ASRock H55M-GE User Manual

H55M-GE

User Manual

Version 1.0

Published May 2010

No part of this manual may be reproduced, transcribed, transmitted, or translated in

any language, in any form or by any means, except duplication of documentation by

the purchaser for backup purpose, without written consent of ASRock Inc.

Products and corporate names appearing in this manual may or may not be regis-

tered trademarks or copyrights of their respective companies, and are used only for

identification or explanation and to the owners’ benefit, without intent to infringe.

Disclaimer:Disclaimer:

Disclaimer:

Disclaimer:Disclaimer:

Specifications and information contained in this manual are furnished for informa-

tional use only and subject to change without notice, and should not be constructed

as a commitment by ASRock. ASRock assumes no responsibility for any errors or

omissions that may appear in this manual.

With respect to the contents of this manual, ASRock does not provide warranty of

any kind, either expressed or implied, including but not limited to the implied warran-

ties or conditions of merchantability or fitness for a particular purpose.

In no event shall ASRock, its directors, officers, employees, or agents be liable for

any indirect, special, incidental, or consequential damages (including damages for

loss of profits, loss of business, loss of data, interruption of business and the like),

even if ASRock has been advised of the possibility of such damages arising from any

defect or error in the manual or product.

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that

may cause undesired operation.

CALIFORNIA, USA ONLY

The Lithium battery adopted on this motherboard contains Perchlorate, a toxic

substance controlled in Perchlorate Best Management Practices (BMP) regulations

passed by the California Legislature. When you discard the Lithium battery in

California, USA, please follow the related regulations in advance.

“Perchlorate Material-special handling may apply, see

www.dtsc.ca.gov/hazardouswaste/perchlorate”

ASRock Website: http://www.asrock.com

ContentsContents

Contents

ContentsContents

1 Introduction1 Introduction

1 Introduction

1 Introduction1 Introduction

1.1 Package Contents .......................................................... 5

1.2 Specifications ................................................................ 6

1.3 Motherboard Layout ...................................................... 11

1.4 I/O Panel ......................................................................... 12

2 Installation2 Installation

2 Installation

2 Installation2 Installation

2.1 Screw Holes ................................................................. 13

2.2 Pre-installation Precautions ........................................... 13

2.3 CPU Installation .............................................................. 14

2.4 Installation of Heatsink and CPU fan ............................. 16

2.5 Installation of Memory Modules (DIMM) ......................... 17

2.6 Expansion Slots (PCI and PCI Express Slots) ..................... 19

2.7 Jumpers Setup .............................................................. 20

2.8 Onboard Headers and Connectors .............................. 21

2.9 SATAII Hard Disk Setup Guide ....................................... 25

2.10 Serial ATA (SATA) / Serial ATAII (SATAII) Hard Disks

Installation ...................................................................... 26

2.11 Hot Plug Function for SATA / SATAII HDDs .................. 26

2.12 SATA / SATAII HDD Hot Plug Feature and Operation

Guide .............................................................................. 27

2.13 Driver Installation Guide ................................................. 29

2.14 Installing Windows® 7 / 7 64-bit / Vista

/ XP / XP 64-bit ............................................................... 29

2.14.1 Installing Windows® XP / XP 64-bit .................... 29

2.14.2 Installing Windows® 7 / 7 64-bit / VistaTM /

VistaTM 64-bit ..................................................... 29

2.15 Untied Overclocking Technology ................................... 30

3 BIOS S3 BIOS S

3 BIOS S

3 BIOS S3 BIOS S

3.1 Introduction3.1 Introduction

3.1 Introduction

3.1 Introduction3.1 Introduction

ETUP UTILITYETUP UTILITY

ETUP UTILITY

ETUP UTILITYETUP UTILITY

3.1.1 BIOS Menu Bar .................................................... 31

3.1.2 Navigation Keys ................................................... 31

3.2 Main Screen ................................................................... 32

3.3 OC Tweaker Screen...................................................... 33

3.4 Advanced Screen ......................................................... 37

3.4.1 CPU Configuration ................................................ 38

3.4.2 Chipset Configuration .......................................... 40

3.4.3 ACPI Configuration ............................................... 41

3.4.4 Storage Configuration ......................................... 42

......................................................................................................

