Daewoo DHC-2300K Schematic

Manual
DVD PLAYER
DVD PLYAER
DHC
CONTENTS
-
2300K
1. Precautions
2. Reference Information
3. Product Specification
4. Operating Instructions
5. Disassembly and Reassembly
6. Troubleshooting
7. Electrical Part List
8. Block Diagram
9. PCB Diagrams
11. Schematic Diagrams
should not exposed Meter
1. Precautions
1-1 Safety Precautions
1) Before returning an instrument to the customer,
and then in the OFF position, measure from a always make a safety check of the entire instrument, including, but not limited to, the following items:
(1) Be sure that no built-in protective devices are defective or have been defeated during servicing. (1) Protective shields are provided to protect both the technician and the customer. Correctly replace all missing protective shields, including any remove for servicing convenience. (2) When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place all protective devices, including, but not limited to, nonmetallic control knobs, insulating fish papers, adjustment and compartment covers/shields, and isolation resistor/capacitor networks. Do not operate this instrument or permit it to be operated without all protective devices correctly installed and functioning.
known earth ground (metal water pipe, conduit,
etc.) to all exposed metal parts of the
instrument (antennas, handle brackets, metal
cabinets, screwheads, metallic overlays,
control shafts, etc.), especially and exposed
metal parts that offer an electrical return path
to the chassis.
Any current measured must not exceed 0.5mA. Reverse the instrument power cord plug in the outlet and repeat the test. See Fig. 1-1. Any measurements not within the limits specified herein indicate a potential shock hazard that must be eliminated before returning the instrument to the customer.
(Reading
Device
Under
Test
Test all
Sufaces
be above
0.5mA)
(2) Be sure that there are no cabinet openings
through which adults or children might be able to insert their fingers and contact a hazardous voltage. Such openings include, but are not limited to, excessively wide cabinet ventilation slots, and an improperly fitted and/or incorrectly secured cabinet back cover.
(3) Leakage Current Hot Check-With the
instrument completely reassembled, plug the AC line cord directly into a 120V AC outlet. (Do not use a isolation transformer during this test.) Use a leakage current tester or a metering system that complies with American National Standards institute (ANSI) C101.1 Leakage
Current for Appliances and Underwriters Laboratories (UL) 1270 (40.7). With the instrument’s AC switch first in the ON position
2-Wire Cord
Also test with Plug
reserved (Using AC
adapter Plug as
Fig. 1-1 AC Leakage Test
(4) Insulation Resistance Test Cold Check-(1)
Unplug the power supply cord and connect a jumper wire between the two prongs of the plug. (2) Turn on the power switch of the instrument. (3) Measure the resistance with an ohmmeter between the jumpered AC plug and all exposed metallic cabinet parts on the instrument, such as screwheads, antenna, control shafts, handle brackets, etc. When an exposed metallic part has a return path to the chassis, the reading should be between 1 and 5.2 megohm. When there is no return path to the chassis, the reading must be infinite. If the reading is not
Earth Ground
2
Safety Precautions
(5) within the limits specified, there is the possibility
the AC power cord for damage. of a shock hazard, and the instrument must be re-pared and rechecked before it is returned to the customer. See Fig. 1-2.
Antenna Terminal
Exposed Metal Part
ohm
Fig. 1-2 Insulation Resistance Test
2) Read and comply with all caution and safety related notes non or inside the cabinet, or on the chassis.
3) Design Alteration Warning-Do not alter of add to the mechanical or electrical design of this instrument. Design alterations and additions, including but not limited to, circuit modifications and the addition of items such as auxiliary audio output connections, might alter the safety characteristics of this instrument and create a hazard to the user. Any design alterations or additions will make you, the service, responsible for personal injury or property damage resulting there from.
4) Observe original lead dress. Take extra care to assure correct lead dress in the following areas: (1) near sharp edges, (2) near thermally hot parts (be sure that leads and components do not touch thermally hot parts), (3) the AC supply, (4) high voltage, and (5) antenna wiring. Always inspect in all areas for pinched, out-of-place, or frayed wiring, Do not change spacing between a component and the printed-circuit board. Check
ohmmeter
5) Components, parts, and/or wiring that appear to have overheated or that are otherwise damaged should be replaced with components, parts and/or wiring that meet original specifications. Additionally determine the cause of overheating and/or damage and, if necessary, take corrective action to remove and potential safety hazard.
6) Product Safety Notice-Some electrical and mechanical parts have special safety-related characteristics which are often not evident from evisual inspection, nor can the protection they give necessarily be obtained by replacing them with components rated for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading, an ( ) or a ( ) on schematics and parts lists. Use of a substitute replacement that does not have the same safety characteristics as the recommended replacement part might created shock, fire and/or other hazards. Product safety is under review continuously and new instructions are issued whenever appropriate.
3
1-2 Servicing Precautions
CAUTION : Before servicing Instruments covered
(3) The components used in the unit have a by this service manual and its supplements, read and follow the Safety Precautions section of this manual.
Note : If unforeseen circument create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions. Remember: Safety First.
1-2-1 General Servicing Precautions
(1) a. Always unplug the instrument’s AC power cord from the AC power source before (1) re­ moving or reinstalling any component, circuit board, module or any other instrument assembly, (2) disconnecting any instrument electrical plug or other electrical connection,
specified flame resistance and dielectric
strength.
When replacing components, use components
which have the same ratings. Components I-
enti-fied by shading, by ( ) or by ( ) in the
circuit diagram are important for safety or for the
characteristics of the unit. Always replace them
with the exact replacement components.
(4) An insulation tube or tape is sometimes used
and some components are raised above the printed wiring board for safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install such elements as they were.
(5) After servicing, always check that the removed (3) connecting a test substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service manual might be equipped. c. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. d. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the test instrument positive lead. Always remove the test instrument ground lead last.
Note : Refer to the Safety Precautions section ground lead last.
screws, components, and wiring have been installed correctly and that the portion around the serviced part has not been damaged and so on. Further, check the insulation between the blades of the attachment plug and accessible conductive parts.
1-2-2 Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet
and turn the power ON. Connect the insulation
resistance meter (500V) to the blades of the
attachment plug. The insulation resistance between
each blade of the attachment plug and accessible
conductive parts(see note) should be more than 1
Megohm.
(2) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the printed or indicated service precautions and service materials.
Note : Accessible conductive parts include metal
panels, input terminals, earphone jacks, etc.
4
1-3 ESD Precautions
Electrostatically Sensitive Devices (ESD)
its protective package until immediately before you
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD devices are integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.
(1) Immediately before handling any semiconductor
components or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which
(7) Immediately before removing the protective
CAUTION : Be sure no power is applied to the
chassis or circuit, and observe all other safety
precautions.
(8) Minimize bodily motions when handling
are ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive materials).
materials from the leads of a replacement ESD device touch the protective material to the chassis or circuit assembly into which the device will be installed.
unpackaged replacement ESD devices. should be removed for potential shock reasons prior to applying power to the unit under test.
(2) After removing an electrical assembly equipped
with ESD devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
(3) Use only a grounded-tip soldering iron to solder
or unsolder ESD device.
(4) Use only an anti-static solder removal devices.
Some solder removal devices not classified as “anti-static” can generate electrical charges sufficient to damage ESD devices.
(Otherwise harmless motion such as the
brushing together of your clothes fabric or the
lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage
an ESD device).
(5) Do not use freon-propelled chemicals. These
can generate electrical charges sufficient to damage ESD devices.
(6) Do not remove a replacement ESD device from
5
2. Reference Information
2-1 Component Descriptions
2-1-1 DVD ATAPI LOADER (DSL-710A)
* D.C. Power Supply
A 4-pin shrouded, keyed male connector is used to provide the D.C. Power. The pin assignment is described below.
PIN DC VOLTS 1 +12V 2 GND 3 GND 4 +5V
Figure-1 D.C. Power Connector
* Interface Connector
A 39-pin male, unshielded, shrouded, keyed connector are applied. Please refer to Section 7-2-3 regarding its pin definition.
39 1 40 2 Interface Connector
* Electrical Charateristics
1. Power
1-1. Voltage +5V DC with ±5% tolerance, less than 100mVp-p Ripple Voltage
+12V DC with ±10% tolerance, less than 150mVp-p Ripple Voltage
1-2. Current
Continuous Reading
Seeking & Spin up
+5V DC 500mA (Average)
+12V DC 300mA (Average)
+5V DC 0.8 A (Maximum)
+12V DC 1.5 A (Maximum)
2. Signal Summary The physical interface consists of single ended TTL compatible receivers.
3. Connector Pin Definition
6
Component Descriptions
I/F Signals I/O Pin # I/F Signals I/O Pin # Reset 1 DMARQ 21
GND 2 GND 22 DD7 3 DIOW 23 DD8 4 GND 24 DD6 5 DIOR 25 DD9 6 GND 26 DD5 7 IORDY 27 DD10 8 CSEL 28 DD4 9 DMACK 29 DD11 10 GND 30 DD3 11 INTRQ 31 DD12 12 IOCS16 32 DD2 13 DA1 33 DD13 14 PDIAG 34 DD1 15 DA0 35 DD14 16 DA2 36 DD0 17 CS1FS 37 DD15 18 CS3FS 38 GND 19 DASP 39 NC 20 GND 40
Appendix 1. DSL-710A Block Diagram
Disc
Disc Motor Unit
Laser
Pickup
Spindle
Motor
BA6664FM
Spindle Motor Drive
Focus
Coil
Actuator Signal
Track
Coil
4Ch Motor Drive
Sled
Motor
BA5954FP
Spindle Motor Signal for CLV
MT1366
(RF AMP.)
