Datasheet dsPIC33FJ32GS406, dsPIC33FJ32GS606, dsPIC33FJ32GS608, dsPIC33FJ32GS610, dsPIC33FJ64GS406 Datasheet

...
dsPIC33FJ32GS406/606/608/610 and
dsPIC33FJ64GS406/606/608/610
Data Sheet
High-Performance,
16-bit Digital Signal Controllers
2010 Microchip Technology Inc. Preliminary DS70591C
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and t he lik e is provided only for your convenience and may be su perseded by upda t es . It is y our responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life supp ort and/or safety ap plications is entir ely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless M icrochip from any and all dama ges, claims, suits, or expenses re sulting from such use. No licens es are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC, K
EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
PIC
logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-027-0
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS70591C-page 2 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and
dsPIC33FJ64GS406/606/608/610
High-Performance, 16-Bit Digital Signal Controllers
Operating Range:
• Up to 40 MIPS operation (at 3.0-3.6V):
- Industrial temperature range (-40°C to +85°C)
- Extended temperature range (-40°C to +125°C)
High-Performance DSC CPU:
• Modified Harvard architecture
• C compiler optimized inst ruction set
• 16-bit wide data path
• 24-bit wide instructions
• Linear program memory addressing up to 4M instruction words
• Linear data memory addressing up to 64 Kbytes
• 83 base instructions: mostly 1 word/1 cycle
• Two 40-bit accumulators with rounding and saturation options
• Flexible and powerful addressing modes:
-Indirect
- Modulo
- Bit-Reversed
• Software stack
• 16 x 16 fractional/integer multiply operations
• 32/16 and 16/16 divide operations
• Single-cycle multiply and accumulate:
- Accumulator write back for DSP operations
- Dual data fetch
• Up to ±16-bit shifts for up to 40-bit data
Direct Memory Access (DMA):
• 4-channel hardware DMA
• 1 Kbyte dual ported DMA buff er area (DMA RAM) to store data transferred via DMA:
- Allows data transfer between RAM and a
peripheral while CPU is executing code (no cycle steali ng)
• Most peripherals support DMA
Digital I/O:
• Up to 85 programmable digital I/O pi ns
• Wake-up/Interrupt-on-Change for up to 24 pins
• Output pins can drive voltage from 3.0V to 3.6V
• Up to 5V output with open drain configuration
• 5V tolerant digital input pins
• 16 mA source/sink on all PWM pins
On-Chip Flash and SRAM:
• Flash program memory (up to 64 Kbytes)
• Data SRAM (up to 8 Kbytes)
• Boot and General Security for program Flash
Peripheral Features:
• Timer/Counters, up to five 16-bit timers
- Can pair up to make one 32-bit timer
• Input Capture (up to four channels):
- Capture on up, down or both edges
- 16-bit capture input functions
- 4-deep FIFO on each capture
• Output Compare (up to four channels):
- Single or Dual 16-bit Compare mode
- 16-bit Glitchless PWM mode
• 4-wire SPI (up to two modules):
- Framing supports I/O interface to simpl e codecs
- 1-deep FIFO buffer
- Supports 8-bit and 16-bit data
- Supports all serial clock formats and sampling modes
2
•I
C™ (up to two modules):
- Supports Full Multi-Master Slave mode
- 7-bit and 10-bit addressing
- Bus collision detection and arbitration
- Integrated signal conditioning
- Slave address masking
2010 Microchip Technology Inc. Preliminary DS70591C-page 3
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
Peripheral Features (Continued)
• UART (up to two modules):
- Interrupt on address bit detect
- Interrupt on UART error
- Wake-up on Start bit from Sleep mode
- 4-character TX and RX FIFO buffers
- LIN bus support
©
-IrDA
- High-Speed Baud mode
- Hardware Flow Control with CTS and RTS
• Enhanced CAN (ECAN™ module) 2.0B active:
- Up to eight transmit and up to 32 receive buffers
- 16 receive filters and three masks
- Loopback, Listen Only and Listen All
- Messages modes for diagnostics and bus
- Wake-up on CAN message
- Automatic processing of Remote
- FIFO mode using DMA
- DeviceNet™ addressing support
• Quadrature Encoder Interface (up to 2 modul es ):
- Phase A, Phase B, and index pulse input
- 16-bit up/down position counter
- Count direction status
- Position Measurement (x2 and x 4) mode
- Programmable digital noise filters on inputs
- Alternate 16-bit Timer/Cou nte r mode
- Interrupt on position counter rollover/underflow
encoding and decoding in hardware
monitoring
Transmission Requests
High-Speed PWM Module Features:
• Up to nine PWM generators with up to 18 outputs
• Primary and Secondary time-base
• Individual time base an d duty c ycle fo r each of the PWM output
• Dead time for rising and falling edges:
- Duty cycle resolution of 1.04 ns
- Dead-time resolution of 1.04 ns
• Phase shift resolution of 1.04 ns
• Frequency resolution of 1.04 ns
• PWM modes supported:
- Standard Edge -Aligned
- True Independent Output
- Complementary
- Center-Aligned
- Push-Pull
-Multi-Phase
- Variable Phase
- Fixed Off-Time
- Current Reset
- Current-Limit
• Independent Fault/Current-Limit inputs
• Output override control
• Special Event Trigger
• PWM capture feature
• Prescaler for input clock
• Dual Trigger from PWM TO ADC
• PWMxL, PWMxH output pin swapping
• On-the-Fly PWM Frequency, Duty cycle and Phase Shift changes
• Disabling of Individual PWM generators
• Leading-Edge Blanking (LEB) functionality
High-Speed Analog Comparator:
• Up to four Analog Comparators:
- 20 ns response time
- 10-bit DAC for each analog comparator
- DACOUT pin to provide DAC output
- Programmable output polarity
- Selectable input source
- ADC sample and convert capability
• PWM module interface:
- PWM Duty Cycle Control
- PWM Period Control
- PWM Fault Detect
Interrupt Controller:
• 5-cycle latency
• Up to five external interrupts
• Seven programmable priority levels
• Five proc essor exceptions
High-Speed 10-bit ADC:
• 10-bit resolution
• Up to 24 input channels grouped into 12 conversion pairs
• Two internal reference monitoring inputs grouped into a pair
• Successive Approximation Register (SAR) converters for parallel conversions of analog pairs:
- 4 Msps for devices with two SARs
- 2 Msps for devices with one SAR
• Dedicated result buffer for each analog channel
• Independent trigger source section for each analog input conversion pairs
Power Management:
• On-chip 2.5V voltage regulator
• Switch between clock sources in real time
• Idle, Sleep, and Doze modes with fast wake-up
DS70591C-page 4 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
CMOS Flash Technology:
• Low-power, high-speed Flash technology
• Fully static design
• 3.3V (±10%) operating voltag e
• Industrial and Extended tempera t ure
• Low power consumption
System Management:
• Flexible clock options :
- External, crystal, resonator, internal RC
- Phase-Locked Loop (PLL) with 120 MHz VCO
- Primary Crystal Os cill ator (OSC) in t he range of 3 MHz to 40 MHz
- Second ary oscillator (SOSC)
- Internal Low-Power RC (LPRC) o scillator at a frequency of 32.767 kHz
- Internal Fast RC (FRC) oscillator at a frequency of 7.37 MHz
• Power-o n Reset (POR )
• Brown-out Reset (BOR)
• Power-up Timer (PWRT)
• Oscillator Start-up Timer (OST)
• Watchdog Timer with its RC oscillator
• Fail-Safe Clock Monitor
• Reset by multiple sources
• In-Circuit Serial Programming™ (ICSP™)
• Reference Oscillator Output
Application Examples:
• AC-to-DC Converters
• Automotive HID
• Battery Chargers
• DC-to-DC Converters
• Digital Lighting
• Induction Cooking
•LED Ballast
• Renewable Power/Pure Sine Wave Inverters
• Uninterruptible Power Supply (UPS)
Packaging:
• 64-pin QFN (9x9x0.9 mm)
• 64-pin TQFP (10x10x1 mm)
• 80-pin TQFP (12x12x1 mm)
• 100-pin TQFP (14x14x1 mm and 12x12x1 mm) Note: See the dsPIC33FJ32GS406/606/608/
610 and dsPIC33FJ64GS406/606/608/ 610 Controller Families table for exact peripheral features per device.
2010 Microchip Technology Inc. Preliminary DS70591C-page 5
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 PRODUCT FAMILIES

