ZTE ZM8300G Users Manual

ZTE ZM8300G Module Hardware User Manual

ZTE ZM8300G Module

Hardware User Manual

Product Model: ZM8300G IoT Module

Document Version: 1.3

Publishing Date: 2017-06-20

ZTE ZM8300G Module Hardware User Manual

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ZTE ZM8300G Module Hardware User Manual

Product Version

Document Version

Reason for Revision

Revision Date

ZM8300G IoT Module Hardware User Manual

V1.0

First edition

2017.03.01

ZM8300G IoT Module Hardware User Manual

V1.1

1. Updated the operating voltage, temperature range, and partial test data of the ZM8300G module.

2. Updated the Power on/off time of the ZM8300G module.

3. Updated the hardware reset procedure of the ZM8300G module.

4. Change the pin PIN34/35 to multiplex reserved function.

5. Updated the PSM function and added the active pown_on function.

6. Added information to the RF and antenna design sections.

7. Fixed font and formatting bugs.

2017.04.13

ZM8300G IoT Module Hardware User Manual

V1.2

1. Added remarks for pown_on scheme 3 to section 3.4.2.

2. Added precautions to section

3.4.4.

3. Added default configurations of serial ports to section 3.6.2.

4. Added the following information to Table 3-8: If the hot plugging function is unavailable, leave the UIM_DET pin not connected.

2017.05.04

Revision History

ZTE ZM8300G Module Hardware User Manual

Product Version

Document Version

Reason for Revision

Revision Date

5. Added precautions for MPP indicator lighting to section

3.11.1.

6. Added information about peripheral components in the circuit recommended for an antenna to section 3.13.2.

ZM8300G IoT module hardware manual

V1.3

1.added section 2.6

2.Update section 3.4.2 for module power of requirement

3.Update section 3.4.2 for module hard reset requirement

4.Update section 3.4.4/5/6/ for module waking up,state indication,PSM_MON

5.Update section 3.6 for description of UART

6.Update table 4-2,4-3,4-4 for parameter

2017.06.20

ZTE ZM8300G Module Hardware User Manual

Contents

1 OVERVIEW ............................................................................................................................... 7

1.1 SCOPE ...................................................................................................................................... 7

1.2 ACRONYMS ............................................................................................................................... 7

1.3 PRODUCT DESCRIPTION ............................................................................................................... 7

2 GENERAL INTRODUCTION ........................................................................................................ 9

2.1 ABOUT THIS CHAPTER ................................................................................................................. 9

2.2 FEATURE INTRODUCTION .............................................................................................................. 9

2.3 APPLICATION DIAGRAM ............................................................................................................. 11

2.4 CIRCUIT DIAGRAM .................................................................................................................... 11

2.5 OUTLINE DIMENSIONS DIAGRAM ................................................................................................. 12

2.6 TRANSFERRED BOARD AND DEBUG BOARD ............................................................................................. 13

3 APPLICATION INTERFACES ...................................................................................................... 14

3.1 ABOUT THIS CHAPTER ............................................................................................................... 14

3.2 DEFINITIONS OF LGA PINS ......................................................................................................... 14

3.2.1 Pin Definitions ............................................................................................................. 14

3.2.2 Pin Distribution ............................................................................................................ 18

3.3 POWER INTERFACES .................................................................................................................. 19

3.3.1 Overview of Power Pins ............................................................................................... 19

3.3.2 VSYS Primary Power .................................................................................................... 19

3.3.3 VIO Power .................................................................................................................... 20

3.4 CONTROL SIGNAL INTERFACES ..................................................................................................... 20

3.4.1 Overview of Control Signals ........................................................................................ 20

3.4.2 POWN_ON Signal ........................................................................................................ 20

3.4.3 RESET_N Signal ........................................................................................................... 22

3.4.4 WAKEUP_IN Signal ...................................................................................................... 23

3.4.5 WAKEUP_OUT Signal .................................................................................................. 24

3.4.6 PSM_MON Signal ........................................................................................................ 24

3.4.7 STATE Signal ................................................................................................................ 25

3.5 DEBUG_UART INTERFACE........................................................................................................ 25

3.6 BLSP INTERFACES ..................................................................................................................... 26

3.6.1 Pin Description ............................................................................................................ 26

3.6.2 UART Interfaces ........................................................................................................... 26

3.6.3 SPI Bus Interface .......................................................................................................... 27

ZTE ZM8300G Module Hardware User Manual

3.6.4 I2C Bus ......................................................................................................................... 29

