Datasheet TMC1103X50 Datasheet (Fairchild Semiconductor)

Page 1
www.fairchildsemi.com
Features
• 8-bit resolution
• 50 Msps conversion rate
• Low power: 100mW per channel @ 20 Msps
• Integral track/hold
• Independent Input Clamps
• Integral and differential linearity error 0.5 LSB
• Differential phase 0.7 degree
• Differential gain 1.8%
• Single +5V power supply
• Three-state TTL/CMOS-compatible outputs
• Low cost
Applications
• Video digitizing (composite and Y-C)
• VGA and CCD digitizing
• LCD projection panels
• Image scanners
• Personal computer video boards
• Multimedia systems
• Low cost, high speed data conversion
Description
Incorporated into the TMC1103 are three analog-to-digital (A/D) converters, each with an independent clock, reference voltage and input clamp. Analog signals are converted to Triple 8-bit digital words at sample rates up to 50 Msps (Megasamples per second) per channel.
Integral Track/Hold circuits deliver excellent performance on signals with full-scale spectral components up to 12 MHz. Innovative two-step conversion architecture and
submicron CMOS technology reduce typical power dissipa­tion to 100 mW per converter.
Power is derived from a single +5 Volt power supply. Out­puts are three-state outputs and TTL/CMOS-compatible.
TMC1103 package is a 80-lead Metric Quad Flat Pack (MQFP). Performance specifications are guaranteed from 0°C to 70°C.
Block Diagram
8-bit
A/D Converter
R
TA
DA
7-0
OE
A
CLK
A
V
INA
V
CLPA CLP
A
R
BA
65-1103-01
Clamp
8-bit
A/D Converter
R
TB
DA
7-0
OE
B
CLK
B
V
INB
V
CLPB CLP
B
R
BB
Clamp
8-bit
A/D Converter
R
TC
DA
7-0
OE
C
CLK
C
V
INC
V
CLPC CLP
C
R
BC
Clamp
TMC1103
Triple Video A/D Converter with Clamps
8-Bit, 50Msps
Rev. 1.2.0
Page 2
TMC1103 PRODUCT SPECIFICATION
2
Circuit Function
Within the TMC1103 are three 8-bit A/D converters, each employing two-step architecture to convert an analog input to a digital output at rates up to 50 Msps. Input signals are held in integral track/hold stages during the conversion pro­cess. Operation is pipelined, with one input sample taken and one output word provided for each CLKX cycle.
Each of the three converters function identically. In the fol­lowing descriptions ‘X’ refers to a generic input/output or clock where ‘X’ is equivalent to A, B or C.
The first step in the conversion process is a coarse 4-bit quantization. This determines the range of the subsequent fine 4-bit quantization step. To eliminate spurious codes, the fine 4-bit A/D quantizer output is gray-coded and converted to binary before it is combined with the coarse result to form a complete 8-bit result.
Analog Input and Voltage References
Each A/D accepts analog signals in the range RBX to RTX into digital data. Input signals outside this range produce “satu­rated” 00h or FFh output codes. The device will not be damaged by signals within the range A
GND
to V
DDA
.
Input range is very flexible and extends from the +5 Volt power supply to ground. Nominal input range is 2 Volts, extending from 0.6V to 2.6V. Characterization and performance is specified over this range. However, the part will function with a full-scale range from 1.0V to 5.0V. A smaller input range may simplify analog signal condition­ing circuitry, at the expense of additional noise sensitivity and some reduced differential linearity performance.
External voltage reference sources are connected to the RTX and RBX pins. RBX can be grounded. Within each A/D con­verter is a reference resistor ladder comprising 255 resistors that are accessed by the TMC1103 comparators. RTX is con­nected to the top of the ladder, RBX to the bottom. Gain and offset errors are directly related to the accuracy and stability of the applied reference voltages.
