Brooks Instrument GF135 Specifications

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DS-TMF-GF135-MFC-eng
November, 2017
Data Sheet
GF135
Digital Mass Flow Controller
Model GF135
Thermal Mass Flow
Pressure Transient Insensitive
Mass Flow Controller with Real-Time
Flow Error Detection and Advanced Diagnostics
OverviewOverview
Overview
OverviewOverview
Designed for the next step in semiconductor etch, thin film and other advanced process gas control applications, the GF135 combines all of the benefits provided by the most advanced pressure transient insensitive mass flow controller (MFC) and adds real-time flow error detection with advanced diagnostics.
Device manufacturers are driving programs to improve wafer level yield. The current downstream quality control approach can allow hundreds of wafers to be processed before issues are detected. Process gas stability and repeatability have been identified as critical to meeting yield enhancement goals and MFC accuracy has been identified as critical to maintaining process control.
The GF135 provides third generation pressure transient insensitivity, market leading process gas accuracy and ultra fast flow settling times for reduced process cycle time and to address advanced 3D device processing requirements. This platform also offers patent pending real-time flow error trending using Rate of Decay (ROD) techniques that are immune to typical MFC failure/degradation modes ensuring accurate and reliable diagnostic capabilities. After a baseline is established at tool start-up, the GF135 can detect changes in flow rate to within 2% of set point. These advanced diagnostic capabilities provide a shift from downstream quality control to real-time quality assurance and predictive maintenance resulting in higher yield and improved uptime.
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The GF135, with integral real-time ROD flow error detection, drops into the standard ultra high purity surface mount or VCR® MFC footprint providing an easy path to upgrade critical gas lines on existing systems.
With the GF135, the user will be able to take advantage of enhanced process gas accuracy, market leading pressure transient performance and MFC health indicators such as automatic trending of sensor stability and valve shutdown (leak-by). Using these health indicators and user programmable alarm limits, via MFC service port or remote digital commands, the user can establish limits to improve the yield and/or manage maintenance schedules to maximize uptime.
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FeaturFeatur
Featur
FeaturFeatur
FeaturFeatur
Featur
FeaturFeatur
Real-time flow error detection Support yield improvement programs by capturing wafer impacting flow deviations
Sensor stability tracking Improves system uptime by supporting predictive maintenance
Valve leak-by tracking Allows user to monitor and set limits to minimze first wafer effects
Enhanced process gas accuracy Meet process gas chemistry control challenges at 10nm
Market leading ultra-fast flow settling time Optimize wafer process cycle time by reducing non-productive flow stabilizaton steps.
Enhanced pressure insensitivity Superior process gas control for enhanced etch and deposition control
Corrosion resistant Hastelloy
Drop-in upgrade for surface-mount and VCR MFCs Easy upgrade for critical gas lines on existing systems
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Real-time Flow Error DetectionReal-time Flow Error Detection
Real-time Flow Error Detection
Real-time Flow Error DetectionReal-time Flow Error Detection
es and Benefitses and Benefits
es and Benefits
es and Benefitses and Benefits
eses
es
eses
®
sensor Provides unmatched long-term sensor stability ensuring maximum yield and throughput
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BenefitsBenefits
Benefits
BenefitsBenefits
Supports advanced 3D device processing
Process contamination buildup in the flow sensor results in higher than indicated actual flow. Process contamination buildup in the flow restrictor results in lower than indicated actual flow. Process contamination on the valve orifice or seat results in leak past the valve. All of these situations can cause lost wafers and cost thousands. When using a standard MFC, these errors cannot be detected without stopping production to run a flow check. The GF135 has patent pending real-time flow error detection and trending using Rate of Decay (ROD) techniques that are immune to typical MFC failure/degradation modes ensuring accurate and reliable diagnostic capabilities. After a baseline is established at tool start-up, the GF135 can detect changes in flow, drift and leak rate.