...................................................

......................................................................................................

............................................................................................................

......................................................

............................................................................................................

/ VistaTM 64-bit

......................................................................................

...........................................

......................................................................................

..........................................................................................

.............................................

..........................................................................................

5 5

13 13

31 31

3.4.5 PCIPnP Configuration ........................................... 44

3.4.6 Super IO Configuration ........................................ 45

3.4.7 USB Configuration ............................................... 46

3.5 Hardware Health Event Monitoring Screen .................. 47

3.6 Boot Screen................................................................... 48

3.6.1 Boot Settings Configuration .................................. 48

3.7 Security Screen ............................................................ 49

3.8 Exit Screen .................................................................... 50

4 Software Support4 Software Support

4 Software Support

4 Software Support4 Software Support

4.1 Install Operating System ............................................... 51

4.2 Support CD Information ................................................. 51

4.2.1 Running Support CD ............................................ 51

4.2.2 Drivers Menu ........................................................ 51

4.2.3 Utilities Menu ........................................................ 51

4.2.4 Contact Information .............................................. 51

......................................................................................

...........................................

......................................................................................

51 51

Chapter 1: IntroductionChapter 1: Introduction

Chapter 1: Introduction

Chapter 1: IntroductionChapter 1: Introduction

Thank you for purchasing ASRock H55M-GE motherboard, a reliable motherboard

produced under ASRock’s consistently stringent quality control. It delivers excellent

performance with robust design conforming to ASRock’s commitment to quality and

endurance.

In this manual, chapter 1 and 2 contain introduction of the motherboard and step-by-step

guide to the hardware installation. Chapter 3 and 4 contain the configuration guide to

BIOS setup and information of the Support CD.

Because the motherboard specifications and the BIOS software might

be updated, the content of this manual will be subject to change without

notice. In case any modifications of this manual occur, the updated

version will be available on ASRock website without further notice. You

may find the latest VGA cards and CPU support lists on ASRock website

as well. ASRock website

If you require technical support related to this motherboard, please visit

our website for specific information about the model you are using.

www.asrock.com/support/index.asp

1.1 P1.1 P

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1.1 P

1.1 P1.1 P

ASRock H55M-GE Motherboard

(Micro ATX Form Factor: 9.6-in x 8.7-in, 24.4 cm x 22.1 cm)

ASRock H55M-GE Quick Installation Guide ASRock H55M-GE Support CD

2 x Serial ATA (SATA) Data Cables (Optional)

1 x I/O Panel Shield

age Contentsage Contents

ack

age Contents

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age Contentsage Contents

http://www.asrock.com

1.21.2

SpecificationsSpecifications

1.2

Specifications

1.21.2

SpecificationsSpecifications

Platform - Micro ATX Form Factor: 9.6-in x 8.7-in, 24.4 cm x 22.1 cm

- All Solid Capacitor design (100% Japan-made high-quality

Conductive Polymer Capacitors) (H55M-GE R2.0)

CPU - Supports Intel

CoreTM i7 / i5 / i3 and Pentium® G6950

Processors in LGA1156 Package

- Supports Intel

Turbo Boost Technology (see CAUTION 1)

- Supports Hyper-Threading Technology (see CAUTION 2)

- Supports Untied Overclocking Technology (see CAUTION 3)

- Supports EM64T CPU

Chipset - Intel

H55

Memory - Dual Channel DDR3 Memory Technology (see CAUTION 4)

- 4 x DDR3 DIMM slots

- Supports DDR3 2600+(OC)/2133(OC)/1866(OC)/1600/

1333/1066 non-ECC, un-buffered memory

- Max. capacity of system memory: 16GB (see CAUTION 5)

- Supports Intel® Extreme Memory Profile (XMP) (see CAUTION 6)

Expansion Slot - 1 x PCI Express 2.0 x16 slot (5GT/s at x16 mode)

