120 mA current sink
Available in 8-lead LFCSP package
2-wire (I
10-bit resolution
Integrated current sense resistor
2.7 V to 5.5 V power supply
Guaranteed monotonic over all codes
Power-down to 0.5 µA typical
Internal reference
Ultralow noise preamplifier
Power-down function
Power-on reset
CONSUMER/COMMUNICATIONS APPLICATIONS
Lens autofocus
Image stabilization
Optical zoom
Shutters
Iris/exposure
Neutral density filter NDFs
Lens covers
Camera phones
Digital still cameras
Camera modules
Digital video cameras (DVCs)/camcorders
Camera-enabled devices
Security cameras
Web/PC cameras
INDUSTRIAL APPLICATIONS
Heater control
Fan control
Cooler (Peltier) control
Solenoid control
Valve control
Linear actuator control
Light control
Current loop control
2
C®-compatible) serial interface
AD5398
FUNCTIONAL BLOCK DIAGRAM
V
DD
6
REFERENCE
10-BIT
CURRENT
OUTPUT DAC
2
DGND
Figure 1.
SDA
SCL
PD
3
4
1
AD5398
I2C SERIAL
INTERFACE
5
DGND
GENERAL DESCRIPTION
The AD5398 is a single 10-bit DAC with 120 mA output
current sink capability. It features an internal reference, and
operates from a single 2.7 V to 5.5 V supply. The DAC is
controlled via a 2-wire (I
operates at clock rates up to 400 kHz.
The AD5398 incorporates a power-on reset circuit, which
ensures that the DAC output powers up to 0 V and remains
there until a valid write takes place. It has a power-down
feature that reduces the current consumption of the device to
1 µA max.
The AD5398 is designed for autofocus, image stabilization,
and optical zoom applications in camera phones, digital still
cameras, and camcorders.
The AD5398 also has many industrial applications, such as
controlling temperature, light, and movement, over the range
−40°C to +85°C without derating.
2
C address range for the AD5398 is 0x18 to 0x1F
The I
inclusive.
2
C-compatible) serial interface that
POWER-ON
RESET
8
R
R
SENSE
3.3Ω
7
AGND
I
SINK
05034-001
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
5
registered trademarks are the property of their respective owners.
VDD = 2.7 V to 5.5 V, AGND = DGND = 0 V, load resistance RL = 25 Ω connected to VDD; all specifications T
unless otherwise noted.
Table 1.
B Version
1
Parameter Min Typ Max Unit Test Conditions/Comments
DC PERFORMANCE
= 3.6 V to 4.5 V. Device operates over 2.7 V to 5.5 V
V
DD
with reduced performance.
Resolution 10 Bits 117 µA/LSB
Relative Accuracy
Differential Nonlinearity
Zero Code Error
Offset Error @ Code 16
Gain Error
Offset Error Drift
Gain Error Drift
2
2, 4
2
4, 5
2, 5
±1.5 ±4 LSB
2, 3
±1 LSB Guaranteed monotonic over all codes.
0 1 5 mA All 0s loaded to DAC.
2
0.5 mA
±0.6 % of FSR @ 25°C
10 µA/ºC
±0.2 ±0.5 LSB/ºC
OUTPUT CHARACTERISTICS
Minimum Sink Current
Maximum Sink Current 120 mA
4
3 mA
= 3.6 V to 4.5 V. Device operates over 2.7 V to 5.5 V, but
V
DD
specified maximum sink current might not be achieved.
Output Current During PD 80 nA PD = 1.
Output Compliance
5
0.6 V
DD
V
Output voltage range over which max sink current is
available.
Power-Up Time 20 µs To 10% of FS, coming out of power-down mode. VDD = 5 V.
LOGIC INPUTS (PD)
5
Input Current ±1 µA
Input Low Voltage, V
Input High Voltage, V
INL
INH
0.8 V VDD = 2.7 V to 5.5 V
0.7 V
V V
DD
= 2.7 V to 5.5 V
DD
Pin Capacitance 3 pF
HYST
5
INL
INH
IN
−0.3 0.3 V
0.7 V
DD
VDD + 0.3
±1 µA V
V
DD
V
= 0 V to V
IN
DD
0.05 VDD V
LOGIC INPUTS (SCL, SDA)
Input Low Voltage, V
Input High Voltage, V
Input Leakage Current I
Input Hysteresis, V
Digital Input Capacitance, CIN 6 pF
Glitch Rejection
6
50 ns Pulse width of spike suppressed.
POWER REQUIREMENTS
V
DD
2.7 5.5 V
IDD (Normal Mode) IDD specification is valid for all DAC codes.
