Datasheet UAA3201T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

UAA3201T

UHF/VHF remote control receiver

Product specification
Supersedes data of 1995 May 18
File under Integrated Circuits, IC18

2000 Apr 18

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

FEATURES

• Oscillator with external Surface Acoustic Wave
Resonator (SAWR)

• Wide frequency range from 150 to 450 MHz

• High sensitivity

• Low power consumption

APPLICATIONS

• Car alarm systems

• Remote control systems

• Security systems

• Gadgets and toys

• Telemetry.

• Automotive temperature range

• Superheterodyne architecture

• Applicable to fulfil FTZ 17 TR 2100 (Germany)

• High integration level, few external components

• Inexpensive external components

• IF filter bandwidth determined by application.

GENERAL DESCRIPTION

The UAA3201T is a fully integrated single-chip receiver,
primarily intended for use in VHF and UHF systems
employing direct AM Return-to-Zero (RZ) Amplitude Shift
Keying (ASK) modulation.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

P

ref

supply voltage 3.5 − 6.0 V
supply current − 3.4 4.8 mA
input reference sensitivity f

= 433.92 MHz;

i(RF)

−−−105 dBm
data rate = 250 bits/s;
BER ≤ 3 × 10

T

amb

ambient temperature −40 − +85 °C

−2

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

UAA3201T SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1

2000 Apr 18 2

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

BLOCK DIAGRAM

V

C19

C12

CC

C17

R1

101112

handbook, full pagewidth

RF_IN

V

EM MIXIN

IF FILTER

FA13LIN LFB CPC CPO

161415

IF AMPLIFIER

×

MIXER

BUFFER

V

OSCILLATOR

OSC OSE MON MOP CPACPB

C7

PINNING

SYMBOL PIN DESCRIPTION

MON 1 negative mixer output
MOP 2 positive mixer output
V

CC

3 positive supply voltage
OSC 4 oscillator collector
OSE 5 oscillator emitter
V

EE

6 negative supply voltage
CPB 7 comparator input B
CPA 8 comparator input A
DATA 9 data output
CPO 10 comparator offset adjustment
CPC 11 comparator input C
LFB 12 limiter feedback
LIN 13 limiter input
MIXIN 14 mixer input
V

EM

15 negative supply voltage for mixer

FA 16 IF amplifier output

CC

LIMITER

BAND GAP

REFERENCE

V

ref

345 12
V

Fig.1 Block diagram.

CC

BUFFER

UAA3201T

V

EE

COMPARATOR

768

C13

UAA3201T

MED897

MON
MOP

V

CC

OSC
OSE

V

EE

CPB
CPA

C14

1
2
3
4
5
6
7
8

Fig.2 Pin configuration.

DATA

9

data

MHB679

16

FA

15

V

EM

14

MIXIN

13

LIN

12

LFB

11

CPC

10

CPO

9

DATA

2000 Apr 18 3

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

FUNCTIONAL DESCRIPTION

The RF signal is fed directly into the mixer stage where it
is mixed down to nominal 500 kHz IF by the integrated
oscillator controlledby anexternalSAWR (seeFig.1). The
IF signalisthenpassedtotheIF amplifierwhichincreases
the level. A 5th-order elliptic low-pass filter acts as main
IF filtering. The output voltage of that filter is demodulated
by a limiter that rectifies the incoming IF signal. The
demodulated signal passes two RC filter stages and is
thenlimited by a data comparator which makes it available
at the data output.

Mixer

The mixer is a single balanced emitter coupled pair with
internally set bias current. The optimum impedance is
320 Ω at 430 MHz. Capacitor C5 (see Fig.9) is used to
transform a 50 Ω generator impedance to the optimum
value.

Oscillator

The oscillator consists of a transistor in common base
configuration and a tank circuit including the SAWR.
Resistor R2 (see Fig.9) is used to control the bias current
through the transistor. Resistor R3 is required to reduce
unwanted responses of the tank circuit.

IF amplifier

The IF amplifier is a differential input, single-ended output
emitter coupled pair. It is used to decouple the first and the
second IF filter and to provide some additional gain in
order to reduce the influence of the noise of the limiter on
the total noise figure.

IF filters

The first IF filter is an RC filter formed by internal resistors
and an external capacitor C7 (see Fig.1).