After installing the GF135, a commissioning routine creates a performance baseline at actual process conditions. During wafer
Model GF135 on Gas Stick
processing, the device automatically takes flow error detection readings at each new process set point and compares the result to the baseline. The proprietary ROD measurement technique momentarily stops the upstream delivery of gas from the tool supply while maintaining flow into the process chamber at the requested flow rate. A highly accurate pressure measurement is taken while the gas is being depleted from the inlet volume and an advanced signal processing algorithm calculates ROD flow rate in
MFC accurately flowing 40 sccm Cl2 (20%) ROD data points collected over 16 minute s Error detection data points show tight consistency well within the ± 2% of S.P detection window
real time. Before the flow to the process is affected by the diminishing pressure, the upstream supply is re-established with no perturbation to the delivered flow. By calculating flow at various set points during wafer processing, the MFC detects any sensor or bypass clogging. It also detects if a sensor offset is
OEM Test: GF135 Critical Flow Accuracy with
Time (Seconds)
Error Detection Monitoring Active
developing since the effects of clogging and drift manifest themselves differently at different set points. The same method is used when the MFC is given a zero set point to calculate valve leak. This enables the MFC to measure zero offset. The MFC can report the valve leak, sensor offset and flow offset to the tool through a documented interface protocol, as well as auto-correcting itself if the user enables that feature. Finally, the MFC stores this data for
MFC flowing 4 sccm Cl2 (2% of F.S.) for 50 minutes ROD measurements taken at 5 second intervals
No spiking or overshoot after each ROD measurement
one year and can report on the changes using the historical data. By providing automated monitoring of flow rate changes, the
GF135 is able to arm the user with real time warnings of wafer impacting flow deviations.
OEM Test: Flow Stability While Running Continuous
Flow Error Detection Measurements at Critical 2% Set Point
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Ultra-Fast ResponseUltra-Fast Response
Ultra-Fast Response
Ultra-Fast ResponseUltra-Fast Response
By combining Brooks’ patented flow sensor technology with a high speed ARM processor and fast acting diaphragm free valve assembly, the GF Series delivers up to 3 times faster response and settling time compared to other mass flow controllers, enabling:
• Improved wafer throughput by reducing nonproductive flow settling steps
• Critical Etch and 3D device processes requiring ultra-fast sub 500 millisecond etch steps
• Reduced diverted gas consumption and associated abatement costs
• Time-sensitive gas delivery steps in Atomic Layer Deposition (ALD)
• Processes requiring a slow ramped gas turn-on or time critical transitions between flow rates with user programmable ramp function
Enhanced Process Gas AccuracyEnhanced Process Gas Accuracy
Enhanced Process Gas Accuracy
Enhanced Process Gas AccuracyEnhanced Process Gas Accuracy A major advancement over traditional single point gas conversion factors, Brooks delivers up to a three-times improvement in process gas accuracy. This is achieved through advanced gas modeling optimized through actual gas testing providing compensation for non-linear gases.
tinued)tinued)
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Comparison of GF135 vs Competititor’s Response Time
to Ascending & Descending Set Points
The GF135 is a gas and range specific device for critical gas process applications requiring the widest working range with tightest flow control accuracy. A typical application is for multi­step processes requiring a high flow rate (up to 5 slpm) and a very accurate low flow rate. Traditionally this has been addressed by using two mass flow controllers. With wide turndown (100:1) and superior accuracy offered by the GF135, it is often possible to replace two mass flow controllers with one, providing immediate cost savings while freeing up a gas line for greater gas panel flexibility.
Pressure Transient InsensitivityPressure Transient Insensitivity
Pressure Transient Insensitivity
Pressure Transient InsensitivityPressure Transient Insensitivity Cost and space constraints have driven gas panel designers to remove point of use pressure regulators and pressure monitoring components, placing more burden on the mass flow controller to control accurately under dynamic pressure conditions. Conventional mass flow controllers react strongly to small inlet pressure fluctuations resulting in unstable performance and unpredictable accuracy (see Non-Pressure Insensitive MFC). This drove Brooks to develop Pressure Transient Insensitive mass flow controller technology (PTI-MFC). The GF135 PTI-MFC is a third generation PTI-MFC utilizing a patented control algorithm that inverts the pressure signal, compares it to the pre-fluctuation signal and drives real-time valve position compensation to maintain stable flow. Enhanced pressure transient insensitivity is achieved through faster sensing, faster processing, and a reduction in internal dead volume between the sensors and valve orifice.
