Artesyn RTM-ATCA-736x-DD Installation

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RTM-ATCA-736X-DD

Installation and Use
P/N: 6806800L82C June 2014
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©
Copyright 2014 Artesyn Embedded Technologies, Inc.
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Artesyn Embedded Technologies Artesyn Embedded Technologies
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2900 S. Diablo Way, Suite 190
Tempe, Arizona 85282
Lilienthalstr. 17-19
85579 Neubiberg/Munich
Germany
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Contents

Contents
About this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.2 Advanced RTM Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.3 I/O PICMG Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.4 I/O Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
1.4.1 Ports 1-2, Ethernet 1000Base-T (RJ-45) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.5 LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1.6 Disk "Request Eject" Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.7 Reset Button . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.8 Software Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
1.9 Products Supported by this Manual . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1.10 Identification Labels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
2 Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.2 Installation and Removal of the Rear Transition Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.3 Important Information about Your Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.3.1 Safety Statement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.3.2 Observe Maximum Module Current Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2.4 Before You Install Or Remove the RTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.4.1 Observe ESD Precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.4.2 Watch for Bent Pins or Other Damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
2.5 Use Caution When Installing or Removing RTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.5.1 Preserve EMI Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.5.2 Understand Hot Swap . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
2.6 Verify Slot Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.7 Installing the Advanced Rear Transition Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
2.8 Removing the Advanced Rear Transition Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2.9 Verifying the Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
2.10 SAS Drive Carrier Assembly Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
2.11 SAS Drive Carrier Assembly Removal (Eject) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
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3 SAS RAID Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.2 Hard Disk Drive Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.3 SAS Boot BIOS Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
3.4 Brief Theory of BIOS Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.5 Boot BIOS Configuration Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.5.1 Launching the Boot BIOS Configuration Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
3.5.2 BIOS Launch: Main Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
3.5.3 Adapter Properties Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.6 RAID Firmware Capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
3.6.1 BIOS, RAID Properties Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
3.6.2 BIOS, RAID Create New Array and Global Hot Spare. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
4 Mechanical and Connector Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.1 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.1.1 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.1.2 Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.1.3 Power Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.1.4 Environmental Specifications and Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.1.5 NEBS Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.1.6 Electromagnetic Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
4.2 Connectors and Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
4.2.1 1000Base-T Ethernet Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
4.2.2 Zone 3 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
4.2.2.1 Connector J30, Power Supply for Advanced RTM . . . . . . . . . . . . . . . . . . . . . . . . 51
4.2.2.2 Connector J30, Storage and Management Infrastructure Pin Assignments . 52
4.2.2.3 Connector J32, PCI-Express and Test Infrastructure Pin Assignments . . . . . . 53
5 IPMI Functions List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.2 IPMI and Management Controller (IPMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.3 Sensor Data Records . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
5.3.1 RTM E-Keying Port Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
5.4 Supported IPMI Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
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5.4.1 Disk IPMI ’raw’ Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
5.4.1.1 Disk Eject, Deactivation Request to Power-off Disk . . . . . . . . . . . . . . . . . . . . . . 62
5.4.1.2 Approve Disk Eject Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
5.4.1.3 Read OEM Manufacturing in DCA EEPROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
5.4.1.4 Write OEM Manufacturing Data Contents in DCA EEPROM . . . . . . . . . . . . . . . 64
5.5 Communication Mechanisms for Disk Extraction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
5.5.1 Typical Module Insertion, All Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.5.2 Typical Module Slave Extraction Mode (Normal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.5.3 Typical Module Extraction, Standalone Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
6 MMC Firmware Upgrade Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6.2 The ipmitool Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6.2.1 Synopsis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6.2.2 Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6.2.3 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
6.2.4 Command Syntax Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
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List of Tables
Table 1-1 I/O Ports Available On RTM Faceplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 1-2 LEDs On RTM Faceplate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 1-3 Available Board Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 1-4 RTM-ATCA-736X-DD Identification Labels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 2-1 Maximum RTM Module Current Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 4-1 RTM-ATCA-736X-DD Weight . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 4-2 Environmental Specifications for the RTM-ATCA-736X-DD . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Table 4-3 EMC Emission Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Table 4-4 Connector Port Identification snd Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 4-5 10/100/1000 Management Port Connector Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 4-6 Connector P30, Management infrastructure Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . 52
Table 4-7 Connector J30, Management Infrastructure Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . 52
Table 4-8 Connector J32, Miscellaneous RTM Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 4-9 Connector J32, Miscellaneous RTM Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Table 5-1 Sensor Data Records . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Table 5-2 Standard FRU Data Records . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Table 5-3 RTM E-Keying Port Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Table 5-4 Supported IPMI Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Table 5-5 IPMI Raw Command Disk Removal Request . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 5-6 IPMI Raw Command to Approve Disk Power Eject Request . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
Table 5-7 IPMI Raw Command to Read OEM Manufacturing from Drive Carrier Assembly . . . . . . . . 63
Table 5-8 IPMI Raw Command to Read FRU Data from Hard Disk Assembly . . . . . . . . . . . . . . . . . . . . . 64
Table 5-9 Disk Eject jumper Position vs. Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table 5-10 MMC Sensor Description for Disk FRU State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table 6-1 Ipmitool Options Relevant To Firmware Upgrades . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
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List of Tables
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List of Figures
Figure 1-1 RTM-ATCA-736X-DD Functional Interconnect Diagram . . . . . . . . . . . . . . . . . . . . . . 17
Figure 1-2 RTM-ATCA-736X-DD Back Panel LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 1-3 SAS Drive Carrier (0106880JXXX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 1-4 RTM-ATCA-736X-DD Top View (with disks installed) . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 1-5 RTM-ATCA-736X-DD Diagram Showing Identification Label Locations . . . . . . . . . 22
Figure 1-6 Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 2-1 Injector / Ejector Latch and Locking Screw . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 2-2 Drive Carrier Assembly (0106880JXXX) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 2-3 Drive Carrier Assembly (DCA) Orientation for Installation . . . . . . . . . . . . . . . . . . . . 35
Figure 3-1 SAS BIOS Start Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Figure 3-2 SAS BIOS Adapter Properties, RTM Status and Configuration . . . . . . . . . . . . . . . . . . 40
Figure 3-3 SAS BIOS RAID Level Configuration Menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 3-4 SAS BIOS, Create New RAID Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 4-1 RTM-ATCA-736X-DD Rear Transition Module Connectors . . . . . . . . . . . . . . . . . . . . 48
Figure 4-2 10/100/1000 Mb Management Port Pin Location Diagram . . . . . . . . . . . . . . . . . . . 49
Figure 4-3 Zone 3, Connector Port Pin Location Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Figure 5-1 Locations of Disk Eject Jumper and Disk Eject Buttons . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure 5-2 Disk FRU State Diagram, Slave Mode (Normal) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure 5-3 Disk FRU State Diagram, Stand-alone Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
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List of Figures
10
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About this Manual

Overview of Contents

This manual supports RTM-ATCA-736X-DD, Rear Transition Module (RTM) with two 1000Base­T Ethernet Ports.
This manual is divided into the following chapters and appendices:
Introduction provides an RTM-ATCA-736X-DD overview.
Installation contains the procedures for installing and removing the RTM-ATCA-736X-DD.
SAS RAID Details provides detailed information on the RTM-ATCA-736X-DD SAS RAID
capabilities.
Mechanical and Connector Information provides mechanical, electrical, environmental, and
other relevant information.
IPMI Functions List provides the details for the function list of the Intelligent Platform
Management Interface.
MMC Firmware Upgrade Procedure provides instructions for upgrading the IPMC (Intelligent
Platform Management Controller) firmware.