3.7 GPIO INTERFACES .................................................................................................................... 30

3.8 USIM INTERFACE ..................................................................................................................... 31

3.8.1 Pin Description ............................................................................................................ 31

3.8.2 Electrical Characteristics and Design Points ................................................................ 31

3.8.3 Circuit Recommended for the USIM Card Interface..................................................... 32

3.9 USB INTERFACE ....................................................................................................................... 32

3.9.1 Pin Description ............................................................................................................ 32

3.9.2 Design Points and Recommended Circuit .................................................................... 33

3.10 AUDIO INTERFACES ................................................................................................................... 34

3.10.1 Pin Description ............................................................................................................ 34

3.10.2 Design Points ............................................................................................................... 34

3.11 ADC/MPP INTERFACES ............................................................................................................. 35

3.11.1 Pin Description ............................................................................................................ 35

3.11.2 Design Points ............................................................................................................... 35

3.12 JTAG INTERFACE ...................................................................................................................... 36

3.12.1 Pin Description ............................................................................................................ 36

3.12.2 Design Points ............................................................................................................... 37

3.13 ANTENNA INTERFACES ............................................................................................................... 37

3.13.1 Pin Description ............................................................................................................ 37

3.13.2 Antenna Design Points ................................................................................................ 38

4 RF CHARACTERISTICS ............................................................................................................. 39

4.1 ABOUT THIS CHAPTER ............................................................................................................... 39

4.1.1 Power Supply ............................................................................................................... 39

4.1.2 Operating Current ....................................................................................................... 39

4.2 REFERENCE DESIGN FOR RF LAYOUT ............................................................................................. 39

4.3 TEST STANDARD FOR CONDUCTED RF ........................................................................................... 40

4.4 REQUIREMENTS FOR ANTENNA DESIGN......................................................................................... 40

4.4.1 Key Points for Antenna Design .................................................................................... 40

4.4.2 Antenna Efficiency ....................................................................................................... 41

4.4.3 VSWR ........................................................................................................................... 42

4.4.4 S11 ............................................................................................................................... 42

4.4.5 Polarization ................................................................................................................. 42

4.4.6 Radiation Pattern ........................................................................................................ 42

4.4.7 Requirements for IoT Antenna Design ......................................................................... 43

4.4.8 Precautions for Early Antenna Design ......................................................................... 43

ZTE ZM8300G Module Hardware User Manual

5 MECHANICAL CHARACTERISTICS ............................................................................................ 44

5.1 ABOUT THIS CHAPTER ............................................................................................................... 44

5.2 ASSEMBLY PROCEDURE .............................................................................................................. 44

5.2.1 Overview ..................................................................................................................... 44

5.2.2 Steel Mesh ................................................................................................................... 44

5.2.3 Reflow Curve ............................................................................................................... 46

5.3 REPAIR PROCEDURE .................................................................................................................. 47

5.3.1 Repair Procedure ......................................................................................................... 47

5.3.2 Module Dismantling .................................................................................................... 47

5.3.3 treatment in weld area ............................................................................................... 47

5.3.4 Module Installation ..................................................................................................... 47

5.3.5 Visual Inspection ......................................................................................................... 47

5.3.6 Feature Validation ....................................................................................................... 47

5.4 EMC AND ESD PROTECTION ...................................................................................................... 48

ZTE ZM8300G Module Hardware User Manual

Acronym

Full Name

ESD

Electro-Static discharge

USB

Universal Serial Bus

UART

Universal Asynchronous Receiver Transmitter

USIM

Universal Subscriber Identity Module

I/O

Input/Output

BLSP

BAM (bus access module) low-speed peripheral

SPI

Serial Peripheral Interface

I2C

Inter-Integrated Circuit

PCM

Pulse-coded Modulation

LED

Light Emitting Diode

GPIO

General-purpose input/output

EMC

Electromagnetic Compatibility

NB-IoT

Narrow Band Internet of Things

AP Application processor

1 Overview

1.1 Scope

This document is intended for customers who use and develop wireless IoT terminal products. This document provides information and precautions for developing the hardware of IoT terminal products using ZTE ZM8300G IoT wireless module. This document applies only to hardware development that uses the ZM8300G IoT wireless module.

