Datasheet TMC2330A Datasheet (Fairchild Semiconductor)

Page 1
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TMC2330A
Coordinate Transformer
16 x 16 Bit, 40 MOPS
Features
• Rectangular-to-Polar or Polar-to-Rectangular conversion at guaranteed 40 MOPS pipelined throughput rate
• Polar data: 16-bit magnitude, 32-bit input/16-bit output phase
• 16-bit user selectable two’s complement or sign-and­magnitude rectangular data formats
• Input register clock enables and asynchronous output enables simplify interfacing
• User-configurable phase accumulator for waveform synthesis and amplitude, frequency, or phase modulation
• Magnitude output data overflow flag (in Polar-to­Rectangular mode)
• Low power consumption CMOS process
• Single +5V power supply
• Available in a 120-pin plastic pin grid array package (PPGA), 120-pin ceramic pin grid array package (CPGA), 120-pin MQFP to PPGA (MPGA) package, and 120-pin metric quad flatpack package (MQFP)
Applications
• Scan conversion (phased array to raster)
• Vector magnitude estimation
• Range and bearing derivation
• Spectral analysis
• Digital waveform synthesis, including quadrature functions
• Digital modulation and demodulation
Description
The TMC2330A VLSI circuit converts bidirectionally between Cartesian (real and imaginary) and Polar (magnitude and phase) coordinates at up to 40 MOPS (Million Operations Per Second).
In its Rectangular-to-Polar mode, the TMC2330A can extract phase and magnitude information or backward “map” from a rectangular raster display to a radial (e.g., range-and-azimuth) data set.
The Polar-to-Rectangular mode executes direct digital waveform synthesis and modulation. The TMC2330A greatly simplifies real-time image-space conversion between the radially-generated image scan data found in radar, sonar, and medical imaging systems, and raster display formats.
All input and output data ports are registered, and a new trans­formed data word pair is available at the output every clock cycle. The user-configurable phase accumulator structure, input clock enables, and asynchronous three-state output bus enables simplify interfacing. All signals are TTL compatible.
Fabricated in a submicron CMOS process, the TMC2330A operates at up to the 40 MHz maximum clock rate over the full commercial (0 to 70°C) temperature and supply voltage ranges, and is available in 120-pin plastic pin grid array, 120-pin ceramic pin grid array, 120-pin metric quad flatpack to PPGA package, and 120-pin metric quad flatpack packages.
Logic Symbol
CONFIGURATION CONTROLS
DATA INPUTS
ENXR
XRIN
ENYP
YPIN
ACC
TCXY
RTP
CLK
15-0
1-0
31-0
1-0
32
16
TMC2330A
OERX
16
RXOUT
15-0
DATA
OEPY
2
16
PYOUT
OVF
OUTPUTS
15-0
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PRODUCT SPECIFICATION TMC2330A
Block Diagram
YPIN
XRIN
15-0
ENXR
31-0
ENYP
1-0
ACC
ACC
1
0
16
1
2
AM
16
3
16
TCXY
RPT
TRANSFORMATION PROCESS
4-21
16 16
22 22 22
16
32 32
16
2
3
4-21
2
CM
32
32
32
PM
FM
16
16
32
32
32
OERX
OVF
RXOUT
15-0
PYOUT
Functional Description
The TMC2330A converts between Rectangular (Cartesian) and Polar (Phase and Magnitude) coordinate data word pairs. The user selects the numeric format and transformation to be performed (Rectangular-To-Polar or Polar-To-Rectangular), and the operation is performed on the data presented to the inputs on the next clock. The transformed result is then available at the outputs 22 clock cycles later, with new out­put data available every 20ns with a 40 MHz clock. All input and output data ports are registered, with input clock enables and asynchronous high-impedance output enables to sim­plify connections to system buses.
OEPY
15-0
When executing a Rectangular-To-Polar conversion, the input ports accept 16-bit Rectangular coordinate words, and the out­put ports generate 16-bit magnitude and 16-bit phase data. The user selects either two’s complement or sign-and-magnitude Cartesian data format. Polar magnitude data are always in magnitude format only. Since the phase angle word is modulo 2 π , it may be regarded as either unsigned or two’s complement format (Tables 1 and 2)
.
In Polar-To-Rectangular mode, the input ports accept 16-bit Polar magnitude and 32-bit phase data, and the output ports produce 16-bit Rectangular data words. Again, the user selects between two’s complement or sign-and-magnitude Cartesian data format.