Input Clamps
A clamp circuit is connected to the input pin V
INX
of each of the three A/D converters. With CLPX LOW, the input pin is clamped to the voltage at V
CLPX
. If CLPX is HIGH, the input pin is high impedance. Clamping adds an offset voltage to an AC coupled signal to adjust this signal’s amplitude to the A/D converter input voltage range.
The analog input is corrected through a 0.1mF capacitor to V
INX
. The source impedance of the analog source should be less than 50 Ohms. Current pulses through the capacitor over several clamp cycles until the voltage across the capacitor equals the difference between V
CLPX
and the voltage at the analog source during the clamping period. When the switch is open, the voltage on the coupling capacitor is added to the analog input, producing a a DC offset input signal.
Input Clamp Circuit
Digital Inputs and Outputs
Sampling of the applied input signal occurs on the falling edge of the CLKX signal (Figure 1). Output data is delayed by 2 1/2 CLKX cycles and is valid following the rising edge of CLKX. Previous output data remains valid for tHO (Out­put Hold Time). New data becomes valid tD (Output Delay Time) after this rising edge of CLKX.
Whenever the analog input signal is sampled and found to be at a level beyond the A/D conversion range, the output limits at 00h or FFh, as appropriate.
Table 1. A/D Output Coding
Note: 1 LSB = (RTX – RBX) / 255
The outputs of the TMC1103 are CMOS- and TTL-compatible, and are capable of driving four low-power Schottky TTL loads. An Output Enable control, OEX, places the A/D outputs in a high-impedance state when HIGH. The outputs are enabled when OEX is LOW.
Power and Ground
The TMC1103 operates from a single +5 Volt power supply. For optimum performance, an analog ground plane should be placed under the TMC1103 the A
GND
and D
GND
pins
should be connected to the system analog ground plane.
Input V oltage Output
RTX + 1 LSB FF
R
TX
FF
RTX - 1 LSB FE
• • • • • • RBX + 128 LSB 80 RBX + 127 LSB 7F
• • • • • •
RBX + 1 LSB 01
R
BX
00
RBX - 1 LSB 00
A/D Converter
Analog
Input
V
INX
0.1µF
V
CLPX
CLP
X
65-1103-02
Page 3
PRODUCT SPECIFICATION TMC1103
3
Pin Assignments
NC DA
5
DA
6
DA
7
OE
A
V
DD
V
DD
NC CLK
A
NC V
DDA
V
INA
AGND R
TA
R
BA
V
CLPA
V
CLPB
V
CLPC
DGND DGND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
DGND DGND NC NC DGND DGND V
DD
CLP
A
CLP
B
CLP
C
NC DGND DGND DC
0
DC
1
DC
2
DC
3
DC
4
DC
5
DC
6
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Pin Name Pin Name
DC
7
OE
C
V
DD
V
DD
CLK
C
NC V
DDA
V
INC
AGND R
TC
R
BC
R
BB
R
TB
AGND V
INB
V
DDA
NC CLK
B
NC V
DD
41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60
V
DD
OE
B
DB
7
DB
6
DB
5
DB
4
DB
3
DB
2
DB
1
DB
0
DGND DGND NC DGND DGND DA
0
DA
1
DA
2
DA
3
DA
4
61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
Pin Name Pin Name
124
65-1103-03
25
40
4164
65
80
Page 4
PRODUCT SPECIFICATION TMC1103
4
Pin Descriptions
Pin Name Pin Number Value Pin Function Description A/D Converters
V
INA
, V
INB
,
V
INC
12, 55, 48 RTX to
R
BX
Analog Inputs. The input voltage conversion range lies between the voltage applied to the RTX and RBX pins.
RTA, RTB, R
TC
14, 53, 50 2.6V Reference Voltage, Top Inputs. DC voltages applied to RTA, RTB
and RTC define highest value of V
INX
.
RBA, RBB, R
BC
15, 52, 51 0.6V Reference Voltage, Bottom Inputs. DC voltages applied to RBA,
RBB and RBC define lowest value of V
INX
.