Laser Driver
Equalizer
Error Gen.
Loading
Motor
Motor Signal
33.86MHz
MT1368
(Decoder/Servo)
ATAPI
Buffer Manager
Demodulator
Error Correction
PLl
Focus & Tracking
Feeding Loading
DRAM (4Mbit)
I/F
Conn.
5V
GND
Flash
Memory
(1Mbit)
80C52
System Controller
GND
12V
7
Component Descriptions
Appendix 2. Key-Components List
Items Model No. Maker Location
Spindle Motor
Loading Motor
Sled Motor
Laser Pick-up SF-HD3 Sanyo Japan Actuator Drive BA5954FP Rohm Japan Spindle Motor Drive BA6664FM Rohm Japan RF Amp. MT1366 Media Tek Taiwan Servo / DSP MT1368 Media Tek Taiwan
DMDSPC41C Samsung Korea RSM-2811F Samhongsa Korea
RF-300CA-11440 Mabuchi Japan MDN3BL3CSA Matsushita Japan RF-300CA-11440 Mabuchi Japan MDN3BL3CSA Matsushita Japan
8
Component Descriptions
2-1-2 Fiber Optic Transmitting Module for Digital Audio Eqipments (TOTX178)
* Recommended Operating Conditions
Item Symbol Min. Typ. Max. Unit Supply Voltage Vcc 4.75 5.0 5.25 V High Level Input Voltage VIH 2.0 - Vcc V Low Level Input Voltage VIL 0 - 0.8 V
9
10
Component Descriptions
2-1-3 NTSC/PAL Digital Video Encoder (ADV7170)
Comonent Descriptions
mA
11
12
Comonent Descriptions
13
Component Descriptions
2-1-4 DVD Processor Chip (Swan-2TM ES4318)
* Features
l Single-chip DVD video decoder in a 208-pin PQFP package l Supports MPEG-1 system and MPEG-2 program streams l Programmable multimedia processor architecture l Compatible with Audio CD, Video CD, VCD 3.0, and Super Video CD(SVCD) l DVD Navigation 1 l Built-in Content Scrambling System(CSS)
- Audio
l Built-in Karaoke key-shift function l DolbyTM Digital 2-channel downmix audio output for DolbyTM l Dolby Pro Logic l Linear PCM streams for 24 bit / 96KHz l Concurrent S/PDIF out and 2-channel audio output l Sensaura Dolby Digital Virtual Surround l DTS Digital Surround 2-channel downmix stereo output l S/PDIF output for encoded AC-3, DTS Digital output or Linear PCM
- Peripheral
l Glueless unterface to DVD loaders (ATAPI or A/V bus I/F) l Bidirectional I2C audio interface l Direct servo / loader interface l 8 general-purpose auxiliary ports l Single 27MHz clock input
- Smart Technology
l SmartZoom l SmartScale l SmartStream
TM
for motion zoom & pan
TM
for NTSC to PAL conversion and vice versa
TM
for video error concealment
14
Component Descriptions
* Functional Description
15
Component Descriptions
* Pinout Diagram
16
Component Descriptions
*PIN DESCRIPTION
Name Number I/O Definition
1, 9, 18, 27, 35, 44, 51, 59, 68, 75, 83,
VCC
LA[21:0] 23:19,16:10,7:2,207:204 O Device address output.
VSS
RESET# 24 I Reset input, active low.
TDMDX O TDM transmit data
RSEL 25 I
TDMDR 28 I TDM receive data.
TDMCLK 29 I TDM clock input.
TDMFS 30 I TDM frame synch.
TDMTSC# 31 O TDM output enable, active low.
TWS
SEL_PLL1
TSD
SEL_PLL0
SEL_PLL2 36
MCLK 39 I/O Audio master clock for audio DAC. TBCK 40 I/O Audio transmit bit clock.
SDIF_DOBM 41 O S/PDIF (IEC958)Format Output.
RSD 45 I Audio receive serial data.
RWS 46 I Audio receive frame synch.
RBCK 47 I Audio receive bit clock.
APLLCAP 48 I Analog PLL Capacitor.
XIN 49 I Crystal input.
XOUT 50 O Crystal output.
DMA[11:0] 66:61, 58:53 O DRAM address bus.
DCAS# 69 O Column address strobe, active low.
DOE#
DSCK_EN
DWE# 71 O DRAM write enable, active low.
DRAS[2:0]# 74:72 O Row address strobe, active low.
DB[15:0] 96:93, 90:85, 82:77 I/O DRAM data bus.
DCS[1:0]# 97, 100 O SDRAM chip select [1:0], active low.
DQM 101 O Data input / output mask. DSCK 102 O Clock to SDRAM. DCLK 105 I Clock Input(27MHz).
YUV[7:0] 115:113, 110:106 O 8-bit YUV output.
PCLK2XSCN 116 I/O 2X pixel clock.
PCLKQSCN 117 I/O Pixel clock.
1. VSY NC H#
121, 130, 139, 148, 157, 164, 172, 183,
8,17,26,34,43,52,60,67,76,84,91,98,103, 38,147,156,163,171,177,184,192,200,20
92, 99, 104, 111,
193, 201
112,120,129,1
8
32
33
70
118 I/O
I 3.65 V ± 150 mv.
I Ground.
ROM Select
RSEL Selection 0 16-bit ROM 1 8-bit ROM
O
I
O
I
0 0 2.5 x DCLK 0 1 3 x DCLK 1 0 3.5 x DCLK 1 1 4 x DCLK
Select PLL2. See the table for pin number
O
I
Audio transmit frame sync.
Select PLL1.
Audio transmit serial data port.
Select PLL0.
SEL_PLL2 SEL_PLL0 Clock
Output
33.
Output enable, active low.
Clock enable, active low.
Vertical synch for screen video interface,
programmable for rising or falling edge,
active low.
17
Component Descriptions
Name Number I/O Definition
Horizontal synch for screen video
HSYNCH# 119 I/O
HD[15:0] 141:140, 137:131, 128:122 O Host data bus HCS1FX# 152 O Host select 1. HCS3FX# 153 O Host select 3.
HIOCS16# 151 I Device 16-bit data transfer.
HA[2:0] 158, 155:154 I/O Host address bus.
VPP 159 I Peripheral protection voltage.
HWR#/DCI_
ACK#
HRD#DCI_C
LK
HD[15:0] 141:140, 137:131, 128:122 I/O Host data bus.
HWRQ# 142 O Host write request.
HRDQ# 143 O Host read request.
HIRQ 144 I/O Host interrupt.
HRST# 145 O Host reset.
HIORDY 146 I Host I/O ready
HWR# 149 O Host write request.
AUX[7:0] 169:165, 162:160 I/O Auxiliary ports.
LOE# 170 O Device output enable, active low.
LCS[3:0]# 176:173 O Chip select[3:0], active low.
LD[15:0] 197:194, 191:185, 182:178 I/O Device data bus.
LWRLL# 198 O Device write enable, active low.
LWRHL# 199 O Device write enable, active low.
NC 37, 38, 42, 203:202 No Connect pins. Leave open
149 I,I 150 I,I Host read/DCI Interface Clock.
interface, programmable for rising or falling
edge, active low.
Host write/DCI Interface Acknowledge
Signal, active low.
18
Component Descriptions
2-1-5 DIGITAL-TO-ANALOG STEREO AUDIO CONVERTER (CS4391)
19
Component Descriptions
20
Component Descriptions
21
Component Descriptions
22
Component Descriptions
2-1-6 DIGITAL-TO-ANALOG STEREO AUDIO CONVERTER (CS4340)
23
Component Descriptions
24
Component Descriptions
25
Component Descriptions
ABSOLUTE Maximum Ratings Power Suppiy Voltage……………………………6.0V Input Current………………………………………15mA Power Dissipatron…………………………………75mW Operating Temperature Range………………….-55~+125°C Storage Tenperature……………………………..-65~+150°C
26
Component Descriptions
2-1-7 8-BIT MTP MICROCONTROLLER (W78LE52)
* FEATURES
Fully static design 8-bit CMOS microcontroller 256 bytes of on-chip scratchpad RAM 8 KB electrically erasable/programmable MTP-ROM 64 KB program memory address space 64 KB data memory address space Four 8-bit bi-directional ports Three 16-bit timer/counters One full duplex serial port(UART) Watchdog Timer Eight sources, two-level interrupt capability EMI reduction mode Built-in power management Code protection mechanism Code protection mechanism
* PIN CONFIGURATIONS
27
Component Descriptions
* PIN DESCRIPTION
SYMBOL DESCRIPTIONS
EXTERNAL ACCESS ENABLE: This pin forces the processor to execute out of
EA#
PSEN#
ALE
RST
XTAL1 XTAL2 CRYSTAL2: This is the crystal oscillator output. It is the inversion of XTAL1.
