time
Over-Current and Thermal Protection
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 2kV HBM, 200V MM
Active Low (AP2401) or Active High (AP2411) Enable
Ambient Temperature Range: -40°C to +85°C
SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:
Available in “Green” Molding Compound (No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
EN 4 4 3 Enable Input. Active low (AP2401) or active high (AP2411).
FLG 5 5
OUT
NC
Exposed Pad — Exposed Pad Exposed Pad
SO-8,
MSOP-8
2, 3 2, 3
6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally)
8 8 6 No Internal Connection. Recommend tie to OUT pins.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
Pin Number
MSOP-8EP,
U-DFN3030-8
U-DFN2020-6
1 Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to GND as close
as possible. (all IN pins must be tied together externally)
4 Over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain
output. FLG is disabled for 7ms after turn-on.
Exposed pad. It should be externally connected to GND plane and thermal mass for enhanced thermal impedance. Exposed pad should not be used as electrical ground
conduction path.
Maximum Continuous Load Current Internal Limited A
LOAD
T
Maximum Junction Temperature 150 °C
J(MAX)
TST Storage Temperature Range (Note 4) -65 to +150 °C
Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit
V
Input UVLO VIN rising 1.6 2.0 2.4 V
UVLO
V
Input UVLO Hysteresis VIN decreasing 50 mV
UVLO
I
I
R
I
I
SHORT
T
I
LEAK-EN
I
LEAK-O
T
T
R
T
T
T
Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.
8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.
Input Shutdown Current Disabled, OUT = open 0.1 1 µA
SHDN
I
Input Quiescent Current Enabled, OUT = open 60 100 µA
Q
Input Leakage Current Disabled, OUT grounded 0.1 1 µA
LEAK
I
Reverse Leakage Current Disabled, V
REV
Switch on-resistance
DS(ON)
Over-Load Current Limit
LIMIT
(Note 6)
I
Current limiting trigger threshold Output Current Slew rate (< 100A/s) 2.5 A
Trig
Short-Circuit Current Limit Enabled into short circuit 2.1 2.75 3.3 A
Short-circuit Response Time V
SHORT
V
EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V
IL
V
EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V
IH
EN Input leakage VIN = 5V, V
Output leakage current Disabled, V
Output turn-on delay time CL = 1µF, R
D(ON)
TR Output turn-on rise time CL = 1µF, R
Output turn-off delay time CL = 1µF, R
D(OFF)
TF Output turn-off fall time CL = 1µF, R
FLG output FET on-resistance I
FLG
I
FLG Off Current V
FOH
FLG blanking and latch off time
BLANK
T
Discharge time CL= 1µF, VIN = 5V, disabled to V
DIS
R
Discharge resistance (Note 7) VIN = 5V, disabled, I
DIS
Thermal Shutdown Threshold Enabled 140 °C
SHDN
Thermal Shutdown Hysteresis 20 °C
HYS
Thermal Resistance Junction-to-
JA
Ambient
= +25°C, VIN = +5.0V, C
A
= 0V, V
IN
= 5V, I
V
IN
VIN = 3.3V, I
VIN= 5V, V
= 0V to I
OUT
= 10mA 20 40
FLG
= 5V 0.01 1 µA
FLG
= 2.0A
OUT
= 2.0A
OUT
= 4.5V -40°C T
OUT
OUT
= 0V and 5.5V 0.01 1 µA
EN
= 0V 0.5 1 µA
OUT
= 5 0.1 ms
LOAD
= 5 0.6 1.5 ms
LOAD
= 5 0.1 ms
LOAD
= 5 0.05 0.1 ms
LOAD
Assertion or deassertion due to overcurrent and overtemperature condition