Dell R640 Technical Guide
Dell EMC PowerEdge R640
Technical Guide
Regulatory Model: E39S Series
Regulatory Type: E39S001
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid the
problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
© 2017 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its
subsidiaries. Other trademarks may be trademarks of their respective owners.
2020 - 2
Rev. A04
Contents
1 Product overview......................................................................................................................... 5
Introduction............................................................................................................................................................................ 5
New technologies.................................................................................................................................................................. 5
2 System features...........................................................................................................................6
Product comparison.............................................................................................................................................................. 6
Technical specifications........................................................................................................................................................ 7
3 Chassis views and features.......................................................................................................... 10
Front view and features...................................................................................................................................................... 10
Back view of the system.....................................................................................................................................................10
Internal view of the system................................................................................................................................................. 11
4 Security features........................................................................................................................ 13
5 Processors................................................................................................................................. 14
Supported processors......................................................................................................................................................... 14
Chipset..................................................................................................................................................................................20
6 Memory.....................................................................................................................................22
7 Storage..................................................................................................................................... 24
Storage controllers..............................................................................................................................................................25
Optical drives....................................................................................................................................................................... 25
Tape drives...........................................................................................................................................................................25
IDSDM or vFlash card.........................................................................................................................................................26
8 Networking and PCIe.................................................................................................................. 27
PCIe riser and options......................................................................................................................................................... 27
9 Power, thermal and acoustics......................................................................................................28
Power consumption and energy efficiency......................................................................................................................28
Thermal and Acoustics........................................................................................................................................................28
Power supply units.............................................................................................................................................................. 29
Acoustical design.................................................................................................................................................................29
10 Rack rails................................................................................................................................. 30
11 Supported operating system.......................................................................................................32
12 Dell EMC OpenManage systems management..............................................................................33
Server and Chassis Managers........................................................................................................................................... 34
Dell EMC consoles...............................................................................................................................................................34
Contents 3
Automation Enablers........................................................................................................................................................... 34
Integration with third-party consoles................................................................................................................................34
Connections for third-party consoles............................................................................................................................... 34
Dell EMC Update Utilities................................................................................................................................................... 34
Dell resources.......................................................................................................................................................................34
13 Appendix A. Additional specifications..........................................................................................36
Chassis dimensions..............................................................................................................................................................36
Video specifications.............................................................................................................................................................37
USB........................................................................................................................................................................................37
Power supply specifications............................................................................................................................................... 37
Environmental specifications............................................................................................................................................. 38
14 Appendix B. Standards compliance............................................................................................. 39
15 Appendix C Additional resources................................................................................................ 40
16 Appendix D. Support and deployment services............................................................................. 41
ProDeploy Enterprise Suite and Residency Services.......................................................................................................41
ProDeploy Plus................................................................................................................................................................41
ProDeploy........................................................................................................................................................................ 41
Basic Deployment...........................................................................................................................................................41
Residency Services........................................................................................................................................................42
Deployment services........................................................................................................................................................... 42
Remote Consulting Services..............................................................................................................................................42
Data Migration Service....................................................................................................................................................... 42
ProSupport Enterprise Suite.............................................................................................................................................. 42
ProSupport Plus...................................................................................................................................................................43
ProSupport...........................................................................................................................................................................43
ProSupport One for Data Center...................................................................................................................................... 43
Support Technologies......................................................................................................................................................... 43
Additional professional services.........................................................................................................................................44
Dell Education Services.......................................................................................................................................................44
Dell EMC Global Infrastructure Consulting Services.......................................................................................................44
Dell EMC Managed Services..............................................................................................................................................45
4
Contents
Product overview
Introduction
The PowerEdge R640 is a general purpose platform expandable up to 7.68TB of memory, up to twelve 2.5 inch drives, and flexible I/O
options. The R640 can handle demanding workloads such as virtualization, dense private cloud, High Performance Computing (HPC) and
software-defined storage.
The Dell EMC PowerEdge R640 is the ideal dual-socket, 1U platform for dense scale-out data center computing. The R640 combines
density, performance and scalability to optimize application performance and data center density.