The second IF filter is an external elliptic filter. The source
impedance is 1.4 kΩ and the load is high-impedance. The
bandwidth of the IF filter in the application and test circuit
(see Fig.9) is 800 kHz due to the centre frequency spread
of the SAWR. It may be reduced when SAWRs with less
tolerances are used or temperature range requirements
are lower. A smaller bandwidth of the filter will yield a
higher sensitivity of the receiver. As the RF signal is mixed
down to a low IF signal there is no image rejection
possible.

Limiter

The limiting amplifier consists of three DC coupled
amplifier stages with a total gain of 60 dB. A Received
Signal Strength Indicator (RSSI) signal is generated by
rectifying the IF signal. The limiter has a lower frequency
limitof 100 kHz which can be controlled by capacitors C12
and C19. The upper frequency limit is 3 MHz.

Comparator

The2 × IF component in the RSSI signalisremoved by the
first order low-pass capacitor C17. After passing a buffer
stage the signal is split into two paths, leading via
RC filters to the inputs of a voltage comparator. The time
constant of one path (C14) is compared to the bit duration.
Consequently the potential at the negative comparator
input represents the average magnitude of the RSSI
signal. The second path with a short time constant (C13)
allows the signal at the positive comparator input to follow
the RSSI signal instantaneously. This results in a variable
comparator threshold, depending on the strength of the
incoming signal. Hence the comparator output is switched
on, when the RSSI signal exceeds its average value, i.e.
when an ASK ‘on’ signal is received.

The low-pass filter capacitor C13 rejects the unwanted
2 × IF component and reduces the noise bandwidth of the
data filter.

The resistor R1 is used to set the current of an internal
source. This current is drawn from the positive comparator
input,therebyapplyinganoffsetanddriving the output into
the ‘off’ state during the absence of an input signal. This
offset can be increased by lowering the value of R1
yieldinga higher noise immunity at the expenseofreduced
sensitivity.

Band gap reference

The band gap reference controls the biasing of the whole
circuit. In this block currents are generated that are
constant over the temperature range and currents that are
proportional to the absolute temperature.

The current consumption of the receiver rises with
increasing temperature, because the blocks with the
highest current consumption are biased by currents that
are proportional to the absolute temperature.

2000 Apr 18 4

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

T

amb

T

stg

V

es

Note

1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

THERMAL CHARACTERISTICS

supply voltage −0.3 +8.0 V
ambient temperature −40 +85 °C
storage temperature −55 +125 °C
electrostatic handling voltage note 1

pins OSC and OSE −2000 +1500 V
pins LFB and MIXIN −1500 +2000 V
all other pins −2000 +2000 V

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 105 K/W

DC CHARACTERISTICS

= 3.5 V; all voltages referenced to VEE; T

V

CC

= −40 to +85 °C; typical value for T

amb

=25°C; for test circuit

amb

see Fig.9; SAWR disconnected; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

V

OH(DATA)

supply voltage 3.5 − 6.0 V
supply current R2 = 680 Ω−3.4 4.8 mA
HIGH-level output voltage at

I

= −10 µA; note 1 VCC− 0.5 − V

DATA

CC

V

pin DATA

V

OL(DATA)

LOW-level output voltage at

I

= +200 µA; note 1 0 − 0.6 V

DATA

pin DATA

Note

1. I

is defined to be positive when the current flows into pin DATA.

DATA

2000 Apr 18 5

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

AC CHARACTERISTICS

VCC= 3.5 V; T
conditions”; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

ref

P

i(max)

P

spur

IP3

mix

IP3

IF

P

1dB

t

on(RX)

Notes

1. P

is the maximum available power at the input of the test board. The Bit Error Rate (BER) is measured using the

ref

test facility shown in Fig.8.

2. Valid only for the reference PCB (see Figs 10 and 11). Spurious radiation is strongly dependent on the PCB layout.

3. The supply voltage VCC is pulsed as explained in Fig.3.

=25°C; for test circuit see Fig.9; R1 disconnected; for AC test conditions see Section “AC test

amb

input reference sensitivity BER ≤ 3 × 10−2; note 1 −−−105 dBm
maximum input power BER ≤ 3 × 10

−2

−−−30 dBm

spurious radiation note 2 −−−60 dBm
interception point (mixer) −20 −17 − dBm
interception point (mixer plus IFamplifier) −38 −35 − dBm
1 dB compression point (mixer) −38 −35 − dBm
receiver turn-on time note 3 −−10 ms

