5 Band Parametric EQ Module (P/N: 250580).......................................................................... 94-99
2
CAUTION: The Bose
®
Entero™ SE 16 Audio Processor
contains no user-serviceable parts.
To prevent warranty infractions, refer servicing
to warranty service centers or factory service.
PROPRIETARY INFORMATION
THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION OF
BOSE® CORPORATION WHICH IS BEING FURNISHED ONLY FOR
THE PURPOSE OF SERVICING THE IDENTIFIED BOSE PRODUCT
BY AN AUTHORIZED BOSE SERVICE CENTER OR OWNER OF THE
BOSE PRODUCT, AND SHALL NOT BE REPRODUCED OR USED
FOR ANY OTHER PURPOSE.
Warranty
The Bose Entero SE 16 Audio Processor and Modules are
covered by a transferable five-year limited warranty.
3
SAFETY INFORMATION
1. Parts that have special safety characteristics are identified by the symbol on schemat-
ics or by special notes on the parts list. Use only replacement parts that have critical characteristics recommended by the manufacturer.
2. Make leakage current or resistance measurements to determine that exposed parts are
acceptably insulated from the supply circuit before returning the unit to the customer. Use the
following checks to perform these measurements:
A. Leakage Current Hot Check-With the unit completely reassembled, plug the AC line cord
directly into a 120V AC outlet. (Do not use an isolation transformer during this test.) Use a
leakage current tester or a metering system that complies with American National Standards
Institute (ANSI) C101.1 "Leakage Current for Appliances" and Underwriters Laboratories (UL)
1492 (71). With the unit AC switch first in the ON position and then in OFF position, measure
from a known earth ground (metal waterpipe, conduit, etc.) to all exposed metal parts of the
unit (antennas, handle bracket, metal cabinet, screwheads, metallic overlays, control shafts,
etc.), especially any exposed metal parts that offer an electrical return path to the chassis. Any
current measured must not exceed 0.5 milliamp. Reverse the unit power cord plug in the outlet
and repeat test. ANY MEASUREMENTS NOT WITHIN THE LIMITS SPECIFIED HEREIN
INDICATE A POTENTIAL SHOCK HAZARD THAT MUST BE ELIMINATED BEFORE RETURNING THE UNIT TO THE CUSTOMER.
B. Insulation Resistance Test Cold Check-(1) Unplug the power supply and connect a
jumper wire between the two prongs of the plug. (2) Turn on the power switch of the unit. (3)
Measure the resistance with an ohmmeter between the jumpered AC plug and each exposed
metallic cabinet part on the unit. When the exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2 Megohms. When there is no return path to
the chassis, the reading must be "infinite". If it is not within the limits specified, there is the
possibility of a shock hazard, and the unit must be repaired and rechecked before it is returned
to the customer.
ELECTROSTATIC DISCHARGE SENSITIVE (ESDS)
DEVICE HANDLING
This unit contains ESDS devices. We recommend the following precautions when repairing,
replacing or transporting ESDS devices:
• Perform work at an electrically grounded work station.
• Wear wrist straps that connect to the station or heel straps that connect to conductive
floor mats.
• Avoid touching the leads or contacts of ESDS devices or PC boards even if properly
grounded. Handle boards by the edges only.
• Transport or store ESDS devices in ESD protective bags, bins, or totes. Do not insert
unprotected devices into materials such as plastic, polystyrene foam, clear plastic bags,
bubble wrap or plastic trays.
4
SPECIFICATIONS
Entero™ SE 16 Audio Processor
Technical Information
Inputs/Outputs: Up to 16/16
Power Supply:
Operates on universal input power
supply with any mains voltage from
80-265VAC, 50-60Hz
Maximum Power Consumption:
240 Watts
Network Input/Output:
LonWorks
®
8 pin RJ45
Dimensions:
3.5"H x 19"W x 15.5"D, nominal
(8.9 cm x 48.3 cm x 39.37 cm)
2 U in a standard full rack
Weight:
9 lb (4 kg) approx., according to number
of modules installed
Features:
• Signal processing for up to 16 channels
with 16 inputs and outputs
• Capacity for 4 DSP modules
(with 4 in x 4 out for each)
• Supports both analog and digital signal
processing technology
• Input compatibility with microphones and
line level sources, balanced and
unbalanced
• Output compatibility with power
amplifers and other line-level equipment
• Internal routing and summing of any
sources to any output
• Network control through LonWorks and
compatible devices, including amplifiers
and video, lighting, and other networked
devices
• Assignment of any system control
function to any user interface, whether
computer-based or not
Chassis rear
Technical Specifications for a Simple
Configuration
In a very basic system design, the chassis
configuration could include 2 input
modules, 2 output modules, and 2 router
modules, to produce the following
specifications.
