Artesyn XMCspan User Manual

XMCSPAN

Installation and Use

P/N: 6806800H03C
June 2014

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Contents

Contents

About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

1.3 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.1.1 Environmental Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

2.2 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

2.2.1 Backplane Power Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

2.3 Checking the Box Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2.4 Installing a Mezzanine Card . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

2.5 Installing the Primary XMCspan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

2.6 Installing the Secondary XMCspan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

2.7 Removing the XMCspan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3 Resetting the XMCspa . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.1 Reset Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

4 Controls, LEDs, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4.1 Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

4.2 Face Plate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

4.3 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

4.3.1 VME Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

4.3.2 LED Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

5 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

5.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

5.3 PEX8533 PCI Express Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

XMCSPAN Installation and Use (6806800H03C)

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Contents

Contents

Contents

5.4 PEX8533 Station and Port Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

5.5 XMCspan Stacking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

5.6 Mezzanine Card Sites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

5.7 Mezzanine Card Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

5.8 XMC.3 Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

5.9 PMC AND PRPMC Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

5.10 PCI Buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

5.11 TSI384 PCI EXPRESS-TO-PCI/PCI-X Bridge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

5.12 Serial EEPROM For VPD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

5.13 Clocking Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

5.14 Debugging Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

A Related Documentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

A.1 Artesyn Embedded Technologies - Embedded Computing Documentation . . . . . . . . . . . . . . . . 47

A.2 Manufacturers Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

A.3 Related Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Sicherheitshinweise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

4

XMCSPAN Installation and Use (6806800H03C)

List of Tables

Table 1-1 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Table 1-2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 4-1 Connector Pin-outs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Table 4-2 Pin definition for VME connector P2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Table 4-3 PEX 8533 PCIE Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Table 4-4 Tsi384 PCIE-PCIX PMC2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Table 5-1 I2C Bus Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Table 5-2 Clocking Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Table 5-3 Debugging Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Table A-1 Artesyn Embedded Technologies - Embedded Computing Publications . . . . . . . . . . . . . . 47

XMCSPAN Installation and Use (6806800H03C)

5

List of Tables

6

XMCSPAN Installation and Use (6806800H03C)

List of Figures

Figure 1-1 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Figure 4-1 XMCspan with SCANBE Handles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 4-2 XMCspan with IEEE Handles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 5-1 XMCspan Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

XMCSPAN Installation and Use (6806800H03C)

7

List of Figures

8

XMCSPAN Installation and Use (6806800H03C)

About this Manual

Overview of Contents

This manual describes how to install the mezzanine cards supported by the XMCspan, and how
to install the XMCspan on the VME base board.

Abbreviations

This document uses the following abbreviations:

Abbreviation Definition

CPLD Complex Programmable Logic Device

EEPROM Electrically Erasable Programmable Read-Only Memory

IEEE Institute of Electrical and Electronics Engineers

JTAG Joint Test Access Group

PCI Peripheral Component Interconnect

PCIE PCI Express

PCI-X Peripheral Component Interconnect-X

PMC PCI Mezzanine Card

PrPMC Processor PMC

RFU Reserved for future use

SerDes Serializer/Deserializer

VITA VMEbus International Trade Association

VME Versa Module Eurocard

VPD Vital Product Data

XMC Switched Mezzanine Card

XMCSPAN Installation and Use (6806800H03C)

9

About this Manual

Conventions

The following table describes the conventions used throughout this manual.

Notation Description

0x00000000 Typical notation for hexadecimal numbers (digits are

0b0000 Same for binary numbers (digits are 0 and 1)

bold Used to emphasize a word
Screen Used for on-screen output and code related elements

Courier + Bold Used to characterize user input and to separate it

Reference Used for references and for table and figure

About this Manual

0 through F), for example used for addresses and
offsets

or commands in body text

from system output

descriptions

10

File > Exit Notation for selecting a submenu

<text> Notation for variables and keys

[text] Notation for software buttons to click on the screen

and parameter description

... Repeated item for example node 1, node 2, ..., node

12

.
.
.

.. Ranges, for example: 0..4 means one of the integers

| Logical OR.

Omission of information from example/command
that is not necessary at the time being.

0,1,2,3, and 4 (used in registers).

XMCSPAN Installation and Use (6806800H03C)

Notation Description

Indicates a hazardous situation which, if not avoided,
could result in death or serious injury.

Indicates a hazardous situation which, if not avoided,
may result in minor or moderate injury

Indicates a property damage message.

No danger encountered. Pay attention to important
information.

About this Manual

Summary of Changes

This manual has been revised and replaces all prior editions.

Part Number Publication Date Description

6806800H03A September 2008 First Edition

6806800H03B November 2013 Added section 4.4 LED Information in Chapter 4.

6806800H03C June 2014 Re-branded to Artesyn template.

XMCSPAN Installation and Use (6806800H03C)

11

About this Manual

About this Manual

12

XMCSPAN Installation and Use (6806800H03C)

Introduction

This chapter gives an overview of the features of the XMCspan, lists the standard compliances,
and details the ordering information for the board.

1.1 Features

The XMCspan is a carrier module that provides PCI Express expansion capability to the VME
base board.

The XMCspan has the following features:

 Provides access to XMC/PMC I/O through the front panel or rear transition module

 Provides stacking capability for up to two XMCspan modules

 Compatibility with the MVME7100 board

 Compatibility with the MVME7100 board

Chapter 1

 Support for two single-wide XMC/PMC/PrPMC modules, or one double-width

XMC/PMC/PrPMC module

 +3.3 V PCI signaling voltage (VIO)

 PEX8533 PCI Express switch with the following features:

– Six highly flexible and configurable PCI Express ports

– 32 full duplex PCI Express lanes with integrated SerDes

– 2.5 Gbps bandwidth per lane

– Fully non-blocking switch architecture

– Signal support for INTA and FATAL ERROR

– Support for QoS (Quality of Service)

– Support for port performance monitoring

 Tsi384 PCI Express-to-PCI/PCI-X bridge with the following features:

– Four full duplex PCI Express lanes with integrated SerDes

– 2.5 Gbps bandwidth per lane

– Conventional PCI data rates: 33 and 66 MHz

XMCSPAN Installation and Use (6806800H03C)

13

Introduction

– PCI-X data rates: 50, 66, 100, and 133 MHz

1.2 Standard Compliances

This product meets the following standards Compliances:

Table 1-1 Standard Compliances

Standard Description

UL 60950-1
UL 94V-011
EN 60950-1
IEC 60950-1
CAN/CSA C22.2 No. 60950-1

Safety requirements

14

SN29500/8
MIL-HDBK-217F

IEC 68-2-1/2/3/13/14 Climatic environmental requirements.