The device names, pin counts, memory sizes, and peripheral availability of each device are listed in Table 1. The following pages show their pinout diagrams.
TABLE 1: dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 CONTROLLER
FAMILIES
ADC
Device
dsPIC33FJ32GS40664324K544212006x20502151658PT,
dsPIC33FJ32GS60664324K544222006x24512261658PT,
dsPIC33FJ32GS60880324K544222008x24512261874PT dsPIC33FJ32GS610100324K544222009x24512262485PT,
dsPIC33FJ64GS40664648K544212006x20502151658PT,
dsPIC33FJ64GS606 64 64 9K
dsPIC33FJ64GS608 80 64 9K dsPIC33FJ64GS610 100 64 9K
Note 1: RAM size is inclusive of 1 Kbyte DMA RAM.
Pins
Program Flash Memory (Kbytes)
UART
16-bit Timer
RAM (Bytes)
(1)
(1) (1)
Input Capture
Output Compare
544222146x24512261658PT,
544222148x24512261874PT 544222149x24512262485PT,
SPI
Quadrature Encoder Interface
ECAN™
PWM
DMA Channels
Analog Compara tor
External Interrupts
C™
2
I
DAC Output
SARs
Sample and Hold (S&H) Circuit
I/O Pins
Packages
Analog-to-Digital Inputs
MR
MR
PF
MR
MR
PF
DS70591C-page 6 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
64-Pin TQFP
1 2 3 4 5 6 7 8 9 10 11 12 13
36 35 34 33
32
31
30
29
28
27
26
646362616059585756
14 15 16
171819202122232425
dsPIC33FJ32GS406
PGEC2/SOSCO/T1CK/CN0/RC14 PGED2/SOSCI/T4CK/CN1/RC13 OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/INT4/RD11
IC2/FLT2/U1CTS
/INT2/RD9 IC1/FLT1/SYNCI1/INT1/RD8 V
SS
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RTS
/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
VSS VDD
AN3/AINDX1/CN5/RB3
AN2/ASS1
/CN4/RB2
PGEC3/B/AN1/CN3/RB1
PGED3/AN0/CN2/RB0
PWM5H/UPDN1/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
V
CAP/VDDCORE
PWM1L1/FLT8/RE0
RF1
PWM1H1/RE1
OC2/SYNCO2/FLT6/RD1
OC3/FLT7/SYNCI3/RD2
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AV
DD
AVSS
AN8/U2CTS/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
V
SS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
AN14/SS1
/U2RTS/RB14
AN15/OCFB/CN12/RB15
U2TX/SCL2/FLT18/CN18/RF5
U2RX/SDA2/FLT17/CN17/RF4
SDA1/RG3
43 42 41 40 39 38 37
44
48 47 46
504951
545352
55
45
SS2
/FLT9/SYNCI2/T5CK/CN11/RG9
AN5/AQEB1/CN7/RB5 AN4/AQEA1/CN6/RB4
IC3/INDX1/FLT3/INT3/RD10
VDD
SYNCI4/RF0
OC4/SYNCO1/RD3
PWM5L/CN15/RD6
PWM6H/CN14/RD5
PWM6L/CN13/RD4
dsPIC33FJ64GS406
= Pins are up to 5V tolerant