CLKA, CLKB, CLK
C
9, 58, 45 CMOS Clock Inputs. CMOS-compatible. V
INX
is sampled on the falling
edge of CLK
X
.
DA
7-0
4, 3, 2, 80, 79,
78, 77, 76
CMOS/
TTL
Data outputs, Converter A (D7 = MSB). Eight-bit CMOS- and TTL-compatible digital outputs. Valid data is output on the rising edge of CLKX.
DB
7-0
63, 64, 65, 66,
67, 68, 69, 70
CMOS/
TTL
Data outputs, Converter B (D7 = MSB). Eight-bit CMOS- and TTL-compatible digital outputs. Valid data is output on the rising edge of CLKX.
DC
7-0
41, 40, 39, 38,
37, 36, 35, 34
CMOS/
TTL
Data outputs, Converter C (D7 = MSB). Eight-bit CMOS- and TTL-compatible digital outputs. Valid data is output on the rising edge of CLKX.
OEA, OEB, OE
C
5, 62, 42 CMOS Output Enable Inputs. CMOS-compatible. When LOW, the A/D
output is enabled. When HIGH, the output is in a high-impedance state.
Clamps
V
CLPA
, V
CLPB
,
V
CLPB
16, 17, 18 RTX to
R
BX
Clamp Reference Voltage. One reference for each clamp. A V
INX
input is clamped to V
CLPX
when CLPX is low.
CLPA, CLPB, CLP
C
28, 29, 30 CMOS Clamp Pulse Inputs. One input for each A/D clamp. When CLPX is
low, the V
INX
input is clamped to the V
CLPX
clamp voltage.
Power
V
DDA
11, 47, 56 +5V Analog Supply Voltage. +5 Volt power inputs. These should come
from the same power source and be decoupled to A
GND
.
V
DD
6, 7, 27, 28, 29,
30, 43, 44, 60,
61
+5V Digital Supply Voltage. +5 Volt power inputs. These should come
from the same power source and be decoupled to A
GND
.
A
GND
13, 49, 54 0.0V Analog Ground. Ground connections. These pins should be
connected to the system analog ground plane.
D
GND
16, 17, 18, 19, 20, 21, 22, 25, 26, 32, 33, 71,
72, 74, 75
0.0V Digital Ground. Ground connections. These pins should be connected to the system analog ground plane.
No Connect
N/C 1, 8, 10, 23, 24,
31, 46, 57, 59,
73
open Not Connected.
Page 5
PRODUCT SPECIFICATION TMC1103
5
Figure 1. Timing
Equivalent Circuits and Threshold Levels
Figure 2. Equivalent Digital Input Circuit Figure 3. Equivalent Digital Output Circuit
V
INX
Sample N
Sample N+1
Data N-3 Data N-2 Data N-1 Data N
Hi-Z
Sample N+2
Sample N+3
t
STD
t
PWL
t
PWH
t
DIS
t
ENA
t
DO
t
HO
1/f
S
CLK
X
65-1103-04
DX
7-0
OE
X
Digital Input
V
DD
p
n
27014B
GND
V
DD
p
n
27011B
GND
Digital Output
Page 6
TMC1103 PRODUCT SPECIFICATION
6
Equivalent Circuits and Threshold Levels (continued)
Figure 4. Equivalent Analog Input Circuit Figure 5. Threshold Levels for Three-State Measurements
Notes:
1. Absolute maximum ratings are limiting values applied individually while all other parameters are within specified operating conditions. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only if Operating Conditions are not exceeded.
