Datasheet UAA3220TS Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

UAA3220TS

Frequency Shift Keying
(FSK)/Amplitude Shift Keying
(ASK) receiver

Product specification
Supersedes data of 1998 April 10
File under Integrated Circuits, IC01

1999 Jan 22

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

FEATURES

• Low cost single-chip ASK or FSK receiver

• Superheterodyne architecture with high integration level

• Few external low cost components and crystal required

• Wide supply voltage range

• Low power consumption

• Wide frequency range, 250 to 920 MHz

• High sensitivity

• IF bandwidth determined by application

• High selectivity

• Automotive temperature range

• SSOP24 package.

Applications

• Keyless entry systems

• Car alarm systems

• Remote control systems

• Security systems

• Telemetry systems

• Wireless data transmission

• Domestic appliance.

UAA3220TS

GENERAL DESCRIPTION

The UAA3220TS is a fully integrated single-chip receiver,
primarily intended for use in VHF and UHF systems.
It supports both Amplitude Shift Keying (ASK) and
Frequency Shift Keying (FSK) demodulation.
By connecting DEMO1 (pin 10) to ground during
realisation of the receiver module the UAA3220TS works
as an ASK receiver (see Fig.10). By connecting pin 10 as
shown in Fig.9 the UAA3220TS works as an FSK receiver.
The UAA3220TS incorporates a crystal stabilized local
oscillator, frequency multiplier, balanced mixer, post mixer
amplifier, limiter, Received Signal Strength Indicator
(RSSI), FSK demodulator, data filter, data slicer and
power down circuit.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

CC

I

CC

supply voltage 2.7 − 5.5 V
supply current f

= 433.92 MHz; FSK mode

i(RF)

operating mode on;

=0V

V

PWD

operating mode off;
V

PWD=VCC

2.8 4.3 5.8 mA

− 330µA

ASK mode

P

i(max)(ASK)

Φ

i(ASK)

maximum input power BER ≤ 3% −22 −16 −10 dBm
sensitivity into pin MIXIN f

= 433.92 MHz; BER ≤ 3% −−119 −113 dBm

i(RF)

FSK mode

P

i(max)(FSK)

Φ

i(FSK)

maximum input power BER ≤ 3% −6 0 +1 dBm
sensitivity into pin MIXIN f

= 433.92 MHz; BER ≤ 3% −−103 −100 dBm

i(RF)

1999 Jan 22 2

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

ORDERING INFORMATION

TYPE

NUMBER

UAA3220TS SSOP24

BLOCK DIAGRAM

MIXIN

MGND

handbook, full pagewidth

23

24

MIXER

NAME DESCRIPTION VERSION

plastic shrink small outline package; 24 leads; body width 5.3 mm

V

PMA

FA

CCI

22

21 20

LIMITER

AMPLIFIER

LFB

19

PACKAGE

CPC CPA

RSSILIN

17

CPB

16 1518

DEMODULATOR

UAA3220TS

SOT340-1

DATA14CGND

13

AM/FM

SWITCH

OGND

1

OSCILLATOR

2

OSE

OSB

UAA3220TS

×2/×3

3

4

V

OSC

CC

+

DATA SLICER

−

MULTIPLIER

×3

7TN8

TEM

6

TP

5

BIAS

PWD

9

10

DEMO1

11

DEMO2

12

MGM742

GND

Fig.1 Block diagram.

1999 Jan 22 3

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

PINNING

SYMBOL PIN DESCRIPTION

OGND 1 oscillator ground
OSE 2 oscillator emitter
OSB 3 oscillator base
V

CC

OSC 5 oscillator collector
TEM 6 frequency multiplier emitter resistor
TN 7 frequency multiplier negative output
TP 8 frequency multiplier positive output
PWD 9 power down control input
DEMO1 10 FM demodulator 1, ASK/FSK switch
DEMO2 11 FM demodulator 2
GND 12 general ground
CGND 13 comparator ground
DATA 14 data output
CPA 15 comparator input A
CPB 16 comparator input B
CPC 17 comparator input C
RSSI 18 RSSI output
LFB 19 limiter feedback
LIN 20 limiter input
V

CCI

FA 22 IF amplifier output
MIXIN 23 mixer input
MGND 24 mixer ground

4 positive supply voltage

21 IF amplifier positive supply voltage

handbook, halfpage

OGND

1

OSE

2

OSB

3

V

4

CC

OSC

5

TEM

6

UAA3220TS

TN

7
8

TP

PWD

9
DEMO1
DEMO2

GND

10
11
12

MGM743

Fig.2 Pin configuration.