Pressure Fluctuations in Non-Pressure Transient Insensitivity MFC
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Advanced Thermal Flow Measurement SensorAdvanced Thermal Flow Measurement Sensor
Advanced Thermal Flow Measurement Sensor
Advanced Thermal Flow Measurement SensorAdvanced Thermal Flow Measurement Sensor Brooks’ sensor technology combines:
• Improved signal to noise performance for improved accuracy at low setpoints
• Improved reproducibility at elevated temperatures through new isothermal packaging, onboard conditioning electronics with ambient temperature sensing and compensation
• Improved long-term stability through enhanced sensor manufacturing and burn in process
• Highly corrosion resistant Hastelloy C-22 sensor tube
• Optimized temperature profile for gases prone to thermal decomposition
High Purity Flow PathHigh Purity Flow Path
High Purity Flow Path
High Purity Flow PathHigh Purity Flow Path All metal, corrosion resistant flow path with reduced surface area and un-swept volumes for faster dry-down during purge steps:
• SEMI F-20 compliant wetted flow path
• 4μ inch Ra surface finish standard
• Highly corrosion resistant Hastelloy C-22 valve seat and jet orifice
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User InterfaceUser Interface
User Interface
User InterfaceUser Interface The user interface has a high visibility electronically rotatable LCD display that provides a local indication of Flow (%), Temperature (°C), Pressure (PSIA/KPa) and Network Address, selectable through the Display button. A Zero button provides a simple means to re-zero the mass flow controller as part of scheduled maintenance.
Communication InterfaceCommunication Interface
Communication Interface
Communication InterfaceCommunication Interface The GF135 supports analog 0-5 Vdc, RS485, and DeviceNet™ communication protocols. A range of low profile adapter cables facilitate replacing older mass flow controllers with the GF Series eliminating the need to carry mass flow controllers of same gas/range but different electrical connectors.
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GF135 Diagram
Communication Interface
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Etch ProcessEtch Process
Etch Process
Etch ProcessEtch Process The transition to 22nm and 10nm nodes and complex 3D device geometries place greater profile and variability control challenges on the etch tool and its gas delivery sub system.
ApplicationApplication
Application
ApplicationApplication
GF Series
Controllers
Creating and maintaining highly reproducible gas chemistry requires leading edge mass flow control.
The GF135 is the preferred mass flow controller for demanding etch applications. With ultra fast 300msec flow settling time, market leading pressure transient insensitivity, wide rangeability, process gas accuracy and real-time flow error detection with advanced diagnostics, the GF135 is the right choice for these demanding applications.
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Electrical InElectrical In
Pr
oduct Specifications
Electrical In
PrPr
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Electrical InElectrical In
PDC OrPDC Or
dering Code G2dering Code G2
PDC Or
dering Code G2
PDC OrPDC Or
dering Code G2dering Code G2 Description: Industry standard Analog / RS485 interface
terface Optionsterface Options
terface Options
terface Optionsterface Options
123
N2
Ar
Hbr
Sf6
O2
O2
CHF3
SiCl4
C4F6
CHAMBER
PDC OrPDC Or
dering Code D0-D9dering Code D0-D9
PDC Or
dering Code D0-D9
PDC OrPDC Or
dering Code D0-D9dering Code D0-D9
and Dand D
AA
-D-D
and D
and Dand D Description: Industry standard ODVA compliant DeviceNet interface
XX
A
-D
X
AA
-D-D
XX
ETCH
EXHAUST
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PrPr
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PP
erformanceerformance
P
erformance
PP
erformanceerformance
Full Scale Flow Range:Full Scale Flow Range:
Full Scale Flow Range: 3 sccm to 5 slm (N2 Eq.)
