Datasheet TDA1386T Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA1386T

Noise shaping filter DAC

Product specification
Supersedes data of 1995 Dec 11
File under Integrated Circuits, IC01

1998 Jan 06

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

FEATURES
General

• Double-speed mode

• Digital volume control

• Soft mute function

• 12 dB attenuation

• Low power dissipation

• Digital de-emphasis

Easy application

• Voltage output

• Only 1st-order analog post-filtering required

• Operational amplifiers and digital filter integrated

• 256fs system clock (f

• I2S-bus or 16, 18 or 20 bits LSB fixed serial input format

• Single rail supply.

High performance

• Superior signal-to-noise ratio

• Wide dynamic range

• No zero crossing distortion

• Inherently monotonic

• Continuous calibration digital-to-analog conversion

combined with noise shaping technique.

.

)

sys

GENERAL DESCRIPTION

The TDA1386T is a dual CMOS digital-to-analog converter
with up-sampling filter and noise shaper. The combination
of oversampling up to 4f
calibration conversion ensures that only simple 1st order
analog post filtering is required.

The TDA1386T supports the I2S-bus data input mode with
word lengths of up to 20 bits and the LSB fixed serial data
input format with word lengths of 16, 18 or 20 bits.
Two cascaded IIR filters increase the sampling rate
4 times.

The DACs are of the continuous calibration type and
incorporate a special data coding. This ensures a high
signal-to-noise ratio, wide dynamic range and immunity to
process variation and component ageing.

Two on-board operational amplifiers convert the
digital-to-analog current to an output voltage.

, noise shaping and continuous

s

ORDERING INFORMATION

TYPE NUMBER

NAME DESCRIPTION VERSION

TDA1386T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

1998 Jan 06 2

PACKAGE

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

QUICK REFERENCE DATA

All power supply pins V

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V
V
V

DDD
DDA
DDO

digital supply voltage 4.5 5.0 5.5 V
analog supply voltage 4.5 5.0 5.5 V
operational amplifier supply

voltage

I

DDD

I

DDA

I

DDO

digital supply current V

analog supply current V

operational amplifier supply
current

Analog signals

V

FS(rms)

full-scale output voltage
(RMS value)

R

L

output load resistance 5 −−kΩ

DAC performance

(THD + N)/S total harmonic distortion

plus noise-to-signal ratio

S/N signal-to-noise ratio no signal; A-weighted −−108 −96 dB
BR input bit rate at data input f

f

sys

T

amb

clock frequency 6.4 − 18.432 MHz
operating ambient

temperature

and GND must be connected to the same external supply unit.

DD

4.5 5.0 5.5 V

DDD

=5 V;

− 58mA

at code 00000H

DDA

=5 V;

− 35mA

at code 00000H
V

DDO

=5 V;

− 24mA

at code 00000H

V

DDD=VDDA=VDDO

=5V;

0.935 1.1 1.265 V

ROL>5kΩ

at 0 dB signal level;
fi= 1 kHz

at −60 dB signal level;
fi= 1 kHz

= 44.1 kHz; normal speed −−2.822 bits

s

f

= 44.1 kHz; double speed −−5.645 bits

s

−−70 − dB

− 0.032 − %

−−42 −32 dB

− 0.8 2.5 %

−40 − +85 °C

1998 Jan 06 3

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

BLOCK DIAGRAM

Fig.1 Block diagram.

1998 Jan 06 4

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

PINNING

SYMBOL PIN DESCRIPTION

V

DDA

AGND 2 analog ground
TEST1 3 test input 1; pin should be

BCK 4 bit clock input
WS 5 word select input
DATA 6 data input
CKSL1 7 format selection 1
CKSL2 8 format selection 2
DGND 9 digital ground
V

DDD

TEST2 11 test input 2; pin should be

SYSCLK 12 system clock 256f
APP3 13 application mode 3 input
APPL 14 application mode selection input
APP2 15 application mode 2 input
APP1 16 application mode 1 input
APP0 17 application mode 0 input
VOL 18 left channel output
FILTCL 19 capacitor for left channel 1st-order

FIL TCR 20 capacitor for right channel 1st-order

VOR 21 right channel output
V

ref

OGND 23 operational amplifier ground
V

DDO

1 analog supply voltage

connected to DGND

10 digital supply voltage

connected to DGND

s

filter function, should be connected
between pins 19 and 18

filter function, should be connected
between pins 20 and 21

22 internal reference voltage for output

channels (0.5V

DDO

typ.)

24 operational amplifier supply voltage

Fig.2 Pin configuration.

