Datasheet VNS3NV04, VNN3NV04, VND3NV04-1, VND3NV04 Datasheet (SGS Thomson Microelectronics)

Page 1
®
VNN3NV04 / VNS3NV04
/ VND3NV 04 / VND3NV0 4-1
“OMNIFE T II” :
FULLY AUTOPROTECTED POWER MOSFET
TYPE R
VNN3NV04 VNS3NV04 VND3NV04 VND3NV04-1
LINEAR CURRENT LIMITATION
n
THERMAL SHUT DOWN
n
SHORT CIRCUIT PROTECTION
n
INTEGRATED CLAMP
n
LOW CURRENT DRAWN FRO M INPUT PIN
n
DIAGNOSTIC FEEDBACK THROUGH INPUT
DS(on)
120 m 3.5 A 40 V
I
lim
V
clamp
PIN
n
ESD PROTECTION
n
DIRECT ACCESS TO THE GATE OF THE
POWER MOSFET (ANALOG DRIVING)
n
COMPATIBLE WITH STANDARD POWER
MOSFET
DESCRIPTION
The VNN3NV04, VNS3NV04, VND3NV04 VND3NV04-1, are mon ol ithi c devic es desi g ned in STMicroelectronics VIPower M0-3 Technology,
BLOCK DIAGRAM
2
3
2
1
SOT-223
3
1
TO252 (DPAK)
ORDER CODES:
SOT-223 SO-8 TO-252 (DPAK) TO-251 (IPAK)
SO-8
1
TO251 (IPAK)
VNN3NV04 VNS3NV04 VND3NV04 VND3NV04-1
3
2
intended for replacement of standard Power MOSFETS from DC up to 50KHz applications. Built in thermal shutdown, l inear curren t limitation and overvoltage clamp protect the chip in harsh environments. Fault feedback can be de tected by mon itori ng the voltage at the input pin.
DRAIN
2
INPUT
1
Februa ry 2003 1/21
Gate
Control
Over
Temperature
Overvoltage
Clamp
Linear
Current
Limiter
3
SOURCE
FC01000
Page 2
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
ABSOLUTE MAXIMUM RATI NG
Symbol Parameter
Drain-source Voltage (VIN=0V) Intern ally Clam p ed V Input Voltage Internally Clamped V
IN
Input Current +/-20 mA Minimum I nput Series Impedance 220 Drain Current Internally Limited A Reverse DC Output Current -5.5 A Electros tatic Discharge (R=1.5K, C=100pF) 4000 V Electros tatic Discharge on output pin only
(R=330, C=150pF) Total Dissipation at Tc=25°C 7 8.3 35 W
tot
Operating Junction Temperature Internally limited °C
j
Case Operating Temperature Internally limit ed °C
c
Storage Temperatu re -55 to 150 °C
R
V V
V
DS
V
I
IN
IN MIN
I
D
I
R
ESD1
ESD2
P
T
T
T
stg
CONNECTION DIAGRAM (TO P VI EW)
SO-8 Pack ag e (*)
SOT-223 SO-8 DPAK/IPAK
Value
Unit
16500 V
SOURCE
1 SOURCE SOURCE INPUT
(*) For the pins configuration related to SOT-223, DPAK, IPAK see outlines at page 1.
4
CURRENT AND VOLTAGE CONVENTIONS
R
I
IN
IN
INPUT
V
IN
8
DRAIN DRAIN DRAIN
5
DRAIN
DRAIN
SOURCE
I
D
V
DS
2/21
Page 3
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
THERMAL DATA
Symbol Parameter
R
thj-case
R
thj-lead
R
thj-amb
(*) When mounted on a standard single-sided FR4 board with 50mm
Thermal R esistance Junction-case}} } MAX 18 3.5 3.5 °C/W
Thermal R esistance Junction-lead MAX 15 °C/W Thermal R esistance Junction -ambient MAX 70(*) 65(*) 54(*) 100 °C/W
SOT-223 SO-8 DPAK IPAK
2
of Cu (at leas t 35 µm thick) connected to all DRAIN pins.
