Dell T310 User Manual

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DELL
TECHNICAL GUIDEB O OK
PowerEdge T310 Technical Guide 0
Dell
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PowerEdge T310 Technical Guide 1
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Table of Contents
1 Overview ........................................................................................................................................... 6
1.1 Product Description ................................................................................................................... 6
1.2 Product Comparison ................................................................................................................. 7
2 New Technologies .......................................................................................................................... 10
2.1 Overview ................................................................................................................................. 10
2.2 Detailed Information ................................................................................................................ 10
2.2.1 Platform Features ................................................................................................................ 10
2.2.2 Processors .......................................................................................................................... 10
2.2.3 Software RAID .................................................................................................................... 11
2.2.4 Hardware RAID ................................................................................................................... 11
3 Systems Overview .......................................................................................................................... 12
4 Mechanical ...................................................................................................................................... 14
4.1 Chassis Description ................................................................................................................ 14
4.2 Dimensions and Weight .......................................................................................................... 14
4.3 Front Panel View and Features ............................................................................................... 15
4.4 Back Panel View and Features ............................................................................................... 16
4.5 Power Supply Indicators ......................................................................................................... 17
4.6 NIC Indicators ......................................................................................................................... 17
4.7 Side View ................................................................................................................................ 19
4.8 Internal Chassis Views ............................................................................................................ 19
4.9 Fan .......................................................................................................................................... 20
4.10 Control Panel/LCD .................................................................................................................. 21
4.11 Security ................................................................................................................................... 22
4.11.1 Cover Latch ..................................................................................................................... 22
4.11.2 Bezel ............................................................................................................................... 23
4.11.3 Hard Drive Access ........................................................................................................... 23
4.11.4 Trusted Platform Module (TPM) ...................................................................................... 24
4.11.5 Power Switch Security ..................................................................................................... 24
4.11.6 Intrusion Alert .................................................................................................................. 24
4.11.7 Secure Mode ................................................................................................................... 24
4.12 USB Key .................................................................................................................................. 24
4.13 Battery ..................................................................................................................................... 25
4.14 Field Replaceable Units (FRU) ............................................................................................... 26
4.15 User Accessible Jumpers, Sockets, and Connectors ............................................................. 26
5 Power, Thermal, Acoustic ............................................................................................................... 27
5.1 Power Supplies ....................................................................................................................... 27
5.2 Thermal ................................................................................................................................... 27
5.3 Acoustics ................................................................................................................................. 29
5.4 Other Environmental Requirements ........................................................................................ 31
5.4.1 Maximum Vibration ............................................................................................................. 31
5.4.2 Maximum Shock .................................................................................................................. 31
5.4.3 Airborne Contaminant Level ................................................................................................ 31
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5.5 Maximum Input Amps ............................................................................................................. 31
5.6 Energy Star Compliance ......................................................................................................... 31
6 Processors ...................................................................................................................................... 32
7 Memory ........................................................................................................................................... 33
7.1 Overview ................................................................................................................................. 33
7.2 DIMMs Supported ................................................................................................................... 33
7.3 Slots/Risers ............................................................................................................................. 35
7.4 Speed ...................................................................................................................................... 36
7.5 Sparing .................................................................................................................................... 38
7.6 Mirroring .................................................................................................................................. 38
7.7 RAID ........................................................................................................................................ 38
7.8 Supported Configurations ....................................................................................................... 38
8 Chipset ............................................................................................................................................ 40
