Turning off your computer............................................................................................................................................. 6
Before working inside your computer........................................................................................................................... 6
After working inside your computer.............................................................................................................................13
2 Technology and components........................................................................................................14
Supported hard drives......................................................................................................................................................... 17
USB features........................................................................................................................................................................ 19
USB Type-C......................................................................................................................................................................... 20
Media Card Readers............................................................................................................................................................ 21
Downloading Windows drivers...........................................................................................................................................22
Turning off your computer.................................................................................................................................................25
Turning off your computer—Windows...................................................................................................................... 25
3 Major components of your system .............................................................................................. 26
4 Disassembly and reassembly....................................................................................................... 29
Removing the microSD card........................................................................................................................................ 30
Installing the microSD card...........................................................................................................................................30
Base Cover...........................................................................................................................................................................30
Removing the base cover.............................................................................................................................................30
Installing the base cover............................................................................................................................................... 32
Removing the battery................................................................................................................................................... 34
Installing the battery......................................................................................................................................................36
Removing the coin cell..................................................................................................................................................39
Installing the coin cell.................................................................................................................................................... 39
Removing the memory module....................................................................................................................................40
Contents3
Installing the memory module....................................................................................................................................... 41
Solid state drive (SSD)....................................................................................................................................................... 42
Removing the SSD........................................................................................................................................................ 42
Installing the SSD...........................................................................................................................................................42
Removing the SSD bracket.......................................................................................................................................... 43
Installing the SSD bracket............................................................................................................................................ 44
Removing the keyboard................................................................................................................................................45
Installing the keyboard.................................................................................................................................................. 48
Removing the touchpad............................................................................................................................................... 52
Installing the touchpad..................................................................................................................................................54
Removing the speakers.................................................................................................................................................57
Installing the speakers...................................................................................................................................................58
Removing the I-O daughterboard............................................................................................................................... 60
Installing the I/O daughterboard.................................................................................................................................. 61
Removing the DC-in cable............................................................................................................................................63
Installing the DC-in cable.............................................................................................................................................. 64
Removing the heat sink................................................................................................................................................ 65
Installing the heat sink...................................................................................................................................................66
System Fan...........................................................................................................................................................................67
Removing the system fan.............................................................................................................................................67
Installing the system fan............................................................................................................................................... 68
Removing the WLAN card............................................................................................................................................69
Installing the WLAN card.............................................................................................................................................. 70
Removing the display assembly.................................................................................................................................... 71
Installing the display assembly......................................................................................................................................73
Removing the display bezel.......................................................................................................................................... 75
Installing the display bezel.............................................................................................................................................77
Camera microphone module.............................................................................................................................................. 79
Removing the camera-microphone module............................................................................................................... 79
Installing the camera-microphone module .................................................................................................................79
Removing the LCD panel..............................................................................................................................................80
Installing the LCD panel................................................................................................................................................. 81
Removing the display hinges........................................................................................................................................83
Installing the display hinges.......................................................................................................................................... 83
Removing the eDP cable.............................................................................................................................................. 84
Installing the eDP cable.................................................................................................................................................85
Display back cover...............................................................................................................................................................87
4
Contents
System board.......................................................................................................................................................................88
Removing the system board........................................................................................................................................ 88
Installing the system board...........................................................................................................................................90
WiFi power cycle................................................................................................................................................................103
Supported Latitude Models........................................................................................................................................ 105
BIOS recovery using hard drive..................................................................................................................................106
BIOS recovery using USB drive..................................................................................................................................106
LCD Built-in Self Test .......................................................................................................................................................107
Use the following safety guidelines to protect your computer from potential damage and to ensure your personal safety. Unless otherwise
noted, each procedure included in this document assumes that the following conditions exist:
•You have read the safety information that shipped with your computer.
•A component can be replaced or, if purchased separately, installed by performing the removal procedure in reverse order.
NOTE: Disconnect all power sources before opening the computer cover or panels. After you finish working inside the
computer, replace all covers, panels, and screws before connecting to the power source.
WARNING: Before working inside your computer, read the safety information that shipped with your computer. For
additional safety best practices information, see the Regulatory Compliance Homepage
CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and
simple repairs as authorized in your product documentation, or as directed by the online or telephone service and
support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow
the safety instructions that came with the product.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically touching
an unpainted metal surface at the same time as touching a connector on the back of the computer.
1
CAUTION: Handle components and cards with care. Do not touch the components or contacts on a card. Hold a card by
its edges or by its metal mounting bracket. Hold a component such as a processor by its edges, not by its pins.
