2.0 Guidelines for Getting Started with 16-Bit Microcontrollers........................................................................................................ 29
3.0 CPU ........................................................................................................................................................................................... 35
5.0 Direct Memory Access Controller (DMA) ................................................................................................................................... 63
6.0 Flash Program Memory.............................................................................................................................................................. 71
20.0 Enhanced Parallel Master Port (EPMP) ................................................................................................................................... 237
21.0 Real-Time Clock and Calendar (RTCC) with Timestamp......................................................................................................... 249
26.0 Comparator Voltage Reference................................................................................................................................................ 313
27.0 Charge Time Measurement Unit (CTMU) ................................................................................................................................ 315
29.0 Special Features ...................................................................................................................................................................... 327
30.0 Development Support............................................................................................................................................................... 343
31.0 Instruction Set Summary.......................................................................................................................................................... 345
Index ................................................................................................................................................................................................. 413
The Microchip Website ...................................................................................................................................................................... 419
Customer Change Notification Service .............................................................................................................................................. 419
Customer Support .............................................................................................................................................................................. 419
Product Identification System ............................................................................................................................................................ 421
2
C) ..................................................................................................................................................... 219
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DS30010118E-page 12 2016-2020 Microchip Technology Inc.
PIC24FJ256GA705 FAMILY
Referenced Sources
This device data sheet is based on the following
individual chapters of the “dsPIC33/PIC24 FamilyReference Manual”. These documents should be
considered as the general reference for the operation
of a particular module or device feature.
Note 1: To access the documents listed below,
browse to the documentation section of the
PIC24FJ256GA705 product page of the
Microchip website (www.microchip.com) or
select a family reference manual section
from the following list.
In addition to parameters, features and
other documentation, the resulting page
provides links to the related family
reference manual sections.
DS30010118E-page 14 2016-2020 Microchip Technology Inc.
PIC24FJ256GA705 FAMILY
1.0DEVICE OVERVIEW
This document contains device-specific information for
the following devices:
• PIC24FJ64GA705• PIC24FJ256GA704
• PIC24FJ128GA705• PIC24FJ64GA702
• PIC24FJ256GA705• PIC24FJ128GA702
• PIC24FJ64GA704• PIC24FJ256GA702
• PIC24FJ128GA704
The PIC24FJ256GA705 family introduces large Flash
and SRAM memory in smaller package sizes. This is a
16-bit microcontroller family with a broad peripheral
feature set and enhanced computational performance.
This family also offers a new migration option for those
high-performance applications which may be outgrowing their 8-bit platforms, but do not require the numerical
processing power of a Digital Signal Processor (DSP).
Table 1-3 lists the functions of the various pins shown
in the pinout diagrams.
1.1Core Features
1.1.116-BIT ARCHITECTURE
Central to all PIC24F devices is the 16-bit modified
Harvard architecture, first introduced with Microchip’s
dsPIC® Digital Signal Controllers (DSCs). The PIC24F
CPU core offers a wide range of enhancements,
such as:
• 16-bit data and 24-bit address paths with the
ability to move information between data and
memory spaces
• Linear addressing of up to 12 Mbytes (program
space) and 32 Kbytes (data)
• A 16-element Working register array with built-in
software stack support
• A 17 x 17 hardware multiplier with support for
integer math
• Hardware support for 32 by 16-bit division
• An instruction set that supports multiple
addressing modes and is optimized for high-level
languages, such as ‘C’
• Operational performance up to 16 MIPS
1.1.2POWER-SAVING TECHNOLOGY
The PIC24FJ256GA705 family of devices includes
Retention Sleep, a low-power mode with essential
circuits being powered from a separate low-voltage
regulator.
This new low-power mode also supports the continuous
operation of the low-power, on-chip Real-Time Clock/
Calendar (RTCC), making it possible for an application
to keep time while the device is otherwise asleep.
Aside from this new feature, PIC24FJ256GA705 family
devices also include all of the legacy power-saving
features of previous PIC24F microcontrollers, such as:
• On-the-Fly Clock Switching, allowing the selection
of a lower power clock during run time
• Doze Mode Operation, for maintaining peripheral
clock speed while slowing the CPU clock
• Instruction-Based Power-Saving Modes, for quick
invocation of the Idle and Sleep modes
1.1.3OSCILLATOR OPTIONS AND
FEATURES
All of the devices in the PIC24FJ256GA705 family offer
six different oscillator options, allowing users a range of
choices in developing application hardware. These
include:
• Two Crystal modes
• External Clock (EC) mode
• A Phase-Locked Loop (PLL) frequency multiplier,
which allows processor speeds up to 32 MHz
• An internal Fast RC Oscillator (FRC), a nominal
8 MHz output with multiple frequency divider
options
• A separate internal Low-Power RC Oscillator
(LPRC), 31 kHz nominal for low-power,
timing-insensitive applications.