UAA3220TS

MGND

24

MIXIN

23

FA

22

V

21

CCI

LIN

20
19

LFB
RSSI

18
17

CPC
CPB

16

CPA

15

DATA

14

CGND

13

1999 Jan 22 4

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

FUNCTIONAL DESCRIPTION
Mixer

The mixer is a single-balanced emitter-coupled mixer with
internal biasing. Matching of the RF source impedance to
the mixer input requires an external matching network.

Oscillator

The oscillator is based on a transistor connected in
common collector configuration followed by a cascode
stage driving a tuned circuit. The voltage at this tuned
circuit drives the frequency multiplier. The bias current of
the oscillator is set by an off-chip resistor (R40 in the
application diagram of Fig.9) to a typical value of 260 µA at

433.92 MHz (R40 = 1.8 kΩ). The oscillator frequency is
controlled by an off-chip overtone crystal (X40). Off-chip
capacitors between base and emitter (C42) and ground
(C41) make the oscillator transistor appear as having
negative resistance at small signal levels. This causes the
oscillator to start. A parallel resonance circuit (L40 and
C41) connected to the emitter of the oscillator transistor
prevents oscillation at the fundamental frequency of the
crystal. The LC tank circuit at the output of the oscillator is
used to select either the fundamental, the second or the
third harmonic of the oscillator frequency.

Frequency multiplier

UAA3220TS

Limiter

The limiter is a single-ended input multiple stage amplifier
with high total gain. Amplifier stability is achieved by
means of an external DC feedback capacitor (C21), which
is also used to determine the lower limiter cut-off
frequency. An RSSI signal proportional to the limiter input
signal is provided. Figure 3 shows the DC voltage at pin 18
(RSSI) as a function of the input voltage (RMS value) at
pin 20 (LIN). It also gives the typical IF of 10.7 MHz.
The lower knee of the level curve (see Fig.3) is determined
by the effective noise bandwidth and is, consequently,
slightly higher.

IF filter

IF filtering with high selectivity is realized by means of an
external ceramic filter (X20), which feeds the IF from the
PMA to the limiter.

FM demodulator

Coming from the limiter the FSK signal is fed differential to
the input of the FM demodulator. After buffering the signal
is fed to a phase detector. The phase shift is generated by
an external LC combination connected to DEMO1 (pin 10)
and DEMO2 (pin 11). The baseband signal is coupled out
single ended via an output buffer and is fed to the FSK
input of the ASK/FSK switch.

The frequency multiplier is an emitter-coupled transistor
pair driving an off-chip balanced tuned circuit. The bias
current of this emitter coupled pair is set by an off-chip
resistor (R50) to a typical value of 350 µA at 433.92 MHz
(R50 = 1.2 kΩ). The oscillator output signal is AC-coupled
to one of the inputs of the emitter-coupled pair. The other
input is connected to ground via an on-chip capacitor.
The output voltage of the frequency multiplier drives the
switching stage of the mixer. The bias voltage at this point
is set by an off-chip resistor (R51) to allow sufficient
voltage swing at the mixer outputs.

Post mixer amplifier

The Post Mixer Amplifier (PMA) is a differential input,
single-ended output amplifier. Amplifier gain is provided in
order to reduce the influence of the limiter noise figure on
the total noise figure.

ASK/FSK switch

The selection of either ASK or FSK reception will be done
by the DEMO1 (pin 10). Grounding this pin to 0 V will
switch the IC to ASK mode. Additional the FM demodulator
and parts of the data slicer will be switched off. In FSK
mode DEMO1 (pin 10) is connected to DEMO2 (pin 11)
via a LC combination (see Fig.9).

Data filters

After demodulation a two-stage data filtering circuit is
provided in order to suppress unwanted frequency
components. Two RC low-pass filters with on-chip
resistors are provided which are separated by a buffer
stage.

1999 Jan 22 5

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

Data slicer

Data detection is provided by means of a level comparator
with adaptive slice reference. After the first data filter stage
the pre-filtered data is split into two paths. One passes the
second data filter stage and is fed to the positive
comparator input. The other path is fed to an integration
circuit with a large time constant in order to derive the
average value (DC component) as an adaptive slice
reference which is presented to the negative comparator
input. The internal buffer provides 13 dB AC voltage gain.
The adaptive reference allows to detect the received data
over a large range of noise floor levels. The integration
circuit consists of a simple RC low-pass filter with on-chip
resistors. The data slicer output is designed with internal
pull-up.

1.55

handbook, full pagewidth

V

RSSI

(V)

UAA3220TS

RSSI buffer

The RSSI buffer is an amplifier with a voltage gain of 0 dB.
At FSK receive mode the RSSI output provides a field
strength indication. It has an output impedance of 10 kΩ.
Figure 3 shows the level curve (RSSI curve) as a function
of the limiter input voltage (RMS value).