CAUTION: When you disconnect a cable, pull on its connector or on its pull-tab, not on the cable itself. Some cables
have connectors with locking tabs; if you are disconnecting this type of cable, press in on the locking tabs before you
disconnect the cable. As you pull connectors apart, keep them evenly aligned to avoid bending any connector pins. Also,
before you connect a cable, ensure that both connectors are correctly oriented and aligned.
NOTE: The color of your computer and certain components may appear differently than shown in this document.
Turning off your computer
Turning off your computertablet tablet— Windows
CAUTION:
computer or remove the side cover.
1. Click or tap .
2. Click or tap and then click or tap Shut down.
To avoid losing data, save and close all open files and exit all open programs before you turn off your
Ensure that the computer and all attached devices are turned off. If your computer and attached devices did
NOTE:
not automatically turn off when you shut down your operating system, press and hold the power button for about 6
seconds to turn them off.
Before working inside your computer
1. Ensure that your work surface is flat and clean to prevent the computer cover from being scratched.
6Working on your computer
2. Turn off your computer.
3. If the computer is connected to a docking device (docked), undock it.
4. Disconnect all network cables from the computer (if available).
CAUTION: If your computer has an RJ45 port, disconnect the network cable by first unplugging the cable from your
computer.
5. Disconnect your computer and all attached devices from their electrical outlets.
6. Open the display.
7. Press and hold the power button for a few seconds to ground the system board.
CAUTION: To guard against electrical shock, unplug your computer from the electrical outlet before performing Step
# 8.
CAUTION: To avoid electrostatic discharge, ground yourself by using a wrist grounding strap or by periodically
touching an unpainted metal surface at the same time as touching a connector on the back of the computer.
8. Remove any installed ExpressCards or Smart Cards from their slots.
Safety Precautions
Follow the safety precautions described in the following sections when you perform an installation or a disassembly/reassembly procedure:
•Turn off the system and all attached peripherals.
•Disconnect the system and all attached peripherals from AC power, and then remove the battery.
•Disconnect all network cables, telephone or telecommunications lines from the system.
•Use a wrist grounding strap and mat when working inside any computer system to avoid electrostatic discharge (ESD) damage.
•After removing a system component, carefully place the removed component on an anti-static mat.
•Wear shoes with non-conductive rubber soles to help reduce the risk of being shocked or seriously injured in an electrical accident.
Standby Power
Dell products with standby power must be completely unplugged before the case is opened. Systems that incorporate standby power are
essentially powered while turned off. The internal power enables the system to be remotely turned on (wake on LAN), suspended into a
sleep mode, and have other advanced power management features.
After you unplug a system and before you remove components, wait approximately 30 to 45 seconds to allow the charge to drain from
the circuits.
Bonding
Bonding is a method for connecting two or more grounding conductors to the same electrical potential. This is done through the use of a
Field Service ESD kit. When connecting a bonding wire, always ensure that it is connected to bare metal and never to a painted or nonmetal surface. The wrist strap should be secure and in full contact with your skin, and be sure to always remove all jewelry such as
watches, bracelets, or rings prior to bonding yourself and the equipment.
Figure 1. Bonding Properly
Working on your computer
7
Electrostatic Discharge Protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors,
memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent
problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is
an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in earlier
Dell products. For this reason some previously approved methods of handling parts are no longer applicable.
There are two recognized types of ESD damage: catastrophic and intermittent failures.
•Catastrophic —The damage causes an immediate and complete loss of device functionality. An example of catastrophic failure is a
memory DIMM that has received a static shock and immediately generates a "No POST/No Video" symptom with a beep code
emitted for missing or nonfunctional memory.
NOTE: Catastrophic failures represent approximately 20 percent of ESD-related failures.
•Intermittent —The DIMM receives a static shock, but the tracing is merely weakened and does not immediately produce outward
symptoms related to the damage. The weakened trace may take weeks or months to melt, and in the meantime may cause
degradation of memory integrity, intermittent memory errors, etc.
NOTE: Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of
intermittent failures means that most of the time when damage occurs, it is not immediately recognizable.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or “walking wounded”) failure. The
following image shows an example of intermittent damage to a memory DIMM trace. Although the damage is done, the symptoms may
not become an issue or cause permanent failure symptoms for some time after the damage occurs.
Figure 2. Intermittent (Latent) Damage to a Wiring Trace
Do the following to prevent ESD damage:
•Use a wired ESD wrist strap that is properly grounded.