Maximum Output: +17dBV
Gain: 0dB nominal
Dynamic Range: 113dB
Harmonic Distortion and Noise:
0.05% nominal, 0.10% limit
Crosstalk at 1kHz: -70dB
Frequency Response:
20Hz to 20kHz referenced at 1kHz, ±1dB
Chassis front
SE 16 audio processor chassis with no
modules installed
5
SPECIFICATIONS
Entero™ SE 16 Audio Processor (continued)
SE 16 Audio Processor block diagram
Software view of an unpopulated
SE 16 chassis
Safety and EMC Compliance
The Bose® Entero SE 16 audio processor
complies with the following safety and other
regulatory standards:
Safety Specifications: UL 1950, CSA C22.2
No. 950, EN 60950, CB Scheme per
IEC60950 with all country deviations.
EMI/RFI Specifications: FCC Part 15 Subpart B Class A, ICES-003 Class A, AS/NZS
1053, CISPR 22, EN 55103-1, EN 55103-2.
6
SPECIFICATIONS
Entero™ Line Level Input module
Technical Information
Inputs/Outputs: 2/2
Input Impedance Differential:
20k Ohms, balanced
10k Ohms, unbalanced
Equivalent Input Noise:
–103dBV, A weighted
Gain/Input Range: –60dB to +20dB
Input Gain Steps: 1dB
THD+N at 1kHz: 0.02%, 0dB gain
CMRR at 1kHz: 65dB
Crosstalk at 1kHz: –70dB
Frequency Response:
20Hz to 20kHz nominal, ±1dB
Size:
2.82"H x 2.24"W
(57.50 mm x 56.25 mm)
Features:
• Handles two channels
• Provides line level differential input stage
• Provides gain control
• Peak detector
• Appropriate for use with all line level
sources, such as:
– CD player
– video cassette
– DAT
– Mixing board output
Software view of Line Level Input module
Line Level Input module block diagram
7
SPECIFICATIONS
Entero™ Mic/Line Level Input module with Limiter
Technical Information
Inputs/Outputs: 2/2
Input Impedance Differential: 20k Ohms
Input Impedance Differential,
Phantom Power On: 4k Ohms
Equivalent Input Noise:
–120dBV (60dB gain)
–95dBV (0dB gain)
CMRR at 1kHz: 70dB, typical
THD: 0.02%, 1kHz, 50dB gain
Limiter Attack Time: 1mS, 5mS, 10mS
Limiter Release Time: .5S, 1S, 2S
Gain Steps:
0dB, 10dB, 20dB, 30dB, 40dB,
50dB, 60dB
Features:
• Handles two channels
• Provides selectable input stage gain to
accommodate a wide range of sources
from mic to line-level
• Supplies 12VDC phantom power for
condenser microphones
• Provides limiter to ensure consistent
output level for a wide range of mic input
• Includes gain control before the limiter
• Provides makeup gain after limiter
• Peak detector
• Appropriate for use with all microphone
inputs and for input jacks that accept both
mic and line sources
Crosstalk at 1kHz: –70dB
Frequency Response:
20Hz-20kHz nominal, ±1dB limit
Phantom Power: 12VDC
Size:
2.82"H x 2.24"W
(70.50 mm x 56.00 mm)
Software view of Line Level Input with
Limiter module
Stereo couple
Line Level Input module with Limiter block diagram
8
SPECIFICATIONS
Entero™ Router Modules
2 x 2 Router module
Technical Information
Inputs/Outputs: 2/2
Maximum Signal Handling: +17dBV
Size: .94"H x 2.25"W
(23.5 mm x 56.25 mm)
Features
• Handles 2 channels
• Includes no active components
• Connects chassis inputs 1 and 2 to the
outputs the router serves
• Peak detector
• Appropriate for use when 2
or fewer inputs are used
Note: There is no software view of this
module in the GUI. It is a hardware only
component and is not controlled by the
Entero software.