2. Applied voltage must be current limited to specified range.
3. Forcing voltage must be limited to specified range.
4. Current is specified as conventional current flowing into the device.
Absolute Maximum Ratings (beyond which the device may be damaged)
1
Parameter Condition Min Typ Max Unit Power Supply Voltages
VDDA Measured to A
GND
-0.5 +7.0 V
VDD Measured to D
GND
-0.5 +7.0 V
VDDA Measured to V
DD
-0.5 +0.5 V
AGND Measured to D
GND
-0.5 +0.5 V
Digital Inputs
Applied Voltage Measured to DGND -0.5 V
DD
+ 0.5 V
Forced current
-10.0 +10.0 mA
Analog Inputs
Applied Voltage Measured to A
GND
-0.5 V
DDA
+0.5 V
Forced current -10.0 +10.0 mA
Digital Outputs
Applied voltage Measured to D
GND
-0.5 VDD + 0.5 V
Forced current
-6.0 +6.0 mA
Short circuit duration Single output in HIGH state to ground) 1 second
Temperature
Operating, ambient -20 110 °C Junction +150 °C Lead, soldering 10 seconds +300 °C Vapor Phase soldering 1 minute +220 °C Storage -65 +150 °C Electrostatic Discharge EIAJ test method ±150 V
V
DDA
V
RT
V
RB
A
GND
V
IN
29030
7048B
t
ENA
2.0V
0.8V
t
DIS
Three-State Outputs
OE
High Impedance
0.5V
0.5V
Page 7
PRODUCT SPECIFICATION TMC1103
7
Operating Conditions
Parameter Min. Nom Max. Units
VDD, V
DDA
Power Supply Voltage 4.75 5.0 5.25 V
A
GND
Analog Ground (Measured to D
GND
) -0.1 0 0.1 V
V
RTX
Reference Voltage, Top 2.6 V
DDA
V
V
RBX
Reference Voltage, Bottom 0 0.6 V
V
RTX-VRBX
Reference Voltage Differential 1.0 2.0 5.0 V
V
INX
Analog Input Range V
RB
V
RT
V
V
CLPX
Clamp Reference Voltage, 50W max source 0 V
V
IH
Input Voltage, Logic HIGH 0.7 V
DD
V
DD
V
V
IL
Input Voltage, Logic LOW GND 0.3 V
DD
V
I
OH
Output Current, Logic HIGH -4.0 mA
I
OL
Output Current, Logic LOW 4.0 mA
T
A
Ambient Temperature, Still Air 0 70 °C
Electrical Characteristics
Parameter Conditions Min. Typ
1
Max. Units
I
DD
Power Supply Current
1
C
LOAD
= 35pF, fCK = fS (3 A/Ds) fS = 20 Msps 70 90 mA fS = 40 Msps 94 120 mA fS = 50 Msps 105 135 mA
I
DDQ
Power Supply Current, Quiescent
VDD = V
DDA
= Max.
CLKX = LOW 29 55 mA CLKX = HIGH 45 65 mA
PD Total Power Dissipation
1
C
LOAD
= 35pF, fCK = fS (3 A/Ds) fS = 20 Msps 300 470 mW fS = 40 Msps 425 630 mW fS = 50 Msps 490 710 mW
C
AI
Input Capacitance, Analog CLKX = LOW 4 pF
CLKX = HIGH 12 pF
R
IN
Input Resistance 500 kW
R
REF
Reference Resistance 200 270 340 W
I
CB
Input Current, Analog ±5 mA
I
IH
Input Current, HIGH VDD = Max., VIN = V
DD
±5 mA
I
IL
Input Current, LOW VDD = Max., VIN = 0V ±5 mA
I
OZH
Hi-Z Output Leakage Current, Output HIGH
VDD = Max., VIN = V
DD
±5 mA
I
OZL
Hi-Z Output Leakage Current, Output LOW
VDD = Max., VIN = V
DD
±5 mA
I
OS
Short-Circuit Current 35 mA
Page 8
TMC1103 PRODUCT SPECIFICATION
8
Note:
1. Typical values with V
DD
= V
DDA
= Nom and TA = Nom, Maximum values with VDD = V
DDA
= Max. and TA = Min.