1998 Jan 06 5

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

FUNCTIONAL DESCRIPTION

The TDA1386T CMOS DAC incorporates an up-sampling
filter, a noise shaper, continuous calibrated current
sources and operational amplifiers.

System clock and data input format

The TDA1386T accommodates slave mode only
consequently, in all applications, the system devices must
provide the 256f

system clock.

s

Table 1 Data input format and system clock

CKSL1 CKSL2 DATA INPUT FORMAT

2

00I

S-bus 256f
0 1 LSB fixed 16 bits 256f
1 0 LSB fixed 18 bits 256f
1 1 LSB fixed 20 bits 256f

Device operation

When the APPL pin is held HIGH and APP3 is held LOW,
pins APP0, APP1 and APP2 form a microcontroller
interface. When the APPL pin is held LOW, pins APP0,
APP1, APP2 and APP3 form pseudo-static application
pins (TDA1305T pin compatible).

The TDA1386T supports the following data input modes:

2

• I

S-bus with data word length of up to 20 bits.

• LSB fixed serial format with data word length of 16, 18
or 20 bits. As this format idles on the MSB it is necessary
to know how many bits are being transmitted.

The data input formats are illustrated in Fig.7. Left and
right data-channel words are time multiplexed.

SYSTEM CLOCK

NORMAL SPEED DOUBLE SPEED

s
s
s
s

128f
128f
128f
128f

s
s
s
s

In the pseudo-static application mode the TDA1386T is pin
compatible with the TDA1305T slave mode. The
correspondence between TDA1386T pin number,
TDA1386T pin name, TDA1305T pin name and a
description of the effects is given in Table 2.

P

SEUDO-STATIC APPLICATION MODE (APPL = LOGIC 0)

In this mode, the device operation is controlled by
pseudo-static application pins (APP0: attenuation mode
control; APP1: double-speed mode control; APP2: mute
mode control and APP3: de-emphasis mode control).

Table 2 Pseudo-static application mode

PIN NAME PIN NUMBER

TDA1305T

FUNCTION

LOGIC

VALUE

DESCRIPTION

APP0 17 ATSB 0 12 dB attenuation (from full scale) activated

(only if MUSB = 1)

1 full scale (only if MUSB = 1)

APP1 16 DSMB 0 double-speed mode

1 normal-speed mode

APP2 15 MUSB 0 samples decrease to mute level

1 level in accordance with ATSB

APP3 13 DEEM1 0 de-emphasis OFF (44.1 kHz)

1 de-emphasis ON (44.1 kHz)

1998 Jan 06 6

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

MICROCONTROLLER APPLICATION MODE
(APPL = LOGIC 1, APP3 = LOGIC 0)

In this mode, the device operation is controlled by a set of
flags in an 8-bit mode control register. The 8-bit mode
control register is written by a microprocessor interface
(pin APPL = 1, APP0 = Data, APP1 = Clock, APP2 = RAB
and APP3 = 0).

The correspondence between serial to parallel conversion,
mode control flags and a summary of the effect of the
control flags is given in Table 3. Figures 3 and 4 illustrate
the mode set timing.

M

ICROCONTROLLER WRITE OPERATION SEQUENCE

• APP2 is held LOW by the microcontroller.

• Microprocessor data is clocked into the internal shift

register on the LOW-to-HIGH transition at pin APP1.

• Data D(7 to 0) is latched into the appropriate control
register on the LOW-to-HIGH transition of pin APP2
(with APP1 HIGH).

• If more data is clocked into the TDA1386T before the
LOW-to-HIGH transition on pin APP2 then only the last
8 bits are used.

• If less data is clocked into the TDA1386T unpredictable
operation will result.

• If the LOW-to-HIGH transition of pin APP2 occurs with
APP1 LOW, the command will be disregarded.

Fig.3 Microcontroller timing.

1998 Jan 06 7

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

MICROCONTROLLER WRITE OPERATION SEQUENCE;

REPEAT MODE

The same command can be repeated several times
(e.g. for fade function) by applying APP2 pulses as shown
in Fig.4.

It should be noted that APP1 must stay HIGH between
APP2 pulses. A minimum pause of 22 µs is necessary
between any two step-up or step-down commands.

Fig.4 Microcontroller timing; repeat mode.

