Datasheet TDA1516BQ-N2-S10, TDA1516BQ-N2 Datasheet (Philips)

Page 1
DATA SH EET
Product specification File under Integrated Circuits, IC01
July 1994
INTEGRATED CIRCUITS
TDA1516BQ
24 W BTL or 2 x 12 watt stereo car radio power amplifier
Page 2
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
GENERAL DESCRIPTION
The TDA 1516BQ is an integrated class-B output amplifier in a 13-lead single-in-line (SlL) plastic power package. The device is primarily developed for car radio applications.
FEATURES
Requires very few external components
Flexibility in use stereo as well as mono BTL
High output power (without bootstrap)
Low offset voltage at output (important for BTL)
Fixed gain
Good ripple rejection
Mute/stand-by switch
Load dump protection
A.C. and d.c. short-circuit-safe to ground and V
P
Thermally protected
Reverse polarity safe
Capability to handle high energy on outputs (VP = 0 V)
No switch-on/switch-off plop
Flexible leads
Low thermal resistance
Identical inputs (inverting and non-inverting)
Compatible with TDA1518Q (except gain)
QUICK REFERENCE DATA
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply voltage range
operating V
P
6,0 14,4 18,0 V
non-operating V
P
−−30,0 V
load dump protected V
P
−−45,0 V
Repetitive peak output
current I
ORM
−−4A
Total quiescent current I
tot
30 mA
Stand-by current I
sb
0,1 100 µA
Switch-on current I
sw
−−40 µA
Input impedance
BTL |ZI|25−−k stereo |Z
I
|50−−k
Stereo application
Output power THD = 10%; 4 P
o
6 W
THD = 10%; 2 P
o
11 W Channel separation α 40 −−dB Noise output voltage V
no(rms)
50 −µV
BTL application
Output power THD = 10%; 4 P
o
22 W Supply voltage R
S
= 0 ;
ripple rejection f = 100 Hz to 10 kHz RR 48 −−dB
D.C. output offset voltage |V
O
| −−100 mV
Page 3
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
PACKAGE OUTLINE
13-lead SIL-bent-to-DIL; plastic power (SOT141); SOT141-6; 1996 July 24.
Fig.1 Block diagram.
Page 4
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
PINNING
FUNCTIONAL DESCRIPTION
The TDA1516BQ contains two identical amplifiers with differential input stages. This device can be used for stereo or bridge applications. The gain of each amplifier is fixed at 20 dB. A special feature of this device is the mute/stand-by switch which has the following features:
low stand-by current (< 100 µA)
low mute/stand-by switching current (low cost supply switch)
mute condition.
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
1 INV1 non-inverting input 1 8 BS2 bootstrap 2 2 INV inverting input 9 OUT2 output 2 3 GND1 ground (signal) 10 V
P
supply voltage
4V
ref
reference voltage 11 M/SS mute/stand-by switch 5 OUT1 output 1 12 RR supply voltage ripple rejection 6 BS1 bootstrap 1 13 INV2 non-inverting input 2 7 GND2 ground (substrate)
PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT
Supply voltage
operating V
P
18 V
non-operating V
P
30 V
load dump protected during 50 ms;
tr≥ 2,5 ms V
P
45 V
A.C. and d.c. short-circuit-
safe voltage V
PSC
18 V
Reverse polarity V
PR
6V
Energy handling capability
at outputs V
P
= 0 V 200 mJ
Non-repetitive peak output
current I
OSM
6A
Repetitive peak output
current I
ORM
4A
Total power dissipation see Fig.2 P
tot
25 W
Crystal temperature T
c
150 °C
Storage temperature range T
stg
55 + 150 °C
Page 5
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
Fig.2 Power derating curve.