IEC 68-2-6/27/32 Mechanical environmental requirements.

EN 50081-1
EN 50082-2

FCC Part 15 Class B
EN 300 386
EN 55022
EN 55024
NEBS Standard GR-1089-CORE

ANSI/IPC-A-610 Rev.B Class 2
ANSI/IPC-R-700B
ANSI-J-001
ANSI-J-002
ANSI-J-003

ISO 8601 Y2K compliance

Reliability requirements

The XMCspan can only be used in a restricted temperature
range.

EMC requirements on system level.

Manufacturing requirements

XMCSPAN Installation and Use (6806800H03C)

Table 1-1 Standard Compliances

Standard Description

NEBS Standard GR-63-CORE

Environmental requirements

ETSI EN 300019 series

Figure 1-1 Declaration of Conformity

E

C Declaration of Conformity

According to EN 17050-1:2004

Manufacturer’s Name:

Manufacturer’s Address:

Declares that the following product, in accordance with the requirements of 2004/108/EC, 2011/65/EU and their
amending directives,

Artesyn Embedded Technologies
Embedded Computing

Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi
Guan Road West, Shiqi District, 528400 Zhongshan City
Guangdong, PRC

Introduction

Product:

Model Name/Number:

has been designed and manufactured to the following specifications:

EN55022:2006 Class A

EN55024 (A1::2001 + A2: 2003): 1998

2011/65/EU RoHS Directive

As manufacturer we hereby declare that the product named above has been designed to comply with the rele­vant sections of the above referenced specifications. This product complies with the essential health and safety
requirements of the above specified directives. We have an internal production control system that ensures
compliance between the manufactured products and the technical documentation.

___________________________________________________ ___

Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)

XMCspan—XMC Expansion Mezzanine

XMCSPAN-001 XMC/PMC with IEEE handles
XMCSPAN-002 XMC/PMC with Scanbe handles

06/03/2014

______

XMCSPAN Installation and Use (6806800H03C)

15

Introduction

1.3 Ordering Information

When ordering board accessories, use the following information:

Table 1-2 Ordering Information

Model Number Description

XMCSPAN-001 XMC Expansion for MVME7100 with IEEE handles, 6E

XMCSPAN-002 XMC Expansion for MVME7100 with SCANBE handles, 6E

16

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

2.1 Overview

This chapter discusses the installation of a mezzanine card and XMCspan module.

The following procedures are detailed:

 Installing a Mezzanine Card on page 20

 Installing the Primary XMCspan on page 23

 Installing the Secondary XMCspan on page 26

 Removing the XMCspan on page 28

2.1.1 Environmental Considerations

The following environmental conditions must be tested and proven in the used system
configuration. These conditions refer to the surroundings of the board within the user
environment.

Chapter 2

Note:

 Operating temperatures refer to the temperature of the air circulating around the module

and not to the component temperature.

 Forced air cooling within the system is required to make sure that the operating conditions

are met.

 The environmental values listed in the table only apply to the board without any

accessories. If you install accessories, you must consider their environmental
requirements.

High humidity and condensation on the surface of the board causes short circuits. Do not
operate the board outside the specified environmental limits. Make sure the board is
completely dry and there is no moisture on any surface before applying power.

XMCSPAN Installation and Use (6806800H03C)

17

Hardware Preparation and Installation

Requirement Operating Non-Operating

Temperature 0°C (32°F) to +55°C (+131°F)

This may be limited by the type of
hard disk used.

Temperature Change +/-0.5°C/min +/- 1°C/min

Forced Air Flow - -

Relative Humidity 5% to 95% non-condensing at

+40°C (+104°F)

Altitude -300m to 3,000m -300m to 13000m

Vibration 0.1g from 5 to 100 Hz and back to

5Hz at a rate of 0.1 octave/minute

Shock Half-sine, 5g/11ms Half-sine, 15g/11ms

Free Fall 100 mm/3 axis 1,200 mm/all edges and corners

2.2 Power Requirements

The XMCspan uses only +5.0 V from the VMEbus backplane. On-board power supplies
generate the required voltages for the various ICs. The XMCspan connects the +12 V and -12 V
supplies from the backplane to the PMC sites while the +3.3 V power supplied to the PMC sites
comes from the +5.0 V backplane power. A maximum of 15A of +3.3 V power is available to the
PMC sites, however the 90 W +5.0 V limit must be observed as well as any cooling limitations.

-40°C (-40°F) to +85°C (+185°F)

5% to 95% non-condensing at
+40°C (+104°F)

5-20 Hz at 0.01 g2/Hz
20-200 Hz at -3.0 dB/octave

Random 5-20 Hz at 1 m2/Sec3
Random 20-200 Hz at -3 m/Sec2

(packaged)

18

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

The following table provides an estimate of the typical and maximum power required.

Board Variant Measured Power Notes

XMCspan 7.5 W 1.5 A at 5 V

XMCspan with 2x MEN
P601

XMCspan with 2x PMC
Tes t Ad apter

XMCspan with 2x PrPMC­280S

13 W 2.6 A at 5 V

38 W 7.6 A at 5 V

39.5 W 7.9 A at 5 V

The following table shows the power available when the XMCspan is installed in either a 3-row
or 5-row chassis and when PMCs are present.

1 Keep below power limit. Cooling limitations must be considered.

2.2.1 Backplane Power Requirements

The following table lists the backplane power requirements.

Voltage Maximum Current Available Power

+5 V 9 pins at 2 A 90 W

+12 V 1 pin at 2 A 24 W

-12 V 1 pin at 2 A 24 W

XMCSPAN Installation and Use (6806800H03C)

19

Hardware Preparation and Installation

2.3 Checking the Box Contents

Static discharge can damage circuits.