Table 3 Microcontroller mode control register

BIT POSITION FUNCTION DESCRIPTION ACTIVE LEVEL

D7 ATSB 12 dB attenuation (from full scale) LOW
D6 DSMB double speed LOW
D5 MUSB mute LOW
D4 DEEM de-emphasis HIGH
D3 FS full scale HIGH
D2 INCR increment HIGH
D1 DECR decrement HIGH
D0 − reserved −

1998 Jan 06 8

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

Volume control

A digital level control is incorporated on the TDA1386T
which performs the function of soft mute and attenuation
(pseudo-static application mode) or soft mute, attenuation,
fade, increment and decrement (microcontroller
application mode). The volume control of both channels
can be varied in small step changes, determined by the
value of the internal fade counter according to:

Audio level = counter × maximum level/120.
Where the counter is a 7-bit binary number between

0 and 120. The time taken for mute to vary from 120 to 0
is 120/f
is approximately 3 ms.

. For example, when fs= 44.1 kHz, the time taken

s

V

OLUME CONTROL IN PSEUDO-STATIC APPLICATION MODE

In the pseudo-static application mode (APPL = logic 0) the
digital audio output level is controlled by APP0
(attenuation) and APP2 (mute) so only the final volume
levels full scale, 12 dB (attenuate) and mute (−infin dB)
can be selected. The mute function has priority over the
attenuation function. Accordingly, if MUSB is LOW, the
state of ATSB has no effect. An example of volume control
in this application mode is illustrated in Fig.5.

Fig.5 Volume control; pseudo-static application mode.

1998 Jan 06 9

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

VOLUME CONTROL IN MICROCONTROLLER APPLICATION MODE
In the microcontroller application mode (APPL = logic 1,

APP3 = logic 0) the audio output level is controlled by
volume control bits ATSB, MUSB, FS, INCR and DECR.

Mute is activated by sending the MUSB command to the
mode control register via the microcontroller interface. The
audio output level will be reduced to zero in a maximum
120 steps (depending on the current position of the fade
counter) and taking a maximum of 3 ms. Mute, attenuation
and full scale are synchronized to prevent operation in the
middle of a word.

• The counter is preset to 120 by the full scale command.

• The counter is preset to 30 by the attenuate command

when its value is more then 30. If the value of the
counter is less than 30 dB the ATSB command has no
effect.

• The counter is preset to 0 by the mute command MUSB.

• Attenuation (−12 dB) is activated by sending the ATSB

command to the fade control register (D7).

• Attenuation and mute are cancelled by sending the full
scale command to the fade control register (D3).

To control the fade counter in a continuous way, the
INCREMENT and DECREMENT commands are available
(fade control registers D1 and D2). They will increment and
decrement the counter by 1 for each register write
operation. When issuing more than 1 step-up or
step-down command in sequence, the write repeat mode
may be used (see microprocessor application mode). An
example of volume control in this application mode is
illustrated in Fig.6.

(1) INCR and DECR in repeat mode.

Fig.6 Volume control; microcontroller application mode.

1998 Jan 06 10

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

There are two recommended application situations within
the microcontroller mode:

• The customer wants to use the microcontroller interface
without the volume setting facility. In this event the
operation is as follows:

– Mute ON; by sending the MUSB command
– Mute OFF; by sending the FS command
– Attenuation ON; by sending the ATSB command
– Attenuation OFF; by sending the FS command.
It is possible to switch from ‘Attenuation ON’ to

‘Mute ON’ but not vice-versa.

• Incorporating the volume control feature operates as
follows:

– Mute ON; by sending the MUSB command the

microcontroller has to store the previous volume
setting.

– Mute OFF; by sending succeeding INCR commands

until the previous volume is reached.

– Attenuation ON; by sending succeeding DECR

commands until a relative downstep of −12 dB is
reached. The microcontroller has to store the
previous volume.

– Attenuation OFF; by sending the succeeding INCR

commands until the previous volume is reached.

– Volume UP; by sending successive INCR

commands.

– Volume DOWN; by sending successive DECR

commands.

Double-speed mode

The double-speed mode is controlled by the DSMB bit at
register D6 (microcontroller application mode) or by
activating the APP1 pin (pseudo static application mode).
When the control bit is active LOW the device operates in
the double-speed mode.

Oversampling filter and noise shaper

The digital filter is a four times oversampling filter. It
consists of two sections which each increase the sample
rate by 2. The noise-shaper operates on 4f

and reduces

s

the in-band noise density.

DAC and operational amplifiers

In this noise shaping DAC a special data code and
bidirectional current sources are used in order to achieve
true low-noise performance. The special data code
guarantees that only small values of current flow to the
output during small signal passages while larger positive
or negative values are generated using the bidirectional
current sources. The noise shaping DAC uses the
continuous calibration conversion technique. The DAC
currents are repeatedly generated from one single
reference current.