The use of wireless anti-static straps is no longer allowed; they do not provide adequate protection.
Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased sensitivity to ESD
damage.
•Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.
•When handling static-sensitive components, grasp them by the sides, not the top. Avoid touching pins and circuit boards.
•When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing
material until you are ready to install the component. Before unwrapping the anti-static packaging, be sure to discharge static
electricity from your body.
•Before transporting a static-sensitive component, place it in an anti-static container or packaging.
The ESD Field Service Kit
The unmonitored Field Service kit is the most commonly used. Each Field Service kit includes three main components: anti-static mat,
wrist strap, and bonding wire.
Figure 4. ESD Field Service Kit
The anti-static mat is dissipative and should be used to safely place parts on during service procedures. When using an anti-static mat,
your wrist strap should be snug and the bonding wire should be connected to the mat and to bare-metal on the system being worked on.
Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. Remember, the only safe place
for ESD-sensitive items are in your hand, on the ESD mat, in the system, or inside a bag.
Figure 5. Anti-Static Mat
The wrist strap and bonding wire can be either directly connected between your wrist and bare metal on the hardware if the ESD mat is
not required, or connected to the anti-static mat to protect hardware that is temporarily placed on the mat. The physical connection of
the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is known as bonding. Use only Field Service kits with
a wrist strap, mat, and bonding wire. Never use wireless wrist straps.
Always be aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly
with a wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire a
minimum of once per week.
Working on your computer
9
Table 1. Wrist Straps
Wrist Strap and Bonding WireWireless ESD Strap (Unacceptable)
ESD Wrist Strap Tester
The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is best practice to regularly test the
strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the best method for doing this test. If you do
not have your own wrist strap tester, check with your regional office to find out if they have one. To perform the test, plug the wriststrap’s bonding-wire into the tester while it is strapped to your wrist and push the button to test. A green LED is lit if the test is
successful; a red LED is lit and an alarm sounds if the test fails.
Figure 6. Wrist Strap Tester
Insulator Elements
It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are insulators and often highly
charged.
10
Working on your computer
Table 2. Placement of Insulator Elements
Unacceptable — DIMM lying on an insulator part (plastic
heat sink shroud)
Acceptable — DIMM separated from the insulator part
Consider the Working Environment
Before deploying the ESD Field Service kit, assess the situation at the customer location. For example, deploying the kit for a server
environment is different than for a desktop or portable environment. Servers are typically installed in a rack within a data center; desktops
or portables are typically placed on office desks or cubicles.
Always look for a large open flat work area that is free of clutter and large enough to deploy the ESD kit with additional space to
accommodate the type of system that is being repaired. The workspace should also be free of insulators that can cause an ESD event. On
the work area, insulators such as Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from
sensitive parts before physically handling any hardware components.
ESD Packaging
All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are preferred. However, you
should always return the damaged part using the same ESD bag and packaging that the new part arrived in. The ESD bag should be folded
over and taped shut and all the same foam packing material should be used in the original box that the new part arrived in.
ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts should never be placed on
top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the ESD mat, in the system, or
inside an anti-static bag.
Working on your computer
11
Figure 7. ESD Packaging
Transporting Sensitive Components
When transporting ESD-sensitive components such as replacement parts or parts to be returned to Dell, it is critical to place these parts in
anti-static bags for safe transport.
ESD Protection Summary
It is strongly suggested that all field service engineers use the traditional wired ESD grounding wrist strap and protective anti-static mat at
all times when servicing Dell products. In addition, it is critical that engineers keep sensitive parts separate from all insulator parts while
performing service and that they use anti-static bags for transporting sensitive components.
Lifting Equipment
NOTE:
Do not lift greater than 50 pounds. Always obtain assistance from another person or persons, or use a
mechanical lifting device.
Adhere to the following guidelines when lifting equipment:
1. Get a firm balanced footing. Keep your feet apart for a stable base, and point your toes out.
2. Bend your knees. Do not bend at the waist.
3. Tighten stomach muscles. Abdominal muscles support your spine when you lift, offsetting the force of the load.
4. Lift with your legs, not your back.
5. Keep the load close. The closer it is to your spine, the less force it exerts on your back.
6. Keep your back upright, whether lifting or setting down the load. Do not add the weight of your body to the load. Avoid twisting your
body and back.
7. Follow the same techniques in reverse to set the load down.
12
Working on your computer
After working inside your computer
After you complete any replacement procedure, ensure that you connect external devices, cards, and cables before turning on your
computer.
