FEATURES
16-Bit Monotonicity over Temperature
ⴞ2 LSBs Integral Linearity Error
Microprocessor Compatible with Readback Capability
Unipolar or Bipolar Output
Multiplying Capability
Low Power (100 mW Typical)
GENERAL DESCRIPTION
The AD7846 is a 16-bit DAC constructed with Analog Devices’
2
MOS process. It has V
LC
an on-chip output amplifier. These can be configured to give a
unipolar output range (0 V to +5 V, 0 V to +10 V) or bipolar
output ranges (±5 V, ±10 V).
The DAC uses a segmented architecture. The 4 MSBs in the
DAC latch select one of the segments in a 16-resistor string.
Both taps of the segment are buffered by amplifiers and fed to a
12-bit DAC, which provides a further 12 bits of resolution. This
architecture ensures 16-bit monotonicity. Excellent integral
linearity results from tight matching between the input offset
voltages of the two buffer amplifiers.
In addition to the excellent accuracy specifications, the AD7846
also offers a comprehensive microprocessor interface. There are
16 data I/O pins, plus control lines (CS, R/W, LDAC and CLR).
R/W and CS allow writing to and reading from the I/O latch.
This is the readback function which is useful in ATE applications. LDAC allows simultaneous updating of DACs in a multiDAC system and the CLR line will reset the contents of the
DAC latch to 00 . . . 000 or 10 . . . 000 depending on the state
of R/W. This means that the DAC output can be reset to 0 V in
both the unipolar and bipolar configurations.
The AD7846 is available in 28-lead plastic, ceramic, and PLCC
packages.
REF+
and V
reference inputs and
REF–
16-Bit Voltage Output DAC
AD7846
FUNCTIONAL BLOCK DIAGRAM
V
V
V
V
REF +
REF –
R
R
R
16
SEGMENT
SWITCH
MATRIX
4
A2
A1
V
SS
AD7846
12-BIT DAC
12
DAC LATCH
12
I/O LATCH
DB15 DB0
PRODUCT HIGHLIGHTS
1. 16-Bit Monotonicity
The guaranteed 16-bit monotonicity over temperature makes
the AD7846 ideal for closed-loop applications.
2. Readback
The ability to read back the DAC register contents minimizes
software routines when the AD7846 is used in ATE systems.
3. Power Dissipation
Power dissipation of 100 mW makes the AD7846 the lowest
power, high accuracy DAC on the market.
DD
CC
R
R
A3
CONTROL
LOGIC
DGND
R
IN
V
OUT
CS
R/ W
LDAC
CLR
REV. E
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
±12±8LSB max
±1±1ppm FSR/°Ctyp
±1±1ppm FSR/°Ctyp
±1±1ppm FSR/°Ctyp
REFERENCE INPUT
Input Resistance2020kΩ minResistance from V
4040kΩ maxTypically 30 kΩ
V
RangeVSS + 6 toVSS + 6 toVolts
REF+
V
RangeVSS + 6 toVSS + 6 toVolts
REF–
VDD – 6VDD – 6
VDD – 6VDD – 6
REF+
to V
REF –
OUTPUT CHARACTERISTICS
Output Voltage SwingVSS + 4 toVSS + 4 toV max
VDD – 3VDD – 3
Resistive Load22kΩ minTo 0 V
Capacitive Load10001000pF maxTo 0 V
Output Resistance0.30.3Ω typ
Short Circuit Current±25±25mA typTo 0 V or Any Power Supply
DIGITAL INPUTS
VIH (Input High Voltage)2.42.4V min
VIL (Input Low Voltage)0.80.8V max
IIN (Input Current)±10± 10µA max
CIN (Input Capacitance)
2
1010pF max
DIGITAL OUTPUTS
VOL (Output Low Voltage)0.40.4Volts maxI
VOH (Output High Voltage)4.04.0Volts minI
Floating State Leakage Current±10±10µA maxDB0–DB15 = 0 to V
Floating State Output Capacitance21010pF max
POWER REQUIREMENTS
V
DD
V
SS
V
CC
I
DD
I
SS
I
CC
Power Supply Sensitivity
3
+11.4/+15.75+11.4/+15.75V min/V max
–11.4/–15.75–11.4/–15.75V min/V max
+4.75/+5.25+4.75/+5.25V min/V max
55mA maxV
55mA maxV
4
11mA max
1.51.5LSB/V max
Power Dissipation100100mW typV
NOTES
1
Temperature ranges as follows: J, K Versions: 0°C to +70°C; A, B Versions: –40°C to +85°C
2
Guaranteed by design and characterization, not production tested.
3
The AD7846 is functional with power supplies of ± 12 V. See Typical Performance Curves.
4
Sensitivity of Gain Error, Offset Error and Bipolar Zero Error to VDD, VSS variations.
= 1.6 mA
SINK
SOURCE
Unloaded
OUT
Unloaded
OUT
Unloaded
OUT
= 400 µA
CC
Specifications subject to change without notice.