16 x 16 Router module
Technical Information
Inputs/Outputs: 16/16
Maximum Input/Output: +17dBV
Size: 2.80"H x 1.97"W
(70 mm x 24.25 mm)
Features
• No active components
• For use only when the audio processor
chassis is configured for 16 independent
signal processing channels
• For use alone, in place of other routers*
* CAUTION: Do not use the 16 x 16 router
module with any other router. Damage to
the module or chassis may result.
Note: There is no software view of this
module in the GUI. It is a hardware only
component and is not controlled by the
Entero software.
2 x 2 Router module block diagram
Entero SE 16 audio processor
Router slots
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
16 x 16 Router module block diagram
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
9
SPECIFICATIONS
Entero™ Router Modules
16 x 2 Router module
Technical Information
Inputs/Outputs: 16/2
Maximum Output: +17dBV at 1 kHz
Summing Gain: 0dB, –6dB, –12dB, –18dB
THD+N at 1kHz: 0.02%
Output Noise:
–95dBV, A weighted, with all switches
closed (16 channels summed)
–100dBV, A weighted, with 1 switch
closed
Crosstalk at 1kHz: –70dB
Frequency Response:
+0/–0.5dB, 20 Hz to 20kHz
Size: 2.80"H x 1.97"W (70 mm x 24.25 mm)
Features:
• Sums from 1 to 16 source signals in any
combination
• Provides two independent outputs
• Peak detector
• Appropriate for use with each pair of
outputs, unless the 2 x 2 Router module
can be used
Software view of 16 x 2 Router module
Note: Entero 16 x 16 and 2 x 2 router
modules have no programmable controls
16 x 2 Router module block diagram
10
SPECIFICATIONS
Entero™ SE 16 Equalization
Fixed EQ Carrier module
Technical Information
Inputs/Outputs: 2/2
Maximum Output at 1kHz: +17dBV
Gain: 0dB nominal (varies with EQ curve)
Output Noise: –90dBV, A weighted
THD+N at 1kHz: 0.05%
Crosstalk at 1kHz: –70dB
Frequency Response:
±.5dB, 20Hz to 20kHz with no speaker
submodule installed
Size:
2.82"H x 2.24"W
(70.5 mm x 56.8 mm)
Features:
• Capacity for two speaker EQ submodules
(the same or different, specific to the
speakers connected to the outputs it
serves)
• Accepts submodules* for:
- 802® II loudspeaker
- 502® A loudspeaker
- 402® loudspeaker
- FreeSpace® 8 flush-mount loudspeaker
- FreeSpace 8 surface-mount
loudspeaker
- FreeSpace 25/32 loudspeaker
- 502B loudspeaker
- 502BEX loudspeaker
- AWCS II CannonTM loudspeaker
• Allows use of an EQ submodule on one
channel with unaffected signal pass-
through on the other
• Selectable low pass and high pass
switches, for use with different speakers
• Peak detector
• Suited to the output signal processing
chain
* Submodules must be specified when
ordering
Software view of Fixed EQ Carrier module
Fixed EQ Carrier with 2 submodules block diagram
11
SPECIFICATIONS
Entero™ SE 16 Equalization
5-Band Parametric EQ module
Technical Information
Inputs/Outputs: 2/2
EQ Bands: 5 fully independent per channel
Q adjustment: 0.7 to 7
Frequency response:
Programmable, from 16Hz to 16kHz
Boost or Cut: –15dB to 15dB
Maximum Output at 1kHz:
+17dBV full band, flat EQ
Maximum Input at 1kHz: +17dBV
Gain: 0dB nominal, ±0.5dB limit with all
bands flat
Output Noise: –95dBV limit with all bands
flat –85dBV limit with typical speaker
EQ curve
Crosstalk at 1kHz: –70dBV
Accuracy:
±5% nominal center frequency accuracy
±10% nominal Q accuracy
Size:
2.82"H x 2.24"W
(70.5 mm x 56.8 mm)
Features:
• 5 fully independent parametric EQ bands
for each channel
• Allows each band to be set to any center
frequency
Line Level Output with Limiter module block diagram
16
DISASSEMBLY/ASSEMBLY PROCEDURES
Module Installation Locations
The diagrams below show where the
various types of modules available for the
Entero
installed in the chassis.
