Datasheet FLC10-200B Datasheet (ST)

Page 1
®
Application Specific Discretes
A.S.D.™
FLC10-200H/B
FIRE LIGHTER CIRCUIT
FEATURES
Dedicated thyristor structure for capacitance
discharge ignition operation High pulse current capability
240A @ tp= 10µs Fast turn-on operation
Designed for high ambient temperature (up to
120°C)
BENEFITS
Space saving thanks to monolithic function
integration High reliability with planar technology
DESCRIPTION
The FLC10 series has been especially developed for high power capacitance discharge operation. The main applications are gas lighters or ignitors such as : cookers / gas boilers / gas hobs...
Based on ST’s ASD™ technology, it provides a fully integrated function, with high performance and reliability levels, adapted to severe and hot temperature environment.
TAB
2
3
1
DPAK
FLC10-200B
FUNCTIONAL DIAGRAM
pin 2 orTab
Z
TAB
FLC10-200H
IPAK
3
2
1
Th: Thyristor for switching operation. Z: Zener diode to set the threshold voltage. D: Diode for reverse conduction. R: 2kresistor.
October 2001 - Ed: 7E
Th
D
R
pin 1/3 (*)
(*) Pin1 and Pin3 must be shorted together in the application circuit layout.
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Page 2
FLC10-200H/B
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
I
TRM
Repetitive surge peak on state current for thyristor
-30°C T
I
FRM
Repetitive surge peak on state current for diode
-30°C T dI/dt Tstg
Tj
Toper
T
L
Note 1 : Test current waveform
Critical rate of rise time on state current -30°C T Storage junction temperature range
Maximum junction temperature Operating temperature range Maximum lead temperature for soldering during 10s
10µs
120°C
amb
120°C
amb
200ms
amb
tp=10µs
( note 1)
120°C
240 A
200 A/µs
-40to+150 + 125
-30 + 120 °C 260 °C
°C
THERMAL RESISTANCE
Symbol Parameter Value Unit
Rth(j-a) Rth(j-a)
S =CopperSurface under Tab
IPAK thermal resistance junction to ambient DPAK thermal resistance junction to ambient S = 0.5cm
100 °C/W
2
70 °C/W
ORDERING INFORMATION
FLC 10 - 200 x
Package:H:IPAK
FIRE LIGHTER CIRCUIT
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200:V 20V
CIRCUIT NUMBER SCR + Diode + Zener + Resistance High Power Version
BO
min =
B: DPAK
Page 3
FLC10-200H/B
ELECTRICAL CHARACTERISTICS
Symbol Parameters
V
V
I I
RM
BO
V V
BO
RM
αT
T
F
Stand-off voltage Breakover voltage
On-state voltage Diode forward voltage drop Breakover current Leakage current Temperature coefficient for V
BO
V
BO
V
RM
I
I
F
V
T
I
RM
I
BO
I
V
F
T
DIODE (D) PARAMETER
Symbol Test Conditions Value Unit
V
F
IF=2A tp500µs
Tj = 25°C Max. 1.7 V
THYRISTOR (Th) and ZENER (Z) PARAMETERS
V
Symbol Test conditions Min Typ Max Unit
I
RM
VRM= 200 V
Tj = 25°C 10 µA
Tj = 125°C 100 µA
V
BO
I
BO
V
T
at I
BO
at V
BO
IT=2A tp500µs
Tj = 25°C 200 225 250 V Tj = 25°C 0.5 mA Tj = 25°C 1.7 V
αT 13 10
Fig. 1: Relative variation of breakover current versus junction temperature.
k = I (Tj) / I (25°C)BO BO
2.5
2
1.5
1
0.5
-4
/°C
0
-20 0 20 40 60 80 100
Tj (°C)
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Page 4
FLC10-200H/B
Fig. 2: BASIC APPLICATION
Rs Ds
AC
Ic
Ic
t
c
Th
Z
MAINS
The applications of the lighter using the capaci­tance discharge topology operate in 2 phases :
PHASE 1
The energy coming from the mains is stored into thecapacitorC. For that, the ACvoltageis rectified by the diode Ds.