Abbreviations

This document uses the following abbreviations:
Abbreviation Definition
AMC Advanced Mezzanine Card
ARP Address Resolution Protocol
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About this Manual

Conventions

The following table describes the conventions used throughout this manual.
Notation Description
0x00000000 Typical notation for hexadecimal numbers (digits are
0b0000 Same for binary numbers (digits are 0 and 1)
bold Used to emphasize a word Screen Used for on-screen output and code related elements
Courier + Bold Used to characterize user input and to separate it
Reference Used for references and for table and figure
About this Manual
0 through F), for example used for addresses and offsets
or commands in body text
from system output
descriptions
12
File > Exit Notation for selecting a submenu
<text> Notation for variables and keys
[text] Notation for software buttons to click on the screen
and parameter description
... Repeated item for example node 1, node 2, ..., node
12
.
.
.
.. Ranges, for example: 0..4 means one of the integers
| Logical OR
Omission of information from example/command that is not necessary at the time being
0,1,2,3, and 4 (used in registers)
RTM-ATCA-736X-DD Installation and Use (6806800L82C)
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Notation Description
Indicates a hazardous situation which, if not avoided, could result in death or serious injury
Indicates a hazardous situation which, if not avoided, may result in minor or moderate injury
Indicates a property damage message
No danger encountered. Pay attention to important information.
About this Manual

Summary of Changes

This manual has been revised and replaces all prior editions.
Part Number Publication Date Description
6806800L82A April 2011 General access release
6806800L82B May 2012 Updated SAS Drive Carrier Assembly Installation on
6806800L82C June 2014 Re-branded to Artesyn.
RTM-ATCA-736X-DD Installation and Use (6806800L82C)
page 32.
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About this Manual
About this Manual
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Introduction

1.1 Overview

The RTM-ATCA-736X-DD is a rear transition module (RTM) designed specifically to work with the Artesyn ATCA-736x processor blade family. The RTM features a two-port 1 Gb Ethernet controller, a four-port SAS controller and two removable disk cards called SAS Drive Carriers. The disk cards each hold one 2.5" disk, and fit wholly within the RTM thermal envelope to provide an environment for proper disk cooling.
Functionally, the RTM-ATCA-736X-DD utilizes two PCI Express buses to connect with the Ethernet and SAS controllers. The Ethernet controller provides two 1000Base-T Ethernet connections using RJ45 copper media jacks on the RTM back panel. These ports are compatible with commodity off-the-shelf, non-proprietary CAT-5E or similar cables.
The SAS controller provides four SAS/SATA ports that each operates at 3 Gb/s. Two SAS ports route to the removable disks, and two SAS ports route back to the Zone 3 connector for additional storage expansion. For example, the front blade can add more storage by routing these ports to disks or to a SAS expander.
Chapter 1
Finally, the RTM-ATCA-736X-DD includes numerous indicator LEDs and a modular management controller (MMC) with a hot swap notification mechanism to coordinate disk servicing the front blade OS. The MMC also performs intelligent monitoring and management tasks and conforms to the PICMG 3.0 and AMC.0 R2 specification.

1.2 Advanced RTM Features

The RTM-ATCA-736X-DD is an 8U (355.6 mm x 80mm) single slot Rear Transition Module that includes the following interfaces and features:
Intel 82580, Dual 1Gb Ethernet controller (PCI Express Gen 2.0)
Two Ethernet 1000Base-T ports (RJ45)
LSI SAS1064E, Quad 3 Gb SAS controller (PCI Express Gen 1.0a)
Two removable SAS Drive Carriers (0106880J0XX)
RAID 0,1, and 1E capability, with boot
SAS Expander support, up to 122 disks
Handle Ejector switch for hot swap
One recessed push button switch for front blade reset
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Introduction
Two recessed push button switches for disk FRU eject request
Temperature and voltage sensors
OOS, health, alarm, and hot swap LEDs
On-board MMC controller for management activities (IPMI)

1.3 I/O PICMG Standards Compliance

The RTM-ATCA-736X-DD is fully compliant with the following PCI Industrial Computer Manufacturers Group (PICMG) specifications:
PICMG 3.0 Rev 3.0
PICMG AMC.0 Rev2.0 compliance
IPMI v1.5 Intelligent Platform Management Interface Specification
PCI Express 2.0 and 1.0a specifications

1.4 I/O Interfaces

The RTM-ATCA-736X-DD mounts to the ATCA carrier blades using zone-3 connectors, conforming to PICMG 3.0 ATCA specification revision 3. Internally, the RTM-ATCA-736X-DD connects zone-3 and the RTM faceplate as follows:
Table 1-1 I/O Ports Available On RTM Faceplate
RTM Zone-3 Electrical Signaling RTM Faceplate
PCIe v1.0, x4 bus #1 Port 1 RJ45 1000Base-T
PCIe v1.0, x8 bus #2 SAS disk field replaceable assembly #1
DCA_SAS, x2 Routes to secondary ports of each SAS drive
LSI_SAS, x2 NA (Routes to LSI Controller)
IPMI - to MMC device on RTM NA
Power NA
16
Port 2 RJ45 1000Base-T
SAS disk field replaceable assembly #2
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Figure 1-1 RTM-ATCA-736X-DD Functional Interconnect Diagram
Introduction

1.4.1 Ports 1-2, Ethernet 1000Base-T (RJ-45)

Each of these ports route to an Intel® 82580DB Ethernet controller accessed by the front blade using PCI express signaling. These ports employ an RJ-45 connector with integrated LED for link (green) and activity (amber). Each port auto negotiates to 10/100/1000BASE-T.

1.5 LEDs

The following LEDs are located on the panel of the RTM-ATCA-736X-DD.
Table 1-2 LEDs On RTM Faceplate
LED RTM Faceplate
Ethernet Activity Amber On LAN management activity LED
Off No activity
Ethernet Link Green On LAN management LINK LED
Off No link
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Introduction
Table 1-2 LEDs On RTM Faceplate (continued)
LED RTM Faceplate
Hard Disk Status #1 and #2 None Off SAS Drive Carrier not installed
Hot Swap (HS) Blue On Management power available to the
Green Off Disk in service
Green Blink Disk I/O on SAS port A
Amber Blink Preparing for removal
Amber On Ready/Safe for removal
module and the module can safely be extracted
Off The module is operational and is
unsafe for extraction
Long Blink Delay before module is activated
Short Blink Delay before module is de-activated
Fault or “Out of Service” (OOS)
In Service (IS) Green On 12V payload power is being supplied
Attention (ATN) Amber On/Off This LED is controlled by higher layer
Amber/Red On Module fault set by shelf manager or
12V payload power not detected.
Off No module fault 12V payload power
is being supplied to board
to board
Off 12V payload power is not detected
Amber/ Red Off This LED is multicolored
(red/green/yellow) and is program­mable by IPMC.
software, such as middle ware or applications.
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Figure 1-2 RTM-ATCA-736X-DD Back Panel LEDs

1.6 Disk "Request Eject" Button

The RTM-ATCA-736X-DD includes a pair of recessed eject buttons that is marked on the panel near port 1 (Figure 1-2). Using a thin pointed object, such as a paper clip, a user can depress the eject button. This action will send a message to the front blade requesting the disk ejection reset. If granted, the corresponding hard disk status light will turn amber.
Introduction

1.7 Reset Button

The RTM-ATCA-736X-DD includes a recessed reset button that is located between the two Ethernet ports (see Figure 1-2). Using a thin pointed object, such as a paper clip, a user can depress the reset button. This action will send a message to the front blade requesting a payload reset. If granted, the host blade and all peripherals will experience a warm reset.

1.8 Software Support

Except for the drivers for the 82580 Ethernet controller (driver distributed by Intel) and for the SAS1064E controller (driver distributed by LSI) , RTM-ATCA-736X-DD requires no other special software to operate. When shipped from the factory, the expander is un-zoned and configured for table routing.
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Introduction

1.9 Products Supported by this Manual

The information in this manual applies to the following Artesyn products:
Table 1-3 Available Board Variants
Marketing Number Description
RTM-ATCA-736X-DD-300 RTM for the ATCA-736X product series, 2X GBE, 2X 147GB SAS HDD
included (ROHS 6/6)
RTM-ATCA-736X-DD-600 RTM for the ATCA-736X product series, 2X GBE, 2X 300GB SAS HDD
included (ROHS 6/6)
RTM-ATCA-736X-1K2 RTM for the ATCA-736X Pproduct series, 2X GBE, 2X 600GB SAS HDD
included (ROHS 6/6)
RTM-ATCA-736X-DD RTM for the ATCA-736X product series, 2X GBE, 2X HDD carrier kits,
no HDD included (ROHS 6/6)
Figure 1-3 SAS Drive Carrier (0106880JXXX)
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Figure 1-4 RTM-ATCA-736X-DD Top View (with disks installed)