2
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(x π
(x π
(x π
TMC2330A PRODUCT SPECIFICATION
Table 1. Data Input/Output Formats—Integer Format
… …
Bit #
-15
2
0
2
0
2
2
NS
–2
2
NS
–2
2
NS
–2
±2
15
-16
15
Format
14
2 2
15
2
2
14
14
-17
… … …
0
2
0
2
0
2
-31
2
)T/U
U S T
S T
14
2
15
14
2
14
2
14
2
15
14
2
0
-1
2
0
2
0
2
0
2
0
2
0
2
-15
2
)T/U
S T U
S T
Port RTP TCXY
XRIN XRIN XRIN
YPIN YPIN YPIN
RXOUT RXOUT RXOUT
PYOUT PYOUT PYOUT
0 1 1
0 1 1
0 0 1
0 0 1
X 0 1
X 0 1
0 1 X
0 1 X
31 30 29 16 15 14 0
0
-1
±2
NS
–2
2
2
15
2
-2
2
14
13
2
14
13
2
Table 2. Data Input/Output Formats—Fractional Format
… … …
Bit #
-15
2
-15
2
-15
2
2
NS
–2
-16
2
NS
–2
2
NS
–2 ±2
Format
0
-1
2
-1
2
0
-1
2
-17
2
-15
2
-15
2
-15
2
-31
2
)T/U
U S T
S T
-1
2
0
0
0
0
-1
2
-1
2
-1
2
-1
2
-1
2
-15
2
-15
2
-15
2
-15
2
-15
2
-15
2
)T/U
S T U
S T
Port
XRIN XRIN XRIN
YPIN YPIN YPIN
RXOUT RXOUT RXOUT
PYOUT PYOUT PYOUT
RTP TCXY
0 1 1
0 1 1
0 0 1
0 0 1
X 0 1
X 0 1
0 1 X
0 1 X
31 30 29 16 15 14 0
0
-1
±2
NS
-2
2 2
0
2
-2
2
-1
-2
2
-1
-2
2
(x π
Notes:
15
1. -2
denotes two’s complement sign bit.
2. NS denotes negative sign, i.e., ‘1’ negates the number.
0
3. ±2
denotes two’s complement sign or highest magnitude bit – since phase angles are modulo 2 π and phase accumulator is
modulo 2
32
, this bit may be regarded as + π or - π .
4. All phase angles are in terms of π radians, hence notation “x π .”
5. If A
= 00, YPIN(15-0) are “don’t cares.”
CC
6. Formats:
T = Two’s Complement S = Signed Magnitude U = Unsigned
HEX U T S
FFFF … 8001 8000 7FFF … 0001 0000
REV. 1.1.8 10/31/00
65535
… 32769 32768 32767
1 0
–1
-32767
-32768 32767
1 0
-32767 …
-1 0
32767
1 0
3
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PRODUCT SPECIFICATION TMC2330A
Static Control Inputs
The controls RTP and TCXY determine the transformation mode and the assumed numeric format of the Rectangular data. The user must exercise caution when changing either of
these controls, as the new transformed results will not be seen at the outputs until the entire internal pipe (22 clocks) has been flushed. Thus, these controls are considered static.
Pin Assignments
120-Pin MQFP
Pin Name Pin Name
31
VDD
Pin 1
1
PYOUT4
2
PYOUT3
3
GND
4
PYOUT2
5
PYOUT1
6
PYOUT0
7
VDD
8
OEPY
9
GND
10
RTP
11
CLK
12
GND
13
TCXY
14
ENPY
15
GND
16
ENPY1
17
ACC0
18
ACC1
19
VDD
20
YPIN0
21
YPIN1
22
YPIN2
23
YPIN3
24
YPIN4
25
YPIN5
26
YPIN6
27
GND
28
YPIN7
29
YPIN8
30
GND
32
YPIN9
33
YPIN10
34
VDD
35
YPIN11
36
YPIN12
37
YPIN13
38
YPIN14
39
YPIN15
40
YPIN16
41
YPIN17
42
VDD
43
YPIN18
44
YPIN19
45
YPIN20
46
GND
47
YPIN21
48
YPIN22