Page 6
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
D.C. CHARACTERISTICS (note 1)
V
P
= 14,4 V; T
amb
= 25 °C; unless otherwise specified
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Supply
Supply voltage range note 2 V
P
6,0 14,4 18,0 V
Quiescent current I
P
40 80 mA
D.C. output voltage at
approximately VP/2 note 3 V
O
6,8 V
D.C. output offset
voltage |V
5-9
| −−100 mV
Mute/stand-by switch
Switch-on voltage level V
ON
8,5 −−V
Mute condition
V
mute
3,0 6,4 V
Output signal in mute V
I
= 1 V (max.);
position f = 20 Hz to
15 kHz V
O
−−2mV
D.C. output offset
voltage |V
5-9
| −−100 mV
Stand-by condition
V
sb
0 2V
D.C. current in
stand-by condition I
sb
−−100 µA
Switch-on current I
sw
12 40 µA
Page 7
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
A.C. CHARACTERISTICS
V
P
= 14,4 V; RL = 4 ; f = 1 kHz; T
amb
= 25 °C; unless otherwise specified
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Stereo application
note 1
Output power note 4;
THD = 0,5% P
o
45−W
THD = 10% P
o
5,5 6,0 W notes 4 and 5; THD = 10% P
o
67−W
Output power at note 4;
R
L
= 2 THD = 0,5% P
o
7.5 8,5 W
THD = 10% P
o
10 11 W notes 4 and 5; THD = 10% P
o
10,5 12,0 W
Low frequency roll-off note 6;
3 dB f
L
45 Hz
High frequency roll-off 1 dB f
H
20 −−kHz
Closed loop voltage gain G
v
19 20 21 dB
Supply voltage ripple
rejection: note 7 ON RR 48 −−dB mute RR 48 −−dB stand-by RR 80 −−dB
Input impedance |Z
I
|506075k
Noise output voltage: note 8;
ON R
S
= 0 V
no(rms)
50 −µV
ON R
S
= 10 k V
no(rms)
70 100 µV
mute note 9 V
no(rms)
50 −µV
Channel separation R
S
= 10 kΩα 40 −−dB
Channel balance G
v
−−1dB
Page 8
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
Notes to the characteristics
1. All characteristics, for stereo application are measured using the circuit shown in Fig.3.
2. The circuit is d.c. adjusted at VP = 6 V to 18 V and a.c. operating at VP = 8,5 to 18 V.
3. At 18 V < VP < 30 V the d.c. output voltage VP/2.
4. Output power is measured directly at the output pins of the IC.
5. With bootstrap and a 100 k resistor from pin 12 to the positive supply voltage (VP), value of bootstrap capacitor is 47 µF.
6. Frequency response externally fixed.
7. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V) and a frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
9. Noise output voltage independent of RS (VI = 0 V).
10. All characteristics, for BTL application are measured using the circuit shown in Fig.4.
BTL application note 10 Output power THD = 0,5% P
o
15,5 17,0 W
THD = 10% P
o
20 22 W
note 5; THD = 10% P
o
21 24 W
Output power at V
P
= 13,2 V THD = 0,5% P
o
13,5 W
THD = 10% P
o
17 W
note 5; THD = 10% P
o
19 W
Power bandwidth THD = 0,5%
P
o
= 15 W B
w
20 to Hz 15 000
Low frequency roll-off note 6;
3 dB f
L
25 Hz
High frequency roll-off 1 dB f
H
20 −−kHz
Closed loop voltage gain G
v
25 26 27 dB
Supply voltage ripple
rejection: note 7 ON RR 48 −−dB mute RR 48 −−dB stand-by RR 80 −−dB
Input impedance |Z
I
|253038k
Noise output voltage note 8;
ON R
S
= 0 V
no(rms)
70 −µV
ON R
S
= 10 k V
no(rms)
100 200 µV
mute note 9 V
no(rms)
60 −µV
PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT
Page 9
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
APPLICATION INFORMATION
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram (without bootstrapping).
Page 10
July 1994 10
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
PACKAGE OUTLINE
UNIT A e
1
A2bpcD
(1)
E
(1)
Z
(1)
deD
h
LL3m
REFERENCES
OUTLINE VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
17.0
15.5
4.6
4.2
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10 3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0 5 10 mm
scale
Qj
0.25w0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w M
b
p
1
d
D
Z
e
2
e
e
x
h
113
j
E
h
non-concave
view B: mounting base side
92-11-17 95-03-11
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v M
B
Page 11
July 1994 11
Philips Semiconductors Product specification
24 W BTL or 2 x 12 watt stereo car radio power amplifier
TDA1516BQ
SOLDERING Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Loading...