The operational amplifiers and the internal conversion
resistors R

CONV1

and R

convert the DAC current to

CONV2

an output voltage available at VOL and VOR. Connecting
an external capacitor between FILTCL and VOL, FILTCR
and VOR respectively provides the required first-order
post filtering.

De-emphasis

A digital de-emphasis is implemented in the TDA1386T.
By selecting the DEEM bit at register D4 (microcontroller
application mode) or activating the APP0 pin
(pseudo-static application mode), de-emphasis can be
applied by means of an IIR filter. De-emphasis is
synchronized to prevent operation in the middle of a word.

1998 Jan 06 11

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX UNIT

V

DDD

V

DDA

V

DDO

T

xtal

T

stg

T

amb

V

es

Notes

1. All V

and GND connections must be made to the same power supply.

DD

2. Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ series resistor.

3. Equivalent to discharging a 200 pF capacitor via a 2.5 µH series inductor.

digital supply voltage note 1 − 7.0 V
analog supply voltage note 1 − 7.0 V
operational amplifiers supply voltage note 1 − 7.0 V
maximum crystal temperature − +150 °C
storage temperature −65 +125 °C
operating ambient temperature −40 +85 °C
electrostatic handling note 2 −2000 +2000 V

note 3 −200 +200 V

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air 69 K/W

QUALITY SPECIFICATION

In accordance with

“UZW-BO/FQ-0601”

.

1998 Jan 06 12

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

DC CHARACTERISTICS

V

DDD=VDDA=VDDO

specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT

V
V
V

DDD
DDA
DDO

digital supply voltage (pin 10) note 1 4.5 5.0 5.5 V
analog supply voltage (pin 1) note 1 4.5 5.0 5.5 V
operational amplifier supply

voltage (pin 24)

I

DDD

I

DDA

I

DDO

digital supply current f
analog supply current at digital silence − 36mA
operational amplifier supply

current

P

tot

V

IH

total power dissipation f

HIGH level digital input voltage
(pins 3 to 8 and 11 to 17)

V

IL

LOW level digital input voltage
(pins 3 to 8 and 11 to 17)

R

pd

internal pull-down resistor to
V

I

 input leakage current −−10 µA

LI

C
V
R

I

ref

CONV

input capacitance −−10 pF
reference voltage (pin 22) with respect to OGND 0.45V
current-to-voltage conversion

resistor

V

FS(rms)

full scale output voltage
(RMS value)

R

L

output load resistance 5 −−kΩ

=5V; T

(pins 3 and 11)

SSD

=5°C; all voltages referenced to ground (pins 2, 9 and 23); unless otherwise

amb

note 1 4.5 5.0 5.5 V

= 11.28 MHz − 58mA

sys

no operational

− 24mA

amplifier load resistor

= 11.28 MHz;

sys

− 50 90 mW
digital silence;
no operational
amplifier load resistor

0.7V

DDD

− V

DDD

−0.5 − 0.3V

17 − 134 kΩ

DDO

0.5V

DDO

0.55V

2.4 3.0 3.6 kΩ

RL>5kΩ; note 2 0.935 1.1 1.265 V

+ 0.5 V

DDD

DDO

V

V

Notes

1. All power supply pins (VDD and GND) must be connected to the same external power supply unit.

2. RL is the AC impedance of the external circuitry connected to the audio outputs of the application circuit.

1998 Jan 06 13

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

AC CHARACTERISTICS (ANALOG)

V

DDD=VDDA=VDDO

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT

DACs

SVRR supply voltage ripple rejection

∆V

o(DAC)

α

DAC

(THD + N)/S total harmonic distortion plus

S/N signal-to-noise ratio f

=5V; T

=25°C; all voltages referenced to ground (pins 2, 9 and 23);

amb

pins 9 and 16

unbalance between the 2 DAC
voltage outputs (pins 18 and 21)

crosstalk between the 2 DAC
voltage outputs (pins 18 and 21)

noise as a function of signal

f

ripple

V

ripple(p-p)

= 1 kHz;

= 100 mV;

− 40 − dB

C22 = 10 µF
maximum volume −−0.5 dB

one output digital silence

−−110 −85 dB

the other maximum volume
at 0 dB signal; f

= 1 kHz −−70 − dB

i

− 0.032 − %

at −60 dB signal; f

= 1 kHz −−42 −32 dB

i

− 0.8 2.5 %

= 20 Hz to 17 kHz;

i

−−108 −96 dB

A-weighted; no signal

Operational amplifiers

G

v

open-loop voltage gain − 85 − dB

PSRR power supply rejection ratio f

(THD + N)/S total harmonic distortion plus

noise as a function of signal

f

ug

Z

o

unity gain frequency open loop − 4.5 − MHz
AC output impedance RL>5kΩ−1.5 150 Ω

= 3 kHz;

ripple

V

ripple(p-p)