1.10 Identification Labels

Introduction
At manufacturing time, several labels are affixed to the RTM-ATCA-736X-DD as shown below. For proper identification of the RTM module, use these barcode labels to accurately determine the module identity. The barcode labels provide the following information:
Table 1-4 RTM-ATCA-736X-DD Identification Labels
Label Description
Label 1: Artesyn
Sub-Assembly P/N
Label 2: Artesyn
Serial number (S/N)
Label 3: Final Assembly P/N
RTM-ATCA-736X-DD Installation and Use (6806800L82C)
P/N = Sub-Assembly Part Number
Rev = Assembly Revision (Refer to Bill Of Material)
S/N Format :AAA = Assembly Number (440)
L =Location of manufacturer (S)
Y = Calendar year of manufacturer ( 2010=0, 2011=1)
MM = Calendar month of manufacturer (March = 03)
SSSS = Sequence number (reset each month) (1234)
P/N = Final Assembly Part Number
Rev = Assembly Revision
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Introduction
Figure 1-5 RTM-ATCA-736X-DD Diagram Showing Identification Label Locations
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Introduction
The following figure contains the Declaration of Conformity for RTM-ATCA-736x-DD series.
Figure 1-6 Declaration of Conformity
E
C Declaration of Conformity
According to EN 17050-1:2004
Manufacturer’s Name:
Manufacturer’s Address:
Declares that the following product, in accordance with the requirements of 2004/108/EC, 2006/95/EC, 2011/65/EU and their amending directives,
Product:
Model Name/Number:
has been designed and manufactured to the following specifications:
EN55022:2010
EN55024:2010
ETSI EN 300 386 V1.5.1 (2010-10)
IEC 60950-1:2005 (2nd Edition), EN60950-1:2006+A11:2009
2011/65/EU RoHS Directive
As manufacturer we hereby declare that the product named above has been designed to comply with the rele­vant sections of the above referenced specifications. This product complies with the essential health and safety requirements of the above specified directives. We have an internal production control system that ensures compliance between the manufactured products and the technical documentation.
Artesyn Embedded Technologies Embedded Computing
Zhongshan General Carton Box Factory Co. Ltd. No 62, Qi Guan Road West, Shiqi District, 528400 Zhongshan City Guangdong, PRC
Rear Transition Module for the ATCA-7365, -737X-, 747X– Product Series
RTM-ATCA-736X-10G, RTM-ATCA-736X-10G-SP, RTM-ATCA-737X-10G, RTM-ATCA-736X-DD-1K2, RTM-ATCA-736X-DD-300, RTM-ATCA-736X-DD-300
___________________________________________________ ___
Tom Tuttle, Manager, Product Testing Services Date (MM/DD/YYYY)
RTM-ATCA-736X-DD Installation and Use (6806800L82C)
06/10/2014
______
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Introduction
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Chapter 2

Installation

2.1 Overview

This chapter contains the procedures for installing and removing the RTM-ATCA-736X-DD RTM.

2.2 Installation and Removal of the Rear Transition Module

The RTM-ATC A-736X-DD can be installed into an ATCA shelf (chassis) with a midplane made for front and rear board installations. The module must be installed in the slot directly behind the host ATCA node board. These back-to-back slots have common pins to enable passing of signals using the Zone-3 connector complex.

2.3 Important Information about Your Chassis

Before installing the rear transition module, verify the module's part number to ensure that the correct rear transition module is being installed into the system. For information on identifying the rear transition module, see Products Supported by this Manual, on page 20.

2.3.1 Safety Statement

The RTM-ATCA-736X-DD is designed to comply with IEC60950-1, and is intended to be used with similarly tested AdvancedTCA products that have a user's guide detailing user installation of module accessories.

2.3.2 Observe Maximum Module Current Requirements

There are several manufacturing options for the RTM. Be sure to validate that the host chassis can supply the RTM slot with these maximum current requirements.
Table 2-1 Maximum RTM Module Current Requirements
RTM-ATCA-736X-DD
Module Current
+12 V (spin up < 100 sec) 0.55 A (6.6 W) 1.9 A (22.9 W) (staggered spin-up)
(No Disk) RTM-ATCA-736X-DD (Two SAS Disk)
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Installation
Table 2-1 Maximum RTM Module Current Requirements (continued)
RTM-ATCA-736X-DD
Module Current
+12 V normal operating 0.55 A (6.6 W) 1.63 A (19.6 W)
OFF STATE LESS THAN 0.4 W LESS THAN 0.4 W
(No Disk) RTM-ATCA-736X-DD (Two SAS Disk)

2.4 Before You Install Or Remove the RTM

Boards may be damaged if improperly installed or handled. Please read and follow the guidelines in this section to protect your equipment.

2.4.1 Observe ESD Precautions

Artesyn strongly recommends that you use an antistatic wrist strap and a conductive foam pad when installing or upgrading a system. Electronic components, such as disk drives, computer boards, and memory modules, can be extremely sensitive to electrostatic discharge (ESD). After removing the component from its protective wrapper or from the system, place the component flat on a grounded, static-free sur face (and, in the case of a board, component side up). Do not slide the component over any surface.
If an ESD station is not available, you can avoid damage resulting from ESD by wearing an antistatic wrist strap (available at electronics stores) that is attached to an active electrical ground. Note that a system chassis may not be grounded if it is unplugged.

2.4.2 Watch for Bent Pins or Other Damage

Bent pins or loose components can cause damage to the board, the backplane, or other system components. Carefully inspect your board and the backplane for both pin and component integrity before installation. Bent pins caused by improper installation or by boards with damaged connectors could void the warranty for the backplane or boards.
If a system contains one or more damaged pins, power off the system and contact your local sales representative to schedule delivery of a replacement chassis assembly.
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Installation

2.5 Use Caution When Installing or Removing RTM

When first installing boards in an empty chassis or onto a carrier card, we recommend that you start at the left of the card cage and work to the right.
When inserting or removing a board in a slot adjacent to other boards, use extra caution to avoid damage to the pins and components located on the primary or secondary sides of the boards.

2.5.1 Preserve EMI Compliance

To preserve compliance with applicable standards and regulations for electromagnetic interference (EMI), during operation, all front and rear openings on the chassis or board faceplates must be filled with an appropriate card or covered with a filler panel. If the EMI barrier is open, devices may cause or be susceptible to excessive interference.

2.5.2 Understand Hot Swap

Your RTM is electrically designed for hot swap within a fully powered chassis. To facilitate hot swap, there is a blue LED on the rear faceplate. This LED is under software control.
If your system is using software that provides full hot swap capabilities, the software will illuminate the blue hot swap LED on the rear faceplate when software has stopped and it is safe to remove the advanced rear transition module.
If your system does not have hot swap-aware software running, the behavior of the blue LED is not determined. In this case, you may need to manually shut down applications or operating systems running on the board prior to board removal, even if the blue LED is lit.
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Installation
Powering down or removing a board before the operating system or other software running on the board has been properly shut down may cause corruption of data or file systems.
Depending on the type of front blade the RTM is connected to, hot swapping the RTM will cause the front board to power down its payload. Please consult Artesyn Embedded Technologies documentation of the relevant front board for further details about RTM hot swap.

2.6 Verify Slot Usage

Prevent possible damage to module components by verifying the proper slot usage for your configuration.

2.7 Installing the Advanced Rear Transition Module

28
This section describes a recommended procedure for installing the RTM module in a chassis.
Before you install your module, please read all cautions, warnings, and instructions presented in this section.
Handling modules and peripherals can result in static damage. Use a grounded wrist strap, static-dissipating work surface, and antistatic containers when handling and storing components.
Insert the board by holding the module handles. Do not exert unnecessary pressure on the faceplate.
Hot swap compliant modules may be installed while the system is powered on. If a module is not hot swap compliant, you should remove power to the slot or system before installing the module. Please consult Artesyn Embedded Technologies documentation of the relevant front board for further details about RTM hot swap.
Installation Process
1. Verify that you have taken the necessary antistatic precautions.
2. Go to the back of the system and choose an appropriate slot for the rear transition module.
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Installation
Rear transition modules must be installed in-line behind the accompanying node board. For example, if the accompanying node board is going to be installed in slot 3, its rear transition module must be installed at the back of the system in slot 3.
3. Remove the slot filler panel from the selected node board slot, if necessary.
4. Prepare the module by loosening the locking screws and opening the injector/ejector latch
at the top of the module as shown in the figure below.
Figure 2-1 Injector / Ejector Latch and Locking Screw
5. Carefully align the edges of the module with the guides in the appropriate slot.
Look into the enclosure to verify correct alignment of the rails in the guides. Align the edges of the module with the card cage rail guides in the appropriate slot.
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Installation
6. Keeping the module aligned with the guides, apply equal and steady pressure and slide the
module in until the injector/ejector mechanism engages with the retention bars.
7. Position your thumbs at the top and bottom of the RTM; simultaneously push in the module
and rotate the injector/ejector mechanisms inward to its closed position to seat and secure the RTM. DO NOT FORCE THE BOARD INTO THE SLOT.
8. Tighten the two module retention screws to secure the module into the shelf.
9. Power on the system, if necessary. Refer to your system manual for instructions on correctly
powering on the system. Once power is applied to the chassis, the internal MMC controller runs a self-test that runs for approximately 10 seconds. Upon a successful power up self­test, the blue hot swap LED will blink and then turn off, indicating that the module has been placed in operation.