INTERNAL PIN CONFIGURATION

PIN SYMBOL EQUIVALENT CIRCUIT

1 MON
2 MOP

1

2

3V

CC

3

MHB681

4 OSC
5 OSE

4

1.5
kΩ

V

CC

V

P

1.5
kΩ

from

oscillator

buffer

MHB680

V

P

2000 Apr 18 6

5

6 kΩ

1.2 V

MHB682

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

PIN SYMBOL EQUIVALENT CIRCUIT

6V

EE

6

MHB683

7 CPB
8CPA

9 DATA

10 CPO

V

P

150 kΩ

7

8

1 kΩ

9

150 kΩ

MHB684

V

P

MHB686

V

P

11 CPC

2000 Apr 18 7

10

MHB685

V

P

30 kΩ

11

MHB704

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

PIN SYMBOL EQUIVALENT CIRCUIT

12 LFB
13 LIN

14 MXIN
15 V

EM

50

kΩ

12
13

14

V

P

MHB687

16 FA

15

1.4 kΩ

16

MHB688

V

P

MHB689

TEST INFORMATION
Tuning procedure for AC tests

1. Turn on the signal generator: f

= 433.92 MHz, no modulation and RF input level=1mV.

i(RF)

2. Tune capacitor C6 (RF stage input) to obtain a maximum voltage on pin LIN.

3. Check that data is appearing on pin DATA and proceed with the AC tests.

AC test conditions

The reference signal level P

for the following tests is defined as the minimum input level in dBm to give a

ref

BER ≤ 3 × 10−2 (e.g. 7.5 bit errors per second for 250 bits/s).

2000 Apr 18 8

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

Table 1 Test signals

TEST

SIGNAL

1 433.92 250 bits/s

FREQUENCY

(MHz)

DATA SIGNAL MODULATION

RZ signal with duty cycle of 66% for logic 1;

(square wave)

RZ signal with duty cycle of 33% for logic 0

MODULATION

INDEX

100%

2 434.02 − no modulation −
3 433.92 − no modulation −

Test results

P

is the maximum available power from signal generator 1 at the input of the test board; P2 is the maximum available

1

power from signal generator 2 at the input of the test board.

Table 2 Test results

GENERATOR

TEST

RESULT

12

Maximum input power;
see Fig.4

Receiver turn-on time;
see Fig.4 and note 1

Interception point (mixer);
see Fig.5 and note 2

Interception point (mixer plus
IF amplifier); see Fig.5 and
note 3

Spurious radiation; see Fig.6
and note 4

1 dB compression point
(mixer);
see Fig.7 and note 5

test signal 1;

= −30 dBm

P

1

(minimum P
test signal 1;

P

1=Pref

+10dB

test signal 3;

= −50 dBm

P

1

test signal 3;
P

= −50 dBm

1

max

− BER ≤ 3 × 10
(e.g. 7.5 bit errors per second for 250 bits/s)

)

− check that the first 10 bits are correct; error counting is
started 10 ms after VCC is switched on

test
signal 2;
P2=P

test
signal 2;
P2=P

IP3 = P1+1⁄2× IM3 (dB);
minimum value: IP3

1

IP3 = P1+1⁄2× IM3 (dB);
minimum value: IP3IF≥−38 dBm

1

−−no spurious radiation (25 MHz to 1 GHz) with level
higher than −60 dBm (maximum P

test signal 3;
P

= −70 dBm;

11

P12= −38 dBm
(minimum P

1dB

− (Po1+ 70 dB) − [Po2+ 38 dB (minimum P
where Po1is the output power for test signal with P
and Po2 is the output power for test signal with P

)

−2

≥−20 dBm

mix

)

spur

)] ≤ 1dB,

1dB

11

12

Notes

1. The supply voltage VCC of the test circuit alternates between ‘on’ (100 ms) and ‘off’ (100 ms); see Fig.3.

2. Differential probe of spectrum analyser connected to pins MOP and MON.

3. Probe of spectrum analyser connected to pin LIN.

4. Spectrum analyser connected to the input of the test board.

5. Probe of spectrum analyser connected to either pin MOP or pin MON.

2000 Apr 18 9

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

(1) For test circuit see Fig.9.
(2) For BER test facility see Fig.8.

V

CC

(V)

3.5

0

3002001000

Fig.3 Timing diagram for pulsed supply voltage.