Full Scale Flow Range:Full Scale Flow Range:
Gasses Supported:Gasses Supported:
Gasses Supported: N2, O2, Ar, H2, SF6, NH3, CO2, Cl2, HBr, NF3, CF4, CH4, CH3F, CH2F2, SiCl4 (@ 100 Torr),
Gasses Supported:Gasses Supported:
Flow Flow
AccurAccur
Flow
Flow Flow
Repeatability & ReprRepeatability & Repr
Repeatability & Repr
Repeatability & ReprRepeatability & Repr
Linearity:Linearity:
Linearity: Included in accuracy
Linearity:Linearity:
Settling Settling
Settling
Settling Settling
PrPr
Pr
PrPr
ConCon
Con
ConCon
VV
V
VV
ZZ
Z
ZZ
TT
emperemper
T
emper
TT
emperemper
Rate-of-Decay PRate-of-Decay P
Rate-of-Decay P
Rate-of-Decay PRate-of-Decay P
RatingsRatings
Ratings
RatingsRatings
OperOper
Oper
OperOper
DifferDiffer
Differ
DifferDiffer
Maximum OperMaximum Oper
Maximum Oper
Maximum OperMaximum Oper
Pneumatic Pneumatic
Pneumatic
Pneumatic Pneumatic
Leak InLeak In
Leak In
Leak InLeak In
MecMec
hanicalhanical
Mec
hanical
MecMec
hanicalhanical
VV
V
VV
WW
W
WW
Surface Finish:Surface Finish:
Surface Finish: 4μ inch Ra (0.1 μm Ra)
Surface Finish:Surface Finish:
Diagnostics & DisplayDiagnostics & Display
Diagnostics & Display
Diagnostics & DisplayDiagnostics & Display
Status Lights:Status Lights:
Status Lights: MFC Health, Network Status
Status Lights:Status Lights:
Alarms:Alarms:
Alarms: Sensor Output, Control Valve Output, Over Temperature, Power Surge/Sag, Network Interruption,
Alarms:Alarms:
Display Display
Display
Display Display
Viewing Distance:Viewing Distance:
Viewing Distance: Fixed / 10 feet
Viewing Distance:Viewing Distance:
Units Displayed / Resolution:Units Displayed / Resolution:
Units Displayed / Resolution: Flow (%), Temp. (°C), Pressure (psia, kPa) / 0.1 (unit)
Units Displayed / Resolution:Units Displayed / Resolution:
ElectricalElectrical
Electrical
ElectricalElectrical
Electrical Connection:Electrical Connection:
Electrical Connection: Analog/RS-485 via 9-Pin “D” connector, DeviceNet via 5-Pin “M12” connector
Electrical Connection:Electrical Connection:
Digital Communication:Digital Communication:
Digital Communication: RS485+ (model specific), DeviceNet (model specific), RS485 Diagnostic Port (all models)
Digital Communication:Digital Communication:
Diagnostic / Service PDiagnostic / Service P
Diagnostic / Service P
Diagnostic / Service PDiagnostic / Service P
PP
P
PP
ComplianceCompliance
Compliance
ComplianceCompliance
EMCEMC
EMC EC Directive 2004/108/EC CE: EN61326: 2006 (FCC Part 15 & Canada IC-subset of CE testing)
EMCEMC Environmental ComplianceEnvironmental Compliance
Environmental Compliance RoHS Directive 2011/65/2006
Environmental ComplianceEnvironmental Compliance
*Exceptions for max ROD flow include SiCl4 (60 sccm), C4F8 (500 sccm) and C4F6-q) (500 sccm). Consult factory for more information.
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acy:acy:
Accur
acy: +/-1.0% S.P. (10-100% F.S.), +/-1% S.P. plus +/-0.04% F.S. (2-10% F.S.)
AccurAccur
acy:acy:
oducibility:oducibility:
oducibility: < +/- 0.15% S.P.