The PowerEdge R640 features:
• 2nd Generation Intel® Xeon® Scalable Processor product family (with up to 28 cores and two threads per core)
• Up to six DDR4 memory channels with two DIMMs per channel per CPU and 24 DIMMs (supports DDR4 RDIMM/LRDIMM/
NVDIMM-N/DCPMM)
• PCI Express® (PCIe) 3.0 enabled expansion slots (with up to 48 lanes per CPU)
• Networking technologies, such as Ethernet, Infiniband, OCP, OPA
New technologies
The following are the new technologies featured on the PowerEdge R640
1
New technology
2nd Generation Intel® Xeon® Scalable Processor The processor product family has embedded PCIe lanes for improved I/O
Intel® C620 series chipset The R640 system uses the Intel Lewisburg chip. It is a 2 chip platform - CPU and
2933 MT/s DDR4 memory The Intel® Xeon® Scalable Processor product family that supports 2933 MT/s
Intel® Optane™ DC persistent memory Up to 6 per CPU socket. Max 12 for 2S configuration.
iDRAC9 with Lifecycle Controller The new embedded systems management solution for the Dell EMC systems
2.5-inch PCIe SSD Supports up to ten CPU Direct Attach PCIe SSD
LCD bezel The PowerEdge R640 LCD control panel is embedded in the front bezel for easy
Detailed description
performance. For details, see the Processor section.
PCH.
memory and twenty-four 288-pin DIMMs. The R640 system supports:
• Two DIMMs per channel for single ‐ rank and/or dual ‐ rank DIMMs
• One or two DIMMs per channel for quad ‐ rank DIMMs For details, see the
Memory section.
See the Memory section for details.
• 256GB, 512GB per DIMM
• 1866, 2133, 2400, 2666 MT/s
• Up to 6.14TB max, (7.68TB max with DCPMM and LDRIMM)
features hardware and firmware inventory and alerting, data center level power
monitoring, and faster performance. For details, see the Dell EMC OpenManage
systems management section.
access and management.
Product overview 5
2
System features
Compared to previous generations, the PowerEdge R640 offers faster processing power and advanced system management.
The R640 system is a powerhouse 2S/1U rack system, which emphasizes performance and reliability in areas such as virtualization, power,
thermal and systems management, and usability. It is designed for mid-size to large data centers that require high memory capacity and
performance.
The R640 system consists of the planar subsystem with control panel, SAS backplane, storage card, riser card, VGA port, Storage
Enclosure Processor (SEP) (4 x HDD back plane, 8x HDD backplane, 10x HDD backplane, 10x NVMe backplane and 2 x rear backplane). It
is a two-chip platform (CPU and PCH) because this family of processors includes an Integrated Memory Controller (IMC) and Integrated
I/O (IIO) (such as PCI Express and DMI3) on a single silicon die.
Topics:
• Product comparison
• Technical specifications
Product comparison
The following table shows the comparison between the R640 with the predecessor R630:
Feature
Processors 2nd Generation Intel® Xeon® Scalable Processor
Chipset Intel® C620 Intel® C610
Memory
Chassis Storage design modularity
Disk Drives Front drive bays:
PCIe SSD Up to 10 CPU Direct Attach PCIe SSD Up to 4x PCIe SSD from PCIe bridge card
RAID Controller S140, HBA330, H330, H730, H730P, H740P,
LCD Module LCD module option in bezel LCD by default in base x8 chassis, not available on x10
PowerEdge R640 PowerEdge R630
Intel® Xeon® processor E5-2600 v3 or E5- 2600 v4
Family
• 24x DDR4 RDIMM/LR-DIMM 12x NVDIMM +
12 x RDIMM
• 12 x DCPMM + 12 x RDIMM or 12 x LRDIMM
• 4 Hard Drive Chassis
• 8 Hard Drive Chassis
• 10 Hard Drive Chassis
• 10 NVMe Drive Chassis
• Up to 10 x 2.5 -inch with up to 8 NVMe, SAS/
SATA/SSD/NVMe, max 76.8TB , or up to 10
NVMe drives max 64TB. Or up to 4 x 3.5”
SAS/SATA, max 64TB
Rear drive bays:
• Up to 2 x 2.5 -inch SAS/SATA/SSD/NVMe,
max 15.36TB
H840P, 12Gbps SAS HBA(External)
24x DDR4 RDIMM/LR-DIMM
Three individual chassis for three SKU
• 8 Hard Drive Chassis
• 1 Hard Drive Chassis
• 24 Hard Drive Chassis
• 8 x 2.5 -inch SAS/SATA or SATA only
• 10 x2. 5 -inch SAS/SATA or SAS/SATA/NVMe
(NVMe up to 4)
• 24 x 1.8 inch SATA (single PERC or dual PERCs)
S130, H330, H730, H730P, H830 (External) Support for
2 internal RAID controllers for x24 SSD configuration
only
and x24 chassis.