CAUTION: To avoid damage to the computer, use only the battery designed for this particular Dell computer. Do not use
batteries designed for other Dell computers.
1. Connect any external devices, such as a port replicator or media base, and replace any cards, such as an ExpressCard.
2. Connect any telephone or network cables to your computer.
CAUTION: To connect a network cable, first plug the cable into the network device and then plug it into the
computer.
3. Connect your computer and all attached devices to their electrical outlets.
4. Turn on your computer.
Working on your computer13
2
Technology and components
This chapter details the technology and components available in the system.
Topics:
•UEFI BIOS
•DDR4
•Graphics options
•Supported hard drives
•HDMI 1.4a
•Battery Specifications
•USB features
•USB Type-C
•Media Card Readers
•Downloading Windows drivers
•Turning off your computer
UEFI BIOS
UEFI is an acronym for Unified Extensible Firmware Interface. The UEFI specification defines a new model for the interface between
personal computer operating systems and platform firmware. The interface consists of data tables that contain platform related
information, plus boot and runtime service calls that are available to the operating system and its loader. Together, these provide a
standard environment for booting an operating system and running pre-boot applications. One of the main differences between BIOS and
UEFI is the way applications are coded. Assembler was used if functions or applications had to be coded for the BIOS while a higher level
language code will be used to program the UEFI.
Dell UEFI BIOS implementation will supersede the existing two different sets of BIOS in the portables and desktop products into one single
UEFI BIOS moving forward.
Important Information
There is no difference in between the conventional BIOS and the UEFI BIOS unless the UEFI option is checked in the 'Boot List Option'
setting in the BIOS page. This will allow the user to create a UEFI boot option list manually without affecting the existing boot priority list.
With the implementation of UEFI BIOS, the changes are more related to the manufacturing tools and functionalities with very minimal
impact to the customer's usages.
A few things to remember are:
•If customers have a UEFI boot media, and ONLY if they have UEFI boot media (either in the optical media or via USB storage), the
one-time boot menu will show an additional section listing the UEFI boot options. Customers can view this option If they have UEFI
boot media attached, and the UEFI boot option is specified manually through the 'Boot Sequence' settings.
How to change Service Tag/Owner Tag?
When the service technician replaces a system board, it's required to set the service tag when the system restarts. Failure to set a service
tag may result in system battery not being able to charge. Therefore, it is very important that the service technician set the correct
system service tag. If a wrong service tag is set, then the technician will have to place the order for another system board replacement.
How to change Asset tag information?
To change the Asset tag information, we can use one of the following software utilities:
Customers may also report that after a motherboard replacement, the asset field is already populated in the system BIOS, and needs
to be cleared or set. For older systems and all newer systems with the UEFI BIOS platform, customers can download the Dell
Command Configure Toolkit (DCC) to customize the BIOS options or even change the ownership or asset tag from within Windows.
DDR4
DDR4 (Double Data Rate fourth generation) memory is a higher-speed successor to the DDR2 and DDR3 technologies and allows up to
512 GB in capacity, compared to the DDR3's maximum of 128 GB per DIMM. DDR4 synchronous dynamic random-access memory is
keyed differently from both SDRAM and DDR to prevent the user from installing the wrong type of memory into the system.
DDR4 needs 20 percent less or just 1.2 volts, compared to DDR3 which requires 1.5 volts of electrical power to operate. DDR4 also
supports a new, deep power-down mode that allows the host device to go into standby without needing to refresh its memory. Deep
power-down mode is expected to reduce standby power consumption by 40 to 50 percent.
DDR4 Details
There are subtle differences between DDR3 and DDR4 memory modules, as listed below:
Key notch difference
The key notch on a DDR4 module is in a different location from the key notch on a DDR3 module. Both notches are on the insertion edge
but the notch location on the DDR4 is slightly different, to prevent the module from being installed into an incompatible board or platform.
Figure 8. Notch difference
Increased thickness
DDR4 modules are slightly thicker than DDR3, to accommodate more signal layers.
Figure 9. Thickness difference
Curved edge
DDR4 modules feature a curved edge to help with insertion and alleviate stress on the PCB during memory installation.
Figure 10. Curved edge
Technology and components
15
Memory Errors
Memory errors on the system display the new 2 - Amber, 3 - White failure code. If all memory fails, the LCD does not turn on.
Troubleshoot for possible memory failure by trying known good memory modules in the memory connectors on the bottom of the system
or under the keyboard, as in some portable systems.