VSS GROUND: Ground potential VDD POWER SUPPLY: Supply voltage for operation.
P0.0 - P0.7
P1.0 - P1.7
P2.0 - P2.7
P3.0 - P3.7
P4.0 - P4.3
external ROM. It should be kept high to access internal ROM. The ROM address and
data will not be presented on the bus if EA pin is high and the program counter is
within on-chip ROM area. PROGRAM STORE ENABLE: PSEN enables the external ROM data onto the Port 0 address/ data bus during fetch and MOVC operations. When internal ROM access is
performed, no PSEN strobe signal outputs from this pin.
ADDRESS LATCH ENABLE: ALE is used to enable the address latch that separates
the address from the data on Port 0.
RESET: A high on this pin for two machine cycles while the oscillator is running
resets
the device.
CRYSTAL1: This is the crystal oscillator input. This pin may be driven by an external
clock.
PORT 0: Port 0 is a bi-directional I/O port which also provides a multiplexed low
order
address/data bus during accesses to external memory. The pins of Port 0 can be
individually configured to open-drain or standard port with internal pull-ups.
PORT 1: Port 1 is a bi-directional I/O port with internal pull-ups. The bits have
alternate
functions which are described below:
T2(P1.0): Timer/Counter 2 external count input
T2EX(P1.1): Timer/Counter 2 Reload/Capture control
PORT 2: Port 2 is a bi-directional I/O port with internal pull-ups. This port also
provides the upper address bits for accesses to external memory.
PORT 3: Port 3 is a bi-directional I/O port with internal pull-ups. All bits have alternate
functions, which are described below: RXD(P3.0) : Serial Port receiver input
TXD(P3.1) : Serial Port transmitter output
INT0 (P3.2) : External Interrupt 0
INT1(P3.3) : External Interrupt 1 T0(P3.4) : Timer 0 External Input T1(P3.5) : Timer 1 External Input
WR(P3.6) :External Data Memory Write Strobe RD(P3.7) : External Data Memory Read Strobe
PORT 4: Another bit-addressable bidirectional I/O port P4. P4.3 and P4.2 are
alternative function pins. It can be used as general I/O port or external interrupt input
sources (INT2 / INT3 ).
28
Component Descriptions
* BLOCK DIAGRAM
* ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL MIN. MAX. UNIT DC Power Supply VDD-VSS -0.3 +7.0 V Input Voltage VIN VSS -0.3 VDD +0.3 V Operating Temperature Storage Temperature TST -55 +150 °C
TA 0 70 °C
29
Component Descriptions
2-1-8 Serial EEPROM, 2K (256 x 8) (AT24C02)
* Features
• Low-Voltage and Standard-Voltage Operation – 5.0 (V CC = 4.5V to 5.5V) – 2.7 (V CC = 2.7V to 5.5V) – 2.5 (V CC = 2.5V to 5.5V) – 1.8 (V CC = 1.8V to 5.5V)
• Internally Organized 128 x 8 (1K), 256 x 8 (2K), 512 x 8 (4K),1024 x 8 (8K) or 2048 x 8 (16K)
• 2-Wire Serial Interface
• Schmitt Trigger, Filtered Inputs for Noise Suppression
• Bidirectional Data Transfer Protocol
• 100 kHz (1.8V, 2.5V, 2.7V) and 400 kHz (5V) Compatibility
• Write Protect Pin for Hardware Data Protection
• 8-Byte Page (1K, 2K), 16-Byte Page (4K, 8K, 16K) Write Modes
• Partial Page Writes Are Allowed
• Self-Timed Write Cycle (10 ms max)
• High Reliability – Endurance: 1 Million Write Cycles – Data Retention: 100 Years – ESD Protection: >3000V
• Automotive Grade and Extended Temperature Devices Available
• 8-Pin and 14-Pin JEDEC SOIC, 8-Pin PDIP, 8-Pin MSOP, and 8-Pin TSSOP Packages
* Pin Configurations
* Pin Description
Pin Name Function A0 - A2 Address Inputs SDA Serial Data SCL Serial Clock Input WP Write Protect NC No Connect
30
Component Descriptions
2-1-9 4-Megabit (512K x 8) FLASH (A29040)
* Features
• 5.0V±40% for read and write operations
• Access time –70max
• Current –20 mA typical active read current –30 mA typical program/erase current –1µA typical CMOS Standby
• Flexible sector architecture – 8 uniform sectors of 64 Kbyte each – Any combination of sectors can be erased – Supports full chip erase – Sector protection
• Embedded Erase Algorithms
• Typical 100,000 program/erase cycles per sector
• Compatible with FEDEC-standards
* Pin Configurations
31
Component Descriptions
Block Diagram
* Absolute Maximum Ratings*
Ambient Operating Temperature ...................... -55°C to +125°C
Storage Temperature ...................................…. -65°C to +150°C
VOC Ground .……………………………………..-2.0V to +7.0V Output Voltage…………………………………… -2.0V to +7.0V
32
Component Descriptions
2-1-10 512K X 16 Bit X 2 Banks Synchronous DRAM (A43L0616)
Features
n JEDEC standard 3.3V power supply n LVTTL compatible with multiplexed address n Dual banks / Pulse RAS n MRS cycle with address key programs
- CAS Latency (2,3)
- Burst Length (1,2,4,8 & full page)
- Burst Type (Sequential & Interleave)
n All inputs are sampled at the positive going edge of the n system clock n Burst Read Single-bit Write operation n DQM for masking n Auto & self refresh n 64ms refresh period (4K cycle) n 50 Pin TSOP (II)
Pin Configuration
33
Component Descriptions
Block Diagram
Pin Descriptions
Symbol Name Description
CLK System Clock Active on the positive going edge to sample all inputs.
CS Chip Select
CKE Clock Enable
A0~A10/AP Address
BA Bank Select Address
RAS Row Address Strobe
CAS Column Address Strobe
WE Write Enable Enables write operation and Row precharge.
L(U)DQM Data Input/Output Mask
DQ0-15
VDD/VSS Power Supply/Ground Power Supply: +3.3V±0.3V/Ground
VDDQ/VSSQ
NC/RFU No Connection
Data Input/Output Data inputs/outputs are multiplexed on the same pins.
Data Output
Power/Ground
Disables or Enables device operation by masking or enabling all inputs exceptCLK, CKE and L(U)DQM Masks system clock to freeze operation from the next clock cycle. CKE should be enabled at least one clock + tss prior to new command. Disable input buffers for power down in standby. Row / Column addresses are multiplexed on the same pins. Row address : RA0~RA10, Column address: CA0~CA7 Selects bank to be activated during row address latch time. Selects band for read/write during column address latch time. Latches row addresses on the positive going edge of the CLK with RAS low. Enables row access & precharge. Latches column addresses on the positive going edge of the CLK with CAS low. Enables column access.
Makes data output Hi-Z, t SHZ after the clock and masks the output. Blocks data input when L(U)DQM active.
Provide isolated Power/Ground to DQs for improved noise immunity.
34
3. Product Specifications
n Playback System
DVD Video Video CD (1.1, 2.0, 3.0) SVCD and CVD CDDA CD-ROM with MP3 data
n Television Signal System
NTSC/PAL
n Video Performance
Video Out 1 Vpp into 75 ohm S-Video Out Component Out 0.7 Vpp into 75 ohm
D/A Converter 27MHz / 10bit
n Audio Performance
Frequency Response
Output Level D/A Converter 96KHz/24bit
Y : 1 Vpp into 75 ohm C : 0.286 Vpp into 75 ohm
DVD : fs 48/96KHz, 4Hz ~ 22/44KHz Video CD : fs 44.1KHz, 4Hz ~ 20KHz Audio CD : fs 44.1KHz, 4Hz ~ 20KHz
Analog : 2Vrms (1 KHz) Digital : 1.15 Vpp
S/N Ratio 110 dB
35
AC 90~250V, 50/60Hz
Product Specifications
n Connections
Coaxial digital out X1 Audio Analog out for 2-channel X1 SCART connector for Component Video X1 SCART connector for External Video X1 (option) Composite Video out X1 S-Video out X1 Optical out X1
n Power Supply
Power Source
n Set
Power Consumption < 25 Watt
Dimensions (W X H X D) 420 X 84 X 270 (mm ) Net Weight 3.6 Kg
Gross Weight 4.9 Kg
36
4. Operating Instructions
4-1 Basic Connections
Connecting to audio equipment
Audio equipment
TV set
S-Video cable (optional) To S-Video input connector Video/audio cable (supplied) To video input connector (yellow)
Audio cable (optional)
Connecting to a monaural TV set
Video/audio cable (supplied) To video input connector (yellow)
Audio cable (optional)
37
TV set
To coaxial digital audio input
To optical digital audio input
Operating Instructions
Connecting to a decoder with a Dolby Digital or DTS processing
Video/audio cable (supplied)
Coaxial audio cable (optional)
Optical audio cable (optional)
Decoder or Amplifier with
Front
Subwoofer
Centre
Front
Surround
Connecting to a stereo TV set
Surround
Video/audio cabl(supplied) To audio input connector (red, white)To video input connector
(yellow)
S-Video cable (optional)
38
Operating Instructions
4-2 Selecting Video MODE
Press SETUP button and select VIDEO submenu on SETUP screen. After that, select TV type by pressing
DOWN arrow button ( ) until desired TV mode is selected. For more information, refer to 7.2 Video on the Instruction Manual.