= 100 mV;

A-weighted
R

>5kΩ;

L

Vo= 2.8 V (p-p);
fi= 1 kHz

− 90 − dB

−−100 − dB

1998 Jan 06 14

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

AC CHARACTERISTICS (DIGITAL)

V

DDD=VDDA=VDDO

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX UNIT

t

W

t

CWL

t

CWH

clock cycle f

f

sys

f

sys

Serial input data timing (see Fig.8)
f

s

word selection input audio sample
frequency

f

BCK

t

r

t

f

t

HB

t

LB

t

SU;DAT

t

HD;DAT

t

SU;WS

t

HD;WS

clock input frequency (data input rate) f

rise time −−20 ns
fall time −−20 ns
bit clock HIGH time 55 −−ns
bit clock LOW time 55 −−ns
data set-up time 20 −−ns
data hold time 10 −−ns
word select set-up time 20 −−ns

word select hold time 10 −−ns
Microcontroller interface timing (see Fig.9)
t

L

t

H

t

SU;DC

t

HD;CD

t

SU;CR

input LOW time 2 −−µs

Input HIGH time 2 −−µs

set-up time DATA to CLOCK 1 −−µs

hold time CLOCK to DATA 1 −−µs

set-up time CLOCK to RAB 1 −−µs

= 4.5 to 5.5 V; T

= −40 to +85 °C; all voltages referenced to ground (pins 2, 9 and 23);

amb

= 256fs; normal speed 81.3 88.6 156 ns

sys

f

= 128fs; double speed 81.3 88.6 156 ns

sys

LOW level pulse width 22 −−ns
HIGH level pulse width 22 −−ns

normal speed 25 44.1 48 kHz
double speed 50 88.2 96 kHz

= 256fs; normal speed −−64f

sys

f

= 128fs; double speed;

sys

−−48f

kHz

s

kHz

s

note 1

Note

1. A clock frequency of up to 96fs is possible in the event that a rising edge of BCK occurs while SYSCLK is LOW.

1998 Jan 06 15

This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in

_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in

white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...

1998 Jan 06 16

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

Fig.7 Data input formats.

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

Fig.8 Timing of input signals.

Fig.9 Microcontroller timing.

1998 Jan 06 17

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

TEST AND APPLICATION INFORMATION
Filter characteristics
Table 4 Digital filter specification, f

BAND ATTENUATION

0 to 19 kHz <0.001 dB

19 to 20 kHz <0.03 dB

24 kHz >25 dB
25 to 35 kHz >40 dB
35 to 64 kHz >50 dB
64 to 68 kHz >31 dB

68 kHz >35 dB
69 to 88 kHz >40 dB

Table 5 Digital filter phase distortion, f

BAND PHASE DISTORTION

0 to 16 kHz <±1 deg

= 44.1 kHz

s

= 44.1 kHz

s

1998 Jan 06 18

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

PACKAGE OUTLINE

SO24: plastic small outline package; 24 leads; body width 7.5 mm

D

c

y

Z

24

pin 1 index

1

e

13

12

w M

b

p

SOT137-1

E

H

E

Q

A

2

A

1

L

p

L

detail X

(A )

A

X

v M

A

A

3

θ

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

OUTLINE
VERSION

SOT137-1

A

max.

2.65

0.10

A1A2A

0.30

2.45

0.10

2.25

0.012

0.096

0.004

0.089

IEC JEDEC EIAJ

075E05 MS-013AD

0.25

0.01

b

3

p

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

cD

15.6

7.6

7.4

0.30

0.29

1.27

0.050

15.2

0.61

0.60

REFERENCES

1998 Jan 06 19

eHELLpQ

10.65

10.00

0.419

0.394

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

0.01

EUROPEAN

ywv θ

Z

0.9

0.4

8

0.004

ISSUE DATE

0.035

0.016

95-01-24
97-05-22

0

o
o

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1998 Jan 06 20

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Jan 06 21

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

NOTES

1998 Jan 06 22

Philips Semiconductors Product specification

Noise shaping filter DAC TDA1386T

NOTES

1998 Jan 06 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: seeAustria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA57
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547027/1200/03/pp24 Date of release: 1998 Jan 06 Document order number: 9397 750 03169