Graphics options
Integrated graphics controller
Table 3. Graphics specification
Integrated graphics controller specifications
Integrated Graphics ControllerIntel UHD Graphics
ModelDell Latitude 3310
Bus Type
Memory Interface
Basic Graphic frequencyPentium 5405 U: 300 Mhz
Max Graphics dynamic frequencyPentium 5405 U: 950 Mhz
This topic explains the HDMI 1.4a and its features along with the advantages.
HDMI (High-Definition Multimedia Interface) is an industry-supported, uncompressed, all-digital audio/video interface. HDMI provides an
interface between any compatible digital audio/video source, such as a DVD player, or A/V receiver and a compatible digital audio and/or
video monitor, such as a digital TV (DTV). The primary advantage is cable reduction and content protection provisions. HDMI supports
standard, enhanced, or high-definition video, plus multichannel digital audio on a single cable.
HDMI 1.4a Features
•HDMI Ethernet Channel - Adds high-speed networking to an HDMI link, allowing users to take full advantage of their IP-enabled
devices without a separate Ethernet cable.
•Audio Return Channel - Allows an HDMI-connected TV with a built-in tuner to send audio data "upstream" to a surround audio
system, eliminating the need for a separate audio cable.
•3D - Defines input/output protocols for major 3D video formats, paving the way for true 3D gaming and 3D home theater applications.
•Content Type - Real-time signaling of content types between display and source devices, enabling a TV to optimize picture settings
based on content type.
•Additional Color Spaces - Adds support for additional color models used in digital photography and computer graphics.
•4K Support - Enables video resolutions far beyond 1080p, supporting next-generation displays that will rival the Digital Cinema
systems used in many commercial movie theaters.
•HDMI Micro Connector - A new, smaller connector for phones and other portable devices, supporting video resolutions up to 1080p.
•Automotive Connection System - New cables and connectors for automotive video systems, designed to meet the unique
demands of the motoring environment while delivering true HD quality.
Advantages of HDMI
•Quality HDMI transfers uncompressed digital audio and video for the highest, crispest image quality.
•Low-cost HDMI provides the quality and functionality of a digital interface while also supporting uncompressed video formats in a
simple, cost-effective manner.
•Audio HDMI supports multiple audio formats from standard stereo to multichannel surround sound.
•HDMI combines video and multichannel audio into a single cable, eliminating the cost, complexity, and confusion of multiple cables
currently used in A/V systems.
•HDMI supports communication between the video source (such as a DVD player) and the DTV, enabling new functionality.
Battery Specifications
What is ExpressCharge ?
For a system advertised as having the ExpressCharge feature, the battery typically will have greater than 80% charge after about an hour
of charging with the system off and fully charged in about 2 hours with the system off.
Enabling Expresscharge requires that both the system and the battery that is used on the system be ExpressCharge capable. If any of the
above requirements is missing, ExpressCharge will not be enabled.
What is BATTMAN?
BATTMAN is a computer controlled battery manager intended for typical rechargeable batteries. It has the following capabilities:
•Monitors self-discharge
18
Technology and components
•Measures internal resistance
•Automatically performs repeated discharge/charge cycles to break in new batteries
•Keeps a log of all operations performed, which can be imported
•Connects via parallel port to any PC running Microsoft Windows
•Operating software, complete with source code, is available to download
USB features
Universal Serial Bus, or USB, was introduced in 1996. It dramatically simplified the connection between host computers and peripheral
devices like mice, keyboards, external drivers, and printers.
Table 6. USB evolution
TypeData Transfer RateCategoryIntroduction Year
USB 2.0480 MbpsHigh Speed2000
USB 3.0/USB 3.1 Gen 1
Port
USB 3.1 Gen 210 GbpsSuperSpeed2013
USB 3.0/USB 3.1 Gen 1 (SuperSpeed USB)
For years, the USB 2.0 has been firmly entrenched as the de facto interface standard in the PC world with about 6 billion devices sold, and
yet the need for more speed grows by ever faster computing hardware and ever greater bandwidth demands. The USB 3.0/USB 3.1 Gen 1
finally has the answer to the consumers' demands with a theoretically 10 times faster than its predecessor. In a nutshell, USB 3.1 Gen 1
features are as follows:
•Higher transfer rates (up to 5 Gbps)
•Increased maximum bus power and increased device current draw to better accommodate power-hungry devices
•New power management features
•Full-duplex data transfers and support for new transfer types
•Backward USB 2.0 compatibility
•New connectors and cable
The topics below cover some of the most commonly asked questions regarding USB 3.0/USB 3.1 Gen 1.