Avoid touching areas of integrated circuitry or take antistatic precautions (ESD wrist strap
or shoes).

1. Make sure that you have received the following items: printed Getting Started manual or
Quick Start guide, XMCspan board, any optional items ordered.

2. Check the items for damages, and report any damage or difference to customer service.

3. If applicable, remove the desiccant bag that shipped together with the board, and dispose
of it according to your country's legislation.

2.4 Installing a Mezzanine Card

The XMCspan supports the following mezzanine cards: XMC, PMC, and PrPMC. These
mezzanine cards mount on the XMCspan. Install the mezzanine cards on the XMCspan before
installing the XMCspan on the VME base board.

For more information on installing a supported mezzanine card, see the installation
instructions that came with it.

Inserting or removing modules with power applied may result in damage to module
components. Avoid touching areas of integrated circuitry as static discharge can damage
these circuits.

20

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

Note: This procedure assumes that you have read the Installation and Use manual of the VME

base board, and that you have properly configured the board according to the information
found in the manual. For more information about the manual, see

To install any one of the supported mezzanine cards on your XMCspan, do the following:

1. Attach an ESD strap to your wrist.

2. Attach the other end of the ESD strap to an electrical ground.
The ESD strap must be secured to your wrist and to ground throughout this procedure.

3. If the XMCspan is already mounted on your VME base board, do the following:

a. Perform an operating system shutdown.

b. Turn off the AC or DC power and remove the AC cord or DC power lines from the

system.

c. Remove chassis or system cover(s) as necessary for access to the VME base board.

d. If the VME base board has already been installed in a VMEbus card slot, carefully

remove it and place it with connectors P1 and P2 facing you.

4. Position the XMCspan with the P1 and P2 connectors facing you.

5. Remove the slot filler panel from the XMCspan front panel.

6. Slide the module port connector into the slot opening on the XMCspan front panel.

XMCSPAN Installation and Use (6806800H03C)

21

Hardware Preparation and Installation

7. Align the module over the XMCspan.

8. Align the connectors on the underside of the module with the corresponding connectors
on the XMCspan.

Mezzanine
Card Slot Connectors

Mezzanine
Card Slot 1

Mezzanine
Card Slot 2

When installing a PMC/PrPMC module, use the following connectors:
J11, J12, J13, and J14.
When installing an XMC module, use J15.

When installing a PMC/PrPMC module, use the following connectors:
J21, J22, J23, and J24.
When installing an XMC module, use J25.

9. Align the keying hole on the module with the keying pin on the XMCspan.

10. Gently press the module onto the XMCspan.

11. Turn the XMCspan component-side down.

12. Insert the four short Phillips screws supplied with the XMCspan through the holes on the
underside of the module, into the standoffs at the corners of the base board, and then
tighten the screws.

Note: Some PMCs use a screw at each corner; others require only two screws at the forward
corners.

22

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

2.5 Installing the Primary XMCspan

The XMCspan mounts on the VME base board. To upgrade or install an XMCspan, refer to the
figure shown below and proceed as follows.

XMCSPAN Installation and Use (6806800H03C)

23

Hardware Preparation and Installation

This procedure assumes that you have read the Installation and Use manual of the VME base
board, and that you have properly configured the board according to the information found in
the manual. For more information about the manual, see Appendix A, Related Documentation,

on page 47.

Dangerous voltages, capable of causing death, are present in this equipment. Use extreme
caution when handling, testing, and adjusting.

Inserting or removing modules with power applied may result in damage to module
components. Avoid touching areas of integrated circuitry as static discharge can damage
these circuits.

24

1. Attach an ESD strap to your wrist.

2. Attach the other end of the ESD strap to an electrical ground.
The ESD strap must be secured to your wrist and to ground throughout this procedure.
Note: The system chassis may not be grounded if it is unplugged.

3. Perform an operating system shutdown.

4. Turn off the AC or DC power and remove the AC cord or DC power lines from the system.

5. Remove chassis or system cover(s) as necessary for access to the VME base board.

6. If the VME base board has already been installed in a VMEbus card slot, carefully remove it
and place it with connectors P1 and P2 facing you.

7. Attach the four standoffs to the VME base board.
For each standoff:

a. Insert the threaded end into the standoff hole at each corner of the VME base board.

b. Thread the locking nuts into the standoff tips and tighten.

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

8. Place the XMCspan on top of the VME base board.

9. Align the mounting holes in each corner to the standoffs and align XMCspan connector P3
with VME connector J6.

10. Gently press the XMCspan and VME base board together, and then verify that the
connectors are fully seated.

11. Insert four short screws (Phillips type) through the holes at the corners of the XMCspan
and into the standoffs on the VME base board.

12. Tighten the screws securely.

XMCSPAN Installation and Use (6806800H03C)

25

Hardware Preparation and Installation

2.6 Installing the Secondary XMCspan

The secondary XMCspan mounts on top of a primary XMCspan module. To install on your VME
base board, do the following steps while referring to the figure shown below..

26

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

Dangerous voltages, capable of causing death, are present in this equipment. Use extreme
caution when handling, testing, and adjusting.

Inserting or removing modules with power applied may result in damage to module
components. Avoid touching areas of integrated circuitry as static discharge can damage
these circuits.

1. Attach an ESD strap to your wrist.

2. Attach the other end of the ESD strap to an electrical ground.
The ESD strap must be secured to your wrist and to ground throughout this procedure.
Note: The system chassis may not be grounded if it is unplugged.

3. Perform an operating system shutdown.

4. Turn off the AC or DC power and remove the AC cord or DC power lines from the system.

5. Remove chassis or system cover(s) as necessary for access to the VME base board.

6. If the primary XMCspan and VME base board is already installed in the VME chassis,
carefully remove it and place it with connectors P1 and P2 facing you.

7. Remove four screws (Phillips type) from the standoffs in each corner of the primary
XMCspan.

8. Attach the four standoffs from the secondary XMCspan mounting kit to the primary
XMCspan by screwing the threaded male portion of the standoffs in each corner of the
primary XMCspan.

9. Place the secondary XMCspan on top of the primary XMCspan.

10. Align the mounting holes in each corner to the standoffs, and then align the secondary
XMCspan connector P3 with primary XMCspan connector J3.