COMPONENT CHOICE
D
R
PHASE 2
At the end of the phase 1, the voltage across the capacitor C reaches the avalanche threshold of the zener. Thenacurrentflowsthroughthegateof the thyristor Th which fires. The firing of the thyristor causes an alternating current to flow through the capacitor C. The positive partsof this currentflow through C, Th and the primary of the HV transformer. The negative parts of the currentflow through C, D and the primaty of the HV transformer.
RS RESISTOR CALCULATION
TheRsresistorallows, in addition with thecapacitorC,the spark frequency to beadjustedandthe cur­rent from themains to be limited. Its valueshall allow the thyristor Th tofire even in worst case condi­tions. In this borderline case, the system must fire with the lowest value of RMS mains voltage while the breakdown voltage and current of the FLC are at the maximum.
The maximum Rs value is equal to :
Rs
max
( min. ) [ max .( .( ))]
AC BO amb
=
−+−2125α
kI
.*
BO
VVTT
* : see fig 1
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Page 5
Fig. 3: Spark frequency versus Rs and C
FLC10-200H/B
F (Hz)
20
10
5
3 2
1
4.7 6.8 10 12 15 18 22 27 30
The couple Rs/C can be chosen with the previous curve. Keep in mind the Rs maximum limit for which the system would not work when the AC
Vac=220Vrms,Vbo=225V, Tamb=25°C
C=0.47 FµC=0.47 Fµ
C=1 FµC=1 Fµ
C=1.5 FµC=1.5 Fµ
C=2.2 Fµ
C=2.7 Fµ
C=3.3 Fµ
Rs (k )
mains is minimum. The next curve shows the be­havior with Rs=15kand C=1µF.
Fig. 4: Voltage across the capacitance with Rs = 15k, C = 1µF and VBO= 225V.
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Page 6
FLC10-200H/B
PEAK CURRENT LIMIT
This component is designed towithstand I
= 240A for a pulse duration of 10µs for an
TRM
ambienttemperatureof 120°C in repetitivesurge (see note 1, page 2).
Fig. 5: Peak current limit versus pulse duration.
I (A)
TRM
300 280 260 240 220 200
The curve of peak current versus the pulse duration allows us to verify if the application is within the FLC operating limit.
Tj max : 120°C
180
6 8 10 12
tp (µs)
POWER LOSSES (For 10µs, see note 1)
To evaluate the power losses, please use the following equations :
For the thyristor:P=1.18 x I For the diode : P =0.67 x I
F(AV)
T(AV)
+ 0.106 I
+ 0.035 I
2
T(RMS)
2
F(RMS)
14
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Page 7
PACKAGE MECHANICAL DATA
DPAK
FLC10-200H/B
DIMENSIONS
REF.
A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212
C 0.45 0.60 0.017 0.023
C2 0.48 0.60 0.018 0.023
D 6.00 6.20 0.236 0.244
E 6.40 6.60 0.251 0.259
G 4.40 4.60 0.173 0.181
H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2
Millimeters Inches
Min. Max Min. Max.
FOOTPRINT
6.7
6.7
3
3
1.61.6
2.32.3
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Page 8
FLC10-200H/B
PACKAGE MECHANICAL DATA
IPAK
E
B2
H
L1
L
B6
G
L2
B3 B
V1
B5
DIMENSIONS
REF.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A
C2
A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.035 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.035
D
B6 0.95 0.037
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
A1
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
C A3
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039
V1 10° 10°
OTHER INFORMATION
Type Marking Package Weight Base qty Delivery mode
FLC10-200H FLC10-200B
Informationfurnished is believedto be accurateandreliable. However, STMicroelectronicsassumes no responsibilityfor the consequences of useof such informationnor for anyinfringement of patentsor other rightsof third partieswhich may resultfromits use. Nolicense is grantedby implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap­proval of STMicroelectronics.
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FLC10-200H IPAK 0.40g 75 Tube FLC10-200B DPAK 0.3 g 75 Tube
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