5 GbpsSuperSpeed2010
Speed
Currently, there are 3 speed modes defined by the latest USB 3.0/USB 3.1 Gen 1 specification. They are Super-Speed, Hi-Speed and FullSpeed. The new SuperSpeed mode has a transfer rate of 4.8 Gbps. While the specification retains Hi-Speed, and Full-Speed USB mode,
commonly known as USB 2.0 and 1.1 respectively, the slower modes still operate at 480 Mbps and 12 Mbps respectively and are kept to
maintain backward compatibility.
USB 3.0/USB 3.1 Gen 1 achieves the much higher performance by the technical changes below:
•An additional physical bus that is added in parallel with the existing USB 2.0 bus (refer to the picture below).
•USB 2.0 previously had four wires (power, ground, and a pair for differential data); USB 3.0/USB 3.1 Gen 1 adds four more for two
pairs of differential signals (receive and transmit) for a combined total of eight connections in the connectors and cabling.
•USB 3.0/USB 3.1 Gen 1 utilizes the bidirectional data interface, rather than USB 2.0's half-duplex arrangement. This gives a 10-fold
increase in theoretical bandwidth.
Technology and components
19
With today's ever increasing demands placed on data transfers with high-definition video content, terabyte storage devices, high
megapixel count digital cameras etc., USB 2.0 may not be fast enough. Furthermore, no USB 2.0 connection could ever come close to the
480Mbps theoretical maximum throughput, making data transfer at around 320 Mbps (40 MB/s) — the actual real-world maximum.
Similarly, USB 3.0/USB 3.1 Gen 1 connections will never achieve 4.8Gbps. We will likely see a real-world maximum rate of 400MB/s with
overheads. At this speed, USB 3.0/USB 3.1 Gen 1 is a 10x improvement over USB 2.0.
Applications
USB 3.0/USB 3.1 Gen 1 opens up the laneways and provides more headroom for devices to deliver a better overall experience. Where USB
video was barely tolerable previously (both from a maximum resolution, latency, and video compression perspective), it's easy to imagine
that with 5-10 times the bandwidth available, USB video solutions should work that much better. Single-link DVI requires almost 2Gbps
throughput. Where 480Mbps was limiting, 5Gbps is more than promising. With its promised 4.8Gbps speed, the standard will find its way
into some products that previously weren't USB territory, like external RAID storage systems.
Listed below are some of the available SuperSpeed USB 3.0/USB 3.1 Gen 1 products:
•External Desktop USB 3.0/USB 3.1 Gen 1 Hard Drives
•Portable USB 3.0/USB 3.1 Gen 1 Hard Drives
•USB 3.0/USB 3.1 Gen 1 Drive Docks & Adapters
•USB 3.0/USB 3.1 Gen 1 Flash Drives & Readers
•USB 3.0/USB 3.1 Gen 1 Solid-state Drives
•USB 3.0/USB 3.1 Gen 1 RAIDs
•Optical Media Drives
•Multimedia Devices
•Networking
•USB 3.0/USB 3.1 Gen 1 Adapter Cards & Hubs
Compatibility
The good news is that USB 3.0/USB 3.1 Gen 1 has been carefully planned from the start to peacefully co-exist with USB 2.0. First of all,
while USB 3.0/USB 3.1 Gen 1 specifies new physical connections and thus new cables to take advantage of the higher speed capability of
the new protocol, the connector itself remains the same rectangular shape with the four USB 2.0 contacts in the exact same location as
before. Five new connections to carry receive and transmitted data independently are present on USB 3.0/USB 3.1 Gen 1 cables and only
come into contact when connected to a proper SuperSpeed USB connection.
USB Type-C
USB Type-C is a new, tiny physical connector. The connector itself can support various exciting new USB standards like USB 3.1 and USB
power delivery (USB PD).
20
Technology and components
Alternate Mode
USB Type-C is a new connector standard that is very small. It is about a third the size of an old USB Type-A plug. This is a single
connector standard that every device should be able to use. USB Type-C ports can support a variety of different protocols using
“alternate modes,” which allows you to have adapters that can output HDMI, VGA, DisplayPort, or other types of connections from that
single USB port
USB Power Delivery
The USB PD specification is also closely intertwined with USB Type-C. Currently, smartphones, tablets, and other mobile devices often
use a USB connection to charge. A USB 2.0 connection provides up to 2.5 watts of power — that'll charge your phone, but that's about
it. A laptop might require up to 60 watts, for example. The USB Power Delivery specification ups this power delivery to 100 watts. It's bidirectional, so a device can either send or receive power. And this power can be transferred at the same time the device is transmitting
data across the connection.