Entero SE 16 Audio Processor input slots
TM
SE 16 audio processor should be
Entero SE 16 Audio Processor
router slots
DSP modules
require four audio
processing slots.
These can be either
input or output
processing slots.
Entero SE 16 Audio Processor audio
processing slots
Entero SE 16 Audio Processor 4x4 DSP
installation diagram
Entero SE 16 Audio Processor output slots
17
DISASSEMBLY/ASSEMBLY PROCEDURES
Note: Refer to Figure 1 on page 32 for the
following procedures.
1. Top Cover Removal
1.1 Remove the seven screws that secure
the top cover (1) to the chassis (13).
1.2 Lift the rear of the top cover and slide
the cover to the rear of the chassis.
1.3 Lift off the top cover.
2. Top Cover Replacement
2.1 Align the top cover (1) with the chassis
(13).
2.2 Slide the front of the top cover under the
lip on the front of the chassis.
2.3 Secure the top cover to the chassis
using the seven screws removed in step
1.1.
3. Power Supply Removal
3.1 Perform procedure 1.
3.2 Unplug the the two cables from the
power supply (2) at J1 and J2.
Note: These cables can be difficult to
remove. Be careful not to damage the
power supply board.
3.3 Remove the four screws that secure the
power supply to the chassis (13).
4.2 Align the power supply with the studs
located in the bottom of the chassis (13).
4.3 Secure the power supply to the chassis
using the four screws and one 5/16”
locknut removed in steps 3.3 and 3.4.
5. Bose® Control Module Removal
5.1 Perform procedure 1.
5.2 Remove the three 5/16” locknuts that
secure the Bose control module (10) to
the motherboard (11).
5.3 Lift the Bose control module straight
up until it is clear of the connectors.
Be careful not to bend the pins on the
connectors.
6. Bose Control Module Replacement
6.1 Align the connectors on the Bose
control module (10) with those on the
motherboard (11).
Note: The connectors are different sizes.
The module will fit only one way.
6.2 Gently press the Bose control module
down until it is fully seated in the
motherboard connectors.
6.3 Secure the Bose control module to the
motherboard using the three 5/16” locknuts
removed in step 5.2. Do not overtighten.
7. Input or Output Module Removal
3.4 Remove the one 5/16” locknut that
secures the power supply bracket (9) to
the chassis.
3.5 Lift the power supply out of the chassis.
4. Power Supply Replacement
4.1 Be sure the power supply bracket (9) is
properly aligned and attached to the heat
sink on the power supply (2) using two
screws.
7.1 Perform procedure 1.
7.2 Remove one screw located at the rear
of the chassis (13) which secures the
module in the chassis.
7.3 Using a gentle rocking motion, lift
the module off of the motherboard (11)
connectors and chassis.
18
DISASSEMBLY/ASSEMBLY PROCEDURES
8. Input or Output Module Replacement
8.1 Align the module connectors with
the corresponding connectors on the
motherboard (11).
Note: Input and Output modules are installed in different locations on the
motherboard. Incorrect module placement
may damage the module and/or the
motherboard. Refer to the silkscreen on the
rear of the chassis (13).
8.2 With the connectors properly aligned,
press the module in place until it is fully
seated in the motherboard connectors.
8.3 Secure the module in place using the
screw removed in step 7.2.
9. 4x4 DSP Module Removal
Note: The 4x4 DSP module processes
audio for four motherboard channels at
once. As a result, it’s installed differently
than an audio processing module. It’s used
in conjunction with a Null module and the
DSP Sidecar PCB, which uses an 8 conductor ribbon cable to connect the audio
from the DSP PCB to the other two channels on the motherboard.
10. 4x4 DSP Module Replacement
Note: The 4x4 DSP module processes
audio for four motherboard channels at
once. As a result, it’s installed differently
than an audio processing module. It’s used
in conjunction with a Null module and the
DSP Sidecar PCB, which uses an 8 conductor ribbon cable to connect the audio
from the DSP PCB to the other two channels on the motherboard.
10.1 Align the 4x4 DSP module with the
corresponding motherboard connectors.
10.2 Gently press the 4x4 DSP module
into the motherboard connectors until it
is fully seated.
10.3 Install the DSP Sidecar PCB into the
motherboard connector for the two
adjacent channels. This is the small 8 pin
connector located below and just to the
right of the E1 connector on component
side of the installed 4x4 DSP module.
