THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
A
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
C
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
Compal Electronics, Inc.
Title
Cover Sheet
Size Document NumberRev
Custom
LA-9331P
D
Date:Sheetof
E
161Friday, June 22, 2012
0.1
A
B
C
D
E
eDP to LVDS
RTD2136
P.37
eDP deMux
PS8338
FFS
P.28
HDMI
Intel
Haswell
4-lane eDP
LNG3DMTR
P.46
Fan Control
EMC1412
P.51
CPU XDP
Conn.
P.7
P.30
LVDS Mux
PI3LVD1012
eDP MUX
PS8321
P.38
P.29
LVDS Conn.
eDP Conn.
11
P.39P.39
P.30
LVDS Mux
PI3LVD1012
eDP MUX
PS8321
Processor
DP/HDMI
LVDS to DP SW
STDP4028
HDMI to LVDS SW
STDP6038
HDMI Redriver
HDMI 1.3 Input
HDMI 1.4a Output
22
Conn.
miniDP Conn.
Mini Card #1(Half)
WLAN/WiMax
BT4.0+LE/WiGig
DMC
P.32
DP Redriver
P.27
P.48
PS8330
HDMI Redriver
PS121
PS121
HDMI SW
TS3DV421
P.35
L
VDS Mux
PI3LVD1012
P.34
HDMI MUX
P.33P.33
P.32
P.27
PS8271
HDMI MUX
.36
P
PS8271
P.31
P.36
Display MiniCard
P.48
33
RJ45 Conn.
USB3.0 Daughter Board
P.50
9 in 1 Conn.
Card Reader Board
LAN(GbE)
E2201 Killer
Card Reader
RTS5209
P.41
P.50
SPI ROM
RTC conn.
Power On/Off CKT.
44
DC/DC Interface CKT.
Power Circuit DC/DC
P.54, 55, 56, 57, 58, 59, 60, 61
P.52
53
P.
A
8MB
ENE KC3810
B
eDP
LVDS
HDMI
DP1.2
DP/HDMI
P.20
P.40
VPK MCU
VPK Daughter Board
MXM III
Conn.
P.26
USB2.0
PCI-E 2.0
USB2.0
PCI-E 2.0
PCI-E 2.0
PCI-E 2.0
Int.KBD
PEGx16
SPI
Gen 3
4
C 47W/57W
Scoket G3
rPGA-947
P.6, 7, 8, 9, 10, 11, 12
DMI x4
100MHz
5GT/s
Intel
Lynx Point
PCH
HM87
BGA 695 Balls
P.17, 18, 19, 20, 21, 22, 23, 24, 25
LPC Bus
ENE KB9012
ouch Pad
T
P.50
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
C
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
Memory Bus DDRIII
Dual Channel
1.35V DDRIII 1600 MHz
USB3.0
USB 2.0
USB3.0
USB 2.0
USB3.0
USB 2.0
USB3.0
USB 2.0
204pin DDRIII SO-DIMM x4
BANK 0, 1, 2, 3
USB3.0 Rediver
USB3.0 Rediver
USB3.0 Rediver
USB3.0 Rediver
P.49
PS8713
P.49
PS8713
PS8713
PS8713
USB3.0 Daughter Board
USB2.0
USB2.0
USB2.0
USB2.0
SATA 3.0
SATA 3.0
SATA 3.0
SATA Rediver
PS8520BT
SATA Rediver
PS8520BT
SATA Rediver
PS8520BT
P.46
P.47
P.47
HD Audio
P.40
Audio Codec
ALC3661
TI
TPA3113D2
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
D
P.13, 14, 15, 16
USB 3.0/USB 2.0 Conn.
( USB Charger Port )
USB 3.0/USB 2.0 Conn.
P.49
P.49
USB 3.0/USB 2.0 Conn.
USB 3.0/USB 2.0 Conn.
P.50
with eDP Panel
Digital Camera
Digital Camera
AlienFX/ELC
3D IR
HDD Conn. 1
HDD Conn. 2
HDD Conn. 3
In ODD Bay (In place of ODD)
ODD Conn.
Mini Card #3(Full)SATA 3.0
mSATA
Combo Jack
( iPhone & Nokia compatible)
Headphone Jack
Headphone Jack
P.42
P.43
Array Mics
Array Mics
Int. Speaker (2.5W*4)
Title
Size Document NumberRev
Custom
Date:Sheetof
P.30
54
P.
P.45,46
P.52
P.46
P.46
P.47
P.47
P.47
P.42
P.42
P.42
P.30
P.39
P.43
Block Diagram
LA-9331P
with LVDS Panel
Camera with eDP Panel
Camera with LVDS Panel
E
261Friday, June 22, 2012
0.1
A
B
C
D
E
Compal Confidential
Project Code : VAS00
File Name : LA-9331P
11
LS-9335P
POWER BUTTON/B
on/off SW
Led x 2
L
S-9336P
INDICATOR/B
Led-HDD
22
33
Led-Wireless
Led-CapsLock
To M/B
Hot Bar
FFC
6 pin
Lid
Tron Light
FFC
20 pin
LS-9337P
CardReader /B
Card Slot
KSI/KSO
30 pin
VPK Keyboard
40 pin
Backlight / 8 Pressure-sense Analog Signals
To USB30/B
FFC
30 pin
22 pin
HDD2 conn.
LS-9338P
VPK Daughter/B
VPK MCUMAX7313
FFC
16 pin
Touch Pad
4 pin
FFC
FFC
60 pin
PWM
Key Pad
22 pin
HDD1 conn.
Wire
12pin
6 pin
10 pin
Hot Key
Hot Bar
LS-9334P
LOGO /B
Led x 2
6pin
Hot BarHot Bar
LS-9333PLS-9331PLS-9332P
Alien head badge/B Alien Slits-L Light/BAlien Slits-R Light/B
Led x 2Led x 2Led x 2
LR
Wire
6pin
LS-933BP
Tron L/B
Led x 1
44
Wire
10pin
To M/B
Wire
6pin
LS-933CP
Tron R/B
Led x 1
50pin
B To B conn.
WireWireWire
6pin6pin
44 pin
Coaxial/Wire Combo
20 pin
LF-XXXXP
FPC
50pin
B To B conn.
LA-9331P M/B
Camera
LCD Panel
HDD3ODD
HDD in ODD Bay Cable
RJ45
USB3.0
USB3.0
LS-9339P
USB30 /B
A
LS-933DP
Tron FL/B
Led x 1
LS-933EP
Tron FR/B
Led x 1
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
B
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
A
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
Connetion
JUSB1 (Left side)
JUSB2 (Left side)
NA3
NA
JUSB3 (Right side)
JUSB4 (Right side)
Compal Secret Data
Deciphered Date
USB2.0
PCI EXPRESS
Lane 1/USB3.0 Port 3
Lane 2/USB3.0 Port 4
Lane 3
Lane 4
Lane 5
Lane 6
Lane 7
Lane 8
USB PORT#0DESTINATION
JUSB1(USB3.0 P1)
JUSB2(USB3.0 P2)
1
JUSB3(USB3.0 P5)
2
JUSB4(USB3.0 P6)
3
JMINI1 (WLAN)
4
JMINI2 (DMC)
5
6
AlienFX/ELC
IR SENSOR
7
No
8
9
10
11
12
13
ne
None
None
e
DP CAMERA
LVDS CAMERA
PK K/B
V
DESTINATION
None
None
10/100/1G LAN
CARD READER
None
None
None
None
Compal Electronics, Inc.
Title
Notes List
Size Document NumberRev
Custom
LA-9331P
Date:Sheetof
461Friday, June 22, 2012
0.1
5
SMBUS Address [TBD]
R10
PCH
DD
U11
U8
R7
MEM_SMBCLK
MEM_SMBDATA
SML0CLK
SML0DATA
N11K6
SML1CLK
SML1DATA
+3VS
SCL2
SDA2
QH9B
EC_SMB_CK2
EC_SMB_DA2
2.2K
+3VS
2.2K
79
80
EC_SMB_CK2
EC_SMB_DA2
0 Ω
0 Ω
QH9A
CC
KBC
BB
KB9012
2.2K
2.2K
77
SCL1
SDA1
AA
EC_SMB_CK1
78EC_SMB_DA1
EC_SMB_CK2_R
EC_SMB_DA2_R
0 Ω
0 Ω
+3VALW_EC
4
2K
2.
