– IDD=1.3mA at VDD=5V ,BTL mode
– IDD=0.9mA at VDD=3.3V ,BTL mode
•Low Shutdown Current
– IDD=0.1µA
•Low Distortion
– 630mW, at VDD=5V, BTL, RL=8Ω
THD +N=0.15%
– 280mW, at VDD=3.3V, BTL, RL=8Ω
THD +N=0.15%
•Output Pow er
at 1% TH D+N
– 900mW, at VDD=5V, BTL, RL=8Ω
– 400mW, at VDD=3.3V, BTL, RL=8Ω
at 10% THD+N
–1.1W at VDD=5V, BTL, RL=8Ω
–480mW at VDD=3.3V, BTL, RL=8Ω
The APA0710 is a bridged-tied load (BTL) or singledended (SE) aud io power amplifier developed especially
for low-voltage applications where internal speakers
and external earphone operation are required. The
APA0 711 is a only BTL audio power amplifier developed
especially for low-voltage applications where internal
spea kers are required. Operating with a 5V supply,
the APA0710/1 can deliver 1.1W of continuous power
into a BTL 8Ω load at 10% THD+N througho ut voice
band frequencies. Altho ugh this device is characterized
out to 20kHz,its operatio n is optimized for narrow band
a pplications such as wireless communications. The
BTL conf iguration eliminates the need for external
coup ling capacitors on the output in most applications,
which is particularly important for small battery-powered
equip ment. A unique feature of the APA0710 is that it
allows the a mplifier to switch from BTL to SE on the
fly when an earphone drive is required. This eliminates
complica ted mechanical switching or auxiliary devices
just to drive the external load. This de vice features a
shutd own mode for power-sensitive applications with
sp ecial depop circuitry to eliminate speaker noise when
exiting shutdow n mode. The APA0710/1 are available
in an 8-pin SOP and 8-pin MSOP-P with enhanced
thermal pad.
•Depop Circuitry Integrated
•Thermal Shutdown Protection and
Over Current Protection Circuitry
•High supply voltage ripple rejection
•Surface-Moun t Packaging
– 8 pin MSOP-P (with e nhanced thermal pad)
pow er package available
– SOP-8 package
Applications
•Mobil Phones
•PDAs
• Digital Camera
•Porta ble Electronic Devices
•Lead Free Available (RoHS Compliant)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
(con nected to GND plane for better heat dissipation)
Ordering and Marking Information
APA0710/1
Lead Free Code
Handling Code
Temp. Range
Package Code
APA0710/1 K :
APA0710/1 XA :
APA0710/1
XXXXX
A0710/1
XXX
XX
Note: AN PEC lead-free products contain molding compo unds/die attach ma terials and 100% matte tin plate
termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering
op erations. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C
fo r MSL classification at lead-free peak reflow temperature.
Thermal Resistance from Junction to Ambient in Free Air
THJA
MSOP-8-P*
SOP-8
* 3.42 in2 printed c ircuit board with 20z trace and copper through 6 vias of 12mil diameter vias.
Th e thermal pad on the MSOP-8-P package with solder on the printed circuit board.