49
YPIN23
50
VDD
51
YPIN24
52
YPIN25
53
YPIN26
54
YPIN27
55
YPIN28
56
YPIN29
57
YPIN30
58
YPIN31
59
ENXR
60
XRIN0
Pin Name Pin Name
91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120
VDD RXOUT9 RXOUT8 GND RXOUT7 RXOUT6 RXOUT5 GND RXOUT4 RXOUT3 RXOUT2 VDD RXOUT1 RXOUT0 OVF GND PYOUT15 PYOUT14 PYOUT13 VDD PYOUT12 PYOUT11 PYOUT10 GND PYOUT9 PYOUT8 PYOUT7 GND PYOUT6 PYOUT5
61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90
VDD XRIN1 XRIN2 GND XRIN3 XRIN4 XRIN5 GND XRIN6 XRIN7 XRIN8 XRIN9 XRIN10 XRIN11 XRIN12 GND XRIN13 XRIN14 XRIN15 VDD OERX GND RXOUT15 VDD RXOUT14 RXOUT13 RXOUT12 GND RXOUT11 RXOUT10
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TMC2330A PRODUCT SPECIFICATION
Pin Assignments (continued)
120-Pin PPGA, H5 Package and 120-Pin CPGA, G1 Package and 120-Pin Metric Quad Flatpack to 120-Pin Plastic Pin Array, H6 Package
12345678910111213
A
B
C
D
E
F
G
H
J
K
L
M
N
KEY
Top View
Cavity Up
Pin Name Pin Name
GND
A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 C1 C2 C3 C4
PYOUT5 PYOUT7 PYOUT8 PYOUT10 PYOUT12 PYOUT14 PYOUT15 RXOUT0 RXOUT2 RXOUT4 RXOUT6 RXOUT8 RXOUT10 PYOUT3 PYOUT4 PYOUT6 PYOUT9 PYOUT11 PYOUT13 OVF RXOUT1 RXOUT3 RXOUT5 RXOUT7 RXOUT9 RXOUT12 PYOUT1 PYOUT2 VDD GND
C5 C6 C7 C8 C9 C10 C11 C12 C13 D1 D2 D3 D11 D12 D13 E1 E2 E3 E11 E12 E13 F1 F2 F3 F11 F12 F13 G1 G2 G3
VDD GND VDD GND GND VDD RXOUT11 RXOUT13 OEPY PYOUT0 GND GND RXOUT14 RXOUT15 RTP GND VDD VDD GND OERX TCKY GND CLK VDD RXIN15 RXIN14 ENPY1 ENPY0 GND
Pin Name Pin Name
L10 L11 L12 L13 M1 M2 M3 M4 M5 M6 M7 M8 M9 M10 M11 M12 M13 N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13
YPIN31 VDD XRIN3 XRIN4 YPIN6 YPIN9 YPIN11 YPIN13 YPIN16 YPIN18 YPIN20 YPIN23 YPIN25 YPIN28 ENXR XRIN1 XRIN2 YPIN8 YPIN10 YPIN12 YPIN15 YPIN17 YPIN19 YPIN21 YPIN22 YPIN24 YPIN26 YPIN29 YPIN30 XRIN0
G11 G12 G13 H1 H2 H3 H11 H12 H13 J1 J2 J3 J11 J12 J13 K1 K2 K3 K11 K12 K13 L1 L2 L3 L4 L5 L6 L7 L8 L9
GND XRIN12 RXIN13 ACCO ACC1 VDD XRIN9 XRIN10 XRIN11 YPIN0 YPIN1 YPIN3 GND XRIN7 XRIN8 YPIN2 YPIN4 GND GND XRIN5 XRIN6 YPIN5 YPIN7 GND VDD YPIN14 VDD GND VDD YPIN27
Pin Descriptions
Pin Number
Pin Name
MQFP
CPGA/PPGA/
MPGA
Power, Ground and Clock
V
DD
1, 8, 20, 34, 42,
50, 61, 80, 84, 91,
102, 110
GND 4, 10, 13, 16, 28,
31, 46, 64, 68, 76,
82, 88, 94, 98,
106, 114, 118
C3, E3, H3, L4, L6, L8, L11, F11, E11,
C11, C8, C6
D3, E2, F2, G3,
K3, L3, L7, K11,
J11, G11, E12,
D11, C10, C9, C7,
C5, C4
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Description
The TMC2330A operates from a single +5V supply. All power and ground pins must be connected.