6 System features
Feature PowerEdge R640 PowerEdge R630
Backplane
Riser Up to 2 riser connectors (left/right) Up to 3 riser connectors (left/center/right)
PCIe Slots Up to 3x PCIe Gen3 (x16/x16/x16) Up to 3x PCIe Gen3 (x16/x8/x16)
Embedded NIC
• 10 x 2.5 inch SATA/SAS/NVMe (up to 8
NVMes)
• 10 x 2.5 inch NVMe
• 8 x 2.5 inch SATA/SAS/NVMe
• 4 x 3.5 inch SATA/SAS
• 4 x 1GbE
• 2 x 10GbE + 2 x 1GbE
• 4 x 10GbE
• 2 x 25GbE
• 8 x 2. 5 inch SAS/SATA
• 10 x 2. 5 inch SAS/SATA
• 10 x 2. 5 inch SAS/SATA/PCIeSSD
• 24 x 1.8 inch SATA
• Broadcom 5730 Base-T
• Intel 1350 Base-T
• Broadcom 57800 SFP+
• Broadcom 57800 Base-T
• Intel X540 Base-T
Power supplies
Remote Management iDRAC9 iDRAC8
TPM TPM China, TPM1.2, TPM2.0 TPM China, TPM1.2, TPM2.0
USB 3.0 Hub board Extra USB3.0 connector to front plane None
iDRAC Direct front port Micro USB USB type A
Fan Up to eight FAN support. (1X6 type) Up to seven FAN support (2X3 type)
IDSDM Module Internal Dual SD Module (IDSDM) and vFlash Internal Dual SD Module (IDSDM)
BOSS Module M.2 SATA interface None
PERC Mini-PERC 10 Mini-PERC 9
NVDIMM Battery External 12 V power bank for NVDIMM used None
ODD/TBU ODD via NPIO TBU and ODD via 7-pin connectors
On board PCH SATA
Connectors
• 495W Platinum
• 750W Platinum
• 750 W Mixed Mode AC Platinum
• 750 W Mixed Mode DC Platinum (for China
only)
• 750W 240HVDC Platinum* (China only)
• 1100W - 48VDC
• 1100W Platinum
• 1100W 380HVDC Platinum* (Available in China
and Japan only)
• 1600W Platinum
• 750W Titanium
4x NPIOs 2x Mini SAS_HDs
• 495 W AC
• 750 W AC
• 1100 W AC
• 1100 W DC
Technical specifications
The following table shows the technical specifications of the PowerEdge R640:
Features
Form factor 1U rack
Processor 2nd Generation Intel® Xeon® Scalable Processors family
Internal interconnect Up to 3 Intel Ultra Path Interconnect (Intel® UPI); up to 11.2 GT/s
Memory DIMM speed:
Technical Specification
System features 7
Features Technical Specification
• Up to 2933 MT/s
Memory type:
• RDIMM
• LRDIMM
• NVDIMM
• DCPMM
Memory module slots:
• 24 DDR4 DIMM slots (12 NVDIMM or 12 DCPMM only)
• Supports registered ECC DDR4 DIMMs only
Maximum RAM:
• RDIMM 1.53TB
• LRDIMM 3TB
• NVDIMM 192GB
• DCPMM* 6.14TB (7.68TB with LDRDIMM)
I/O slots Up to 3 x PCIeGen slots plus a dedicated PERC and rNDC slot
Storage controllers
• Internal controllers: PERC S140 (SW RAID SATA), PERC H330, PERC H730, PERC H730P,
PERC H740P
• Internal HBA (RAID): PERC HBA330
• External HBA—non-RAID: 12 Gb/s SAS HBA
Hard drives
Accelerators
Embedded NIC
Power supply
Operating systems
• 10 x 2.5 -inch SATA/SAS/NVMe (up to 8 NVMes)
• 10 x 2.5 -inch NVMe
