40-channel DAC in a 64-lead LFCSP and a 64-lead LQFP
Guaranteed monotonic to 16 bits
Maximum output voltage span of 4 × V
Nominal output voltage span of −4 V to +8 V
Multiple, independent output spans available
System calibration function allowing user-programmable
off
set and gain
Channel grouping and addressing features
Thermal shutdown function
DSP/microcontroller-compatible serial interface
SPI serial interface
DV
CCVDDVSS
STATE
16
88
16
16
16
16
16
16
16
16
88
16
16
16
16
16
16
16
16
16
A/B SELECT
REGISTER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGIS TER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGISTER
A/B SELECT
REGISTER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGIS TER
X1A
REGISTER
X1B
REGISTER
M REGISTER
C REGISTER
SYNC
SDI
SCLK
SDO
BUSY
RESET
CLR
CONTROL
REGISTER
SERIAL
INTERFACE
MACHINE
AD5370
(20 V)
REF
AGND DGND
MUX 1MUX 1MUX 1MUX 1
FUNCTIONAL BLOCK DIAGRAM
TO
MUX2
16
16
TO
MUX2
16
16
16
16
16
16
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
16
16
16
16
16
16
16
16
Serial Input, Voltage Output DAC
2.5 V to 5.5 V digital interface
X2A
X2B
X2A
X2B
X2A
X2B
X2A
X2B
Digital reset (
Clear function to user-defined SIGGNDx
Simultaneous update of DAC outputs
APPLICATIONS
Level setting in automatic test equipment (ATE)
Variable optical attenuators (VOA)
Optical switches
Industrial control systems
Instrumentation
LDAC
1616
OFS0
REGISTER
MUX 2
MUX 2
MUX 2
MUX 2
16
16
16
16
REGISTER
REGISTER
REGISTER
REGISTER
REGISTER
16
DAC 0
16
DAC 7
1616
OFS1
16
DAC 0
16
DAC 7
GROUP 2 TO GROUP 4
ARE THE SAME AS GROUP 1
RESET
OFFSET
DAC 0
DAC 0
DAC 7
OFFSET
DAC 1
DAC 0
DAC 7
)
BUFFER
BUFFER
BUFFER
BUFFER
GROUP 0
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
GROUP 1
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
OUTPUT BUFFER
AND
POWER-DOW N
CONTROL
AD5370
VREF0
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
VOUT6
VOUT7
SIGGND0
VREF1
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
SIGGND1
VOUT16
TO
VOUT39
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Anal og Devices for its use, nor for any infringements of patents or ot her
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
The AD53701 contains forty 16-bit DACs in a single 64-lead
LFCSP and a 64-lead LQFP. The device provides buffered
voltage outputs with a span that is 4× the reference voltage. The
gain and offset of each DAC channel can be independently
trimmed to remove errors. For even greater flexibility, the device is
divided into five groups of eight DACs. Three offset DAC channels
allow the output range of blocks to be adjusted. Group 0 can be
adjusted by Offset DAC 0, Group 1 can be adjusted by Offset
DAC 1, and Group 2 to Group 4 can be adjusted by Offset DAC 2.
The AD5370 offers guaranteed operation over a wide supply
nge, with V
ra
from −16.5 V to −4.5 V and VDD from +9 V to
SS
+16.5 V. The output amplifier headroom requirement is 1.4 V
operating with a load current of 1 mA.
1
Protected by U.S. Patent No. 5,969,657; other patents pending.
Table 1. High Channel Count Bipolar DACs
Model Resolution Nominal Output Span Output Channels Linearity Error (LSB)
AD536016 bits 4 × V
AD536114 bits 4 × V
AD536216 bits 4 × V
AD536314 bits 4 × V
AD5370 16 bits 4 × V
AD537114 bits 4 × V
AD537216 bits 4 × V
AD537314 bits 4 × V
AD537814 bits ±8.75 V 32 ±3
AD537914 bits ±8.75 V 40 ±3
(20 V) 16 ±4
REF
(20 V) 16 ±1
REF
(20 V) 8 ±4
REF
(20 V) 8 ±1
REF
(12 V) 40 ±4
REF
(12 V) 40 ±1
REF
(12 V) 32 ±4
REF
(12 V) 32 ±1
REF
The AD5370 has a high speed serial interface that is compatible
with SPI, QSPI™, MICROWIRE™, and DSP interface standards
and can handle clock speeds of up to 50 MHz.
The DAC registers are updated on receipt of new data. All the
o
utputs can be updated simultaneously by taking the
LDAC
input low. Each channel has a programmable gain and an offset
adjust register to allow removal of gain and offset errors.
