ANALOG DEVICES AD5370 Service Manual

40-Channel,16-Bit,
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FEATURES

40-channel DAC in a 64-lead LFCSP and a 64-lead LQFP Guaranteed monotonic to 16 bits Maximum output voltage span of 4 × V Nominal output voltage span of −4 V to +8 V Multiple, independent output spans available System calibration function allowing user-programmable
off
set and gain Channel grouping and addressing features Thermal shutdown function DSP/microcontroller-compatible serial interface SPI serial interface
DV
CCVDDVSS
STATE
16
8 8
16
16
16
16
16
16
16
16
8 8
16
16
16
16
16
16
16
16
16
A/B SELECT
REGISTER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGIS TER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGISTER
A/B SELECT
REGISTER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGIS TER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGISTER
SYNC
SDI
SCLK
SDO
BUSY
RESET
CLR
CONTROL REGISTER
SERIAL
INTERFACE
MACHINE
AD5370
(20 V)
REF
AGND DGND
MUX 1MUX 1MUX 1MUX 1

FUNCTIONAL BLOCK DIAGRAM

TO
MUX2
16
16
TO
MUX2
16
16
16
16
16
16
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
16
16
16
16
16
16
16
16
Serial Input, Voltage Output DAC
2.5 V to 5.5 V digital interface
X2A
X2B
X2A
X2B
X2A
X2B
X2A
X2B
Digital reset ( Clear function to user-defined SIGGNDx Simultaneous update of DAC outputs

APPLICATIONS

Level setting in automatic test equipment (ATE) Variable optical attenuators (VOA) Optical switches Industrial control systems Instrumentation
LDAC
1616
OFS0
REGISTER
MUX 2
MUX 2
MUX 2
MUX 2
16
16
16
16
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
16
DAC 0
16
DAC 7
1616
OFS1
16
DAC 0
16
DAC 7
GROUP 2 TO GROUP 4
ARE THE SAME AS GROUP 1
RESET
OFFSET
DAC 0
DAC 0
DAC 7
OFFSET
DAC 1
DAC 0
DAC 7
)
BUFFER
BUFFER
BUFFER
BUFFER
GROUP 0
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
GROUP 1
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
AD5370
VREF0
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
VOUT6
VOUT7
SIGGND0
VREF1
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
SIGGND1
VOUT16 TO VOUT39
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2008 Analog Devices, Inc. All rights reserved.
SIGGND4SIGGND3SIGGND2
05813-001
AD5370
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TABLE OF CONTENTS

Features.............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram ..............................................................1
Revision History ...............................................................................2
General Description......................................................................... 3
Specifications..................................................................................... 4
Performance Specifications......................................................... 4
AC Characteristics........................................................................ 5
Timing Characteristics ................................................................ 6
Timing Diagrams.......................................................................... 6
Absolute Maximum Ratings............................................................ 9
ESD Caution.................................................................................. 9
Pin Configurations and Function Descriptions......................... 10
Typical Performance Characteristics........................................... 12
Terminology.................................................................................... 14
Theory of Operation ......................................................................15
DAC Architecture....................................................................... 15
Channel Groups.......................................................................... 15
A
/B Registers and Gain/Offset Adjustment............................ 16
Load DAC.................................................................................... 16
Offset DAC Channels ................................................................16
Output Amplifier........................................................................ 17
Transfer Function....................................................................... 17
Reference Selection .................................................................... 17
Calibration................................................................................... 18
Additional Calibration............................................................... 18
Reset Function............................................................................ 19
Clear Function............................................................................ 19
and
LDAC
Functions...................................................... 19
BUSY
Power-Down Mode.................................................................... 19
Thermal Shutdown Function ...................................................19
Toggle Mode................................................................................ 20
Serial Interface ................................................................................ 21
SPI Write Mode .......................................................................... 21
SPI Readback Mode................................................................... 21
Register Update Rates................................................................ 21
Channel Addressing and Special Modes................................. 21
Special Function Mode.............................................................. 23
Power Supply Decoupling......................................................... 25
Power Supply Sequencing .........................................................25
Interfacing Examples ................................................................. 26
Outline Dimensions....................................................................... 27
Ordering Guide .......................................................................... 27