Make sure it is fully seated into the
motherboard connector. Connect the other
end of the ribbon cable to the E1 connector
on the 4x4 DSP module. This cable should
extend straight to the left to connect to E1.
9.1 Disconnect the DSP Sidecar PCB cable
from the E1 connector on the top-left of the
DSP PCB. Unplug the DSP Sidecar PCB
from the motherboard (11) connector.
9.2 Grasp the DSP PCB at the corners and
using a gentle rocking motion, pull the DSP
PCB out of the motherboard connectors.
9.3 Remove the associated Null module
using a gentle rocking motion. This would
be the Null module installed in the 8 pin
motherboard connector located near the
bottom right corner of the installed 4x4 DSP
module.
10.4 Install a Null module in the other 8 pin
motherboard connector located near the
bottom right corner of the component side
of the installed 4x4 DSP module. This Null
module is needed to jumper the audio
information across this connector. Without
this module installed, you will have no
audio output on these two channels.
10.5 Verify that the 4x4 DSP module, the
DSP Sidecar PCB and the required Null
module are properly installed. For example,
if the 4x4 DSP module were installed in
motherboard connectors J108, J208, J116
and J216, then the DSP Sidecar PCB
would be installed into J209 and the Null
module would be installed into J217.
19
DISASSEMBLY/ASSEMBLY PROCEDURES
11. Router Module Removal
11.1 Perform procedure 1.
11.2 Grasp the corners of the Router
module. Using a gentle rocking motion, lift
up on the Router module until it is clear of
the motherboard connectors.
12. Router Module Replacement
12.1 Align the Router module with the
corresponding connectors on the
motherboard (11).
Note: The Router modules must be installed into the correct connectors on the
motherboard. These connectors are located
in the center of the motherboard near J1.
Only the Router modules will fit into these
connectors.
12.2 Gently press the Router module
straight down into the motherboard
connectors until it is fully seated.
13. Motherboard Removal
13.6 Using a 5/16” nutdriver, remove the
three locknuts that secure the Bose
control Module (10) to the motherboard.
Lift the Bose control module straight up to
remove it from the motherboard connectors.
13.7 Using a 1/4” nutdriver, remove the
three standoffs located under the Bose
control module. These standoffs must be
removed to remove the motherboard.
13.8 Lift up on the motherboard, starting at
the edge of the motherboard nearest the
power supply (2).
13.9 Slide the motherboard up and out
toward the front panel of the chassis until
the D52 and D53 LEDs and RJ45 network
connectors have cleared the chassis.
14. Motherboard Replacement
14.1 Align the the motherboard (11) D52
and D53 LEDs and RJ45 network connectors with the corresponding openings in
the chassis (13).
®
13.1 Perform procedure 1.
13.2 Remove all of the Input, Output,
4x4 DSP, Router and audio processing
modules using the disassembly/assembly
procedures located in this section.
13.3 Unplug the power supply to
motherboard cable harness (4) at J1.
Note: Use caution when removing this
connector.
13.4 Using a small flat-head screwdriver,
disconnect the red, green and black wires
that run from the front panel LED harness
assembly (8) to the motherboard (11) at J6.
13.5 Using a phillips-head screwdriver,
remove the fifteen screws that secure the
motherboard (11) into the chassis (13).
14.2 Slide the motherboard into the
chassis, aligning it with the chassis screw
studs. Make sure that the RJ45 network
connectors and LEDs D52 and D53 protrude through their openings in the rear of
the chassis.
14.3 Secure the motherboard to the
chassis using the fifteen screws removed
in step 13.5.
14.4 Using a 1/4” nutdriver, install the three
standoffs removed in step 13.7
14.5 Reinstall the Bose control module (10)
into its connectors on the motherboard.
Be careful not to bend the pins on the
connectors.
14.6 Using a 5/16” nutdriver, secure the
Bose control module to the chassis using
the three locknuts removed in step 13.6
20
DISASSEMBLY/ASSEMBLY PROCEDURES
14.7 Re-connect the power supply to
motherboard cable harness (4) from
the power supply (2) to motherboard
connector at J1.
14.8 Using a small flat-blade screwdriver,
re-connect the Front Panel LED harness
(8) wires to motherboard connector J6.
Be sure that the green, red and black wires
are installed in the correct locations, and
that there are no strands of wire shorting
across to the other wires.
