Dell R840 Technical Specifications

Dell EMC PowerEdge R840

Technical Specifications

Reg ula tor y M ode l: E49 S S eries
Reg ula tor y T ype : E 49S 001
Apr il 202 1
Rev . A 09

Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid

the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2018 - 2019 Dell Inc. or its subsidiaries. All rights reserved . Dell, EMC, and other trademarks are trademarks of Dell Inc. or its

subsidiaries. Other trademarks may be trademarks of their respective owners.

Contents

Chapter 1: Technical specifications............................................................................................... 4

Chassis dimensions..............................................................................................................................................................4

Chassis weight..................................................................................................................................................................... 5

Processor specifications.................................................................................................................................................... 5

Supported operating systems...........................................................................................................................................5

PSU specifications.............................................................................................................................................................. 5

System battery specifications.......................................................................................................................................... 6

Expansion card riser specifications................................................................................................................................. 6

Memory specifications........................................................................................................................................................7

RAID controller specifications.......................................................................................................................................... 8

Drive specifications............................................................................................................................................................. 9

Drives................................................................................................................................................................................9

Optical drives.................................................................................................................................................................. 9

Tape drives...................................................................................................................................................................... 9

Ports and connectors specifications...............................................................................................................................9

USB ports........................................................................................................................................................................ 9

NIC ports........................................................................................................................................................................10

VGA ports...................................................................................................................................................................... 10

Serial connector............................................................................................................................................................10

IDSDM or vFlash module............................................................................................................................................ 10

Video specifications............................................................................................................................................................11

Environmental specifications........................................................................................................................................... 11

Standard operating temperature.............................................................................................................................. 12

Expanded operating temperature.............................................................................................................................12

Particulate and gaseous contamination specifications ...................................................................................... 15

Contents 3

Technical specifications

The technical and environmental specifications of your system are outlined in this section.

Topics:

• Chassis dimensions

• Chassis weight

• Processor specifications

• Supported operating systems

• PSU specifications

• System battery specifications

• Expansion card riser specifications

• Memory specifications

• RAID controller specifications

• Drive specifications

• Ports and connectors specifications

• Video specifications

• Environmental specifications

1

Chassis dimensions

Figure 1. Dimensions of PowerEdge R840 system

4 Technical specifications

Table 1. Dimensions of PowerEdge R840 system

Xa Xb

482 mm
(18.97
inches)

* - Zb refers to the nominal rear wall external surface, where the system board I/O connectors are located.

(without
brackets)

434 mm
(17.08
inches)

Xb (w
brackets)

444.0 (17.48
inches)

Y Za (with

86.8 mm
(3.41
inches)

bezel)

37.84 mm
(1.41 inches)

Za
(without
bezel)

23.9 mm
(0.94
inches)

Zb* Zc (with

812 mm
(31.96
inches)

PSU
handle)

842 mm
(33.14
inches)

Chassis weight

Table 2. Chassis weight

System Maximum weight (with all drives/SSDs)

2.5 inch 36.6 kg (80.68 lb)

Processor specifications

The PowerEdge R840 system supports four processors - Intel Xeon Scalable Processor family.

Zc (with
chassis
rear wall
handle)

902 mm
(35.51
inches)

Supported operating systems

The PowerEdge R840 supports the following operating systems:

● Canonical Ubuntu LTS

● Citrix Hypervisor

● Microsoft Windows Server with Hyper-V

● Red Hat Enterprise Linux

● SUSE Linux Enterprise Server

● VMware ESXi

For more information on the specific versions and additions, see https://www.dell.com/support/home/Drivers/SupportedOS/

poweredge-r840.

PSU specifications

The PowerEdge R840 system supports up to two AC or DC power supply units (PSUs).

Table 3. PSU specifications

PSU Class Heat

dissipation
(maximum)

750 W AC Platinum 2891

BTU/hr

Frequency Voltage High line

50/60 Hz 100–240 V

AC,
autoranging

200V–240
V

750 W 750 W NA 10 A-5 A

Low line
100 V– 140
V

DC Current

750 W AC Titanium 2843

BTU/hr

750 W
Mixed Mode
HVDC (for
China only)

Platinum 2891

BTU/hr

50/60 Hz 200–240 V

AC,
autoranging

50/60 Hz 100–240 V

AC,
autoranging

750 W NA NA 5 A

750 W 750 W NA 10 A-5 A

Technical specifications 5

Table 3. PSU specifications

PSU Class Heat

dissipation
(maximum)