2.8 Removing the Advanced Rear Transition Module

The RTM-ATCA-736X-DD RTM is hot-swappable and can be removed from the chassis without powering down its associated node board if supported by the front board. Please consult Artesyn Embedded Technologiesdocumentation of the relevant front board for further details about RTM hot swap. This section describes a recommended procedure for removing a board module from a chassis.
Before you remove your module, please read all cautions, warnings, and instructions presented in this section. Hot swap compliant modules may be removed while the system is powered on. If the chassis is not hot swap compliant, you should remove power to the slot or system before removing the module.
Removing an RTM
1. Loosen the locking screws on the rear transition module.
2. Rotate the top ejector handle to half way (HW) position. Do not remove the module
immediately.
3. If your host module is running a hot swap-aware software, the action of rotating the ejector
lever will start the shutdown process on the board. The software will slowly blink the blue hot swap LED indicating the module is in the process of being deactivated.
4. Once the module has been deactivated, the blue LED will illuminate steadily. Once this is
done, you can extract the module by pulling on the module handle.
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Note: Powering down or removing a board before the operating system or other software running on the board has been properly shut down may cause corruption of data or file systems.
5. If your board or system is not running hot swap-aware software, the blue LED may
illuminate without regard to software processes still running on the board. Be sure to manually shut down applications or operating systems running on the board prior to board removal.
6. Carefully pull the module from the chassis.
7. If the card slot is to remain empty, install a filler panel in the slot.

2.9 Verifying the Hardware Installation

This section provides information to verify the installation of the RTM-ATCA-736X-DD module. Manually inspect the module power LED on the RTM panel. Refer to Figure "RTM-ATCA-736X-
DD Back Panel LEDs" on page 19.
Installation
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Installation

2.10 SAS Drive Carrier Assembly Installation

The RTM-ATCA-736X-DD can accommodate two SAS drive carrier assembly. These assemblies support disk serviceability and hot swap without removing the RTM. This section describes the recommended procedure for installing the drive carrier assembly.
Figure 2-2 Drive Carrier Assembly (0106880JXXX)
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Installation
To install a DCA, follow these steps:
1. Verify that you have taken the necessary antistatic precautions.
2. Place the hard disk insulator on the top of the SAS-PCB assembly.
3. Align the insulator holes with the holes on the board.
4. Place the hard disk on the top of the insulator, such that it is aligned with the board SATA
connector.
5. Slide the hard disk into the SATA connector.
6. Flip assembly on its back and align the SAS-PCB holes with the insulator and hard
disk holes.
7. Attach the drive support bracket to the side of the hard disk.
8. Tighten the four flat head screws to secure the drive support bracket to the hard
disk.
9. Tighten the two pen head screws to fix the hard disk, insulator, and SAS-PCB
together.
10.Assemble the front panel bezel to the disk drive assembly using two flat head
screws.

2.11 SAS Drive Carrier Assembly Removal (Eject)

The RTM-ATCA-736X-DD can accommodate two SAS Drive Carrier Assemblies (DCA). These assemblies support disk serviceability and hot swap without removing the RTM. This section describes the recommended procedure for removing the hard disk assembly.
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Installation
To remove a DCA, follow these steps:
1. Locate the hole marked "EJECT" corresponding to DCA #1 or #2. Insert a paperclip about 0.5
inches to engage a spring-loaded plastic micro switch.
Note: Removing a DCA without properly preparing the operating system or other software using the disk, may cause corruption of data or file systems.
2. The corresponding DCA status LED will blink in amber color for approximately five seconds.
The blink indicates the DCA is being de-activated.
3. Once the module has been de-activated, the DCA status LED illuminates steady amber.
4. Loosen the locking thumbscrews on the DCA. Carefully pull the module from the chassis.
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5. If the card slot is to remain empty, install a filler panel in the slot.
Figure 2-3 Drive Carrier Assembly (DCA) Orientation for Installation
Installation
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Installation
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SAS RAID Details

3.1 Overview

This chapter provides detailed information on the RTM-ATCA-736X-DD SAS RAID capabilities.

3.2 Hard Disk Drive Controller

The RTM-ATCA-736X-DD includes an LSI SAS 1064e hard disk drive controller with the following features:
Four-lane PCIe interface (full duplex 2.5 Gb/sec)
Four SAS ports (3.0 Gb/sec) with 1 port routed to each hard disk drive slot.

3.3 SAS Boot BIOS Features

Chapter 3
The Boot BIOS for Intel/AMD-based platforms is stored on the flash device located on the module.
The SAS boot BIOS supports the following features:
Support multiple SAS controllers
Apply global properties stored in flash
Selection and configuration for up to 256 adapters
Automatic INT13 drive mapping for SAS drives
SAS topology discovery, including expander traversal
Apply PHY transceiver properties
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SAS RAID Details

3.4 Brief Theory of BIOS Operation

If Boot is enabled, the boot BIOS will scan for SAS hard disks (HD) connected to the RTM. Discovered disk(s) are enumerated with drive letters and appended to a master list of “devices” discovered on the host. Upon scan completion, the host will serially inspect the master list of devices beginning with drive A, and attempt to boot from the first device it finds with a boot record.
The boot feature is enabled by default on this product.

3.5 Boot BIOS Configuration Utility

The BIOS configuration utility is stored in a flash device located on the RTM module. LSI Corporation authored the BIOS used on the RTM module. The sections that follow will provide the user a summary of the BIOS configuration capabilities.

3.5.1 Launching the Boot BIOS Configuration Utility

The boot BIOS allows you to change the default configuration of your RTM module. When the BIOS loads, the following message appears on your monitor:
Press Ctrl-C to start LSI Configuration Utility...
This message remains on your screen for about five seconds, giving you time to start the utility. After you press CTRL+C, the message changes to:
Please wait, invoking LSI Configuration Utility...
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After a brief pause, your computer monitor displays the main menu of the BIOS Configuration Utility.
Not all devices detected by the Configuration Utility can be controlled by the BIOS. Devices such as tape drives and scanners require loading a device driver specific to that peripheral. The BIOS Configuration Utility allows parameters to be modified for these devices.

3.5.2 BIOS Launch: Main Menu

When the boot BIOS Configuration Utility is launched, the main menu appears. This screen displays a scrolling list of all the SAS controllers visible in the system, along with PCI Express identification information. Use the arrow keys to select the RTM module you wish to modify, and press ENTER to view and modify module properties.
SAS RAID Details
Figure 3-1 SAS BIOS Start Menu
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SAS RAID Details

3.5.3 Adapter Properties Menu

This menu provides the top level view of module status and manageable attributes. Using the arrow keys, move to the menu item you wish to select and press ENTER.
Figure 3-2 SAS BIOS Adapter Properties, RTM Status and Configuration

3.6 RAID Firmware Capability

The RTM-ATCA-736X-DD product includes additional firmware to construct RAID volumes using a disk on the RTM and a disk externally connected to the RTM. Please consult your host blade documentation to verify this capability.
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3.6.1 BIOS, RAID Properties Menu

This menu allows the user to select the desired RAID level for a volume definition. Using the arrow keys, move to the menu item you wish to select and press ENTER.
Figure 3-3 SAS BIOS RAID Level Configuration Menu
SAS RAID Details
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SAS RAID Details
Menu Text RAID Level Description
None Default. All discovered disks are presented to the host blade
or CPU, with no RAID function.
IS Volume
(Integrated Stripe)
IM Volume
(Integrated Mirror)
IME volume
(Integrated Mirror Enhanced)
RAID0 Two or more disks are grouped to provide a capacity
aggregation function. The advantage is the multiplicative performance and capacity effect of four spindles working in concert to store or retrieve data for the host.
RAID1 Two disks are grouped to provide a mirror function. By
definition, two drives our bounded such that every write to one drive is mirrored on the second. If a failure occurs with either drive, the data is still accessible through the surviving drive.
RAID1E Three or more disks are grouped to provide a mirror function
using an algorithm extension to permit use with many drives. If a failure occurs with any drive, data is still accessible through the surviving drives.