This could spell the end of all those proprietary laptop charging cables, with everything charging via a standard USB connection. You could
charge your laptop from one of those portable battery packs you charge your smartphones and other portable devices from today. You
could plug your laptop into an external display connected to a power cable, and that external display would charge your laptop as you used
it as an external display — all via the one little USB Type-C connection. To use this, the device and the cable have to support USB Power
Delivery. Just having a USB Type-C connection doesn't necessarily mean they do.
USB Type-C and USB 3.1
USB 3.1 is a new USB standard. USB 3's theoretical bandwidth is 5 Gbps, while USB 3.1's is 10 Gbps. That's double the bandwidth, as fast
as a first-generation Thunderbolt connector. USB Type-C isn't the same thing as USB 3.1. USB Type-C is just a connector shape, and the
underlying technology could just be USB 2 or USB 3.0. In fact, Nokia's N1 Android tablet uses a USB Type-C connector, but underneath
it's all USB 2.0 — not even USB 3.0. However, these technologies are closely related.
Media Card Readers
NOTE:
The media card reader is integrated into the system board on portable systems. If there is a hardware failure or
the reader malfunctions, replace the system board.
The media card reader expands the usefulness and functionality of portable systems, especially when used with other devices such as
digital cameras, portable MP3 players, and handheld devices. All these devices use a form of media card to store information. Media card
readers allows for easy transfer of data between these devices.
Several different types of media or memory cards are available today. Below is a list of the different types of cards that work in the media
card reader.
SD Card Reader
1. Memory Stick
2. Secure Digital (SD)
3. Secure Digital High Capacity (SDHC)
4. Secure Digital eXtended Capacity(SDXC)
Technology and components
21
Downloading Windows drivers
1. Turn on the laptop.
2. Go to Dell.com/support.
3. Click Product Support, enter the Service Tag, and then click Submit.
NOTE: If you do not have the Service Tag, use the auto detect feature or manually browse for your laptop model.
4. Click Drivers and Downloads.
5. Select the operating system installed on your laptop.
6. Scroll down the page and select the driver to install.
7. Click Download File to download the driver.
8. After the download is complete, navigate to the folder where you saved the driver file.
9. Double-click the driver file icon and follow the instructions on the screen.
Dell Command Configure
Dell Command | Configure (Command | Configure) is a packaged software offering that provides configuration capability to business
client platforms. This product consists of a Command Line Interface (CLI) and Graphical User Interface (GUI) to configure various BIOS
features. You can use Command | Configure on Microsoft Windows Pre-installation Environment (Windows PE), Windows 7, Windows 8,
and Windows 8.1, Windows 10 operating systems, and Red Hat Enterprise Linux environments.
What’s new with Dell Command | Configure
The new features for the Dell Command | Configure includes:
•Dell Client Configuration Toolkit (CCTK) is re-branded as Dell Command | Configure (DCC).
•New User Interface.
•Support for Red Hat Enterprise Linux 7.0 Client version (64-bit) operating system.
•Support for x6 client platforms
•Support for Advanced System Management (ASM) 2.0 on Dell Precision™ Workstations for setting the non-critical upper threshold
values for cooling probes.
•Support for additional arguments: medium_high and medium_low for configuring the fan speed using --fanspeed option.
•Support for the following BIOS options:
•--backcamera.
•--fnlock
•--fnlockmode
•--gpsradio
•--keyboardbacklightonacpower
•--rearusb
•--sideusb
•--unmanagednic
Platforms Supported
These are the business clients platforms supported:
•Latitude
•OptiPlex
•Dell Precision Workstation Mobile
•Dell Precision Workstation
™
™
Dell Command | Configure will not be pre-loaded for the customer upon purchase. Customers will be able to
NOTE:
download the software from the Dell support website.
Command | Configure Graphical User Interface
The Dell Command | Configure Graphical User Interface (Command | Configure GUI) displays all Basic Input/Output System (BIOS)
configurations supported by Command | Configure. Using the GUI, you can perform the following tasks:
22
Technology and components
•Create BIOS configuration for client systems
•Validate the BIOS configuration against the BIOS configuration of the host system
•Export the customized BIOS configurations as a configuration file (.ini/.cctk), Self-Contained Executable (SCE), shell script, or report
NOTE: To apply the configuration using Command Line Interface (CLI), run the required file (.ini , .cctk, or sce).