MGM744

1.45

1.35

1.25

1.15

(1) T
(2) T
(3) T

10

amb
amb
amb

-7

=85°C.
=27°C.
= −40°C.

(1)

(2)

(3)

-6

10

Fig.3 Level curve V

-5

10

-4

10

as a function of V

RSSI

-3

10

LIN(rms)

-2

10

V

LIN(rms)

(V)

-1

10

.

1999 Jan 22 6

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

CC

P

i(max)

T

amb

T

stg

V

es

Note

1. Machine model: C = 200 pF, R = 0 Ω and L = 0.75 µH; pins are connected to GND and V

supply voltage −0.3 +8.0 V
absolute maximum input power − 3 dBm
operating ambient temperature −40 +85 °C
storage temperature −55 +125 °C
electrostatic handling note 1

pins 3 and 6 −50 +50 V
pin 2 −100 +100 V
pin 5 −250 +150 V
pin 23 −200 +250 V
all other pins −250 +250 V

.

CC

THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT

R

th(j-a)

thermal resistance from junction to ambient in free air 125 K/W

1999 Jan 22 7

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

DC CHARACTERISTICS

V

= 2.7 V; T

CC

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

V

CC

I

CC

V

PWD

I

PWD

Oscillator

V

OSE

V

OSB

Multiplier

V

TEM

V

TN,TP

Mixer

V

MIXIN

Post mixer amplifier

V

FA

Limiter

V

LIN

V

LFB

V

RSSI

=25°C; for application diagram see Figs 9 and 10; crystal disconnected; unless otherwise specified.

amb

supply voltage 2.7 − 5.5 V
supply current operating mode on;

V

= 0 V; notes 1 and 2

PWD

FSK demodulation;

2.8 4.3 5.8 mA

note 3
ASK demodulation;

2.5 3.7 4.9 mA

note 4

operating mode off;
V

PWD=VCC

voltage on pin PWD operating mode on

− 330µA

0 − 300 mV

(receiving mode)
operating mode off

V

− 0.3 − V

CC

CC

(sleep mode)

current into pin PWD operating mode on

−30 −10 −3 µA
(receiving mode);
V

=0V

PWD

operating mode off

− 215µA
(sleep mode);
V

PWD=VCC

DC voltage at pin 2 independent of oscillator 0.33 0.38 0.43 V
DC voltage at pin 3 independent of oscillator 1.05 1.15 1.25 V

DC voltage at pin 6 independent of oscillator 0.33 0.39 0.45 V
DC voltage at pins 7 and 8 independent of oscillator 2.01 2.21 2.41 V

DC voltage at pin 23 independent of oscillator 0.68 0.78 0.88 V

DC voltage at pin 22 independent of oscillator 1.10 1.25 1.40 V

DC voltage at pin 20 independent of oscillator 1.85 1.95 2.05 V
DC voltage at pin 19 independent of oscillator 1.85 1.95 2.05 V
DC voltage at pin 18 independent of oscillator 1.00 1.16 1.32 V

V

1999 Jan 22 8

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Demodulator

V

DEMO1,2

DC voltage at pins 10 and 11 independent of oscillator;

note 5

V

DEMO1(ASK)

DC voltage at pin 10 to switch in
ASK mode

Data filter and slicer

V

CPA,CPB,CPC

DC voltage at pins 15, 16 and 17 ASK mode 1.27 1.42 1.57 V

FSK mode; note 6 1.81 2.01 2.21 V

V

OH(DATA)

V

OL(DATA)

HIGH-level output voltage at pin 14 I
LOW-level output voltage at pin 14 I

= −10 µAV

DATA

= 200 µA0−0.6 V

DATA

Notes

1. For f

= 868.35 MHz all values + 0.6 mA.

i(RF)

2. Crystal connected; oscillator and multiplier active.

3. Pin DEMO1 connected to pin DEMO2 via tank circuit.

4. Pin DEMO1 short circuited to ground.

5. The given values are applicable for FSK reception mode. In ASK mode pin 10 is short circuited to ground.

6. No modulation and fIF= 10.7 MHz.

2.00 2.24 2.48 V

0 − 300 mV

− 0.5 − V

CC

CC

V

1999 Jan 22 9

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

AC CHARACTERISTICS

V

= 2.7 V; T

CC

f

= 868.35 MHz (see Table 5); f

i(RF)

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

System performance

f

i(RF)

f

IF

P

i(max)

P

SPUR

f

DATA

t

on(RX)

V

RSSI

ASK mode

Φ

i(ASK)

FSK mode

Φ

i(FSK)

∆f frequency deviation (peak value) 4 10 75 kHz
∆Φ

(FSK)(max)