- 1 x PCI Express 2.0 x1 slot (2.5GT/s)

- 2 x PCI slots

Graphics * * Requires a Processor with Intel

Graphics Technology

- Intel® HD Graphics

- Pixel Shader 4.0, DirectX 10

- Max. shared memory 1759MB (see CAUTION 7)

- Three VGA Output options: D-Sub, DVI-D and HDMI (see CAUTION 8)

- Supports HDMI 1.3a Technology with max. resolution up to

1920x1200

- Supports DVI with max. resolution up to 1920x1200 @ 60Hz

- Supports D-Sub with max. resolution up to 2048x1536 @

75Hz

- Supports Auto Lip Sync, Deep Color (12bpc), xvYCC and

HBR (High Bit Rate Audio) with HDMI 1.3a (Compliant HDMI monitor is required) (see CAUTION 9)

- Supports HDCP function with DVI and HDMI ports

- Supports Full HD 1080p Blu-ray (BD) / HD-DVD playback with

DVI and HDMI ports

Audio - 5.1 CH HD Audio (VIA

VT1705 Audio Codec)

LAN - PCIE x1 Gigabit LAN 10/100/1000 Mb/s

- Realtek RTL8111E

- Supports Wake-On-LAN

- Supports LAN Cable Detection

Rear Panel I/O I/O Panel

- 1 x PS/2 Keyboard Port

- 1 x VGA/D-Sub Port

- 1 x VGA/DVI-D Port

- 1 x HDMI Port

- 6 x Ready-to-Use USB 2.0 Ports

- 1 x RJ-45 LAN Port with LED (ACT/LINK LED and SPEED

LED)

- HD Audio Jack: Line in/Front Speaker/Microphone

Connector - 6 x SATAII 3.0Gb/s connectors, support NCQ, AHCI and “Hot

Plug” functions (see CAUTION 10)

- 1 x IR header

- 1 x Print Port header

- 1 x COM port header

- 1 x HDMI_SPDIF header

- 1 x TPM header

- 1 x Chassis Intrusion header

- CPU/Chassis/Power FAN connector

- 24 pin ATX power connector

- 4 pin 12V power connector

- Front panel audio connector

- 3 x USB 2.0 headers (support 6 USB 2.0 ports) (see CAUTION 11)

BIOS Feature - 16Mb AMI Legal BIOS

- Supports “Plug and Play”

- ACPI 1.1 Compliance Wake Up Events

- Supports jumperfree

- SMBIOS 2.3.1 Support

- CPU VID, CPU GFX, VCCM, VTT, PCH PLL Voltage

Multi-adjustment

Support CD - Drivers, Utilities, AntiVirus Software (Trial Version),

ASRock Software Suite (CyberLink DVD Suite and Creative

Sound Blaster X-Fi MB) (OEM and Trial Version)

Unique Feature - ASRock OC Tuner (see CAUTION 12)

- Intelligent Energy Saver (see CAUTION 13)

- Instant Boot

- ASRock Instant Flash (see CAUTION 14)

- ASRock OC DNA (see CAUTION 15)

- Hybrid Booster:

- CPU Frequency Stepless Control (see CAUTION 16)

- ASRock U-COP (see CAUTION 17)

- Boot Failure Guard (B.F.G.)

- Combo Cooler Option (C.C.O.) (see CAUTION 18)

- Good Night LED

- Turbo 50 / Turbo 100 GPU Overclocking (Requires a

Processor with Intel® Graphics Technology)

Hardware - CPU Temperature Sensing Monitor - Chassis Temperature Sensing

- CPU/Chassis/Power Fan Tachometer

- CPU Quiet Fan

- CPU/Chassis Fan Multi-Speed Control

- CASE OPEN detection

- Voltage Monitoring: +12V, +5V, +3.3V, CPU Vcore

OS - Microsoft

Windows® 7 / 7 64-bit / Vista

/ VistaTM 64-bit

/ XP / XP 64-bit compliant

Certifications - FCC, CE, WHQL

- ErP/EuP Ready (ErP/EuP ready power supply is required) (see CAUTION 19)

* For detailed product information, please visit our website: http://www.asrock.com

WA R NING

Please realize that there is a certain risk involved with overclocking, including adjusting

the setting in the BIOS, applying Untied Overclocking Technology, or using the third-

party overclocking tools. Overclocking may affect your system stability, or even

cause damage to the components and devices of your system. It should be done at

your own risk and expense. We are not responsible for possible damage caused by

overclocking.