14.9 Reinstall the Input, Output, Router, 4x4
DSP, Null Module and audio processing
Modules using the disassembly/assembly
procedures located earlier in this section.
15. Fan Removal
15.1 Perform procedure 3.
16.4 Observing polarity, solder the wires
from the power supply harness and the
new fan together. Insulate the connections
using heat shrink tubing.
16.5 Perform procedure 4.
15.2 With the chassis disconnected from
AC mains, cut the red and black wires that
run from the power supply (2) connector at
J2 to the fan (12).
15.3 Remove the four locknuts that secure
the fan to the chassis (13). Slide the fan off
of the chassis studs.
16. Fan Replacement
16.1 Slide the fan (12) over the four chassis
studs. Be sure to face the fan in the same
direction as the original for correct airflow.
16.2 Secure the fan to the chassis (13)
using the four locknuts removed in step
15.4. Do not overtighten them or you will
crack the fan housing.
16.3 Strip the red and black wires from the
power supply (2) harness at J2 and the
wires from the new fan.
21
TEST PROCEDURES
Test Setup Parameters
In order to perform these tests, you will
need the following:
®
• A Microsoft
computer with at least 40Mbytes of hard
disk space, 32Mbytes of RAM and a CD
ROM drive.
• Bose
Owner’s Guide.
• Windows 95 or Windows NT 4.0.
• Network Interface Card, such as the
Echelon® PCNSI for desktops or the
PCC-10 for laptops.
• An Entero SE 16 audio processor
chassis to be used as a test-bed.
• A length of CAT-5 network cable long
enough to reach from the network card
in your PC to your Entero chassis.
1. Verify that the Entero software is
properly installed and operating on the
computer that you will be using for these
tests. If the software is not installed, refer to
the Entero Designer Software User’s Guide.
2. Verify that the Echelon Network Interface
Card is installed and working properly.
3. Connect the CAT-5 cable from your PC to
the Entero SE 16 audio processor chassis
under test.
1. Power Up Test
1.1 Remove the top cover using disassem-
bly/assembly procedure 1.
®
Windows® compatible
Entero™ software (CD ROM) and
1.4 Turn on the power switch on the front
panel of the SE 16 audio processor.
1.5 Turn on the Variac and slowly increase
the AC mains voltage to the proper level
while observing the SE 16 audio processor
for problems.
1.6 The front panel LED may illuminate if
the neuron module has been previously
configured, otherwise it remains off.
1.7 Verify that the fan is operating and
drawing air into the front of the chassis.
1.8 Using a Voltmeter, check the AC and
DC voltages at the power supply in accordance with the following table.
1.2 Using an Ohmmeter, verify that the
fuses are good. Also make sure they are
the correct value in accordance with the
part list in the back of this manual.
1.3 Connect an AC mains cable to the unit
under test. Connect the other end of the AC
mains cable to a Variac.
Caution: Use care when working inside
the chassis with AC mains power applied.
Note: If any of the DC voltages in the table
are low, remove AC mains power and
unplug J1 on the motherboard. Re-apply
AC mains power to the chassis and recheck the DC voltage levels at J2 of the
power supply.
If the DC voltage is now at the correct level,
then the problem is on the motherboard.
22
TEST PROCEDURES
1.9 Measure the motherboard DC voltages
at motherboard connectors J100-J147 in
accordance with the following table.
All measurements are referenced to pin 10
of the connector you are testing.
Refer to the motherboard schematic
diagram for more information.
Note: Be careful not to short across pins
during these tests.
1.10 Measure the motherboard DC voltages
at motherboard connectors J348-J355 in
accordance with the following table. All
measurements are referenced to pin 10 of
the connector you are testing.
Refer to the motherboard schematic
diagram for more information.
Note: Be careful not to short across pins
during these tests.
2.1 Verify that the modules are properly
installed in the desired test configuration.
If you are testing a failed chassis you would
configure the modules as they were when
the chassis failed.
2.2 Apply AC mains voltage to the chassis
under test. Turn the front panel power
switch ON.
2.3 In the Microsoft
®
Windows® operating
system, click START, and select the icon to
TM
open the Entero
Designer software.
Using the Entero Graphical User Interface
(GUI), add the device (SE 16 chassis) to
the GUI. When the GUI window opens,
click on the DEVICE FINDER tab at the
bottom of the window as shown below.
circuitry on the motherboard. They do not
test every IC 100%. The following circuits
will be exercised during these tests.