G

dem

=25°C; for application diagram see Figs 9 and 10; f

amb

= 1 kHz square wave; unless otherwise specified.

mod

= 433.92 MHz (see Table 4) and

i(RF)

RF input frequency 250 − 920 MHz
IF frequency 10.56 10.7 10.84 MHz
maximum input power −−3 dBm

ASK mode; BER ≤ 3%;

−22 −16 −10 dBm

notes 1 and 2
FSK mode; BER ≤ 3%;

−6 0 +1 dBm

notes 2 and 3
spurious radiation note 4 −−−57 dBm
data frequency note 5 − 1 − kHz
receiver turn-on time notes 6 and 7

= 433.92 MHz − 610ms

f

i(RF)

f

= 868.35 MHz − 37ms

i(RF)

RSSI voltage 1.1 − 1.6 V

input sensitivity directly into pin MIXIN BER ≤ 3%; notes 1 and 2

f

= 433.92 MHz −−119 −113 dBm

i(RF)

f

= 868.35 MHz −−116 −110 dBm

i(RF)

input sensitivity directly into pin MIXIN BER ≤ 3%; notes 2 and 3 −−103 −100 dBm

maximum sensitivity degradation ∆f=4kHz −−3dB
demodulator gain note 8 0.75 1.0 1.25

mV

--------- ­kHz

Mixer and post mixer amplifier

Z

IP3
G
Z

i

PMA

PMA

o(IF)

input impedance of mixer f

i(RF)

f

i(RF)

interception point (mixer + PMA) −38 −30 − dBm
gain (mixer + PMA) note 9 40 42 50 dB
output impedance of IF amplifier 280 330 380 Ω

1999 Jan 22 10

= 433.92 MHz − 600 −Ω
= 868.35 MHz − 300 −Ω

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Limiter

R

i(LIN)

Buffer

R

CPC

G

buffer

R

CPA,CPB

Data slicer; see Chapter “DC characteristics”
B

ds

Notes

1. 100% AM modulation (ASK); available power from generator into a 50 Ω load.

2. With external matching network, to transform the impedance to 50 Ω.

3. ∆f = 10 kHz; available power from generator into a 50 Ω load.

4. Measured at the RF input connector of the test board into a 50 Ω load; f

5. The data frequency range can be varied by changing C30 to C32 (see Figs 9 and 10) to match other bit rates.
Data frequency determined by data slicer application.

6. ton= 50 ms; t

7. The given turn-on time is only valid during strobing by pin PWD; if the IC is strobed on and off by the supply voltage
the turn-on time will be longer.

8. LC tank circuit (L60, C60) tuned to maximum phase slope.

9. G

PMA

limiter input resistance 40 48 56 kΩ

data buffer output resistance at pin 17 24 30 36 kΩ
data buffer AC gain 12 13 14 dB
data buffer output resistance at

120 150 180 kΩ

pins 15 and 16

internal data slicer bandwidth 50 − 100 kHz

= 25 MHz to 1 GHz.

i(RF)

= 138 ms; P = P

off

sens

+ 3 dB.

is typically 6 dB lower when measured in the application, because of the load of the ceramic filter.

1999 Jan 22 11

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

INTERNAL CIRCUITRY
Table 1 Equivalent pin circuits and pin voltages for rough test of printed-circuit board; V

PIN

NO.

1 OGND 0
2 OSE 0.38
3 OSB 1.15
5 OSC 2.7

4V
6 TEM 0.39
7 TN 2.21
8 TP 2.21

SYMBOL

CC

PIN

DC VOLTAGE

(V)

2.7

EQUIVALENT CIRCUIT

V

CC

3

GND

7 8

9.6 kΩ

5

UAA3220TS

= 2.7 V; no input signal

CC

5

2

8.15 kΩ

1

MHA780

GND

V

CC

9 PWD −

10 DEMO1 2.24
11 DEMO2 2.24
12 GND 0

6

V

CC

210 kΩ

9

MGM750

10

11

7 kΩ

10 kΩ

7 kΩ

MHA781

12

MGM751

1999 Jan 22 12

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

PIN
NO.

13 CGND 0
15 CPA 1.95
16 CPB 1.95

14 DATA −

PIN

SYMBOL

DC VOLTAGE

(V)

EQUIVALENT CIRCUIT

15

150 kΩ

150 kΩ

16

MGM753

V

CC

1 kΩ

14

UAA3220TS

V

CC

13

17 CPC 1.95

18 RSSI 1.16

13

30 kΩ

12

17

10 kΩ

MGM754

MGM755

18

MGM752

V

CC

GND

1999 Jan 22 13

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

PIN
NO.