ELECTRICAL CHARACTERISTICS (-40°C < Tj < 150°C, unless otherwise specified) OFF
Symbol Parameter Test Conditions Min Typ Max Unit
V
CLAMP
V
CLTH
V
INTH
I
ISS
V
INCL
I
DSS
Drain-source Clamp Voltage Drain-source Clamp
Threshold Voltage Input Thre shold Voltage VDS=VIN; ID=1mA 0. 5 2.5 V Supply Current from Input
Pin Input-Source Clamp Voltage
Zero Input Voltage Drain Current (VIN=0V)
V
=0V; ID=1.5A 40 45 55 V
IN
VIN=0V; ID=2mA 36 V
VDS=0V; VIN=5V 100 150 µA IIN=1mA
I
=-1mA
IN
=13V; VIN=0V; Tj=25°C
V
DS
V
=25V; VIN=0V
DS
Value
-1.0
6
6.8 8
-0.3 30 75
Unit
V
µA
ON
Symbol Parameter Test Conditions Min Typ Max Unit
R
DS(on)
Static Drain-source On Resistance
=5V; ID=1.5A; Tj=25°C
V
IN
V
=5V; ID=1.5A
IN
120 240
m
3/21
1
Page 4
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
ELECTRICAL CHARACTERISTICS (continued) (Tj=25°C, unless otherwise specified)
DYNAMIC
Symbol Parameter Test Conditions Min Typ Max Unit
gfs (*) C
OSS
SWITCHING
Symbol Parame ter Test Conditions Min Typ M ax Unit
t
d(on)
t
t
d(off)
t
t
d(on)
t
t
d(off)
t
(dI/dt)
Q
Forward Transconductanc e
VDD=13V; ID=1.5A 5.0 S
Output Capacitance VDS=13V; f=1MHz; VIN=0V 150 pF
Turn-on Delay Time Rise Time 250 750 ns
r
Turn-off Delay Time 450 1350 ns Fall Time 250 750 ns
f
Turn-on Delay Time Rise Time 2.5 7.5 µs
r
Turn-off Delay Time 3.3 10.0 µs Fall Time 2.0 6.0 µs
f
Turn-on Current Slope
on
Total Input Charge
i
=15V; ID=1.5A
V
DD
V
=5V; R
gen
gen=RIN MIN
(see figure 1)
=15V; ID=1.5A
V
DD
V
gen
=5V; R
=2.2 K
gen
(see figure 1)
=15V; ID=1.5A
V
DD
V
=5V; R V I
gen DD
gen
gen=RIN MIN
=12V; ID=1.5A; VIN=5V
=2.13m A (see figure 5)
=220
=220
90 300 ns
0.45 1.35 µs
4.7 A/µs
8.5 nC
SOURCE DRAIN DIODE
Symbol Param eter Test Conditions Min Typ Max Unit
(*) Forward On Vol tage ISD=1.5A; VIN=0V 0.8 V
V
SD
Q
I
RRM
t
Reverse Recovery Time ISD=1.5A; dI/dt=12A/µs
rr
Reverse Recovery Charge 37 µC
rr
Reverse Recovery Current 0.7 A
V
=30V; L= 20 0 µ H
DD
(see test circuit, figure 2)
107 ns
PROTECTIONS (-40°C < Tj < 150°C, unless otherwise specified)
Symbol Param eter Test Conditions Min Typ Max Unit
I
lim
t
dlim
T
T
I
E
(*) Pulsed: Pu ls e duration = 300µs, duty c y c le 1.5%
Drain Current Limit VIN=5V; VDS=13V 3.5 5 7 A
=5V; VDS=13V
Step Response Current Limit
Overtemperature
jsh
Shutdown
Overtemperature Reset 135 °C
jrs
Fault Sink Current VIN=5V; VDS=13V; Tj=T
gf
Sing l e Pu lse
as
Avala nche Energy
V
IN
starti ng T V
IN
=25°C; VDD=24V
j
=5V R
gen=RIN MIN
(see figures 3 & 4)
jsh
=220Ω; L=24mH
10 µs
150 175 200 °C
10 15 20 mA
100 mJ
4/21
2
Page 5
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
PROTECTION FEATURES
During normal operation, the INPUT pin is electrically connected to the gate of the internal power MOSFET through a low impedance path.