2.2K
2.2K
2.2K
2.2K
2.2K
+3VS
+3V_MXM
+3V_PCH
+3V_PCH
+3V_PCH
QV2B
CSCL
CSDA
QV2A
22 Ω
22 Ω
VPK_SMB_CK2
VPK_SMB_DA2
QV8
QV6
100 Ω
100 Ω
+3VS
0 Ω
0 Ω
0 Ω
0 Ω
0 Ω0 Ω
CLK_SMB
DAT_SMB
QH9A
H9B
Q
4.7K
4.7K
CIICSCL
CIICSDA
EC_HDMI_DAT_R
EC_HDMI_CLK_R
EC_HDMI_CLK
EC_HDMI_DAT
4.7K
4.7K
VGA_SMB_CK1
VGA_SMB_DA1
MXM_CURI2C_CLK
MXM_CURI2C_DATA
+DVCC33
4.7K
4.7K
+3V_MXM
3
2.2K
2.2K
111
RTD2136S
112
+3VS
LVDS transfer DP
B14
STDP4028
C13
HDMI IN
72
STDP6038
71
VPK
43
MSP430F5508
42
Thermal sensor
8
ADM1032
7
Thermal sensor
8
ADM1032
7
70
MXM1 CONN
68
MXM Current Monitor
5
HPA00900
6
4
5
BATT CONN
+3VS
PCH_SMBCLK
PCH_SMBDATA
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [0FFFFh to 0FF80h]
MXM FAN CONTROL
SMBUS Address [100_1100]
SYSTEM FAN CONTROL
SMBUS Address [100_1100]
SMBUS Address []
SMBUS Address []
SMBUS Address []
2
0 Ω
0 Ω
DDR_XDP_SMBCLK_R1
DDR_XDP_SMBDAT_R1
0 Ω
MINI2_SMBCLK
MINI2_SMBDATA
0 Ω
202
200
202
200
202
200
202
200
4
6
30
32
30
32
15
16
DIMM1
DIMM2
DIMM3
DIMM4
53
51
G sensor
LNG3DM
Touch pad
XDP
mSATA
DMC
1
SMBUS Address [A2]
SMBUS Address [A6]
SMBUS Address [A0]
SMBUS Address [A4]
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
SMBUS Address [TBD]
0 Ω
0 Ω
PU700
5
4
SMBUS Address [000_1001]
Security Classification
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
CAD Note:
Trace width=12~15 mil, Spcing=20 mils
Max trace length= 500 mil
+VCCIO_OUT+VCCIO_OUT
XDP_PREQ#_R
XDP_PRDY#_R
CFG0
CFG1
CFG2
CFG3
XDP_OBS0
XDP_OBS1
CFG4
CFG5
CFG6
CFG7
CFD_PWRBTN#_XDP
SYS_PWROK_XDP
DDR_XDP_SMBDAT_R1
DDR_XDP_SMBCLK_R1
XDP_TCLK_R
XDP_DBRESET# <17>
RC45100_0402_1%~D
12
RC5575_0402_1%~D
12
RC49100_0402_1%~D
12
JXDP1
1
GND0
3
OBSFN_A0
5
OBSFN_A1
7
GND2
9
OBSDATA_A 0
11
OBSDATA_A 1
13
GND4
15
OBSDATA_A 2
17
OBSDATA_A 3
19
GND6
21
OBSFN_B0
23
OBSFN_B1
25
GND8
27
OBSDATA_B 0
29
OBSDATA_B 1
31
GND10
33
OBSDATA_B 2
35
OBSDATA_B 3
37
GND12
39
PWRGOO D/HOOK0
41
HOOK1
43
VCC_OBS_ AB
45
HOOK2
47
HOOK3
49
GND14
51
SDA
53
SCL
55
TCK1
57
TCK0
59
GND16
SAMTE_BSH-030-01-L-D-A
GND1
OBSFN_C0
OBSFN_C1
GND3
OBSDATA_C0
OBSDATA_C1
GND5
OBSDATA_C2
OBSDATA_C3
GND7
OBSFN_D0
OBSFN_D1
GND9
OBSDATA_D0
OBSDATA_D1
GND11
OBSDATA_D2
OBSDATA_D3
GND13
ITPCLK/HOOK 4
ITPCLK#/HO OK5
VCC_OBS_ CD
RESET#/HOO K6
DBR#/HOOK 7
GND15
TD0
TRST#
TDI
TMS
GND17
CONN@
CRB Rev 0.7 no pull up
2
CFG17
4
CFG16
6
8
CFG8
10
CFG9
12
14
CFG10
16
CFG11
18
20
CFG19
22
CFG18
24
26
CFG12
28
CFG13
30
32
CFG14
34
CFG15
36
38
CLK_XDP
40
CLK_XDP#
42
44
XDP_RST#_RCPU_PWR_DEBUG_R
46
XDP_DBRESET#
48
50
XDP_TDO
52
XDP_TRST#_R
54
XDP_TDI
56
XDP_TMS_R
58
60
PU/PD for JTAG signals
XDP_DBRESET#_R
XDP_TMS
XDP_TDI_R
XDP_PREQ#
XDP_TDO_R
XDP_TCLK
XDP_TRST#
CFG17<9>
CFG16<9>
CFG8<9>
CFG9<9>
CFG10<9>
CFG11<9>
CFG19<9>
CFG18<9>
CFG12<9>
CFG13<9>
CFG14<9>
CFG15<9>
RC1440_0402_5%~D
12
RC1450_0402_5%~D
12
CPU_PLTRST#_R
12
RC91K_0402_1%~D
RC191K_0402_1%~D
12
RC2751_0402_1%~D@
12
RC2951_0402_1%~D
12
RC3251_0402_1%~D@
12
RC3551_0402_1%~D
12
RC4251_0402_1%~D
12
RC4151_0402_1%~D
12
+1.05VS
+3VS
CLK_CPU_ITP <18>
CLK_CPU_ITP# <18>
CAD Note:
PLACE PULL-UP RESISTOR WITHIN 2 INCH OF THE CPU
AA
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
1 : Disabled; No Physical Display Port
attached to Embedded Display Port
0 : Enabled; An external Display Port device is
connected to the Embedded Display Port
CFG4
Display Port Presence Strap
CFG6
CFG5
PCIE Port Bifurcation Straps
11: (Default) x16 - Device 1 functions 1 and 2 disabled
10: x8, x8 - Device 1 function 1 enabled ; function 2
CFG[6:5]
disabled
01: Reserved - (Device 1 function 1 disabled ; function
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
CAD Note: Place the PU resistors close to CPU
RC60 close to CPU 300 - 1500mils
H_CPU_SVIDALRT#
12
RC6943_0402_5%~D
CAD Note: Place the PU resistors close to CPU
RC63 close to CPU 300 - 1500mils
VIDSOUT
CAD Note: RC67 SHOULD BE PLACED CLOSE TO CPU
VCCSENSE_R
12
RC670_0402_5%~D
CAD Note: RC68 SHOULD BE PLACED CLOSE TO CPU
VSSSENSE_R
12
RC680_0402_5%~D
VSSSENSE_R <11>
B+_BIAS
330K_0402_5%~D
12
RC72
RUN_ON_CPU1.5VS3RUN_ON_CPU1.5VS3
34
QC4B