oducibility:oducibility:
Time (to within +/- 2% FS):Time (to within +/- 2% FS):
Time (to within +/- 2% FS): <300ms (<860 sccm N2 Equivalent), <400ms (861-5000 sccm N2 Equivalent)
Time (to within +/- 2% FS):Time (to within +/- 2% FS):
essuressur
e Insensitivity:e Insensitivity:
essur
e Insensitivity: < 1% S.P. up to 5 psi/sec upstream press. spike
essuressur
e Insensitivity:e Insensitivity:
trtr
ol Range:ol Range:
tr
ol Range: 1-100%
trtr
ol Range:ol Range:
alve Shut Down:alve Shut Down:
alve Shut Down: < 0.5% of F.S. N2
alve Shut Down:alve Shut Down:
erer
o Stability:o Stability:
er
o Stability: < +/- 0.5% F.S. per year
erer
o Stability:o Stability:
aturatur
e Coefficiene Coefficien
atur
e Coefficien
aturatur
e Coefficiene Coefficien
Flow Rate:Flow Rate:
Flow Rate: Maximum flow rate for which an ROD measurement can be obtained is 800 sccm*
Flow Rate:Flow Rate:
T
T
emperemper
aturatur
T
emper
atur
TT
emperemper
aturatur
PrPr
essuressur
e Sensitivity:e Sensitivity:
Pr
essur
e Sensitivity: +/- 0.04% F.S./psi
PrPr
essuressur
e Sensitivity:e Sensitivity:
Minimum Detectable ChangeMinimum Detectable Change
Minimum Detectable Change Zero Drift: +/- 0.02% F.S.
Minimum Detectable ChangeMinimum Detectable Change frfr
om Commissioning Baseline:om Commissioning Baseline:
fr
om Commissioning Baseline: Valve Leak: +0.1% F.S.
frfr
om Commissioning Baseline:om Commissioning Baseline:
ating ating
TT
emperemper
ating
T
emper
ating ating
TT
emperemper
enen
tial Prtial Pr
en
tial Pr
enen
tial Prtial Pr
VV
alve Operalve Oper
V
alve Oper
VV
alve Operalve Oper
tegrity (external):tegrity (external):
tegrity (external): 1x10-10 atm. cc/sec He
tegrity (external):tegrity (external):
alve alve
TT
ype:ype:
alve
T
ype: Normally Closed
alve alve
TT
ype:ype:
etted Materials:etted Materials:
etted Materials: SEMI F20 UHP Compliant 316L VIM/VAR, Hastelloy C-22,316L Stainless Steel, 304 Stainless Steel, KM-45
etted Materials:etted Materials:
TT
ype:ype:
T
ype: Top Mount Electronically Rotatable Integrated LCD
TT
ype:ype:
ower Supply/Consumption:ower Supply/Consumption:
ower Supply/Consumption: DeviceNet: +11-25 Vdc., 545 mA max. @ 11 Vdc., 250 mA (max.) @ 24 Vdc.,
ower Supply/Consumption:ower Supply/Consumption:
t:t:
t: Span: 0.05% setpoint per °C, Zero: 0.005% F.S. per °C
t:t:
erformance:erformance:
erformance: (ROD by default is disabled/off. It should not be enabled until after MFC is installed and properly commissioned)
erformance:erformance:
e Sensitivity:e Sensitivity:
e Sensitivity: +/- 0.04% S.P./Deg C
e Sensitivity:e Sensitivity:
aturatur
e Range:e Range:
atur
e Range: 10-50°C
aturatur
e Range:e Range:
essuressur
e Range**:e Range**:
essur
e Range**: 3-860 sccm = 7-45 psid, 861- 5000 sccm = 10-45 psid
essuressur
e Range**:e Range**:
ating Prating Pr
essuressur
ating Pr
ating Prating Pr
e:e:
essur
e: 100 psia max
essuressur
e:e:
ating Prating Pr
essuressur
ating Pr
essur
ating Prating Pr
essuressur
ort:ort:
ort: RS485 via 2.5 mm jack
ort:ort:
C4F6-q (@ 800 Torr), C4F8 (@ 1200 Torr), N2O, CHF3, SiH2Cl2, He, SiH4, BCl3, SiHCl3
Repeatability: +/- 0.3% S.P. (SiCl4 +/- 0.5% from 5-100% S.P. up to 100 sccm flow)
**Typical pressure drop. Actual pressure drop will be gas and flow dependent. Argon gas applications require higher differential pressure. Low vapor pressure gases require an inlet pressure of > 100 Torr, with vacuum on outlet (example SiCl4). Contact Brooks Technical Support for more information.