• 8 x 2.5 -inch SAS/SATA/NVMe
• 4 x 3.5 -inch SAS/SATA
• 8 x 2.5 -inch SATA
Up to 3 single-width GPU (NVIDIA T4) or up to 1 FPGA
• 4 x 1GbE
• 2 x 10GbE + 2 x 1GbE
• 4 x 10GbE
• 2 x 25GbE
• 495W Platinum
• 750W Platinum
• 750W 240HVDC Platinum* (Available in China only)
• 750 W Mixed Mode AC Platinum
• 750 W Mixed Mode DC Platinum (for China only)
• 1100W - 48VDC
• 1100W Platinum
• 1100W 380HVDC Platinum* (Available in China and Japan only)
• 1600W Platinum
• 750W Titanium
• Canonical® Ubuntu® Server LTS
• Citrix® Hypervisor
• Microsoft® Windows Server® LTSC with Hyper-V
• Oracle® Linux
• Red Hat® Enterprise Linux
• SUSE® Linux Enterprise Server
For more information on the specific versions and additions, visit Dell.com/OSsupport
8 System features
Features Technical Specification
Systems management
• Systems management: IPMI 2.0 compliant; Dell OpenManage Enterprise; Dell EMC
OpenManage Mobile; Dell EMC OpenManage Power Center
• Remote management: iDRAC9; 8 GB vFlash media (upgrade), 16 GB vFlash media (upgrade)
iDRAC Quick Sync
• Dell EMC OpenManage Integrations: Microsoft® System Center, VMware® vCenter™,
BMC Truesight, Red Hat Ansible Modules.
• Dell EMC OpenManage Connections: IBM Tivoli® Netcool/OMNIbus, IBM Tivoli® Network
Manager IP Edition, Micro Focus® Operations Manager I, Nagios® Core, Nagios® XI
Dimensions and weight
Recommended support Dell EMC ProSupport Plus for critical systems or Dell EMC ProSupport for premium hardware and
• Height: 42.8mm (1.69 -inch)
• Width: 482.0mm (18.98 -inch)
• Depth: 808.5mm (31.8 -inch)
• Weight: 21.9kg (48.3 lbs)
Dimensions include bezel
software support for your PowerEdge solution. Consulting and deployment offerings are also
available. Contact your Dell EMC representative for more information. Availability and terms of Dell
EMC Services vary by region. For more information, visit Dell EMC.com/ServiceDescriptions.
System features 9
Chassis views and features
Front view and features
The images below illustrates the front view of the PowerEdge R640 with the types of supported chassis options:
Figure 1. Front view 4 x 3.5-inch drive chassis
Figure 2. Front view 8 x 2.5-inch drive chassis
3
Figure 3. Front view 10 x 2.5-inch drive chassis
Back view of the system
The back panel of a PowerEdge system contains access to I/O connectors for both embedded and add-in devices, including networking,
video, serial, USB, system ID, and system management access ports. Most add-in PCI cards are accessible through the back panel. It is
also the default location for power supply units (PSU), including the points for AC/DC connections.