8.1 Overview ................................................................................................................................. 40
8.2 Direct Media Interface (DMI) ................................................................................................... 40
8.3 PCI Express Interface ............................................................................................................. 40
8.4 SATA Interface ........................................................................................................................ 40
8.5 Advanced Host Controller Interface (AHCI) ............................................................................ 40
8.6 Intel Rapid Storage Technology .............................................................................................. 40
8.7 PCI Interface ........................................................................................................................... 41
8.8 Low Pin Count (LPC) Interface ............................................................................................... 41
8.9 Serial Peripheral Interface (SPI) ............................................................................................. 41
8.10 Compatibility Module (DMA Controller, Timer/Counters, Interrupt Controller) ........................ 41
8.11 Advanced Programmable Interrupt Controller (APIC) ............................................................. 41
8.12 Universal Serial Bus (USB) Controllers ................................................................................... 42
8.13 Real-Time Clock (RTC) ........................................................................................................... 42
8.14 General Purpose Inputs and Outputs (GPIO) ......................................................................... 42
8.15 Enhanced Power Management ............................................................................................... 42
8.16 Chipset Management .............................................................................................................. 42
8.17 System Management Bus (SMBus 2.0) .................................................................................. 43
8.18 Intel Anti-Theft Technology ..................................................................................................... 43
8.19 Intel Virtualization Technology for Directed I/O ....................................................................... 43
8.20 JTAG Boundary-Scan ............................................................................................................. 43
9 BIOS ............................................................................................................................................... 44
9.1 Overview ................................................................................................................................. 44
9.2 Supported ACPI States ........................................................................................................... 44
9.3 Power Management ................................................................................................................ 45
10 I/O Slots .......................................................................................................................................... 47
10.1 Overview ................................................................................................................................. 47
10.2 External Controller Cards ........................................................................................................ 49
10.3 PCI Card Dimensions .............................................................................................................. 49
11 Storage ........................................................................................................................................... 50
11.1 Overview ................................................................................................................................. 50
11.2 Drives ...................................................................................................................................... 50
11.3 RAID Configurations ............................................................................................................... 51
11.3.1 Back-Up Drives (Tape) .................................................................................................... 53
12 Video ............................................................................................................................................... 53
13 Rack Information ............................................................................................................................. 55
14 Operating Systems ......................................................................................................................... 56
15 Virtualization ................................................................................................................................... 58
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16 Systems Management .................................................................................................................... 59
16.1 Overview ................................................................................................................................. 59
16.2 Server Management ................................................................................................................ 59
16.3 Embedded Server Management ............................................................................................. 60
16.4 Lifecycle Controller and Unified Server Configurator .............................................................. 60
16.5 iDRAC6 Express ..................................................................................................................... 61
16.6 iDRAC6 Enterprise .................................................................................................................. 61
17 Peripherals ...................................................................................................................................... 63
17.1 USB Peripherals ...................................................................................................................... 63
17.2 External Storage ..................................................................................................................... 63
18 Packaging Options .......................................................................................................................... 64
Tables
Table 1. Comparison for PowerEdge Servers ..................................................................................... 7
Table 2. Product Features Summary ................................................................................................ 12
Table 3. Dimensions and Weight ...................................................................................................... 14
Table 4. NIC LED Activity .................................................................................................................. 18
Table 5. Environmental Specifications and Operating Requirements ............................................... 28
Table 6. Acoustical Specifications ..................................................................................................... 30
Table 7. Supported Processors ......................................................................................................... 32
Table 8. Memory Support: U-DIMM .................................................................................................. 34
Table 9. Memory Support: R-DIMM .................................................................................................. 35
Table 10. 4 DIMM Information ............................................................................................................. 36