e:e:
e: 43.5 psia - 72.5 psia
e:e:
Sensor Drift, Flow Error, Valve Leak
Analog /RS485: +/-15 Vdc. (+10%), 6 Watts (max) or +24 Vdc +/-10%
Reach Directive EC 1907/2006
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Model GF135, DeviceNet, C-Seal Connections
Model GF135, DeviceNet, VCR Connections
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PrPr
oduct Dimensions GF135, RS485oduct Dimensions GF135, RS485
Pr
oduct Dimensions GF135, RS485
PrPr
oduct Dimensions GF135, RS485oduct Dimensions GF135, RS485
Model GF135, RS485, C-Seal Connections
Model GF135, RS485, VCR Connections
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Model CodeModel Code
Model Code
Model CodeModel Code
Code DescriptionCode Description
Code Description
Code DescriptionCode Description
I.I.
I. Base Model Code
I.I.
II.II.
II. Package/Finish Specifications
II.II.
III.III.
III. Configurability
III.III.
IVIV
..
IV
. Special Application
IVIV
..
VV
..
V
.Valve Configuration
VV
..
VI.VI.
VI.Specific Gas Code & Range,
VI.VI.
VII.VII.
VII. Fitting
VII.VII.
VIII. VIII.
VIII. Downstream Condition
VIII. VIII.
IX.IX.
IX. Sensor
IX.IX.
X.X.
X. Connector DeviceNet Standard Configuration Parameters
X.X.
Code OptionCode Option
Code Option
Code OptionCode Option
GFGF
GF
GFGF
135135
135 Pressure Transient Insensitive (PTI) Ultra High Purity Advanced Diagnostic MFC
135135
XX
X Gas specific
XX
XXXX
XX Standard Application
XXXX
CC
C Normally Closed Valve
CC
XXXX XXXXXXXX XXXX
XXXX XXXX Specify Gas Code & Range, i.e. “0004” = Argon and “010L” = 10 slpm
XXXX XXXXXXXX XXXX
VXVX
VX 1 1/2" VCR 1/4"
VXVX
CXCX
CX 1 1/8" C Seal 92mm
CXCX
WXWX
WX 1 1/8" W Seal 92mm
WXWX
AA
A Atmosphere
AA
VV
V Vacuum
VV
OO
O Default Orientation
OO
D0D0
D0 DeviceNet 5 Pin Micro Idle Count Integer 6000h 2 7 Executing 500KB
D0D0
D1D1
D1 DeviceNet 5 Pin Micro Idle Count Integer 6000h 21 7 Executing 500KB
D1D1
D2D2
D2 DeviceNet 5 Pin Micro Idle SCCM Float 7FFFh 13 19 Executing 500KB
D2D2
D3D3
D3 DeviceNet 5 Pin Micro Idle Count Integer 6000h 22 7 Executing 500KB
D3D3
D4D4
D4 DeviceNet 5 Pin Micro Executing Count Integer 6000h 22 8 Executing 500KB
D4D4
D5D5
D5 DeviceNet 5 Pin Micro Idle Count Integer 6000h 6 8 Executing 500KB
D5D5
D6D6
D6 DeviceNet 5 Pin Micro Idle Count Integer 7FFFh 3 7 Executing 500KB
D6D6
D7D7
D7 DeviceNet 5 Pin Micro Idle Count Integer 7FFFh 6 8 Executing 500KB
D7D7
D8D8
D8 DeviceNet 5 Pin Micro Idle Count Integer 6000h 3 7 Executing 500KB
D8D8
D9D9
D9 DeviceNet 5 Pin Micro Executing Count Integer 6000h 2 7 Executing 500KB
D9D9
DD
AA
D
A DeviceNet 5 Pin Micro Idle Count Integer 7FFFh 22 7 Executing 500KB
DD
AA
DBDB
DB DeviceNet 5 Pin Micro Idle Count Integer 6000h 22 8 Executing 500KB
DBDB
DCDC
DC DeviceNet 5 Pin Micro Idle Count Integer 7FFFh 3 7 Idle 500KB
DCDC
DDDD
DD DeviceNet 5 Pin Micro Executing Count Integer 7FFFh 22 8 Executing 500KB
DDDD
DEDE
DE DeviceNet 5 Pin Micro Executing SCCM Float 6000h 15 19 Executing 500KB
DEDE
DD
XX
D
X DeviceNet 5 Pin Micro To be defined by CSR
DD
XX
G2G2
G2 Analog/RS485 9 Pin D NA NA NA NA NA NA NA NA
G2G2
Option DescriptionOption Description
Option Description
Option DescriptionOption Description
I/O Connector State Setting Setting Setting Producer Consumer Transition Rate
Power On Full Scale Full Scale Full Scale Instance Instance State Baud
Poll IO Poll IO Poll IO External
XI.XI.