REVISION HISTORY

4/08—Revision 0: Initial Version
Rev. 0 | Page 2 of 28
AD5370
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GENERAL DESCRIPTION

The AD53701 contains forty 16-bit DACs in a single 64-lead LFCSP and a 64-lead LQFP. The device provides buffered voltage outputs with a span that is 4× the reference voltage. The gain and offset of each DAC channel can be independently trimmed to remove errors. For even greater flexibility, the device is divided into five groups of eight DACs. Three offset DAC channels allow the output range of blocks to be adjusted. Group 0 can be adjusted by Offset DAC 0, Group 1 can be adjusted by Offset DAC 1, and Group 2 to Group 4 can be adjusted by Offset DAC 2.
The AD5370 offers guaranteed operation over a wide supply
nge, with V
ra
from −16.5 V to −4.5 V and VDD from +9 V to
SS
+16.5 V. The output amplifier headroom requirement is 1.4 V operating with a load current of 1 mA.
1
Protected by U.S. Patent No. 5,969,657; other patents pending.
Table 1. High Channel Count Bipolar DACs
Model Resolution Nominal Output Span Output Channels Linearity Error (LSB)
AD5360 16 bits 4 × V AD5361 14 bits 4 × V AD5362 16 bits 4 × V AD5363 14 bits 4 × V
AD5370 16 bits 4 × V
AD5371 14 bits 4 × V AD5372 16 bits 4 × V AD5373 14 bits 4 × V AD5378 14 bits ±8.75 V 32 ±3 AD5379 14 bits ±8.75 V 40 ±3
(20 V) 16 ±4
REF
(20 V) 16 ±1
REF
(20 V) 8 ±4
REF
(20 V) 8 ±1
REF
(12 V) 40 ±4
REF
(12 V) 40 ±1
REF
(12 V) 32 ±4
REF
(12 V) 32 ±1
REF
The AD5370 has a high speed serial interface that is compatible with SPI, QSPI™, MICROWIRE™, and DSP interface standards and can handle clock speeds of up to 50 MHz.
The DAC registers are updated on receipt of new data. All the o
utputs can be updated simultaneously by taking the
LDAC input low. Each channel has a programmable gain and an offset adjust register to allow removal of gain and offset errors.
Each DAC output is gained and buffered on chip with respect to
n external SIGGNDx input. The DAC outputs can also be
a switched to SIGGNDx via the
CLR
pin.
Rev. 0 | Page 3 of 28
AD5370
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SPECIFICATIONS