11. Gently press the two XMCspan modules together and verify that P3 is fully seated in J3.

12. Insert the four screws (Phillips type) through the holes at the corners of the secondary

XMCSPAN Installation and Use (6806800H03C)

27

Hardware Preparation and Installation

XMCspan, and into the standoffs on the primary XMCspan.

13. Tighten the screws securely.
Note: The screws have two different head diameters. Use the screws with the smaller
heads on the standoffs next to the VMEbus connectors P1 and P2.

2.7 Removing the XMCspan

This procedure is applicable to the primary and secondary XMCspan.

Dangerous voltages, capable of causing death, are present in this equipment. Use extreme
caution when handling, testing, and adjusting.

28

Inserting or removing modules with power applied may result in damage to module
components. Avoid touching areas of integrated circuitry as static discharge can damage
these circuits.

1. Attach an ESD strap to your wrist.

2. Attach the other end of the ESD strap to an electrical ground.
The ESD strap must be secured to your wrist and to ground throughout this procedure.
Note: The system chassis may not be grounded if it is unplugged.

3. Perform an operating system shutdown.

4. Turn off the AC or DC power and remove the AC cord or DC power lines from the system.

5. Remove chassis or system cover(s) as necessary for access to the VME base board.

6. If the VME base board has already been installed in a VMEbus card slot, carefully remove
it.

XMCSPAN Installation and Use (6806800H03C)

Hardware Preparation and Installation

7. Remove the four screws (Phillips type) from each corner of the XMCspan.

8. Gently remove the XMCspan, and then remove the standoffs from the VME base board.

XMCSPAN Installation and Use (6806800H03C)

29

Hardware Preparation and Installation

30

XMCSPAN Installation and Use (6806800H03C)

Resetting the XMCspa

3.1 Reset Sources

There are many ways to reset the XMCspan. The following sources will generate a board level
hardware reset for the whole XMCspan, including the PEX8533 and other devices connected
to one of the PCI/PCI-X buses:

 Power-up reset

This reset occurs when the XMCspan is powered on.

 VME hardware reset

The VME base board has a single push button switch that provides abort and reset
functions. When the switch is pressed for more than 3 seconds, a board-level hardware
reset is generated.

 VMEbus reset

When the VME base board receives a VMEbus reset, it combines this signal with any
local reset signal. This resets all devices on the base board, including the XMCspan.

Chapter 3

Reset Switch

The standard reset/abort switch has been omitted on the XMCspan.

Reset Controller

The on-board CPLD is used to handle power-up and reset. The LC4128V-27TN100C from
Lattice, which is a 100-pin TSSOP package, is used.

XMCSPAN Installation and Use (6806800H03C)

31

Resetting the XMCspa

32

XMCSPAN Installation and Use (6806800H03C)

Controls, LEDs, and Connectors

This chapter summarizes the LEDs and connectors used in the XMCspan.

4.1 Board Layout

The following figures shows the components, LEDS, and connectors on the XMCspan.

Chapter 4

XMCSPAN Installation and Use (6806800H03C)

33

Controls, LEDs, and Connectors

4.2 Face Plate

The following shows the face plate and the two variants of the handles for the XMCspan.

Figure 4-1 XMCspan with SCANBE Handles

34

XMCSPAN Installation and Use (6806800H03C)

Figure 4-2 XMCspan with IEEE Handles

Controls, LEDs, and Connectors

XMCSPAN Installation and Use (6806800H03C)

35

Controls, LEDs, and Connectors

4.3 Connectors

The XMCspan module connectors provide I/O and interfaces to the MVME7100 processor
modules and to other XMCspan modules.The pin assignments for the XMCspan connectors
are detailed in the succeeding sections.

Table 4-1 Connector Pin-outs

Location Function

P1 5-row VME connector.

P2 5-row VME connector.

J11 to J14, J21 to J24 PMC sites.

J15, J25 XMC sites.

P3 Connection to MVME7100

J3 Connection to secondary XMCspan

4.3.1 VME Connectors

The VMEbus connector P1 is used for the XMCspan power supply. There is no connection to the
VMEbus except for signal SYSRESET#, which is connected to the on-board CPLD. The P1
connector also connects the following daisy chains:

 IACKIN* and IACKOUT* with BG0IN* and BG0OUT*

 BG1IN* and BG1OUT* and BG2IN* and BG2OUT* with BG3IN* and BG3OUT*

PCI Express expansion connector located on the bottom side
of the board.

PCI Express expansion connector located located on the top
side of the board.

36

XMCSPAN Installation and Use (6806800H03C)

Controls, LEDs, and Connectors

The VMEbus connector P2 is used for power supply and user I/O connection to the rear
transition module. There is no connection to the VME bus.

Table 4-2 Pin definition for VME connector P2

Pin Row Z Row A Row B Row C Ro

1 PMC2IO_2 PMC1IO_2 +5V PMC1IO_1 PMC2IO_1

2 GND PMC1IO_4 GND PMC1IO_3 PMC2IO_3

3 PMC2IO_5 PMC1IO_6 - PMC1IO_4 PMC2IO_4

4 GND PMC1IO_8 - PMC1IO_7 PMC2IO_6

5 PMC2IO_8 PMC1IO_10 - PMC1IO_9 PMC2IO_7

6 GND PMC1IO_12 - PMC1IO_11 PMC2IO_9

7 PMC2IO_11 PMC1IO_14 - PMC1IO_13 PMC2IO_10

8 GND PMC1IO_16 - PMC1IO_15 PMC2IO_12

9 PMC2IO_14 PMC1IO_18 - PMC1IO_17 PMC2IO_13

10 GND PMC1IO_20 - PMC1IO_29 PMC2IO_15

11 PMC2IO_17 PMC1IO_22 - PMC1IO_21 PMC2IO_16

12 GND PMC1IO_24 GND PMC1IO_23 PMC2IO_18

13 PMC2IO_20 PMC1IO_26 +5V PMC1IO_25 PMC2IO_19

14 GND PMC1IO_28 - PMC1IO_27 PMC2IO_21

15 PMC2IO_23 PMC1IO_30 - PMC1IO_29 PMC2IO_22

16 GND PMC1IO_32 - PMC1IO_31 PMC2IO_24

17 PMC2IO_26 PMC1IO_34 - PMC1IO_33 PMC2IO_25

18 GND PMC1IO_36 - PMC1IO_35 PMC2IO_27

19 PMC2IO_29 PMC1IO_38 - PMC1IO_37 PMC2IO_28

20 GND PMC1IO_40 - PMC1IO_39 PMC2IO_30

21 PMC2IO_32 PMC1IO_42 - PMC1IO_41 PMC2IO_31

22 GND PMC1IO_44 GND PMC1IO_43 PMC2IO_33

23 PMC2IO_35 PMC1IO_46 - PMC1IO_45 PMC2IO_34

24 GND PMC1IO_48 - PMC1IO_47 PMC2IO_36

25 PMC2IO_38 PMC1IO_50 - PMC1IO_49 PMC2IO_37

XMCSPAN Installation and Use (6806800H03C)

