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SCP-P4040-4G-ENP2
Installation
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Artesyn SCP-P4040-4G-ENP2 Installation

SCP-P4040-4G-ENP2

Installation and Use
P/N: 6806800P60B August 2014
©
Copyright 2014 Artesyn Embedded Technologies, Inc.
All rights reserved.
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Notice
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Use, duplication, or disclosure by the Government is subject to restrictions as set forth in subparagraph (b)(3) of the Rights in Technical Data clause at DFARS 252.227-7013 (Nov. 1995) and of the Rights in Noncommercial Computer Software and Documentation clause at DFARS 252.227-7014 (Jun. 1995).
Contact Address
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Marketing Communications
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Tempe, Arizona 85282
Lilienthalstr. 17-19
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Germany

Contents

Contents
About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.2 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.3 Mechanical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
1.4 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.5 Production Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
2 Hardware Preparation and Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.1 Environmental and Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2.2 Unpacking and Inspecting the Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2.3 Installing and Removing the Module on the Carrier Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3 Controls, LEDs, and Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1 Connectors and Switches . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1.1 On-Board Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.2 On Board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
4 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
4.2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
4.3 Processor Core and Cache Memory Complex . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.4 Integrated Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
4.5 Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
4.5.1 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.5.2 NOR Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
4.5.3 NAND Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.6 HSSI OR SERDES Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
4.7 Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
4.8 Main Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.8.1 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
4.9 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
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4.10 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4.11 SDHC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
4.12 SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.13 LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.13.1 MDIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.13.2 PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.14 UART Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.15 RTC & WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.16 USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.16.1 Four USB Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.17 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.17.1 I2C Device EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
4.17.2 I2C Device EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.17.3 I2C Device WDT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.17.4 I2C Device RTC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.17.5 I2C Device Clock Generator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.17.6 I2C Device USB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
5 Clock Structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
6 On-Boards Power Domains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
6.1 Power Controlling Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7 BSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.1 BSP Build Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.1.1 Install Build Tools of SDK1.0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
7.2 BSP Source Code Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.2.1 De-Compose Source Code Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.2.2 Setup Build Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.3 Build BSP Images . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.3.1 Build U-Boot. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.3.2 Build Linux Kernel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
7.3.3 Build ROOTFS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
7.3.4 Build Misc Firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
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7.4 DEPLOY BSP IMAGES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
7.4.1 Pre-Deployment Steps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
7.4.2 Deploying BSP Images on NOR FLASH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
7.5 RAMBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.6 NORBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
7.7 NFSBOOT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Safety Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
Sicherheitshinweise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
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List of Tables
Table 1-1 Standard Compliances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 1-2 PCB Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 1-3 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 2-1 Environmental Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 2-2 Critical Temperature Spots . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 2-3 Power Requirement (with solder-down memory chips) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 2-4 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 3-1 JTAG connector pin-out . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 3-2 LED and statements of the system . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 4-1 NOR Flash Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 4-2 NAND FLASH Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 4-3 Options of the SERDES routed to COM Express Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 4-4 Memory Capacities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 4-5 Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 4-6 GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 4-7 SD or Micro SD card on the Carrier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Table 4-8 Real Time Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 4-9 WDT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 4-10 USB PHY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 4-11 USB HUB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 4-12 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Table 5-1 Configuration of the frequency of SERDES reference clock by GPIO . . . . . . . . . . . . . . . . . . . 56
Table 7-1 BSP Source Code Package Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
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Figure 1-1 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 1-2 SCP-P4040-4G-ENP2 Mechanical Dimensions (Top and side views) . . . . . . . . . . . . 18
Figure 1-3 Location of Product Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 4-1 SCP-P4040-4G-ENP2 Function Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 4-2 Distribution of local bus on P4040 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 4-3 Distribution of SERDES Lanes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 4-4 Board Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 4-5 Memory Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 4-6 Distribution of GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 4-7 Distribution of SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 4-8 Distribution of I2C buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 5-1 Clock Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Figure 6-1 Power Tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 6-2 Power Sequence of SCP-P4040-4G-ENP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
9
List of Figures
10
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)