DMN66D0LDW-7_SOT363-6~D
5
RUN_ON_CPU1.5VS3# <6,56>
+1.35V
QC3
AO4304L_SO8
8
7
6
5
4
0.022U_0402_25V7K~D
1M_0402_5%~D
12
RC143
1
2
+1.05VS
RC40_0603_5%~D@
RESISTOR STUFFING OPTIONS ARE
PROVIDED FOR TESTING PURPOSES
+1.35V_CPU_VDDQ
CC136
1
2
3
1
2
1
2
+1.35V_CPU_VDDQ
10U_0603_6.3V6M~D
12
CC135
1
2
12
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
1
CC180
2
22U_0805_6.3V6M~D
22U_0805_6.3V6M~D
CC181
1
2
C_0805NEW
20K_0402_5%~D
@
RC73
+VCCIO_OUT
VDDQ DECOUPLING
10U_0603_6.3V6M~D
1
1
CC169
CC170
2
2
22U_0805_6.3V6M~D
CC183
CC182
1
1
2
2
C_0805NEW
T113 PAD~D@
T114 PAD~D@
T112 PAD~D@
T116 PAD~D@
+1.35V
CC1510.1U_0402_10V7K~D
12
CC1520.1U_0402_10V7K~D
12
T115 PAD~D@
+VCC_CORE
T151 PAD~D@
T152 PAD~D@
T153 PAD~D@
+VCCIO_OUT
T156 PAD~D@
+VCOMP_OUT
T160 PAD~D@
T159 PAD~D@
+1.05VS
10K_0402_5%~D
12
@
RC80
CPU_PWR_DEBUG
10K_0402_5%~D
12
@
RC71
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
1
CC168
2
22U_0805_6.3V6M~D
CC184
1
2
C_0805NEW
C_0805NEW
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
1
1
CC161
CC162
2
2
22U_0805_6.3V6M~D
22U_0805_6.3V6M~D
CC186
CC185
1
1
2
2
C_0805NEW
C_0805NEW
10U_0603_6.3V6M~D
1
1
CC163
CC164
CC165
2
2
22U_0805_6.3V6M~D
22U_0805_6.3V6M~D
22U_0805_6.3V6M~D
CC189
CC187
CC188
1
1
2
2
C_0805NEW
C_0805NEW
T168 PAD~D@
T154 PAD~D@
VIDSCLK<62>
CPU_PWR_DEBUG<6>
T157 PAD~D@
T158 PAD~D@
T162 PAD~D@
T163 PAD~D@
10U_0603_6.3V6M~D
330U_D2_2VM_R6M~D
1
CC167
1
+
CC166
2
2
22U_0805_6.3V6M~D
22U_0805_6.3V6M~D
CC190
CC191
1
1
2
2
C_0805NEW
C_0805NEW
+1.35V_CPU_VDDQ
VCCSENSE_R
H_CPU_SVIDALRT#
VIDSCLK
VIDSOUT
+VCC_CORE
AA
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWING IS THE PROPRIETARY PROPERTY OF COMPAL ELEC TRONICS, INC. AND CONTAINS CONFIDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRAN SFERED FROM THE CUSTODY OF THE COMPETENT DIVISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COMPAL ELECTRONICS, INC. NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS
5
4
MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT PRIOR WRITTEN CONSE NT OF COMPAL ELECTRONICS, INC.
3
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
Compal Electronics, Inc.
Title
CPU (7/7) VSS
Size Document NumberRev
Custom
LA-9331P
2
Date:Sheetof
1
1261Friday, June 22, 2012
0.1
5
DD
DDR_A_DQS#[0..7]<7,14>
DDR_A_D[0..63]<7, 14>
DDR_A_DQS[0..7]<7,14>
DDR_A_MA[0..15]<7,14>
Layout Note:
Place near JDIMMA
CC
BB
AA
+1.35V
1U_0402_6.3V6K~D
1
1
CD3
2
2
+1.35V
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD7
1
1
2
2
Layout Note:
Place near JDIMMA.203,204
+0.675VS
1
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
CD4
CD8
1
2
1U_0402_6.3V6K~D
CD17
SA0
1
0
0
1U_0402_6.3V6K~D
1
1
CD5
CD6
2
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD10
CD9
1
1
2
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD18
2
2
SA1
001
DIMM1A
1
DIMMB
DIMMC
1
DIMMD
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
330U_SX_2VY~D
@
1
CD13
CD11
CD74
1
1
2
1
CD19
2
+
2
2
1U_0402_6.3V6K~D
CD20
10K_0402_5%~D
10K_0402_5%~D
All VREF traces should
have 20 mil trace width
CD14
+3VS
RD38
12
RD21
@
12
4
RD39
@
10K_0402_5%~D
12
+3VS
RD22
10K_0402_5%~D
12
+DIMM0_1_VREF_CPU
2.2U_0402_6.3V6M
1
CD1
2
DDR_CKE4_DIMMC<7>
DDR_A_BS2<7,14>
M_CLK_DDR4<7>
M_CLK_DDR#4<7>
DDR_A_BS0<7,14>
DDR_A_WE#<7,14>
DDR_A_CAS#<7,14>
DDR_CS5_DIMMC#<7>
0.1U_0402_25V6K~D
CD21
1
1
2
2
3
JDIMMA H=4mm
JDIMM1
1
VREF_DQ
0.1U_0402_25V6K~D
DDR_A_D0
DDR_A_D1
1
CD2
2
DDR_A_D2
DDR_A_D3
DDR_A_D8
DDR_A_D9D DR_A_D13
DDR_A_DQS#1
DDR_A_DQS1
DDR_A_D10
DDR_A_D11
DDR_A_D17
DDR_A_DQS#2
DDR_A_DQS2
DDR_A_D18
DDR_A_D19
DDR_A_D24
DDR_A_D25
DDR_A_D26
DDR_A_D27
DDR_CKE4_DIMMCDDR_CKE5_DIMMC
DDR_A_BS2
DDR_A_MA3
M_CLK_DDR4
M_CLK_DDR#4
DDR_A_MA10
DDR_A_BS0
DDR_A_WE#
DDR_A_CAS#
DDR_A_MA13
DDR_CS5_DIMMC#
DDR_A_D32
DDR_A_D33
DDR_A_DQS#4
DDR_A_DQS4
DDR_A_D34
DDR_A_D35
DDR_A_D40
DDR_A_D41
DDR_A_D42
DDR_A_D43
DDR_A_D48
DDR_A_D49
DDR_A_DQS#6
DDR_A_DQS6
DDR_A_D50
DDR_A_D51
DDR_A_D56
DDR_A_D57
DDR_A_D58
DDR_A_D59
2.2U_0402_6.3V6M
CD22
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DM0
13
VSS
15
DQ2
17
DQ3
19
VSS
21
DQ8
23
DQ9
25