Frequency Voltage High line

200V–240
V

Low line
100 V– 140
V

DC Current

N/A 2891

BTU/hr

750 W
Mixed Mode
AC

750 W
Mixed Mode
DC (for
China only)

1100 W AC Platinum 4100

1100 W DC N/A 4416

1100 W 10
A-5 A Mixed
Mode HVDC
(for China
and Japan
only)

1600 W AC Platinum 6000

Platinum 2891

BTU/hr

N/A 2891

BTU/hr

BTU/hr

BTU/hr

Platinum 4100

BTU/hr

N/A 4100

BTU/hr

BTU/hr

N/A 240 V DC,

autoranging

50/60 Hz 100–240 VAC750 W 750 W N/A 10 A-5 A

50/60 Hz 240 V DC 750 W N/A 750 W 5 A

50/60 Hz 100–240 V

AC,
autoranging

N/A –(48–60) V

DC,
autoranging

50/60 Hz 100–240 V

AC,
autoranging

N/A 200–380 V

DC,
autoranging

50/60 Hz 100–240 V

AC,
autoranging

NA NA 750 W 4.5 A

1100 W 1050 W NA 12 A-6.5 A

NA NA 1100 W 32 A

1100 W 1050 W NA 12 A-6.5 A

NA NA 1100 W 6.4 A-3.2 A

1600 W 800 W NA 10 A

2000 W AC Platinum 7500

BTU/hr

2400 W AC Platinum 9000

BTU/hr

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase-to-phase voltage not exceeding 240

V.

NOTE: PSUs rated for 1100 W AC or 1100 W Mixed Mode HVDC and higher require high-line voltage (200–240 V AC) to

supply their rated capacity.

50/60 Hz 100–240 V

AC,
autoranging

50/60 Hz 100–240 V

AC,
autoranging

2000 W 1000 W NA 11.5 A

2400 W 1400 W NA 16 A

System battery specifications

The PowerEdge R840 system supports CR 2032 3.0-V lithium coin cell system battery.

Expansion card riser specifications

The PowerEdge R840 system supports up to six PCI express (PCIe) generation 3 expansion cards that can be installed on the
system board and expansion card risers.

6

Technical specifications

Figure 2. 24 x 2.5-inch drive system

Figure 3. 24 x 2.5-inch + 2 x 2.5-inch (rear) drive system

The following table provides detailed information about the expansion card riser specifications:

Table 4. Expansion card riser specifications

PCIe slot Riser Processor

1 X8 PCIe Riser 1 Processor 1 Full height Half length x8

2 X16 PCIe Riser 1 Processor 1 Full height Full length x16

X8 PCIe Riser 1 Processor 1 Full height Half length x8

3 On the system

board

4 On the system

board

5 X8 PCIe Riser 2 Processor 2 Full height Half length x8

6 X16 PCIe Riser 2 Processor 2 Full height Full length x16

X8 PCIe Riser 2 Processor 2 Full height Half length x8

connection

Processor 1 Low profile Half length x16

Processor 2 Low profile Half length x16

Memory specifications

.

Table 5. Memory specifications

Height Length Slot width

Technical specifications 7

Table 5. Memory specifications

Memory module
sockets

DIMM
type

DIMM
rank

DIMM
capacity

Dual processors Quad processors

Minimum
RAM

Maximum
RAM

Minimum
RAM

Maximum RAM

48 288-pins LRDIMM Octal

rank

LRDIMM Octal

rank

LRDIMM

RDIMM Dual rank 64 GB 128 GB 1536 GB 256 GB 3072 GB

RDIMM Dual rank 32 GB 64 GB 768 GB 128 GB 1536 GB

RDIMM Dual rank 16 GB 32 GB 384 GB 64 GB 768 GB

RDIMM Single

NVDIMM-N Single

DCPMM N/A 128 GB RDIMM: 192GBLRDIMM: 1536GBRDIMM: 384GBLRDIMM: 3072

Quad
rank

rank

rank

N/A 256 GB RDIMM: 384GBLRDIMM: 1536GBRDIMM: 384GBLRDIMM: 3072

256 GB 512 GB 6144 GB 1024 GB 12.288 TB

128 GB 256 GB 3072 GB 512 GB 6144 GB

64 GB 128 GB 1536 GB 256 GB 3072 GB

8 GB 16 GB 192 GB 32 GB 384 GB

16 GB RDIMM: 192GBRDIMM: 384GBRDIMM: 384GBRDIMM: 1152 GB

NVDIMM-N: 16GBNVDIMM-N:

192 GB

DCPMM: 1536GBDCPMM: 1536GBDCPMM: 248GBDCPMM: 3072

NVDIMM-N: 16GBNVDIMM-N: 192

GB

GB

GB

GB

DCPMM: 2048GBDCPMM: 3072GBDCPMM: 4096GBDCPMM: 6144

GB

N/A 512 GB RDIMM: 384GBLRDIMM: 1536GBRDIMM: 768GBLRDIMM: 3072

GB

DCPMM: 4096GBDCPMM: 6144GBDCPMM: 8192GBDCPMM: 12,288

GB

NOTE: Do not mix 8 GB RDIMMs and 16 GB NVDIMM-Ns.

NOTE: Do not mix 64 GB LRDIMMs, 128 GB LRDIMMs and 256 GB LRDIMMs.

NOTE: The maximum ambient temperature for 256 GB LRDIMMs is 30oC.

Table 6. DIMM blank population rules

Processor
configuration

Dual processor Required Required Not required Not required

Quad processor Required Required Required Required

Processor 1 Processor 2 Processor 3 Processor 4

RAID controller specifications

The PowerEdge R840 system supports:

● Internal storage controller cards: PowerEdge RAID Controller (PERC) H330, PERC H730P, H740P, HBA330, and Boot
Optimized Server Storage (BOSS-S1)

8

Technical specifications

● External storage controller cards: S140 and 12 Gbps SAS HBA

Drive specifications

Drives

The PowerEdge R840 system supports SAS, SATA, Nearline SAS hard drives/SSDs, or NVMe drives.

Table 7. Supported drive options for PowerEdge R840 system

Chassis options Configurations

Eight hard drive
chassis

Twenty-four drive
chassis

Twenty four front +
two rear drive chassis

Up to eight 2.5-inch SAS/SATA front accessible drives in slots 0–7

Up to eight 2.5-inch SATA front accessible drives in slots 0–7

Up to twenty-four 2.5-inch SAS/SATA front accessible drives in slots 0–23

Up to twelve 2.5-inch SAS/SATA front accessible drives in slots 0–11 + twelve SAS/SATA/NVMe
front accessible drives in slots 12–23

Up to twenty-four 2.5-inch NVMe front accessible drives in slots 0–23

Up to twenty-four 2.5 inch SAS/SATA front accessible drives in slots 0–23 + up to two 2.5-inch
SAS/SATA rear accessible drives

Optical drives

The PowerEdge R840 system supports one optional slim SATA DVD-ROM drive or DVD +/-RW drive.

NOTE: DVD devices support only data.

Tape drives

The PowerEdge R840 system supports external tape backup devices.

NOTE: The PowerEdge R840 system does not support internal tape drives.

Supported external tape drives:

● External RD1000 USB

● External LTO-5, LTO-6,LTO-7, and 6 Gb SAS tape drives

● 114X rack mount chassis with LTO-5, LTO-6, and LTO-7, 6 Gb SAS tape drives

● TL1000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives

● TL2000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives

● TL2000 with LTO-5, LTO-6, and LTO-7 8 Gb FC tape drives

● TL4000 with LTO-5, LTO-6, and LTO-7 6 Gb SAS tape drives

● TL4000 with LTO-5, LTO-6, and LTO-7 8 Gb FC tape drives

● ML6000 with LTO-5, LTO-6, 6 Gb SAS tape drives

● ML6000 with LTO-5, LTO-6, LTO-7 8 Gb FC tape drives

Ports and connectors specifications

USB ports

The PowerEdge R840 system supports both USB 2.0-compliant ports and USB 3.0-compliant ports:

The following table provides more information about the USB specifications:

Technical specifications

9

Table 8. USB specifications

Front panel Back panel Internal USB

● Two USB 2.0-compliant ports

● One micro USB 2.0-compliant port

for iDRAC Direct

NOTE: The micro USB 2.0

compliant port can only be
used as an iDRAC Direct or a
management port.