–2–
REV. E
AD7846
These characteristics are included for design guidance and are not
subject to test. (V
AC PERFORMANCE CHARACTERISTICS
to –15.75 V; VCC= +4.75 V to +5.25 V; RINconnected to 0 V.)
Impulse70nV-secs typDAC alternately loaded with 10 . . . 0000 and
01 . . . 1111. V
AC Feedthrough0.5mV pk-pk typV
REF–
DAC loaded with all 0s.
Digital Feedthrough10nV-secs typDAC alternately loaded with all 1s and all 0s. CS High.
Output Noise Voltage
Density 1 kHz–100 kHz50nV/√Hz typMeasured at V
V
REF+
NOTES
1
LDAC = 0. Settling time does not include deglitching time of 2.5 µs (typ).
Specifications subject to change without notice.
(V
TIMING CHARACTERISTICS
ParameterLimit at T
t
1
t
2
t
3
t
4
t
5
t
6
t
7
0ns minR/W to CS Setup Time
60ns minCS Pulsewidth (Write Cycle)
0ns minR/W to CS Hold Time
60ns minData Setup Time
0ns minData Hold Time
120ns maxData Access Time
10ns minBus Relinquish Time
MIN
to T
= +14.25 V to +15.75 V; V
DD
(All Versions)UnitTest Conditions/Comments
MAX
= –14.25 V to –15.75 V; VCC = +4.75 V to +5.25 V)
SS
60ns max
t
8
t
9
t
10
t
11
t
12
NOTES
1
Timing specifications are sample tested at +25°C to ensure compliance. All input control signals are specified with tR = tF = 5 ns (10% to 90% of +5 V) and timed
from a voltage level of 1.6 V.
2
t6 is measured with the load circuits of Figure 1 and defined as the time required for an output to cross 0.8 V or 2.4 V.
3
t7 is defined as the time required for an output to change 0.5 V when loaded with the circuits of Figure 2.
Specifications subject to change without notice.
DBN
3k⍀
a. High Z to V
Figure 1. Load Circuits for Access Time (t6)
DBN
a. V
3k⍀
to High Z
OH
0ns minCLR Setup Time
70ns minCLR Pulsewidth
0ns minCLR Hold Time
70ns minLDAC Pulsewidth
130ns minCS Pulsewidth (Read Cycle)
5V
3k⍀
100pF
DGND
5V
3k⍀
10pF
DGND
to High Z
OL
R/ W
OL
CS
DATA
CLR
LDAC
DGND
DGND
OH
100pF
DBN
b. High Z to V
DBN
10pF
b. V
= +5 V; VDD= +14.25 V to +15.75 V; VSS= –14.25 V
REF+
= 0 V, V
= V
REF–
t
1
t
8
loaded. V
OUT
loaded. V
OUT
unloaded.
OUT
= 1 V rms, 10 kHz sine wave.
REF+
. DAC loaded with 0111011 . . . 11.
OUT
= 0 V.
t
3
t
2
t
4
t
9
t
5
t
10
= 0 V. Typically 3.5 µs.
REF–
= –5 V. Typically 6.5 µs.
REF–
t
1
t
12
t
6
DATA VALIDDATA VALID
t
t
t
9
8
9
Figure 3. Timing DiagramFigure 2. Load Circuits for Bus Relinquish Time (t7)
t
3
t
7
t
10
t
11
5V
0V
5V
0V
5V
0V
5V
0V
5V
0V
REV. E
–3–
AD7846
ABSOLUTE MAXIMUM RATINGS
1
VDD to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.4 V to +17 V
V
to DGND . . . . . . . . . . . . . . . –0.4 V, VDD + 0.4 V or +7 V
CC
(Whichever Is Lower)
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . +0.4 V to –17 V
to DGND2 . . . . . . . . VDD + 0.4 V, VSS – 0.4 V or ±10 V
OUT
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one Absolute
Maximum Rating may be applied at any one time.
2
V
may be shorted to DGND, VDD, VSS, VCC provided that the power dissipation
AD7846JN0°C to +70°C±16 LSBPlastic DIPN-28A
AD7846KN0°C to +70°C±8 LSBPlastic DIPN-28A
AD7846JP0°C to +70°C±16 LSBPlastic Leaded Chip Carrier (PLCC)P-28A
AD7846KP0°C to +70°C±8 LSBPlastic Leaded Chip Carrier (PLCC)P-28A
AD7846AP–40°C to +85°C± 16 LSBPlastic Leaded Chip Carrier (PLCC)P-28A
AD7846AQ–40°C to +85°C±16 LSBCeramic DIPQ-28
AD7846BP–40°C to +85°C±8 LSBPlastic Leaded Chip Carrier (PLCC)P-28A
CAUTION
ESD (electrostatic discharge) sensitive device. The digital control inputs are diode protected;
however, permanent damage may occur on unconnected devices subject to high energy electrostatic fields. Unused devices must be stored in conductive foam or shunts. The protective foam
should be discharged to the destination socket before devices are removed.