3.6.2 BIOS, RAID Create New Array and Global Hot Spare

This menu enables the user to choose the disks that will comprise new RAID volumes or global hot spares. Using the keyboard arrow keys, highlight the drives in the "RAID DISK" column, and use the space bar to change to "Yes" or "No", "Yes" if the disk will be a member of the new array and "No", if otherwise. Alternatively, highlight the drives in the "Hot Spr" (global hot spare) column, and use the space bar to change to "Yes" or "No", "Yes" if the disk will be a member of the global hot spare and "No", if otherwise. A maximum of two drives may be designated as a global hot spare.
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SAS RAID Details
In this screen shot example, a total of four drives were detected. Two are marked to become the IM (RAID1) volume, and a third is designated as a global hot spare for the volume. Press the "C" key to create the volume.
Figure 3-4 SAS BIOS, Create New RAID Array
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SAS RAID Details
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Mechanical and Connector Information

4.1 Specifications

This section provides mechanical, electrical, environmental, and other relevant information.

4.1.1 Physical Dimensions

The RTM-ATCA-736X-DD is an 8U (355.6 mm) height board with 80 mm depth for standard applications. It complies with PICMG 3.0 Revision 3.0 specification. The RTM-ATCA-736X-DD is keyed to conform to the PICMG 3.0, Keying of ATCA Boards and Backplanes specification.

4.1.2 Weight

The weight of the RTM-ATCA-736X-DD is listed below.
Chapter 4
Table 4-1 RTM-ATCA-736X-DD Weight
Description
RTM Board 570 g 1000 g
RTM board in shipping box 1125 g 1555 g

4.1.3 Power Requirements

There are several manufacturing options for the RTM. Be sure to validate that the host chassis can supply the RTM slot with these maximum current requirements. See Table "Maximum RTM
Module Current Requirements" on page 25.
RTM-ATCA-736X-DD (No disks)
RTM-ATCA-736X-DD (Dual disks installed)
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Mechanical and Connector Information

4.1.4 Environmental Specifications and Compliance

The environmental specifications for the RTM-ATCA-736X-DD assembly are presented in the table below.
Table 4-2 Environmental Specifications for the RTM-ATCA-736X-DD
RTM with rotating SAS Disk Media
Specification
Operating Voltage +12V +/- 5% (payload power) +12V +/- 5% (payload power)
Operating Temperature (normal) +5°C to +40°C +0°C to +49°C
Installed RTM without Disks
Operating Temperature (short term) -5°C to +55°C (Consult disk drive
manufacturer for warranty implications)
Storage Temperature -40 °C to 70°C -40 °C to 100°C
Operating Temperature Gradient 11°C /H (max) 11°C /H (max)
Storage Temperature Gradient 20°C /H (max) 20°C /H (max)
Shipping Temperature Gradient 20°C /H (max) *1 20°C /H (max)
Operating Humidity 5% to 85% (non condensing) 5% to 90% (non condensing)
Storage Humidity 5% to 90% (non condensing) 5% to 90% (non condensing)
Shipping Humidity 5% to 90% (non condensing) No condensation
Condensation No condensation No condensation
Altitude, operating (relative to sea level)
Altitude, non-operating (relative to sea level)
Shock, operating 980 m/s2 (100G) / 1 ms duration 500G / 0.5msec duration
Shock, non-operating 3,920 m/s2 (400G) / 1 ms duration 1000G / 0.5msec duration
Vibration, operating 0.6 mm (5 to 20Hz) / 9.8 m/s2 (1G)
-305 to +3,048 m (-1000 to +10,000 feet)
-305 to +12,192 m (-1000 to +40,000 feet)
(20 to 300Hz) or less Note: At random seek write/read and default on retry setting with log sweep vibration.
+0°C to 70°C
(-1000 to +40,000 feet)
(-1000 to +40,000 feet)
2.17 GRMS (5-700Hz)
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Mechanical and Connector Information
Table 4-2 Environmental Specifications for the RTM-ATCA-736X-DD (continued)
RTM with rotating SAS Disk Media
Specification
Vibration, non-operating 3.1 mm (5 to 20Hz) / 49m/s2 (5G)
RoHS 6 of 6 compliant 6 of 6 compliant
MTBF Not calculated 972,226 hours (@25C)
Installed RTM without Disks
3.13 GRMS (5-800Hz) (20 to 300Hz) or less. Note: At power-off state after installation

4.1.5 NEBS Compliance

NEBS certifications are performed by integrator at a system level (chassis, ATCA, shelf managers, etc.). The RTM module will not preclude the system from passing NEBS.

4.1.6 Electromagnetic Compliance

The board is designed and implemented to minimize electromagnetic emissions, susceptibility, and the effects of electrostatic discharge.
Table 4-3 EMC Emission Compliance
Standard Description
US: FCC 47 CFR Part 15 Class A FCC Class A emissions requirements (United States)
ICES-003 2004 Class A Class A Interference-causing Equipment standard (Canada)
VCCI V-3/2007.04 Class A Class A ITE emissions requirements (Japan)
Europe Commercial: EN5022:2006 Class A, ITE Class A ITE emissions requirements (EU, Europe)
AS/NZS CISPR 22:2005 Class A, ITE Class A ITE emissions requirements (Australia)
Europe Commercial: EN 55022:1998/A1:2000/A2:2003
Europe Commercial: EN 55024:1998A1:2001/A2:2003
Europe Commercial: EN 61000-4-2,3,4,5,6: 2001 EMC Electrostatic discharge immunity
Immunity for ITE equipment
Immunity for ITE equipment
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Mechanical and Connector Information

4.2 Connectors and Pin Assignments

This section provides position and pin-out details of all connectors available on the RTM-ATCA­736X-DD.
Table 4-4 Connector Port Identification snd Location
1 Disk FRU # 1 4 Zone 3 connector
2 1000BASE-T Ethernet 5 RTM alignment pin
3 Disk FRU # 2
Figure 4-1 RTM-ATCA-736X-DD Rear Transition Module Connectors
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4.2.1 1000Base-T Ethernet Ports

Two Ethernet ports are provided on the rear panel of the RTM using an RJ-45 style shielded connectors. Each of these ports route to an Intel® 82580 Ethernet controller, and accessed by the front blade through PCI express signaling. Each port auto negotiates to 10/100/1000BASE­T.
Table 4-5 10/100/1000 Management Port Connector Pin Assignments
Pin Signal Name Pin Signal Name
1 LAN0_A+ 5 LAN0_C-
2 LAN0_A- 6 LAN0_B-
3 LAN0_B+ 7 LAN0_D+
4 LAN0_C+ 8 LAN0_D-
Mechanical and Connector Information
Figure 4-2 10/100/1000 Mb Management Port Pin Location Diagram
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Mechanical and Connector Information