Ground
Page 6
PRODUCT SPECIFICATION TMC2330A
Pin Descriptions (continued)
Pin Number
Pin Name
MQFP
CPGA/PPGA/
MPGA
CLK 12 F3 The TMC2330A operates from a single clock. All enabled
Inputs/Outputs
XRIN
15-0
79, 78, 77, 75, 74, 73, 72, 71, 70, 69, 67, 66, 65, 63, 62,
60
F12, F13, G13,
G12, H13, H12,
H11, J13, J12,
K13, K12, L13,
L12, M13, M12,
N13
YPIN
31-0
58, 57, 56, 55, 54, 53, 52, 51, 49, 48, 47, 45, 44, 43, 41, 40, 39, 38, 37, 36, 35, 33, 32, 30, 29, 27, 26, 25, 24, 23,
22, 21
L10, N12, N11,
M10, L9, N10, M9,
N9, M8, N8, N7, M7, N6, M6, N5,
M5, N4, L5, M4,
N3, M3, N2, M2,
N1, L2, M1, L1,
K2, J3, K1, J2, J1
RXOUT
83, 85, 86, 87, 89,
15-0
90, 92, 93, 95, 96,
97, 99, 100, 101,
103, 104
D13, D12, C13, B13, C12, A13,
B12, A12, B11,
A11, B10, A10,
B9, A9, B8, A8
PYOUT
15-0
107, 108, 109, 111, 112, 113, 115, 116, 117,
119, 120, 2, 3, 5,
A7, A6, B6, A5, B5, A4, B4, A3, A2, B3, A1, B2,
B1, C2, C1, D2
6, 7
Controls
ENXR 59 M11 The value presented to the input port XRIN is latched into
ENYP
1,0
17, 15 G1, G2 The value presented to the YPIN input port is latched into
Description
registers are strobed on the rising edge of CLK, which is the reference for all timing specifications.
XRIN
is the registered Cartesian X-coordinate or
15-0
Polar Magnitude (Radius) 16-bit input data port. XRIN15 is the MSB.
YPIN
is the registered Cartesian Y-coordinate or Polar
31-0
Phase angle 32-bit input data port. The input phase accumulators are fed through this port in conjunction with the input enable select ENYP
. When RTP is HIGH
1,0
(Rectangular-To-Polar), the input accumulators are normally not used. The 16 MSBs of YPIN are the input port, and the lower 16 bits become dont cares if ACC = 00. YPIN31 is the MSB.
RXOUT
is the registered Polar Magnitude (Radius) or
15-0
X-coordinate 16-bit output data port. This output is forced into the high-impedance state when OERX=HIGH. RXOUT15 is the MSB.
PYOUT
is the registered Polar Phase angle or
15-0
Cartesian Y-coordinate 16-bit output data port. This output is forced to the high-impedance state when OEPY=HIGH. PYOUT15 is the MSB.
the input registers on the current clock when ENXR is HIGH. When ENXR is LOW, the value stored in the register remains unchanged.
the phase accumulator input registers on the current clock, as determined by the control inputs ENYP shown below:
1,0
, as
Register Operation ENYP
MC
1,0
00 hold hold 01 load hold 10 hold load 11 clear load
where C is the Carrier register and M is the Modulation register, and 0=LOW, 1=HIGH. See the Functional Block Diagram.
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TMC2330A PRODUCT SPECIFICATION
Pin Descriptions (continued)
Pin Number
Pin Name
MQFP
CPGA/PPGA/
MPGA
RTP 11 E1 This registered input selects the current transformation
ACC
1,0
19, 18 H2, H1 In applications utilizing the TMC2330A to perform
Description
mode of the device. When RTP is HIGH, the TMC2330A executes a Rectangular-To-Polar conversion. When RTP is LOW, a Polar-To-Rectangular conversion will be performed. The input and output ports are then configured to handle data in the appropriate coordinate system. This is a static input. See the Timing Diagram.
waveform synthesis and modulation in the Polar-To-Rectangular mode (RTP=LOW), the user determines the internal phase Accumulator structure implemented on the next clock by setting the accumulator control word ACC
, as shown below:
1,0
ACC
Configuration
1,0
00 No accumulation performed (normal operation) 01 PM accumulator path enabled 10 FM accumulator path enabled 11 (Nonsensical) logical OR of PM and FM
where 0 = L0W, 1 = HIGH. See the Functional Block Diagram. The accumulator will roll over correctly when full-scale is exceeded, allowing the user to perform continuous phase accumulation through 2π radians or 360 degrees. Note that the accumulators will also function when RTP=HIGH (Rectangular-To-Polar), which is useful when performing backward mapping from Cartesian to polar coordinates. However, most applications will require that ACC
be set to 00 to avoid accumulating the Cartesian Y
1,0
input data.
TCXY 14 F1 The format select control sets the numeric format of the
Rectangular data, whether input (RTP=HIGH) or output (RTP=LOW). This control indicates twos complement format when TCXY=HIGH and sign-and-magnitude when LOW. This is a static input. See the Timing Diagram.
OVF 105 B7 When RTP=LOW (Polar-To-Rectangular), the Overflow
Flag will go HIGH on the clock that the magnitude of either of the current Cartesian coordinate outputs exceeds the maximum range. It will return LOW on the clock that the Cartesian out-put value(s) return to full-scale or less. See the Applications Discussion section. Overflow is not possible in Rectangular-To-Polar mode (RTP = HIGH).