The internal oscillator block also provides a stable
reference source for the Fail-Safe Clock Monitor
(FSCM). This option constantly monitors the main clock
source against a reference signal provided by the internal oscillator and enables the controller to switch to the
internal oscillator, allowing for continued low-speed
operation or a safe application shutdown.
1.1.4EASY MIGRATION
Regardless of the memory size, all devices share the
same rich set of peripherals, allowing for a smooth
migration path as applications grow and evolve. The
consistent pinout scheme used throughout the entire
family also aids in migrating from one device to the next
larger device.
The PIC24F family is pin-compatible with devices in the
dsPIC33 family, and shares some compatibility with the
pinout schema for PIC18 and dsPIC30. This extends
the ability of applications to grow from the relatively
simple, to the powerful and complex, yet still selecting
a Microchip device.
PIC24FJ256GA705 family devices have a Direct Memory
Access (DMA) Controller. This module acts in concert
with the CPU, allowing data to move between data
memory and peripherals without the intervention of the
CPU, increasing data throughput and decreasing execution time overhead. Six independently programmable
channels make it possible to service multiple peripherals
at virtually the same time, with each channel peripheral
performing a different operation. Many types of data
transfer operations are supported.
1.3Other Special Features
• Peripheral Pin Select: The Peripheral Pin Select
(PPS) feature allows most digital peripherals to be
mapped over a fixed set of digital I/O pins. Users
may independently map the input and/or output of
any one of the many digital peripherals to any one
of the I/O pins.
• Configurable Logic Cell: The Configurable
Logic Cell (CLC) module allows the user to
specify combinations of signals as inputs to a
logic function and to use the logic output to control
other peripherals or I/O pins.
• Timing Modules: The PIC24FJ256GA705 family
provides three independent, general purpose,
16-bit timers (two of which can be combined
into a 32-bit timer). The devices also include
four multiple output advanced
Capture/Compare/PWM/Timer peripherals, and
three independent legacy Input Capture and
three independent legacy Output Compare modules.
• Communications: The PIC24FJ256GA705 family
incorporates a range of serial
communication peripherals to handle a range of
application requirements. There are two indepen-
2
C modules that support both Master and
dent I
Slave modes of operation. Devices also have,
through the PPS feature, two independent UARTs
with built-in IrDA
three SPI modules.
• Analog Features: All members of the
PIC24FJ256GA705 family include a 12-bit A/D
Converter (A/D) module and a triple comparator
module. The A/D module incorporates a range of
new features that allow the converter to assess
and make decisions on incoming data, reducing
CPU overhead for routine A/D conversions. The
comparator module includes three analog
comparators that are configurable for a wide
range of operations.
• CTMU Interface: In addition to their other analog
features, members of the PIC24FJ256GA705
family include the CTMU interface module. This
provides a convenient method for precision time
measurement and pulse generation, and can serve
as an interface for capacitive sensors.
®
encoders/decoders and
• Enhanced Parallel Master/Parallel Slave Port:
This module allows rapid and transparent access to
the microcontroller data bus, and enables the CPU
to directly address external data memory. The
parallel port can function in Master or Slave mode,
accommodating data widths of four or eight bits and
address widths of up to ten bits in Master modes.
• Real-Time Clock and Calendar (RTCC): This
module implements a full-featured clock and
calendar with alarm functions in hardware, freeing
up timer resources and program memory space
for use of the core application.
1.4Details on Individual Family
Members
Devices in the PIC24FJ256GA705 family are available
in 28-pin, 44-pin and 48-pin packages. The general
block diagram for all devices is shown in Figure 1-1.
The devices are differentiated from each other in
five ways:
1. Flash program memory (64 Kbytes for
PIC24FJ64GA70X devices, 128 Kbytes for
PIC24FJ128GA70X devices, 256 Kbytes for
PIC24FJ256GA70X devices).
2. Available I/O pins and ports (22 pins on two
ports for 28-pin devices, and 36 and 40 pins on
three ports for 44-pin/48-pin devices).
3.Enhanced Parallel Master Port (EPMP) is only
available on 44-pin/48-pin devices.
4.Analog input channels (10 channels for 28-pin
devices and 14 channels for 44-pin/48-pin
devices).
5.CTMU input channels (12 channels for 28-pin
devices and 13 channels for 44-pin/48-pin
devices)
All other features for devices in this family are identical.
These are summarized in Ta bl e 1 - 1 and Ta bl e 1- 2.