Pin Diagrams

2010 Microchip Technology Inc. Preliminary DS70591C-page 7
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
64-Pin QFN
PGEC2/SOSCO/T1CK/CN0/RC14 PGED2/SOSCI/T4CK/CN1/RC13 OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/INT4/RD11
IC2/FLT2/U1CTS
/INT2/RD9 IC1/FLT1/SYNCI1/INT1/RD8 V
SS
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RTS
/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
VSS VDD
AN3/AINDX1/CN5/RB3
AN2/ASS1
/CN4/RB2
PGEC3/B/AN1/CN3/RB1
PGED3/AN0/CN2/RB0
PWM5H/UPDN1/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
V
CAP/VDDCORE
PWM1L1/FLT8/RE0
RF1
PWM1H1/RE1
OC2/SYNCO2/FLT6/RD1
OC3/FLT7/SYNCI3/RD2
PGEC1/AN6/OCFA/RB6
PGED1/AN7/RB7
AV
DD
AVss
AN8/U2CTS
/RB8
AN9/RB9
TMS/AN10/RB10
TDO/AN11/RB11
V
SS
VDD
TCK/AN12/RB12
TDI/AN13/RB13
AN14/SS1
/U2RTS/RB14
AN15/OCFB/CN12/RB15
U2TX/SCL2/FLT18/CN18/RF5
U2RX/SDA2/FLT17/CN17/RF4
SDA1/RG3
SS2
/FLT9/SYNCI2/T5CK/CN11/RG9
AN5/AQEB1/CN7/RB5 AN4/AQEA1/CN6/RB4
IC3/INDX1/FLT3/INT3/RD10
VDD
SYNCI4/RF0
OC4/SYNCO1/RD3
PWM5L/CN15/RD6
PWM6H/CN14/RD5
PWM6L/CN13/RD4
646362 61 60595857 56 55
2223 24 2526272829 30 31
3
40 39 38 37 36 35 34 33
4 5
7 8
9 10 11
1
2
42 41
6
32
43
54
14 15 16
12 13
17
1819 20 21
45 44
47 46
48
53
52515049
dsPIC33FJ32GS406 dsPIC33FJ64GS406
= Pins are up to 5V tolerant
Note: The metal plane at the bottom of the device is not connected to any pins and is recomm ended t o be connected to
V
SS externally.
Pin Diagrams (Continued)
DS70591C-page 8 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
64-Pin TQFP
1 2 3 4 5 6 7 8 9 10 11 12 13
36 35 34 33
32
31
30
29
28
27
26
646362616059585756
14 15 16
171819202122232425
PGEC2/SOSCO/T1CK/CN0/RC14 PGED2/SOSCI/T4CK/CN1/RC13 OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/INT4/RD11
IC2/FLT2/U1CTS
/INT2/RD9 IC1/FLT1/SYNCI1/INT1/RD8 V
SS
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RTS
/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
VSS VDD
AN3/CMP2B/AINDX1/CN5/RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
PGEC3/B/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
PWM5H/UPDN1/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
V
CAP/VDDCORE
PWM1L1/FLT8/RE0
RF1
PWM1H1/RE1
OC2/SYNCO2/FLT6/RD1
OC3/FLT7/SYNCI3/RD2
PGEC1/AN6/CMP3C/CMP4A/OCFA/RB6
PGED1/AN7/CMP4B/RB7
AVdd
AV
SS
AN8/U2CTS/RB8
AN9/DACOUT/RB9
TMS/AN10/RB10
TDO/AN11/EXTREF/RB11
V
SS
VDD
TCK/AN12/CMP1D/RB12
TDI/AN13/CMP2D/RB13
AN14/CMP3D/SS1
/U2RTS/RB14
AN15/CMP4D/OCFB/CN12/RB15
U2TX/SCL2/FLT18/CN18/RF5
U2RX/SDA2/FLT17/CN17/RF4
SDA1/RG3
43 42 41 40 39 38 37
44
48 47 46
504951
545352
55
45
SS2
/FLT9/SYNCI2/T5CK/CN11/RG9
AN5/CMP3B/AQEB1/CN7/RB5
AN4/CMP2C/CMP3A/AQEA1/CN6/RB4
IC3/INDX1/FLT3/INT3/RD10
VDD
SYNCI4/RF0
OC4/SYNCO1/RD3
PWM5L/CN15/RD6
PWM6H/CN14/RD5
PWM6L/CN13/RD4
dsPIC33FJ32GS606
= Pins are up to 5V tolerant
Pin Diagrams (Continued)
2010 Microchip Technology Inc. Preliminary DS70591C-page 9
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
64-Pin TQFP
1 2 3 4 5 6 7 8 9 10 11 12 13
36 35 34 33
32
31
30
29
28
27
26
646362616059585756
14 15 16
171819202122232425
PGEC2/SOSCO/T1CK/CN0/RC14 PGED2/SOSCI/T4CK/CN1/RC13 OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/INT4/RD11
IC2/FLT2/U1CTS
/INT2/RD9 IC1/FLT1/SYNCI1/INT1/RD8 V
SS
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RTS
/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
VSS VDD
AN3/CMP2B/AINDX1/CN5/RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
PGEC3/B/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
PWM5H/UPDN1/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
V
CAP/VDDCORE
PWM1L1/FLT8/RE0
C1TX/RF1
PWM1H1/RE1
OC2/SYNCO2/FLT6/RD1
OC3/FLT7/SYNCI3/RD2
PGEC1/AN6/CMP3C/CMP4A/OCFA/RB6
PGED1/AN7/CMP4B/RB7
AVdd
AV
SS
AN8/U2CTS/RB8
AN9/DACOUT/RB9
TMS/AN10/RB10
TDO/AN11/EXTREF/RB11
V
SS
VDD
TCK/AN12/CMP1D/RB12
TDI/AN13/CMP2D/RB13
AN14/CMP3D/SS1
/U2RTS/RB14
AN15/CMP4D/OCFB/CN12/RB15
U2TX/SCL2/FLT18/CN18/RF5
U2RX/SDA2/FLT17/CN17/RF4
SDA1/RG3
43 42 41 40 39 38 37
44
48 47 46
504951
545352
55
45
SS2
/FLT9/SYNCI2/T5CK/CN11/RG9
AN5/CMP3B/AQEB1/CN7/RB5
AN4/CMP2C/CMP3A/AQEA1/CN6/RB4
IC3/INDX1/FLT3/INT3/RD10
VDD
C1RX/SYNCI4/RF0
OC4/SYNCO1/RD3
PWM5L/CN15/RD6
PWM6H/CN14/RD5
PWM6L/CN13/RD4
dsPIC33FJ64GS606
= Pins are up to 5V tolerant
Pin Diagrams (Continued)
DS70591C-page 10 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
PGEC2/SOSCO/T1CK/CN0/RC14 PGED2/SOSCI/T4CK/CN1/RC13 OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/INT4/RD11
IC2/FLT2/U1CTS
/INT2/RD9 IC1/FLT1/SYNCI1/INT1/RD8 V
SS
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RTS
/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
VSS VDD
AN3/CMP2B/AINDX1/CN5/RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
PGEC3/B/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
PWM5H/UPDN1/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
V
CAP/VDDCORE
PWM1L1/FLT8/RE0
RF1