37

Controls, LEDs, and Connectors

Table 4-2 Pin definition for VME connector P2

Pin Row Z Row A Row B Row C Ro

26 GND PMC1IO_52 - PMC1IO_51 PMC2IO_39

27 PMC2IO_41 PMC1IO_54 - PMC1IO_53 PMC2IO_40

28 GND PMC1IO_56 - PMC1IO_55 PMC2IO_42

29 PMC2IO_44 PMC1IO_58 - PMC1IO_57 PMC2IO_43

30 GND PMC1IO_60 - PMC1IO_59 PMC2IO_45

31 PMC2IO_46 PMC1IO_62 GND PMC1IO_61 GND

32 GND PMC1IO_64 +5V PMC1IO_63 VPC

4.3.2 LED Information

38

The XMCSPAN has two front panel LEDs: PWR and RESET. The PWR LED is illuminated red if the
on-board supplies are not functioning properly. The PWR LED is off when the supplies are
good. The RESET LED is illuminated yellow if the board is in reset.The RESET LED is illuminated
green when not in reset.The XMCSPAN-001 has LEDs that are mounted on the surface of the
PWB and not visible from the front panel. The function of these LEDs is described in the tables
below.

Table 4-3 PEX 8533 PCIE Switch

LED Description Color

D10 PEX_PORT_GOOD_0 Amber

D9 PE X_PORT_GOOD_1 (For

more details, refer Table

"Tsi384 PCIE-PCIX PMC2"
on page 39)).

D8 PEX_PORT_GOOD_2 Amber

D7 PEX_PORT_GOOD_8 Amber

Amber

XMCSPAN Installation and Use (6806800H03C)

Controls, LEDs, and Connectors

Table 4-3 PEX 8533 PCIE Switch

LED Description Color

D6 PE X_PORT_GOOD_8 (For

more details, refer Table

"Tsi384 PCIE-PCIX PMC2"
on page 39).

D5 PEX_PORT_GOOD_10 Amber

PEX 8533 PCIE switch indicates if there is a port link or not. If it is On, then the link is good, and
if it is Off then there is no link. D5 will only be on, when XMC 1 is installed. D6 will only be on,
when XMC 2 is installed. D7 will only be on, when an additional XMCSPAN is installed.

Table 4-4 Tsi384 PCIE-PCIX PMC2

LED Description Color

Amber

D20 PEX_LANE_3 Amber

D21 PEX_LANE_2 Amber

D22 PEX_LANE_1 Amber

D23 PEX_LANE_0 Amber

Tsi384 PCIE-PCIX PMC2 On indicates that the PCIE lane is good.

XMCSPAN Installation and Use (6806800H03C)

39

Controls, LEDs, and Connectors

40

XMCSPAN Installation and Use (6806800H03C)

Functional Description

5.1 Overview

This chapter describes the physical structure of the XMCspan. It shows the detailed block
diagram of the XMCspan and its primary interfaces.

5.2 Block Diagram

The following figure gives an overview of the main function blocks of the XMCspan and how
they are interconnected.

Figure 5-1 XMCspan Block Diagram

Chapter 5

XMCSPAN Installation and Use (6806800H03C)

41

Functional Description

5.3 PEX8533 PCI Express Switch

The XMCspan provides an eight-lane (x8) PCI Express interface that expands the VME bus
board. This PCI Express interface is available at connector J3, and connected to the uplink port
Port 0 of the PCI Express Switch PEX8533. The PEX8533 gives PCI Express switching capability
that conforms to the latest revision of the PCI Express Base specification.

5.4 PEX8533 Station and Port Configuration

The 32 PCI Express lanes are implemented equally across two stations, and are connected by
the internal switch fabric to the central RAM. Each station supports up to 16 SerDes modules
that are integrated on the chip, and provide the 32 PCI Express hardware interface lanes. The
lanes can be combined to create one to three ports per station. Each port implements the PCI
Express Base R1.1 physical, data link, and transaction layer.

5.5 XMCspan Stacking

The XMCspan provides a second eight-lane (x8) PCI Express interface to allow a second
XMCspan module to be stacked on top of the VME base board. This interface is available at PCI
Express expansion output connector J4, and connected to the downlink port Port 8 of
PEX8533.

5.6 Mezzanine Card Sites

The XMCspan has two mezzanine card sites that support XMC, PMC, and PrPMC modules.
PMC-mode, XMC-mode, or dual-mode mezzanine cards are also supported.

The mezzanine cards are compliant with:

 IEEE 1386-2001

 IEEE 1386.1-2001

 ANSI/VITA 32-2003

 ANSI/VITA 35-2000

42

XMCSPAN Installation and Use (6806800H03C)

 ANSI/VITA 39-2003

 ANSI/VITA 42.0-2005

 ANSI/VITA 42.3-2006

5.7 Mezzanine Card Identification

The mezzanine cards can be identified by reading the VPD serial EEPROM. The connector
signals MSCL and MSCA are connected to the I2C bus.

5.8 XMC.3 Support

The XMCspan implements only the primary XMC.3 connector receptacles at locations J15and
J25. Each primary connector uses 16 differential pairs: 8 defined as transmit, and 8 defined as
receive, plus one 100 MHz differential pair for the PCI Express clock reference. A single four-lane
PCI Express interface is connected between each connector and the PEX8533 PCI Express
Switch.