● One optional USB 3.0-compliant
port

● Two USB 3.0-compliant ports ● One internal USB 3.0-compliant port

NIC ports

The PowerEdge R840 system supports up to four Network Interface Controller (NIC) ports that are integrated on the network
daughter card (NDC), and are available in the following configurations:

● Four RJ-45 ports that support 10 Mbps, 100 Mbps, and 1000 Mbps

● Four RJ-45 ports that support 100 M, 1 G, and 10 Gbps

● Four RJ-45 ports, where two ports support maximum of 10 G and the other two ports maximum of 1 G

● Two RJ-45 ports that support up to 1 Gbps and 2 SFP+ ports that support up to 10 Gbps

● Four SFP+ ports that support up to 10 Gbps

● Two SFP28 ports that support up to 25 Gbps

VGA ports

The Video Graphic Array (VGA) port enables you to connect the system to a VGA display.

The PowerEdge R840 system supports two 15-pin VGA ports, one each, on the front and back of the system.

Serial connector

The serial connector on the rear of system for serial device connection and console redirection.

The PowerEdge R840 system supports one serial connector on the back panel, which is a 9-pin connector, Data Terminal
Equipment (DTE), 16550-compliant.

IDSDM or vFlash module

The PowerEdge R840 system supports optional Internal Dual SD module (IDSDM) or vFlash module. In 14th generation of
PowerEdge servers, IDSDM or vFlash module is combined into a single card module, and are available in these configurations:

● vFlash or

● vFlash and IDSDM

The IDSDM or vFlash module is located in a slot on the back of the system. The module supports three microSD cards; two
cards for IDSDM and one card for vFlash. The following capacities are supported:

● IDSDM: 16 GB, 32 GB, 64 GB

● vFlash: 16 GB

NOTE: There are two dip switches on the IDSDM or vFlash module for write-protection.

NOTE: One IDSDM card slot is dedicated for redundancy.

NOTE: Use Dell branded microSD cards associated with the IDSDM or vFlash configured systems.

10 Technical specifications

Video specifications

R840 servers support the integrated Matrox G200eW3 graphics controller with 16 MB of video frame buffer.

The following table describes the supported video resolution options.

Table 9. Supported video resolution options

Resolution Refresh rate (Hz) Color depth (bits)

1024 x 768 60 8, 16, 32

1280 x 800 60 8, 16, 32

1280 x 1024 60 8, 16, 32

1360 x 768 60 8, 16, 32

1440 x 900 60 8, 16, 32

1600 x 900 60 8, 16, 32

1600 x 1200 60 8, 16, 32

1680 x 1050 60 8, 16, 32

1920 x 1080 60 8, 16, 32

1920 x 1200 60 8, 16, 32

NOTE: 1920 x 1080 and 1920 x 1200 resolutions are supported only in reduced blanking mode.

Environmental specifications

NOTE:

For additional information about environmental certifications, please refer to the Product Environmental Datasheet

located with the Manuals & Documents on support.dell.com.

Table 10. Temperature specifications

Temperature Specifications

Storage –40–65°C (–40 °F–149°F)

Continuous operation (for altitude less than 950
m or 3117 ft)

Maximum temperature gradient (operating and
storage)

Table 11. Relative humidity specifications

Relative humidity Specifications

Storage 5% to 95% RH with 33°C (91°F) maximum dew point. Atmosphere must be

Operating 10% to 80% RH with 29°C (84.2°F) maximum dew point.

Table 12. Maximum vibration specifications

Maximum vibration Specifications

10–35°C (50 °F–95°F) with no direct sunlight on the equipment

20°C/h (36°F/h)

noncondensing at all times.

Operating 0.26 G

Storage 1.88 G

Table 13. Maximum shock pulse specifications

at 5 Hz to 350 Hz (all operation orientations)

rms

at 10 Hz to 500 Hz for 15 minutes (all six sides tested)

rms

Technical specifications 11

Table 13. Maximum shock pulse specifications

Maximum shock pulse Specifications

Operating Six consecutively executed shock pulses in the positive and negative x, y,

and z axes of 6 G for up to 11 ms.

Storage Six consecutively executed shock pulses in the positive and negative x, y,

and z axes (one pulse on each side of the system) of 71 G for up to 2 ms.

Table 14. Maximum altitude specifications

Maximum altitude Specifications

Operating 3048 m (10,000 ft)

Storage 12,000 m (39,370 ft)

Table 15. Operating temperature derating specification

Operating temperature derating Specifications

Up to 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft), above 950

m (3,117 ft).

35–40 °C (95–104 °F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft), above 950 m

(3,117 ft).

40–45 °C (104 °F–113 °F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft), above 950 m

(3,117 ft).