4.2.2 Zone 3 Connectors

The RTM-ATCA-736X-DD routes several I/O signals to the Zone-3 connector complex consisting of connectors J30 and J32. These connectors enable expansion using rear transition modules (RTM) whose "J" connectors mirror the "P" connectors located on the carrier module. All of these connectors utilize a 4-pin per column type available from Tyco electronics (PN# 1469048-1, http://www.tycoelectronics.com).
The connector pin-outs are presented from the point of view of ATCA blade, such that:
"TX" refers to ATCA blade as the signal source, and RTM as the signal receiver.
"RX" refers to ATCA blade as signal receiver, and RTM as the signal source.
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Mechanical and Connector Information
Figure 4-3 Zone 3, Connector Port Pin Location Diagram
4.2.2.1 Connector J30, Power Supply for Advanced RTM
The RTM-ATCA-736X-DD draws power from +12 V and the +3.3 V management voltages through the P30 connector. The RTM will convert the main 12 V payload power into 1.0 V, 1.8 V, 2.5 V and 3.3 V by using DC/DC converters.
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Mechanical and Connector Information
4.2.2.2 Connector J30, Storage and Management Infrastructure Pin Assignments
The following table presents the RTM-ATCA-736X-DD J30 connector pin assignments and descriptions:
Table 4-6 Connector P30, Management infrastructure Pin Assignments
Row Interface A B C D E F G H
1 88_Serial
_RXD
2 SAS LSI_SAS[
3]TX+
3 SAS LSI_SAS[
2]TX+
4 USB USB+ USB- n.c. n.c. SATA[1]TX+SATA[1]TX-SATA[1]RX+SATA[1]RX-
5 n.c. n.c. n.c. n.c. n.c. n.c. n.c. n.c.
6 PCIe-10 3 P10_Rx0+P10_Rx0- P10_Tx0+P10_Tx0- P10_Rx1+P10_Rx1- P10_Tx1+P10_Tx1-
7 PCIe-10 3 P10_Rx2+P10_Rx2- P10_Tx2+P10_Tx2- P10_Rx3+P10_Rx3- P10_Tx3+P10_Tx3-
8 Test P10_Clk1
00+
9 IPMB IPMB_SCLIPMB_SDAV3P3_M
10 POWER VP12 VP12 n.c. n.c. n.c. ENABLE_NI2C_CLK I2C_DAT
88_Serial _TXD
LSI_SAS[ 3]TX-
LSI_SAS[ 2]TX-
P10_Clk1 00-
TDO TDI n.c. n.c. PS1_N POWERGOOD
LSI_SAS[ 3]RX+
LSI_SAS[ 2]RX+
88_PCIE_ RST
GMT
LSI_SAS[ 3]RX-
LSI_SAS[ 2]RX-
JTAG_TRSTJTAG_TCKJTAG_TMS88_SHIFT
n.c. reserved 88_PS0_N88_RST_
DCA2_SA S_TX+
DCA1_SA S_TX+
DCA2_SA S_TX-
DCA1_SA S_TX-
DCA2_SA S_RX+
DCA1_SA S_RX+
_CLK
KEY_N
DCA2_SAS_RX-
DCA1_SAS_RX-
88_LATCH_CLK
88_RST_OUT_N
Table 4-7 Connector J30, Management Infrastructure Signal Descriptions
88_Serial_RXD O LVTTL Serial line receives data to the front board CPU.
88_Serial_TXD I LVTTL Serial line transmits data from the front board CPU.
V3P3_MGMT +3.3V Management Power is used exclusively for management power.
PS1_N O RTM Presence signal. The front board reads this active low signal to determine
if an RTM is present and fully inserted.
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Mechanical and Connector Information
Table 4-7 Connector J30, Management Infrastructure Signal Descriptions (continued)
POWERGOOD O Open Drain. When low indicates to RTM that it is fully inserted and that MMC
can start execution. Logic high shall keep MMC in reset state. This signal shall have a pull-up resistor.
LSI_SAS[ ] I/O LVDS. These transceiver pairs connect to the LSI SAS controller, port2 and
port3. Some front blades route these ports to the Zone2 update channel where additional disks may reside.
DCA1_SAS[] I/O LVDS. These transceiver pairs route to the secondary SAS por t of the hard drive
located on DCA (drive carrier assembly) #1
DCA2_SAS[] i/O LVDS. These transceiver pairs route to the secondary SAS port of the hard drive
located on DCA (drive carrier assembly) #2
SATA[ ] I/O (Unused) LVDS. These transceiver pairs are driven by a storage controller on
the host blade.
USB I/O (Unused) USB bidirectional, differential data pin pair
TDO, TDI Test Data In/Out signals as defined in JTAG. The RTM provides a bypass circuit
to propagate this signal and complete the test data chain (that is, TDI connects to TDO)
P10_Rx, P10_Tx, P10_Clk100+
88_PCIE_RST PCIE Reset driven by host blade.
IPMB_SCL, IPMB_SDA
VP12 12V Payload Power, enabled after successful E-keying, as outlined in the AMC.0
(Unused) LVDS. Port #10 PCI express differential signal pairs for transmit receive and 100MHz reference Clock
IPMI/I2C serial-bus clock and data signals, as defined in AMC.0 specification.
specification.
4.2.2.3 Connector J32, PCI-Express and Test Infrastructure Pin Assignments
The RTM-ATCA-736X-DD , J31 connector pin assignments and descriptions appear below.
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Table 4-8 Connector J32, Miscellaneous RTM Signal Descriptions
Row Interface A B C D E F G H
3
1 PCIe-9
2 PCIe-9
3 PCIe-8
4 PCIe-8
5 PCIe-7
6 PCIe-7
7 PCIe-6 P6_Rx0+ P6_Rx0- P6_Tx0+ P6_Tx0- P6_Rx1+ P6_Rx1- P6_Tx1+ P6_Tx1-
8 PCIe-6 P6_Rx2+ P6_Rx2- P6_Tx2+ P6_Tx2- P6_Rx3+ P6_Rx3- P6_Tx3+ P6_Tx3-
P9_Rx0+ P9_Rx0- P9_Tx0+ P9_Tx0- P9_Rx1+ P9_Rx1- P9_Tx1+ P9_Tx1-
3
P9_Rx2+ P9_Rx2- P9_Tx2+ P9_Tx2- P9_Rx3+ P9_Rx3- P9_Tx3+ P9_Tx3-
2
P8_Rx0+ P8_Rx0- P8_Tx0+ P8_Tx0- P8_Rx1+ P8_Rx1- P8_Tx1+ P8_Tx1-
2
P8_Rx2+ P8_Rx2- P8_Tx2+ P8_Tx2- P8_Rx3+ P8_Rx3- P8_Tx3+ P8_Tx3-
2
P7_Rx0+ P7_Rx0- P7_Tx0+ P7_Tx0- P7_Rx1+ P7_Rx1- P7_Tx1+ P7_Tx1-
2
P7_Rx2+ P7_Rx2- P7_Tx2+ P7_Tx2- P7_Rx3+ P7_Rx3- P7_Tx3+ P7_Tx3-
9 PCIe P9_Clk100+P9_Clk1
00-
10 POWER VP12 n.c. n.c. VP12 n.c. 88
P8_Clk100+P8_Clk1
00-
P7_Clk1 00+
P7_Clk1 00-
P6_Clk100+P6_Clk1
00-
88_ DI 88_ D0
_PS0_N
1
PCIe ports 8 and 7 may be combined to function as single x8 PCI-express port through BIOS settings. Port 8 become
bits 4-7.
2
PCIe ports 10 and 9 may be combined to function as single x8 PCI-express port through BIOS settings. Port 10
become bits 4-7.
3
PCIe ports 10,9,8,7 may be combined to function as single x16 PCI-express port through BIOS settings. Port 10
becomes bits 15-12.
Table 4-9 Connector J32, Miscellaneous RTM Signal Descriptions
Connector Description
P9_Rx, P9_Tx, P9_Clk100+ (Unused) Port #9 PCI express differential signal pairs for transmit and receive; and
100MHz reference clock
P8_Rx, P8_Tx, P8_Clk100+ Route to LSI 1064E Port #8 PCI express differential signal pairs for transmit and
receive; and 100 MHz reference clock
P7_Rx, P7_Tx, P7_Clk100+ Route to LSI 1064E. Port #7 PCI express differential signal pairs for transmit and
receive; and 100 MHz reference clock
P6_Rx, P6_Tx, P6_Clk100+ Route to Intel 82580. Port #6 PCI express differential signal pairs for transmit
receive and 100 MHz reference clock
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Table 4-9 Connector J32, Miscellaneous RTM Signal Descriptions (continued)
Connector Description
VP12 12V Payload Power, enabled after successful E-keying, as outlined in the AMC.0
specification.
88 _PS0_N Ac tive low RTM present signal.PS0_N is tied to logic GND on the ATCA blade. PS0_N
(Connector J32) and PS1_N (Connector J30) shall be connected through a diode on the RTM. Logic low on PS1_N indicates that RTM is present and fully inserted.
Consult Artesyn documentation of the relevant front board for further details how to set PCIe lane width.
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IPMI Functions List

5.1 Overview

The RTM-ATCA-736X-DD module includes an MMC device for reporting status information to the ATCA blade. This MMC utilizes an Intelligent Platform Management Interface (IPMI) which will communicate with the AdvancedTCA. This MMC controls and monitors the following:
Hot swap communication with the shelf manager
Inlet air temperatures
Voltage monitoring
FRU information
Drives OOS (out of service), IS (in service) and ATN (attention) LEDs

5.2 IPMI and Management Controller (IPMC)

Chapter 5
The design features an IPMI controller consisting of a 16-bit microcontroller, flash and SRAM. The microcontroller uses I2C interface to communicate the shelf management controller (ShMC), and sensors and MMC devices on AdvancedMC modules and the RTM, if installed.
An I2C connection provides the communication path between the MMC and the
temperature sensor.
Support hot swap operation as defined for AMC modules in PICMG AMC.0 specification
"Fail-safe flash update" - if interrupted at anytime, the MMC firmware is still able to respond and re-flash.
"I2C hang recovery" - able to detect and recover from an I2C bus hang.