VSS
27
DQS1#
29
DQS1
31
VSS
33
DQ10
35
DQ11
37
VSS
39
DQ16
41
DQ17
43
VSS
45
DQS2#
47
DQS2
49
VSS
51
DQ18
53
DQ19
55
VSS
57
DQ24
59
DQ25
61
VSS
63
DM3
65
VSS
67
DQ26
69
DQ27
71
VSS
73
CKE0
75
VDD
77
NC
79
BA2
81
VDD
83
A12/BC#
85
A9
87
VDD
89
A8
91
A5
93
VDD
95
A3
97
A1
99
VDD
101
CK0
103
CK0#
105
VDD
107
A10/AP
109
BA0
111
VDD
113
WE#
115
CAS#
117
VDD
119
A13
121
S1#
123
VDD
125
TEST
127
VSS
129
DQ32
131
DQ33
133
VSS
135
DQS4#
137
DQS4
139
VSS
141
DQ34
143
DQ35
145
VSS
147
DQ40
149
DQ41
151
VSS
153
DM5
155
VSS
157
DQ42
159
DQ43
161
VSS
163
DQ48
165
DQ49
167
VSS
169
DQS6#
171
DQS6
173
VSS
175
DQ50
177
DQ51
179
VSS
181
DQ56
183
DQ57
185
VSS
187
DM7
189
VSS
191
DQ58
193
DQ59
195
VSS
197
SA0
199
VDDSPD
201
SA1
203
VTT
205
GND1
207
BOSS1
TYCO_2-2013022-1
CONN@
DQS0#
DQS0
DQ12
DQ13
RESET#
DQ14
DQ15
DQ20
DQ21
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
CKE1
CK1#
RAS#
ODT0
ODT1
VREF_CA
DQ36
DQ37
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
EVENT#
GND2
BOSS2
2
VSS
4
DQ4
6
DQ5
8
VSS
10
12
14
VSS
16
DQ6
18
DQ7
20
VSS
22
24
26
VSS
28
DM1
30
32
VSS
34
36
38
VSS
40
42
44
VSS
46
DM2
48
VSS
50
52
54
VSS
56
58
60
VSS
62
64
66
VSS
68
70
72
VSS
74
76
VDD
78
A15
80
A14
82
VDD
84
A11
86
A7
88
VDD
90
A6
92
A4
94
VDD
96
A2
98
A0
100
VDD
102
CK1
104
106
VDD
108
BA1
110
112
VDD
114
S0#
116
118
VDD
120
122
NC
124
VDD
126
128
VSS
130
132
134
VSS
136
DM4
138
VSS
140
142
144
VSS
146
148
150
VSS
152
154
156
VSS
158
160
162
VSS
164
166
168
VSS
170
DM6
172
VSS
174
176
178
VSS
180
182
184
VSS
186
188
190
VSS
192
194
196
VSS
198
200
SDA
202
SCL
204
VTT
206
208
+1.35V+1.35V
DDR_A_D4
DDR_A_D5
DDR_A_DQS#0
DDR_A_DQS0
DDR_A_D6
DDR_A_D7
DDR_A_D12
DDR3_DRAMRST#_R
DDR_A_D14
DDR_A_D15
DDR_A_D20DDR_A_D16
DDR_A_D21
DDR_A_D22
DDR_A_D23
DDR_A_D28
DDR_A_D29
DDR_A_DQS#3
DDR_A_DQS3
DDR_A_D30
DDR_A_D31
DDR_A_MA15
DDR_A_MA14
DDR_A_MA11DDR_A_MA12
DDR_A_MA7DDR_A_MA9
DDR_A_MA6DDR_A_MA8
DDR_A_MA4DDR_A_MA5
DDR_A_MA2
DDR_A_MA0DDR_A_MA1
M_CLK_DDR5
M_CLK_DDR#5
DDR_A_BS1
DDR_A_RAS#
DDR_CS4_DIMMC#
M_ODT4
M_ODT5
DDR_A_D36
DDR_A_D37
DDR_A_D38
DDR_A_D39
DDR_A_D44
DDR_A_D45
DDR_A_DQS#5
DDR_A_DQS5
DDR_A_D46
DDR_A_D47
DDR_A_D52
DDR_A_D53
DDR_A_D54
DDR_A_D55
DDR_A_D60
DDR_A_D61
DDR_A_DQS#7
DDR_A_DQS7
DDR_A_D62
DDR_A_D63
M_THERMAL#
+0.675VS+0.675VS
DDR_CKE5_DIMMC <7>
M_CLK_DDR5 <7>
M_CLK_DDR#5 <7>
DDR_A_BS1 <7,14>
DDR_A_RAS# <7, 14>
DDR_CS4_DIMMC# <7>
M_ODT4 <7>
M_ODT5 <7>
1
2
M_THERMAL# <13,14,15,43>
PCH_SMBDATA <6,13,14,15,19,49,50,51,53>
PCH_SMBCLK <6,13,14,15,19,49,50,51,53>
+V_SM_VREF_CNT
2.2U_0402_6.3V6M
0.1U_0402_25V6K~D
CD15
1
2
2
DDR3_DRAMRST#_R
CD16
+1.35V
@
12
RD291K_0402_5%~D
All VREF traces should
have 20 mil trace width
CPU
1K_0402_5%~D
12
RD27
CRB Rev 0.7 is depop
2(H8)
JDIMMA(H4)
3(H5.2)
4(H9.2)
1
DDR3_DRAMRST#_CPU <6>DDR3_DRAMRST#_R<13,14,15>
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
2
Compal Electronics, Inc.
Title
DDRIII DIMMA
Size Document NumberRev
Custom
LA-9331P
Date:Sheetof
1
1361Friday, June 22, 2012
0.1
5
4
3
2
1
DD
+DIMM0_1_CA_CPU
0.1U_0402_25V6K~D
2.2U_0402_6.3V6M
CD23
1
All VREF traces should
have 20 mil trace width
DDR_B_DQS#[0..7]<7,15>
DDR_B_D[0..63]<7, 15>
DDR_B_DQS[0..7]<7,15>
DDR_B_MA[0..15]<7,15>
Layout Note:
Place near JDIMMB
CC
BB
AA
+1.35V
+1.35V
1
2
+0.675VS
10U_0603_6.3V6M~D
CD29
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD26
CD25
2
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD31
CD30
1
1
1
2
2
2
Layout Note:
Place near JDIMMB.203,204
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD39
CD40
2
2
SA0
SA1
001
DIMMA
1
DIMMB
1
DIMMC
0
1
DIMMD
0
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD27
CD28
2
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD32
CD33
1
1
2
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD41
CD42
2
2
330U_SX_2VY~D
@
1
CD36
CD34
CD35
1
+
2
2
+3VS
RD40
10K_0402_5%~D
12
RD23
@
10K_0402_5%~D
12
RD24
10K_0402_5%~D
12
+3VS
RD41
@
10K_0402_5%~D
12
2
DDR_CKE6_DIMMD<7>
DDR_B_BS2<7,15>
M_CLK_DDR6<7>
M_CLK_DDR#6<7>
DDR_B_BS0<7,15>
DDR_B_WE#<7,15>
DDR_B_CAS#<7,15>
DDR_CS7_DIMMD#<7>
0.1U_0402_25V6K~D
1
2