PWM1H1/RE1
OC2/SYNCO2/FLT6/RD1
OC3/FLT7/SYNCI3/RD2
PGEC1/AN6/CMP3C/CMP4A/OCFA/RB6
PGED1/AN7/CMP4B/RB7
AV
DD
AVSS
AN8/U2CTS/RB8
AN9/DACOUT/RB9
TMS/AN10/RB10
TDO/AN11/EXTREF/RB11
V
SS
VDD
TCK/AN12/CMP1D/RB12
TDI/AN13/CMP2D/RB13
AN14/CMP3D/SS1
/U2RTS/RB14
AN15/CMP4D/OCFB/CN12/RB15
U2TX/SCL2FLT18//CN18/RF5
U2RX/SDA2/FLT17/CN17/RF4
SDA1/RG3
SS2
/FLT9/SYNCI2/T5CK/CN11/RG9
AN5/CMP3B/AQEB1/CN7/RB5
AN4/CMP2C/CMP3A/AQEA1/CN6/RB4
IC3/INDX1/FLT3/INT3/RD10
VDD
SYNCI4/RF0
OC4/SYNCO1/RD3
PWM5L/CN15/RD6
PWM6H/CN14/RD5
PWM6L/CN13/RD4
64 63 62 6160 59 58 57 56 55
22 23 2425 26 27 28 29 30 31
3
40 39 38 37 36 35 34 33
4 5
7 8
9 10 11
1
2
42 41
6
32
43
54
14 15 16
12 13
17
18 19 2021
45 44
47 46
48
53
52 51 5049
dsPIC33FJ32GS606
64-Pin QFN
= Pins are up to 5V tolerant
Note: The metal plane at the bottom of the device is not connected to any pins and is recommended to be connected to
V
SS externally.
Pin Diagrams (Continued)
2010 Microchip Technology Inc. Preliminary DS70591C-page 11
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
64-Pin QFN
PGEC2/SOSCO/T1CK/CN0/RC14 PGED2/SOSCI/T4CK/CN1/RC13 OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/INT4/RD11
IC2/FLT2/U1CTS
/INT2/RD9 IC1/FLT1/SYNCI1/INT1/RD8 V
SS
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RTS
/SCK1/INT0/RF6 U1RX/SDI1/RF2 U1TX/SDO1/RF3
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
VSS VDD
AN3/CMP2B/AINDX1/CN5/RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
PGEC3/B/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
PWM5H/UPDN1/CN16/RD7
PWM3L/RE4
PWM2H/RE3
PWM2L/RE2
V
CAP/VDDCORE
PWM1L1/FLT8/RE0
C1TX/RF1
PWM1H1/RE1
OC2/SYNCO2/FLT6/RD1
OC3/FLT7/SYNCI3/RD2
PGEC1/AN6/CMP3C/CMP4A/OCFA/RB6
PGED1/AN7/CMP4B/RB7
AV
DD
AVSS
AN8/U2CTS/RB8
AN9/DACOUT/RB9
TMS/AN10/RB10
TDO/AN11/EXTREF/RB11
V
SS
VDD
TCK/AN12/CMP1D/RB12
TDI/AN13/CMP2D/RB13
AN14/CMP3D/SS1
/U2RTS/RB14
AN15/CMP4D/OCFB/CN12/RB15
U2TX/SCL2/FLT18/CN18/RF5
U2RX/SDA2/FLT17/CN17/RF4
SDA1/RG3
SS2
/FLT9/SYNCI2/T5CK/CN11/RG9
AN5/CMP3B/AQEB1/CN7/RB5
AN4/CMP2C/CMP3A/AQEA1/CN6/RB4
IC3/INDX1/FLT3/INT3/RD10
VDD
C1RX/SYNCI4/RF0
OC4/SYNCO1/RD3
PWM5L/CN15/RD6
PWM6H/CN14/RD5
PWM6L/CN13/RD4
64 63 62 61 60 59 5857 56 55
22 23 2425 26 27 28 29 30 31
3
40 39 38 37 36 35 34 33
4 5
7 8
9 10 11
1
2
42 41
6
32
43
54
14 15 16
12 13
17
18 19 2021
45 44
47 46
48
53
52 51 5049
dsPIC33FJ64GS606
= Pins are up to 5V tolerant
Note: The metal plane at the bottom of the device is not connected to any pins and is recomm ended t o be connected to
V
SS externally.
Pin Diagrams (Continued)
DS70591C-page 12 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
80-Pin TQFP
727473
7170696867666564636261
20
2 3 4 5 6 7 8
9 10 11 12 13 14 15 16
50 49 48 47 46 45 44
21
41
40
39
38
37
36
35
34
2324252627282930313233
dsPIC33FJ32GS608
17 18 19
75
1
57 56 55 54 53 52 51
60 59 58
43 42
767877
79
22
80
QEA2/RD12
PWM7H/OC4/SYNCO1/RD3
OC3/FLT7/RD2
OC2/SYNCO2/FLT6/RD1
PWM2L/RE2
PWM1H1/RE1
PWM1L1/FLT8/RE0
INDX2SYNCI4//RG0
QEB2/RG1
RF1
RF0
PWM3L/RE4
PWM2H/RE3
PWM5H/UPDN1/CN16/RD7
PWM6H/CN14/RD5
OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/RD11
IC2/FLT2/RD9 IC1/FLT1/SYNCI1/RD8 SDA2/INT4/FLT19/RA15
IC3/INDX1/FLT3/RD10
SCL2/INT3/FLT20/RA14 V
SS
OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RX/RF2 U1TX/RF3
PGEC2/SOSCO/T1CK/CN0/R C14 PGED2/SOSCI/T4CK/CN1/RC13
PWM8H/RA10
PWM8L/RA9
AV
DD
AVSS
AN8/U2CTS/RB8
AN9/DACOUT/RB9
AN10/RB10
AN11/EXTREF/RB11
V
DD
U2RX/FLT17/CN17/RF4
U1RTS
/FLT16/SYNCI2/CN21/RD15
U2TX/FLT18/CN18/RF5
PGEC1/AN6CMP3C/CMP4A//OCFA/RB6
PGED1/AN7/CMP4B/RB7
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
SS2/FLT9/T5CK/CN11/RG9
AN4/CMP2C/CMP3A/AQEA1/CN6/RB4
AN3/CMP2B/AINDX1/CN5/RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
PGEC3/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
V
SS
VDD
PWM3H/RE5
PWM4L/RE6
TDO/FLT14/INT2/RE9
TMS/FLT13/INT1/RE8
TCK/AN12/CMP1D/RB12
TDI/AN13/CMP2D/RB13
AN14/CMP3D/SS1
/U2RTS/RB14
AN15/CMP4D/OCFB/CN12/RB15
V
DD
VCAP/VDDCORE
PWM6L/CN13/RD4
PWM7L/CN19/RD13
SDA1/RG3
SDI1/RF7 SDO1/RF8
AN5/CMP3B/AQEB1/CN7/RB5
VSS
OSC2/REFCLKO/CLKO/RC15
PWM5L/CN15/RD6
SCK1/INT0/RF6
U1CTS/FLT15/SYNCI3/CN20/RD14
AN16/T2CK/RC1 AN17/T3CK/RC2
= Pins are up to 5V tolerant
Pin Diagrams (Continued)
2010 Microchip Technology Inc. Preliminary DS70591C-page 13
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
80-Pin TQFP
727473
7170696867666564636261
20
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16
50 49 48 47 46 45 44
21
41
40
39
38
37
36
35
34
2324252627282930313233
17 18 19
75
1
57 56 55 54 53 52 51
60 59 58
43 42
767877
79
22
80
QEA2/RD12
PWM7H/OC4/SYNCO1/RD3
OC3/FLT7/RD2
OC2/SYNCO2/FLT6/RD1
PWM2L/RE2
PWM1H1/RE1
PWM1L1/FLT8/RE0
INDX2SYNCI4//RG0
QEB2/RG1
C1TX/RF1
C1RX/RF0
PWM3L/RE4
PWM2H/RE3
PWM5H/UPDN1/CN16/RD7
PWM6H/CN14/RD5
OC1/QEB1/FLT5/RD0 IC4/QEA1/FLT4/RD11
IC2/FLT2/RD9 IC1/FLT1/SYNCI1/RD8 SDA2/INT4/FLT19/RA15
IC3/INDX1/FLT3/RD10