Standard operating temperature

Table 16. Standard operating temperature specifications

Standard operating temperature Specifications

Continuous operation (for altitude less than 950 m or
3117 ft)

10 °C–35°C (50 °F–95°F) with no direct sunlight on the equipment.

Expanded operating temperature

Table 17. Expanded operating temperature specifications

Expanded operating temperature Specifications

Continuous operation 5 °C–40°C at 5% to 85% RH with 29°C dew point.

NOTE: Outside the standard operating temperature (10

°C–35°C), the system can operate continuously in
temperatures as low as 5°C and as high as 40°C.

For temperatures 35 °C – 40°C, derate maximum allowable
temperature by 1°C per 175 m (1°F per 319 ft.) above 950 m
(3,1171 ft.).

≤ 1% of annual operating hours –5 °C–45°C at 5% to 90% RH with 29°C dew point.

NOTE: Outside the standard operating temperature (10

°C–35°C), the system can operate down to –5°C or up
to 45°C for a maximum of 1% of its annual operating
hours.

12 Technical specifications

For temperatures 40 °C – 45°C, derate maximum allowable
temperature by 1°C per 125 m (1°F per 228 ft.) above 950 m
(3.117 ft.).

NOTE: When operating in the expanded temperature range, the performance of the system may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported on the LCD

panel and in the System Event Log.

Expanded operating temperature restrictions

● The operating temperature is specified for a maximum altitude of 950 m for Fresh Air Cooling.

● Do not perform cold start below 5°C due to hard drive constraints.

● Apache Pass DIMM, NVDIMM, PCIe SSD, and NVMe are not supported.

● Tape Backup Unit (TBU) is not supported in Fresh Air.

● LRDIMM >32 GB is not supported in x4 sockets configuration.

● Rear installed drives and GPU configuration are not supported.

● Redundant power supplies are required.

● Non Dell qualified peripheral cards and /or peripheral cards greater than 25 W are not supported.

● Intel FPGA is not supported.

● 205 W SKUs, 200W/18C, 165W/12C, and 150W_8C processor are not supported on all x4 socket processor configurations.

● 165 W SKUs, 130W/8C, 115W/6C, and 105W_4C are not supported on the x4 socket processor configurations except front

x8 inch SAS/SATA drives configurations.

Ambient temperature limitations

NOTE:

The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess processor throttling,

which may impact system performance.

Table 18. Configuration-based ambient temperature restrictions with GPGPU

TDP(W) R840

● 8 x 2.5 inch
SAS/SATA

● 2 x CPU

● 2 x GPGPU

C40E4535 30 C40E4535 30 C40E4535 30 C40E4535 30 C40E4535 30

205 N N N N N N N N N N N N N N N

200 N N N N N N N N N N N N N N N

165 (Gold

6146)

150 (Gold
6144 and

6244)

150 (Gold
6240Y)

165 N Y Y N Y Y N Y Y N N Y N N Y

150 N Y Y N Y Y N Y Y N N Y N N Y

140 N Y Y N Y Y N Y Y N N Y N N Y

130 ( Gold

6134)

N N N N N N N N N N N N N N N

N N N N N N N N N N N N N N N

N N N N N N N N N N N Y N N Y

N Y Y N Y Y N Y Y N N Y N N Y

R840

● 8 x 2.5 inch
SAS/SATA

● 4 x CPU

● 2 x GPGPU

R840

● 24 x 2.5 inch
SAS/SATA

● 2 x CPU

● 2 x GPGPU

R840

● 24 x 2.5 inch
SAS/SATA

● 4 x CPU

● 2 x GPGPU

R840

● 24 x 2.5 inch
NVme

● 4 x CPU

● 2 x GPGPU

125 N Y Y N Y Y N Y Y N N Y N N Y

115 ( Gold

6128)

115 N Y Y N Y Y N Y Y N N Y N N Y

N Y Y N Y Y N Y Y N N Y N N Y

Technical specifications 13

Table 18. Configuration-based ambient temperature restrictions with GPGPU

TDP(W) R840

● 8 x 2.5 inch
SAS/SATA

● 2 x CPU

● 2 x GPGPU

C40E4535 30 C40E4535 30 C40E4535 30 C40E4535 30 C40E4535 30

R840

● 8 x 2.5 inch
SAS/SATA

● 4 x CPU

● 2 x GPGPU

R840

● 24 x 2.5 inch
SAS/SATA

● 2 x CPU

● 2 x GPGPU

R840

● 24 x 2.5 inch
SAS/SATA

● 4 x CPU

● 2 x GPGPU

R840

● 24 x 2.5 inch
NVme

● 4 x CPU

● 2 x GPGPU

105(Gold 5122
and 8156)