Accessing Command | Configure From a Windows System
The following table displays the files and folders of Command | Configure on a Windows system.
Table 7. Files And Folders configuration
Files/FoldersDescription
Command | Configure Command
Prompt
Configuration WizardAllows access to the Command | Configure GUI.
Command | Configure WINPEAllows access to the Windows PE scripts to create a bootable image. For more details, see the Dell
UninstallUninstalls Command | Configure.
User’s Guide OnlineProvides access to the Command | Configure online documentation.
Allows access to the Command | Configure command prompt.
Command | Configure Installation Guide.
Technology and components23
Launching The Command | Configure GUI
NOTE: The Command | Configure GUI is supported only on systems running the Windows operating system.
To launch the GUI, click Start > All Programs > Dell > Command Configure > Configuration Wizard or double-click the Dell
Configuration Wizard on the desktop. The below screen appears:
Command Line Interface
This chapter provides a general overview of the Command Line Interface (CLI) utility. It explains how to run the commands and the syntax
details of the command line options used to configure BIOS settings for the client systems.
Running Command | Configure Commands
You can run the Command | Configure commands in two ways:
•Using Command Prompt
•Using Bootable Image
Command Prompt
To run Command | Configure commands:
1. Click Start → All Program → Dell → Command Configure → Command Configure Command Prompt.
2. Navigate to the x86 or x86_64 directory depending on the architecture of the operating system.
3. Run the Command | Configure commands.
Bootable Image
To run Command | Configure commands:
1. Copy Dell Command | Configure with the International Organization for Standardization (ISO) image to a Compact Disc (CD). For
more information, see Dell Command | Configure Installation Guide.
2. Boot the system that you want to configure from the CD.
3. Navigate to the Command Configure\x86 or Command Configure\x86_64 directory.
4. Run the Command | Configure commands.
24
Technology and components
Turning off your computer
Turning off your computer—Windows
CAUTION: To avoid losing data, save and close all open files and exit all open programs before you turn off your
computer or remove the side cover.
1. Click or tap .
Click or tap
2.
and then click or tap Shut down.
NOTE: Ensure that the computer and all attached devices are turned off. If your computer and attached devices did
not automatically turn off when you shut down your operating system, press and hold the power button for about 6
seconds to turn them off.
Technology and components25
3
26Major components of your system
Major components of your system
Major components of your system27
1. Back cover
2. Battery
3. Solid state drive (SSD)
4. Touchpad
5. Dc-in
6. System board
7. Speakers
8. Palmrest
9. LCD
10. I/O board
11. WLAN
12. Memory
13. Coin cell
14. System fan
15. Heatsink
28Major components of your system
Disassembly and reassembly
Screw List
The following table shows the screw list and the images for Latitude 3310, for different components and locations.
Table 8. Screw Size List
ComponentQuantityScrew typeImage
4
•System board to palmrest
•DC-In bracket
•LCD Panel to back cover
•Touchpad frame to palmrest
•SSD bracket to palmrest
•Battery retaining bracket
•Battery support bracket
•I/O Board to palmrest
•Fan to palmrest
Hinges to LCD back cover6M2.5 x 3.5
•Touchpad to palmrest
•I/O Daughter
•I/O Board to palmrest
Hinges to palmrest5M2.5 x 5.0
•LCD bezel to back cover
•DC-In bracket to MB
•I/O board to palmrest
•System board to palmrest
•SSD to SSD Bracket
•2
•1
•4
•3
•2
•2
•1
•1
•2
•3
•1
•1
•2
•1
•1
•1
•1
M2.0 x 2.0
M2.0 x 3.0
M2.0 x 3.0 (large head)
M2.0 x 4.0
•Base cover to palmrest
•Heatsink to system board
•10
•4
M2.5 x 8.0Captive screws (Part of the
Recommended tools
The procedures in this document require the following tools:
•Phillips #0 screwdriver
•Phillips #1 screwdriver
•Plastic scribe
NOTE: The #0 screw driver is for screws 0-1 and the #1 screw driver is for screws 2-4.
base cover)
Disassembly and reassembly29
microSD card
Removing the microSD card
1. Press in on the microSD card to release it from the computer.
2. Remove the microSD card from the computer.
Installing the microSD card
Slide the microSD card into its slot until it clicks into place.
Base Cover
Removing the base cover
1. Follow the procedure in Before working inside your computer.
2. Remove the:
a) microSD card
3. Loosen the 10 'M2.5xL8.0' captive screws that secure the base cover to the computer.
30
Disassembly and reassembly
Loading...
+ 78 hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.