DDR_B_D0
DDR_B_D1
CD24
1
DDR_B_D2
2
DDR_B_D3
DDR_B_D8
DDR_B_D9
DDR_B_DQS#1
DDR_B_DQS1
DDR_B_D10
DDR_B_D11
DDR_B_D16
DDR_B_D17
DDR_B_DQS#2
DDR_B_DQS2
DDR_B_D18
DDR_B_D19
DDR_B_D24
DDR_B_D25
DDR_B_D26
DDR_B_D27
DDR_CKE6_DIMMD
DDR_B_BS2
DDR_B_MA12
DDR_B_MA9
DDR_B_MA8
DDR_B_MA5
DDR_B_MA3
DDR_B_MA1
M_CLK_DDR6
M_CLK_DDR#6
DDR_B_MA10
DDR_B_BS0
DDR_B_WE#
DDR_B_CAS#
DDR_B_MA13
DDR_CS7_DIMMD#
DDR_B_D32
DDR_B_D33
DDR_B_DQS#4
DDR_B_DQS4
DDR_B_D34
DDR_B_D35
DDR_B_D40
DDR_B_D41
DDR_B_D42
DDR_B_D43
DDR_B_D48
DDR_B_D49
DDR_B_DQS#6
DDR_B_DQS6
DDR_B_D50
DDR_B_D51
DDR_B_D56
DDR_B_D57
DDR_B_D58
DDR_B_D59
2.2U_0402_6.3V6M
CD43
CD44
1
2
JDIMMB H=4mm
+1.35V
+0.675VS
JDIMM2
1
VREF_DQ
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DM0
13
VSS
15
DQ2
17
DQ3
19
VSS
21
DQ8
23
DQ9
25
VSS
27
DQS1#
29
DQS1
31
VSS
33
DQ10
35
DQ11
37
VSS
39
DQ16
41
DQ17
43
VSS
45
DQS2#
47
DQS2
49
VSS
51
DQ18
53
DQ19
55
VSS
57
DQ24
59
DQ25
61
VSS
63
DM3
65
VSS
67
DQ26
69
DQ27
71
VSS
73
CKE0
75
VDD
77
NC
79
BA2
81
VDD
83
A12/BC#
85
A9
87
VDD
89
A8
91
A5
93
VDD
95
A3
97
A1
99
VDD
101
CK0
103
CK0#
105
VDD
107
A10/AP
109
BA0
111
VDD
113
WE#
115
CAS#
117
VDD
119
A13
121
S1#
123
VDD
125
TEST
127
VSS
129
DQ32
131
DQ33
133
VSS
135
DQS4#
137
DQS4
139
VSS
141
DQ34
143
DQ35
145
VSS
147
DQ40
149
DQ41
151
VSS
153
DM5
155
VSS
157
DQ42
159
DQ43
161
VSS
163
DQ48
165
DQ49
167
VSS
169
DQS6#
171
DQS6
173
VSS
175
DQ50
177
DQ51
179
VSS
181
DQ56
183
DQ57
185
VSS
187
DM7
189
VSS
191
DQ58
193
DQ59
195
VSS
197
SA0
199
VDDSPD
201
SA1
203
VTT
205
GND1
207
BOSS1
SUYIN_600025HB204G251ZL
CONN@
DQS0#
DQS0
DQ12
DQ13
RESET#
DQ14
DQ15
DQ20
DQ21
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
CKE1
CK1#
RAS#
ODT0
ODT1
VREF_CA
DQ36
DQ37
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
EVENT#
GND2
BOSS2
+1.35V
2
VSS
DQ4
DQ5
VSS
VSS
DQ6
DQ7
VSS
VSS
DM1
VSS
VSS
VSS
DM2
VSS
VSS
VSS
VSS
VSS
VDD
A15
A14
VDD
A11
VDD
VDD
VDD
CK1
VDD
BA1
VDD
S0#
VDD
VDD
VSS
VSS
DM4
VSS
VSS
VSS
VSS
VSS
VSS
DM6
VSS
VSS
VSS
VSS
VSS
SDA
SCL
VTT
DDR_B_D4
4
DDR_B_D5
6
8
DDR_B_DQS#0
10
DDR_B_DQS0
12
14
DDR_B_D6
16
DDR_B_D7
18
20
DDR_B_D12
22
DDR_B_D13
24
26
28
DDR3_DRAMRST#_R
30
32
DDR_B_D14
34
DDR_B_D15
36
38
DDR_B_D20
40
DDR_B_D21
42
44
46
48
DDR_B_D22
50
DDR_B_D23
52
54
DDR_B_D28
56
DDR_B_D29
58
60
DDR_B_DQS#3
62
DDR_B_DQS3
64
66
DDR_B_D30
68
DDR_B_D31
70
72
DDR_CKE7_DIMMD
74
76
DDR_B_MA15
78
DDR_B_MA14
80
82
DDR_B_MA11
84
DDR_B_MA7
86
A7
88
DDR_B_MA6
90
A6
DDR_B_MA4
92
A4
94
DDR_B_MA2
96
A2
DDR_B_MA0
98
A0
100
M_CLK_DDR7
102
M_CLK_DDR#7
104
106
DDR_B_BS1
108
DDR_B_RAS#
110
112
DDR_CS6_DIMMD#
114
M_ODT6
116
118
M_ODT7
120
122
NC
124
126
128
DDR_B_D36
130
DDR_B_D37
132
134
136
138
DDR_B_D38
140
DDR_B_D39
142
144
DDR_B_D44
146
DDR_B_D45
148
150
DDR_B_DQS#5
152
DDR_B_DQS5
154
156
DDR_B_D46
158
DDR_B_D47
160
162
DDR_B_D52
164
DDR_B_D53
166
168
170
172
DDR_B_D54
174
DDR_B_D55
176
178
DDR_B_D60
180
DDR_B_D61
182
184
DDR_B_DQS#7
186
DDR_B_DQS7
188
190
DDR_B_D62
192
DDR_B_D63
194
196
M_THERMAL#
198
200
202
204
206
208
+0.675VS
DDR3_DRAMRST#_R <12,14,15>
DDR_CKE7_DIMMD <7>
M_CLK_DDR7 <7>
M_CLK_DDR#7 <7>
DDR_B_BS1 <7,15>
DDR_B_RAS# <7, 15>
DDR_CS6_DIMMD# <7>
M_ODT6 <7>
+V_SM_VREF_CNT
M_ODT7 <7>
2.2U_0402_6.3V6M
CD37
1
2
M_THERMAL# <12,14,15,43>
PCH_SMBDATA <6,12,14,15,19,49,50,51,53>
PCH_SMBCLK <6,12,14,15,19,49,50,51,53>
0.1U_0402_25V6K~D
CD38
1
2
All VREF traces should
have 20 mil trace width
CPU
JDIMMB(H8)
1(H4)
3(H5.2)
4(H9.2)
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
2
Compal Electronics, Inc.
Title
DDRIII DIMMB
Size Document NumberRev
Custom
LA-9331P
Date:Sheetof
1
1461Friday, June 22, 2012
0.1
5
4
3
2
1
DD
All VREF traces should
have 20 mil trace width
DDR_A_DQS#[0..7]<7,12>
DDR_A_D[0..63]<7, 12>
DDR_A_DQS[0..7]<7,12>
DDR_A_MA[0..15]<7,12>
Layout Note:
Place near JDIMMC
CC
BB
AA
+1.35V
1U_0402_6.3V6K~D
1
1
CD12
2
2
+1.35V
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
CD56
1
1
2
2
Layout Note:
Place near JDIMMC.203,204
+0.675VS
1
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
1
CD54
CD63
CD47
2
2
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