PERFORMANCE SPECIFICATIONS

DVCC = 2.5 V to 5.5 V; VDD = 9 V to 16.5 V; VSS = −16.5 V to −8 V; V R
= open circuit; gain (M), offset (C), and DAC offset registers at default values; all specifications T
L
= 3 V; AGND = DGND = SIGGND = 0 V; CL = open circuit;
REF
MIN
to T
, unless otherwise noted.
MAX
Table 2.
Parameter Min Type Max Unit Test Conditions/Comments
ACCURACY
Resolution 16 Bits Integral Nonlinearity −4 +4 LSB Differential Nonlinearity −1 +1 LSB Guaranteed monotonic by design Zero-Scale Error −10 +10 mV Before calibration Full-Scale Error −10 +10 mV Before calibration Gain Error 0.1 % FSR Zero-Scale Error Full-Scale Error Span Error of Offset DAC −35 +35 mV
VOUT Temperature Coefficient
(VOUT0 to VOUT39)
DC Crosstalk
REFERENCE INPUTS (VREF0, VREF1)
VREF Input Current −10 +10 µA Per input, typically ±30 nA VREF Range 2 5 V ±2% for specified operation
SIGGND INPUT (SIGGND0 to SIGGND4)2
DC Input Impedance 50 kΩ Typically 55 kΩ Input Range −0.5 +0.5 V SIGGND Gain 0.995 1.005
OUTPUT CHARACTERISTICS
Output Voltage Range VSS + 1.4 VDD − 1.4 V I Nominal Output Voltage Range −4 +8 V Short-Circuit Current 15 mA VOUTx to DVCC, VDD, or VSS Load Current −1 +1 mA Capacitive Load 2200 pF DC Output Impedance 0.5
DIGITAL INPUTS
Input High Voltage 1.7 V DVCC = 2.5 V to 3.6 V
2.0 V DVCC = 3.6 V to 5.5 V Input Low Voltage 0.8 V DVCC = 2.5 V to 5.5 V Input Current −1 +1 µA
CLR High Impedance Leakage
Current
Input Capacitance
DIGITAL OUTPUTS (SDO, BUSY)
Output Low Voltage 0.5 V Sinking 200 A Output High Voltage (SDO) DVCC − 0.5 V Sourcing 200 A SDO High Impedance Leakage
Current
High Impedance Output
Capacitance
2
2
2
2
2
2
1 LSB After calibration 1 LSB After calibration
See the Offset DAC Channels section for
etails
d
5 ppm FSR/°C Includes linearity, offset, and gain drift
120 µV
2
−20 +20 µA
10 pF
−5 +5 µA
10 pF
Typically 20 µV; measured channel at midscale,
e change on any other channel
full-scal
= 1 mA
LOAD
Excluding the CLR
pin
1
Rev. 0 | Page 4 of 28
AD5370
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Parameter Min Type Max Unit Test Conditions/Comments
1
POWER REQUIREMENTS
DVCC 2.5 5.5 V VDD 9 16.5 V VSS −16.5 −4.5 V Power Supply Sensitivity
2
Full Scale/VDD −75 dB Full Scale/VSS −75 dB Full Scale/DVCC −90 dB
DICC 2 mA
= 5.5 V, VIH = DVCC, VIL = GND; normal
DV
CC
operating conditions IDD 18 mA Outputs unloaded, DAC outputs = 0 V 20 mA Outputs unloaded, DAC outputs = full scale ISS −18 mA Outputs unloaded, DAC outputs = 0 V
−20 mA Outputs unloaded, DAC outputs = full scale Power Dissipation Unloaded (P) 280 mW VSS = −8 V, VDD = +9.5 V, DVCC = 2.5 V Power-Down Mode Control register power-down bit set
DICC 5 µA IDD 35 µA ISS −35 µA
Junction Temperature
1
Temperature range for the AD5370 is −40°C to +85°C. Typical specifications are at 25°C.
2
Guaranteed by design and characterization, not production tested.
3
Where θJA represents the package thermal impedance.
3
130 °C TJ = TA + P
TOTAL
× θJA

AC CHARACTERISTICS

DVCC = 2.5 V; VDD = 15 V; VSS = −15 V; VREF0 = VREF1 = 3 V; AGND = DGND = SIGGND = 0 V; CL = 200 pF; RL = 10 kΩ; gain (M), offset (C), and DAC offset registers at default values; all specifications T
Table 3. AC Characteristics
1
Parameter Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time 20 µs Settling to 1 LSB from a full-scale change 30 µs DAC latch contents alternately loaded with all 0s and all 1s Slew Rate 1 V/µs Digital-to-Analog Glitch Energy 5 nV-s Glitch Impulse Peak Amplitude 10 mV Channel-to-Channel Isolation 100 dB VREF0 = VREF1 = 2 V p-p, 1 kHz DAC-to-DAC Crosstalk 20 nV-s Digital Crosstalk 0.2 nV-s Digital Feedthrough 0.02 nV-s Effect of input bus activity on DAC output under test Output Noise Spectral Density @ 10 kHz 250 nV/√Hz VREF0 = VREF1 = 0 V
1
Guaranteed by design and characterization, not production tested.
MIN
to T
, unless otherwise noted.
MAX
Rev. 0 | Page 5 of 28
AD5370
T
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TIMING CHARACTERISTICS