CAUTION!

1. Intel® CoreTM i3 and Pentium® G6950 processors do not support Intel

Turbo Boost Technology.

2. About the setting of “Hyper Threading Technology”, please check page 38.

3. This motherboard supports Untied Overclocking Technology. Please read

“Untied Overclocking Technology” on page 30 for details.

4. This motherboard supports Dual Channel Memory Technology. Before you

implement Dual Channel Memory Technology, make sure to read the

installation guide of memory modules on page 17 for proper installation.

5. Due to the operating system limitation, the actual memory size may be

less than 4GB for the reservation for system usage under Windows® 7 /

/ XP. For Windows® OS with 64-bit CPU, there is no such limitation.

Vista

6. For those CPU that only support up to DDR3 1333, the XMP DDR3 1600

is supported through overclocking.

7. The maximum shared memory size is defined by the chipset vendor and

is subject to change. Please check Intel® website for the latest information.

8. You can choose to use two of the three monitors only. D-Sub, DVI-D and

HDMI monitors cannot be enabled at the same time. Besides, with the DVI-

to-HDMI adapter, the DVI-D port can support the same features as HDMI

port.

9. xvYCC and Deep Color are only supported under Windows

Deep Color mode will be enabled only if the display supports 12bpc in

EDID. HBR is supported under Windows® 7 64-bit / 7 / VistaTM 64-bit /

Vista

10. Before installing SATAII hard disk to SATAII connector, please read the

“SATAII Hard Disk Setup Guide” on page 25 to adjust your SATAII hard disk

drive to SATAII mode. You can also connect SATA hard disk to SATAII

connector directly.

11. Power Management for USB 2.0 works fine under Microsoft

64-bit / 7 / Vista

64-bit / VistaTM / XP 64-bit / XP SP1 or SP2.

12. It is a user-friendly ASRock overclocking tool which allows you to surveil

your system by hardware monitor function and overclock your hardware

devices to get the best system performance under Windows

Please visit our website for the operation procedures of ASRock OC

Tuner.

ASRock website:

http://www.asrock.com/feature/OCTuner/index.htm

13. Featuring an advanced proprietary hardware and software design,

Intelligent Energy Saver is a revolutionary technology that delivers

unparalleled power savings. In other words, it is able to provide exceptional

power saving and improve power efficiency without sacrificing computing

performance. Please visit our website for the operation procedures of

Intelligent Energy Saver.

ASRock website:

http://www.asrock.com/feature/IES/index.html

7 64-bit / 7.

Windows® 7

environment.

14. ASRock Instant Flash is a BIOS flash utility embedded in Flash ROM.

This convenient BIOS update tool allows you to update system BIOS

without entering operating systems first like MS-DOS or Windows®. With

this utility, you can press <F6> key during the POST or press <F2> key to

BIOS setup menu to access ASRock Instant Flash. Just launch this tool

and save the new BIOS file to your USB flash drive, floppy disk or hard

drive, then you can update your BIOS only in a few clicks without prepar-

ing an additional floppy diskette or other complicated flash utility. Please

be noted that the USB flash drive or hard drive must use FAT32/16/12 file

system.

15. The software name itself – OC DNA literally tells you what it is capable of.

OC DNA, an exclusive utility developed by ASRock, provides a conve-

nient way for the user to record the OC settings and share with others. It

helps you to save your overclocking record under the operating system

and simplifies the complicated recording process of overclocking settings.

With OC DNA, you can save your OC settings as a profile and share with

your friends! Your friends then can load the OC profile to their own system

to get the same OC settings as yours! Please be noticed that the OC

profile can only be shared and worked on the same motherboard.