VDD = 2.7 V to 5.5 V
V
= 2.7 V to 4.5 V
DD
2.5
2.3
4
3
mA
mA
= VDD, and VIL = GND, VDD = 5.5 V
V
IH
V
= VDD, and VIL = GND, VDD = 4.5 V
IH
IDD (Power-Down Mode) 0.5 1 µA VIH = VDD, and VIL = GND
1
Temperature range is as follows: B Version: –40°C to +85°C.
2
See the Terminology section.
3
Linearity is tested using a reduced code range: Codes 32 to 1023.
4
To achieve near zero output current, use the power-down feature.
5
Guaranteed by design and characterization; not production tested.
6
Input filtering on both the SCL and SDA inputs suppresses noise spikes that are less than 50 ns.
MIN
to T
MAX
,
Rev. 0 | Page 3 of 16
AD5398
AC CHARACTERISTICS
VDD = 2.7 V to 5.5 V, AGND = DGND = 0 V, load resistance RL = 25 Ω connected to VDD, unless otherwise noted.
Table 2.
B Version
1, 2
Parameter Min Typ Max Unit Test Conditions/Comments
Output Current Settling Time 250 µs
= 5 V, RL = 25 Ω, LL = 680 µH
V
DD
¼ scale to ¾ scale change (0x100 to 0x300)
Slew Rate 0.3 mA/µs
Major Code Change Glitch Impulse 0.15 nA-s 1 LSB change around major carry
Digital Feedthrough
3
0.06 nA-s
1
Temperature range is as follows: B Version: –40°C to +85°C.
2
Guaranteed by design and characterization; not production tested.
3
See the section. Terminology
TIMING CHARACTERISTICS
VDD = 2.7 V to 5.5 V. All specifications T
Table 3.
Parameter
f
SCL
t
1
t
2
t
3
t
4
t
5
2
t
6
Limit at T
1
(B Version) Unit Conditions/Comments
400 kHz max SCL clock frequency
2.5 µs min SCL cycle time
0.6 µs min t
1.3 µs min t
0.6 µs min t
100 ns min t
0.9 µs max t
MIN
, T
MAX
0 µs min
t
7
t
8
t
9
t
10
0.6 µs min t
0.6 µs min t
1.3 µs min t
300 ns max tR, rise time of both SCL and SDA when receiving
0 ns min May be CMOS driven
t
11
250 ns max tF, fall time of SDA when receiving
300 ns max tF, fall time of Both SCL and SDA when transmitting
20 + 0.1 C
C
b
400 pF max Capacitive load for each bus line
3
b
1
Guaranteed by design and characterization; not production tested.
2
A master device must provide a hold time of at least 300 ns for the SDA signal (referred to the VIH MIN of the SCL signal) in order to bridge the undefined region of SCL’s
falling edge.
3
C
is the total capacitance of one bus line in pF. t
b
MIN
to T
, unless otherwise noted.
MAX
, SCL high time
HIGH
, SCL low time
LOW
, start/repeated start condition hold time
HD,STA
, data setup time
SU,DAT
, data hold time
HD,DAT
, setup time for repeated start
SU,STA
, stop condition setup time
SU,STO
, bus free time between a stop condition and a start condition
BUF
ns min
and tF are measured between 0.3 VDD and 0.7 V
R
DD.
SDA
t
9
SCL
START
CONDITION
t
3
t
4
t
10
t
6
t
11
t
2
t
5
Figure 2. 2-Wire Serial Interface Timing Diagram
t
7
REPEATED
START
CONDITION
t
4
t
1
t
8
STOP
CONDITION
05034-002
Rev. 0 | Page 4 of 16
AD5398
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 4.
Parameter Rating
VDD to AGND –0.3 V to +7 V
VDD to DGND –0.3 V to VDD + 0.3 V
AGND to DGND –0.3 V to +0.3 V
SCL, SDA to DGND –0.3 V to VDD + 0.3 V
PD to DGND –0.3 V to VDD + 0.3 V
I
to AGND –0.3 V to VDD + 0.3 V
SINK
Operating Temperature Range
Industrial (B Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Junction Temperature (TJ max) 150°C
LFCSP Power Dissipation (TJ max – TA)/θ
θJA Thermal Impedance
2
Mounted on 2-Layer Board 84°C/W
Mounted on 4-Layer Board 48°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) 215°C
Infrared (15 sec) 220°C
____________________
1
Transient currents of up to 100 mA do not cause SCR latch-up.
2
To achieve the optimum θJA, it is recommended that the AD5398 is soldered on a
4-layer board. The AD5398 comes in an 8-lead LFCSP package with an exposed
paddle that should be connected to the same potential as the AD5398 DGND pin.
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Only one absolute maximum rating may be
applied at any one time.
JA
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. 0 | Page 5 of 16
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