• Neuron module with Flash memory
• RJ45 connectors and EMI filtering
• Oscillator and divider circuitry
• PLDs U54 and U55
• Clock, Data, Enable and Channel Select
signals
• Module ID Mux chain
• Peak detect Mux chain
• A/D Converter and Dump circuit
• Service Pin and drive circuitry
• LEDs and drive circuitry
The view will change to the device view.
At the top of the GUI window, click on the
TOOLS pull-down menu. Select ADD
DEVICE as shown below.
23
TEST PROCEDURES
When the box opens, open the
PROCESSING folder,
and click on the file named Bose
SE16.dev. Click OPEN.
Click on the icon once to highlight it, and
click on the TOOLS list at the top of the GUI
window. In the pull-down menu, select
ATTACH.
®
The dialog box shown below will open.
You will see a triangular icon with an “X”
through it appear in the white left-hand
column.
Select the “Service Pin” option in the dialog
box. Press the service pin on the rear of
the SE 16 chassis. Ensure that the yellow
“service” LED on the rear panel of the
chassis illuminates when you press the
service pin. You will get the dialog shown
below.
24
TEST PROCEDURES
2.4 When this dialog box opens, click on
the “Configure for Hardware Modules”
option. Verify that the green LED on the
chassis rear panel illuminates during this
procedure. The front panel LED should now
be a solid green.
2.5 You should now see a gray block with
56 sections in the gray right-hand column
with icons for the various installed modules
in them. The “X” through the icon for the
SE16 processor should be gone. See the
example below.
Using the Entero GUI, verify that all of the
modules installed in the chassis were
discovered correctly by the GUI. As you
click on each one of the icons in the gray
block. The controls for that module should
appear to the right of the gray block.
Make sure that the correct controls for the
module appear. See the photos on the
following pages for examples.
If the module is not correctly discovered,
replace it with a known good one and
repeat these tests.
3. Automatic Clock Switching Tests
Note: These tests verify the functionality
of the DSP clock routing to J108-J115 and
J132-J139. The following circuits will be
exercised during these tests.
• DSP module ID Detectors
• DSP Clock MUXing
3.1 With no DSP modules installed, apply
AC mains power to the EnteroTM chassis
under test. Place the front panel power
switch to the ON position.
3.2 Configure the chassis in the Entero GUI
for the installed modules using the Module
Discovery tests in this section. Verify that
the modules were correctly discovered.
3.3 Using a frequency counter or oscilloscope, verify that there is no 10 MHz clock
signal present at pin 4 of the input signal
processing connectors at J108, J110, J112,
J114 and the output signal processing
connectors at J132, J134, J136 and J138
of the motherboard.
3.4 Place the chassis front panel switch to
the OFF position. Install a DSP module into
the input or output signal processing connectors that you want to test. For example,
lets install the DSP module into J108, J208,
J116, J216, J209 and J217. In this case the
DSP sidecar module used with the DSP
module would install into J209 and the
other end of the ribbon cable plugs into E1
on the DSP card. A signal pass-thru or null
module would normally be installed in J217
as well to pass the audio for that channel to
the rest of the motherboard. Place the front
panel power switch to the ON position.
3.5 Configure the chassis in the Entero GUI
for the installed modules using the Module
Discovery tests in this section. Verify that
the DSP module was correctly discovered.
3.6 Using a frequency counter or oscilloscope, verify that the 10 MHz clock signal
now appears on the DSP at J1 pin 4 of the
DSP board.
3.7 Repeat these tests for the rest of the
connectors you want to test as listed in
step 3.3. For example, the next connector
for test would be J110. Install the DSP
module and configure the chassis.
Using a frequency counter, verify that there
is now a 10 MHz signal at J110 pin 4.
25
TEST PROCEDURES
4. Signal Path Tests
4.1 Populate the chassis with modules in
the same configuration as when the module
or chassis failed (see the example in the
diagram below). In this way you should be
able to determine whether or not you have
a failed module or a failed channel on the
motherboard.
Note: In order to pass an audio signal
through the chassis you will need an Input
module, Output module, Router and Null
modules. The Null modules (also referred
to as Signal Pass-Thru modules) are used
to jumper the audio signal through the
unused audio connectors on the
motherboard. Without these modules in
place, you will not pass audio through the
chassis on that motherboard channel.