1.2 Acronyms

Table 1-1 Acronyms Used in This Document

1.3 Product Description

The ZM8300G module is an IoT module that uses the LGA packaging. The ZM8300G module supports the CAT NB/eMTC, multiple band combinations such as Band 5/8 and Band 3/39,

ZTE ZM8300G Module Hardware User Manual

and Support for GNSS (GPS, Beidou, GLONASS, and Galileo), and provides a wide variety of interfaces, such as the USB, UART, SPI, I2C, PCM, and ADC. The ZM8300G module can be used for the development of various kinds of IoT products. This document describes the functions, application interfaces, RF characteristics, electrical characteristics, reliability, and mechanical characteristics of the ZM8300G module and provides precautions for design, with the goal of providing design guidelines and references for the hardware application and development of the ZM8300G module.

The ZM8300G module is small and its dimensions are as follows: 23.0 mm x 28.0 mm x 2.4 mm (excluding the label thickness, which is 0.1 mm). The ZM8300G module meets requirements of M2M applications and can be widely used in IoT-related devices such as data metering devices, data collection devices, security solution devices, wireless POS devices, and mobile computing devices.

Being an LGA module, the ZM8300G IoT module provides 67 pads (consisting of 58 LGA signal pads, seven JTAG test pads, and two PG pads) and can be applied to customers' design.

ZTE ZM8300G Module Hardware User Manual

Title

Description

Physical features

Dimensions: 23.0 mm x 28.0 mm x 2.4 mm

Weight: 3.3 g

Airlink

technologies

Supports the NB-IoT: Band 5/8,3/39.

Supports the GNSSes: GPS, Beidou, GLONASS, and Galileo.

Operating temperature

-40 to 85℃

Storage temperature

-40 to 85℃ Operating voltage

DC 3.0 V to 4.2 V (with the typical value being 3.6 V)

AT command set

Refer to the ZTE ZM8300G IoT Module AT Command Set.

Power consumption (3.6 V)

leakage current: 4.8 uA

PSM (power saving mode) sleep current: 7 uA

Average sleep current: 0.7 mA

Idle current：1.47mA , 2.56s DRX Online ◆注 1 idle current: note 1

Average operating current:

NB-IoT: 50 mA (UL)/50 mA (DL) ◆Note 2

2 General Introduction

2.1 About This Chapter

This chapter describes the ZM8300G module in general, covering the following aspects:

 Feature introduction  Application diagram  Circuit diagram  Outline dimensions diagram

2.2 Feature Introduction

Table 2-1 provides major technical parameters and features of the ZM8300G module.

Table 2-1 Major Technical Parameters and Features of the ZM8300G Module

ZTE ZM8300G Module Hardware User Manual

Title

Description

eMTC: 115 mA (UL)/112 mA (DL) ◆Note 3

Application interfaces (LGA interfaces)

USB 2.0 interface

USIM card interface (2.85 V and 1.8 V), supporting hot plugging

UART/JTAG debug interface

UART/SPI/I2C/GPIO (multiple combinations; for details, see Table 3-6

PCM/I2S interface

ADC/MPP interface

Startup/Shutdown interface

Module hardware reset interface

Status indication interface

AP waking up interface for module

Module waking up interface for AP

Antenna interface

Antenna pads (1xeMTC/NB-IoT antenna pad; 1xGPS antenna pad)

◆Note 1: The lab data(sleep and Idle current) provided by Qualcomm ‘s test data from lab.

◆Note 2: The lab data provided by Qualcomm ‘s test data from lab. The operating condition is as

follows: LTE 10 MHz bandwidth embedded data call@0dBm TX, UL/DL only. Used data packets are as follows: UL 62.5 kbps (15 kHz single tone)/DL 21 kbps (multi tone).

◆Note 3: The lab data provided by Qualcomm ‘s test data from lab. The operating condition is as follows: LTE 10 MHz bandwidth embedded data call@0dBm TX, UL/DL only. 375 kbps data packets are used in both the uplink and downlink directions.

ZTE ZM8300G Module Hardware User Manual

ZM8300 IoT

Application

interface

POWER

ANT

WAKEUP-IN/OUT

POWN_ON

RESET_N

WAKEUP-IN/OUT

STATE

PCM

USIM

CODEC

USB

MAIN ANT

GPS ANT

UART/SPI/I2C/

GPIO

LED

ADC/MPPADC/LED

3.0V~4.2V Typical

3.6V

USIM SLOT

eSIM

2.3 Application Diagram

Figure 2-1 Application Diagram of the ZM8300G Module

2.4 Circuit Diagram

Figure 2-2 is the circuit diagram of the ZM8300G module. The ZM8300G module consists of the following main function units:

 Baseband controller/power management unit

 Memory (1 Gbit NAND + 512 bit LPDDR2)