OERX, OEPY
81, 9 E13, D1 Data in the output registers are available at the outputs of
the device when the respective asynchronous Output Enables are LOW. When OERX or OEPY is HIGH, the respective output port(s) is in the high impedance state.
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PRODUCT SPECIFICATION TMC2330A
Absolute Maximum Ratings
(beyond which the device may be damaged)
Parameter Conditions Min Typ Max Units
Supply Voltage -0.5 7.0 V
Input Voltage -0.5 VDD + 0.5 V
Output Applied Voltage
Externally Forced Current
2
3,4
Short-Circuit Duration Single output in HIGH state
to ground
Operating Temperature -20 110 °C
Ambient Temperature -20 110 °C
Storage Temperature -65 150 °C
Junction Temperature 140 °C
Lead Soldering 10 seconds 300 °C
Notes:
1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Operating Conditions are not exceeded.
2. Applied voltage must be current limited to specified range.
3. Forcing voltage must be limited to specified range.
4. Current is specified as conventional current flowing into the device.
1
-0.5 VDD + 0.5 V
-3.0 6.0 V
1 sec
Operating Conditions
Parameter Min Nom Max Units
V f
CLK
t
PWH
t
PWL
t
S
t
H
V V I
OH
l
OL
T
A
DD
lH
IL
Power Supply Voltage 4.75 5.0 5.25 V
Clock frequency TMC2330A 20 MHz
TMC2330A-1 40 MHz
Clock Pulse Width, HIGH 7 ns
Clock Pulse Width, LOW 6 ns
Input Data Setup Time 6 ns
Input Data Hold Time 1 ns
Input Voltage, Logic HIGH 2.0 V
Input Voltage, Logic LOW 0.8 V
Output Current, Logic HIGH -2.0 mA
Output Current, Logic LOW 4.0 mA
Ambient Temperature, Still Air 0 70 °C
8 REV. 1.1.8 10/31/00
Page 9
TMC2330A PRODUCT SPECIFICATION
Electrical Characteristics
Parameter Conditions Min Nom Max Units
I
DD
I
DDU
I
DDQ
C I
IH
I
IL
I
OZH
I
OZL
I
OS
V V
Power Supply Current VDD = Max, C
LOAD
= 25pF, f
CLK
= Max
TMC2330A 140 mA
TMC2330A-1 240 mA
Power Supply Current, Unloaded
VDD = Max, OERX, OEPY = HIGH, f
= Max
CLK
TMC2330A 95 mA
TMC2330A-1 175 mA
Power Supply Current,
VDD = Max, CLK = LOW 5mA
Quiescent
I/O Pin Capacitance 5 pF
PIN
Input Current, HIGH V Input Current, LOW V
Hi-Z Output Leakage
= Max,VIN = V
DD
= Max,VIN = 0 V ±10 µA
DD
VDD = Max,VIN = V
DD
DD
Current, Output HIGH
Hi-Z Output Leakage
VDD = Max,VIN = 0 V ±10 µA
Current, Output LOW
Short-Circuit Current -20 -80 mA Output Voltage, HIGH S
OH
Output Voltage, LOW S
OL
, IOH = Max 2.4 V
15-0
, IOL = Max 0.5 V
15-0
±10 µA
±10 µA
Switching Characteristics
Parameter Conditions
t
DO
t
HO
t
ENA
t
DIS
Note:
1. All transitions are measured at a 1.5V level except for t
Output Delay Time C
Output Hold Time C
Three-State Output Enable Delay C
Three-State Output Disable Delay C
ENA
= 25 pF 16 ns
LOAD
= 25 pF 3 ns
LOAD
= 0 pF 13 ns
LOAD
= 0 pF 13 ns
LOAD
and t
DIS
1
.
Min Nom Max Units
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Page 10
PRODUCT SPECIFICATION TMC2330A
Timing Diagrams
No Accumulation
CLK
RTP, TCXY
ACC[1:0]
ENXR,
ENYP[1:0]
XRIN[15:0],
YPIN[31:0]
RXOUT[15:0],
PYOUT[15:0]
Note: OERX = OEPY = LOW
Phase Modulation
CLK
RTP, TCXY
ACC[1:0]
ENXR
XRIN[15:0]
ENYP[1:0]
YPIN[31:0]
RXOUT[15:0] PYOUT[15:0]
tS
tH
0123
00
EN EN EN
A BC
0123 22 23 24 25
00 01
R
10 01 01 01 01
C I J K L
01 01 01
tPWH
tPWL
00 00
22
C + I
tD tHO
f(A) f(B)
2C + J 3C + K 4C + L
23
Notes:
1. OERX
= OEPY = LOW
2. Carrier C and amplitude R loaded on CLK0.
3. Modulation Values I, J, K, L Loaded on CLK1, CLK2, etc.
4. Output corresponding to modulation loaded at CLKi emerged tDO after CLKi + 21.
5. To modulate amplitude, vary XRIN with ENXR = 1.
Applications Discussion
Numeric Overow
Because the TMC2330A accommodates 16-bit unsigned radii and 16-bit signed Cartesian coordinates, Polar-To­Rectangular conversions can overflow for incoming radii greater than 32767= 7FFFh and will overflow for all incom­ing radii greater than 46341=B505h. (ln signed magnitude mode, a radius of 46340 = B504h will also overflow at all angles.) The regions of overflow and of correct conversion are illustrated in Figure 1.
10 REV. 1.1.8 10/31/00
In signed magnitude mode, overflows are circularly symmet­rical—if a given radius overflows at an angle P, it will also overflow at the angles π-P, π+P, and -P. This is because -X will overflow if and only if X overflows, and -Y will over­flow if and only if Y overflows.
In two’s complement mode, the number system’s asymmetry complicates the overflow conditions slightly. An input vector with an X component of -32768=8000h will not overflow, whereas one with an X component of +32768 will. Table 3 summarizes several simple cases of overflow and near-over­flow.
Page 11
TMC2330A PRODUCT SPECIFICATION
Table 3a. X-Dimensional Marginal Overows
TC YPIN OV RXOUT CORRECT X
0 0000 = 0 1 0000 = +0 +32768
0 8000 = π 1 8000 = -0 -32768
1 0000 = 0 1 8000 = -32768 +32768
1 8000 = π 0 8000 = -32768 -32768
In all cases, RTP=0 (Polar-To-Rectangular mode) and XRIN=8000 (incoming radius=32768).
Table 3b. Maximal Overow (Radius In=65535)
TC YPIN OV RXOUT CORRECT X
0 0000 = 0 1 7FFF = +32767 +65535
0 8000 = π 1 FFFF = -32767 -65535
1 0000 = 0 1 FFFF = -1 +65535
1 8000 = π 1 0001 = +1 -65535
In all cases, RTP=0 (Polar-To-Rectangular mode) and XRIN=7FFF (incoming radius=65535, which will always overflow).
Numeric Underow
In RTP=1 (Rectangular-To-Polar) mode, if XRIN=YPIN=0, the angle is undefined. Under these conditions, the TMC2330A will output the expected radius of 0 (RXOUT= 0000) and an angle of 1.744 radians (PYOUT=4707). This angle is an artifact of the CORDIC algorithm and is not flagged as an error, since the angle of any 0 length vector is arbitrary.
Performing Scan Conversion with the TMC2330A
Medical Imaging Systems such as Ultrasound, MRI, and PET, and phased array Radar and Sonar systems generate radial-format coordinates (range or distance, and bearing) which must be converted into raster-scan format for further processing and display. Utilizing the TMC2302A Image Resampling Sequencer, a minimum chipcount Scan Con­verter can be implemented which utilizes the trigonometric translation performed by the TMC2330A to backwards-map from a Cartesian coordinate set into the Polar source image buffer address space.
As shown in Figure 2, the TMC2330A transforms the Carte­sian source image addresses from the TMC2302A directly to vector distance and angle coordinates, while the TMC2302A writes the resulting resampled pixel values into the target memory in raster fashion. Note that the ability to perform this spatial transformation in either direction gives the user the freedom to process images in either coordinate space, with little restriction. Image manipulation such as zooms or tilts can easily be included in the transformation by program­ming the desired image manipulation into the TMC2302A’s transformation parameter registers.
65535
32767
Y
π/2
X = R (Cos θ) Y = R (Sin θ) and
R = X2 + Y
θ = Tan-1 (Y/X)
If R 32767, overflow will not occur (Region A).
C
B
A
R
θ
X
32767 65535
Figure 1. First Quadrant Coordinate Relationships
If R > 32767, overflow will not occur (Region B) if |X| 32767 and |Y| 32767. If R > 32767, overflow will occur (Region C) if |X| 32768 or |Y| 32768.
2
REV. 1.1.8 10/31/00 11
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PRODUCT SPECIFICATION TMC2330A
R
SADR
SADR
X
TMC2330A
COORDINATE
Y
TRANSFORMER
θ
R
θ
SOURCE IMAGE BUFFER
DATA OUT
(2) TMC2302A IMAGE
RESAMPLING
SEQUENCERS
TADR
TADR
TWR
Figure 1. Figure 1. First Quadrant Coordinate Relationships
Figure 2. Block Diagram of Scan Converter Circuit Utilizing TMC2330A and TMC2302A Image Resampling Sequencer
Arithmetic Error for Two’s Complement Rectangular to Polar Conversion
A random set of 5000 input vector coordinate pairs (X,Y), uniformly spread over a circle of radius 32767 was converted to polar coordinates.