10U_0603_6.3V6M~D
330U_SX_2VY~D
@
CD45
1
CD75
CD46
CD62
CD59
1
2
1U_0402_6.3V6K~D
1
CD64
2
SA0
SA1
001
1
1
0
1
0
CD49
CD61
1
1
1
1
+
2
2
2
1U_0402_6.3V6K~D
1U_0402_6.3V6K~D
1
CD57
CD51
2
DIMMA
DIMMB
DIMMC
DIMMD
2
2
RD25
10K_0402_5%~D
RD42
10K_0402_5%~D
+3VS
@
12
12
1U_0402_6.3V6K~D
1
CD55
2
RD43
@
10K_0402_5%~D
12
+3VS
RD26
10K_0402_5%~D
12
+DIMM0_1_VREF_CPU
2.2U_0402_6.3V6M
1
CD50
2
DDR_CKE0_DIMMA<7>
DDR_A_BS2<7,12>
M_CLK_DDR0<7>
DDR_A_BS0<7,12>
DDR_A_WE#<7,12>
DDR_A_CAS#<7,12>
DDR_CS1_DIMMA#<7>
0.1U_0402_25V6K~D
CD48
1
2
0.1U_0402_25V6K~D
DDR_A_D0
DDR_A_D1
1
CD53
2
DDR_A_D2
DDR_A_D3
DDR_A_D8
DDR_A_D9D DR_A_D13
DDR_A_DQS#1
DDR_A_DQS1
DDR_A_D10
DDR_A_D11
DDR_A_D17
DDR_A_DQS#2
DDR_A_DQS2
DDR_A_D18
DDR_A_D19
DDR_A_D24
DDR_A_D25
DDR_A_D26
DDR_A_D27
DDR_CKE0_DIMMADDR_CKE1_DIMMA
DDR_A_BS2
DDR_A_MA3
M_CLK_DDR0
M_CLK_DDR#0
DDR_A_MA10
DDR_A_BS0
DDR_A_WE#
DDR_A_CAS#
DDR_A_MA13
DDR_CS1_DIMMA#
DDR_A_D32
DDR_A_D33
DDR_A_DQS#4
DDR_A_DQS4
DDR_A_D34
DDR_A_D35
DDR_A_D40
DDR_A_D41
DDR_A_D42
DDR_A_D43
DDR_A_D48
DDR_A_D49
DDR_A_DQS#6
DDR_A_DQS6
DDR_A_D50
DDR_A_D51
DDR_A_D56
DDR_A_D57
DDR_A_D58
DDR_A_D59
2.2U_0402_6.3V6M
CD60
1
2
JDIMMC H=5.2mm
JDIMM3
1
VREF_DQ
3
VSS
5
DQ0
7
DQ1
9
VSS
11
DM0
13
VSS
15
DQ2
17
DQ3
19
VSS
21
DQ8
23
DQ9
25
VSS
27
DQS1#
29
DQS1
31
VSS
33
DQ10
35
DQ11
37
VSS
39
DQ16
41
DQ17
43
VSS
45
DQS2#
47
DQS2
49
VSS
51
DQ18
53
DQ19
55
VSS
57
DQ24
59
DQ25
61
VSS
63
DM3
65
VSS
67
DQ26
69
DQ27
71
VSS
73
CKE0
75
VDD
77
NC
79
BA2
81
VDD
83
A12/BC#
85
A9
87
VDD
89
A8
91
A5
93
VDD
95
A3
97
A1
99
VDD
101
CK0
103
CK0#
105
VDD
107
A10/AP
109
BA0
111
VDD
113
WE#
115
CAS#
117
VDD
119
A13
121
S1#
123
VDD
125
TEST
127
VSS
129
DQ32
131
DQ33
133
VSS
135
DQS4#
137
DQS4
139
VSS
141
DQ34
143
DQ35
145
VSS
147
DQ40
149
DQ41
151
VSS
153
DM5
155
VSS
157
DQ42
159
DQ43
161
VSS
163
DQ48
165
DQ49
167
VSS
169
DQS6#
171
DQS6
173
VSS
175
DQ50
177
DQ51
179
VSS
181
DQ56
183
DQ57
185
VSS
187
DM7
189
VSS
191
DQ58
193
DQ59
195
VSS
197
SA0
199
VDDSPD
201
SA1
+0.675VS
203
VTT
205
GND1
207
BOSS1
LCN_DAN06-K4526-0103
CONN@
DQS0#
DQS0
DQ12
DQ13
RESET#
DQ14
DQ15
DQ20
DQ21
DQ22
DQ23
DQ28
DQ29
DQS3#
DQS3
DQ30
DQ31
CKE1
CK1#
RAS#
ODT0
ODT1
VREF_CA
DQ36
DQ37
DQ38
DQ39
DQ44
DQ45
DQS5#
DQS5
DQ46
DQ47
DQ52
DQ53
DQ54
DQ55
DQ60
DQ61
DQS7#
DQS7
DQ62
DQ63
EVENT#
GND2
BOSS2
+1.35V+1.35V
2
VSS
DQ4
DQ5
VSS
VSS
DQ6
DQ7
VSS
VSS
DM1
VSS
VSS
VSS
DM2
VSS
VSS
VSS
VSS
VSS
VDD
A15
A14
VDD
A11
VDD
VDD
VDD
CK1
VDD
BA1
VDD
S0#
VDD
VDD
VSS
VSS
DM4
VSS
VSS
VSS
VSS
VSS
VSS
DM6
VSS
VSS
VSS
VSS
VSS
SDA
SCL
VTT
DDR_A_D4
4
DDR_A_D5
6
8
DDR_A_DQS#0
10
DDR_A_DQS0
12
14
DDR_A_D6
16
DDR_A_D7
18
20
DDR_A_D12
22
24
26
28
DDR3_DRAMRST#_R
30
32
DDR_A_D14
34
DDR_A_D15
36
38
DDR_A_D20DDR_A_D16
40
DDR_A_D21
42
44
46
48
DDR_A_D22
50
DDR_A_D23
52
54
DDR_A_D28
56
DDR_A_D29
58
60
DDR_A_DQS#3
62
DDR_A_DQS3
64
66
DDR_A_D30
68
DDR_A_D31
70
72
74
76
DDR_A_MA15
78
DDR_A_MA14
80
82
DDR_A_MA11DDR_A_MA12
84
DDR_A_MA7DDR_A_MA9
86
A7
88
DDR_A_MA6DDR_A_MA8
90
A6
DDR_A_MA4DDR_A_MA5
92
A4
94
DDR_A_MA2
96
A2
DDR_A_MA0DDR_A_MA1
98
A0
100
M_CLK_DDR1
102
M_CLK_DDR#1
104
106
DDR_A_BS1
108
DDR_A_RAS#
110
112
DDR_CS0_DIMMA#
114
M_ODT0
116
118
M_ODT1
120
122
NC
124
126
128
DDR_A_D36
130
DDR_A_D37
132
134
136
138
DDR_A_D38
140
DDR_A_D39
142
144
DDR_A_D44
146
DDR_A_D45
148
150
DDR_A_DQS#5
152
DDR_A_DQS5
154
156
DDR_A_D46
158
DDR_A_D47
160
162
DDR_A_D52
164
DDR_A_D53
166
168
170
172
DDR_A_D54
174
DDR_A_D55
176
178
DDR_A_D60
180
DDR_A_D61
182
184
DDR_A_DQS#7
186
DDR_A_DQS7
188
190
DDR_A_D62
192
DDR_A_D63
194
196
M_THERMAL#
198
200
202
204
206
208
+0.675VS
DDR3_DRAMRST#_R <12,13,15>
DDR_CKE1_DIMMA <7>
M_CLK_DDR1 <7>
M_CLK_DDR#1 <7>M_CLK_DDR#0<7>
DDR_A_BS1 <7,12>
DDR_A_RAS# <7, 12>
DDR_CS0_DIMMA# <7>
M_ODT0 <7>
M_ODT1 <7>
+V_SM_VREF_CNT
2.2U_0402_6.3V6M
CD52
1
2
M_THERMAL# <12,13,15,43>
PCH_SMBDATA <6,12,13,15,19,49,50,51,53>
PCH_SMBCLK <6,12,13,15,19,49,50,51,53>
0.1U_0402_25V6K~D
1
2
CD58
All VREF traces should
have 20 mil trace width
CPU
2(H8)
1(H4)
JDIMMC(H5.2)
4(H9.2)
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
2
Compal Electronics, Inc.
