Datasheet STP90NF03L, STB90NF03L-1 Datasheet (SGS Thomson Microelectronics)

Page 1
STP90NF03L
STB90NF03L-1
N-CHANNEL 30V - 0.0056- 90A TO-220/I2PAK
LOW GATE CHARGE STripFET™ POWER MOSFET
TYPE V
STP90NF03L STB90NF03L-1
TYPICAL R
TYPICAL Q
OPTIMAL R
CONDUCTION LOSSES REDUCED
SWITCHING LOSSES REDUCED
g
DSS
30 V 30 V
(on) = 0.0056
=35nC@5V
(on) x QgTRADE-OFF
R
DS(on)
< 0.0065 < 0.0065
I
D
90 A 90 A
DESCRIPTION
This application specific Power Mosfet is the third generation of STMicroelectronics unique “Single Feature Size
™” strip-based process. The resulting
transistor shows the best trade-off between on-re­sistance and gate c harge. When used as high and low side in buck regulators, it gives the best perfor­mance in terms of both conduc ti on and switching losses. This is extremely important for mot her­boards where fast switching and high efficiency are of paramount importance.
APPLICATIONS
SPECIFICALLY DESIGNED AND OPTIMISED
FOR HIGH EFFICIENCY CPU CORE DC/DC CONVERTERS
TO-220
3
2
1
I2PAK
3
2
1
INTERNAL SCHEMATIC DIAGRAM
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP90NF03L P90NF03L TO-220 TUBE
STB90NF03L-1 B90NF03L
I
2
PAK
TUBE
1/9April 2003
Page 2
STP90NF03L/STB90NF03L-1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
V
DS
V
DGR
V
GS
I I
I
DM
P
TOT
T
stg
T
() Pulse width limited by safe operating area
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 1 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
30 V
30 V Gate- source Voltage ±20 V Drain Current (continuous) at TC=25°C
D
Drain Current (continuous) at TC=100°C
D
()
Drain Current (pulsed) 360 A Total Dissipation at TC= 25°C
90 A
65 A
150 W Derating Factor 0.73 W/°C Storage Temperature –65 to 175 °C Max. Operating Junction Temperature 175 °C
j
Maximum Lead Temperature For Soldering Purpose 300 °C
l
ELECTRICAL CHARACTERISTICS (T
= 25 °C UNLESS O THERWISE SPECIFIED)
CASE
ON /OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
2/9
(BR)DSS
I
DSS
I
GSS
I
D(on)
V
GS(th)
R
DS(on)
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
=0)
On State Drain Current VDS>I
Gate Threshold Voltage VDS=VGS,ID= 250 µA Static Drain-source On
Resistance
ID= 250 µA, VGS= 0 30 V
V
= Max Rating
=0)
DS
= Max Rating, TC= 125 °C
V
DS
V
= ±20V ±100 nA
GS
D(on)xRDS(on)max,
90 A
VGS= 10V
1
VGS= 10V, ID=45A
=5V,ID=45A
V
GS
0.0056
0.007
A
10 µA
2.5 V
0.0065
0.012
Page 3
STP90NF03L/STB90NF03L-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
D(on)xRDS(on)max,
ID=45A
V
C
C
C
Input Capacitance
iss
Output Capacitance 860 pF
oss
Reverse Transfer Capacitance 170 pF
rss
=25V,f=1MHz,VGS=0
DS
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
Turn-on Delay Time
t
r
g gs gd
Rise Time 200 ns Total Gate Charge VDD=24V,ID=90A,VGS=5V 35
Gate-Source Charge 10 nC Gate-Drain Charge 18 nC
=15V,ID=45A
DD
RG= 4.7VGS=4.5V (see test circuit, Figure 3)
40 S
2700 pF
30 ns
47
nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off-Delay Time
t
f
Fall Time
VDD=15V,ID=45A, R
=4.7Ω, VGS= 4.5 V
G
50
105
(see test circuit, Figure 3)
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 90 A
(2)
Source-drain Current (pulsed) 360 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
ISD=90A,VGS=0
= 90 A, di/dt = 100A/µs,
I
SD
V
=15V,Tj= 150°C
DD
(see test circuit, Figure 5)
80 90
2.5
1.3 V
ns ns
ns
nC
A
3/9
Page 4
STP90NF03L/STB90NF03L-1
Thermal Im pedenceSafe Operating Area
Output Characteristics Tr ansfer Characteristics
Transconductance Static Drain-source On Resistance
4/9
Page 5
STP90NF03L/STB90NF03L-1
Gate Charge vs Gate-so urc e V oltage Capacitance Variations
Normalized On Resistance vs TemperatureNormalized Gate Thereshold Voltage vs Temp.
Source-drain Diode Forward Characteristics
5/9
Page 6
STP90NF03L/STB90NF03L-1
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit F or
Resistive Load
Fig. 5: Test Circuit For Induc tive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Ci rcuit
6/9
Page 7
TO-220 MECHANICAL DATA
STP90NF03L/STB90NF03L-1
DIM.
A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154
L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
7/9
Page 8
STP90NF03L/STB90NF03L-1
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368 e 2.4 2.7 0.094 0.106 E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531 L1 3.48 3.78 0.137 0.149 L2 1.27 1.4 0.050 0.055
mm inch
C
8/9
A
A1
C2
B2
B
e
E
L1
L2
D
L
P011P5/E
Page 9
STP90NF03L/STB90NF03L-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inform ation nor for any in fring ement of p atents or o ther ri ghts of th ird p arties which may r esul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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