Dell R640 Technical Guide
Dell EMC PowerEdge R640
Technical Guide
Regulatory Model: E39S Series
Regulatory Type: E39S001
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2017 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.
2020 - 2
Rev. A04
Contents
1 Product overview......................................................................................................................... |
5 |
Introduction............................................................................................................................................................................ |
5 |
New technologies.................................................................................................................................................................. |
5 |
2 System features........................................................................................................................... |
6 |
Product comparison.............................................................................................................................................................. |
6 |
Technical specifications........................................................................................................................................................ |
7 |
3 Chassis views and features.......................................................................................................... |
10 |
Front view and features...................................................................................................................................................... |
10 |
Back view of the system..................................................................................................................................................... |
10 |
Internal view of the system................................................................................................................................................. |
11 |
4 Security features........................................................................................................................ |
13 |
5 Processors................................................................................................................................. |
14 |
Supported processors......................................................................................................................................................... |
14 |
Chipset.................................................................................................................................................................................. |
20 |
6 Memory..................................................................................................................................... |
22 |
7 Storage..................................................................................................................................... |
24 |
Storage controllers.............................................................................................................................................................. |
25 |
Optical drives....................................................................................................................................................................... |
25 |
Tape drives........................................................................................................................................................................... |
25 |
IDSDM or vFlash card......................................................................................................................................................... |
26 |
8 Networking and PCIe.................................................................................................................. |
27 |
PCIe riser and options......................................................................................................................................................... |
27 |
9 Power, thermal and acoustics...................................................................................................... |
28 |
Power consumption and energy efficiency...................................................................................................................... |
28 |
Thermal and Acoustics........................................................................................................................................................ |
28 |
Power supply units.............................................................................................................................................................. |
29 |
Acoustical design................................................................................................................................................................. |
29 |
10 Rack rails................................................................................................................................. |
30 |
11 Supported operating system....................................................................................................... |
32 |
12 Dell EMC OpenManage systems management.............................................................................. |
33 |
Server and Chassis Managers........................................................................................................................................... |
34 |
Dell EMC consoles............................................................................................................................................................... |
34 |
Contents 3
Automation Enablers........................................................................................................................................................... |
34 |
Integration with third-party consoles................................................................................................................................ |
34 |
Connections for third-party consoles............................................................................................................................... |
34 |
Dell EMC Update Utilities................................................................................................................................................... |
34 |
Dell resources....................................................................................................................................................................... |
34 |
13 Appendix A. Additional specifications.......................................................................................... |
36 |
Chassis dimensions.............................................................................................................................................................. |
36 |
Video specifications............................................................................................................................................................. |
37 |
USB........................................................................................................................................................................................ |
37 |
Power supply specifications............................................................................................................................................... |
37 |
Environmental specifications............................................................................................................................................. |
38 |
14 Appendix B. Standards compliance............................................................................................. |
39 |
15 Appendix C Additional resources................................................................................................ |
40 |
16 Appendix D. Support and deployment services............................................................................. |
41 |
ProDeploy Enterprise Suite and Residency Services....................................................................................................... |
41 |
ProDeploy Plus................................................................................................................................................................ |
41 |
ProDeploy........................................................................................................................................................................ |
41 |
Basic Deployment........................................................................................................................................................... |
41 |
Residency Services........................................................................................................................................................ |
42 |
Deployment services........................................................................................................................................................... |
42 |
Remote Consulting Services.............................................................................................................................................. |
42 |
Data Migration Service....................................................................................................................................................... |
42 |
ProSupport Enterprise Suite.............................................................................................................................................. |
42 |
ProSupport Plus................................................................................................................................................................... |
43 |
ProSupport........................................................................................................................................................................... |
43 |
ProSupport One for Data Center...................................................................................................................................... |
43 |
Support Technologies......................................................................................................................................................... |
43 |
Additional professional services......................................................................................................................................... |
44 |
Dell Education Services....................................................................................................................................................... |
44 |
Dell EMC Global Infrastructure Consulting Services....................................................................................................... |
44 |
Dell EMC Managed Services.............................................................................................................................................. |
45 |
4 Contents
1
Product overview
Introduction
The PowerEdge R640 is a general purpose platform expandable up to 7.68TB of memory, up to twelve 2.5 inch drives, and flexible I/O options. The R640 can handle demanding workloads such as virtualization, dense private cloud, High Performance Computing (HPC) and software-defined storage.
The Dell EMC PowerEdge R640 is the ideal dual-socket, 1U platform for dense scale-out data center computing. The R640 combines density, performance and scalability to optimize application performance and data center density.