XI. Customer Special Request
XI.XI.
XII.XII.
XII. Auto Shut-Off
XII.XII.
XIII.XIII.
XIII. Auto Zero
XIII.XIII.
XIVXIV
..
XIV
. Reference Temperature
XIVXIV
..
Example Model CodeExample Model Code
Example Model Code
Example Model CodeExample Model Code
II
IIII
II
IIII
135135
135
135135
IIIIII
III
IIIIII
XX
X
XX
GFGF
GF
GFGF
I
II
XXXXXXXX
XXXX Customer Special Request Number
XXXXXXXX
AA
A Auto Shut Off (Included)
AA
XX
X Auto Shut Off (Not Included)
XX
AA
A Auto Zero (Included)
AA
XX
X Auto Zero (Not Included)
XX
000000
000 0°C Reference Calibration (Standard) - Default Setting
000000
IVIV
IV
IVIV XXXX
XX
XXXX
VV
V
VV CC
C
CC
VIVI
VI
VIVI
XXXX XXXXXXXX XXXX
XXXX XXXX
XXXX XXXXXXXX XXXX
VIIVII
VII
VIIVII VXVX
VX
VXVX
VIIIVIII
VIII
VIIIVIII
IXIX
IX
IXIX
AA
OO
A
AA
D1D1
O
D1
OO
D1D1
XX
XIXI
XIIXII
XIIIXIII
X
XI
XIXI
XXXXXXXX
XXXX
XXXXXXXX
XII
XIIXII
AA
A
AA
XX
XIII
XIIIXIII
AA
A
AA
XIVXIV
XIV
XIVXIV
000000
000
000000
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BrBr
ooks Service and Supportooks Service and Support
Br
ooks Service and Support
BrBr
ooks Service and Supportooks Service and Support
Brooks is committed to assuring all of our customers receive the ideal flow solution for their application, along with outstanding service and support to back it up. We operate first class repair facilities located around the world to provide rapid response and support. Each location utilizes primary standard calibration equipment to ensure accuracy and reliability for repairs and recalibra­tion and is certified by our local Weights and Measures Authorities and traceable to the relevant International Standards.
Visit www.BrooksInstrument.com to locate the service location nearest to you.
STST
ARAR
TT
-UP SERVICE -UP SERVICE
ST
AR
T
-UP SERVICE
STST
ARAR
TT
-UP SERVICE -UP SERVICE
Brooks Instrument can provide start-up service prior to operation when required. For some process applications, where ISO-9001 Quality Certification is important, it is mandatory to verify and/or (re)calibrate the products periodically. In many cases this service can be provided under in-situ conditions, and the results will be traceable to the relevant international quality standards.
AND IN-SITU CALIBRAAND IN-SITU CALIBRA
AND IN-SITU CALIBRA
AND IN-SITU CALIBRAAND IN-SITU CALIBRA
TIONTION
TION
TIONTION
SEMINARS SEMINARS
SEMINARS
SEMINARS SEMINARS Brooks Instrument can provide seminars and dedicated training to engineers, end users, and maintenance persons.
Please contact your nearest sales representative for more details.
Due to Brooks Instrument's commitment to continuous improvement of our products, all specifications are subject to change without notice.
TRADEMARKS
Brooks, MultiFlo ............................................................. Brooks Instrument, LLC
All other trademarks are the property of their respective owners.
AND AND
AND
AND AND
TRAININGTRAINING
TRAINING
TRAININGTRAINING
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