SCL2/INT3/FLT20/RA14 V
SS
OSC1/CLKIN/RC12 V
DD
SCL1/RG2
U1RX/RF2 U1TX/RF3
PGEC2/SOSCO/T1CK/CN0/R C14 PGED2/SOSCI/T4CK/CN1/RC13
PWM8H/RA10
PWM8L/RA9
AV
DD
AVSS
AN8/U2CTS/RB8
AN9/DACOUT/RB9
AN10/RB10
AN11/EXTREF/RB11
V
DD
U2RX/FLT17/CN17/RF4
U1RTS
/FLT16/SYNCI2/CN21/RD15
U2TX/FLT18/CN18/RF5
PGEC1/AN6CMP3C/CMP4A//OCFA/RB6
PGED1/AN7/CMP4B/RB7
PWM4H/RE7
SCK2/FLT12/CN8/RG6
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
MCLR
SS2/FLT9/T5CK/CN11/RG9
AN4/CMP2C/CMP3A/AQEA1/CN6/RB4
AN3/CMP2B/AINDX1/CN5/RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
PGEC3/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
V
SS
VDD
PWM3H/RE5
PWM4L/RE6
TDO/FLT14/INT2/RE9
TMS/FLT13/INT1/RE8
TCK/AN12/CMP1D/RB12
TDI/AN13/CMP2D/RB13
AN14/CMP3D/SS1
/U2RTS/RB14
AN15/CMP4D/OCFB/CN12/RB15
V
DD
VCAP/VDDCORE
PWM6L/CN13/RD4
PWM7L/CN19/RD13
SDA1/RG3
SDI1/RF7 SDO1/RF8
AN5/CMP3B/AQEB1/CN7/RB5
VSS
OSC2/REFCLKO/CLKO/RC15
PWM5L/CN15/RD6
SCK1/INT0/RF6
U1CTS/FLT15/SYNCI3/CN20/RD14
AN16/T2CK/RC1 AN17/T3CK/RC2
dsPIC33FJ64GS608
= Pins are up to 5V tolerant
Pin Diagrams (Continued)
DS70591C-page 14 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
100-Pin TQFP
9294939190898887868584838281807978
20
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
65 64 63 62 61 60 59
26
56
45
44
43
42
41
40
39
2829303132333435363738
17 18 19
21 22
95
1
76
77
72 71 70 69 68 67 66
75 74 73
58 57
24
23
25
969897
99
27
4647484950
55 54 53 52 51
100
PWM6H/CN14/RD5
PWM6L/CN13/RD4
PWM7L/CN19/RD13
QEA2/RD12
PWM7H/OC4/RD3
OC3/FLT7/RD2
OC2/SYNCO2/FLT6/RD1
AN23/CN23/RA7
AN22/CN22/RA6
PWM2L/RE2
PWM9L/RG13
PWM9H/RG12
SYNCO1/FLT23/RG14
PWM1H/RE1
PW/M1L/FLT8/RE0
INDX2/RG0
PWM3L/RE4
PWM2H/RE3
RF0
V
CAP/VDDCORE
PGED2/SOSCI/CN1/RC13 OC1/QEB1/FLT5/RD0
IC3/INDX1/FLT3/RD10 IC2/FLT2/RD9 IC1/FLT1/RD8
IC4/QEA1/FLT4/RD11
SDA2/FLT21/RA3 SCL2/FLT22/RA2
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8
SDA1/RG3
U1RX/RF2 U1TX/RF3
Vss PGEC2/SOSCO/T1CK/CN0/RC14
PWM8H/RA10
PWM8L/RA9
AV
DD
AVSS
AN8/RB8
AN9/DACOUT/RB9
AN10/RB10
AN11/EXTREF/RB11
V
DD
U2CTS/RF12
U2RTS
/RF13
U1CTS
/FLT15/SYNCI3/CN20/RD14
U1RTS
/FLT16/SYNCI2/CN21/RD15
V
DD
VSS
PGEC1/AN6/CMP3C/CMP4A//OCFA/RB6
PGED1/AN7/CMP4B/RB7
U2TX/FLT18/CN18/RF5
U2RX/FLT17/CN17/RF4
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
V
DD
TMS/RA0
AN20/FLT13/INT1/RE8 AN21/FLT14/INT2/RE9
AN5/CMP3B/AQEB1/CN7/RB5
AN4/CMP2C/CMP3A/AQEA1/CN 6/RB4
AN3/CMP2B/AINDX1/CN5 /RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
PGEC3/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
SYNCI1/RG15
V
DD
SS2/FLT9/CN11/RG9
MCLR
AN12/CMP1D/RB12
AN13/CMP2D/RB13
AN14/CMP3D/SS1
/RB14
AN15/CMP4D/OCFB/CN12/RB15
QEB2/RG1
RF1
PWM5H/UPDN1/CN16/RD7
PWM5L/CN15/RD6
TDO/RA5
INT4/FLT19/SYNCI4/RA15 INT3/FLT20/RA14
V
SS
VSS
VSS
VDD
TDI/RA4
TCK/RA1
AN16/T2CK/RC1 AN17/T3CK/RC2 AN18/T4CK/RC3 AN19/T5CK/RC4
dsPIC33FJ32GS610
= Pins are up to 5V tolerant
Pin Diagrams (Continued)
2010 Microchip Technology Inc. Preliminary DS70591C-page 15
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
9294939190898887868584838281807978
20
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
65 64 63 62 61 60 59
26
56
45
44
43
42
41
40
39
2829303132333435363738
17 18 19
21 22
95
1
76
77
72 71 70 69 68 67 66
75 74 73
58 57
24
23
25
969897
99
27
4647484950
55 54 53 52 51
100
PWM6H/CN14/RD5
PWM6L/CN13/RD4
PWM7L/CN19/RD13
QEA2/RD12
PWM7H/OC4/RD3
OC3/FLT7/RD2
OC2/SYNCO2/FLT6/RD1
AN23/CN23/RA7
AN22/CN22/RA6
PWM2L/RE2
PWM9L/RG13
PWM9H/RG12
SYNCO1/FLT23/RG14
PWM1H/RE1
PW/M1L/FLT8/RE0
INDX2/RG0
PWM3L/RE4
PWM2H/RE3
C1RX/RF0
V
CAP/VDDCORE
PGED2/SOSCI/CN1/RC13 OC1/QEB1/FLT5/RD0
IC3/INDX1/FLT3/RD10 IC2/FLT2/RD9 IC1/FLT1/RD8
IC4/QEA1/FLT4/RD11
SDA2/FLT21/RA3 SCL2/FLT22/RA2
OSC2/REFCLKO/CLKO/RC15 OSC1/CLKIN/RC12 V
DD
SCL1/RG2
SCK1/INT0/RF6 SDI1/RF7 SDO1/RF8
SDA1/RG3
U1RX/RF2 U1TX/RF3
Vss PGEC2/SOSCO/T1CK/CN0/RC14
PWM8H/RA10
PWM8L/RA9
AV
DD
AVSS
AN8/RB8
AN9/DACOUT/RB9
AN10/RB10
AN11/EXTREF/RB11
V
DD
U2CTS/RF12
U2RTS
/RF13
U1CTS
/FLT15/SYNCI3/CN20/RD14
U1RTS
/FLT16/SYNCI2/CN21/RD15
V
DD
VSS
PGEC1/AN6/CMP3C/CMP4A//OCFA/RB6
PGED1/AN7/CMP4B/RB7
U2TX/FLT18/CN18/RF5
U2RX/FLT17/CN17/RF4
PWM3H/RE5
PWM4L/RE6
PWM4H/RE7
SCK2/FLT12/CN8/RG6
V
DD
TMS/RA0
AN20/FLT13/INT1/RE8 AN21/FLT14/INT2/RE9
AN5/CMP3B/AQEB1/CN7/RB5
AN4/CMP2C/CMP3A/AQEA1/CN 6/RB4
AN3/CMP2B/AINDX1/CN5 /RB3
AN2/CMP1C/CMP2A/ASS1
/CN4/RB2
SDI2/FLT11/CN9/RG7
SDO2/FLT10/CN10/RG8
PGEC3/AN1/CMP1B/CN3/RB1
PGED3/AN0/CMP1A/CMP4C/CN2/RB0
SYNCI1/RG15
V
DD
SS2/FLT9/CN11/RG9
MCLR
AN12/CMP1D/RB12
AN13/CMP2D/RB13
AN14/CMP3D/SS1
/RB14
AN15/CMP4D/OCFB/CN12/RB15
QEB2/RG1
C1TX/RF1
PWM5H/UPDN1/CN16/RD7
PWM5L/CN15/RD6
TDO/RA5
INT4/FLT19/SYNCI4/RA15 INT3/FLT20/RA14
V
SS
VSS
VSS
VDD
TDI/RA4
TCK/RA1
AN16/T2CK/RC1 AN17/T3CK/RC2 AN18/T4CK/RC3 AN19/T5CK/RC4
dsPIC33FJ64GS610
= Pins are up to 5V tolerant
100-Pin TQFP
Pin Diagrams (Continued)
DS70591C-page 16 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