Depending on your system configuration, the drive backplanes supported in PowerEdge R640 are listed here:
• 2.5 inch (x8) SAS, SATA, or NVMe backplane
• 2.5 inch (x10) SAS, SATA, or NVMe backplane
• 2.5 inch (x10) SAS, SATA, or NVMe backplane and 2.5 inch (x2) SAS or SATA backplane (back)
• 3.5 inch (x4) SAS or SATA backplane
Figure 4. Back panel view of 2 x 2.5 inch hard drives with 1 PCIe expansion slot
Figure 5. Back panel view of system with 3 PCIe expansion slots
10 Chassis views and features
Figure 6. Back panel view of system with 2 PCIe expansion slots
Internal view of the system
The chassis design of the PowerEdge R640 is optimized for easy access to components and for efficient cooling. The PowerEdge R640
supports up to 24 DIMMs, two processors, hot-plug redundant fans, system board and hard drive bays, and many other components and
features. For more system views, see the Dell EMC PowerEdge R640 Installation and Service Manual at Dell.com/Support/Manuals.¶
Figure 7. Inside the system with 1 PCIe expansion riser
Figure 8. Inside the system with 2 PCIe expansion risers
Chassis views and features
11
Figure 9. Inside the system with 3 PCIe expansion risers
12 Chassis views and features
Security features
The latest generation of PowerEdge servers has the features listed in the table to help ensure the security of your data center.
Security feature Description
Cover latch A tooled latch is integrated in the top cover to secure it to the
system.
Bezel A standard bezel is an optional metal bezel mounted to the chassis
front. A lock on the bezel protects unauthorized access to hard
drives. The QuickSync NFC bezel enables the iDRAC QuickSync
management function for managing the server from the front using
an NFC-capable device and the Dell EMC OpenManage Mobile
App. Available only from the factory and not supported after point
of sale.
TPM The Trusted Platform Module (TPM) is used to generate/store,
protect/authenticate password, and create/store digital
certificates.
Power-off security BIOS has the ability to disable the power button function.
4
Security features 13
5
Processors
The 2nd Generation Intel Xeon Processor Scalable Family provides the foundation for a powerful data center platform. It is the most
advanced compute core featuring a new core micro architecture optimized to accelerate a wide range of compute workloads. The key
features are as follows:
• Higher Per-Core Performance: Up to 28 cores (24 cores with R440), delivery high performance, and scalability for computeintensive workloads across compute, storage, and network usages. The 2nd Generation Intel Xeon Scalable Processors can offer even
greater core or frequencies, or both.
• Greater Memory Bandwidth/Capacity: 50% increased memory bandwidth and capacity. 6 memory channels vs. 4 memory
channels of previous generation for memory intensive workloads.
• Expanded I/O: 48 lanes of PCIe 3.0 bandwidth and throughput for demanding I/O-intensive workloads.
• Intel Ultra Path Interconnect (UPI): Up to three Intel UPI channels increase scalability of the platform to as many as eight sockets,
and improves inter-CPU bandwidth for I/O intensive workloads.
• Intel Advanced Vector Extensions 512 (Intel AVX-512) with a single AVX512 fused multiply add (FMA) execution units. SKUs
which support Advanced RAS enable a second FMA execution unit.
• Security without Compromise: Near-zero encryption overhead enables higher performance on all secure data transactions with
enhanced hardware mitigation.
• Intel Deep Learning Boost: Accelerate data-intensive workloads within the CPU with inferencing capabilities.
Topics:
• Supported processors
• Chipset
Supported processors
The following table lists the 1st and 2nd Generation Intel® Xeon® Scalable supported processors for the PowerEdge R640:
Table 1. 1st and 2nd Generation Intel® Xeon® Scalable supported processors
Model Intel
Intel Xeon
Processor
Scalable
Family
Intel Xeon
Processor
Scalable
Family
Intel Xeon
Processor
Scalable
Family
Intel Xeon
Processor
Scalable
Family
Intel Xeon
Processor
Scalable
Family
SKU
8280L Platinum XCC 2.7 38.5 NA 2933 28 Turbo 205W
8280M Platinum XCC 2.7 38.5 NA 2933 28 Turbo 205W
8280 Platinum XCC 2.7 38.5 NA 2933 28 Turbo 205W
8276L Platinum XCC 2.2 NA NA 2933 28 Turbo 165W
8276M Platinum XCC 2.2 NA NA 2933 28 Turbo 165W
SKU
type
Stepping Speed(GHz)Cache(
MB)
UPI(GT/s)Max
Memory
Speed(M
T/s)
Cores Turbo TDP
14 Processors
Loading...