Datasheet TDA1029 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA1029

Signal-sources switch

Product specification
File under Integrated Circuits, IC01

January 1980

Philips Semiconductors Product specification

Signal-sources switch TDA1029

The TDA1029 is a dual operational amplifier (connected as an impedance converter) each amplifier having 4 mutually
switchable inputs which are protected by clamping diodes. The input currents are independent of switch position and the
outputs are short-circuit protected.

The device is intended as an electronic two-channel signal-source switch in a.f. amplifiers.

QUICK REFERENCE DATA

Supply voltage range (pin 14) V
Operating ambient temperature T
Supply voltage (pin 14) V
Current consumption I
Maximum input signal handling (r.m.s. value) V
Voltage gain G
Total harmonic distortion d

P
amb
P

14

i(rms)

v

tot

typ. 20 V
typ. 3,5 mA
typ. 6 V
typ. 1
typ. 0,01 %

6 to 23 V

−30 to + 80 °C

Crosstalk α typ. 70 dB
Signal-to-noise ratio S/N typ. 120 dB

PACKAGE OUTLINE

16-lead DIL; plastic (SOT38); SOT38-1; 1996 July 18.

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.1 Block diagram.

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 14) V

Input voltage (pins 1 to 8) V

Switch control voltage (pins 11, 12 and 13) V
Input current ±I
Switch control current −I
Total power dissipation P
Storage temperature T
Operating ambient temperature T

CHARACTERISTICS

= 20 V; T

V

P

= 25 °C; unless otherwise specified

amb

Current consumption

without load; I

= I15 = 0 2 to 5 mA

9

Supply voltage range (pin 14) V

−V

I

14

P
I

I

S

I

S
tot
stg
amb

P

max. 23 V
max. V

P

max. 0,5 V

0 to 23 V
max. 20 mA
max. 50 mA
max. 800 mW

−55 to + 150 °C

−30 to + 80 °C

typ. 3,5 mA

6 to 23 V

Signal inputs

Input offset voltage

of switched-on inputs
R

≤ 1 kΩ < 10 mV

S

Input offset current

of switched-on inputs < 200 nA

V

io

I

io

typ. 2 mV

typ. 20 nA

Input offset current

of a switched-on input with respect to a
non-switched-on input of a channel < 200 nA

Input bias current

independent of switch position < 950 nA

I

io

I

i

typ. 20 nA

typ. 250 nA

Capacitance between adjacent inputs C typ. 0,5 pF
D.C. input voltage range V
Supply voltage rejection ratio; R

≤ 10 kΩ SVRR typ. 100 µV/V

S

I

3 to 19 V

Equivalent input noise voltage

R

= 0; f = 20 Hz to 20 kHz (r.m.s. value) V

S

n(rms)

typ. 3,5 µV

Equivalent input noise current

f = 20 Hz to 20 kHz (r.m.s. value) I

n(rms)

typ. 0,05 nA

Crosstalk between a switched-on input

and a non-switched-on input;
measured at the output at R

= 1 kΩ; f = 1 kHz α typ. 100 dB

S

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

Signal amplifier

Voltage gain of a switched-on input

= I15 = 0; RL = ∞ G

at I

9

Current gain of a switched-on amplifier G

Signal outputs

v
i

typ. 1
typ. 10

5

Output resistance (pins 9 and 15) R
Output current capability at V

= 6 to 23 V ±I9; ±I

P

o

15

typ. 400 Ω
typ. 5 mA

Frequency limit of the output voltage

V

= 1 V; RS = 1 kΩ; RL = 10 MΩ; CL = 10 pF f typ. 1,3 MHz

i(p-p)

Slew rate (unity gain); ∆V

R

= 10 MΩ; CL = 10 pF S typ. 2 V/µs

L

9-16

/∆t; ∆V

15-16

/∆t

Bias voltage

D.C. output voltage

Output resistance R

V

10-16

10-16

typ. 11 V

10,2 to 11,8 V

typ. 8,2 kΩ

Switch control

switched-on interconnected control voltages

inputs pins V

11-16

V

12-16

I-1, II-1 1-15, 5-9 H H H
I-2, II-2 2-15, 6-9 H H L
I-3, II-3 3-15, 7-9 H L H
I-4, II-4 4-15, 8-9 L H H
I-4, II-4 4-15, 8-9 L L H
I-4, II-4 4-15, 8-9 L H L
I-4, II-4 4-15, 8-9 L L L
I-3, II-3 3-15, 7-9 H L L

V

(1)

13-16

In the case of offset control, an internal blocking circuit of the switch control ensures that not more than one input will be
switched on at a time. In that case safe switching-through is obtained at V

≤ 1,5 V.