4-3 Selecting the desired DVD menu Item
When a DVD disc is loaded, select desired menu item using arrow
button or numeric button, if number for each menu item is displayed, then press the SELECT button to start play. To select subtitles, the forth menu item in the figure as shown right, press the RIGHT arrow button three times and press the SELECT button.
Example:
1. Press the RIGHT arrow button ( )
2. Press the RIGHT arrow button ( )
3. Press the RIGHT arrow button ( )
4. Press the SELECT button
4-4 Selecting the desired MP3 folder
When a MP3 disc is loaded, you may see the menu screen as shown right. To play a MP3 title, you should select a title under the desired folder. Use arrow button, select the folder, which you want to play, by pressing the SELECT button. If you press the SELECT button, you can see the file lists under the folder. To select DDROST folder in this case, press the SELECT button.
Example:
1. Press the SELECT button
39
Operating Instructions
4-5 Selecting the desired MP3 title
Use arrow button and select an MP3 title using the SELECT button then play will start automatically. When you know the title number, enter the MP3 title number using numeric buttons and press the SE­LECT button. If you want to play an adjacent MP3 title, press the NEXT button for next title and the PREV button for previous title during playing. To select “005 HAVEYOU” MP3 title in this case, press the DOWN arrow button twice and press the SELECT button.
Example:
1. Press the DOWN arrow button ( ▼)
2. Press the DOWN arrow button ( ▼)
3. Press the SELECT button
4-6 Searching
When you want to view the disc contents in fast forward or fast rev­ erse, you can do that by pressing FF/SF button( ) or FR/SR button ( ). There are total 6 steps for DVD, 4 steps for VCD and 2 steps for
CDDA in fast searching. They are FAST 2X, FAST 4X, FAST 8X, FAST 16X, FAST 32X and FAST 64X for both direction. To search at FAST 16X in forward direction, press the FF/SF button 4 times during play mode.
Example:
1. Press the FF/SF button ( )
2. Press the FF/SF button ( )
3. Press the FF/SF button ( )
4. Press the FF/SF button ( )
4-7 Resume Play
If power is OFF by pressing the POWER button during PLAY or PRESTOP state, play is resumed from the point where it was stopped. If you switch OFF by disconnecting AC cord, the machine will start playing from the first track or chapter.
Example:
Press the POWER button during play mode or prestop mode.
40
Operating Instructions
4-8 Slow Viewing
When you want to view the disc contents very slowly in forward or
reverse direction, you can do that by pressing the FF/SF button ( )
or the FR/SR button ( ) during pause mode. There are total 3 steps
for DVD and VCD. They are SLOW 1/2X, SLOW 1/4X and SLOW
1/8X for both direction. The slow reverse function is possible only
when a DVD disc is loaded. To view at slow 1/4X in forward direc-
tion, press the FF/SF button ( ) two times during pause mode.
Example:
1. press the PLAY/PAUSE button ( )
1. Press the FF/SF button ( )
2. Press the FF/SF button ( )
4-9 Selecting Audio Language
This function works only with discs on which multiple audio sound
track languages are recorded. If the loaded disc supports multiple
languages, you can see the AUD indicator on fluorescent display.
In the figure shown right, there are total 8 audio languages. To select
the third audio language, press the AUDIO button twice during play.
Example:
1. Press the AUDIO button
2. Press the AUDIO button
4-10 Selecting Subtitle Language
This function works only with discs on which multiple subtitle lan-
gauges are recorded. If the loaded disc supports multiple languages,
you can see the SUB-T indicator on fluorescent display. In the figure
shown right, there is only one subtitle language. To turn on the sub-
title language, press the SUBTITLE button. If you press it again,
you can turn off the subtitle language.
Example:
1. Press the SUBTITLE button
41
Operating Instructions
4-11 Selecting Angle
Some DVD discs may contain scenes, which have been shot simul­taneously from a number of different angles. If the loaded disc su-
pports multiple angles, you can see indicator on the fluorescent
display and the TV screen. In the figure shown right, there are total 9 angles. To switch to the angle number 2, press the ANGLE button.
Example:
1. Press the ANGLE button
42
Operating Instructions
Remained to be defined
43
5. Disassembly and Reassembly
Tray
· Door Tray
5-1 Cabinet and PCB
5-1-1 Door Tray Removal
1) Supply Power and open Tray .
2) Disassemble the Door Tray · in direction off arrow “A”.
3) Close Tray and power off.
Note : If Tray doesn’t open, insert a Screw driver ¹ into the Emergency hole ¸ (as shown in detailed drawing) and then turn it in the direction of arrow “B”. Open Tray manually.
¸ Emergency Hole
¹ Screw Driver
<Bottom View>
Fig 5-1 Door Tray Removal
44
Disassembly and Reassembly
5-1-2 Top Cabinet Removal
1) Remove 3 Screws on the back Top Cabinet.
2) Remove 2 Screws ·, ¸ on the left and right side.
3) Lift up the Top Cabinet in direction of arrow.
· 2 Screws 3 Screws
Fig 5-2 Top Cabinet Removal
¸ 2 Screws
45
Disassembly and Reassembly
5-1-3 PCB Cable Removal
1) Disconnect PCN1 ¶.
2) Disconnect PCN4 ·.
3) Disconnect LCN1 ¸.
4) Disconnect CON2 ¹.
5) Disconnect CON1 º.
6) Disconnect CON6 ».
7) Disconnect LCN7 7.
º CON1
¸ LCN1
PCN1
º CON6
· PCN4
○7LCN7
Fig 5-3 PCB Cable Removal
¹ CON2
46
Disassembly and Reassembly
5-1-4 PCB and Front Ass’y Removal
1) Remove 2 Screws on the back of the Cabinet.
2) Remove 8 Screws · and disassemble the Main PCB ¹ and SMPS PCB º.
3) Remove 5 Screws ¸ and disassemble the Front Ass’y ».
º SMPS PCB
· 8 Screws
¹ Main PCB
» Front Ass’y
¸ 5 Screws
Fig 5-4 PCB and Front Ass’y Removal
47
Disassembly and Reassembly
5-1-5 Loader Removal
1) Remove 4 Screws and disassemble the Loader ·.
4 Screws
· Loader
Fig 5-5 Loader Removal
48
7 Screws
Disassembly and Reassembly
5-1-6 Front PCB Removal
1) Remove 7 Screws and disassemble the Front PCB ¸ from the Front Ass’y ·.
`
¸ Front PCB
· Front Ass’y
Fig 5-6 Front PCB Removal
49
6. Troubleshooting
Trouble
No power Insert the AC power plug securely into the power outlet.
Action
No picture No sound Make sure that the equipment is connected properly.
Distorted sound No fast forward or fast
reverse No proper aspect ratio
No operations can be performed with the remote controller
No button operation
Audio soundtrack and/or Subtitle language is not the one you selected.
No Angle change
Make sure that the equipment is connected properly. Make sure that the input setting for the TV is Video (AV).
Make sure that the input settings for the TV and stereo system are correct. Some discs may have sections that prohibit fast forward or fast reverse.
Select the correct setup for TV aspect ratio that matches your TV set.
Check the batteries are installed with the correct polarities. Point the remote control unit at the remote control sensor and operate. Remove the obstacles between the remote control unit and remote control sensor.
Set the POWER button to OFF and then back to ON. Alternatively, turn off the power, disconnect the power plug and then reconnect it.
If the audio soundtrack and/or subtitle language does not exist on the disc, the language selected at the initial settings will not be seen.
This function is dependent on software availability. Even if a disc has a number of angles recorded, these angles may be recorded for specific scenes only.