19 LFB 1.95

20 LIN 1.95

PIN

SYMBOL

DC VOLTAGE

(V)

EQUIVALENT CIRCUIT

19

MGM756

48 kΩ

20

UAA3220TS

V

CC

GND

V

CC

21 V

CCI

2.7

22 FA 1.25

23 MIXIN 0.78
24 MGND 0

MGM757

MGM759

GND

21

330 Ω

22

GND

MGM758

23

15 Ω

24

1999 Jan 22 14

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

TEST INFORMATION
Tuning procedures

UNING PROCEDURE FOR AC TESTS

T

1. Turn on the signal generator (f

2. Tune first C50 (multiplier tank circuit), second C11 (RF stage input) to obtain a peak IF voltage at pin FA.

T

UNING PROCEDURE FOR ASK RECEPTION

1. Make sure that pin DEMO1 is short circuited to ground.

2. Turn on ASK modulation and check that data is appearing on the DATA output pin and proceed with the AC tests.

UNING PROCEDURE FOR FSK RECEPTION

T

1. Make sure that pins DEMO1 and DEMO2 are connected by the LC tank circuit.

2. Turn on FSK modulation (∆f = 10 kHz; RF input level = −103 dBm).

3. Tune C61 (or L60) (phase shifter LC tank circuit) to obtain a peak LF voltage at pin CPC.

4. Check that data is appearing on pin DATA and proceed with the AC tests.

AC test conditions

= 433.92 or 868.35 MHz; no modulation; RF input level = −50 dBm).

i(RF)

Table 2 Test signals
The reference signal level P

BER ≤ 3 × 10−2 (e.g. 60 bit errors per second for 2000 bits/s). All test signal levels refer to 50 Ω load condition.

TEST

SIGNAL

1 433.92/868.35 1000 Hz square wave AM (ASK) 100% −
2 433.92/868.35 1000 Hz square wave FM (FSK) − 10 kHz
3 433.92/868.35 − no modulation −−
4 433.82/868.35 − no modulation −−

FREQUENCY

(MHz)

for the following tests is defined as the minimum input level in dBm to give a

ref

DATA SIGNAL MODULATION

MODULATION

INDEX

FREQUENCY

DEVIATION

1999 Jan 22 15

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

Table 3 Tests and results
P1 is the maximum available power from signal generator 1 at the input of the test board; P2 is the maximum available

power from signal generator 2 at the input of the test board.

TEST

ASK sensitivity into
pin MIXIN (see Fig.5)

FSK sensitivity into
pin MIXIN (see Fig.5)

Maximum input power
for ASK (see Fig.5)

Maximum input power
for FSK (see Fig.5)

Receiver turn-on
time; see note 1 and
Fig.4

Interception point
(mixer + PMA)
see note 2 and Fig.6

Spurious radiation;
see note 3 and Fig.7

modulated test signal 1;

≤−113 dBm for

P

1

f

= 433.92 MHz;

i(RF)

P1≤−110 dBm for

= 868.35 MHz

f

i(RF)

modulated test signal 2;
P

≤−100 dBm

1

modulated test signal 1;
P

≥−22 dBm

1

modulated test signal 2;
P

≥−6 dBm

1

modulated test
signal 1 or 2;
P

1=Pref

test signal 3;
P

= −40 dBm

1

−−no spurious signals (25 MHz to 1 GHz) with level

GENERATOR

12

− BER ≤ 3 × 10
(e.g. 60 bit errors per second for 2000 bits/s)

− BER ≤ 3 × 10
(e.g. 60 bit errors per second for 2000 bits/s)

− BER ≤ 3 × 10
(e.g. 60 bit errors per second for 2000 bits/s)

− BER ≤ 3 × 10
(e.g. 60 bit errors per second for 2000 bits/s)

− check that the first 10 bits are correct;
error counting is started 10 ms after power down

+3dB

test signal 4;
P2=P

1

is switched into operating mode on
measure with high impedance probe at pin FA

IP3

higher than maximum P

PMA

RESULT

−2

−2

−2

−2

IM3

P

1

--------- ­2

dBm+=

(for IM3 see Fig.6)

SPUR

Notes

1. The voltage at pin PWD of the test circuit alternates between operating mode: on(50 ms; 0 V) and off (138 ms; V
see Fig.4.

2. Probe of spectrum analyzer connected to pin FA (pin 22).

3. Spectrum analyzer connected to the input of the test board.

handbook, full pagewidth

V

PWD

(V)

2.7

0

0 50 188 238 376 426

t (ms)

MGM745

Fig.4 Timing diagram for pulsed power down voltage.

CC

);

1999 Jan 22 16

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

GENERATOR 1

50 Ω

TEST CIRCUIT

UAA3220TS

(1)

BER TEST

FACILITY

(2)

MED900

(1) For test circuit see Fig.9.
(2) For BER test facility see Fig.8.