A list of the pin features available on the
PIC24FJ256GA705 family devices, sorted by function, is shown in Tab le 1 -3 . Note that this table shows
the pin location of individual peripheral features and not
how they are multiplexed on the same pin. This
information is provided in the pinout diagrams in the
beginning of this data sheet. Multiplexed features are
sorted by the priority given to a feature, with the highest
priority peripheral being listed first.
DS30010118E-page 16 2016-2020 Microchip Technology Inc.
PIC24FJ256GA705 FAMILY
TABLE 1-1:DEVICE FEATURES FOR THE PIC24FJXXXGA702: 28-PIN DEVICES
Features PIC24FJ64GA702PIC24FJ128GA702PIC24FJ256GA702
DS30010118E-page 28 2016-2020 Microchip Technology Inc.
PIC24FJ256GA705 FAMILY
PIC24FJXXX
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
C1
R1
VDD
MCLR
VCAP
R2
C7
C2
(2)
C3
(2)
C4
(2)
C5
(2)
C6
(2)
Key (all values are recommendations):
C1 through C6: 0.1 µF, 50V ceramic
C7: 10 µF, 16V or greater, ceramic
R1: 10 kΩ
R2: 100Ω to 470Ω
Note 1:See Section 2.4 “Voltage Regulator Pin
(V
CAP)” for an explanation of voltage
regulator pin connections.
2:The example shown is for a PIC24F device
with five V
DD/VSS and AVDD/AVSS pairs.
Other devices may have more or less pairs;
adjust the number of decoupling capacitors
appropriately.
(1)
2.0GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
2.1Basic Connection Requirements
Getting started with the PIC24FJ256GA705 family of
16-bit microcontrollers requires attention to a minimal
set of device pin connections before proceeding with
development.
The following pins must always be connected:
DD and VSS pins
•All V
(see Section 2.2 “Power Supply Pins”)
•All AV
•MCLR
•V
These pins must also be connected if they are being
used in the end application:
• PGCx/PGDx pins used for In-Circuit Serial
• OSCI and OSCO pins when an external oscillator
Additionally, the following pins may be required:
•V
The minimum mandatory connections are shown in
Figure 2-1.
DD and AVSS pins, regardless of whether or
not the analog device features are used
(see Section 2.2 “Power Supply Pins”)
pin
(see Section 2.3 “Master Clear (MCLR) Pin”)
CAP pin
(see Section 2.4 “Voltage Regulator Pin (V
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
REF+/VREF- pins used when external voltage
reference for analog modules is implemented
Note:The AVDD and AVSS pins must always be
connected, regardless of whether any of
the analog modules are being used.
starting value is 10 k. Ensure that the MCLR
pin VIH and VIL specifications are met.
2: R2 470 will limit any current flowing into
MCLR
from the external capacitor, C, in the
event of a MCLR
pin breakdown, due to
Electrostatic Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C1
R2
R1
V
DD
MCLR
PIC24FXXX
JP
2.2Power Supply Pins
2.2.1DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as V
SS, is required.
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: A 0.1 µF (100 nF),
25V-50V capacitor is recommended. The
capacitor should be a low-ESR device with a
self-resonance frequency in the range of 200 MHz
and higher. Ceramic capacitors are
recommended.
• Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
• Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic-type
capacitor in parallel to the above described
decoupling capacitor. The value of the second
capacitor can be in the range of 0.01 µF to
0.001 µF. Place this second capacitor next to
each primary decoupling capacitor. In high-speed
circuit designs, consider implementing a decade
pair of capacitances as close to the power and
ground pins as possible (e.g., 0.1 µF in parallel
with 0.001 µF).
• Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
DD, VSS, AVDD and
2.3Master Clear (MCLR) Pin
The MCLR pin provides two specific device functions:
device Reset, and device programming and debugging. If programming and debugging are not required
in the end application, a direct connection to V
may be all that is required. The addition of other
components, to help increase the application’s
resistance to spurious Resets from voltage sags, may
be beneficial. A typical configuration is shown in
Figure 2-1. Other circuit designs may be implemented
depending on the application’s requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR
levels (V
IH and VIL) and fast signal transitions must
pin. Consequently, specific voltage
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR
pin during programming and debugging operations by using a jumper (Figure 2-2). The
jumper is replaced for normal run-time operations.
Any components associated with the MCLR
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2:EXAMPLE OF MCLR PIN
CONNECTIONS
DD
pin
2.2.2BULK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a bulk
capacitance of 10 µF or greater located near the MCU.
The value of the capacitor should be determined based
on the trace resistance that connects the power supply
source to the device, and the maximum current drawn
by the device in the application. Typical values range
from 10 µF to 47 µF. The capacitor should be ceramic
and have a voltage rating of 25V or more to reduce DC
bias effects (see Section 2.4.1 “Considerations for
Ceramic Capacitors”).
DS30010118E-page 30 2016-2020 Microchip Technology Inc.
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