Title
DDRIII DIMMD
Size Document NumberRev
Custom
LA-9331P
Date:Sheetof
1
1661Friday, June 22, 2012
0.1
5
+RTC_CELL
12
4
330K_0402_1%~D
RH38
3
2
1
DD
INTVRMEN - INTEGRATED SUS 1.05V VRM
ENABLE
High - Enable Internal VRs
Low - Enable External VRs
+3VS
RH3510K_0402_5%~D@
NO REBOOT STRAP
DISABLED WHEN LOW (DEFAULT)
ENABLED WHEN HIGH
CC
+3VS
RH355100K_0402_5%~D
CMOS_CLR1
ShuntClear CMOS
Open
ME_CLR1
ShuntClear ME RTC Registers
Open
HDA_SYNC Isolation Circuit
BB
RTC Battery
+3VLP
AA
W=20mils
W=20mils
330K_0402_1%~D
12
12
12
CMOS setting
Keep CMOS
TPM setting
Keep ME RTC Registers
+RTCBATT
12
W=20mils
2
3
1
1
CH12
1U_0603_10V6K
2
5
PCH_INTVRMEN
@
RH39
HDA_SPKR
PCH_GPIO33
+5VS
S
1M_0402_5%~D
SSM3K7002FU_SC70-3~D
RH31
12
RH34
1K_0402_5%
DH1
BAT54CW_SOT323-3
+RTC_CELL
+3V_PCH
12
RH2871K_0402_1%~D@
FLASH DESCRIPTOR SECURITY OVERRIDE
LOW = DESABLED (DEFAULT)
HIGH = ENABLED
+RTC_CELL
1
1
@
ME1SHORT PADS~D
1 2
CH51U_0402_6.3V6K~D
G
2
PCH_AZ_SYNCPCH_AZ_SYNC_Q
13
D
QH8
PCH_AZ_SDOUT
CH2
PCH_RTCX1_R
1 2
18P_0402_50V8J~D
RH2220K_0402_5%~D
12
RH111M_0402_5%~D
12
RH2320K_0402_5%~D
12
2
2
+3V_PCH
0_0603_5%~D
12
RH288
1
CH4
CMOS place near DIMM
+3.3V_ALW_PCH_JTAGPCH_JTAG_TMS
18P_0402_50V8J~D
2
1
2
@
CMOS1 SHORT PADS~D
1 2
1U_0402_6.3V6K~D
RH5951_0402_1%~D
12
RH44210_0402_1%~D
12
@
RH45210_0402_1%~D
12
@
RH46210_0402_1%~D
12
@
CH3
1 2
12
YH1
32.768KHZ_12.5PF_Q13FC1350000~D
HDA for Codec
PCH_AZ_SDOUT
PCH_AZ_CODEC_SDOUT<45>
PCH_AZ_CODEC_SYNC<45>
PCH_AZ_CODEC_RST#<45>
PCH_AZ_CODEC_BITCLK<45>
4
12
RH2933_0402_5%~D
12
RH5633_0402_5%~D
12
RH2733_0402_5%~D
12
RH2633_0402_5%~D
27P_0402_50V8J~D
@
CH101
1
2
PCH_AZ_SYNC_Q
PCH_AZ_RST#
PCH_AZ_BITCLK
12
RH2860_0402_5%~D
HDA_SPKR<45>
PCH_AZ_CODEC_SDIN0<45>
HDA_SDO<43>
100_0402_1%~D
12
RH48
12
RH501K_0402_1%~D
DP_PCH_HPD<30>
100_0402_1%~D
100_0402_1%~D
12
12
RH49
RH47
PCH_JTAG_TCK
PCH_JTAG_TDI
PCH_JTAG_TDO
RH2890_0402_5%~D
12
RH2
10M_0402_5%~D
PCH_RTCX2
SRTCRST#
INTRUDER#
PCH_INTVRMEN
PCH_RTCRST#
PCH_AZ_BITCLK
PCH_AZ_SYNC
HDA_SPKR
PCH_AZ_RST#
PCH_AZ_CODEC_SDIN0
PCH_AZ_SDOUT
PCH_GPIO33
DP_PCH_HPD
12
T122 PAD~D@
PCH_RTCX1
3
PCH_TP25
PCH_GPIO21
BBS_BIT0_R
PCH_SATALED#
UH1A
B5
RTCX1
B4
RTCX2
B9
SRTCRST#
A8
INTRUDER#
G10
INTVRMEN
D9
RTCRST#
B25
HDA_BCLK
A22
HDA_SYNC
AL10
SPKR
C24
HDA_RST#
L22
HDA_SDI0
K22
HDA_SDI1
G22
HDA_SDI2
F22
HDA_SDI3
A24
HDA_SDO
B17
DOCKEN#/G PIO33
C22
HDA_DOCK_ RST#/GPIO13
AB3
JTAG_TCK
AD1
JTAG_TMS
AE2
JTAG_TDI
AD3
JTAG_TDO
F8
TP25
C26
TP22
AB6
TP20
Security Classification
Issued Date
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
LPT_PCH_M_EDS
JTAGRTCAZALIA
LYNXPOINT_BGA695
5
SATA
SATA_RXN4 /PERN1
SATA_RXP4 /PERP1
SATA_TXN4/P ETN1
SATA_TXP4/P ETP1
SATA_RXN5 /PERN2
SATA_RXP5 /PERP2
SATA_TXN5/P ETN2
SATA_TXP5/P ETP2
SATA0GP/G PIO21
SATA1GP/G PIO19
SATA_RXN_ 0
SATA_RXP_ 0
SATA_TXN_0
SATA_TXP_0
SATA_RXN_ 1
SATA_RXP_ 1
SATA_TXN_1
SATA_TXP_1
SATA_RXN_ 2
SATA_RXP_ 2
SATA_TXN_2
SATA_TXP_2
SATA_RXN_ 3
SATA_RXP_ 3
SATA_TXN_3
SATA_TXP_3
SATA_RCOMP
SATALED#
SATA_IREF
TP9
TP8
BC8
SATA_PRX_DTX_P0
BE8
SATA_PTX_DRX_N0
AW8
SATA_PTX_DRX_P0
AY8
SATA_PRX_DTX_N1
BC10
SATA_PRX_DTX_P1
BE10
SATA_PTX_DRX_N1
AV10
SATA_PTX_DRX_P1
AW10
SATA_ODD_PRX_DTX_N2
BB9
SATA_ODD_PRX_DTX_P2
BD9
SATA_ODD_PTX_DRX_N2
AY13
SATA_ODD_PTX_DRX_P2
AW13
MSATA_PRX_DTX_N3
BC12
MSATA_PRX_DTX_P3
BE12
MSATA_PTX_DRX_N3
AR13
MSATA_PTX_DRX_P3
AT13
PCIE_PRX_WLANTX_N1
BD13
PCIE_PRX_WLANTX_P1
BB13
PCIE_PTX_WLANRX_N1
AV15
PCIE_PTX_WLANRX_P1
AW15
PCIE_PRX_WANTX_N2
BC14
PCIE_PRX_WANTX_P2
BE14
PCIE_PTX_WANRX_N2
AP15
PCIE_PTX_WANRX_P2
AR15
SATA_COMP
AY5
PCH_SATALED#
AP3
PCH_GPIO21
AT1
BBS_BIT0_R
AU2
SATA_IREF
BD4
BA2
BB2
T161PAD~D@
T155PAD~D@
SATA_PRX_DTX_N0
SATA Impedance Compensation
1 OF 11
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
2
SATA_COMP
CAD note:
Place the resistor within 500 mils of the PCH. Avoid
routing next to clock pins.
SATA_PRX_DTX_N0 <49>
SATA_PRX_DTX_P0 <49>
SATA_PTX_DRX_N0 <49>
SATA_PTX_DRX_P0 <49>
SATA_PRX_DTX_N1 <49>
SATA_PRX_DTX_P1 <49>
SATA_PTX_DRX_N1 <49>
SATA_PTX_DRX_P1 <49>
SATA_ODD_PRX_DTX_N2 <50>
SATA_ODD_PRX_DTX_P2 <50>
SATA_ODD_PTX_DRX_N2 <50>
SATA_ODD_PTX_DRX_P2 <50>
MSATA_PRX_DTX_N3 <50>
MSATA_PRX_DTX_P3 <50>
MSATA_PTX_DRX_N3 <50>
MSATA_PTX_DRX_P3 <50>
PCIE_PRX_WLANTX_N1 <51>
PCIE_PRX_WLANTX_P1 <51>
PCIE_PTX_WLANRX_N1 <51>
PCIE_PTX_WLANRX_P1 <51>
PCIE_PRX_WANTX_N2 <51>
PCIE_PRX_WANTX_P2 <51>
PCIE_PTX_WANRX_N2 <51>
PCIE_PTX_WANRX_P2 <51>
PCH_SATALED# <48>
12
RH410_0402_5%
12
12
+3VS
RH3010K_0402_5%~D
12
RH524.7K_0402_5%~D
RH5510K_0402_5%~D
HDD1(Master)
HDD2(Slave)
ODD/HDD3 Bay
mSATA
MiniWLAN (Mini Card 1)
MiniDMC (Mini Card 2)
+1.5VS
+1.5VS
12
RH407.5K_0402_1%~D
Compal Electronics, Inc.