U
V
(4) TMC2011A
DELAY
REGISTER
The results of the 10,000-vector study were as follows:
Mean Error (X) +0.0052 LSB Mean Error (Y) 0.0031 LSB Mean Absolute Error (X) 0.662 LSB Mean Absolute Error (Y) 0.664 LSB Root Mean Square Error (X) 1.025 LSB
U
V
DATA IN
TARGET
IMAGE
BUFFER
TMC2246A PIXEL INTERPOLATOR
Σ
Root Mean Square Error (Y) 1.020 LSB Radius Error Range –0.609 to 0.746 LSB Mean Radius Error 0.019 LSB
Max Error (X) +4/ -5 LSB
Max Error (Y) +5 -4 LSB Mean Absolute Radius Error 0.252 LSB
Since this is a double conversion (rectangular to polar and Phase Error Range –1.373 to 1.469 LSB Mean Phase Error 0.058 LSB Mean Absolute Phase Error 0.428 LSB
back) which includes a wide variety of “good case” and “bad
case” vectors, the chip should perform even better in many
real systems. Repeating the experiment and restricting the
original data set to an annulus defined by 8196<R<32768
Statistical Evaluation of Double Conversion
In this empirical test, 10,000 random Cartesian vectors were converted to and from polar format by the TMC2330A. The resulting Cartesian pairs were then compared against the
reduced the mean square error to 0.89 LSB and the peak
error to ±4 LSB (x or y). These latter results are more ger-
mane to synthesizer, demodulator, and other applications in
which the amplitude can be restricted to lie between quarter
and full scale. The largest errors tend to occur in the angle
component of small radius cartesian-to-polar conversion. original ones. The un-restricted database represents uniform sampling over a square bounded by -32769<x<32768 and
-32769<y<32768.
12 REV. 1.1.8 10/31/00
Page 13
TMC2330A PRODUCT SPECIFICATION
Equivalent Circuits
V
V
DD
DD
Digital Input
GND
Figure 3. Equivalent Input Circuit
OERX, OEPY
Three-State Outputs
Figure 5. Transition Levels for Three-State Measurements
p
n
p
Digital Output
n
GND
Figure 4. Equivalent Output Circuit
t
ENA
t
DIS
0.5V
2.0V
High Impedance
0.5V
0.8V
REV. 1.1.8 10/31/00 13
Page 14
PRODUCT SPECIFICATION TMC2330A
Mechanical Dimensions
120-Lead CPGA Package
A2
Notes:
1.
Pin #1 identifier shall be within shaded area shown.
2.
Pin diameter excludes solder dip finish.
3.
Dimension "M" defines matrix size.
4.
Dimension "N" defines the maximum possible number of pins.
5.
Orientation pin is at supplier's option.
6.
Controlling dimension: inch.
A1
L
e
øB
øB2
P
A
Symbol
A .080 .160 2.03 4.06
A1 .040 .060 1.01 1.53
A2 .125 3.17
øB .016 .020 0.40 0.51 øB2
D 1.340 1.380 33.27 35.05
D1
e
L
L1 .170 .190 4.31 4.83
M13 13
N
P
Inches
Min. Max. Min. Max.
.215 5.46
.050 NOM. 1.27 NOM.
1.200 BSC 30.48 BSC
.100 BSC 2.54 BSC
.110 .145 2.79 3.68
120 120
.003 .076
D
Millimeters
Notes
2 2
SQ
3
4
Top View
Cavity Up
Pin 1 Identifier
D1
14 REV. 1.1.8 10/31/00
Page 15
PRODUCT SPECIFICATION TMC2330A
Mechanical Dimensions
120-Lead PPGA Package
A2
Notes:
1.
Pin #1 identifier shall be within shaded area shown.
2.
Pin diameter excludes solder dip finish.
3.
Dimension "M" defines matrix size.
4.
Dimension "N" defines the maximum possible number of pins.
5.
Orientation pin is at supplier's option.
6.
Controlling dimension: inch.
A1
L
e
øB
øB2
P
A
Symbol
A .080 .160 2.03 4.06
A1 .040 .060 1.01 1.53
A2 .125 3.17
øB .016 .020 0.40 0.51 øB2
D 1.340 1.380 33.27 35.05
D1
e
L
L1 .170 .190 4.31 4.83
M13 13
N
P
Inches
Min. Max. Min. Max.