Table of Contents

dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 Product Families ............................................................... 6
1.0 Device Overview........................................................................................................................................................................ 19
2.0 Guidelines for Getting Started with 16-bit Digital Signal Controllers ..........................................................................................25
3.0 CPU............................................................................................................................................................................................ 35
4.0 Memory Organization................................................................................................................................................................. 47
5.0 Flash Program Memory............................................................................................................................................................ 109
6.0 Resets ..................................................................................................................................................................................... 115
7.0 Interrupt Controller................................... ................................................................. ............................................................... 123
8.0 Direct Memory Access (DMA)......................................................................... ......................................................................... 177
9.0 Oscillator Configuration .........................................................................................................................................................187
10.0 Power-Saving Features............................................................ ................................................................................................ 199
11.0 I/O Ports.............................................. .................................................................................................................................... 209
12.0 Timer1......................................................................................................................................................................................211
13.0 Timer2/3/4/5 feature s ....................................... .............................................................. ......................................................... 213
14.0 Input Capture......................................................................................................... .... ...............................................................219
15.0 Output Compare...................................................... .................................................................................................................221
16.0 High-Speed PWM........ .......................................................................................... ........... ........................................................ 225
17.0 Quadrature Encoder Interface (QEI) Module ........................................................................................................................... 255
18.0 Serial Peripheral Interface (SPI)............................................................................................................................................... 259
19.0 Inter-Integrated Circuit (I
20.0 Universal Asynchronous Receiver Transmitter (UART) ........................................................................................................... 273
21.0 Enhanced CAN (ECAN™) Module........................................................................................................................................... 279
22.0 High-Speed 10-bit Analog- to-Digital Converter (ADC)...................................... ........................... ............................................ 305
23.0 High-Speed Analog Comparato r......................... .................................................... ................................................................. 329
24.0 Special Features...................................................................................................................................................................... 333
25.0 Instruction Set Summary .......................................................................................................................................................... 341
26.0 Development Support............................................................................................................................................................... 349
27.0 Electrical Characteristics.......................................................................................................................................................... 353
28.0 Packaging Information. ................................................................. ............................................................................................ 389
Appendix A: Migrating from dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 to dsPIC33FJ32GS406/606/608/610
and dsPIC33FJ64GS406/606/608/610 Devices ................................................................................................................................ 403
Appendix B: Revision History............................................................................................................................................................. 404
Index ................................................................................................................................................................................................. 409
The Microchip Web Site.............. ....................................................................................................................................................... 415
Customer Change Notification Service .............................................................................................................................................. 415
Customer Support..............................................................................................................................................................................415
Reader Response.............................................................................................................................................................................. 416
Product Identification System............................................................................................................................................................ 417
2
C™) ................................................................................................................................................. 265
2010 Microchip Technology Inc. Preliminary DS70591C-page 17
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced.
If you have any questions or c omm ents r egarding t his publication, p lease c ontact the M arket ing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Web site; http://www.microchip.com
• Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
DS70591C-page 18 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