GENERATOR 1

50 Ω

TEST CIRCUIT

(1)

Fig.4 Test configuration (single generator).

MED899 - 1

t (ms)

BER TEST

FACILITY

(2)

MED900

GENERATOR 1

50 Ω

50 Ω

2-SIGNAL

POWER

COMBINER

GENERATOR 2

50 Ω

(1) For test circuit see Fig.9.

Fig.5 Test configuration (interception point).

2000 Apr 18 10

TEST CIRCUIT

(1)

∆f

∆f = 100 kHz

SPECTRUM

ANALYZER

WITH

PROBE

IM3

∆f ∆f

MED901

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

SPECTRUM

(1) For test circuit see Fig.9.

ANALYZER

INPUT IMPEDANCE

50 Ω

TEST CIRCUIT

Fig.6 Test configuration (spurious radiation).

(1)

MED902

(1) For test circuit see Fig.9.

UNDER TEST

DEVICE

GENERATOR 1

50 Ω

TEST CIRCUIT

(1)

SPECTRUM

ANALYZER

WITH

PROBE

Fig.7 Test configuration (1 dB compression point).

SIGNAL

GENERATOR

MASTER

CLOCK

delayed
TX data

TX data

BIT PATTERN
GENERATOR

PRESET

DELAY

MED903

INTEGRATE

RX data

AND DUMP

Fig.8 BER test facility.

2000 Apr 18 11

DATA

COMPARATOR

BER TEST BOARD

to error counter

MED904

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

APPLICATION INFORMATION

handbook, full pagewidth

FA
16

1 2 3456 78

MON MOP OSC OSE CPB CPA

3.5 V

C9

C20

L2 L3

IF

AMP

C7

RF_IN

C11C8

C10

V

15 14 13 12 11 10 9

V

CC

V

EM

MIXER

ref

C5

C19

MIXIN LIN LFB CPC CPO DATA

BAND GAP

REFERENCE

V

CC

C3C2C1

C4

L1

C6

BUFFER

OSCILLATOR

C18

L4 R2

C16

C15

LIMITER

R3

+3.5 V

C12

(1)

C17

BUFFER

UAA3201T

V

EE

C21

R1

COMPARATOR

C14 C13

data

MED896

SAWR

(1) Stray inductance.

Fig.9 Application and test circuit.

Fig.9 Application and test circuit.

2000 Apr 18 12

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

Components and layout of printed circuit board of test circuit for f

= 433.92 MHz

i(RF)

Table 3 Components list for Fig.9

COMPONENT VALUE TOLERANCE DESCRIPTION

R1 27 kΩ±2% TC = +50 ppm/K
R2 680 Ω±2% TC = +50 ppm/K
R3 220 Ω±2% TC = +50 ppm/K
C1 4.7 µF ±20% −

≤ 1pF
≤ 1pF

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

−4

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

; f = 1 MHz

−4

−4

−4

; f = 1 MHz

−4

−4

; f = 1 MHz

C2 150 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C3 1 nF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C4 820 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C5 3.3 pF ±10% TC = 0 ±150 ppm/K; tan δ≤30 × 10
C6 2.5 to 6 pF − TC = 0 ±300 ppm/K; tan δ≤20 × 10
C7 56 pF ±10% TC= 0 ±30 ppm/K; tan δ≤10 × 10
C8 150 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C9 220 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C10 27 pF ±10% TC = 0 ±30 ppm/K; tan δ≤20 × 10
C11 150 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C12 100 nF ±10% tan δ≤25 × 10
C13 2.2 nF ±10% tan δ≤25 × 10
C14 33 nF ±10% tan δ≤25 × 10

−3

; f = 1 kHz

−3

; f = 1 kHz

−3

; f = 1 kHz
C15 150 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C16 3.9 pF ±10% TC = 0 ±150 ppm/K; tan δ≤30 × 10

−3

C17 10 nF ±10% tan δ≤25 × 10

; f = 1 kHz
C18 3.3 pF ±10% TC = 0 ±150 ppm/K; tan δ≤30 × 10
C19 68 pF ±10% TC = 0 ±30 ppm/K; tan δ≤10 × 10
C20 6.8 pF ±10% TC = 0 ±150 ppm/K; tan δ≤30 × 10
C21 47 pF ±5% TC = 0 ±30 ppm/K; tan δ≤10 × 10
L1 10 nH ±10% Q
L2 330 µH ±10% Q
L3 330 µH ±10% Q
L4 33 nH ±10% Q