Table 11. 4 DIMM MAX Memory and DRAM Technology ................................................................... 36
Table 12. 6 RDIMM (Registered DDR3 ECC)—Xeon only ................................................................. 37
Table 13. 6 DIMM MAX Memory and DRAM Technology ................................................................... 37
Table 14. Supported Memory Configurations ...................................................................................... 38
Table 15. ACPI Wake Up Events and States ...................................................................................... 44
Table 16. Power Management Features ............................................................................................. 45
Table 17. Current Power Profiles that 11G BIOS will Expose in BIOS Setup ..................................... 46
Table 18. PCIe Slot Specification ........................................................................................................ 47
Table 19. Quantities and Priorities ...................................................................................................... 48
Table 20. External Controller Cards .................................................................................................... 49
Table 21. PCI Card Dimensions .......................................................................................................... 49
Table 22. PowerEdge T310 Drives ..................................................................................................... 50
Table 23. Raid Configurations ............................................................................................................. 51
Table 24. OS Editions Not Supported by PERC S100 and S300 ........................................................ 52
Table 25. Microsoft OS Support .......................................................................................................... 56
Table 26. Linux OS Support ................................................................................................................ 57
Table 27. Supported Virtualization OS ................................................................................................ 58
Table 28. Unified Server Configurator Features and Description ........................................................ 60
Table 29. Features List for BMC, iDRAC6, and vFlash ....................................................................... 61
Table 30. Dimensions and Weight
Table 31. PowerEdge T310 Volatility .................................................................................................. 66
Table 32. Volatility: Data Writing and Purpose .................................................................................... 68
Table 33. Methodology for Data Input to Memory ............................................................................... 69
Table 34. Methodology for Memory Protection and Clearing .............................................................. 71
...................................................................................................... 64
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Figures
Figure 1. PowerEdge T310 Dimensions 14 Figure 2. Front Panel Views and Features 15 Figure 3. Back Panel View and Features 16 Figure 4. Power Supply Indicators for Redundant PSU Only 17 Figure 5. NIC Indicators 17 Figure 6. Side View 19 Figure 7. Hot-Swap HDD Chassis 19 Figure 8. Cabled HDD Chassis 20 Figure 9. Rear and Internal Views of Fan 20 Figure 10. LCD-Front Panel (Hot-Swap HDD Configuration) 21 Figure 11. LED Front Panel (Cabled HDD Configuration) 21 Figure 12. System Coin Lock under Cover Latch 22 Figure 13. Bezel Lock in Front Bezel 22 Figure 14. Lock Port on Back of Chassis 23 Figure 15. Bezel and Key Storage 23 Figure 16. Intrusion Switch 24 Figure 17. Internal USB Connectors 25 Figure 18. Motherboard Battery (CR2032) 25 Figure 19. Battery Holder for PERC Card: Located Under the HDD Cage 26 Figure 20. Slots and Risers 36 Figure 21. Packaging Diagram 64
PowerEdge T310 Technical Guide 5
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1 Overview

1.1 Product Description

Dell’s robust and reliable, 1-socket PowerEdge™ T310 tower server offers the performance of Intel® processors, DDR3 memory, advanced systems management options and the availability of up to four hard drives (3.5” or 2.5”) in a compact tower chassis.
The Dell PowerEdge T310 server delivers enterprise-level performance, redundancy, and comprehensive right-sized manageability options in a 1-socket tower that is simple to own, deploy, and manage.
The Dell PowerEdge T310 was designed to meet the needs of the growing small business or remote office by offering more features and performance than a basic, entry-level server. Customizable with optional advanced systems management capabilities including remote management, a short 20.5 inch chassis, redundancy features and cost-effective RAID options, the T310 is the ideal robust and reliable 1-socket tower server.
Dell aims to add value to your business by providing the features you need. Our goal is to deliver value through tailored solutions based on industry standards, as well as purposeful, innovative design.
The PowerEdge T310, part of the 11th Generation PowerEdge server portfolio, is built with system design commonality and reliability. All 11th Generation servers are built with user ease in mind. All external ports, power supplies, LED lights, and LCD screens are kept in the same location for familiar user experience and easy installation and deployment.
Robust, metal hard drive carriers and organized cabling are designed to improve component access and airflow across the server. The PowerEdge T310’s purposeful design provides quiet acoustics and an optional interactive LCD screen positioned on the front by the bezel for ease of monitoring. With a chassis depth of 20.5”, the PowerEdge T310’s chassis is ideal for use in a back office, retail, or small office settings where small chassis and quiet acoustics matter.
Energy Smart technologies are at the core system level on the PowerEdge T310. These energy­optimized technologies are designed to increase energy efficiency within the server while continuing to deliver the performance your business requires. Built with lower wattage power supplies than its predecessor, the PowerEdge T310 offers highly efficient cabled or redundant power supply options. Also included in the T310 are low-flow fans, designed to spin faster in accordance with server workload demands and help reduce unnecessary noise when possible. In addition, the logical component layout aids with air flow direction, helping to keep the server cool. The T310 also includes Energy Smart power management features including power capping, power inventory, and power budgeting to best manage power in your specific environment.
The Lifecycle Controller is the engine for advanced embedded management and is delivered as part of the optional iDRAC Express or iDRAC Enterprise in the PowerEdge T310. The Lifecycle Controller helps to deliver faster server deployment and update capabilities from a bare-metal, pre-operating system environment. With a single access point via the Unified Server Configurator (USC) interface, the USC tool provides a one stop shop to enable efficient operating system deployment with built-in driver installations, firmware updates, hardware configuration, and diagnostics for the system. Servers selected with hot pluggable hard drives will also get the benefit of an interactive LCD which can be accessed remotely via optional iDRAC Express or iDRAC Enterprise for system alerts and power usage as well as select boot-up options.
Also part of Dell’s OpenManage™ portfolio is the Dell Management Console, included with every Dell server, which provides IT administrators with a consolidated view of their IT infrastructure.
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