Switching Characteristics
V
OH
Output Voltage, HIGH IOH = -2.5mA 3.5 V
IOH = Max. 2.4 V
V
OL
Output Voltage, LOW IOL = Max. 0.4 V
C
DI
Digital Input Capacitance 4 10 pF
C
DO
Digital Output Capacitance 10 pF
Parameter Conditions Min. Typ. Max. Units
f
S
Conversion Rate TMC1103-20 20 Msps TMC1103-40 40 Msps TMC1103-50 50 Msps
t
PWH
CLKX Pulsewidth, HIGH TMC1103-20 14 ns TMC1103-40 14 ns TMC1103-50 13 ns
t
PWL
CLKX Pulsewidth, LOW TMC1103-20 8 ns TMC1103-40 8 ns TMC1103-50 7 ns
E
AP
Aperture Error 30 ps
t
STO
Sampling Time Offset 1 2 5 ns
t
STS
Sampling Time Skew 150 400 ps
t
CPW
Clamp Pulse Width
1
+20 < TA < +70°C2 mS
t
CDLY
Clamp Delay Time 100 300 ns
t
HO
Output Hold Time CLOAD = 15pF 9 ns
t
DO
Output Delay Time 14 ns
t
ENA
Output Enable Time 27 ns
t
DIS
Output Disable Time 42 ns
Electrical Characteristics (continued)
Parameter Conditions Min. Typ
1
Max. Units
Page 9
PRODUCT SPECIFICATION TMC1103
9
System Performance Characteristics
Parameter Conditions Min. Typ. Max. Units
E
LI
Integral Linearity Error, Independent
VRT = 2.6V ±0.5 LSB
E
LD
Differential Linearity Error VRB = 0.6V ±0.5 LSB
BW Bandwidth
1
TMC1203-20 10 MHz TMC1203-40 12 MHz TMC1203-50 12 MHz
E
OT
Offset Voltage, Top (RT – VIN for most positive code transition)
VRT = 2.6V, VRB = 0.6V -40 80 mV
E
OB
Offset Voltage, Bottom (RB – VIN for most negative code transition)
VRT = 2.6V, VRB = 0.6V -95 -30 mV
OFF
CL
Offset Voltage, Clamp ±20 mV
dg Differential Gain fS = 14.3Msps
NTSC 40 IRE Mod Ramp V
DDA
= +5.0V, TA=25°C
VRT = 2.6V, VRB = 0.6V
1.8 %
dp Differential Phase fS = 14.3Msps
NTSC 40 IRE Mod Ramp V
DDA
= +5.0V, TA=25°C
VRT = 2.6V, VRB = 0.6V
0.7 deg
XTALK Channel Crosstalk fN = 5.0 MHz 45 dB SNR Signal-to-Noise Ratio fS = 20Msps, VRT = 2.6V, VRB = 0.6V
fN = 1.24MHz 46 dB fN = 2.48MHz 46 dB fN = 6.98MHz 45 dB fN = 10.0MHz 45 dB fS = 40Msps, VRT = 2.6V, VRB = 0.6V fN = 1.24MHz 42 dB fN = 6.98MHz 41 dB fN = 12.0MHz 40 dB fS = 50Msps, VRT = 2.6V, VRB = 0.6V fN = 1.24MHz 40 dB fN = 6.98MHz 40 dB fN = 12.0MHz 40 dB
Page 10
TMC1103 PRODUCT SPECIFICATION
10
Notes:
1. Bandwidth is the frequency up to which a full-scale sinewave can be digitized without spurious codes.
2. Values shown in Typ. column are typical for V
DD
= V
DDA
= +5V and TA = 25°C.
3. SNR values do not include the harmonics of the fundamental frequency.
4. SFDR is the ratio in dB of fundamental amplitude to the harmonic with the highest amplitude.
5. Characteristics specified for V
RT
= 2.6V, VRB = 0.6V.