.215 5.46
.050 NOM. 1.27 NOM.
1.200 BSC 30.48 BSC
.100 BSC 2.54 BSC
.110 .145 2.79 3.68
120 120
.003 .076
D
Millimeters
Notes
2 2
SQ
3
4
Top View Cavity Up
Pin 1 Identifier
D1
15 REV. 1.1.8 10/31/00
Page 16
PRODUCT SPECIFICATION TMC2330A
Mechanical Dimensions
120-Lead Metric Quad Flat Package to Pin Grid Array Package (MPGA)
A1
Notes:
1.
Pin #1 identifier shall be within shaded area shown.
2.
Pin diameter excludes solder dip finish.
3.
Dimension "M" defines matrix size.
4.
Dimension "N" defines the maximum possible number of pins.
5.
Orientation pin is at supplier's option.
6.
Controlling dimension: inch.
L
A3
øB2
øB
e
A2
Symbol
A .309 .311 7.85 7.90
A1 .145 .155 3.68 3.94
A2
A3
øB .016 .020 0.40 0.51 øB2
D 1.355 1.365 34.42 34.67
D1
e
L
M13 13
N
Inches
Min. Max. Min. Max.
.080 2.03
.175 .185 4.45 4.70
.090 2.29
.050 TYP. 1.27 TYP.
.050 NOM. 1.27 NOM.
1.200 BSC 30.48 BSC
.100 BSC 2.54 BSC
120 120
Millimeters
Notes
2 2
SQ
3
4
A
Fairchild
TMC2330A
Pin 1 Identifier
D
e
D1
16 REV. 1.1.8 10/31/00
Page 17
TMC2330A PRODUCT SPECIFICATION
Mechanical Dimensions
120-Pin MQFP Package
Symbol
A .154 3.92
A1 .010 .25 A2 .125 .144 3.17 3.67 B .012 3, 5.30
C .005 .13 D/E 1.219 1.238 30.95 31.45
D1/E1 1.098 1.106 27.90 28.10 e
L .026 .037 .65 .95
N
ND
α
ccc
E
E1
Inches
Min. Max. Min. Max.
.018 .45
.009 .23
.0315 BSC .80 BSC
120 120
30 30
.004 .10
D
PIN 1 IDENTIFIER
Millimeters
D1
Notes
5
4
e
0.063" Ref (1.60mm)
Notes:
1.
All dimensions and tolerances conform to ANSI Y14.5M-1982.
2.
Controlling dimension is millimeters.
3.
Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be .08mm (.003in.) maximum in excess of the "B" dimension. Dambar cannot be located on the lower radius or the foot.
4.
"L" is the length of terminal for soldering to a substrate.
5.
"B" & "C" includes lead finish thickness.
.20 (.008) Min.
0° Min.
.13 (.005) R Min.
.13/.30 .005/.012
C
L
Lead Detail
R
α
See Lead Detail
A2
A
B
A1
Seating Plane
Base Plane
-C-
LEAD COPLANARITY
ccc
C
REV. 1.1.8 10/31/00 17
Page 18
PRODUCT SPECIFICATION TMC2330A
Ordering Information
Product Number
Temperature
Range
Speed
Grade
Screening Package
Package
Marking
TMC2330AG1C 0° to 70°C 20 MHz Commercial 120-Pin Ceramic Pin Grid Array 2330AG1C
TMC2330AG1C1 0° to 70°C 40 MHz Commercial 120-Pin Ceramic Pin Grid Array 2330AG1C1
TMC2330AH5C 0° to 70°C 20 MHz Commercial 120-Pin Plastic Pin Grid Array 2330AH5C
TMC2330AH5C1 0° to 70°C 40 MHz Commercial 120-Pin Plastic Pin Grid Array 2330AH5C1
TMC2330AH6C 0° to 70°C 20 MHz Commercial 120 Lead Metric Quad FlatPack
N/A
to Pin Grid Array
TMC2330AH6C1 0° to 70°C 40 MHz Commercial 120 Lead Metric Quad FlatPack
N/A
to Pin Grid Array
TMC2330AKEC 0° to 70°C 20 MHz Commercial 120-Pin Metric Quad FlatPack 2330AKEC
TMC2330AKEC1 0° to 70°C 40 MHz Commercial 120-Pin Metric Quad FlatPack 2330AKEC1
LIFE SUPPORT POLICY
FAIRCHILDS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
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2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
10/31/00 0.0m 002
2000 Fairchild Semiconductor Corporation
Stock#DS30002230A
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