50
Troubleshooting
Remained to be defined
51
7. Electrical Part List
1.Main board
5.1 Channel Single SCART
NO Spec Pak' Usa' No
ASS'Y MAIN
1 SMPS MANUAL 1 2 Hard Disc Cable, 25mm, 40Pin 1 3 DVD Loader, Mechanism Ass'y Ass'y 1
PCB ASS'Y, MAIN (T/U)
1 80C52(80C51), 40PIN DIP, MPU DIP 1 U701 2 PROGRAM MEMORY 512K * 8 DIP 1 U202
PCB ASS'Y, MAIN (M/I)
1 POWER CON', 12PIN, 2.54mm Strat 1 CON101 2 FRONT CON', WAFER,11PIN, 2.54mm strat 1 CON102 3 BOX HEADER, 20*2, 2.54mm 1 CON103 4 S-VHS CON, MINI DIN, SHILD 1 CON104
2CH Audio CON',6PIN JACK,SHILD, (W-W-Y,R-R-Y)
5
5.1CH Audio CON',6PIN JACK,SHILD, (W-W-B,R-R-B)
6 7 Coaxial CON', 1PIN JACK,SHILD, (B) PCB-L 1 CON108 8 SINGLE SCART, SHIELD,RIGHT ANGLE PCB-L 1 CON105
Sub PCB CON'9PIN, 2.54mm, (Main PCB insert)
9 10 Optical Connector for Audio 1 CON109 11 X-TAL, 11.0592MHZ,HC-49/S, 20pF HC-49/S 1 X601 12 X-TAL, 27MHZ,HC-49/S, 20pF HC-49/S 1 X201
PCB ASS'Y, MAIN (DIP)
1 40PIN, DIP, MPU SOCKET DIP 1 U701
2 32PIN, DIP, ROM SOCKET DIP 1 U202
PCB ASS'Y, MAIN (RAD)
1 ELEC' CAP', 100uF/16V,M 5mm 5 CE101,CE104,CE105,CE106,CE107
2 ELEC' CAP', 100uF/25V,M 5mm 3 CE102,CE103,CE526
3 ELEC' CAP', 10uF/16V,M 5mm 30 CE108,CE109,CE110,CE111,CE201,CE202,CE203,CE204,
4 ELEC' CAP', 10uF/25V,M 5mm 3 CE313,CE314,CE501
5 ELEC' CAP', 47uF/16V,M 5mm 2 CE301,CE401
6 ELEC' CAP', 22uF/16V,M 5mm 20 CE506,CE507,CE508,CE509,CE510,CE511,CE512,CE513,
7 ELEC' CAP', 470uF/25V,M 5mm 1 CE527
PCB ASS'Y, MAIN (SMD)
Location
PCB-L 1 CON106 PCB-L 1 CON107
1 CON110
CE205,CE206,CE207,CE303,CE304,CE305,CE306,CE307, CE308,CE309,CE310,CE311,CE312,CE315,CE316,CE317, CE318,CE320,CE321,CE322,CE323,CE701
CE514,CE515,CE516,CE517,CE518,CE519,CE520,CE521, CE522,CE523,CE524,CE525
52
xer, TWO
1 PCB, 2 LAYER FR4 1
2 CPU&RISC SINGLE CHIP PQFP 1 U201
3 Video Encoder, NTSC/PAL LQFP 1 U401
4 16M-SDRAM, 3.3V,400mil,512K*16*2 TSOP(II) 2 U204,U203
5 TTL, HEX INVERTER(FAST) SOIC 1 U206
6 TTL, HEX INVERTER SOIC 1 U207
7 EEPROM, 2KBIT,SOIC SOIC 1 U205
8 Streo DAC,192kHz,24BIt,20Pin SOIC 1 U301
9 Streo DAC,96kHz,24BIt,16Pin SOIC 2 U303,U302 10 DUAL OP-AMP SOIC 7 U304,U305,U306,U307,U308,U309.U310 11 Triple 2-Channel Multiple
SCART
12 WOUND INDUCT', 15uH,3225 SMD 4 L404,L407,L408,L409 13 CHIP POWER BEAD 3216 8 PL101,PL102,PL103,PL104,PL105,PL106,PL107,PL108 14 CHIP FERRITE BEAD 2012 38 EL101,EL102,EL104,EL105,EL106,EL107,EL108,PL109,
15 ZENER DIODE, 3.9V,350mW,SOT-23 SOT-23 1 D504 16 ZENER DIODE, 8.2V,350mW,SOT-23 SOT-23 0 17 Switching diode SOT-23 1 D503 18 Dual Diode, Common kethode SOT-23 4 D501,D502,D508,D509 19 RLS4148 SOT-23 1 D701 20 GENERAL TR, NPN SOT-23 37 Q501,Q502,Q504,Q506,Q507,Q508,Q509,Q510,Q511,
21 GENERAL TR, PNP SOT-23 0 22 Switching TR, NPN SOT-23 5 Q538,Q539,Q541,Q544,Q701 23 Switching TR, PNP SOT-23 5 Q540,Q542,Q545,Q550,Q702 24 CHIP RES', 1/10W,0 ΩJ 1608 14 R107,R203,R207,R209,R245,R252,R265,R406,
25 CHIP RES', 1/10W,10 ΩJ 1608 13 R202,R253,R254,R255,R256,R257,R258,R259,R260,
26 CHIP RES', 1/10W,100 ΩJ 1608 12 R561,R566,R571,R576,R581,R586,R591,R596,R601,
27 CHIP RES', 1/10W,1K ΩJ 1608 13 R266,R267,R507,R509,R514,R560,R562,R565,R567,
28 CHIP RES', 1/10W,10K ΩJ 1608 7 R350,R355,R358,R360,R701,R712,R715 29 CHIP RES', 1/10W,100K ΩJ 1608 33 R519,R522,R524,R527,R529,R532,R534,R537,R539,
30 CHIP RES', 1/10W,1M ΩJ 1608 3 R268,R269,R275 31 CHIP RES', 1/10W,22 ΩJ 1608 23 ER201,ER202,R301,R302,R303,R304,R305,R306,R307,
32 CHIP RES', 1/10W,220 ΩJ 1608 8 R270,R271,R272,R273,R274,R620,R621,R702 33 CHIP RES', 1/10W,33 ΩJ 1608 28 R219,R220,R221,R222,R223,R224,R225,R226,R227,
34 CHIP RES', 1/10W,330 ΩJ 1608 2 R103,R104
DMP 0
EL109,PL110,EL110,PL111,PL112,PL201,PL202,PL301, PL401,PL303,PL304,PL502,EL501,EL502,EL503,EL504, EL505,EL506,EL507,EL508,EL509,EL510,EL511,EL512, EL513,EL514,EL515,EL516,EL517,EL518
Q512,Q513,Q514,Q515,Q516,Q517,Q518,Q519,Q520, Q521,Q522,Q523,Q524,Q525,Q526,Q527,Q528,Q529, Q530,Q531,Q532,Q533,Q534,Q535,Q536,Q537,Q546, Q547
R501~R506
R261,R262,R263,R264
R606,R611,R616
R628,R629,R630,R631
R542,R544,R547,R549,R552,R554,R557,R558,R563, R568,R573,R578,R583,R588,R593,R598,R603,R608, R613,R632
R308,R309,R310,R311,R312,R313,R314,R315, R316,R317,R318,R319,R320,R321
R228,R229,R230,R231,R232,R233,R234,R235, R236,R237,R238,R246,R247,R248,R249,R250,R251, R401,R402
53
BC234,BC235,BC236,BC237,BC238,BC240,BC301,BC303,
35 CHIP RES', 1/10W,3.3K ΩJ 1608 27 R201,R334,R342,R345,R347,R361,R405,R520,R525,
R530,R535,R540,R545,R550,R555,R618,R619,R703, R705,R706,R707,R708,R709,R710,R713,R714,R717
36 CHIP RES', 1/10W,47 ΩJ 1608 9 R211,R212,R213,R214,R215,R216,R217,R218,R508 37 CHIP RES', 1/10W,470 ΩJ 1608 1 R404 38 CHIP RES', 1/10W,47K ΩJ 1608 2 R239,R240 39 CHIP RES', 1/10W,4.7K ΩJ 1608 9 R101,R102,R204,R241,R242,R243,R510,R511,R515 40 CHIP RES', 1/10W,5.6K ΩJ 1608 12 R322,R323,R324,R325,R326,R328,R330,R332,R349,
R352,R354,R357
41 CHIP RES', 1/10W,620 ΩJ 1608 8 R407,R408,R413,R414,R415,R416,R417,R418 42 CHIP RES', 1/10W,6.2K ΩJ 1608 2 R346,R348 43 CHIP RES', 1/10W,75 ΩJ 1608 9 R521,R526,R531,R536,R541,R546,R551,R556,R633 44 CHIP RES', 1/10W,91 ΩJ 1608 1 R106 45 CHIP RES', 1/10W,1.2K ΩJ 1608 4 R327,R329,R331,R333 46 CHIP RES', 1/10W,1.3K ΩJ 1608 20 R570,R572,R575,R577,580,R582,R585,R587,R590,
R592,R595,R597,R600,R602,R605,R607,R610,R612, R615,R617