SFDR Spurious-Free Dynamic Range fS = 20Msps, VIN = 2V p-p
fN = 1.24MHz 53 dB fN = 2.48MHz 48 dB fN = 6.98MHz 44 dB fN = 10.0MHz 40 dB fS = 40Msps, VIN = 2V p-p fN = 1.24MHz 49 dB fN = 6.98MHz 44 dB f
N
= 12.0MHz 38 dB fS = 50Msps, VIN = 2V p-p fN = 1.24MHz 46 dB fN = 6.98MHz 40 dB fN = 12.0MHz 37 dB
System Performance Characteristics (continued)
Parameter Conditions Min. Typ. Max. Units
Page 11
PRODUCT SPECIFICATION TMC1103
11
Typical Performance Characteristics
Figure 6. Typical IDD vs fS (Single A/D) Figure 7. Typical SFDR vs f
IN
Figure 8. Typical SNR vs f
IN
Figure 9. Typical SNR vs Full Scale Input Range
35 30 25 20 15 10
5 0
01020
f
S
(Msps)
I
DD
30 40 50
65-1103-05
60
50
40
30
20
10
0
05
f
S
= 20Msps
10 15 20 25
fIN (Msps)
SFDR (dB)
65-1103-06
50
40
30
20
10
0
05
f
S
= 20Msps
10 15 20 25
fIN (MHz)
SNR (dB)
65-1103-07
50
40
30
20
10
0
01
f
S
= 20Msps
234 5
V
IN
SNR (dB)
65-1103-08
Page 12
TMC1103 PRODUCT SPECIFICATION
12
Figure 10. Typical Interface Circuit – High Performance
+ –
+ –
+ –
+ –
LM185-1.2
1k½
1k½
1k½
1k½
10k½
1k½
75½
100
20½
+5V
+5V
+5V
GREEN
Video
Input
GREEN
Digital
Video
Output
BLUE
Digital
Video
Output
RED
Digital
Video
Output
Pixel
Clock
0.1µF
65-1103-09
Gain Adjust
1k½
1k½
10k½
75½
100
BLUE Video
Input
1k½
1k½
10k½
75½
100
RED
Video
Input
2k½ 0.1µF
0.1µF
0.1µF
0.1µF
0.1µF
0.1µF
VCLAMP CLAMP
0.1µF
V
DDA
R
TA
R
TB
R
TC
R
BA
R
BB
R
BC
V
INA
V
CLPA
CLP
A
V
CLPB
CLP
B
V
CLPC
CLP
C
V
INB
V
INC
A
GNDDGND
V
DD
V
DDP
DA
7-0
OE
A
CLK
A
TMC1103
DB
7-0
OE
B
CLK
B
DC
7-0
OE
C
CLK
C
0.1µF
Application Notes
The circuit in Figure 10 employs a band-gap reference to generate a variable RTX reference voltages for the TMC1103 as well as a bias voltage to offset the wideband input amplifi­ers to mid-range. The operational amplifier in the reference circuitry is a standard 741-type.
The voltage reference at RTX can be adjusted from 0.0 to 2.4 volts while RBX is grounded. Schottky diodes can be used at V
INX
to restrict the wideband amplifier output to between
-0.3V and VDD +0.3V. Diode protection is good practice to limit the analog input voltage at V
INX
to the safe operating
range.
Grounding
The TMC1103 has separate analog and digital circuits. To keep digital system noise from the A/D converter, it is rec­ommended that power supply voltages (VDD and V
DDA
) come from the same source, and that ground connections (D
GND
and A
GND
) be made to the analog ground plane, and as close as possible to the device pins. Power supply pins should be individually decoupled at the pin. The digital cir­cuitry that gets its input from the TMC1103 should be referred to the system digital ground plane.
Printed Circuit Board Layout
Designing with high performance mixed-signal circuits demands printed circuits with ground planes. Overall system performance is strongly influenced by the board layout. Capacitive coupling from digital to analog circuits may result in poor A/D conversion. Consider the following sug­gestions when doing the layout:
1. Keep the critical analog traces (VN, RTX, RBX) as short as possible and as far as possible from all digital signals. The TMC1103 should be located close to the analog input connectors.