DVCC = 2.5 V to 5.5 V; VDD = 9 V to 16.5 V; VSS = −16.5 V to −4.5 V; V R
= open circuit; gain (M), offset (C), and DAC offset registers at default values; all specifications T
L
Table 4. SPI Interface
Parameter
t1
1, 2, 3
Limit at T
Min Typ Max
20 ns SCLK cycle time
MIN
, T
MAX
Unit Description
t2 8 ns SCLK high time t3 8 ns SCLK low time t4 11 ns
t
5
20 ns t6 10 ns t
7
5 ns Data setup time
SYNC Minimum SYNC 24
t8 5 ns Data hold time
4
t
42 ns
9
t
1.5 μs
10
SYNC
BUSY t11 600 ns Single-channel update cycle time t12 20 ns t13 10 ns t14 3 μs t15 0 ns t16 3 μs
SYNC
LDAC
BUSY
BUSY
LDAC t17 20 30 μs DAC output settling time t18 140 ns t19 30 ns t20 400 μs t21 270 ns
5
t
25 ns SCLK rising edge to SDO valid
22
t23 80 ns
1
Guaranteed by design and characterization, not production tested.
2
All input signals are specified with tR = tF = 2 ns (10% to 90% of DVCC) and timed from a voltage level of 1.2 V.
3
See Figure 4 and Figure 5.
4
This is measured with the load circuit shown in Figure 2.
5
This is measured with the load circuit shown in Figure 3.
CLR
RESET
RESET
Minimum SYNC
RESET
= 3 V; AGND = DGND = SIGGND = 0 V; CL = 200 pF to GND;
REF
falling edge to SCLK falling edge setup time
high time
th
SCLK falling edge to SYNC rising edge
rising edge to BUSY falling edge pulse width low (single-channel update); see Table 8
rising edge to LDAC falling edge pulse width low rising edge to DAC output response time rising edge to LDAC falling edge falling edge to DAC output response time
/RESET pulse activation time
pulse width low time indicated by BUSY low
high time in readback mode
rising edge to BUSY falling edge
MIN
to T
, unless otherwise noted.
MAX

TIMING DIAGRAMS

DV
CC
R
L
2.2k
TO
OUTPUT
PIN
Figure 2. Load Circuit for
C
L
50pF
BUSY
Timing Diagram
V
OL
05813-002
O OUTPUT
PIN
Figure 3. Load Circuit for SDO Timing Diagram
Rev. 0 | Page 6 of 28
50pF
C
200µA I
L
200µA I
OL
VOH (MIN) – VOL (MAX)
OH
2
5813-003
AD5370
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SCLK
SYNC
BUSY
LDAC
VOUTx
LDAC
VOUTx
SDI
1
1
2
2
1
2
t
t
4
t
5
t
7
t
8
DB23
t
1
24
3
t
2
t
6
DB0
t
9
t
1
t
11
t
10
12
t
13
24
t
17
t
14
t
15
t
13
t
17
t
16
CLR
VOUTx
RESET
VOUTx
BUSY
1
LDAC ACTIVE DURI NG BUSY.
2
LDAC ACTIVE AFTER BUSY.
t
18
t
19
t
18
t
20
t
23
05813-004
Figure 4. SPI Write Timing
Rev. 0 | Page 7 of 28
AD5370
SYNC
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SCLK
SDI
INPUT WORD SPECIFIES
REGIS TER TO BE READ
SDO
t
22
DB0 DB23DB23
LSB FROM PREVIOUS WRITE
Figure 5. SPI Read Timing
t
21
NOP CONDITIO N
DB0
DB23
SELECTED REG ISTER DAT A CLOCKED OUT
48
DB0
DB0
5813-005
Rev. 0 | Page 8 of 28
AD5370
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ABSOLUTE MAXIMUM RATINGS

TA = 25°C, unless otherwise noted. Transient currents of up to 60 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
VDD to AGND −0.3 V to +17 V VSS to AGND −17 V to +0.3 V DVCC to DGND −0.3 V to +7 V Digital Inputs to DGND −0.3 V to DVCC + 0.3 V Digital Outputs to DGND −0.3 V to DVCC + 0.3 V VREF0, VREF1 to AGND −0.3 V to +5.5 V VOUT0 through VOUT39 to AGND VSS − 0.3 V to VDD + 0.3 V SIGGND0 through SIGGND4 to AGND −1 V to +1 V AGND to DGND −0.3 V to +0.3 V Operating Temperature Range (TA)
Industrial (B Version) −40°C to +85°C Storage −65°C to +150°C
Operating Junction Temperature
max)
(T
J
θJA Thermal Impedance
64-Lead LFCSP 25°C/W 64-Lead LQFP 45.5°C/W
Reflow Soldering
Peak Temperature 230°C Time at Peak Temperature 10 sec to 40 sec
130°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

ESD CAUTION

Rev. 0 | Page 9 of 28
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