The device then behaves like a standard power MOSFET and can be used as a switch from DC up
to 50KHz. The only difference from the user’s standpoint is that a small DC current I 100µA) flows into the INPUT pin in order to supply
ISS
(typ.
the internal circuitry. The de vice integrates:
- OVERVOLTAGE CLAMP PROTECTION: internally set at 45V, along with the rugged
avalanche characteristics o f the Power MOSFET stage giv e this device unrivall ed ruggedne ss and energy handl ing capability. This feat ure is mainly important when driving inductive loads.
- LINEAR CURRENT LIMITER CIRCUIT: limits the drain current ID to I
INPUT pin voltages. When the current limiter is
whatever the
lim
active, the device operates in the linear region, so power dissipation may exceed the capability of the heatsink. Both case and junction temperatures increase, and if this phase lasts long enough, junction temperature may reach the overtemperature threshold T
jsh
.
- OVERTEMPERATURE AND SHORT CIRCUIT PROTECTION:
these are based on sensing the chip t emperatur e and are not dependen t on the input voltage. The location o f t he s ensing el emen t on the c h ip i n t he power stage area ensures fast, accurate detection of the junction temperature. Overtemperature cutout occurs in the range 150 to 190 °C, a typical value being 170 °C. The device is auto matically restarted when the chip temp eratu re fall s of about 15°C below shut-down temperature.
- STATUS FEEDBACK: in the case of an overtem perature fault cond ition
(Tj > T current Igf through the INPUT pin in order to
), the device tries to sink a diagnostic
jsh
indicate fault condition. If driven from a low impedance source, this current may be used in order to warn the control circuit of a device shutdown. If the drive imped ance is high enough so that the INPUT p in dri ver is no t abl e to su pply the current Igf, the INPUT pin will fall to 0V. This
will not however affect the device operation: no requirement is put on the current capability of the INPUT pin driver except to be able to supply the normal operation drive current I
ISS
Additional features of this device are ESD protection according to the Human Body model and the ability to be driven from a TTL Logic circuit.
.
5/21
Page 6
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Fig.1: Switching Time Test Circuit for Resistive Load
V
gen
I
D
90%
V
D
R
gen
t
r
t
V
gen
d(on) t
Fig.2: Test Circuit for Diode Recovery Times
A
D
I
OMNIFET
S
220
B
10%
R
gen
FAST DIODE
d(off)
I
t
f
A
B
OMNIFET
L=100uH
D
t
t
V
DD
6/21
1
V
gen
S
8.5
Page 7
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Thermal Impedance for DPAK/IPAK Thermal Impedance for SOT-223
7/21
Page 8
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Fig. 3: Unclamped Inductive Load Test Circuits
R
V
IN
P
GEN
W
Fig. 5: Input Ch arge Test Circuit
IN
V
GEN
Fig. 4: Unclamped Inductive Waveforms
8/21
ND8003
Page 9
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Source-Drain Diode Forward Characteristics
Vsd (mV)
1100
1050
1000
950
900
850
800
750
700 650 600
Vin=0V
0123456789101112
Id (A)
Derating Curve
Voltage
Rds(on) (mohms)
250
225
200
175
150
125
100
75
50
25
0
3 3.5 4 4.5 5 5.5 6 6.5
Vin(V)
Id=1.5A
Tj=150ºC
Tj=25ºC
Tj=-40ºC
Static Drain Source On Resistance
Rds(on) (mo h ms )
1000
900
800
700
600
500
400
300
200
100
0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.55
Tj=-40ºC
Vin=2.5V