The PowerEdge R640 features:
•2nd Generation Intel® Xeon® Scalable Processor product family (with up to 28 cores and two threads per core)
•Up to six DDR4 memory channels with two DIMMs per channel per CPU and 24 DIMMs (supports DDR4 RDIMM/LRDIMM/ NVDIMM-N/DCPMM)
•PCI Express® (PCIe) 3.0 enabled expansion slots (with up to 48 lanes per CPU)
•Networking technologies, such as Ethernet, Infiniband, OCP, OPA
New technologies
The following are the new technologies featured on the PowerEdge R640
New technology |
Detailed description |
2nd Generation Intel® Xeon® Scalable Processor Intel® C620 series chipset
2933 MT/s DDR4 memory
The processor product family has embedded PCIe lanes for improved I/O performance. For details, see the Processor section.
The R640 system uses the Intel Lewisburg chip. It is a 2 chip platform - CPU and PCH.
The Intel® Xeon® Scalable Processor product family that supports 2933 MT/s memory and twenty-four 288-pin DIMMs. The R640 system supports:
•Two DIMMs per channel for single rank and/or dual rank DIMMs
•One or two DIMMs per channel for quad rank DIMMs For details, see the Memory section.
See the Memory section for details.
Intel® Optane™ DC persistent memory |
Up to 6 per CPU socket. Max 12 for 2S configuration. |
|
• 256GB, 512GB per DIMM |
|
• 1866, 2133, 2400, 2666 MT/s |
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• Up to 6.14TB max, (7.68TB max with DCPMM and LDRIMM) |
iDRAC9 with Lifecycle Controller |
The new embedded systems management solution for the Dell EMC systems |
|
features hardware and firmware inventory and alerting, data center level power |
|
monitoring, and faster performance. For details, see the Dell EMC OpenManage |
|
systems management section. |
2.5-inch PCIe SSD |
Supports up to ten CPU Direct Attach PCIe SSD |
LCD bezel |
The PowerEdge R640 LCD control panel is embedded in the front bezel for easy |
|
access and management. |
Product overview |
5 |
2
System features
Compared to previous generations, the PowerEdge R640 offers faster processing power and advanced system management.
The R640 system is a powerhouse 2S/1U rack system, which emphasizes performance and reliability in areas such as virtualization, power, thermal and systems management, and usability. It is designed for mid-size to large data centers that require high memory capacity and performance.
The R640 system consists of the planar subsystem with control panel, SAS backplane, storage card, riser card, VGA port, Storage Enclosure Processor (SEP) (4 x HDD back plane, 8x HDD backplane, 10x HDD backplane, 10x NVMe backplane and 2 x rear backplane). It is a two-chip platform (CPU and PCH) because this family of processors includes an Integrated Memory Controller (IMC) and Integrated I/O (IIO) (such as PCI Express and DMI3) on a single silicon die.
Topics:
•Product comparison
•Technical specifications
Product comparison
The following table shows the comparison between the R640 with the predecessor R630:
Feature |
PowerEdge R640 |
PowerEdge R630 |
|
|
|
Processors |
2nd Generation Intel® Xeon® Scalable Processor |
Intel® Xeon® processor E5-2600 v3 or E52600 v4 |
|
Family |
|
Chipset |
Intel® C620 |
Intel® C610 |
Memory |
• 24x DDR4 RDIMM/LR-DIMM 12x NVDIMM + |
24x DDR4 RDIMM/LR-DIMM |
|
12 x RDIMM |
|
|
• 12 x DCPMM + 12 x RDIMM or 12 x LRDIMM |
|
Chassis |
Storage design modularity |
Three individual chassis for three SKU |
|
• 4 Hard Drive Chassis |
• 8 Hard Drive Chassis |