5.3 Sensor Data Records

The MMC monitors the status of the module and provides this data so it can be read by the shelf manager. Below are the SDRs that the RTM-ATCA-736X-DD module creates.
Table 5-1 Sensor Data Records
# Sensor UNR UC UNC LNC LC LNR ID String
0x07 1.0 1.105 1.075 1.055 0.955 0.935 0.905 +1V0
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IPMI Functions List
Table 5-1 Sensor Data Records
# Sensor UNR UC UNC LNC LC LNR ID String
0x03 1.2 1.324 1.294 1.265 1.147 1.118 1.088 +1V2
0x08 1.8 1.985 1.935 1.895 1.715 1.675 1.625 +1V8
0x02 3.3 V 3.605 3.505 3.462 3.162 3.105 3.005 +3V3
0x04 12.0 V 13.603 13.438 13.053 11.018 10.633 10.412 +12V0
0x05 Board Temp
(LM75)
0x06 Inlet Temp
(LM60)
0x0B 12 V to Disk N/A N/A N/A N/A N/A N/A +12V0 SLOT1
0x0C 12 V to Disk N/A N/A N/A N/A N/A N/A +12V0 SLOT2
51.320 60.740 70.160 N/A N/A N/A Board Temp
60.000 70.000 80.000 N/A N/A N/A Inlet Temp
The RTM-ATCA-736X-DD includes the standard FRU data records per the IPMI Platform Management FRU Information Storage Definition, Board Info Area. The RTM-ATCA-736X-DD includes additional FRU records as defined in the PICMG 3.0 specification.
Table 5-2 Standard FRU Data Records
Board Information
Ver sio n 1
Language Code EN (English)
MFG date.time See note *1
Manufacturer Emerson Network Power
Product Name RTM-ATCA-736X-DD
Serial Number AAALYMMssss (See note *2)
58
Part Number 0106812K0XX
*1. Manufacturing time is defined as 'minutes since 1/1/96' in the IPMI FRU spec.
*2. Serial Number format: AAALYMMssss
AAA = 431 part code (denotes RTM-ATCA-736X-DD)
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L =Location of manufacturer (S)
Y = Calendar year of manufacturer (2008 = 8)
MM = Calendar month of manufacturer (March = 03)
SSSS = Sequence number (reset each month) (1234)

5.3.1 RTM E-Keying Port Assignments

Table 5-3 RTM E-Keying Port Assignments
IPMI Functions List
Port
Port
0 PCIe 02h, AMC.1 PCI
1 PCIe 02h, AMC.1 PCI
2 PCIe 02h, AMC.1 PCI
3 PCIe 02h, AMC.1 PCI
4 PCIe 02h, AMC.1 PCI
Name Link type Link type extension
Express
Express
Express
Express
Express
Asymmetric match Link Designator
0000b, Gen1-NSSC 01b 100h, AMC.1 Type
1, Group 0
0000b, Gen1-NSSC 01b 100h, AMC.1 Type
1, Group 0
0000b, Gen1-NSSC 01b 100h, AMC.1 Type
1, Group 0
0000b, Gen1-NSSC 01b 100h, AMC.1 Type
1, Group 0
0000b, Gen1-NSSC 01b 100h, AMC.1 Type
1, Group 0
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IPMI Functions List

5.4 Supported IPMI Commands

The MMC communicates with the carrier controller through the local IPMB-L bus of the carrier and responds to all mandatory commands for AMC Module Management Controllers, as well as some optional ones.
Table 5-4 Supported IPMI Commands
IPMI/PICMG
Command
IPM Device "Global" Commands
Get Device ID 17.1 App 01h Mandatory
Broadcast "Get Device ID" 17.9 App 01h Mandatory
Messaging Commands
Send Message 18.7 App 34 h Optional
/AMC Spec NetFn CMD MMC Req
Event Commands
Platform Event 23.3 S/E 02 h Mandatory
Sensor Device Commands
Get Device SDR Info 29.2 S/E 20 h Mandatory
Get Device SDR 29.3 S/E 21 h Mandatory
Reserve Device SDR Repository 29.4 S/E 22 h Mandatory
Get Sensor Reading Factors 29.5 S/E 23 h Optional
Set Sensor Hysteresis 29.6 S/E 24 h Optional
Get Sensor Hysteresis 29.7 S/E 25 h Optional
Set Sensor Threshold 29.8 S/E 26 h Optional
Get Sensor Threshold 29.9 S/E 27 h Optional
Set Sensor Event Enable 29.10 S/E 28 h Optional
Get Sensor Event Enable 29.11 S/E 29 h Optional
Rearm Sensor Events 29.12 S/E 2A h Optional
Get Sensor Event Status 29.13 S/E 2B h Optional
Get Sensor Reading 29.14 S/E 2D h Mandatory
FRU Device Commands
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Table 5-4 Supported IPMI Commands (continued)
IPMI/PICMG
Command
Get FRU Inventory Area Info 28.1 Storage 10 h Mandatory
Read FRU Data 28.2 Storage 11 h Mandatory
Write FRU Data 28.3 Storage 12 h Mandatory
AdvancedTCA™ Commands
Get PICMG Properties 3-9 PICMG 00 h Mandatory
FRU Control 3-22 PICMG 04 h Mandatory
Get FRU LED Properties 3-24 PICMG 05 h Mandatory
Get LED Color Capabilities 3-25 PICMG 06 h Mandatory
Set FRU LED State 3-26 PICMG 07 h Mandatory
Get FRU LED State 3-27 PICMG 08 h Mandatory
/AMC Spec NetFn CMD MMC Req
Get Device Locator Record ID 3-29 PICMG 0D h Mandatory
AMC® Commands
Set AMC Port State 3-27 PICMG 19 h Mandatory
Get AMC Port State 3-28 PICMG 1A h Mandatory

5.4.1 Disk IPMI ’raw’ Commands

The MMC on the RTM includes several custom commands developed to facilitate management of the Hard Disk Assemblies (DCA). Please consult your ATCA carrier or shelf documentation for the exact syntax to send a raw command, as it will vary with each ATCA supplier.
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IPMI Functions List
5.4.1.1 Disk Eject, Deactivation Request to Power-off Disk
This command produces the same response as pressing one of the disk eject buttons on the RTM panel.
Before ejecting a drive, the user should ensure the OS has released the drive, meaning it has to be unused. This usually requires unmounting any file systems on it, and terminating any raw partition use.
Upon completion of the OS removal preparations, the user may issue an IPMI raw command and subsequently illuminate the disk FRU hot swap LED.
Table 5-5 IPMI Raw Command Disk Removal Request
Raw Command Description
netfn 0x2E
cmd 0xA0
data 0xA4 0x76 0x00 0xZZ
Where 0xZZ indicates the disk drive:
0x01 is disk#1, 0x02 is disk#2.
Any other 0xZZ value will trigger completion code 0xCC
Return code 0x00 - Success
0xCC - Invalid Data in Request
Return Data 0xA4 0x76 0x00
5.4.1.2 Approve Disk Eject Request
If the RTM is operating in slave mode (see Typical Module Slave Extraction Mode (Normal), on
page 66), the host must explicitly approve a disk eject request using this command.
Table 5-6 IPMI Raw Command to Approve Disk Power Eject Request
Raw command Description
netfn 0x2E
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Table 5-6 IPMI Raw Command to Approve Disk Power Eject Request
Raw command Description
cmd 0xA1
data 0xA4 0x76 0x00 0xZZ
Where 0xZZ indicates the disk drive:
0x01 is disk#1, 0x02 is disk#2.
Any other 0xZZ value will trigger completion code 0xCC
Return code 0x00 - Success
0xCC - Invalid Data in Request
Return Data 0xA4 0x76 0x00
5.4.1.3 Read OEM Manufacturing in DCA EEPROM
Each Drive Carrier Assembly (DCA) includes an EEPROM, with a 128 byte region reserved for OEM manufacturing storage. The region may contain data deemed relevant to the manufacturer. Users may read the OEM manufacturing region 8 bytes at a time. Use this command to read bytes from the OEM manufacturing region located at a given offset.
IPMI Functions List
Table 5-7 IPMI Raw Command to Read OEM Manufacturing from Drive Carrier Assembly
Raw command Description
netfn 0x2E
cmd 0xA2
data 0xA4 0x76 0x00 0xZZ xYY
Where 0xZZ indicates the disk drive:
0x01 is disk#1, 0x02 is disk#2.
Where 0xYY is byte count offset, (0x00-0x77)
Any other 0xZZ value will trigger completion code 0xCC
Return code 0x00 - Success
0xC9 = IPMI PARAMETER OUT OF RANGE, I2C read failed, invalid address
0xCC - Invalid Data in Request
0xD5 = Command not supported in present state
Return Data 0xA4 0x76 0x00 [8 bytes of data]
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At present, the OEM manufacturing data is expected to contain four entries, beginning at offset 0x00
1. Manufacturer, Null terminated (0x00)
2. Product Name, Null terminated (0x00)
3. Part/Model Number, Null terminated (0x00)
4. Serial Number, Null terminated (0x00)
5.4.1.4 Write OEM Manufacturing Data Contents in DCA EEPROM
Each Drive Carrier Assembly (DCA) includes an EEPROM, with a 128 byte region reserved for FRU data storage. The region may contain data deemed relevant to the manufacturer. Users may read the FRU data region 8 bytes at a time. Use this command to write bytes to the FRU data region at a given offset.
Table 5-8 IPMI Raw Command to Read FRU Data from Hard Disk Assembly
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Raw command Description
netfn 0x2E
cmd 0xA3
data 0xA4 0x76 0x00 0xZZ xYY [8 data bytes]
Where 0xZZ indicates the disk drive:
0x01 is disk#1, 0x02 is disk#2.
Where 0xYY is byte count offset, (0x00-0x77)
Any other 0xZZ value will trigger completion code 0xCC
Return code 0x00 - Success
0xC9 = IPMI PARAMETER OUT OF RANGE, I2C write failed, invalid address
0xCC - Invalid Data in Request
0xD5 = Command not supported in present state
Return Data 0xA4 0x76 0x00
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IPMI Functions List