46 CHIP RES', 1/10W,3.9K ΩJ 1608 6 R339,R343,R351,R353,R356,R359 47 CHIP RES', 1/10W,15K ΩJ 1608 1 R716 48 CHIP RES', 1/10W,20K ΩJ 1608 8 R538,R543,R548,R553, R518,R523,R528,R533
49 CHIP RES', 1/10W,300 ΩJ 1608 12 R559,R564,R569,R574,R579,R584,R589,R594,R599,R60
4,R609,R614
50 CHIP RES', 1/10W,9.31K ΩF 1608 3 R362,R363,R364 51 CHIP RES', 1/10W,18.7K ΩF 1608 3 R365,R366,R367 52 CHIP CAP', 25V,3pF,J,COG 1608 4 C402,C411,C414,C417 53 CHIP CAP', 25V,22pF,J,COG 1608 1 C202 54 CHIP CAP', 25V,2700pF,J,COG 1608 8 C302,C303,C304,C305,C310,C312,C314,C316 55 CHIP CAP', 25V,27pF,J,COG 1608 16 C203,C207,C208,C210,C211,C212,C403,C404,C412,
C413,C415,C416,C418, C419,C701,C702
56 CHIP CAP', 25V,33pF,J,COG 1608 6 C201,C220,C221,C222,C223,C224 57 CHIP CAP', 25V,330pF,J,COG 1608 4 C313,C315,C317,C321 58 CHIP CAP', 25V,47pF,J,COG 1608 10 TC201,C501,C502,C503,C504,C505,C506,C507,C508,
C530
59 CHIP CAP', 25V,470pF,J,COG 1608 12 C509,C510,C511,C512,C513,C514,C515,C516,C517,
C518,C519,C520
60 CHIP CAP', 25V,560pF,J,COG 1608 4 C306,C307,C308,C309 61 CHIP CAP', 25V,15pF,J,COG 1608 29 EC101,EC103,EC104,EC105,EC106,EC107,EC108,EC109,
EC110,EC111,C205,EC501,EC502,EC503, EC504,EC505,EC506,EC507,EC508,EC509,EC510,EC511, EC512,EC513,EC514,EC515,EC516,EC517,EC518
62 CHIP CAP', 25V,0.1uF,Z,Y5V 1608 98 BC101,BC102,BC103,C104,BC104,BC105,BC106,BC107,
BC108,BC109,BC110,BC111,BC112,BC200,BC201,BC202, BC203,BC204,BC205,C206,BC206,BC207,BC208,BC209, BC210,BC211,BC212,BC213,BC214,BC215,BC216,BC217, BC218,BC219,BC220,BC221,BC222,BC223,BC224,BC225, BC226,BC227,BC228,BC229,BC230,BC231,BC232,BC233,
BC304,BC305,BC306,BC307,BC308,BC309,BC310,BC311, BC312,BC313,BC314,BC315,BC316,BC317,BC318,BC319, BC320,BC321,BC322,BC323,BC325,BC326,BC327,BC328, BC329,BC330,BC331,BC332,BC333,BC334,BC401,C422, C423,C424,C425,C426,C427,C428,BC501,BC506,BC507, BC701
54
5.1CH Audio CON',6PIN JACK,SHILD,
Sub PCB CON'9PIN, 2.54mm, (Main PCB
5.1 Channel Dual SCART
NO Spec Pak' Usa' No
ASS'Y MAIN
1 SMPS MANUAL 1 2 Hard Disc Cable, 25mm, 40Pin 1 3 DVD Loader, Mechanism Ass'y Ass'y 1
PCB ASS'Y, MAIN (T/U)
1 80C52(80C51), 40PIN DIP, MPU DIP 1 U701 2 PROGRAM MEMORY 512K * 8 DIP 1 U202
PCB ASS'Y, MAIN (M/I)
1 POWER CON', 12PIN, 2.54mm Strat 1 CON101 2 FRONT CON', WAFER,11PIN, 2.54mm strat 1 CON102 3 BOX HEADER, 20*2, 2.54mm 1 CON103 4 S-VHS CON, MINI DIN, SHILD 1 CON104 5 2CH Audio CON',6PIN JACK,SHILD, (W-
W-Y,R-R-Y)
6
(W-W-B,R-R-B)
7 Coaxial CON', 1PIN JACK,SHILD, (B) PCB-L 1 CON108 8 DUAL SCART, SHIELD,RIGHT ANGLE PCB-L 1 CON105 9
insert)
10 Optical Connector for Audio 1 CON109 11 X-TAL, 11.0592MHZ,HC-49/S, 20pF HC-49/S 1 X601 12 X-TAL, 27MHZ,HC-49/S, 20pF HC-49/S 1 X201
PCB ASS'Y, MAIN (DIP)
1 40PIN, DIP, MPU SOCKET DIP 1 U701 2 32PIN, DIP, ROM SOCKET DIP 1 U202
PCB ASS'Y, MAIN (RAD)
1 ELEC' CAP', 100uF/16V,M 5mm 5 CE101,CE104,CE105,CE106,CE107 2 ELEC' CAP', 100uF/25V,M 5mm 3 CE102,CE103,CE526 3 ELEC' CAP', 10uF/16V,M 5mm 30 CE108,CE109,CE110,CE111,CE201,CE202,CE203,CE204,
4 ELEC' CAP', 10uF/25V,M 5mm 5 CE313,CE314,CE501,CE504,CE505 5 ELEC' CAP', 47uF/16V,M 5mm 2 CE301,CE401 6 ELEC' CAP', 22uF/16V,M 5mm 20 CE506,CE507,CE508,CE509,CE510,CE511,CE512,CE513,
7 ELEC' CAP', 470uF/25V,M 5mm 1 CE527
PCB ASS'Y, MAIN (SMD)
Location
PCB-L 1 CON106
PCB-L 1 CON107
1 CON110
CE205,CE206,CE207,CE303,CE304,CE305,CE306,CE307, CE308,CE309,CE310,CE311,CE312,CE315,CE316,CE317, CE318,CE320,CE321,CE322,CE323,CE701
CE514,CE515,CE516,CE517,CE518,CE519,CE520,CE521, CE522,CE523,CE524,CE525
55
1 PCB, 2 LAYER FR4 1 2 CPU&RISC SINGLE CHIP PQFP 1 U201 3 Video Encoder, NTSC/PAL LQFP 1 U401 4 16M-SDRAM, 3.3V,400mil,512K*16*2 TSOP(II) 2 U204,U203 5 TTL, HEX INVERTER(FAST) SOIC 1 U206 6 TTL, HEX INVERTER SOIC 1 U207 7 EEPROM, 2KBIT,SOIC SOIC 1 U205 8 Streo DAC,192kHz,24BIt,20Pin SOIC 1 U301 9 Streo DAC,96kHz,24BIt,16Pin SOIC 2 U303,U302
10 DUAL OP-AMP SOIC 7 U304,U305,U306,U307,U308,U309.U310
Triple 2-Channel Multiplexer, TWO SCART
11 12 WOUND INDUCT', 15uH,3225 SMD 4 L404,L407,L408,L409 13 CHIP POWER BEAD 3216 8 PL101,PL102,PL103,PL104,PL105,PL106,PL107,PL108 14 CHIP FERRITE BEAD 2012 38 EL101,EL102,EL104,EL105,EL106,EL107,EL108,PL109,
15 ZENER DIODE, 3.9V,350mW,SOT-23 SOT-23 1 D504 16 ZENER DIODE, 8.2V,350mW,SOT-23 SOT-23 2 D506.D507 17 Switching diode SOT-23 1 D503 18 Dual Diode, Common kethode SOT-23 4 D501,D502,D508,D509 19 RLS4148 SOT-23 1 D701 20 GENERAL TR, NPN SOT-23 40 Q501,Q502,Q503,Q504,Q505,Q506,Q507,Q508,Q509,
21 GENERAL TR, PNP SOT-23 1 Q543 22 Switching TR, NPN SOT-23 6 Q538,Q539,Q541,Q544.Q549,Q701 23 Switching TR, PNP SOT-23 5 Q540,Q542,Q545,Q550,Q702 24 CHIP RES', 1/10W,0 ΩJ 1608 8 R107,R203,R207,R209,R245,R252,R265,R406 25 CHIP RES', 1/10W,10 ΩJ 1608 13 R202,R253,R254,R255,R256,R257,R258,R259,R260,
26 CHIP RES', 1/10W,100 ΩJ 1608 12 R561,R566,R571,R576,R581,R586,R591,R596,R601,
27 CHIP RES', 1/10W,1K ΩJ 1608 18 R266,R267,R507,R509,R512,R514,R516,R560,R562,
28 CHIP RES', 1/10W,10K ΩJ 1608 7 R350,R355,R358,R360,R701,R712,R715 29 CHIP RES', 1/10W,100K ΩJ 1608 33 R518,R519,R522,R523,R524,R527,R528,R529,R532,
30 CHIP RES', 1/10W,1M ΩJ 1608 3 R268,R269,R275 31 CHIP RES', 1/10W,22 ΩJ 1608 23 ER201,ER202,R301,R302,R303,R304,R305,R306,R307,
32 CHIP RES', 1/10W,220 ΩJ 1608 8 R270,R271,R272,R273,R274,R620,R621,R702 33 CHIP RES', 1/10W,33 ΩJ 1608 28 R219,R220,R221,R222,R223,R224,R225,R226,R227,