GENERATOR 1

GENERATOR 2

Fig.5 Test configuration A (single generator).

50 Ω

50 Ω

2-SIGNAL

POWER

COMBINER

50 Ω

TEST CIRCUIT

(1)

∆f

∆f = 100 kHz

SPECTRUM
ANALYZER

WITH

PROBE

IM3

∆f ∆f

MED901

(1) For test circuit see Fig.9.

Fig.6 Test configuration C (IP3).

1999 Jan 22 17

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

SPECTRUM

ANALYZER

INPUT IMPEDANCE

50 Ω

TEST CIRCUIT

UAA3220TS

(1)

MED902

(1) For test circuit see Fig.9.

DEVICE

UNDER TEST

RX data

Fig.7 Test configuration D (spurious radiation).

SIGNAL

GENERATOR

MASTER

CLOCK

delayed
TX data

INTEGRATE

AND DUMP

TX data

BIT PATTERN
GENERATOR

PRESET

DELAY

DATA

COMPARATOR

BER TEST BOARD

MED904

to error counter

Fig.8 BER test facility.

1999 Jan 22 18

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1999 Jan 22 19

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APPLICATION INFORMATION

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

Shift Keying (ASK) receiver

50 Ω

RF

input

C10

L10

L40

R40

C12

MGND

24

MIXER

C40

C11

1
OGND

C41

X20

MIXIN
23

PMA

OSCILLATOR

2
OSE

C42

V

CCI

FA

21 20

22

UAA3220TS

3

4
V

OSB

X40

V

CC

CC

V

R20

×2/×3

R41

CC

5
OSC

C22

LIMITER

AMPLIFIER

C43 L41

C44C70

R51

RSSI

LFB
19

MULTIPLIER

×3

7TN8

6
TEM

C50

R50

L50

CPC CPA

RSSILIN

17

BIAS

TP

L51

power-down

C51

C32C30C33C21C20

CPB

16 1518

DEMODULATOR

9
PWD

C31

10
DEMO1

C60

C61

R60

L60

+

−

11
DEMO2

data output

AM/FM

SWITCH

DATA SLICER

12
GND

DATA

14

CGND
13

MGM747

UAA3220TS

Fig.9 Application diagram (FSK reception).

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1999 Jan 22 20

dbook, full pagewidth

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

Shift Keying (ASK) receiver

50 Ω

RF

input

C10

L10

C12

MGND

24

MIXER

C11

1
OGND

X20

MIXIN
23

PMA

OSCILLATOR

2
OSE

C42

V

CCI

FA

21 20

22

UAA3220TS

3

4
V

OSB

CC

V

R20

×2/×3

CC

5
OSC

C22

LIMITER

AMPLIFIER

RSSI

LFB

19

MULTIPLIER

×3

7TN8

6
TEM

C50

CPC CPA

RSSILIN

17

BIAS

TP

C32C30C33C21C20

CPB

16 1518

DEMODULATOR

9
PWD

C31

10
DEMO1

+

−

11
DEMO2

data output

AM/FM

SWITCH

DATA SLICER

12
GND

DATA

14

CGND
13

MGM748

L40

R40

C40

C41

C43 L41

V

X40

CC

R41

R51

C44C70

R50

Fig.10 Application diagram (ASK reception).

L50

C51

L51

power-down

UAA3220TS

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

Table 4 Component list for Figs 9 and 10; f

COMPONENT

VALUE TOLERANCE

R20 330 Ω±2% +50 −− −
R40 1.8 kΩ±2% +50 −− −
R41 not placed −− − − −
R50 1.2 kΩ±2% +50 −− −
R51 1.5 kΩ±2% +50 −− −
R60 4.7 kΩ±2% +50 −− −

(1)

C10

2.7 pF ±10% 0 ±30 tan δ≤20 × 10−4−−
C11 3 to 10 pF − 0±300 tan δ≤20 × 10
C12 100 pF ±10% 0 ±30 tan δ≤10 × 10
C20 1 nF ±10% 0 ±30 tan δ≤10 × 10
C21 47 nF ±10% 0 ±30 tan δ≤10 × 10
C22 1 nF ±10% 0 ±30 tan δ≤10 × 10
C30 2.7 nF ±10% 0 ±30 tan δ≤10 × 10
C31 470 pF ±10% 0 ±30 tan δ≤10 × 10
C32 47 nF ±10% 0 ±30 tan δ≤10 × 10
C33 10 nF ±10% 0 ±30 tan δ≤10 × 10
C40 1 nF ±10% 0 ±30 tan δ≤20 × 10
C41