1.0 DEVICE OVERVIEW

Note: This data sheet summarizes the features
of the dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 families of devic es . It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site (www.micro­chip.com) for the latest dsPIC3 3F/PIC 24H Family Reference Manual sections.
This document cont a ins dev ice -specific information for the following dsPIC33F Digital Signal Controller (DSC) devices:
• dsPIC33FJ32GS406
• dsPIC33FJ32GS606
• dsPIC33FJ32GS608
• dsPIC33FJ32GS610
• dsPIC33FJ64GS406
• dsPIC33FJ64GS606
• dsPIC33FJ64GS608
• dsPIC33FJ64GS610 The dsPIC33FJ32GS406/606/608/610 and
dsPIC33FJ64GS406/606/608/610 families of devices contain extensiv e Di gital Signal Processo r (DSP) fun c­tionality with a high-performance 16-bit microcontroller (MCU) architecture.
Figure 1-1 shows a general block diagram of the core and peripheral modules in the dsPIC33FJ32GS406/ 606/608/610 and dsPIC33FJ64GS406/606/608/610 devices. Table 1-1 lists the functio ns of th e various pins shown in the pinout diagrams.
2010 Microchip Technology Inc. Preliminary DS70591C-page 19
16
OSC1/CLKI
OSC2/CLKO
V
DD, VSS
Timing
Generation
MCLR
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Brown-out
Reset
Precision
Reference
Band Gap
FRC/LPRC Oscillators
Regulator
Voltage
VCAP/VDDCORE
IC1-4
I2C1,2
PORTA
Instruction
Decode &
Control
PCH PCL
16
Program Counter
16-bit ALU
23
23
24
23
Instruction Reg
PCU
16 x 16
W Register Array
ROM Latch
16
EA MUX
16
16
8
Interrupt
Controller
PSV & Table Data Access
Control Block
Stack
Control
Logic
Loop
Control
Logic
Data Latch
Address
Latch
Address Latch
Program Memory
Data Latch
Literal Data
16
16
16
16
Data Latch
Address
Latch
16
X RAM
Y RAM
16
Y Data Bus
X Data Bus
DSP Engine
Divide Support
16
Control Signals to Various Blocks
ADC1
Timers
PORTB
Address Generator Units
1-5
CNx
UART1,2
PWM
9 x 2
PORTC
SPI1,2
OC1-4
Analog
Comparator 1-4
Note: Not all pins or features are implemented on all device pinout configurations. See pinout diagrams for the specific pins and features
present on each device.
ECAN1
QEI1,2
PORTD
PORTE
PORTF
PORTG
DMA
DMA
RAM
Controller
16
16
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

FIGURE 1-1: BLOCK DIAGRAM

DS70591C-page 20 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TABLE 1-1: PINOUT I/O DESCRIPTIONS
Pin Name
AN0-AN23 I Analog Analog input channels CLKI
CLKO
OSC1 OSC2
SOSCI SOSCO
CN0-CN23 I ST Change notification inputs. Can be software programmed for internal
C1RX C1TX
IC1-IC4 I ST Capture inputs 1/4 INDX1, INDX2, AINDX1
QEA1, QEA2, AQEA1 QEB1, QEB2, AQEB1 UPDN1
OCFA OCFB OC1-OC4
INT0 INT1 INT2 INT3 INT4
RA0-RA15 I/O ST PORTA is a bidirectional I/O port RB0-RB15 I/O ST PORTB is a bidirectional I/O port RC0-RC15 I/O ST PORTC is a bidirectional I/O port RD0-RD15 I/O ST PORTD is a bidirectional I/O port RE0-RE9 I/O ST PORTE is a bidirectional I/O port RF0-RF13 I/O ST PORTF is a bidirectional I/O port RG0-RG15 I/O ST PORTG is a bidirectional I/O port T1CK
T2CK T3CK T4CK T5CK
Legend: CMOS = CMOS compatible input or output Analog = Analog input I = Input
ST = Schmitt Trigger input with CMOS levels P = Power O = Output TTL = Transistor-Transistor Logic
Pin
Type
I/O
O
O
O
Buffer
Type
IOST/CMOS—External clock source input. Always associated with OSC1 pin function.
Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes. Always associated with OSC2 pin function.
I
ST/CMOS—Oscillator crystal input. ST buffer when configured in RC mode; CMOS
otherwise. Oscillator crystal output. Connects to crystal or resonator in Crystal Oscillator mode. Optionally functions as CLKO in RC and EC modes.
IOST/CMOS—32.768 kHz low-power oscillator crystal input; CMOS otherwise.
32.768 kHz low-power oscillator cry s tal output.
weak pull-ups on all inputs.
I
I I
I
I I
I I I I I
I I I I I
ST—ECAN1 bus receive pin.
ST ST
ST
CMOS
ST ST
ST ST ST ST ST
ST ST ST ST ST
ECAN1 bus transmit pin.
Quadrature Encoder Index Pulse input. Quadrature Encoder Phase A input in QEI mode. Auxiliary Timer External Clock/Gate input in Timer mode. Quadrature Encoder Phase A input in QEI mode. Auxiliary Timer External Clock/Gate input in Timer mode. Position Up/Down Counter Direction State.
Compare Fault A input (for Compare Channels 1 and 2) Compare Fault B input (for Compare Channels 3 and 4)
Compare Outputs 1 through 4 External Interrupt 0
External Interrupt 1 External Interrupt 2 External Interrupt 3 External Interrupt 4
Timer1 External Clock Input Timer2 External Clock Input Timer3 External Clock Input Timer4 External Clock Input Timer5 External Clock Input
Description
2010 Microchip Technology Inc. Preliminary DS70591C-page 21
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin
Type
Buffer
Type
Description
U1CTS U1RTS U1RX U1TX U2CTS U2RTS U2RX U2TX
SCK1 SDI1 SDO1 SS1, ASS1 SCK2 SDI2 SDO2 SS2
SCL1 SDA1 SCL2 SDA2
TMS TCK TDI TDO
CMP1A CMP1B CMP1C CMP1D CMP2A CMP2B CMP2C CMP2D CMP3A CMP3B CMP3C CMP3D CMP4A CMP4B CMP4C CMP4D
DACOUT 0 DAC output voltage EXTREF I Analog External Voltage Reference Input for the Reference DACs REFCLK 0 REFCLK output signal is a postscaled derivative of the system clock Legend: CMOS = CMOS compatible input or output Analog = Analog input I = Input
ST = Schmitt Trigger input with CMOS levels P = Power O = Output TTL = Transistor-Transistor Logic
I
O
I
O
I
O
I
O
I/O
I
O I/O I/O
I
O I/O
I/O I/O I/O I/O
I I I
O
I I I I I I I I I I I I I I I I
ST
ST
ST
ST
ST ST
— ST ST ST
— ST
ST ST ST ST
TTL TTL TTL
Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog Analog
UART1 clear to send UART1 ready to send UART1 receive UART1 transmit UART2 clear to send UART2 ready to send UART2 receive UART2 transmit
Synchronous serial clock input/output for SPI1 SPI1 data in SPI1 data ou t SPI1 slave synchronization or frame pulse I/O Synchronous serial clock input/output for SPI2 SPI2 data in SPI2 data ou t SPI2 slave synchronization or frame pulse I/O
Synchronous serial clock input/output for I2C1 Synchronous serial data input/output for I2C1 Synchronous serial clock input/output for I2C2 Synchronous serial data input/output for I2C2
JTAG Test mode select pin JTAG test clock input pi n JTAG test data input pin JTAG test data output pin
Comparator 1 Channel A Comparator 1 Channel B Comparator 1 Channel C Comparator 1 Channel D Comparator 2 Channel A Comparator 2 Channel B Comparator 2 Channel C Comparator 2 Channel D Comparator 3 Channel A Comparator 3 Channel B Comparator 3 Channel C Comparator 3 Channel D Comparator 4 Channel A Comparator 4 Channel B Comparator 4 Channel C Comparator 4 Channel D
DS70591C-page 22 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
TABLE 1-1: PINOUT I/O DESCRIPTIONS (CONTINUED)
Pin Name
Pin
Type
Buffer
Type
Description
FLT1-FLT23 SYNCI1-SYNCI4 SYNCO1-SYNCO2 PWM1L PWM1H PWM2L PWM2H PWM3L PWM3H PWM4L PWM4H PWM5L PWM5H PWM6L PWM6H PWM7L PWM7H PWM8L PWM8H PWM9L PWM9H
PGED1 PGEC1 PGED2 PGEC2 PGED3 PGEC3
MCLR
AV
DD P P Positive supply for analog modules
AVSS P P Ground reference for analog modules
DD P Positive supply for peripheral logic and I/O pins
V VCAP/VDDCORE P CPU logic filter capacitor connection VSS P Ground reference for logic and I/O pins Legend: CMOS = CMOS compatible input or output Analog = Analog input I = Input
ST = Schmitt Trigger input with CMOS levels P = Power O = Output TTL = Transistor-Transistor Logic
I
I O O O O O O O O O O O O O O O O O O O
I/O
I
I/O
I
I/O
I
I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the
ST ST
— — — — — — — — — — — — — — — — — — —
ST ST ST ST ST ST
Fault Inputs to PWM Module External synchronization signal to PWM Master Time Base PWM Master Time Base for external device synchronization PWM1 Low output PWM1 High output PWM2 Low output PWM2 High output PWM3 Low output PWM3 High output PWM4 Low output PWM4 High output PWM5 Low output PWM5 High output PWM6 Low output PWM6 High output PWM7 Low output PWM7 High output PWM8 Low output PWM8 High output PWM9 Low output PWM9 High output
Data I/O pin for programming/debugging communication Channel 1 Clock input pin for programming/debugging communication Channel 1 Data I/O pin for programming/debugging communication Channel 2 Clock input pin for programming/debugging communication Channel 2 Data I/O pin for programming/debugging communication Channel 3 Clock input pin for programming/debugging communication Channel 3
device.
2010 Microchip Technology Inc. Preliminary DS70591C-page 23
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
NOTES:
DS70591C-page 24 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610