Page 13
PRODUCT SPECIFICATION TMC1103
13
2. Segregate traces:
• A/D analog
• D/A analog
• Clocks
• Digital Treat analog inputs as transmission lines. Cleanly route
traces over the ground plane bearing in mind that the return currents will flow through the ground plane beneath the traces. Do not route digital traces nearby. A few inches of digital trace less than a few line widths from an analog trace will cross-couple noise into adjacent analog circuits.
3. The power plane for the TMC1103 should be separate from that which supplies the rest of the digital circuitry. A single power plane should be used for all of the V
DD
pins. If the power supply for the TMC1103 is the same as that of the system's digital circuitry, power to the TMC1103 should be decoupled with ferrite beads and
0.1mF capacitors to reduce noise.
4. The ground plane should be solid, not cross-hatched. Connections to the ground plane should have very short leads.
5. Decoupling capacitors should be applied liberally to V
DD
pins. Remember that not all power supply pins are created equal. They supply different circuits on the integrated circuit, each of which generate varying amounts and types of noise. For best results, use 0.1mF ceramic capacitors. Lead lengths should be minimized.
6. CLKX should be handled carefully. Jitter and noise on this clock may degrade performance. Terminate the clock line, if needed, to eliminate overshoot and ringing.
Related Products
• TMC1175A, TMC1275 8-Bit Video A/D Converters
• TMC1173A, TMC1273 3V, Low-Power 8-Bit Video
A/D Converters
• TMC1203 Triple 8-bit A/D Converter
• TMC3003/TMC3503 Triple Video D/A Converters
• TMC2242B/TMC2243/TMC2246A Digital Filters
Page 14
TMC1103 PRODUCT SPECIFICATION
14
Notes:
Page 15
PRODUCT SPECIFICATION TMC1103
15
Mechanical Dimensions – 80-Lead MQFP Package
A1
-C-
LEAD COPLANARITY
Seating Plane
ccc C
See Lead Detail
Base Plane
A
A2
E
E1
D1
D
Pin 1 Identifier
B
e
Lead Detail
R
C
L
a
Datum Plane
0¡ Min.
.20 (.008) Min.
.13 (.30) .005 (.012)
0.063" Ref (1.60mm)
A .134 3.40
Symbol
Inches
Min. Max. Min. Max.
Millimeters
Notes
A1 .010 .25
.018 .45
A2 .100 .120 2.55 3.05 B .012 3, 5
5
.30
.009 .23
C .005 .13
E .667 .687 16.95 17.45
.0315 BSC .80 BSC
e L .025 .041 .65 1.03
80 80 24 24
4 N ND
16 16
NE
a 0¡ 7¡ 0¡ 7¡
.004 0.10
ccc
D .904 .923 22.95 23.45 D1 .783 .791 19.90 20.10
E1 .547 .555 13.90 14.10
Notes:
1.
2.
3.
4.
5.
All dimensions and tolerances conform to ANSI Y14.5M-1982. Controlling dimension is millimeters. Dimension "B" does not include dambar protrusion. Allowable
dambar protrusion shall be .08mm (.003in.) maximum in excess of the "B" dimension. Dambar cannot be located on the lower radius or the foot.
"L" is the length of terminal for soldering to a substrate. "B" & "C" includes lead finish thickness.
.13 (.005) R Min.
Page 16
TMC1103 PRODUCT SPECIFICATION
6/22/98 0.0m 002
Stock# DS70001103
Ó 1998 Fairchild Semiconductor Corporation
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
Ordering Information
Product Number
Conversion
Rate (Msps) Temperature Range Screening Package Package Marking
TMC1103KLC20 20 Msps TA = 0°C to 70°C Commercial 80-Lead MQFP 1103KLC20 TMC1103KLC40 40 Msps TA = 0°C to 70°C Commercial 80-Lead MQFP 1103KLC40 TMC1103KLC50 50 Msps TA = 0°C to 70°C Commercial 80-Lead MQFP 1103KLC50
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