Tj=25ºC
Tj=150ºC
Id(A)
Static Drain-Source On resistance Vs. Input Voltage
Rds(on) (mohms)
300 275 250 225
Tj=150ºC
200 175 150
Tj=25ºC
125 100
Tj=-40ºC
75 50 25
0
3 3.5 4 4.5 5 5.5 6 6.5
Id=3.5A Id=1A
Id=3.5A Id=1A
Id=3.5A Id=1A
Vin(V)
TransconductanceStatic Drain-Source On resistance Vs. Input
Gfs (S)
11 10
Vds=13V
9 8 7 6 5 4 3 2
1
0
00.511.522.533.544.555.5
Id (A)
Tj=-40ºC Tj=25ºC
Tj=150ºC
9/21
Page 10
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Static Drain-Source On Resistance Vs. Id
Rds(on) (mo h ms )
250
225
200
175
150
125
100
75
50
25
0
Vin=5V
Tj=150ºC
Tj=25ºC
Tj= - 40ºC
00.511.522.533.54
Id (A)
Turn On Current Slope
di/dt(A/us)
5
4.5 4
3.5 3
2.5 2
1.5 1
0.5 0
0
500
250
750
1000
1250
Rg(ohm)
1500
Vdd=15V
1750
Vin=5V
Id=1.5A
2000
2250
2500
Transfer Characteristics
Idon (A)
6
5.5
4.5
3.5
2.5
1.5
0.5
Vds=13.5V
5
4
3
2
1
0
1.522.533.544.555.56
Tj=150ºC
Tj=-40ºC
Tj=25ºC
Vin (V)
Turn On Current Slope
di/dt(A/usec)
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0 250 500 750 1000 1250 1500 1750 2000 2250 2500
Rg(ohm)
Vin=3.5V Vdd=15V
Id=1.5A
Input Voltage Vs. Input Charge
Vin (V)
9
8
Vds=1V Id=1.5A
7
6
5
4
3
2
1
0
01234567891011
Qg (nC)
10/21
Turn off drain source voltage slope
dv/dt(V/usec)
300 275 250 225 200 175 150 125 100
75 50 25
0
0
500
250
750
1000
1250
Rg(ohm)
1500
1750
Vin=5V
Vdd=15V
Id=1.5A
2000
2250
2500
Page 11
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Turn Off Drain-Source Voltage Slope
dv/dt(V/usec)
300 275 250 225 200 175 150 125 100
75 50 25
0
0
500
250
750
1000
1250
1500
Vin=3.5V Vdd=15V
Id=1.5A
1750
Rg(ohm)
Switching Time Resistive Load
t(usec)
4
3.5
2.5
1.5
0.5
Vdd=15V
3
Id=1.5A
Vin=5V
2
1
0
0
500
250
750
1000
1250
1500
1750
td(off)
2000
Rg(ohm)
Output Characteristics
2000
tr
tf
td(on)
2250
2250
2500
2500
Capacitance Variations
C(pF)
350
300
250
200
150
100
50
0 5 10 15 20 25 30 35
f=1MHz Vin=0V
Vds(V)
Switching Time Resistive Load
t(nsec)
900
800
700
600
500
400
300
200
100
0
3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25
td(off)
tf
td(on)
tr
Vdd=15V
Id=1.5A
Rg=220ohm
Vin(V)
Normalized On Resistance Vs. Temperature
Id (A)
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5 0
012345678910
Vin=5V
Vin=4V
Vin=3V
Vds (V)
Rds(on) (mOhm)
4
3.5
3
2.5
2
1.5
1
0.5
Vin=5V
Id=1.5A
-50 -25 0 25 50 75 100 125 150 175
Tc )ºC)
11/21
Page 12
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
Normalized Input Threshold Voltage Vs. Temperature
Vinth (V)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2 0
Vds=Vin
Id=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
Step Response Current Limit
Tdlim(usec)
13
12.5 12
11.5
11
10.5 10
9.5 9
8.5 8
7.5
5 7.5 1012.51517.52022.52527.53032.5
Vdd(V)
Vin=5V
Rg=220ohm
Normalized Current Limit Vs. Junction Temperature
Ilim (A)
10
9
8
7
6
5
4
3
2
1 0
Vin=5V
Vds=13V
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
12/21
Page 13
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
TO-251 (IPAK) MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
H
A
E
= =
C2
L2
B2
= =
C
A3
A1
B6
L
B
B5
G
= =
D
B3
2
1 3
L1
13/21
Page 14
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
TO-252 (DPAK) MECHANICAL DATA
DIM.
A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23
B 0.64 0.90 B2 5.20 5.40
C 0.45 0.60 C2 0.48 0.60
D 6.00 6.20 D1 5.1
E 6.40 6.60 E1 4.7
e2.28 G 4.40 4.60 H 9.35 10.10
L2 0.8 L4 0.60 1.00
R0.2
V2
Package W eight Gr. 0.29
MIN. TYP MAX.
mm.