|
• 8 Hard Drive Chassis |
• 1 Hard Drive Chassis |
|
• 10 Hard Drive Chassis |
• 24 Hard Drive Chassis |
|
• 10 NVMe Drive Chassis |
|
Disk Drives |
Front drive bays: |
|
• Up to 10 x 2.5 -inch with up to 8 NVMe, SAS/ |
|
SATA/SSD/NVMe, max 76.8TB , or up to 10 |
|
NVMe drives max 64TB. Or up to 4 x 3.5” |
|
SAS/SATA, max 64TB |
|
Rear drive bays: |
|
• Up to 2 x 2.5 -inch SAS/SATA/SSD/NVMe, |
|
max 15.36TB |
•8 x 2.5 -inch SAS/SATA or SATA only
•10 x2. 5 -inch SAS/SATA or SAS/SATA/NVMe (NVMe up to 4)
•24 x 1.8 inch SATA (single PERC or dual PERCs)
PCIe SSD |
Up to 10 CPU Direct Attach PCIe SSD |
Up to 4x PCIe SSD from PCIe bridge card |
RAID Controller |
S140, HBA330, H330, H730, H730P, H740P, |
S130, H330, H730, H730P, H830 (External) Support for |
|
H840P, 12Gbps SAS HBA(External) |
2 internal RAID controllers for x24 SSD configuration |
|
|
only |
LCD Module |
LCD module option in bezel |
LCD by default in base x8 chassis, not available on x10 |
|
|
and x24 chassis. |
6 System features
Feature |
PowerEdge R640 |
PowerEdge R630 |
||
|
|
|
||
Backplane |
• 10 x 2.5 inch SATA/SAS/NVMe (up to 8 |
• 8 x 2. 5 inch SAS/SATA |
||
|
|
NVMes) |
• 10 x 2. 5 inch SAS/SATA |
|
|
• 10 x 2.5 inch NVMe |
• 10 x 2. 5 inch SAS/SATA/PCIeSSD |
||
|
• 8 x 2.5 inch SATA/SAS/NVMe |
• 24 x 1.8 inch SATA |
||
|
• 4 x 3.5 inch SATA/SAS |
|
|
|
Riser |
Up to 2 riser connectors (left/right) |
Up to 3 riser connectors (left/center/right) |
||
PCIe Slots |
Up to 3x PCIe Gen3 (x16/x16/x16) |
Up to 3x PCIe Gen3 (x16/x8/x16) |
||
Embedded NIC |
• |
4 x 1GbE |
• |
Broadcom 5730 Base-T |
|
• 2 x 10GbE + 2 x 1GbE |
• |
Intel 1350 Base-T |
|
|
• |
4 x 10GbE |
• |
Broadcom 57800 SFP+ |
|
• |
2 x 25GbE |
• |
Broadcom 57800 Base-T |
|
|
|
• |
Intel X540 Base-T |
Power supplies |
• |
495W Platinum |
• |
495 W AC |
|
• |
750W Platinum |
• |
750 W AC |
|
• 750 W Mixed Mode AC Platinum |
• |
1100 W AC |
|
|
• 750 W Mixed Mode DC Platinum (for China |
• |
1100 W DC |
|
|
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only) |
|
|
|
• 750W 240HVDC Platinum* (China only) |
|
|
|
|
• |
1100W - 48VDC |
|
|
|
• |
1100W Platinum |
|
|
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• 1100W 380HVDC Platinum* (Available in China |
|
|
|
|
|
and Japan only) |
|
|
|
• |
1600W Platinum |
|
|
|
• |
750W Titanium |
|
|
Remote Management |
iDRAC9 |
iDRAC8 |
||
TPM |
TPM China, TPM1.2, TPM2.0 |
TPM China, TPM1.2, TPM2.0 |
||
USB 3.0 Hub board |
Extra USB3.0 connector to front plane |
None |
||
iDRAC Direct front port |
Micro USB |
USB type A |
||
Fan |
Up to eight FAN support. (1X6 type) |
Up to seven FAN support (2X3 type) |
||
IDSDM Module |
Internal Dual SD Module (IDSDM) and vFlash |
Internal Dual SD Module (IDSDM) |
||
BOSS Module |
M.2 SATA interface |
None |
||
PERC |
Mini-PERC 10 |
Mini-PERC 9 |
||
NVDIMM Battery |
External 12 V power bank for NVDIMM used |
None |
||
ODD/TBU |
ODD via NPIO |
TBU and ODD via 7-pin connectors |
||
On board PCH SATA |
4x NPIOs |
2x Mini SAS_HDs |
||
Connectors |
|
|
|
|
Technical specifications
The following table shows the technical specifications of the PowerEdge R640:
Features |
Technical Specification |
|
|
Form factor |
1U rack |
Processor |
2nd Generation Intel® Xeon® Scalable Processors family |
Internal interconnect |
Up to 3 Intel Ultra Path Interconnect (Intel® UPI); up to 11.2 GT/s |
Memory |
DIMM speed: |
System features |
7 |
Features |
Technical Specification |
|
|
