Designed for the next step in semiconductor etch, thin film and other advanced process
gas control applications, the GF135 combines all of the benefits provided by the most
advanced pressure transient insensitive mass flow controller (MFC) and adds real-time
flow error detection with advanced diagnostics.
Device manufacturers are driving programs to improve wafer level yield. The current
downstream quality control approach can allow hundreds of wafers to be processed
before issues are detected. Process gas stability and repeatability have been identified as
critical to meeting yield enhancement goals and MFC accuracy has been identified as
critical to maintaining process control.
The GF135 provides third generation pressure transient insensitivity, market leading
process gas accuracy and ultra fast flow settling times for reduced process cycle time and
to address advanced 3D device processing requirements. This platform also offers patent
pending real-time flow error trending using Rate of Decay (ROD) techniques that are
immune to typical MFC failure/degradation modes ensuring accurate and reliable
diagnostic capabilities. After a baseline is established at tool start-up, the GF135 can
detect changes in flow rate to within 2% of set point. These advanced diagnostic
capabilities provide a shift from downstream quality control to real-time quality
assurance and predictive maintenance resulting in higher yield and improved uptime.
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The GF135, with integral real-time ROD flow error detection, drops into the standard
ultra high purity surface mount or VCR® MFC footprint providing an easy path to upgrade
critical gas lines on existing systems.
With the GF135, the user will be able to take advantage of enhanced process gas
accuracy, market leading pressure transient performance and MFC health indicators such
as automatic trending of sensor stability and valve shutdown (leak-by). Using these
health indicators and user programmable alarm limits, via MFC service port or remote
digital commands, the user can establish limits to improve the yield and/or manage
maintenance schedules to maximize uptime.
sensorProvides unmatched long-term sensor stability ensuring maximum yield and throughput
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BenefitsBenefits
Benefits
BenefitsBenefits
Supports advanced 3D device processing
Process contamination buildup in the flow sensor results in higherthan indicated actual flow. Process contamination buildup in theflow restrictor results in lower than indicated actual flow. Processcontamination on the valve orifice or seat results in leak past thevalve. All of these situations can cause lost wafers and costthousands. When using a standard MFC, these errors cannot bedetected without stopping production to run a flow check. TheGF135 has patent pending real-time flow error detection andtrending using Rate of Decay (ROD) techniques that are immune totypical MFC failure/degradation modes ensuring accurate andreliable diagnostic capabilities. After a baseline is established at toolstart-up, the GF135 can detect changes in flow, drift and leak rate.
After installing the GF135, a commissioning routine creates aperformance baseline at actual process conditions. During wafer
Model GF135 on Gas Stick
processing, the device automatically takes flow error detectionreadings at each new process set point and compares the result tothe baseline. The proprietary ROD measurement techniquemomentarily stops the upstream delivery of gas from the toolsupply while maintaining flow into the process chamber at therequested flow rate. A highly accurate pressure measurement istaken while the gas is being depleted from the inlet volume and anadvanced signal processing algorithm calculates ROD flow rate in
MFC accurately flowing 40 sccmCl2 (20%)ROD data points collected over 16 minute sError detection data points show tight consistency well within the ±2% of S.P detection window
real time. Before the flow to the process is affected by thediminishing pressure, the upstream supply is re-established withno perturbation to the delivered flow. By calculating flow atvarious set points during wafer processing, the MFC detects anysensor or bypass clogging. It also detects if a sensor offset is
OEM Test: GF135 Critical Flow Accuracy with
Time (Seconds)
Error Detection Monitoring Active
developing since the effects of clogging and drift manifestthemselves differently at different set points. The same method isused when the MFC is given a zero set point to calculate valve leak.This enables the MFC to measure zero offset. The MFC can reportthe valve leak, sensor offset and flow offset to the tool through adocumented interface protocol, as well as auto-correcting itself ifthe user enables that feature. Finally, the MFC stores this data for
MFC flowing 4 sccm Cl2 (2% of F.S.) for 50 minutes
ROD measurements taken at 5 second intervals
No spiking or overshoot after each ROD measurement
one year and can report on the changes using the historical data.By providing automated monitoring of flow rate changes, the
GF135 is able to arm the user with real time warnings of waferimpacting flow deviations.