5.5 Communication Mechanisms for Disk Extraction

The RTM includes two disk eject request buttons located on the RTM panel. When pressed, the behavior of the RTM is governed by the state of jumper identified as HDR500. The diagram below shows the location of the eject buttons and header.
Figure 5-1 Locations of Disk Eject Jumper and Disk Eject Buttons
Disk eject behavior differs by the position of jumper HDR500.This table defines the operations that take place when the drive eject request button is depressed.
Table 5-9 Disk Eject jumper Position vs. Function
Jumper/Header (HDR500) Extraction Type Description
None Slave In this configuration, the host blade must grant
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the RTM explicit permission for drive removal. This permission is conducted using custom commands exchanged between the MMC on the RTM and the Host.
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Table 5-9 Disk Eject jumper Position vs. Function
Jumper/Header (HDR500) Extraction Type Description
2-3 Standalone In this configuration, 30 seconds after pressing
the extract button, the RTM drive will grant extraction without notifying the host.

5.5.1 Typical Module Insertion, All Modes

1. A drive begins in state 0x01. This is equivalent to having the module in hand and not installed in the RTM. The status LED is off. Drive power is off.
2. Upon inserting the drive into an empty slot on the RTM, the state transitions to "0x02". The status LED will turn amber. Drive power is still off in this state.
3. After a one second fixed timeout, the drive transitions to state “0x04”, active state. The status LED will turn green. Drive power is active.
4. State "0x04" is the normal operation state. This state is the end of the insertion process.

5.5.2 Typical Module Slave Extraction Mode (Normal)

1. A drive begins in the active state 0x04. The status LED is green and drive power is ON.
2. When a push button is depressed or during a software shutdown request, the drive transitions to state "0x08" Deactivation Request. The status LED will blink amber. Drive power is on. A 30 second timer is started and a sensor is set for front ATCA blade to poll over the IPMI-L bus. If the request is ignored and the ten second timer expires, the drive returns to the active state 0x04.
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IPMI Functions List
3. Assuming the front blade approves the request, the RTM will receive a deactivation approval command and the drive will transition to state 0x10, "inactive". The LED is amber. Drive power is off. The drive is ready for extraction.
4. The operator physically removes the drive from the RTM. The drive transitions to state "0x01", not installed. The status LED is off. Drive power is off.
Figure 5-2 Disk FRU State Diagram, Slave Mode (Normal)
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5.5.3 Typical Module Extraction, Standalone Mode

1. A drive begins in the active state "0x04". The status LED is green and drive power is on.
2. When push button is depressed or during a software shutdown request, the drive transitions to state "0x08" Deactivation Request. The status LED will blink amber. Drive power is on. A ten second timer is started.
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3. After the 30 second timer expires, the drive automatically transitions to state "0x10", Inactive. The LED is amber. Drive power is off. The drive is ready for extraction. Note that once the timer is started, the drive will always transition to state "0x10".
4. The operator physically removes the drive from the RTM. The drive transitions to state "0x01", not installed. The status LED is off. Drive power is off.
Figure 5-3 Disk FRU State Diagram, Stand-alone Mode
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State Mask Returns Drive state, see State Machine
Table 5-10 MMC Sensor Description for Disk FRU State
Feature Raw Value Description
Sensor Name Drive X State X= 1 or 2
Sensor LUN 0x00
Sensor Number 0x09 or 0x0A 1 for each drive
Entity ID 0xC0 RTM
Sensor Type 0xC9 OEM Reserved
Event/Reading Type 0x6F Sensor-Specific
Assertion Event Mask 0x001F
Deassertion Event Mask 0x0000
Threshold/Discrete Mask 0x001F
Base Unit 0x00 Unspecified
Rearm mode 0x01 Auto Rearm
Hysteresis Support 0x00 No Hysteresis
Threshold Access Support 0x00 No Threshold
Event Message Control 0x01 Entire
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MMC Firmware Upgrade Procedure

6.1 Overview

This chapter provides instructions for upgrading the MMC (Module Management Controller) firmware on the RTM. The primary update mechanism utilizes the FCU (Firmware Upgrade Command-line Utility) which is delivered with the BBS package for the host ATCA-736X board family. Please consult the Programmer's Reference document for operation and use of the FCU.
Users may also upgrade the MMC firmware using the Pigeon Point System modified Ipmitool described below.

6.2 The ipmitool Utility

An upgrade for the RTM-ATCA-736X-DD firmware can be performed remotely using a LAN connection to the shelf manager. Firmware upgrades are accomplished with ipmitool, a utility for managing IPMI-enabled devices. The utility is an open source derivative which is modified by the shelf management supplier.
Chapter 6
The RTM-ATCA-736X-DD keeps a redundant copy of the firmware in the flash. Upgrades are reliable and reversible. A failure in the download (error or interruption) does not affect the IPMC's ability to continue using the "old" firmware or its ability to restart the download process. The IPMC automatically restores the previous firmware if there is a problem running a new code for the first time.

6.2.1 Synopsis

The minimum information to complete a firmware upgrade is documented here.
$ ipmitool [-I|-H|-T|-B|-t|-b] hpm upgrade <firmware_file>
$ ipmitool [-I|-H|-T|-B|-t|-b] hpm activate

6.2.2 Description

ipmitool lets you manage Intelligent Platform Management Interface (IPMI) functions of either a local or remote system using IPMI v1.5 and IPMI v2.0. Capabilities include printing FRU information, LAN configuration, sensor readings, and remote chassis power control.
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6.2.3 Options

Table 6-1 Ipmitool Options Relevant To Firmware Upgrades
Option Description
-I <interface> Selects IPMI interface to use. Supported interfaces that are compiled are visible in the usage help output. Use LAN to designate Ethernet.
-H <address> Remote server address can be IP address or hostname. This option is required for LAN interfaces.
-T <address> If updating an AMC, this is used to specify the address and Bus ID of the
-B <bus id>
-t <address> IPMB-L address of the target MMC or Carrier.
-b <bus id> Bus ID of the target MMC or Carrier (use "0" for carrier, "7" for AMC/RTM)
carrier that holds the AMC. These entries are not needed when updating the carrier alone.

6.2.4 Command Syntax Examples

EXAMPLE 1. The following example shows the command sequence for firmware upgrade of an AMC installed on a carrier:
$ ipmitool -I lan -H 192.168.0.2 -T 0x82 -B 0 -t 0x74 -b 7 hpm upgrade hpm1fw.img $ ipmitool -I lan -H 192.168.0.2 -T 0x82 -B 0 -t 0x74 -b 7 hpm activate
Line 1 puts the new firmware in the flash device, where hpm1fw.img is the image
Line 2 is used to dynamically load and activate the new firmware.
EXAMPLE 2. The following example shows the command performing firmware upgrade on the carrier itself:
$ ipmitool -I lan -H 192.168.0.2 -t 0x82 -b 0 hpm upgrade hpm1fw.img $ ipmitool -I lan -H 192.168.0.2 -t 0x82 -b 0 hpm activate
Line 1 puts the new firmware in the flash device, where hpm1fw.img is the image.
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Line 2 is used to dynamically activate the new firmware.
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