I/O slots
Storage controllers
•Up to 2933 MT/s Memory type:
•RDIMM
•LRDIMM
•NVDIMM
•DCPMM
Memory module slots:
•24 DDR4 DIMM slots (12 NVDIMM or 12 DCPMM only)
•Supports registered ECC DDR4 DIMMs only
Maximum RAM:
•RDIMM 1.53TB
•LRDIMM 3TB
•NVDIMM 192GB
•DCPMM* 6.14TB (7.68TB with LDRDIMM)
Up to 3 x PCIeGen slots plus a dedicated PERC and rNDC slot
•Internal controllers: PERC S140 (SW RAID SATA), PERC H330, PERC H730, PERC H730P, PERC H740P
•Internal HBA (RAID): PERC HBA330
•External HBA—non-RAID: 12 Gb/s SAS HBA
Hard drives |
• |
10 x 2.5 |
-inch SATA/SAS/NVMe (up to 8 NVMes) |
|
|
• 10 x 2.5 |
-inch NVMe |
||
|
• 8 x 2.5 |
-inch SAS/SATA/NVMe |
||
|
• 4 x 3.5 -inch SAS/SATA |
|||
|
• |
8 x 2.5 |
-inch SATA |
|
Accelerators
Embedded NIC
Power supply
Up to 3 single-width GPU (NVIDIA T4) or up to 1 FPGA
•4 x 1GbE
•2 x 10GbE + 2 x 1GbE
•4 x 10GbE
•2 x 25GbE
•495W Platinum
•750W Platinum
•750W 240HVDC Platinum* (Available in China only)
•750 W Mixed Mode AC Platinum
•750 W Mixed Mode DC Platinum (for China only)
•1100W - 48VDC
•1100W Platinum
•1100W 380HVDC Platinum* (Available in China and Japan only)
•1600W Platinum
•750W Titanium
Operating systems |
• |
Canonical® Ubuntu® Server LTS |
|
• |
Citrix® Hypervisor |
|
• Microsoft® Windows Server® LTSC with Hyper-V |
|
|
• |
Oracle® Linux |
|
• Red Hat® Enterprise Linux |
|
|
• SUSE® Linux Enterprise Server |
|
For more information on the specific versions and additions, visit Dell.com/OSsupport
8 System features
Features |
Technical Specification |
|
|
|
|
Systems management |
• Systems management: IPMI 2.0 compliant; Dell OpenManage Enterprise; Dell EMC |
|
|
|
OpenManage Mobile; Dell EMC OpenManage Power Center |
|
• Remote management: iDRAC9; 8 GB vFlash media (upgrade), 16 GB vFlash media (upgrade) |
|
|
|
iDRAC Quick Sync |
|
• Dell EMC OpenManage Integrations: Microsoft® System Center, VMware® vCenter™, |
|
|
|
BMC Truesight, Red Hat Ansible Modules. |
|
• Dell EMC OpenManage Connections: IBM Tivoli® Netcool/OMNIbus, IBM Tivoli® Network |
|
|
|
Manager IP Edition, Micro Focus® Operations Manager I, Nagios® Core, Nagios® XI |
Dimensions and weight |
• |
Height: 42.8mm (1.69 -inch) |
|
• |
Width: 482.0mm (18.98 -inch) |
|
• |
Depth: 808.5mm (31.8 -inch) |
|
• Weight: 21.9kg (48.3 lbs) |
|
|
Dimensions include bezel |
|
Recommended support |
Dell EMC ProSupport Plus for critical systems or Dell EMC ProSupport for premium hardware and |
|
|
software support for your PowerEdge solution. Consulting and deployment offerings are also |
|
|
available. Contact your Dell EMC representative for more information. Availability and terms of Dell |
|
|
EMC Services vary by region. For more information, visit Dell EMC.com/ServiceDescriptions. |
|
System features |
9 |
3
Chassis views and features
Front view and features
The images below illustrates the front view of the PowerEdge R640 with the types of supported chassis options:
Figure 1. Front view 4 x 3.5-inch drive chassis
Figure 2. Front view 8 x 2.5-inch drive chassis
Figure 3. Front view 10 x 2.5-inch drive chassis
Back view of the system
The back panel of a PowerEdge system contains access to I/O connectors for both embedded and add-in devices, including networking, video, serial, USB, system ID, and system management access ports. Most add-in PCI cards are accessible through the back panel. It is also the default location for power supply units (PSU), including the points for AC/DC connections.