Each DAC output is gained and buffered on chip with respect to
n external SIGGNDx input. The DAC outputs can also be
a
switched to SIGGNDx via the
CLR
pin.
Rev. 0 | Page 3 of 28
AD5370
www.BDTIC.com/ADI
SPECIFICATIONS
PERFORMANCE SPECIFICATIONS
DVCC = 2.5 V to 5.5 V; VDD = 9 V to 16.5 V; VSS = −16.5 V to −8 V; V
R
= open circuit; gain (M), offset (C), and DAC offset registers at default values; all specifications T
Parameter Min Type Max Unit Test Conditions/Comments
ACCURACY
Resolution 16 Bits
Integral Nonlinearity −4 +4 LSB
Differential Nonlinearity −1 +1 LSB Guaranteed monotonic by design
Zero-Scale Error −10 +10 mV Before calibration
Full-Scale Error −10 +10 mV Before calibration
Gain Error 0.1 % FSR
Zero-Scale Error
Full-Scale Error
Span Error of Offset DAC −35 +35 mV
VOUT Temperature Coefficient
(VOUT0 to VOUT39)
DC Crosstalk
REFERENCE INPUTS (VREF0, VREF1)
VREF Input Current −10 +10 µA Per input, typically ±30 nA
VREF Range 2 5 V ±2% for specified operation
SIGGND INPUT (SIGGND0 to SIGGND4)2
DC Input Impedance 50 kΩ Typically 55 kΩ
Input Range −0.5 +0.5 V
SIGGND Gain 0.995 1.005
OUTPUT CHARACTERISTICS
Output Voltage Range VSS + 1.4 VDD − 1.4 V I
Nominal Output Voltage Range −4 +8 V
Short-Circuit Current 15 mA VOUTx to DVCC, VDD, or VSS
Load Current −1 +1 mA
Capacitive Load 2200 pF
DC Output Impedance 0.5
DIGITAL INPUTS
Input High Voltage 1.7 V DVCC = 2.5 V to 3.6 V
2.0 V DVCC = 3.6 V to 5.5 V
Input Low Voltage 0.8 V DVCC = 2.5 V to 5.5 V
Input Current −1 +1 µA
CLR High Impedance Leakage
Current
Input Capacitance
DIGITAL OUTPUTS (SDO, BUSY)
Output Low Voltage 0.5 V Sinking 200 A
Output High Voltage (SDO) DVCC − 0.5 V Sourcing 200 A
SDO High Impedance Leakage
Current
High Impedance Output
Capacitance
2
2
2
2
2
2
1 LSB After calibration
1 LSB After calibration
See the Offset DAC Channels section for
etails
d
5 ppm FSR/°C Includes linearity, offset, and gain drift
120 µV
2
−20 +20 µA
10 pF
−5 +5 µA
10 pF
Typically 20 µV; measured channel at midscale,
e change on any other channel
full-scal
= 1 mA
LOAD
Excluding the CLR
pin
1
Rev. 0 | Page 4 of 28
AD5370
www.BDTIC.com/ADI
Parameter Min Type Max Unit Test Conditions/Comments
1
POWER REQUIREMENTS
DVCC 2.5 5.5 V
VDD 9 16.5 V
VSS −16.5 −4.5 V
Power Supply Sensitivity
2
Full Scale/VDD −75 dB
Full Scale/VSS −75 dB
Full Scale/DVCC −90 dB
DICC 2 mA
= 5.5 V, VIH = DVCC, VIL = GND; normal
DV
CC
operating conditions
IDD 18 mA Outputs unloaded, DAC outputs = 0 V
20 mA Outputs unloaded, DAC outputs = full scale
ISS −18 mA Outputs unloaded, DAC outputs = 0 V
−20 mA Outputs unloaded, DAC outputs = full scale
Power Dissipation Unloaded (P) 280 mW VSS = −8 V, VDD = +9.5 V, DVCC = 2.5 V
Power-Down Mode Control register power-down bit set
DICC 5 µA
IDD 35 µA
ISS −35 µA
Junction Temperature
1
Temperature range for the AD5370 is −40°C to +85°C. Typical specifications are at 25°C.
2
Guaranteed by design and characterization, not production tested.
3
Where θJA represents the package thermal impedance.