Functional Description

 PEX8533 Port 2 is connected to connector J15.

 PEX8533 Port 10 is connected to connector J25.

The XMC and XMC.3 specification use sideband signals to power, reset, identify, and manage
the XMC card.

5.9 PMC AND PRPMC Support

Each of the two mezzanine card sites has a separate PCI Express-to-PCI/PCI-X Bridge, which is
the Tsi384.

The PCI signaling voltage for the PMC is 3.3 V.

Each of the two mezzanine card sites implements three PMC connectors for 64-bit wide
PCI/PCI-X interface at locations Jn1, Jn2, and Jn3. Each site also implements one PMC connector
for user I/O signals. Both sites support front panel access to the PMC card, and rear panel access
to PMC user I/O via connector Jn4. The PMC sites support 32/64 bit data. In PCI mode, 33 and

XMCSPAN Installation and Use (6806800H03C)

43

Functional Description

66 MHz clocks are supported. In PCIX mode, 66, 100 and 133 MHz clocks are supported. SW1­6 must be on to enable 133 MHz PCI-X. If it’s off, the maximum speed is 100 MHz PCI-X. The
PMC connectors have the standard PCI/PCI-X configuration signals. When a module is
installed, the Tsi384 configures the clock and mode to the modules capabilities.

5.10 PCI Buses

The XMCspan has various PCI buses. There is one virtual PCI bus in the PEX8533 PCI Express
switch, and two physical PCI/PCI-X buses between the module sites and the Tsi384 bridge.

5.11 TSI384 PCI EXPRESS-TO-PCI/PCI-X Bridge

The Tsi384 is a bridge that allows the migration of legacy PCI and PCI-X bus interfaces to the
new, advanced serial PCI Express interface.

Tsi384 is equipped with a standard but flexible PCI Express port that scales to x1, x2, or x4 lanes
with a maximum of 1 GB per second of throughput per transmit and receive direction. Its PCI­X interface can operate up to 133 MHz in PCI-X mode, or up to 66 MHz in PCI mode.

On the XMCspan, the Tsi384 is a 4-lane PCI Express interface that is configured in forward
transparent bridge mode, and is connected with the PEX8533 PCI Express Switch.

PEX8533 Port 1 is connected with Tsi384 Bridge for module site 1.

PEX8533 Port 9 is connected with Tsi384 Bridge for module site 2.

5.12 Serial EEPROM For VPD

The XMCspan has an 8 KB dual address serial EEPROM. The EEPROM contains vital product data
(VPD) configuration information, which may include the following information, among others:

 Manufacturer

 Board Revision

 Build Version

 Date of Assembly

44

XMCSPAN Installation and Use (6806800H03C)

Functional Description

Table 5-1 I2C Bus Address Map

Bus Address Size Function

0 E0x NA I2C Bus Multiplexer on the first XMCspan

module

0 E2x NA I2C Bus Multiplexer on the first XMCspan

module

1 90x NA Temperature Sensor LM75

1 ACx 8 KB VPD serial EEPROM

2 ACx - VPD of XMC module 1

2 AEx - VPD of XMC module 2

5.13 Clocking Scheme

A 100 MHz PCI Express reference clock is provided to the XMCspan through expansion
connector pins J3.27 and J3.29.The reference clock is used to generate all other PCI Express
clocks using an ICS9DB108, which is IDT's 8-output differential buffer for PCI Express.

The PCI/PCI-X bus clocks are generated by the Tsi384 internal clock generator. The clock
generator uses REFCLK positive and negative inputs to generate the clock on PCI_CLK0
outputs.The clock frequency is determined by PCI_PCIXCAP, PCI_M66EN, and PCI_SEL100.

The table below lists all the clocks required by the XMCspan, along with their frequency,
source, and clock target device.

Table 5-2 Clocking Scheme

Clock Signal Clock Source Frequency Device

CLK_PCI1 Tsi384_1 - PMC Site 1

CLK_PCI2 Tsi384_2 - PMC Site 2

CLK_PCIE0 ICS9DB108 100 MHz PEX8533

XMCSPAN Installation and Use (6806800H03C)

45

Functional Description

Table 5-2 Clocking Scheme

Clock Signal Clock Source Frequency Device

CLK_PCIE1 ICS9DB108 100 MHz Tsi384 Bridge 1

CLK_PCIE2 ICS9DB108 100 MHz XMC Site 1

CLK_PCIE8 ICS9DB108 100 MHz XMCspan connector J4

CLK_PCIE9 ICS9DB108 100 MHz Tsi384 Bridge 2

CLK_PCIE10 ICS9DB108 100 MHz XMC Site 2

5.14 Debugging Support

The XMCspan has an 8-position DIP switch that is mainly used for factory testing and
debugging.

The following table describes the function of each position on the switch.

46

Table 5-3 Debugging Support

Position Default Function

SW1-1 OFF Factory use only

SW1-2 OFF Factory use only

SW1-3 OFF Factory use only

SW1-4 OFF Factory use only

SW1-5 OFF Factory use only

SW1-6 OFF This is used to enable 133 MHz PCI-X mode for the PMC

slots.

SW1-7 OFF Factory use only

SW1-8 OFF Factory use only

XMCSPAN Installation and Use (6806800H03C)

Appendix A

A Related Documentation

A.1 Artesyn Embedded Technologies - Embedded

Computing Documentation

The publications listed below are referenced in this manual. You can obtain electronic copies of
Artesyn Embedded Technologies - Embedded Computing publications by contacting your
local Artesyn sales office. For released products, you can also visit our Web site for the latest
copies of our product documentation.

1. Go to www.artesyn.com/computing.

2. Under SUPPORT, click TECHNICAL DOCUMENTATION.

3. Under FILTER OPTIONS, click the Document types drop-down list box to select the type of
document you are looking for.

4. In the Search text box, type the product name and click GO.

Table A-1 Artesyn Embedded Technologies - Embedded Computing Publications

Document Title Publication Number

MVME7100 Installation and Use 6806800E08

MVME4100 Installation and Use 6806800H18

XMCSPAN Installation and Use (6806800H03C)

47

A.2 Manufacturers Documents

For additional information, refer to the following table for manufacturers’ data sheets or user’s
manuals. As additional help, a source for the listed document is provided. Please note that,
while these sources have been verified, the information is subject to change without notice.