About this Manual

Overview of Contents

This manual is divided into following chapters and appendix.
Introduction provides an overview of the product's features.
Hardware Preparation and Installation provides instructions for installing and removing the
module.
Controls, LEDs, and Connectors provides informations on the pin assignments on the various
connectors on the board
Functional Description describes the functions of the various components on the board
Clock Structure describes the clock distribution in the SCP-P4040-4G-ENP2. and the setup
utility used to configure the product.
On-Boards Power Domains describes the power supply system for the module.
BSP describe how to build SCP-P4040-4G-ENP2 Basic Support Package (BSP) and deploy
the built images on SCP-P4040-4G-ENP2.

Abbreviations

This document uses the following abbreviations:
Abbreviation Definition
AC '97 Audio CODEC (Coder-Decoder).
ACPI Advanced Configuration Power Interface -
software standard to implement power saving modes in PC-AT systems.
Basic Module COM Express
Carrier Board An application specific circuit board that accepts a COM
Express
DP Display Port.
DVI Digital Visual Interface
EEPROM Electrically Erasable Programmable Read-Only Memory.
GPI General Purpose Input.
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
TM
module.
TM
125mm x 95mm module form factor.
11
About this Manual
Abbreviation Definition
GPIO General Purpose Input Output.
GPO General Purpose Output.
HDMI High Definition Multimedia Interface.
I2C Inter Integrated Circuit - 2 wire (clock and data) signaling scheme
IDE Integrated Device Electronics - parallel interface for hard disk
LPC Low Pin-Count Interface: a low speed interface used for peripheral
LVDS Low Voltage Differential Signaling - widely used as a physical
About this Manual
allowing communication between integrated circuits, primarily used to read and load register values.
drives - also known as PATA.
circuits such as Super I/O controllers, which typically combine legacy-device support into a single IC.
interface for TFT flat panels. LVDS can be used for many high­speed signaling applications. In this document, it refers only to TFT flat-panel applications.
12
PCI Peripheral Component Interface.
PCIE Peripheral Component Interface Express - next-generation high
speed Serialized I/O bus.
PHY Ethernet controller physical layer device.
Pin-out Type A reference to one of five COM Express definitions for what signals
appear on the COM Express module connector pins.
SPD Serial Presence Detect - refers to serial EEPROM on DRAMs that
has DRAM module configuration information.
S0, S1, S2, S3, S4,
S5
SATA Serial AT Attachment: serial-interface standard for hard disks.
SDVO Serialized Digital Video Output - Intel defined
System states describing the power and activity level.
S0 Full power, all devices powered S1 S2 S3 Suspend to RAM System context stored in RAM; RAM is in standby.
S4 Suspend to Disk System context stored on disk.S5 Soft Off Main power rail off, only standby power rail present.
format for digital video output that can be used with Carrier Board conversion ICs to create parallel, TMDS, and LVDS flat panel formats as well as NTSC and PAL TV outputs.
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
Abbreviation Definition
Super I/O An integrated circuit; typically interfaced via the LPC bus that
USB Universal Serial Bus.
VGA Video Graphics Adapter - PC-AT graphics adapter standard
WDT Watch Dog Timer.

Conventions

The following table describes the conventions used throughout this manual.
Notation Description
About this Manual
provides legacy PC I/O functions including PS2 keyboard and mouse ports, serial and parallel port(s) and a floppy interface.
defined by IBM.
0x00000000 Typical notation for hexadecimal numbers (digits are
0 through F), for example used for addresses and offsets
0b0000 Same for binary numbers (digits are 0 and 1)
bold Used to emphasize a word Screen Used for on-screen output and code related elements
or commands in body text
Courier + Bold Used to characterize user input and to separate it
from system output
Reference Used for references and for table and figure
descriptions
File > Exit Notation for selecting a submenu
<text> Notation for variables and keys
[text] Notation for software buttons to click on the screen
and parameter description
... Repeated item for example node 1, node 2, ..., node
12
.
.
.
Omission of information from example/command that is not necessary at the time being.
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
13
About this Manual
Notation Description
.. Ranges, for example: 0..4 means one of the integers
| Logical OR.
About this Manual
0,1,2,3, and 4 (used in registers).
Indicates a hazardous situation which, if not avoided, could result in death or serious injury.
Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury
Indicates a property damage message.