34 CHIP RES', 1/10W,330 ΩJ 1608 2 R103,R104 35 CHIP RES', 1/10W,3.3K ΩJ 1608 27 R201,R334,R342,R345,R347,R361,R405,R520,R525,
DMP 2 U501,U502
EL109,PL110,EL110,PL111,PL112,PL201,PL202,PL301, PL401,PL303,PL304,PL501,EL501,EL502,EL503,EL504, EL505,EL506,EL507,EL508,EL509,EL510,EL511,EL512, EL513,EL514,EL515,EL516,EL517,EL518
Q510,Q511,Q512,Q513,Q514,Q515,Q516,Q517,Q518, Q519,Q520,Q521,Q522,Q523,Q524,Q525,Q526,Q527, Q528,Q529,Q530,Q531,Q532,Q533,Q534,Q535,Q536, Q537,Q546,Q547,Q548
R261,R262,R263,R264
R606,R611,R616
R565,R567,R626,R627,R628,R629, R630,R631,R634
R533,R534,R537,R539,R542,R544,R547,R549,R552, R554,R557,R558,R563,R568,R573,R578,R583,R588, R593,R598,R603,R608,R613,R632
R308,R309,R310,R311,R312,R313,R314,R315,R316, R317,R318,R319,R320,R321
R228,R229,R230,R231,R232,R233,R234,R235,R236, R237,R238,R246,R247,R248,R249,R250,R251,R401,R402
R530,R535,R540,R545,R550,R555,R618,R619,R703, R705,R706,R707,R708,R709,R710,R713,R714,R717
56
BC234,BC235,BC236,BC237,BC238,BC240,BC301,BC303,
36 CHIP RES', 1/10W,47 ΩJ 1608 9 R211,R212,R213,R214,R215,R216,R217,R218,R508 37 CHIP RES', 1/10W,470 ΩJ 1608 1 R404 38 CHIP RES', 1/10W,47K ΩJ 1608 2 R239,R240 39 CHIP RES', 1/10W,4.7K ΩJ 1608 11 R101,R102,R204,R241,R242,R243,R510,R511,R513,R515
,R517
40 CHIP RES', 1/10W,5.6K ΩJ 1608 12 R322,R323,R324,R325,R326,R328,R330,R332,R349,
R352,R354,R357
41 CHIP RES', 1/10W,620 ΩJ 1608 8 R407,R408,R413,R414,R415,R416,R417,R418 42 CHIP RES', 1/10W,6.2K ΩJ 1608 2 R346,R348 43 CHIP RES', 1/10W,75 ΩJ 1608 9 R521,R526,R531,R536,R541,R546,R551,R556,R633 44 CHIP RES', 1/10W,91 ΩJ 1608 1 R106 45 CHIP RES', 1/10W,1.2K ΩJ 1608 4 R327,R329,R331,R333 46 CHIP RES', 1/10W,1.3K ΩJ 1608 20 R570,R572,R575,R577,580,R582,R585,R587,R590,R592,
R595,R597,R600,R602,R605,R607,R610, R612,R615,R617
46 CHIP RES', 1/10W,3.9K ΩJ 1608 6 R339,R343,R351,R353,R356,R359 47 CHIP RES', 1/10W,15K ΩJ 1608 1 R716 48 CHIP RES', 1/10W,20K ΩJ 1608 4 R538,R543,R548,R553 49 CHIP RES', 1/10W,300 ΩJ 1608 12 R559,R564,R569,R574,R579,R584,R589,R594,R599,R604
,R609,R614
50 CHIP RES', 1/10W,9.31K ΩF 1608 3 R362,R363,R364 51 CHIP RES', 1/10W,18.7K ΩF 1608 3 R365,R366,R367 52 CHIP CAP', 25V,3pF,J,COG 1608 4 C402,C411,C414,C417 53 CHIP CAP', 25V,22pF,J,COG 1608 1 C202 54 CHIP CAP', 25V,2700pF,J,COG 1608 8 C302,C303,C304,C305,C310,C312,C314,C316 55 CHIP CAP', 25V,27pF,J,COG 1608 16 C203,C207,C208,C210,C211,C212,C403,C404,C412,C413
,C415,C416,C418, C419,C701,C702
56 CHIP CAP', 25V,33pF,J,COG 1608 6 C201,C220,C221,C222,C223,C224 57 CHIP CAP', 25V,330pF,J,COG 1608 4 C313,C315,C317,C321 58 CHIP CAP', 25V,47pF,J,COG 1608 10 TC201,C501,C502,C503,C504,C505,C506,C507,C508,
C530
59 CHIP CAP', 25V,470pF,J,COG 1608 12 C509,C510,C511,C512,C513,C514,C515,C516,C517,C518
,C519,C520
60 CHIP CAP', 25V,560pF,J,COG 1608 4 C306,C307,C308,C309 61 CHIP CAP', 25V,15pF,J,COG 1608 29 EC101,EC103,EC104,EC105,EC106,EC107,EC108,EC109,
EC110,EC111,C205,EC501,EC502,EC503, EC504,EC505,EC506,EC507,EC508,EC509,EC510,EC511, EC512,EC513,EC514,EC515,EC516,EC517,EC518
62 CHIP CAP', 25V,0.1uF,Z,Y5V 1608 102 BC101,BC102,BC103,C104,BC104,BC105,BC106,BC107,
BC108,BC109,BC110,BC111,BC112,BC200,BC201,BC202, BC203,BC204,BC205,C206,BC206,BC207,BC208,BC209, BC210,BC211,BC212,BC213,BC214,BC215,BC216,BC217, BC218,BC219,BC220,BC221,BC222,BC223,BC224,BC225, BC226,BC227,BC228,BC229,BC230,BC231,BC232,BC233,
BC304,BC305,BC306,BC307,BC308,BC309,BC310,BC311, BC312,BC313,BC314,BC315,BC316,BC317,BC318,BC319, BC320,BC321,BC322,BC323,BC325,BC326,BC327,BC328, BC329,BC330,BC331,BC332,BC333,BC334,BC401,C422, C423,C424,C425,C426,C427,C428,BC501,BC502,BC503, BC504,BC505, BC506,BC507,BC701
57
N(PCB), PCB
2. Headphone board
PCB ASS'Y, HEADPHONE (M/I)
1 HEADPHONE WIRE, 9PIN-9PI
IN
2 HEADPHONE JACK 1 JAC901 3 VARIABLE RESISTOR
PCB ASS'Y, HEADPHONE (RAD)
1 ELEC' CAP', 22uF/16V,M 5mm 2 CE902,CE901 2 ELEC' CAP', 47uF/25V,M 5mm 2 CE903,CE904
PCB ASS'Y, HEADPHONE (SMD)
1 HEADPHONE PCB 1LAYER FR1 1
2 CHIP CAP', 25V,470pF,J,COG 1608 2 C901,C903 3 CHIP CAP', 25V,100pF,J,COG 1608 2 C902,C904 4 CHIP CAP', 25V,0.1uF,Z,Y5V 1608 2 C906,C905 5 CHIP FERRITE BEAD 2012 2 L901,L902 6 GENERAL TR, NPN SOT-23 4 Q901,Q902,Q903,Q904 7 CHIP RES', 1/10W,100 ΩJ 0603 4 R902,R907,R904,R909 8 CHIP RES', 1/10W,1 K ΩJ 0603 4 R903,R905,R908,R910
9 CHIP RES', 1/10W, 10K ΩJ 0603 1 R915 10 CHIP RES', 1/10W,100K ΩJ 0603 2 R901,R906 11 CHIP RES', 1/10W, 3.3K ΩJ 0603 2 R911,R913 12 CHIP RES', 1/10W, 6.2K ΩJ 0603 2 R912,R914 13 DUAL OP-AMP SOIC 1 U901
Total
WIRE 1 CON901
1 VR901
3. Front Board
NO
PCB ASS'Y, FRONT (T/U)
PCB ASS'Y, FRONT (M/I)
1 (IR)INFRA RECIEVER L Type 1 U2
2 TR TO-92 1 Q1
3 VFD DISPLAY 1 U3
4 FrontPowerWire, 5Pin-5Pin(PCB), PCB IN WIRE 1 CON2
5 FrontSignalWire,11Pin-11Pin(PCB),PCB IN WIRE 1 CON1
6 TACT S/W, 4PIN,5mm 5mm 11
PCB ASS'Y, FRONT (RAD)
1 LED,RED, 3 PIE, 5mm Formming, High 4.5mm 1 D2
2 ELEC' CAP', 10uF/16V,M 5mm 2 CE1,CE2,CE4
3 ELEC' CAP', 10uF/50V,M 5mm 1 CE3
PCB ASS'Y, FRONT (AXI)
1 PCB, 1 LAYER FR1 1 REV. C+
2 JUMPER 8mm 9 JP1,JP16,JP17,JP23,JP24,JP25,JP26,JP27,JP28
3 JUMPER 12mm 17 JP2,JP4~15,JP18~JP21
4 JUMPER 18mm 2 JP3,JP22
5 DIODE AXIAL 3 D3,D4,D5
6 Axial Cap, 50V,0.IUF,Z AXIAL 7 C1,C3,C4,C5,C6,C7,C8
7 AXIAL,BEAD, 3560 AXIAL 2 L1,L2
8
AXI' RES', 1/8W,3.3K J
Spec' & description Pak' Usa' Location No.