Document Title Publication Number

Related Documentation

ATML

SPI Serial EEPROMs
128K (16,384 x 8)
256K (32,768 x 8)

Lattice Semiconductor Corporation

ispMACH™ 4000V/B/C/Z Family

3.3V/2.5V/1.8V In-System Programmable SuperFAST™ High
Density PLDs

PLX Technology

ExpressLane PEX 8533-AA 32-Lane/6-Port PCI Express Gen 1
Switch Data Book

Tundra Semiconductor Corporation

Tsi384 PCIe-to-PCI/X Bridge User Manual

A.3 Related Specifications

For additional information, refer to the following table for related specifications.

Organization Document Title

IEEE IEEE Standard for a Common Mezzanine Card (CMC) Family, IEEE 1386-2001

3368J–SEEPR–06/07

Data Sheet DS1020
June 2007

Version 1.6
January 2008

80B2000_MA001_03
December 2006

48

IEEE Standard Physical and Environmental Layers for PCI Mezzanine Cards
(PMC),

IEEE 1386.1-2001

XMCSPAN Installation and Use (6806800H03C)

Related Documentation

Organization Document Title

VITA PCI Express Base Specification, PCI SIG Revision 2.0

PCI-X Addendum to the PCI Local Bus Specification, PCI SIG Revision 1.0a

PCI-X Auxiliary Standard for PMCs and Processor PMCs, ANSI/VITA 39-2003

Processor PMC, VITA 32-2003

PMC-P4 Pin Out Mapping to VME-P0 and VME64x-P2, VITA 35-2000

VME64, ANSI/VITA 1-1994

VME64 Extension, ANSI/VITA 1.1-1997

XMC Switched Mezzanine Card, VITA 42.0-2005, Draft 0.29

XMC PCI Express Protocol Layer Standard, VITA 42.3-2006

XMCSPAN Installation and Use (6806800H03C)

49

Related Documentation

50

XMCSPAN Installation and Use (6806800H03C)

Safety Notes

This section provides warnings that precede potentially dangerous procedures throughout
this manual. Instructions contained in the warnings must be followed during all phases of
operation, service, and repair of this equipment. You should also employ all other safety
precautions necessary for the operation of the equipment in your operating environment.
Failure to comply with these precautions or with specific warnings elsewhere in this manual
could result in personal injury or damage to the equipment.

Artesyn intends to provide all necessary information to install and handle the product in this
manual. Because of the complexity of this product and its various uses, we do not guarantee
that the given information is complete. If you need additional information, ask your Artesyn
representative.

The product has been designed to meet the standard industrial safety requirements. It must
not be used except in its specific area of office telecommunication industry and industrial
control.

Only personnel trained by Artesyn or persons qualified in electronics or electrical engineering
are authorized to install, remove or maintain the product.

The information given in this manual is meant to complete the knowledge of a specialist and
must not be used as replacement for qualified personnel.

Keep away from live circuits inside the equipment. Operating personnel must not remove
equipment covers. Only Factory Authorized Service Personnel or other qualified service
personnel may remove equipment covers for internal subassembly or component replacement
or any internal adjustment.

Do not install substitute parts or perform any unauthorized modification of the equipment or
the warranty may be voided. Contact your local Artesyn representative for service and repair
to make sure that all safety features are maintained.

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51

Safety Notes

EMC

This equipment has been tested and found to comply with the limits for a Class A digital device,

pursuant to Part 15 of the FCC Rules, EN55022. These limits are designed to provide
reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense.
Changes or modifications not expressly approved by Artesyn Embedded Technologies could
void the user's authority to operate the equipment.
Board products are tested in a representative system to show compliance with the above
mentioned requirements. A proper installation in a compliant system will maintain the
required performance. Use only shielded cables when connecting peripherals to assure that
appropriate radio frequency emissions compliance is maintained.

Operation

Product Damage

High humidity and condensation on the board surface causes short circuits.
Do not operate the board outside the specified environmental limits.Make sure the board is
completely dry and there is no moisture on any surface before applying power.

Damage of Circuits

Electrostatic discharge and incorrect installation and removal can damage circuits or shorten
their life.
Before touching the board or electronic components, make sure that you are working in an
ESD-safe environment.

Installation

Data Loss

Powering down or removing a board before the operating system or other software running
on the board has been properly shut down may cause corruption of data or file systems.

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XMCSPAN Installation and Use (6806800H03C)

Make sure all software is completely shut down before removing power from the board or
removing the board from the chassis.

Product Damage

Only use injector handles for board insertion to avoid damage to the front panel and/or PCB.
Deformation of the front panel can cause an electrical short or other board malfunction.

Product Damage

Inserting or removing modules with power applied may result in damage to module
components.
Before installing or removing additional devices or modules, read the documentation that
came with the product.

Environment

Safety Notes

Always dispose of used products according to your country's legislation and manufacturer's

instructions.

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Safety Notes

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XMCSPAN Installation and Use (6806800H03C)

Sicherheitshinweise

Dieses Kapitel enthält Hinweise, die potentiell gefährlichen Prozeduren innerhalb dieses
Handbuchs vorrangestellt sind. Beachten Sie unbedingt in allen Phasen des Betriebs, der
Wartung und der Reparatur des Systems die Anweisungen, die diesen Hinweisen enthalten
sind. Sie sollten außerdem alle anderen Vorsichtsmaßnahmen treffen, die für den Betrieb des
Produktes innerhalb Ihrer Betriebsumgebung notwendig sind. Wenn Sie diese
Vorsichtsmaßnahmen oder Sicherheitshinweise, die an anderer Stelle diese Handbuchs
enthalten sind, nicht beachten, kann das Verletzungen oder Schäden am Produkt zur Folge
haben.

Artesyn ist darauf bedacht, alle notwendigen Informationen zum Einbau und zum Umgang mit
dem Produkt in diesem Handbuch bereit zu stellen. Da es sich jedoch um ein komplexes
Produkt mit vielfältigen Einsatzmöglichkeiten handelt, können wir die Vollständigkeit der im
Handbuch enthaltenen Informationen nicht garantieren. Falls Sie weitere Informationen
benötigen sollten, wenden Sie sich bitte an die für Sie zuständige Geschäftsstelle von Artesyn.