105(Gold 5222
and 8256)

105 N Y Y N Y Y N Y Y N N Y N N Y

100 N Y Y N Y Y N Y Y N N Y N N Y

85 N Y Y N Y Y N Y Y N N Y N N Y

70 N Y Y N Y Y N Y Y N N N N N N

N= Not Supported

Y= Supported

N Y Y N Y Y N Y Y N N Y N N Y

N Y Y N Y Y N Y Y N N Y N N Y

Table 19. Configuration-based ambient temperature restrictions with PCIe

TDP(W) R840

● 8 x 2.5 inch
SAS/SATA

● 2 x CPU

● 6 x PCIe

C40E4535 30 C40E4535 30 C40E4535 30 C40E4535 30 C40

205 Y Y Y N Y Y Y Y Y N N Y N N Y

200 Y Y Y N Y Y Y Y Y N N Y N N Y

R840

● 8 x 2.5 inch
SAS/SATA

● 4 x CPU

● 6 x PCIe

R840

● 24 x 2.5 inch
SAS/SATA

● 2 x CPU

● 6 x PCIe

R840

● 24 x 2.5 inch
SAS/SATA

● 4 x CPU

● 6 x PCIe

R840

● 24 x 2.5 inch
NVMe

● 4 x CPU

● 6 x PCIe

35 30

E45

165 (Gold

6146)

150 (Gold 6144
and 6244)

150 (Gold
6240Y)

165 Y Y Y Y Y Y Y Y Y N Y Y N N Y

150 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

140 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

130 ( Gold

6134)

125 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

115 ( Gold

6128)

115 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

105(Gold 5122
and 8156)

105(Gold 5222
and 8256)

Y Y Y N Y Y Y Y Y N N Y N N Y

Y Y Y N Y Y Y Y Y N N Y N N Y

Y Y Y N Y Y Y Y Y N Y Y N N Y

Y Y Y Y Y Y Y Y Y N Y Y N N Y

Y Y Y Y Y Y Y Y Y N Y Y N N Y

Y Y Y Y Y Y Y Y Y N Y Y N N Y

Y Y Y Y Y Y Y Y Y N Y Y N N Y

14 Technical specifications

Table 19. Configuration-based ambient temperature restrictions with PCIe

TDP(W) R840

● 8 x 2.5 inch
SAS/SATA

● 2 x CPU

● 6 x PCIe

C40E4535 30 C40E4535 30 C40E4535 30 C40E4535 30 C40

105 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

100 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

85 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

70 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y

N= Not Supported

Y= Supported

R840

● 8 x 2.5 inch
SAS/SATA

● 4 x CPU

● 6 x PCIe

R840

● 24 x 2.5 inch
SAS/SATA

● 2 x CPU

● 6 x PCIe

R840

● 24 x 2.5 inch
SAS/SATA

● 4 x CPU

● 6 x PCIe

R840

● 24 x 2.5 inch
NVMe

● 4 x CPU

● 6 x PCIe

35 30

E45

Particulate and gaseous contamination specifications

The following table defines the limitations that help avoid any damages to the IT equipment and/or, or both failure from
particulates and gaseous contamination. If the levels of particulates or gaseous pollution exceed the specified limitations and
result in equipment damage or failure, you must rectify the environmental conditions. Remediation of environmental conditions is
the responsibility of the customer.

Table 20. Particulate contamination specifications

Particulate contamination Specifications

Air Filtration

Conductive dust Air must be free of conductive dust, zinc whiskers, or other

Corrosive dust

Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.

NOTE: This condition applies to data center environments

only. Air filtration requirements do not apply to IT
equipment designed to be used outside a data center, in
environments such as an office or factory floor.

NOTE: Air entering the data center must have MERV11 or

MERV13 filtration.

conductive particles.

NOTE: This condition applies to data center and non-data

center environments.

● Air must be free of corrosive dust.

● Residual dust present in the air must have a deliquescent

point less than 60% relative humidity.

NOTE: This condition applies to data center and non-data

center environments.

Table 21. Gaseous contamination specifications

Gaseous contamination Specifications

Copper Coupon Corrosion <300 Å/month per Class G1 as defined by ANSI/

ISA71.04-1985.

Silver Coupon Corrosion <200 Å/month as defined by AHSRAE TC9.9.

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Technical specifications 15