14/21
P032P
1
Page 15
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
SOT-223 MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 1.8 0.071 B 0.6 0.7 0.85 0.024 0.027 0.033
B1 2.9 3 3.15 0.114 0.118 0.124
c 0.24 0.26 0.35 0.009 0.01 0.014
D 6.3 6.5 6.7 0.248 0.256 0.264
e2.3 0.09
e1 4.6 0.181
E 3.3 3.5 3.7 0.13 0.138 0.146
H 6.7 7 7.3 0.264 0.276 0.287
V10 (max)
A1 0.02 0.1 0.0008 0.004
mm. inch
0046067
15/21
Page 16
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
SO-8 MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 1.75 0.068 a1 0.1 0.25 0.003 0.009 a2 1.65 0.064 a3 0.65 0.85 0.025 0.033
b 0.35 0.48 0.013 0.018 b1 0.19 0.25 0.007 0.010
C 0.25 0.5 0.010 0.019
c1 45 (typ.)
D 4.8 5.0 0.188 0.196
E 5.8 6.2 0.228 0.244
e 1.27 0.050 e3 3.81 0.150
F 3.8 4.0 0.14 0.157
L 0.4 1.27 0.015 0.050
M 0.6 0.023
F 8 (max.)
mm. inch
16/21
Page 17
SOT-223 TAPE AND REEL SHIPMENT (suffix “13TR”)
TAPE DIMENSIONS
According to Electr onic Industries Association (EIA) Sta ndard 481 rev. A, Feb. 1986
Tape width W 12 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 8 Hole Diameter D (± 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 5.5 Compartment Depth K (max) 4.5 Hole Spacing P1 (± 0.1) 2
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
REEL DIMENS I O N S
Base Q.ty 1000 Bulk Q.ty 1000 A (max) 330 B (min) 1.5 C (± 0.2) 13
F 20.2 G (+ 2 / -0) 12.4 N (min) 60 T (max) 18.4
All dimensions are i n mm.
Top
cover
tape
End
500mm min
Empty components pockets saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
17/21
1
Page 18
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
SO-8 TUBE SHIPMENT (no suffix)
B
C
Base Q.ty 100 Bulk Q.ty 2000 Tube length (± 0.5) 532
A
A 3.2 B 6 C (± 0.1) 0.6
All dimensions are i n mm.
TAPE AND REEL SHIPMENT (suffix “13TR”)
REEL DIMENSIONS
Base Q.ty 2500 Bulk Q.ty 2500 A (max) 330 B (min) 1.5 C (± 0.2) 13
F 20.2 G (+ 2 / -0) 12.4 N (min) 60 T (max) 18.4
All dimensions are in mm.
TAPE DIMENSIONS
According to Electr onic Industries Association (EIA) S tanda rd 481 rev. A, Feb 1986
Tape width W 12 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 8 Hole Diameter D (± 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 5.5 Compartment Depth K (max) 4.5 Hole Spacing P1 (± 0.1) 2
All dimensions are i n mm.
18/21
Top
cover
tape
End
500mm min
Empty components pockets saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
Page 19
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
DPAK FOOTPRINT TUBE SHIPMENT (no suffix)
6.7
6.7 3.01.8 1.6
2.3
2.3
TAPE AND REEL SHIPMENT (suffix “13TR”)
A
Base Q.ty 75
C
Bulk Q.ty 3000 Tube length (± 0. 5) 532
A 6
B
B 21.3 C (± 0.1) 0.6
All dimensions are in mm.
REEL DIMENSIONS
Base Q.ty 2500 Bulk Q.ty 2500 A (max) 330 B (min) 1.5 C (± 0.2) 13
F 20.2 G (+ 2 / -0) 16.4 N (min) 60 T (max) 22.4
TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb 1986
Tape width W 16 Tape Hole Spacing P0 (± 0.1) 4 Component Spacing P 8 Hole Diameter D (± 0.1/-0) 1.5 Hole Diameter D1 (min) 1.5 Hole Position F (± 0.05) 7.5 Compartm ent Depth K (max) 6.5 Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
Top
cover
tape
End
500mm min
Empty components pockets saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
19/21
Page 20
VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
IPAK TUBE SHIP MENT (no suffix)
A
C
Base Q.ty 75 Bulk Q.ty 3000 Tube length (± 0.5) 532
B
A 6 B 21.3 C (± 0.1) 0.6
All dimensions are in mm.
20/21
1
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VNN3NV04 / VNS3NV04 / VND3NV04 / VND3NV04-1
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