16. Although this motherboard offers stepless control, it is not recommended

to perform over-clocking. Frequencies other than the recommended CPU

bus frequencies may cause the instability of the system or damage the

CPU.

17. While CPU overheat is detected, the system will automatically shutdown.

Before you resume the system, please check if the CPU fan on the

motherboard functions properly and unplug the power cord, then plug it

back again. To improve heat dissipation, remember to spray thermal

grease between the CPU and the heatsink when you install the PC system.

18. Combo Cooler Option (C.C.O.) provides the flexible option to adopt two

different CPU cooler types, Socket LGA 775 and LGA 1156. Please be

noticed that not all the 775 CPU Fan can be used.

19. EuP, stands for Energy Using Product, was a provision regulated by

European Union to define the power consumption for the completed system.

According to EuP, the total AC power of the completed system shall be

under 1.00W in off mode condition. To meet EuP standard, an EuP ready

motherboard and an EuP ready power supply are required. According to

Intel’s suggestion, the EuP ready power supply must meet the standard of

5v standby power efficiency is higher than 50% under 100 mA current

consumption. For EuP ready power supply selection, we recommend you

checking with the power supply manufacturer for more details.

1010

1.3 Motherboard Layout1.3 Motherboard Layout

1.3 Motherboard Layout

1.3 Motherboard Layout1.3 Motherboard Layout

22.1cm (8.7in)

USB2.0 T: US B4 B:USB5

VGA1

DVI_CON1

PS2_USB_PWR1

USB_PWR2

ATX12V1

CPU_FAN1

PWR_FAN1

Dual Channel

Keyboard

PS2

DX10

HDMI1

USB2.0 T: US B2 B:USB3

Gigabit LAN

USB2.0

Top:

T: US B0

RJ-45

B:USB1

Bottom:

MIC IN

Top:

LINE IN

LAN

Center:

FRONT

PHY

HD_AUDIO1

RoHS

AUDIO CODEC

Super

I/O

COM1

LPT1

PCIE2

H55M-GE

PCI Express2.0

PCIE1

Designed inTaipei

PCI1

ErP/EuP Ready

PCI2

CI1

IR1

TPMS1

USB_PWR3

2627

CMOS

Battery

USB10_11

DDR3 2600+

CLRCMOS1

USB8_9

USB6_7

DDR3_A2 (64bit, 240-pin module)

Intel

H55

PANEL1

PLEDPWRBTN

HDLED RESET

DDR3_A1 (64bit, 240-pin module)

HDMI_SPDIF1

DDR3_B2 (64bit, 240-pin module)

SATAII_3

SATAII_6

DDR3_B1 (64bit, 240-pin module)

SATAII_2

SATAII_5

SPEAKER1

1819

ATXPWR1

CHA_FAN1

16Mb BIOS

SATAII_1

SATAII_4

24.4cm (9.6in)

11 12

13 14

1 USB_PWR2 Jumper 19 Sixth SAT AII Connector (SA T AII_6, Blue) 2 PS2_USB_PWR1 Jumper 20 HDMI_SPDIF Header (HDMI_SPDIF1, White) 3 ATX 12V Power Conne ctor (A TX12V1) 21 System Panel Header (PANEL1, White) 4 CPU Fan Connector (CPU_FAN1) 22 USB 2.0 Header (USB6_7, Blue) 5 Power Fan Connector (PWR_FAN1) 23 Clear CMOS Jumper (CLRCMOS1) 6 1156-Pin CPU Socket 24 USB 2.0 Header (USB8_9, Blue) 7 2 x 240-pin DDR3 DIMM Slots 25 USB 2.0 Header (USB10_11, Blue)

(Dual Channel: DDR3_A2, DDR3_B2, Blue) 26 USB_PWR3 Jumper

8 2 x 240-pin DDR3 DIMM Slots 27 TPM Header (TPMS1)