Depending on your system configuration, the drive backplanes supported in PowerEdge R640 are listed here:
•2.5 inch (x8) SAS, SATA, or NVMe backplane
•2.5 inch (x10) SAS, SATA, or NVMe backplane
•2.5 inch (x10) SAS, SATA, or NVMe backplane and 2.5 inch (x2) SAS or SATA backplane (back)
•3.5 inch (x4) SAS or SATA backplane
Figure 4. Back panel view of 2 x 2.5 inch hard drives with 1 PCIe expansion slot
Figure 5. Back panel view of system with 3 PCIe expansion slots
10 Chassis views and features
Figure 6. Back panel view of system with 2 PCIe expansion slots
Internal view of the system
The chassis design of the PowerEdge R640 is optimized for easy access to components and for efficient cooling. The PowerEdge R640 supports up to 24 DIMMs, two processors, hot-plug redundant fans, system board and hard drive bays, and many other components and features. For more system views, see the Dell EMC PowerEdge R640 Installation and Service Manual at Dell.com/Support/Manuals.¶
Figure 7. Inside the system with 1 PCIe expansion riser
Figure 8. Inside the system with 2 PCIe expansion risers
Chassis views and features |
11 |
Figure 9. Inside the system with 3 PCIe expansion risers
12 Chassis views and features
4
Security features
The latest generation of PowerEdge servers has the features listed in the table to help ensure the security of your data center.
Security feature |
Description |
|
|
Cover latch |
A tooled latch is integrated in the top cover to secure it to the |
|
system. |
Bezel |
A standard bezel is an optional metal bezel mounted to the chassis |
|
front. A lock on the bezel protects unauthorized access to hard |
|
drives. The QuickSync NFC bezel enables the iDRAC QuickSync |
|
management function for managing the server from the front using |
|
an NFC-capable device and the Dell EMC OpenManage Mobile |
|
App. Available only from the factory and not supported after point |
|
of sale. |
TPM |
The Trusted Platform Module (TPM) is used to generate/store, |
|
protect/authenticate password, and create/store digital |
|
certificates. |
Power-off security |
BIOS has the ability to disable the power button function. |
Security features |
13 |
5
Processors
The 2nd Generation Intel Xeon Processor Scalable Family provides the foundation for a powerful data center platform. It is the most advanced compute core featuring a new core micro architecture optimized to accelerate a wide range of compute workloads. The key features are as follows:
•Higher Per-Core Performance: Up to 28 cores (24 cores with R440), delivery high performance, and scalability for computeintensive workloads across compute, storage, and network usages. The 2nd Generation Intel Xeon Scalable Processors can offer even greater core or frequencies, or both.
•Greater Memory Bandwidth/Capacity: 50% increased memory bandwidth and capacity. 6 memory channels vs. 4 memory channels of previous generation for memory intensive workloads.
•Expanded I/O: 48 lanes of PCIe 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
•Intel Ultra Path Interconnect (UPI): Up to three Intel UPI channels increase scalability of the platform to as many as eight sockets, and improves inter-CPU bandwidth for I/O intensive workloads.
•Intel Advanced Vector Extensions 512 (Intel AVX-512) with a single AVX512 fused multiply add (FMA) execution units. SKUs which support Advanced RAS enable a second FMA execution unit.
•Security without Compromise: Near-zero encryption overhead enables higher performance on all secure data transactions with enhanced hardware mitigation.
•Intel Deep Learning Boost: Accelerate data-intensive workloads within the CPU with inferencing capabilities.
Topics:
•Supported processors
•Chipset
Supported processors
The following table lists the 1st and 2nd Generation Intel® Xeon® Scalable supported processors for the PowerEdge R640:
Table 1. 1st and 2nd Generation Intel® Xeon® Scalable supported processors |
|
|
|
|
||||||
Model |
Intel |
SKU |
Stepping |
Speed(GHz |
Cache( |
UPI(GT/ |
Max |
Cores |
Turbo |
TDP |
|
SKU |
type |
|
) |
MB) |
s) |
Memory |
|
|
|
|
|
|
|
|
|
|
Speed(M |
|
|
|
|
|
|
|
|
|
|
T/s) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Intel Xeon |
8280L |
Platinum |
XCC |
2.7 |
38.5 |
NA |
2933 |
28 |
Turbo |
205W |
Processor |
|
|
|
|
|
|
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|
|
|
Scalable |
|
|
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|
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Family |
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|
|
Intel Xeon |
8280M |
Platinum |
XCC |
2.7 |
38.5 |
NA |
2933 |
28 |
Turbo |
205W |
Processor |
|
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|
|
|
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|
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Scalable |
|
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|
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Family |
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|
|
|
Intel Xeon |
8280 |
Platinum |
XCC |
2.7 |
38.5 |
NA |
2933 |
28 |
Turbo |
205W |
Processor |
|
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|
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Scalable |
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Family |
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Intel Xeon |
8276L |
Platinum |
XCC |
2.2 |
NA |
NA |
2933 |
28 |
Turbo |
165W |
Processor |
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Scalable |
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Family |
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Intel Xeon |
8276M |
Platinum |
XCC |
2.2 |
NA |
NA |
2933 |
28 |
Turbo |
165W |
Processor |
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Scalable |
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Family |
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14 Processors
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