SL

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

Control inputs (pins 11, 12 and 13)

Required voltage

HIGH V

SH

> 3,3 V

LOW VSL < 2,1 V

Input current

HIGH (leakage current) I
LOW (control current) −I

SH

SL

<1µA
< 250 µA

Notes

1. V

2. Or control inputs open (R

is typically 0,5 ⋅ V

10-16

+ 1,5 ⋅ VBE.

14-16

11,12,13−16

> 33 MΩ).

APPLICATION INFORMATION

= 20 V; T

V

P

C

= 100 pF (unless otherwise specified)

L

Voltage gain G
Output voltage variation when switching

the inputs < 100 mV

= 25 °C; measured in Fig.1; RS= 47 kΩ; Ci= 0,1 µF; R

amb

= 470 kΩ; RL= 47 kΩ;

bias

v

; ∆V

∆V

9−16

15−16

typ. −1,5 dB
typ. 10 mV

Total harmonic distortion

over most of signal range (see Fig.4) d
V

= 5 V; f = 1 kHz d

i

V

= 5 V; f = 20 Hz to 20 kHz d

i

tot
tot
tot

typ. 0,01 %
typ. 0,02 %
typ. 0,03 %

Output signal handling

= 0,1%; f = 1 kHz (r.m.s. value) V

d

tot

o(rms)

> 5,0 V
typ. 5,3 V

Noise output voltage (unweighted)

f = 20 Hz to 20 kHz (r.m.s. value) V

n(rms)

typ. 5 µV

Noise output voltage (weighted)

f = 20 Hz to 20 kHz (in accordance with DIN 45405) V

n

typ. 12 µV

Amplitude response

Vi = 5 V; f = 20 Hz to 20 kHz; Ci = 0,22 µF ∆V

9-16;∆V15-16

< 0,1 dB

Crosswalk between a switched-on input

and a non-switched-on input;
measured at the output at f = 1 kHz α typ. 75 dB

Crosswalk between switched-on inputs

and the outputs of the other channels α typ. 90 dB

(2)

(1)

(2)

(2)

Notes

1. The lower cut-off frequency depends on values of R

bias

and Ci.

2. Depends on external circuitry and RS. The value will be fixed mostly by capacitive crosstalk of the external
components.

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.2 Equivalent input noise current.

Fig.3 Equivalent input noise voltage.

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.4 Total harmonic distortion as a function of r.m.s output voltage.  f = 1 kHz;  -  - f = 20 kHz.

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.5 Output voltage as a function of supply voltage.

Fig.6 Noise output voltage as a function of input resistance; GV = 1; f = 20 Hz to 20 kHz.

 Vn (output); − − − Vn (RS).

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Philips Semiconductors Product specification

Signal-sources switch TDA1029

APPLICATION NOTES
Input protection circuit and indication

Fig.7 Circuit diagram showing input protection and indication.

Unused signal inputs

Any unused inputs must be connected to a d.c. (bias) voltage, which is within the d.c. input voltage range; e.g. unused
inputs can be connected directly to pin 10.

Circuits with standby operation

The control inputs (pins 11, 12 and 13) are high-ohmic at V
(pin 14) is switched off.

January 1980 10

≤ 20 V (ISH≤ 1 µA), as well as, when the supply voltage

SH

Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.8 TDA1029 connected as a four input stereo source selector.

January 1980 11

Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.9 TDA1029 and TDA1028 connected as a five input stereo source selector with monitoring facilities.

January 1980 12

Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.10 TDA1029 connected as a third-order active high-pass filter with Butterworth response and component

values chosen according to the method proposed by Fjällbrant. It is a four-function circuit which can select
mute, rumble filter, subsonic filter and linear response.

Switch control

function V

11-16

V

12-16

V

linear H H H
subsonic filter ‘on’ H H L
rumble filter ‘on’ H L X
mute ‘on’ L X X

January 1980 13

13-16

Philips Semiconductors Product specification

Signal-sources switch TDA1029

Fig.11 Frequency response curves for the circuit of Fig.10.

January 1980 14

Philips Semiconductors Product specification

Signal-sources switch TDA1029

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

pin 1 index

e

b

b

1

9

A

1

w M

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

E

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

(1) (1)

D

21.8

21.4

0.86

0.84

January 1980 15

8

6.48

6.20

0.26

0.24

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

H

9.5

0.2542.54 7.62

8.3

0.37

0.010.100.0200.19

0.33

ISSUE DATE

w

92-10-02
95-01-19

Z

max.

2.2

0.087

(1)

Philips Semiconductors Product specification

Signal-sources switch TDA1029

SOLDERING
Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.

(order code 9398 652 90011).

). If the printed-circuit board has been pre-heated, forced cooling may

stg max

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

January 1980 16