Das System erfüllt die für die Industrie geforderten Sicherheitsvorschriften und darf
ausschließlich für Anwendungen in der Telekommunikationsindustrie und im Zusammenhang
mit Industriesteuerungen verwendet werden.

Einbau, Wartung und Betrieb dürfen nur von durch Artesyn ausgebildetem oder im Bereich
Elektronik oder Elektrotechnik qualifiziertem Personal durchgeführt werden. Die in diesem
Handbuch enthaltenen Informationen dienen ausschließlich dazu, das Wissen von
Fachpersonal zu ergänzen, können dieses jedoch nicht ersetzen.

Halten Sie sich von stromführenden Leitungen innerhalb des Produktes fern. Entfernen Sie auf
keinen Fall Abdeckungen am Produkt. Nur werksseitig zugelassenes Wartungspersonal oder
anderweitig qualifiziertes Wartungspersonal darf Abdeckungen entfernen, um Komponenten
zu ersetzen oder andere Anpassungen vorzunehmen.

Installieren Sie keine Ersatzteile oder führen Sie keine unerlaubten eränderungen am Produkt
durch, sonst verfällt die Garantie. Wenden Sie sich für Wartung oder Reparatur bitte an die für
Sie zuständige Geschäftsstelle von Artesyn. So stellen Sie sicher, dass alle
sicherheitsrelevanten Aspekte beachtet werden.

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55

Sicherheitshinweise

EMV

Das Produkt wurde in einem Artesyn Standardsystem getestet. Es erfüllt die für digitale Geräte

der Klasse A gültigen Grenzwerte in einem solchen System gemäß den FCC-Richtlinien
Abschnitt 15 bzw. EN 55022 Klasse A. Diese Grenzwerte sollen einen angemessenen Schutz
vor Störstrahlung beim Betrieb des Produktes in Gewerbe- sowie Industriegebieten
gewährleisten.
Das Produkt arbeitet im Hochfrequenzbereich und erzeugt Störstrahlung. Bei
unsachgemäßem Einbau und anderem als in diesem Handbuch beschriebenen Betrieb können
Störungen im Hochfrequenzbereich auftreten.
Wird das Produkt in einem Wohngebiet betrieben, so kann dies mit grosser Wahrscheinlichkeit
zu starken Störungen führen, welche dann auf Kosten des Produktanwenders beseitigt werden
müssen. Änderungen oder Modifikationen am Produkt, welche ohne ausdrückliche
Genehmigung vonArtesyn Embedded Technologiesdurchgeführt werden, können dazu
führen, dass der Anwender die Genehmigung zum Betrieb des Produktes verliert.
Boardprodukte werden in einem repräsentativen System getestet, um zu zeigen, dass das
Board den oben aufgeführten EMV-Richtlinien entspricht. Eine ordnungsgemässe Installation
in einem System, welches die EMV-Richtlinien erfüllt, stellt sicher, dass das Produkt gemäss
den EMV-Richtlinien betrieben wird. Verwenden Sie nur abgeschirmte Kabel zum Anschluss
von Zusatzmodulen. So ist sichergestellt, dass sich die Aussendung von
Hochfrequenzstrahlung im Rahmen der erlaubten Grenzwerte bewegt.
Warnung! Dies ist eine Einrichtung der Klasse A. Diese Einrichtung kann im Wohnbereich
Funkstörungen verursachen. In diesem Fall kann vom Betreiber verlangt werden,
angemessene Maßnahmen durchzuführen.

Betrieb

56

Beschädigung des Produktes

Hohe Luftfeuchtigkeit und Kondensat auf der Oberfläche des Produktes können zu
Kurzschlüssen führen.

Betreiben Sie das Produkt nur innerhalb der angegebenen Grenzwerte für die relative
Luftfeuchtigkeit und Temperatur.

Stellen Sie vor dem Einschalten des Stroms sicher, dass sich auf dem Produkt kein Kondensat
befindet.

XMCSPAN Installation and Use (6806800H03C)

Beschädigung von Schaltkreisen

Elektrostatische Entladung und unsachgemäßer Ein- und Ausbau des Produktes kann
Schaltkreise beschädigen oder ihre Lebensdauer verkürzen.

Bevor Sie das Produkt oder elektronische Komponenten berühren, vergewissern Sie sich, daß
Sie in einem ESD-geschützten Bereich arbeiten.

Installation

Datenverlust

Das Herunterfahren oder die Deinstallation eines Boards bevor das Betriebssystem oder
andere auf dem Board laufende Software ordnungsmemäss beendet wurde, kann zu
partiellem Datenverlust sowie zu Schäden am Filesystem führen.

Stellen Sie sicher, dass sämtliche Software auf dem Board ordnungsgemäss beendet wurde,
bevor Sie das Board herunterfahren oder das Board aus dem Chassis entfernen.

Sicherheitshinweise

Beschädigung des Produktes

Fehlerhafte Installation des Produktes kann zu einer Beschädigung des Produktes führen.

Verwenden Sie die Handles, um das Produkt zu installieren/deinstallieren. Auf diese Weise
vermeiden Sie, dass das Face Plate oder die Platine deformiert oder zerstört wird.

Beschädigung des Produktes und von Zusatzmodulen

Fehlerhafte Installation von Zusatzmodulen, kann zur Beschädigung des Produktes und der
Zusatzmodule führen.

Lesen Sie daher vor der Installation von Zusatzmodulen die zugehörige Dokumentation.

Umweltschutz

Entsorgen Sie alte Batterien und/oder Blades/Systemkomponenten/RTMs stets gemäß der in

Ihrem Land gültigen Gesetzgebung, wenn möglich immer umweltfreundlich.

XMCSPAN Installation and Use (6806800H03C)

57

Sicherheitshinweise

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XMCSPAN Installation and Use (6806800H03C)

Artesyn Embedded Technologies, Artesyn and the Artesyn Embedded Technologies logo are trademarks and service marks of Artesyn Embedded Technologies, Inc.
All other product or service names are the property of their respective owners.

©

2014 Artesyn Embedded Technologies, Inc.