3
130 °C TJ = TA + P
TOTAL
× θJA
AC CHARACTERISTICS
DVCC = 2.5 V; VDD = 15 V; VSS = −15 V; VREF0 = VREF1 = 3 V; AGND = DGND = SIGGND = 0 V; CL = 200 pF; RL = 10 kΩ; gain (M),
offset (C), and DAC offset registers at default values; all specifications T
Table 3. AC Characteristics
1
Parameter Min Typ Max Unit Test Conditions/Comments
DYNAMIC PERFORMANCE
Output Voltage Settling Time 20 µs Settling to 1 LSB from a full-scale change
30 µs DAC latch contents alternately loaded with all 0s and all 1s
Slew Rate 1 V/µs
Digital-to-Analog Glitch Energy 5 nV-s
Glitch Impulse Peak Amplitude 10 mV
Channel-to-Channel Isolation 100 dB VREF0 = VREF1 = 2 V p-p, 1 kHz
DAC-to-DAC Crosstalk 20 nV-s
Digital Crosstalk 0.2 nV-s
Digital Feedthrough 0.02 nV-s Effect of input bus activity on DAC output under test
Output Noise Spectral Density @ 10 kHz 250 nV/√Hz VREF0 = VREF1 = 0 V
1
Guaranteed by design and characterization, not production tested.
MIN
to T
, unless otherwise noted.
MAX
Rev. 0 | Page 5 of 28
AD5370
T
www.BDTIC.com/ADI
TIMING CHARACTERISTICS
DVCC = 2.5 V to 5.5 V; VDD = 9 V to 16.5 V; VSS = −16.5 V to −4.5 V; V
R
= open circuit; gain (M), offset (C), and DAC offset registers at default values; all specifications T
L
Table 4. SPI Interface
Parameter
t1
1, 2, 3
Limit at T
Min Typ Max
20 ns SCLK cycle time
MIN
, T
MAX
Unit Description
t2 8 ns SCLK high time
t3 8 ns SCLK low time
t4 11 ns
rising edge to BUSY falling edge
pulse width low (single-channel update); see Table 8
rising edge to LDAC falling edge
pulse width low
rising edge to DAC output response time
rising edge to LDAC falling edge
falling edge to DAC output response time
/RESET pulse activation time
pulse width low
time indicated by BUSY low
high time in readback mode
rising edge to BUSY falling edge
MIN
to T
, unless otherwise noted.
MAX
TIMING DIAGRAMS
DV
CC
R
L
2.2k
TO
OUTPUT
PIN
Figure 2. Load Circuit for
Ω
C
L
50pF
BUSY
Timing Diagram
V
OL
05813-002
O OUTPUT
PIN
Figure 3. Load Circuit for SDO Timing Diagram
Rev. 0 | Page 6 of 28
50pF
C
200µAI
L
200µAI
OL
VOH (MIN) – VOL (MAX)
OH
2
5813-003
AD5370
www.BDTIC.com/ADI
SCLK
SYNC
BUSY
LDAC
VOUTx
LDAC
VOUTx
SDI
1
1
2
2
1
2
t
t
4
t
5
t
7
t
8
DB23
t
1
24
3
t
2
t
6
DB0
t
9
t
1
t
11
t
10
12
t
13
24
t
17
t
14
t
15
t
13
t
17
t
16
CLR
VOUTx
RESET
VOUTx
BUSY
1
LDAC ACTIVE DURI NG BUSY.
2
LDAC ACTIVE AFTER BUSY.
t
18
t
19
t
18
t
20
t
23
05813-004
Figure 4. SPI Write Timing
Rev. 0 | Page 7 of 28
AD5370
SYNC
www.BDTIC.com/ADI
SCLK
SDI
INPUT WORD SPECIFIES
REGIS TER TO BE READ
SDO
t
22
DB0DB23DB23
LSB FROM PREVIOUS WRITE
Figure 5. SPI Read Timing
t
21
NOP CONDITIO N
DB0
DB23
SELECTED REG ISTER DAT A CLOCKED OUT
48
DB0
DB0
5813-005
Rev. 0 | Page 8 of 28
AD5370
www.BDTIC.com/ADI
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
60 mA do not cause SCR latch-up.
Table 5.
Parameter Rating
VDD to AGND −0.3 V to +17 V
VSS to AGND −17 V to +0.3 V
DVCC to DGND −0.3 V to +7 V
Digital Inputs to DGND −0.3 V to DVCC + 0.3 V
Digital Outputs to DGND −0.3 V to DVCC + 0.3 V
VREF0, VREF1 to AGND −0.3 V to +5.5 V
VOUT0 through VOUT39 to AGND VSS − 0.3 V to VDD + 0.3 V
SIGGND0 through SIGGND4 to AGND −1 V to +1 V
AGND to DGND −0.3 V to +0.3 V
Operating Temperature Range (TA)
Industrial (B Version) −40°C to +85°C
Storage −65°C to +150°C
Operating Junction Temperature
max)
(T
J
θJA Thermal Impedance
64-Lead LFCSP 25°C/W
64-Lead LQFP 45.5°C/W
Reflow Soldering
Peak Temperature 230°C
Time at Peak Temperature 10 sec to 40 sec
130°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. 0 | Page 9 of 28
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