OEM Test: Flow Stability While Running Continuous
Flow Error Detection Measurements at Critical 2% Set Point
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Ultra-Fast ResponseUltra-Fast Response
Ultra-Fast Response
Ultra-Fast ResponseUltra-Fast Response
By combining Brooks’ patented flow sensor technology with a
high speed ARM processor and fast acting diaphragm free valve
assembly, the GF Series delivers up to 3 times faster response
and settling time compared to other mass flow controllers,
enabling:
• Improved wafer throughput by reducing nonproductive flow
settling steps
• Critical Etch and 3D device processes requiring ultra-fast sub
500 millisecond etch steps
• Reduced diverted gas consumption and associated
abatement costs
• Time-sensitive gas delivery steps in Atomic Layer Deposition (ALD)
• Processes requiring a slow ramped gas turn-on or time
critical transitions between flow rates with user
programmable ramp function
Enhanced Process Gas AccuracyEnhanced Process Gas Accuracy
Enhanced Process Gas Accuracy
Enhanced Process Gas AccuracyEnhanced Process Gas Accuracy
A major advancement over traditional single point gas
conversion factors, Brooks delivers up to a three-times
improvement in process gas accuracy. This is achieved through
advanced gas modeling optimized through actual gas testing
providing compensation for non-linear gases.
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Comparison of GF135 vs Competititor’s Response Time
to Ascending & Descending Set Points
The GF135 is a gas and range specific device for critical gas
process applications requiring the widest working range with
tightest flow control accuracy. A typical application is for multistep processes requiring a high flow rate (up to 5 slpm) and a
very accurate low flow rate. Traditionally this has been
addressed by using two mass flow controllers. With wide
turndown (100:1) and superior accuracy offered by the GF135,
it is often possible to replace two mass flow controllers with
one, providing immediate cost savings while freeing up a gas
line for greater gas panel flexibility.
Pressure Transient InsensitivityPressure Transient Insensitivity
Cost and space constraints have driven gas panel designers to
remove point of use pressure regulators and pressure
monitoring components, placing more burden on the mass flow
controller to control accurately under dynamic pressure
conditions. Conventional mass flow controllers react strongly to
small inlet pressure fluctuations resulting in unstable
performance and unpredictable accuracy (see Non-Pressure
Insensitive MFC). This drove Brooks to develop Pressure
Transient Insensitive mass flow controller technology (PTI-MFC).
The GF135 PTI-MFC is a third generation PTI-MFC utilizing a
patented control algorithm that inverts the pressure signal,
compares it to the pre-fluctuation signal and drives real-time
valve position compensation to maintain stable flow. Enhanced
pressure transient insensitivity is achieved through faster
sensing, faster processing, and a reduction in internal dead
volume between the sensors and valve orifice.
Pressure Fluctuations in Non-Pressure Transient Insensitivity MFC
• Improved signal to noise performance for improved accuracy
at low setpoints
• Improved reproducibility at elevated temperatures through
new isothermal packaging, onboard conditioning electronics
with ambient temperature sensing and compensation
• Improved long-term stability through enhanced sensor
manufacturing and burn in process
• Optimized temperature profile for gases prone to thermal
decomposition
High Purity Flow PathHigh Purity Flow Path
High Purity Flow Path
High Purity Flow PathHigh Purity Flow Path
All metal, corrosion resistant flow path with reduced surface
area and un-swept volumes for faster dry-down during purge
steps:
User InterfaceUser Interface
The user interface has a high visibility electronically rotatable
LCD display that provides a local indication of Flow (%),
Temperature (°C), Pressure (PSIA/KPa) and Network Address,
selectable through the Display button. A Zero button provides a
simple means to re-zero the mass flow controller as part of
scheduled maintenance.