Summary of Changes

This manual has been revised and replaces all prior editions.
Part Number Publication Date Description
6806800P60A August 2012 Initial Version.
6806800P60B August 2014 Re-branded to Artesyn template.
14
No danger encountered. Pay attention to important information.
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)

Introduction

The SCP-P4040-4G-ENP2 is a COM Express module based on the Freescale Power PC P40x0 platform.This board provides some of the universal interfaces such as Gigabit Ethernet, USB, PCIE, and so on.

1.1 Features

Following are the features of the SCP-P4040-4G-ENP2:
Form Factor: Basic (95mm x 125mm) Bullet list 2
P4040 CPU supported
Boot Options:
– 16 bits width NOR flash from local bus (standard product default)
– NAND flash from local bus
Chapter 1
– I2C EEPROM Note: Selectable via carrier
Operating System:
– Linux
– VxWorks Note: VxWorks is only a plan rather than requirement Supported CPU: P4040
(P4040) dual channel laid down DDR3, 2GB per channel, ECC (with option to populate only
one channel (top) at 2GB)
(P4040) 16 lanes of SERDES routed to COME connectors, which can be configured as PCIE,
XAUI, SRIO, SGMII
4 UARTs or 2 DUARTs
(P4040) 0/1/2 GE ports (option available to use this port as USB)
(P4040) 5/4/0 USB ports
1588 signals output to the COME connectors
Total 3 I2C buses
1 SPI bus with 3 chip select signals
Connected from the SDHC pins to COME connectors
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
15
Introduction
Connected from the tamper detect pins to COME connectors
8 GPI and 8 GPO to COME connectors
On-board RTC and WDT device
Provide both remote and local thermal sensor
JTAG connector on module
Aurora testing points on module
On-board regulators supply required voltages to devices on the module
12V and 5V standby power supplied to module from ATX-type (or other type) power
supply through COME connectors

1.2 Standard Compliances

This product meets the following standards:
16
Table 1-1 Standard Compliances
Standard Description
UL60950-1 EN 60950-1 IEC 60950-1 CAN/CSA C22.2 No 60950-1
CISPR 22 CISPR 24 EN55022 EN 55024
ENTSI EN 300 019 Series Environmental Requirement
Directive 2011/65/EU Directive on the restriction of the use of certain hazardous
NEBS Standard GR-63-CORE
ETSI EN 300019 series
Safety requirements
EMC Requirements on system level
substances in electrical and electronic equipment (ROHS)
Environmental requirements
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
Figure 1-1 Declaration of Conformity
E
C Declaration of Conformity
According to EN 17050-1:2004
Introduction
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,
Product:
Model Name/Number:
has been designed and manufactured to the following specifications:
EN55022: 2010 Class B
EN55024: 2010
IEC 60950-1: 2005 (2nd Edition) + A1:2009
2011/65/EU RoHS Directive
As manufacturer we hereby declare that the product named above has been designed to comply with the rele- vant sections of the above referenced specifications. This product complies with the essential health and safety requirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.
Artesyn Embedded Technologies Embedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi Guan Road West, Shiqi District, 528400 Zhongshan City Guangdong, PRC
Ruggedized and extended temperature COM Express modules with Freescale QorIQ™ processing power
SCP-P4040-4G-ENP2, COMX-P4080-2G-ENP2
___________________________________________________ ___
Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
08/12/2014
______
17
Introduction

