Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA1016
Recording/playback and
2 W audio power amplifier
Product specification
File under Integrated Circuits, IC01
August 1987
Page 2
Philips Semiconductors Product specification
Recording/playback and
TDA1016
2 W audio power amplifier
GENERAL DESCRIPTION
The TDA1016 is a monolithic integrated audio power amplifier, preamplifier and A.L.C. circuit designed for applications
in radio-recorders and recorders. The wide supply voltage range makes this circuit very suitable for d.c. and a.c.
apparatus. The circuit incorporates the following features:
Features
• Power amplifier/monitor amplifier
• Preamplifier/record and playback amplifier
• Automatic Level Control (A.L.C.) circuit
• Voltage stabilizer
• Short-circuit (up to 12 V a.c.) and thermal protection.
QUICK REFERENCE DATA
Supply voltage range V
Supply current; total quiescent at V
= 6 V I
P
Operating ambient temperature range T
Power amplifier
Output power at d
= 6 V; RL = 4 Ω P
V
P
= 9 V; RL = 4 Ω P
V
P
tot
= 10%
Closed loop gain G
Preamplifier
Open loop gain G
Minimum closed loop voltage gain G
Output voltage at d
= 1% V
tot
Automatic Level Control (A.L.C.)
Gain variation for ∆V
= 40 dB ∆G
i
Stabilized supply voltage
Output voltage V
P
tot
amb
o
o
c
o
c min
o
5-16
typ. 10 mA
typ. 1 W
typ. 2 W
typ. 36 dB
min. 70 dB
min. 35 dB
min. 1 V
v
typ. 2 dB
typ. 2,6 V
3,6 to 15 V
−25 to 150 °C
PACKAGE OUTLINE
16-lead DIL; plastic, with internal heat spreader (SOT38); SOT38-1; 1996 July 23.
August 1987 2
Page 3
Philips Semiconductors Product specification
Recording/playback and
2 W audio power amplifier
TDA1016
Fig.1 Block diagram with external components; also used as test circuit.
August 1987 3
Page 4
Philips Semiconductors Product specification
Recording/playback and
2 W audio power amplifier
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 3) V
Repetitive peak output current I
Non-repetitive peak output current (pin 1) I
P
ORM
OSM
Total power dissipation see derating curve Fig.2
A.C. short-circuit duration of load during
sinewave drive; V
Crystal temperature T
Storage temperature range T
Operating ambient temperature range T
= 12 V t
P
sc
c
stg
amb
THERMAL RESISTANCE
The power derating curve (Fig.2) is based on the following data
From junction to ambient R
th j-a
max. 18 V
max. 1 A
max. 2 A
max. 100 hours
max. 150 °C
−55 to + 150 °C
−25 to + 150 °C
= 55 K/W
TDA1016
Fig.2 Power derating curve.
August 1987 4
Page 5
Philips Semiconductors Product specification
Recording/playback and
TDA1016
2 W audio power amplifier
CHARACTERISTICS
= 6 V; RL = 4 Ω; f = 1 kHz; T
V
P
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Supply (pin 3)
V
P
Supply voltage 3,6 6 15 V
Supply current; total quiescent
I
tot
Power amplifier
Output power at d
P
o
P
o
G
c
d
tot
| Input impedance 0,5 −−MΩ
|Z
i
Closed loop voltage gain − 36 − dB
Total harmonic distortion at Po = 0,5 W −−1%
RR Ripple rejection at f = 100 Hz (R
Noise output voltage (r.m.s. value)
V
n(rms)
Noise output voltage at 500 kHz
V
n
Preamplifier
G
o
G
c
Open loop voltage gain at f = 10 kHz 70 78 − dB
Closed loop voltage gain − 52 − dB
Minimum closed loop voltage gain
G
c min
V
o
Output voltage at d
Output voltage with A.L.C.
V
o
Total harmonic distortion with A.L.C.
d
tot
d
tot
Signal-to-noise ratio related to V
S/N R
| Input impedance 100 −−kΩ
|Z
i
Ripple rejection
RR at f = 100 Hz; R
| Output impedance; see note 2 −−50 Ω
|Z
o
= 25 °C; measured in test circuit Fig.1; unless otherwise specified
amb
at VP = 6 V − 10 − mA
= 10%; see note 1
tot
VP = 6 V − 1 − W
VP = 9 V − 2 − W
= 0 Ω)4050−dB
S
RS = 0 Ω; B = 60 Hz to 15 kHz − 90 200 µV
RS = 0 Ω; B = 5 kHz − 8 −µV
(when changing Rf)35−−dB
= 1% 1 −−V
tot
Vi = 2 mV 0,45 0,5 0,55 V
Vi = 2 mV −−1%
Vi = 360 mV −−3%
= 1,2 mV;
i
= 1 kΩ; B = 60 Hz to 15 kHz − 60 − dB
S
= 0 Ω 50 54 − dB
S
August 1987 5
Page 6
Philips Semiconductors Product specification
Recording/playback and
TDA1016
2 W audio power amplifier
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
Automatic Level Control (A.L.C.) (see Fig.3); see note 4
∆G
v
t
l
t
s
t
r
Voltage stabilizer
V
11-15
l
11
RR Ripple rejection at f = 100 Hz 40 −− dB
Notes
1. Measured with an ideal coupling capacitor connected to the speaker load.
2. lP (effective value) must not exceed 1 mA.
3. At ∆Vi = dB with respect to Vi = 1,2 mV.
4. The A.L.C. tracking in stereo has a typical spread of 1 dB if pins 6 of both ICs are connected to the same RC network.
5. Without a shunt resistor across A.L.C. With 1 MΩ or 2,2 MΩ across A.L.C. recovery time becomes 22 or 50 seconds.
Gain variation for ∆Vi = 45 dB − 23 dB
Limiting time; see note 3 −−50 ms
Level setting time; see note 3 −−50 ms
Recovery time; see notes 3 and 5 − 100 − s
Output voltage − 2,6 − V
Load current −−1,5 mA
August 1987 6
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Philips Semiconductors Product specification
Recording/playback and
2 W audio power amplifier
TDA1016
Fig.3 Typical A.L.C. curve with RS = 10 kΩ.
August 1987 7
Page 8
Philips Semiconductors Product specification
Recording/playback and
2 W audio power amplifier
PACKAGE OUTLINE
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
D
seating plane
L
Z
16
e
b
b
1
9
A
w M
TDA1016
SOT38-1
M
E
A
2
A
1
c
(e )
1
M
H
pin 1 index
1
0 5 10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
UNIT
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
A
max.
4.7 0.51 3.7
OUTLINE
VERSION
SOT38-1
min.
A
1 2
max.
0.15
IEC JEDEC EIAJ
050G09 MO-001AE
b
1.40
1.14
0.055
0.045
b
0.53
0.38
0.021
0.015
1
cEe M
0.32
0.23
0.013
0.009
REFERENCES
D
21.8
21.4
0.86
0.84
8
scale
(1) (1)
6.48
6.20
0.26
0.24
E
(1)
Z
e
0.30
1
0.15
0.13
M
L
3.9
3.4
E
8.25
7.80
0.32
0.31
EUROPEAN
PROJECTION
9.5
8.3
0.37
0.33
w
H
0.2542.54 7.62
0.010.100.0200.19
ISSUE DATE
92-10-02
95-01-19
max.
2.2
0.087
August 1987 8
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Philips Semiconductors Product specification
Recording/playback and
TDA1016
2 W audio power amplifier
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
August 1987 9
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