= 50 to 450 MHz; TC = 25 to 125 ppm/K

min

= 45 to 800 kHz; C

min

= 45 to 800 kHz; C

min

= 45 to 450 MHz; TC = 25 to 125 ppm/K

min

stray
stray

SAWR −−see Table 4

; f = 1 MHz
; f = 1 MHz

; f = 1 MHz

; f = 1 MHz

; f = 1 MHz

Table 4 SAWR data

DESCRIPTION SPECIFICATION

Type one-port (e.g. RFM R02112)
Centre frequency 433.42 MHz ±75 kHz
Maximum insertion loss 1.5 dB
Typical loaded Q 1600 (50 Ω load)
Temperature drift 0.032 ppm/K

2

Turnover temperature 43 °C

2000 Apr 18 13

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

MBE589

RF_IN

data

n.c.

H4ACS15

UAA3201T

Fig.10 Layout top side.

MBE591

PCALH/H4ACS15

Fig.11 Layout bottom side.

2000 Apr 18 14

H4ACS15

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

MBE590

RF_IN

C5

C4

L3

C19

L2

n.c.

C6

C15

L1

C12 C17

IC1

R1

SAWR

DATA

C13
C14

data

H4ACS15

supply

UAA3201T

Fig.12 Top side with components.

Fig.12 Top side with components.

C11
C10
C9

C21

R2

C18

C8

C2

C16

R3

L4

C20

C7

C1

MBE592

C3

PCALH/H4ACS15

Fig.13 Bottom side with components.

2000 Apr 18 15

H4ACS15

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

PACKAGE OUTLINE

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

Z

16

pin 1 index

1

D

c

y

9

A

2

A

1

8

e

w M

b

p

E

H

E

detail X

A

X

v M

A

Q

(A )

L

p

L

A

3

θ

0 2.5 5 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

A

max.

1.75

0.069

OUTLINE
VERSION

SOT109-1

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

IEC JEDEC EIAJ

076E07 MS-012

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.0100

0.019

0.0075

0.014

(1)E(1) (1)

cD

10.0

4.0

3.8

0.16

0.15

1.27

0.050

9.8

0.39

0.38

REFERENCES

2000 Apr 18 16

eHELLpQZywv θ

1.05

0.041

1.0

0.4

0.039

0.016

0.7

0.25

0.6

0.028

0.01 0.004

0.020

EUROPEAN

PROJECTION

0.25 0.1

0.01

0.7

0.3

0.028

0.012

ISSUE DATE

97-05-22
99-12-27

o

8

o

0

6.2

5.8

0.244

0.228

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

SOLDERING
Introduction to soldering surface mount packages

Thistextgives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreenprinting,stencillingor
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• Forpackages with leads on four sides, thefootprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Wave soldering

Conventional single wave soldering is not recommended
forsurface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

2000 Apr 18 17

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

WAVE REFLOW

(1)

BGA, LFBGA, SQFP, TFBGA not suitable suitable

SOLDERING METHOD

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable

(3)

PLCC

, SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

(2)

(3)(4)
(5)

suitable

suitable
suitable

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

.

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

2000 Apr 18 18

Philips Semiconductors Product specification

UHF/VHF remote control receiver UAA3201T

DATA SHEET STATUS

DATA SHEET STATUS

Objective specification Development This data sheet contains the design target or goal specifications for

Preliminary specification Qualification This data sheet contains preliminary data, and supplementary data will be

Product specification Production This data sheet contains final specifications. Philips Semiconductors

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DEFINITIONS
Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentation or warranty that suchapplicationswill be
suitable for the specified use without further testing or
modification.

PRODUCT

STATUS

DEFINITIONS

product development. Specification may change in any manner without
notice.

published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DISCLAIMERS
Life support applications  These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomers using or selling theseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes  Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuse of any of these products, conveysnolicenceor title
under any patent, copyright, or mask work right to these
products,andmakesno representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

(1)

2000 Apr 18 19

Philips Semiconductors – a w orldwide compan y

Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone], Fax. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

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Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

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Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
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Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. [phone], Fax [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone], Fax [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
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Spain: Balmes 22, 08007 BARCELONA,
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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone], Fax. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

2000

Internet: http://www.semiconductors.philips.com

69

Printed in The Netherlands 03/pp20 Date of release: 2000 Apr 18 Document order number: 9397 750 06929