1.3 Mechanical Data

Mechanical Information:
The following figures are the top and bottom view of the board.
Figure 1-2 SCP-P4040-4G-ENP2 Mechanical Dimensions (Top and side views)
18
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
Table 1-2 PCB Dimensions
Characteristic Value
Height 95 mm
Length 125 mm
Thickness 2 mm
Mounting height top side (component side 1)
Mounting height bottom side (component side 2)

1.4 Ordering Information

Supported Board Models:
As of the printing date of this manual, this guide supports the board models listed in the following table.
Introduction
Table 1-3 Ordering Information
Order Number Description
SCP-P4040-4G-ENP2 QorIQ P4040 with 4GB memory, ENP2. COM Express Basic size
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
19
Introduction

1.5 Production Identification

The following figure shows the location of the board's serial number.
Figure 1-3 Location of Product Serial Number
20
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)

Hardware Preparation and Installation

2.1 Environmental and Power Requirements

You must make sure that following environmental requirements meet when board is operated in your system configuration.
Operating temperatures refer to the temperature of air circulation around the board, but not the component temperature.
Environmental Requirements
The following table provides the environmental requirement details for the board.
Chapter 2
Table 2-1 Environmental Requirements
Environmental Factor Operating Non-operating
o
Temperature -40
Humidity to 100% RH to 100% RH
Vibration Random (1hr/axis)
Shock 30g/11mS(half sine)
Altitude -60 to 4000 m ASL
Vibration Sine (10mins/axis)
Thermal Requirements
A standard passive heat sink or heat spreader can be provided by Artesyn; 12 CFM system airflow volume (at 71oC) is needed for the heat sink to keep sufficient cooling to the SCP­P4040-4G-ENP2. Contact your Artesyn sales representative for current information on the detailed thermal information of the SCP-P4040-4G-ENP2.
C to +71oC -50oC to +100
0.04g2/Hz, 15 to 2000Hz (8GRMS)
5G 15 to 2000Hz
o
C
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
21
Hardware Preparation and Installation
The following table summarized components that exhibit significant temperature raises and their maximum allowable operating temperature. These components should be monitored in order to assess thermal performance during customized thermal solution development.
Table 2-2 Critical Temperature Spots
Component Identifier Heat Dissipation Power (W) Maximum Allowable Temperature (oC)
CPU: P4040 16.8 CPU: 105 (Tj)
GbE Transceiver: BCM5482
Memory SDRAM: 4GB 3 95 (Tc)
0.86 125 (Tj)
System Overheating Colling Vents Improper cooling can lead to system damage and an void the manufacturer's warranty. To ensure proper cooling and undisturbed airflow through the system do not obstruct the ventilation openings of the system. Make sure that the fresh air supply is not mixed with hot exhaust from other devices.
Personal Injury During operation, hot surfaces may be present on the heat sinks and the components of the product. To prevent injury from hot surface, do not touch any of the exposed components or heatsinks on the product when handling. Use the handle and face plate, where applicable, or the board edge when removing the product from the enclosure.
22
Power Requirements
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
Hardware Preparation and Installation
This board is designed to operate with the input voltages and currents as defined in the following tables.
Table 2-3 Power Requirement (with solder-down memory chips)
State 12v VCC_RCT
Idle 2.81A 100 uA
Full Loading (Linux) 2.91A 100 uA
Table 2-4 Power Dissipation
Item Configuration Power
1 Total power dissipation (W) 34.92

2.2 Unpacking and Inspecting the Board

Damage of Circuits
Electrostatic discharge and incorrect installation and removal of the product can
damage circuits or shorten their life.
Before touching the product make sure that you are working in an ESD-safe
environment or wear and ESD wrist strap or ESD shoes. Hold the product by its edges and do not touch any components or circuits.
1. Verify that you have received all items of your shipment:
Printed Quick Start Guide and Safety Notes
SCP-P4040-4G-ENP2 Board
Drivers CD
SCP-P4040-4G-ENP2 Installation and Use (6806800P60B)
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