2.0 GUIDELINES FOR GETTING STARTED WITH 16-BIT DIGITAL SIGNAL CONTROLLERS

Note 1: This data sheet summarizes the features
of the dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 family of devices. It is not intended to be a comprehensive reference source. To complement the information in this data sheet, refer to the “dsPIC33F/PIC24H Family Reference Manual”. Please see the Microchip web site (www.microchip.com) for the latest 74dsPIC33F/PIC24H Family Reference Manual sections.
2: Some registers and associated bits
described in this section may not be avail­able on all devices. Refer to Section 4.0 “Memory Organization” in this data sheet for device-specific register and bit information.
2.1 Basic Connection Requirements
Getting started with the dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 family of 16-bit Digital Signal Controllers (DSC) requires attention to a minimal set of device pin connections before proceeding with development. The following is a list of pin names, which must always be connected:
DD and VSS pins
•All V
(see Section 2.2 “Decoupling Capacitors”)
•All AV
•V
•MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
DD and AVSS pins (regardless if ADC module
is not used) (see Section 2.2 “Decoupling Capacitors”)
CAP/VDDCORE
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes (see Section 2.5 “ICSP Pins”)
source is used (see Section 2.6 “External Oscillator Pins”)
CAP/VDDCORE)”)
2.2 Decoupling Capacitors
The use of decoupling capacitors on every pair of power supply pins, such as V
SS is required.
AV Consider the following criteria when using decoupling
capacitors:
Value and type of cap a cito r: Reco mm endation of 0.1 µF (100 nF), 10-20V. This capacitor should be a low-ESR and have resonance frequency in the range of 20 MHz and higher. It is recommended that ceramic c apacitors be used.
Placement on the printed circuit board: The decoupling capacitors should be placed as close to the pins as possible. It is recommended to place the capacitors on the same side of the board as the device. If space is constricted, the capacitor can be placed on another layer on the PCB using a via; however, ensure that the trace length from the pin to the capacitor is within one-quarter inch (6mm) in length.
Handling high frequency noise: If the board is experiencing high frequency noise, upward of tens of MHz, add a second ceramic-type capaci­tor in parallel to the above described decoupling capacitor. The value of the second capacitor can be in the range of 0.01 µF to 0.001 µF. Place this second capacitor next to the primary decoupling capacitor. In high-speed circuit designs, consider implementing a decade pair of capacitances as close to the power and ground pins as possible. For example, 0.1 µF in parallel with 0.001 µF.
Maximizing performance: On the board layout from the power supply circuit, run the power and return traces to the decoupling cap acito rs firs t, and then to the device pins. This ensures that the decoupling capacitors are first in the power chain. Equally important is to keep the trace length between the capacitor and the power pins to a minimum, thereby reducing PCB track inductance.
DD, VSS, AVDD, and
2010 Microchip Technology Inc. Preliminary DS70591C-page 25
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
dsPIC33F
VDD
VSS
VDD
VSS
VSS
VDD
AVDD
AVSS
VDD
VSS
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
0.1 µF
Ceramic
C
R
V
DD
MCLR
0.1 µF
Ceramic
VCAP/VDDCORE
10
R1
Note 1: R 10 k is recommended. A suggested
starting value is 10 k. Ensure that the MCLR
pin VIH and VIL specifications are met.
2: R1 470 will limit any current flowing into
MCLR
from the external capacitor C, in the
event of MCLR
pin breakdown, due to Electrostatic Discharge (ESD) or Electrical Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C
R1
R
V
DD
MCLR
dsPIC33F
JP
FIGURE 2-1: RECOMMENDED
MINIMUM CONNECTION
2.2.1 TANK CAPACITORS
On boards with power traces running longer than six inches in length, it is suggested to use a tank capacitor for integrated circuits including DSCs to supply a local power source. The value of the tank capacitor should be determined based on the trace resistance that con­nects the power supply source to the device, and the maximum current drawn by the device in the applica­tion. In other words, select the tank capacitor so that it meets the ac ceptable volta ge sag at th e device . T ypical values range from 4.7 µF to 47 µF.
2.4 Master Clear (MCLR) Pin
The MCLR pin provides for two specific device functions:
• Device Reset
• Device programming and debugging. During device programming and debugging, the
resistance and capacitance that can be added to the pin must be considered. Device programmers and debuggers drive the MCLR specific voltage levels (V transitions must not be adversely affected. Therefore, specific values of R and C will need to be adjusted based on the application and PCB requirements.
For example, as shown in Figure 2-2, it is recommended that the capacitor C, be isolated from the MCLR
pin during programming and debugging
operations. Place the components shown in Figure2-2 within
one-quarter inch (6mm) from the MCLR
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
pin. Consequently,
IH and VIL) and fast signal
pin.
2.3 Capacitor on Internal Voltage Regulator (V
A low-ESR (< 5 Ohms) capacitor is required on the
CAP/VDDCORE pin, which is used to stabilize the
V voltage regulator output voltage. The V pin must not be connected to VDD, and must have a capacitor bet ween 4.7µF and 10 µF, 16V connected to ground. The type can be ceramic or tantalum. Refer to Section 27.0 “Electrical Characteristics” for additional information.
The placement of this capacitor should be close to the
CAP/VDDCORE. It is recommended that the trace
V length not exceed one-quarter inch (6 mm). Refer to Section 24.2 “On-Chip Voltage Regulator” for details.
DS70591C-page 26 Preliminary 2010 Microchip Technology Inc.
CAP/VDDCORE)
CAP/VDDCORE
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
13
Main Oscillator
Guard Ring
Guard Trace
Secondary Oscillator
14 15 16 17 18 19 20
2.5 ICSP Pins
The PGECx and PGEDx pins are used for In-Circuit Serial Programming™ (ICSP™) and debugging pur­poses. It is recommended to keep the trace length between the ICSP connec tor an d th e ICSP pi ns on th e device as short as possible. If the ICSP connector is expected to experience an ESD event, a serie s resistor is recommended, with the value in the range of a few tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the PGCx and PGDx pins are not recommended as they will interfere with the programmer/debugger communi­cations to the device. If such discrete components are an application requirement, they should be removed from the circuit during programming and debugging. Alternatively, refer to the AC/DC characteristics and timing requirements information in the respective device Flash programming specification for information on capacitive loading limits and pin input voltage high
IH) and input low (VIL) requirements.
(V Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device matches the physical connections for the ICSP to MPLAB ICE™.
For more information on ICD 2, ICD 3, and REAL ICE connection requirements, refer to the following documents that are available on the Microchip web site.
“MPLAB
“Using MPLAB
“MPLAB
“Using MPLAB® ICD 3” (poster) DS51765
“MPLAB® ICD 3 Design Advisory” DS51764
“MPLAB
“Using MPLAB
®
ICD 2, MPLAB® ICD 3, or MPLAB® REAL
®
ICD 2 In-Circuit Debugger User's
Guide” DS51331
®
®
®
ICD 2” (poster) DS51265
ICD 2 Design Advisory” DS51566
REAL ICE™ In-Circuit Debugger
User's Guide” DS51616
®
REAL ICE™” (poster) DS51749
2.6 External Oscillator Pins
Many DSCs have options for at least two oscillators: a high-frequency primary oscillator and a low-frequency secondary oscillator (refer to Section 9.0 “Oscillator Configuration” for details).
The oscillator circuit should be placed on the same side of the board as the device. Also, place the oscillator circuit close to the respective oscillator pins, not exceeding one-half inch (12 mm) distance between them. The load capacitors should be placed next to the oscillator itself, on the same side of the board. Use a grounded copper pour around the oscillator circuit to isolate them from surrounding circuits. The grounded copper pour should be routed directly to the MCU ground. Do not run any signal traces or power traces inside the ground pour. Also, if using a two-sided board, avoid any traces on the other side of the board where the crystal is placed. A suggested layout is shown in Figure 2-3.
FIGURE 2-3: SUGGESTED PLACEMENT
OF THE OSCILLATOR CIRCUIT
2010 Microchip Technology Inc. Preliminary DS70591C-page 27
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
2.7 Oscillator Value Conditions on Device Start-up
If the PLL of the target device is enabled and configured for the device start-up oscillator, the maximum oscil lator source freque ncy must be limit ed to 4 MHz < F start-up conditions. This means that if the external oscillator frequency is outside this range, the application must start-up in the FRC mode first. The default PLL settings after a POR with an oscillator frequency outside this range will violate the device operating speed.
Once the device powers up, the application firmware can initialize the PLL SFR s, CLKDIV, and PLLDBF to a suitable value, and then perform a clock switch to the Oscillator + PLL clock source. Note that clock switching must be enabled in the device Configuration Word.
IN < 8 MHz to comply with device PLL
2.8 Configuration of Analog and Digital Pins During ICSP Operations
If MPLAB ICD 2, ICD 3, or R EAL ICE i s sele cted as a debugger, it automatical ly ini tia liz es al l of the A/D input pins (ANx) as “digital” pins, by setting all bits in the ADPCFG and ADPCFG2 registers.
The bits in the re gister s that co rrespond to the A/D pin s that are initialized by MPLAB ICD 2, ICD 3, or REAL ICE, must not be cleared by the user application firmware; otherwise, communication errors will result between the debugger and the device.
If your application needs to use certain A/D pins as analog input pins during the debug session, the user application must clear the corresponding bits in the ADPCFG and ADPCFG2 registers during initialization of the ADC module.
When MPLAB ICD 2, ICD 3, or REAL ICE is used as a programmer, the user application firmware must correctly configure the ADPCFG and ADPCFG2 registers. Automatic initialization of these registers is only done during debugger operation. Failure to correctly configure the register(s) will result in all A/D pins being recogn ized as a nalog inpu t pins , res ulting in the port value being read as a logic '0', which may affect user application functionality.
2.9 Unused I/Os
Unused I/O pins s hould b e config ured as outputs and driven to a logic-low state.
Alternatively, connect a 1k to 10k resistor to V unused pins and drive the output to logic low.
SS on
2.10 Typical Application Connection Examples
Examples of typical applicati on connecti ons are shown in Figure 2-4 through Figure 2-11.
DS70591C-page 28 Preliminary 2010 Microchip Technology Inc.
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
VAC
IPFC
VHV_BUS
ADC Channel
ADC Channel
ADC Channel
PWM Output
|V
AC|
k
1
k
2
k
3
FET
dsPIC33FJ32GS406
Driver
IPFC
VOUTPUT
ADC Channel
ADC
ADC Channel
PWM
k
1
k
2
k
3
FET
dsPIC33FJ32GS406
V
INPUT
Channel Output
Driver

FIGURE 2-4: DIGITAL PFC

FIGURE 2-5: BOOST CONVERTER IMPLEMENTATION

2010 Microchip Technology Inc. Preliminary DS70591C-page 29
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
k
1
Analog
Comp.
k
2
k
7
PWM
PWM
ADC
Channel
ADC
Channel
5V Output
I
5V
12V Input
FET
Driver
dsPIC33FJ32GS606
k
5
k
4
k
3
k
6
k
7
Analog Comparator
Analog Comparator
ADC Channel
Analog Comparator
ADC
Channel
PWM
PWM
PWM
PWM
PWM
PWM
3.3V Output
12V Input
FET
Driver
FET
Driver
FET
Driver
dsPIC33FJ32GS608

FIGURE 2-6: SINGLE-PHASE SYNCHRONOUS BUCK CONVERTER

FIGURE 2-7: MULTI-PHASE SYNCHRONOUS BUCK CONVERTER

DS70591C-page 30 Preliminary 2010 Microchip Technology Inc.
Loading...
+ 388 hidden pages