TERMINOLOGY
LEAST SIGNIFICANT BIT
This is the analog weighting of 1 bit of the digital word in a DAC.
For the AD7846, 1 LSB = (V
REF+–VREF–
)/216.
Relative Accuracy
Relative accuracy or endpoint nonlinearity is a measure of the
maximum deviation from a straight line passing through the endpoints of the DAC transfer function. It is measured after adjusting for both endpoints (i.e., offset and gain errors are adjusted
out) and is normally expressed in least significant bits or as a
percentage of full-scale range.
Differential Nonlinearity
Differential nonlinearity is the difference between the measured
change and the ideal change between any two adjacent codes. A
specified differential nonlinearity of ±1 LSB over the operating
temperature range ensures monotonicity.
Gain Error
Gain error is a measure of the output error between an ideal
DAC and the actual device output with all 1s loaded after offset
error has been adjusted out. Gain error is adjustable to zero
with an external potentiometer.
Offset Error
This is the error present at the device output with all 0s loaded
in the DAC. It is due to op amp input offset voltage and bias
current and the DAC leakage current.
Bipolar Zero Error
When the AD7846 is connected for bipolar output and 10 . . . 000
is loaded to the DAC, the deviation of the analog output from the
ideal midscale of 0 V is called the bipolar zero error.
Digital-to-Analog Glitch Impulse
This is the amount of charge injected from the digital inputs to
the analog output when the inputs change state. This is normally
specified as the area of the glitch in either pA-secs or nV-secs
depending upon whether the glitch is measured as a current or a
voltage.
Multiplying Feedthrough Error
This is an ac error due to capacitive feedthrough from either of
the V
terminals to V
REF
when the DAC is loaded with all 0s.
OUT
Digital Feedthrough
When the DAC is not selected (i.e., CS is held high), high frequency logic activity on the digital inputs is capacitively coupled
through the device to show up as noise on the V
noise is digital feedthrough.
–4–
WARNING!
ESD SENSITIVE DEVICE
pin. This
OUT
REV. E
AD7846
PIN CONFIGURATIONS
DIP
DB2
1
DB1
2
DB0
3
V
4
DD
V
5
OUT
R
6
IN
SS
AD7846
7
TOP VIEW
(Not to Scale)
8
9
10
11
12
13
14
V
REF+
V
REF–
DB15
DB14
DB13
DB12
DB11
V
PLCC
DD
V
DB0
DB1
DB2
V
V
REF+
V
REF–
DB15
DB14
4 3 2 1 28 27 26
5
OUT
6
R
IN
7
8
9
V
SS
10
11
12 13 14 15 16 17 18
DB13
DB12
PIN 1
IDENTIFIER
AD7846
TOP VIEW
(Not to Scale)
DB11
DB10
DB3
DB9
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DB4
DB8
DB3
DB4
DB5
LDAC
CLR
CS
R/W
V
CC
DGND
DB6
DB7
DB8
DB9
DB10
DB5
DB7
25
24
23
22
21
20
19
LDAC
CLR
CS
R/W
V
CC
DGND
DB6
PIN FUNCTION DESCRIPTION
PinMnemonicDescription
1–3DB2–DB0Data I/O pins. DB0 is LSB.
4V
DD
Positive supply for analog circuitry. This is
+15 V nominal.
5V
6R
OUT
IN
DAC output voltage pin.
Input to summing resistor of DAC output
amplifier. This is used to select output
voltage ranges. See Table I.
7V
REF+
V
Input. The DAC is specified for V
REF+
REF+
= +5 V.
8V
REF–
V
Input. For unipolar operation con-
REF–
nect V
to 0 V and for bipolar operation
REF–
connect it to –5 V. The device is specified
for both conditions.
9V
SS
Negative supply for the analog circuitry.
This is –15 V nominal.
10–19 DB15–DB6Data I/O pins. DB15 is MSB.
20DGNDGround pin for digital circuitry.
21V
CC
Positive supply for digital circuitry. This is
+5 V nominal.
22R/WR/W input. This can be used to load data to
the DAC or to read back the DAC latch
contents.
23CSChip select input. This selects the device.
24CLRClear input. The DAC can be cleared to
000 . . . 000 or 100 . . . 000. See Table II.
25LDACAsynchronous load input to DAC.
26–28 DB5–DB3Data I/O pins.
Table I. Output Voltage Ranges
Output RangeV
REF+
0 V to +5 V+5 V0 VV
V
REF–
R
IN
OUT
0 V to +10 V+5 V0 V0 V
+5 V to –5 V+5 V–5 VV
OUT
+5 V to –5 V+5 V0 V+5 V
+10 V to –10 V+5 V–5 V0 V
REV. E
–5–
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