4.2 Once the chassis is configured physically, you will need to configure the modules
in the EnteroTM GUI as shown in the following examples. You will set up only the
modules that are actually used in the signal
path of the chassis channel you want to
test.
Mic/Line Level Input Module
Set the GUI controls for this module as
shown in the above figure.
1. Input Gain 1 and 2: 0 dB
2. Attack 1 and 2: 1 mS
3. Release 1 and 2: 500 mS
4. Threshold 1 and 2 slider: +17 dB
5. Output Gain 1 and 2 slider: 0 dB
6. Phantom Power 1 and 2: unchecked
7. Mute 1 and 2: unchecked
GUI showing Entero chassis populated with modules to be tested
26
TEST PROCEDURES
Line Level Input Module
Set the GUI controls for this module as
shown in the above figure.
1. Output Gain sliders for both
channels: 0 dB
2. Channel Couple: unchecked
3. Mute for both channels: unchecked
16x2 Router Module
Set the GUI controls for this module as
shown in the above figure.
1. Channel 1 input to channel 1 output
2. Channel 2 input to channel 2 output
3. Channels 1 and 2 NOT summed
Note: Channel 1 and 2 shown above,
setup also applies to channels 3 through 8.
4x4 DSP - Empty Block Diagram (Note: 0 dBV on analog meter = -17 dBFS on DSP meter)
27
TEST PROCEDURES
5-Band Parametric EQ (configure for flat frequency response)
Fixed EQs (measured at 700 Hz)
Set the GUI controls for this module as
shown in the above figure.
1. Low Pass Filter (LPF) channel 1 and 2:
Default
2. High Pass Filter (HPF) channel 1 and 2:
Full Range
Line Level Output Module
Set the GUI controls for this module as
shown in the above figure.
1. Channel 1 and 2 Gain Sliders: 0 dB
2. Channel 1 and 2 Couple button:
unchecked
3. Channel 1 and 2 Mute buttons:
unchecked
28
TEST PROCEDURES
Line Level Output with Limiter Module
Signal Path Tests (continued)
4.3 Apply a 0 dBV (1 Vrms), 1 kHz signal to
the channel 1 and 2 inputs located on the
Input Module.
4.4 Using the GUI, check the signal levels
on the module meters. Verify that the 0 dBV
sine wave is passing through each module
in the chassis. If the sine wave goes into a
card, but not out, check the settings for that
module and ensure that it is set up correctly.
4.5 If the module settings are correct, and
audio is still not flowing out of a module,
then swap out the module with a known
good module, if available, to verify that the
module under test has failed.
Set the GUI controls for this module as
shown in the previous figure.
1. Attack 1 and 2: 1 mS
2. Release 1 and 2: 500 mS
3. Channel 1 and 2 Gain sliders: 0 dB
4. Channel 1 and 2 Threshold: +17 dB
5. Channel 1 and 2 Couple: unchecked
6. Channel 1 and 2 Mute buttons:
unchecked.
4.6 If you have audio coming out of both
channels, but it is distorted, then:
4.6.1 Verify that the signal applied to the
input modules is not distorted.
4.6.2 Check the meters on the various
modules to be sure that the signal is not
being overloaded by too high gain.
Verify setup of the modules using the
setup diagrams on the previous pages
of this section.
4.7 If the audio output is still distorted,
sequentially replace the modules with
known good modules until the distortion is
eliminated. Return the defective module for
replacement.
29
PART LIST NOTES
1. This part is not normally available from Customer Service. Approval from the Field Service
Manager is required before ordering.
2. The individual parts located on the PCBs are listed in the Electrical Part List.
3. This part is critical for safety purposes. Failure to use a substitute replacement with the
same safety characteristics as the recommended replacement part might create shock, fire
and/or other hazards.
®
4. The 80 Watt Power Supply, Bose
manufactured by:
part number 181269, is a purchase for resale item that is
The part numbers listed in the part list for the 80 Watt Power Supply are the part numbers
used by Artesyn Technologies, and are provided for informational purposes. If you have a
defective power supply in your Entero
TM
SE 16 chassis, it is recommended that you purchase
a replacement power supply from Bose Corporation. If the power supply is no longer
available, then you may need to repair your defective unit using the information supplied in
this manual.
30
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