Communication InterfaceCommunication Interface
Communication Interface
Communication InterfaceCommunication Interface
The GF135 supports analog 0-5 Vdc, RS485, and DeviceNet™
communication protocols. A range of low profile adapter cables
facilitate replacing older mass flow controllers with the GF
Series eliminating the need to carry mass flow controllers of
same gas/range but different electrical connectors.
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GF135 Diagram
Communication Interface
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Etch ProcessEtch Process
Etch Process
Etch ProcessEtch Process
The transition to 22nm and 10nm nodes and complex 3D
device geometries place greater profile and variability control
challenges on the etch tool and its gas delivery sub system.
ApplicationApplication
Application
ApplicationApplication
GF Series
Controllers
Creating and maintaining highly reproducible gas chemistry
requires leading edge mass flow control.
The GF135 is the preferred mass flow controller for
demanding etch applications. With ultra fast 300msec flow
settling time, market leading pressure transient insensitivity,
wide rangeability, process gas accuracy and real-time flow
error detection with advanced diagnostics, the GF135 is the
right choice for these demanding applications.
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Electrical InElectrical In
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Electrical In
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Electrical InElectrical In
PDC OrPDC Or
dering Code G2dering Code G2
PDC Or
dering Code G2
PDC OrPDC Or
dering Code G2dering Code G2
Description: Industry standard
Analog / RS485 interface
terface Optionsterface Options
terface Options
terface Optionsterface Options
123
N2
Ar
Hbr
Sf6
O2
O2
CHF3
SiCl4
C4F6
CHAMBER
PDC OrPDC Or
dering Code D0-D9dering Code D0-D9
PDC Or
dering Code D0-D9
PDC OrPDC Or
dering Code D0-D9dering Code D0-D9
and Dand D
AA
-D-D
and D
and Dand D
Description: Industry standard
ODVA compliant DeviceNet
interface
Repeatability: +/- 0.3% S.P. (SiCl4 +/- 0.5% from 5-100% S.P. up to 100 sccm flow)
**Typical pressure drop. Actual pressure drop will be gas and flow dependent.
Argon gas applications require higher differential pressure.
Low vapor pressure gases require an inlet pressure of > 100 Torr, with vacuum on outlet
(example SiCl4). Contact Brooks Technical Support for more information.
e:e:
e: 43.5 psia - 72.5 psia
e:e:
Sensor Drift, Flow Error, Valve Leak
Analog /RS485: +/-15 Vdc. (+10%), 6 Watts (max) or +24 Vdc +/-10%
Brooks is committed to assuring all of our customers receive the ideal flow solution for their application, along with outstanding
service and support to back it up. We operate first class repair facilities located around the world to provide rapid response and
support. Each location utilizes primary standard calibration equipment to ensure accuracy and reliability for repairs and recalibration and is certified by our local Weights and Measures Authorities and traceable to the relevant International Standards.
Visit www.BrooksInstrument.com to locate the service location nearest to you.
STST
ARAR
TT
-UP SERVICE -UP SERVICE
ST
AR
T
-UP SERVICE
STST
ARAR
TT
-UP SERVICE -UP SERVICE
Brooks Instrument can provide start-up service prior to operation when required. For some process applications, where ISO-9001
Quality Certification is important, it is mandatory to verify and/or (re)calibrate the products periodically. In many cases this service
can be provided under in-situ conditions, and the results will be traceable to the relevant international quality standards.
AND IN-SITU CALIBRAAND IN-SITU CALIBRA
AND IN-SITU CALIBRA
AND IN-SITU CALIBRAAND IN-SITU CALIBRA
TIONTION
TION
TIONTION
SEMINARS SEMINARS
SEMINARS
SEMINARS SEMINARS
Brooks Instrument can provide seminars and dedicated training to engineers, end users, and maintenance persons.
Please contact your nearest sales representative for more details.
Due to Brooks Instrument's commitment to continuous improvement of our products, all specifications are subject to change without notice.