Title
PCH (1/9) RTC,HDA,SATA,XDP
ze Document NumberRev
Si
Custom
LA-9331P
Date:Sheetof
1
1761Friday, June 22, 2012
0.1
5
DD
+3V_PCH
12
RH31810K_0402_5%~D@
12
RH15310K_0402_5%~D
12
RH14810K_0402_5%~D
12
RH17210K_0402_5%~D
+3VS
12
RH1388.2K_0402_5%~D
12
RH1528.2K_0402_5%~D@
DMI_CTX_PRX_N0<5>
DMI_CTX_PRX_N1<5>
DMI_CTX_PRX_N2<5>
DMI_CTX_PRX_N3<5>
DMI_CTX_PRX_P0<5>
CC
PM_DRAM_PWRGD<6>
PCH_RSMRST#<43>
BB
AA
SUSPWRDNACK<43>
+PCH_VCCDSW3_3
DMI_CTX_PRX_P1<5>
DMI_CTX_PRX_P2<5>
DMI_CTX_PRX_P3<5>
DMI_CRX_PTX_N0<5>
DMI_CRX_PTX_N1<5>
DMI_CRX_PTX_N2<5>
DMI_CRX_PTX_N3<5>
DMI_CRX_PTX_P0<5>
DMI_CRX_PTX_P1<5>
DMI_CRX_PTX_P2<5>
DMI_CRX_PTX_P3<5>
+1.5VS
+1.5VS
SG_AMD_BKL<42,43>
SYS_PWROK<6>
PCH_PWROK<43>
PBTN_OUT#<6, 43>
10K_0402_5%
ACIN<29,43,47,57,63>
SUS_STAT#
SUSPWRDNACK
PCIE_WAKE#
PCH_RI#
PM_CLKRUN#
ME_RESET#
DMI_CTX_PRX_N0
DMI_CTX_PRX_N1
DMI_CTX_PRX_N2
DMI_CTX_PRX_N3
DMI_CTX_PRX_P0
DMI_CTX_PRX_P1
DMI_CTX_PRX_P2
DMI_CTX_PRX_P3
DMI_CRX_PTX_N0
DMI_CRX_PTX_N1
DMI_CRX_PTX_N2
DMI_CRX_PTX_N3
DMI_CRX_PTX_P0
DMI_CRX_PTX_P1
DMI_CRX_PTX_P2
DMI_CRX_PTX_P3
DMI_IREF
12
RH430_0402_5%
T139 PAD~D@
T123 PAD~D@
12
RH2047.5K_0402_1%~D
12
RH1140_0402_5%~D@
12
RH1930_0402_5%~D
12
RH1440_0402_5%~D
12
RH1490_0402_5%~D
12
RH3200_0402_5%~D
12
RH1850_0402_5%~D
12
RH2000_0402_5%~D
12
RH1630_0402_5%~D
12
RH1568.2K_0402_5%~D
IMVP_PWRGD<6, 43,62>
+3V_PCH
12
R1899
61
2
5
SUSACK#_R
SYS_RESET#
SYS_PWROK_R
PCH_PWROK_R
PM_APWROK_R
PM_DRAM_PWRGD_R
PCH_RSMRST#_R
ME_SUS_PWR_ACK_R
ACIN_PCH
PCH_BATLOW#
T140 PAD~D@
1
CH41
0.1U_0402_16V7K
2
PCH_PWROK
1
2
+3V_PCH
12
R1900
10K_0402_5%
ACIN_PCH
34
DMN66D0LDW-7_SOT363-6~D
5
QH13B
DMN66D0LDW-7_SOT363-6~D
QH13A
DMI_RCOMP
SIO_PWRBTN#_R
PCH_RI#
+3VS
IN1
IN2
XDP_DBRESET#<6>
UH1B
AW22
DMI_RXN_0
AR20
DMI_RXN_1
AP17
DMI_RXN_2
AV20
DMI_RXN_3
AY22
DMI_RXP_0
AP20
DMI_RXP_1
AR17
DMI_RXP_2
AW20
DMI_RXP_3
BD21
DMI_TXN_0
BE20
DMI_TXN_1
BD17
DMI_TXN_2
BE18
DMI_TXN_3
BB21
DMI_TXP_0
BC20
DMI_TXP_1
BB17
DMI_TXP_2
BC18
DMI_TXP_3
BE16
DMI_IREF
AW17
TP12
AV17
TP7
AY17
DMI_RCOMP
R6
SUSACK#
AM1
SYS_RESE T#
AD7
SYS_PW ROK
F10
PWROK
AB7
APWROK
H3
DRAMPWR OK
J2
RSMRST#
J4
SUSWAR N#/SUSPWR NACK/GPIO30
K1
PWRBTN#
E6
ACPRESEN T/GPIO31
K7
BATLOW# /GPIO72
N4
RI#
AB10
TP21
D2
SLP_W LAN#/GPIO2 9
5
UH8
VCC
SYS_PWROK
4
OUT
GND
MC74VHC1G08DFT2G_SC70-5
3
RH1998.2K_0402_5%~D@
LYNXPOINT_BGA695
4
RH3570_0402_5%~D
12
+3VS
CH143
@
1 2
5
0.1U_0402_25V6K~D
1
P
B
4
ME_RESET#
12
ME_SUS_PWR_ACK_RSUSACK#_R
LPT_PCH_M_EDS
DMI
O
2
A
G
UH13
@
74AHC1G09GW_TSSOP5~D
3
12
RH3230_0402_5%~D
5
FDI_RXN_0
FDI_RXN_1
FDI_RXP_0
FDI
FDI_RXP_1
FDI_CSYNC
FDI_INT
FDI_IREF
FDI_RCOMP
System Power
Management
BBS_BIT1
1K_0402_1%~D
12
4 OF 11
@
RH342
DSWVRME N
DPWROK
CLKRUN#
SUS_STAT#/G PIO61
SUSCLK/G PIO62
SLP_S5# /GPIO63
SLP_S4#
SLP_S3#
SLP_SUS #
PMSYNCH
SLP_LAN #
GNT1#/GPIO51
(BBS_BIT1)
WAKE#
SLP_A#
01Reserved (NAND)
10
*
GPIO51 has internal pull up.
4
SYS_RESET#
AJ35
AL35
AJ36
AL36
AV43
TP16
AY45
TP5
AV45
TP15
AW44
TP10
FDI_CSYNC
AL39
FDI_INT
AL40
FDI_IREF
AT45
AU42
TP17
AU44
TP13
FDI_RCOMP
AR44
DSWODVREN
C8
PCH_DRWROK_R
L13
PCIE_WAKE#
K3
PM_CLKRUN#
AN7
SUS_STAT#
U7
Y6
PM_SLP_S5#
Y7
PM_SLP_S4#
C6
PM_SLP_S3#
H1
F3
PM_SLP_SUS#
F1
H_PM_SYNC
AY3
G5
Boot BIOS Strap
SATA1GP/GPIO19
(BBS_BIT0)
00LPC
11SPI
T144PAD~D@
T141PAD~D@
T147PAD~D@
T148PAD~D@
FDI_CSYNC <5>
FDI_INT<5>
12
RH420_0402_5%
T145PAD~D@
T146PAD~D@
12
RH2067.5K_0402_1%~D
RH1670_0402_5%~D
12
12
RH1860_0402_5%~D@
PCIE_WAKE# <43,44,51>
T129 PAD~D@
T126 PAD~D@
PM_SLP_S5# <43,47>
T125 PAD~D
PM_SLP_S4# <43>
PM_SLP_S3# <43,47>
T128 PAD~D
PM_SLP_SUS# <43>
T127 PAD~D
H_PM_SYNC <6>
Boot BIOS Location
PCI
+1.5VS
+1.5VS
@
3
PCH_EDP_PWM<40>
DGPU_SELECT#<32,36,42>
HDMI_IN_PWMSEL#<42>
PCH_RSMRST#_R
PCH_DPWROK <43>
@
@
DSWODVREN
DSWODVREN - ON DIE DSW VR ENABLE
HIGH = ENABLED (DEFAULT)
LOW = DISABLED
Security Classification
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
THIS SHEET OF ENGINEERING DRAWI NG IS THE PROPRIETARY PROPERTY OF COMPAL ELECTRONI CS, INC. AND CONTAINS CONF IDENTIAL
AND TRADE SECRET INFORMATION. THIS SHEET MAY NOT BE TRANSFERED FR OM THE CUSTODY OF THE COMPETENT DI VISION OF R&D
DEPARTMENT EXCEPT AS AUTHORIZED BY COM PAL ELECTRONICS, INC. NEITHER TH IS SHEET NOR THE INFORMATION IT CONTAINS
5
4
3
MAY BE USED BY OR DISCLOSED TO ANY THIR D PARTY WITHOUT PRIOR WRITT EN CONSENT OF COMPAL ELECTRONICS, INC.
2012/06/222013/06/21
Compal Secret Data
Deciphered Date
2
Compal Electronics, Inc.
Title
PCH (3/9) CLK
ze Document NumberRev
Si
Custom
LA-9331P
Date:Sheetof
1
1961Friday, June 22, 2012
0.1
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