SW1,SW2,SW3,SW4,SW5,SW6,SW8,SW9,SW10, SW11,SW12
AXIAL 1 R9
58
9
AXI' RES', 1/8W,56K J
10
AXI' RES', 1/6W,10K ΩJ
11
AXI' RES', 1/6W,330 ΩJ
12
AXI' RES', 1/6W,22 ΩJ
PCB ASS'Y, FRONT BOTTUM (SMD)
1 VFD DRIVER PQFP 1 U1
AXIAL 1 R12 AXIAL 6 R3,R4,R5,R6,R7,R8 AXIAL 1 R1 AXIAL 1 NR1
4. SMPS PART LIST
NO
PCB ASS'Y, SMPS (RAD)
1 ELEC' CAP', 220uF/6.3V,M 6mm 2 PC14,15
2 ELEC' CAP', 220uF/16V,M 8mm 3 PC16,28,30
3 ELEC' CAP', 470uF/16V,M 10mm 3 PC6,10,11
4 ELEC' CAP', 10uF/50V,M 5mm 1 PC32
5 ELEC' CAP', 47uF/35V,M 6mm 1 PC17
6 ELEC' CAP', 470uF/6.3V,M 8mm 4 PC13,19,22,25
7 ELEC' CAP', 1000uF/6.3V,M 10mm 3 PC12,18,33
8 ELEC' CAP', 47uF/16V,M 5mm 1 PC34
9 ELEC' CAP', 220uF/25V,M 5mm 1 PC8 10 ELEC' CAP', 22uF/16V,M 5mm 1 PC40 11 ELEC' CAP', 1uF/50V,M 5mm 3 PC21,26,29 12 PE-CAP',YSG472J2AN 5mm 3 PC3,23,61 13 PE-CAP',PEA102J2AN 5mm 2 PC24,60 14 PE-CAP',PEA103J2AN 5mm 1 PC7 15 PE-CAP',PEA682J2AN 5mm 1 PC5 16 FRD', FR103 4 PD9,14,16,17 17 FRD', FR204 1 PD7 18 FRD', FR107 2 PD5,6 19 FRD', FR154 1 PD11 20 SRD', SR204 1 PD10 21 RECTIFIER', 1N4007 6 PD1,2,3,4,18,19 22 ZENER', 1N5252(500mW) DO-35 3 PZD2,5,6 23 ZENER', 1N5234(500mW) DO-35 1 PZD4 24 ZENER', 1N5242(500mW) DO-35 3 PZD1,3,7
PCB ASS'Y, SMPS (AXI)
1 PCB, 1 LAYER FR1 1
2
RES-RD', 1/8W,10 J
3
RES-RD', 1/8W,47K J
4
RES-RD' 1/8W,10K J
5
RES-RD', 1/8W,220 J
6
RES-RD', 1/8W,22K J
7
RES-RD', 1/8W,150 J
8
RES-RD', 1/8W,27K J
9
RES-RD', 1/8W,51 J
10
RES-RD', 1/8W,1K J
11
RES-RD', 1/8W,100 J
12
RES-RD', 1/8W,18K J
13
RES-RD', 1/8W,4.7K J
14
RES-RD', 1/8W,470 J
15
RES-CF', 1/8W,560 J
Spec Pak' Usa' No
2 PR6,21 3 PR1,9,42 3 PR7,16,18 2 PR38,43 1 PR3 1 PR33 2 PR5,17 1 PR26 2 PR32,39 2 PR25,30 1 PR22 2 PR36,40 4 PR11,12,15,19 1 PR35
59
16
RES-RD', 1/4W,2K J
17
RES-RD', 1/8W,4.7K J
18
RES-RD', 1/8W,6.8K J
19
RES-RD', 1/4W,270K J
NO
20
RES-RN', 1/8W,2K J F
21
RES-RN', 1/8W,12K J F
22
RES-RN', 1/8W,6.8K J F
23
RES-MOF', 2W,15 J (MOR) 24 CER.CAP', 102K 1KV 2 PC4,9 25 CER.CAP', 471K 50V 2 PC27,57
26 KSP2222ATA TO-92 5 PQ2,4,5,6,7 27 KIA431 TO-92 2 PU2,3 28 PN2907 TO-92 1 PQ8
29 THERMISTER’, 5D-9 1 PTH1 30 CHOKE', PEAKING 10uH 5 PL3,4,6,8,10,
PCB ASS'Y, SMPS (M/I)
1 MOS FET', IRF 830 T0-220 2 PQ1,3 2 VTG REGULATER KA7805 T0-220 1 PU9 3 VTG REGULATER KA7812 T0-220 1 PU4 4
ELEC' CAP', 47uF/400,(105℃)
5 250VAC 104 1 PC1 6 FRD’ SF34 1 PD8 7 TCET 1103 2 PU1,6 8
RES-MOF', 2W,1K J(MOR)
9
RES-MOF', 2W,12K J(MOR) 10
RES-MOF', 2W,470 J(MOR) 11 Y-CAP', 332 Y-1 1 PC20 12 TRANS', EER2229 1 PT1 13 TRANS', EER2828 1 PT2 14 LINEFILTER', UU 1116(40mH) 1 PL1 15 FUSE', 250T 2.0A 1 PF1 16 FUSE CLIP', PLASTIC 1 17 RUBBER', BAR 1 18
절연지', SIZE 50*35 19 CONN ASS'Y', 12PIN, 350mm PCB IN WIRE 1 PCN2 20 CONN ASS'Y', 4PIN, 220mm PCB IN WIRE 1 PCN3 21 WAFER,5PIN(SMALL) PCB IN WAFER 1 PCN4
22 PIN POST', 2PIN 10mm
Spec Pak' Usa' No
3 PR10,13,29 1 PR36 1 PR41 2 PR2,28
3 PR23,31,37 1 PR45 1 PR34 2 PR44,46
1 PC2
2 PR4,47 2 PR8,20 1 PR27
1
PIN
POST'
1 PCN5
60
Electrical Part List
Remained to be defined
61
8. Block Diagram
MAIN PCB
POWER
PCB
HEAD PHONE
PCB
LOADER
(DVS)
VFD
REMOCON
EYE
VIDEO
ENCODER
A/V
DECODER
&
MAIN CPU
KEY
MATRIX
D/A
CONVERTE
R
SUB
MICOM
RCU
FRONT PCB
62
Block Diagram
Remained to be defined
63
9. PCB Diagrams
9-1 Main PCB (Component Side)
64
PCB Diagrams
9-2 Main PCB (Solder Side)
65
PCB Diagrams
9-3 Front PCB (Component Side) 9-4 Front PCB (Solder Side)
66
PCB Diagrams
9-5 SMPS PCB (Top Side)
67
PCB Diagrams
9-6 SMPS PCB (Bottom Side)
68
10. Wiring Diagram
69
Wiring Diagram
Remained to be defined
70
11. Schematic Diagrams
11-1 Main PCB Schematic Diagram
11-1-1 Main PCB Top Schematic diagram
71
Schematic Diagrams
11-1-2 Main PCB A/V Decoder Block Schematic diagram
72
Schematic Diagrams
11-1-3 Main PCB Submicom Block Schematic diagram
73
Schematic Diagrams
11-1-4 Main PCB Video Block Schematic diagram
74
Schematic Diagrams
11-1-5 Main PCB Audio Block Schematic diagram
75
Schematic Diagrams
11-1-6 Main PCB Out Stage Block Schematic diagram
76
11-2 Front PCB Schematic Diagram
11-2-1 Front PCB Schematic diagram
77
11-3 SMPS PCB Schematic Diagram
78
Schematic Diagrams
Remained to be defined
79
TaeYoung Telstar Co.,Ltd May.2001 Printed in Korea
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