(Dual Channel: DDR3_A1, DDR3_B1, White) 2 8 Infrared Module Header (IR1) 9 ATX Power Connector (A TXPWR1) 29 Print Port Header (LPT1, White) 10 Chassis Fan Connector (CHA_FAN1) 30 Chassis Intrusion Header (CI1) 11 Intel H55 Chipset 31 COM Port Header (COM1) 12 Third SATAII Conne ctor (SA T AII_3, Blue) 32 PCI Slot (PCI2) 13 16Mb SPI Flash 33 PCI Express 2.0 x1 Slot (PCIE2, White) 14 Secondary SATAII Conne ctor (SA T AII_2, Blue) 34 PCI Slot (PCI1) 15 Primary SATAII Connector (SA T AII_1, Blue) 35 PCI Express 2.0 x16 Slot (PCIE1, Blue) 16 Fourth SAT AII Connector (SA TAII_4, Blue) 36 Front Panel Audio Header 17 Fifth SAT AII Connector (SA T AII_5, Blue) (HD_AUDIO1, White) 18 Chassis Speaker Header (SPEAKER 1, White)

1111

1.41.4

1.4

1.41.4

I/O PanelI/O Panel

I/O Panel

I/O PanelI/O Panel

1 USB 2.0 Ports (USB45) 7 USB 2.0 Ports (USB01) 2 VGA/D-Sub Port 8 USB 2.0 Ports (USB23) 3 LAN RJ-45 Port 9 HDMI Port 4 Line In (Light Blue) 10 VGA/DVI-D Port 5 Front Speaker (Lime) 11 PS/2 Keyboard Port (Purple) 6 Microphone (Pink)

* There are two LED next to the LAN port. Please refer to the table below for the LAN port LED

indications.

Activity/Link LED SPEED LED

Status Description Status Description

LAN Port LED Indications

Off No Link Off 10Mbps connection

Blinking Data Activity Orange 100Mbps connection

On Link Green 1Gbps connection

ACT/LINK LED

LAN Port

SPEED LED

To enable Multi-Streaming function, you need to connect a front panel audio cable to the front

panel audio header. After restarting your computer, you will find “VIA HD Audio Deck” tool on

your system. Please follow below instructions according to the OS you install. For Windows

Please click “VIA HD Audio Deck” icon , and click “Speaker”. Then you are allowed to

select “2 Channel” or “4 Channel”. Click “Power” to save your change. For Windows® 7 / 7 64-bit / VistaTM / VistaTM 64-bit OS:

Please click “VIA HD Audio Deck” icon , and click “Advanced Options” on the left side

on the bottom. In “Advanced Options” screen, select “Independent Headphone”, and click

“OK” to save your change.

XP / XP 64-bit OS:

1212

Chapter 2: InstallationChapter 2: Installation

Chapter 2: Installation

Chapter 2: InstallationChapter 2: Installation

This is a Micro ATX form factor (9.6" x 8.7", 24.4 x 22.1 cm) motherboard. Before you

install the motherboard, study the configuration of your chassis to ensure that the

motherboard fits into it.

Make sure to unplug the power cord before installing or removing the

motherboard. Failure to do so may cause physical injuries to you and

damages to motherboard components.

2.1 Screw Holes2.1 Screw Holes

2.1 Screw Holes

2.1 Screw Holes2.1 Screw Holes

Place screws into the holes indicated by circles to secure the motherboard to the

chassis.

Do not over-tighten the screws! Doing so may damage the motherboard.

2.2 Pre-installation Precautions2.2 Pre-installation Precautions

2.2 Pre-installation Precautions

2.2 Pre-installation Precautions2.2 Pre-installation Precautions

Take note of the following precautions before you install motherboard components

or change any motherboard settings.

1. Unplug the power cord from the wall socket before touching any component.

2. To avoid damaging the motherboard components due to static electricity, NEVER

place your motherboard directly on the carpet or the like. Also remember to use

a grounded wrist strap or touch a safety grounded object before you handle

components.

3. Hold components by the edges and do not touch the ICs.

4. Whenever you uninstall any component, place it on a grounded antistatic pad or

in the bag that comes with the component.

Before you install or remove any component, ensure that the power is

switched off or the power cord is detached from the power supply.

Failure to do so may cause severe damage to the motherboard, peripherals,

and/or components.