(1)

15 pF ±10% 0 ±30 tanδ≤20 × 10−4−−

C42 15 pF ±10% 0 ±30 tan δ≤10 × 10

(1)

C43

8.2 pF ±10% 0 ±30 tan δ≤20 × 10−4−−
C44 1 nF ±10% 0 ±30 tan δ≤10 × 10
C50 3to10pF − 0±300 tan δ≤20 × 10
C51 1 nF ±10% 0 ±30 tan δ≤10 × 10
C60
C61

(2)
(2)

82 pF ±10% 0 ±30 tan δ≤10 × 10−4−−
5to30pF − 0±300 tan δ≤10 × 10−4−−

C70 not placed −− − − −

(3)

L10

8nH ±5% +25 to +125 −≥140 at 150 MHz ≥3 GHz
L40 560 nH ±10% +25 to +125 −≥45 at 100 MHz ≥400 MHz
L41 100 nH ±10% +25 to +125 −≥60 at 350 MHz ≥1 GHz

(3)

L50
L51
L60

(3)
(2)

8nH ±5% +25 to +125 −≥140 at 150 MHz ≥3 GHz

8nH ±5% +25 to +125 −≥140 at 150 MHz ≥3 GHz

2.2 µH ±10% +25 to +125 −≥37 at 7.9 MHz ≥150 MHz
X20 ceramic filter, MurataSFE 10.7 MA 5 A; see note 4
X40 3rd overtone crystal, 70.5367 MHz; see note 5

= 433.92 MHz

i(RF)

COMPONENT CHARACTERISTICS

TEMPERATURE

COEFFICIENT

(ppm/K)

LOSS FACT OR

AT 1 MHz

QUALITY

FACTOR

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

SELF

RESONANCE

FREQUENCY

1999 Jan 22 21

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

Notes

1. C10, C41 and C43 can be placed as tuning capacitors on the PCB.

2. C60, C61 and L60 can be substituted by an LC tank.

3. L10, L50 and L51 are 3 turn air coils.

4. 3 dB bandwidth: 280 ± 50 kHz; insertion loss: 4 dB typical and 6 dB maximum; spurious: 30 dB minimum at
8 to 12 MHz; input and output impedance: 330 Ω.

5. Motional resistance: Rm≤ 20 Ω; static capacitance: C0≤ 6 pF; load capacitance: CL= 6 pF; loaded parallel
resonance frequency: 70.5367 MHz; drive level dependency: Rm≤ 20 Ω (1 nW ≤ P ≤ 1 mW).

1999 Jan 22 22

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

Table 5 Component list for Figs 9 and 10; f

COMPONENT

VALUE TOLERANCE

R20 330 Ω±5% ≤±100 −−−
R40 1.5 kΩ±5% ≤±100 −−−
R41 not placed −−−−−
R50 390 Ω±5% ≤±100 −−−
R51 330 Ω±5% ≤±100 −−−
R60 4.7 kΩ±5% ≤±100 −−−
C10 27 pF ±5% 0 ±30 tan δ≤10 × 10
C11 1.7 to 3 pF − 0 ±300 tan δ≤20 × 10
C12 27 pF ±5% 0 ±30 tan δ≤10 × 10
C20 1 nF ±10% ±15%
C21 47 nF ±10% ±15%
C22 1 nF ±10% ±15%
C30 3.3 nF ±10% ±15%
C31 680 pF ±10% ±15%
C32 10 nF ±10% ±15%
C33 10 nF ±10% ±15%
C40 1 nF ±10% ±15%
C41 12 pF ±5% 0 ±30 tan δ≤10 × 10
C42 12 pF ±5% 0 ±30 tan δ≤10 × 10
C43 4 pF ±0.25 pF 0 ±30 tan δ≤15 × 10
C44 47 pF ±5% 0 ±30 tan δ≤10 × 10
C50 2.5 to 6 pF − 0 ±300 tan δ≤20 × 10
C51 47 pF ±5% 0 ±30 tan δ≤10 × 10
C60
C61

(2)
(2)

82 pF ±5% 0 ±30 tan δ≤10 × 10−4−−

5to30pF − 0±300 tan δ≤3.4 × 10−4−−
C70 4.7 µF ±20% ±15%
L10

(3)

−−−−−−

L40 560 nH ±10% +25 to +125 −≥30 at 25 MHz ≥415 MHz
L41 39 nH ±10% +25 to +125 −≥50 at 50 MHz ≥1.5 GHz

(3)

L50
L51
L60

(3)
(2)

−−−−−−

−−−−−−

2.2 µH ±10% +25 to +125 −≥20 at 7.9 MHz ≥140 MHz
X20 ceramic filter, Murata SFE 107 MA 5 A; see note 4
X40 3rd overtone crystal, 95.2944 MHz; see note 5

