Kenton WLAN module
User Guide
Model name: ASA5506-AP702
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1 Purpose
The purpose of this document is to give an overall description of the hardware requirements of
the WLAN module used in Kenton p r o je c t .
1.1 Scope
This document contains the requirements for the subject system and its top-level or architectural
design for an ODM partner. This document should only contain information needed to design
the system, since this document will go to multiple ODM vendors during the RFQ process.
The requirements specify the behavior of the system, both hardware and software. They do not
specify "how" the system will be built except for necessary constraints on the design such as
needed interfaces to other systems or valid c ons traints on size, shape, processor and memory
utilization, power consumption, etc. The behavior may be described in terms of how the system
enables the end user to perform work (i .e., the functions, performance, qu ality requirements, etc).
The architectural design describes the components of the system, their individual functions and
performance, and how they inte rfa ce with each other.
Development considerations such as schedule, cost, developmen t process, and staffing are not
included in this specification.
2 Functional Overview
2.1 System Overview
The Kenton WLAN module is designed f t o be a pluggable module assembly to the wi re le ss
version of Kenton Desktop Security Appliance. It will provide the following functionalities:
2x2 100mW
Dual Radios,
802.11n
Internal Antennas
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Compliance to standards based Dual Radio, 2x2, 802.11n
Dual Radio, 2x2, 100mW, Internal Antenna
Shall support Dual Concurrent Radios
Dual Radio, 2x2, 100mW, Internal Antenna
Shall support limited lifetime warranty
Operating Temp: 0ºC to 40ºC
Storage Temp: -30ºC to 70ºC
Operating Humidity: 10% to 90% Non-condensing
Storage Humidity: 5% to 95% Non-condensing
The PCB must include a printed “Manufactured for Cisco” marking
(using the Cisco Logo as shown in EDCS-775872. The minimum width
of the Cisco logo is ½”. The location is preferable on the top of the PCB,
but the back is acceptable if spacing doesn’t allow it to be on the top. It
cannot be underneath a soldered component (but can be underneath a
mini-PCI card if one exists).
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