1313

2.3 CPU Installation2.3 CPU Installation

2.3 CPU Installation

2.3 CPU Installation2.3 CPU Installation

For the installation of Intel 1156-Pin CPU,

please follow the steps below.

LoadPlate

LoadLever

Before you insert the 1156-Pin CPU into the socket, please check if

the CPU surface is unclean or if there is any bent pin on the socket.

Do not force to insert the CPU into the socket if above situation is

found. Otherwise, the CPU will be seriously damaged.

Step 1. Open the socket:

Step 1-1. Disengaging the lever by depressing

down and out on the hook to clear

retention tab.

Step 1-2. Rotate the load lever to fully open po-

sition at approximately 135 degrees.

Step 1-3. Rotate the load plate to fully open po-

sition at approximately 100 degrees.

Step 2. Remove PnP Cap (Pick and Place Cap).

ContactArray

1156-Pin Socket Overview

SocketBody

1. It is recommended to use the cap tab to handle and avoid kicking

off the PnP cap.

2. This cap must be placed if returning the motherboard for after

service.

1414

Step 3. Insert the 1156-Pin CPU:

Step 3-1. Hold the CPU by the edge where is

marked with black line.

Step 3-2. Orient the CPU with IHS (Integrated Heat

Sink) up. Locate Pin1 and the two ori-

entation key notches.

orientation key notch

Pin1

orientation key notch

1156-Pin CPU

For proper inserting, please ensure to match the two orientation key

notches of the CPU with the two alignment keys of the socket.

Step 3-3. Carefully place the CPU into the socket

by using a purely vertical motion.

Step 3-4. Verify that the CPU is within the socket

and properly mated to the orient keys.

black line

alignment key

Pin1

alignment key

1156-Pin Socket

Step 4. Close the socket:

Step 4-1. Rotate the load plate onto the IHS.

Step 4-2. While pressing down lightly on load

plate, engage the load lever.

Step 4-3. Secure load lever with load plate tab

under retention tab of load lever.

1515

2.42.4

Installation of CPU Fan and HeatsinkInstallation of CPU Fan and Heatsink

2.4

Installation of CPU Fan and Heatsink

2.42.4

Installation of CPU Fan and HeatsinkInstallation of CPU Fan and Heatsink

This motherboard is equipped with 1156-Pin socket that supports Intel 1156-Pin CPU.

Please adopt the type of heatsink and cooling fan compliant with Intel 1156-Pin CPU

to dissipate heat. Before you installed the heatsink, you need to spray thermal

interface material between the CPU and the heatsink to improve heat dissipation.

Ensure that the CPU and the heatsink are securely fastened and in good contact with

each other. Then connect the CPU fan to the CPU_FAN connector (CPU_FAN1, see

page 11, No. 4).

For proper installation, please kindly refer to the instruction manuals of your CPU fan and heatsink.

Below is an example to illustrate the installation of the heatsink for 1156-Pin CPU.

Step 1. Apply thermal interface material onto center of

IHS on the socket surface.

Apply Thermal Interface Material

Step 2. Place the heatsink onto the socket. Ensure

fan cables are oriented on side closest to the

Fan cableson side closest toMB header

CPU fan connector on the motherboard

(CPU_FAN1, see page 11, No. 4).

Step 3. Align fasteners with the motherboard

Fastener slots pointing straightout

throughholes.

Step 4. Rotate the fastener clockwise, then press

down on fastener caps with thumb to install

and lock. Repeat with remaining fasteners.

Press Down (4 Places)

If you press down the fasteners without rotating them clockwise,

the heatsink cannot be secured on the motherboard.

Step 5. Connect fan header with the CPU fan connector on the motherboard.

Step 6. Secure excess cable with tie-wrap to ensure cable does not interfere with

fan operation or contact other components.

Please be noticed that this motherboard supports Combo Cooler

Option (C.C.O.), which provides the flexible option to adopt two

different CPU cooler types, Socket LGA 775 and LGA 1156. The

white throughholes are for Socket LGA 1156 CPU fan.

1616

+ 35 hidden pages