= 868.35 MHz

i(RF)

COMPONENT CHARACTERISTICS

TEMPERATURE

COEFFICIENT

(ppm/K)

(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)

(1)

LOSS FACT OR

AT 1 MHz

tan δ≤2.5% −−
tan δ≤2.5% −−
tan δ≤2.5% −−
tan δ≤2.5% −−
tan δ≤2.5% −−
tan δ≤2.5% −−
tan δ≤2.5% −−
tan δ≤2.5% −−

tan δ≤0.06 −−

QUALITY

FACTOR

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

−4

−−

SELF

RESONANCE

FREQUENCY

1999 Jan 22 23

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

Notes

1. Temperature coefficient given as maximum ∆C/C over temperature range.

2. C60, C61 and L60 can be substituted by an LC tank.

3. Realized as microstrip line; see Fig.12.

4. 3 dB bandwidth: 280 ± 50 kHz; insertion loss: 4 dB typical and 6 dB maximum; spurious: 30 dB minimum at
8 to 12 MHz; input and output impedance: 330 Ω.

5. Motional resistance: Rm≤ 20 Ω; static capacitance: C0≤ 6 pF; load capacitance: CL= 6 pF; loaded parallel
resonance frequency: 95.2944 MHz; drive level dependency: Rm≤ 20 Ω (1 nW ≤ P ≤ 1 mW).

1999 Jan 22 24

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

handbook, full pagewidth

UAA3220TS

47

44

bottom viewtop view

RSSI DATA out

C33

C12

C10

RF in

R20

C22

C20

C11

X10

L10

C30

C21

C32

C31

V

CC

R60

UAA3220TS

L60

C61

C60

C40

L51

C43

R50

R41

C42

C51

C50

L40

R40

L50

R51

L41

C44

C70

C41

X40

MGM749

Dimensions in mm.

Fig.11 Printed-circuit board layout for f

1999 Jan 22 25

= 433.92 MHz.

i(RF)

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

handbook, full pagewidth

UAA3220TS

47

46

X20

RSSI

C33

C20

R20

RF in

DATA out

C30

C32

C22

C21

C12

C10

jumper

n.p.

C31

UAA3220TS

C11

bottom view

L60

C61

C60
R60

R50

C50

C42

L40

C41

R40

C40

L41

C44

C51

C43

CON9

C70

R51

R41

X40

MHB459

Dimensions in mm.

Fig.12 Printed-circuit board layout for f

1999 Jan 22 26

= 868.35 MHz.

i(RF)

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

PACKAGE OUTLINE

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

D

c

y

Z

24 13

UAA3220TS

SOT340-1

E

H

E

A

X

v M

A

pin 1 index

112

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

2.0

0.21

0.05

1.80

1.65

2

A3b

0.25

p

0.38

0.25

UNIT A1A

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

p

cD

0.20

8.4

0.09

8.0

0 2.5 5 mm

scale

(1)E(1) (1)

eHELLpQZywv θ

5.4

0.65 1.25

5.2

7.9

7.6

Q

A

2

A

1

detail X

1.03

0.9

0.63

0.7

(A )

L

p

L

A

3

θ

0.13 0.10.2

0.8

0.4

o

8

o

0

OUTLINE
VERSION

SOT340-1 MO-150AG

IEC JEDEC EIAJ

REFERENCES

1999 Jan 22 27

EUROPEAN

PROJECTION

ISSUE DATE

93-09-08
95-02-04

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

SOLDERING
Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

UAA3220TS

If wave soldering is used the following conditions must be
observed for optimal results:

• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.

1999 Jan 22 28

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude

UAA3220TS

Shift Keying (ASK) receiver

Suitability of surface mount IC packages for wave and reflow soldering methods

PACKAGE

BGA, SQFP not suitable suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable

(3)

PLCC
LQFP, QFP, TQFP not recommended
SSOP, TSSOP, VSO not recommended

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

, SO, SOJ suitable suitable

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

The package footprint must incorporate solder thieves downstream and at the side corners.

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”

WAVE REFLOW

(2)

(3)(4)
(5)

SOLDERING METHOD

(1)

suitable

suitable
suitable

.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1999 Jan 22 29

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

NOTES

UAA3220TS

1999 Jan 22 30

Philips Semiconductors Product specification

Frequency Shift Keying (FSK)/Amplitude
Shift Keying (ASK) receiver

NOTES

UAA3220TS

1999 Jan 22 31

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
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Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1999 SCA61
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Printed in The Netherlands 545002/00/02/pp32 Date of release: 1999Jan 22 Document order number: 9397 750 04896