 LGA interface unit  RF transceiver IC  RF front-end circuit

ZTE ZM8300G Module Hardware User Manual

CPU

PMU

LGA

Interface

MCP

FLASH

transceiver

RF TRx

GPS Rx

RF_

RX/TX

GPS_RX

RF Front-end

RX/TX

CONTROL

VSYS

VIO

Power

supply

GPS_ANT

MAIN_ANT

USIM

UATR/SPI

/I2C

WAKEUP_IN

WAKEUP_OUT

WAKEUP_IN

STATUS

USB

PSM_MON

RESET_N

JTAG/UART

ZM8300 IoT

ADC/MPP

POWN_ON

JTAG/Debug_UART

USIM/eSIM

USB

UATR/SPI

/I2C

STATUS

PSM_MON

WAKEUP_OUT

VIO

RESET_N

POWN_ON

Figure 2-1 Circuit Diagram of the ZM8300G Module

2.5 Outline Dimensions Diagram

Figure 2-3 Dimensions of the ZM8300G Module (in mm)

ZTE ZM8300G Module Hardware User Manual

Figure 2-4 Dimensions of the BOT Side of the ZM8300G Module (in mm) ◆Note 4

◆Note 4: Figure 2-4 is the outline pad diagram of the ZM8300G module. If pad design of a

system board is required, ZTE can provide a dedicated outline drawing file.

2.6 transferred board and debug board

ZTE provide transferred board,debug board and peripheral such as antenna,power supplier,Serial Interface cable in order to better apply the ZM8300G to design the product for you,detailed referred to <<ZTE debug board use manual for module product>>

ZTE ZM8300G Module Hardware User Manual

Type

Description

Digital output

Digital input

Bidirectional digital

Power input

Power output

3 Application Interfaces

3.1 About This Chapter

This chapter describes the following major interfaces provided by the ZM8300G module:

 Power interfaces  Control signal interfaces  DEBUG_UART interface  BLSP interfaces  GPIO interfaces  USIM interface  USB interface  Audio interfaces  ADC/MPP interfaces  JTAG interface  Antenna interfaces

3.2 Definitions of LGA Pins

The ZM8300G IoT module uses the LGA package and has 67 pads, namely, 58 signal pads, seven JTAG test pads, and two PG pads. Using the pads, the ZM8300G module is connected to a customer's IoT application platform. The following sections describe interfaces provided by the ZM8300G module.

3.2.1 Pin Definitions

Table 3-1 provides definitions for input/output parameters of pins of the ZM8300G module.

Table 3-1 Definitions for Input/Output Parameters of Pins of the ZM8300G Module ◆Note 1

ZTE ZM8300G Module Hardware User Manual

Out

Analog input

Analog output

Signal

Type

Description

Param

eter

Minim

Value

(V)

Typica

l Value

(V)

Maxim

Value

(V)

Remarks

GND

Grounding

- - -

MAIN_ANT

Main antenna interface

- - -

50 Ω

GND

Grounding

- - -

4 GND

GND

Grounding

- - -

STATE

Module status indication

signal

VOH 1 1.8

1.9

1.8 V Power domain

VOL 0 -

0.45

WAKEUP_IN

AP waking up module

signal

VIH 1 -

2.1

VIL 0 -

0.63

WAKEUP_OUT

module waking up AP

signal

VOH 1 1.8

1.9

VOL 0 -

0.45

PSM_MON

Module deep sleeping

indication signa

VOH 1 1.8

1.9

VOL 0 -

0.45

9 GND

GND

Grounding

- - -

GND

Grounding

- - -

GPS_ANT

GPS antenna interface

- - - - 50 ohms

GND

Grounding

- - -

GND

Grounding

- - -

GND

Grounding

- - -

DEBUG_UART_RX

Debug serial port RX

signal

VIH - -

Led out by means of

external design

DEBUG_UART_TX

Debug serial port TX

signal

VOH - -

BLSPA_0

Two groups of four-wire

BLSP signals being

configured as UART,

SPI, I2C, and GPIO

interfaces

VIH 1 -

2.1

1.8 V power domain

BLSPA_1

BLSPA_2

VIL 0 -

0.63

BLSPA_3

BLSPB_0

VOH 1 1.8

1.9

BLSPB_1

◆Note 1: The pin directions in Table 3-1 are based on the body of the ZM8300G module.

Table 3-2 provides definitions for pins of the ZM8300G LGA module.

Table 3-2-1 Definitions for Interfaces Provided by the ZM8300G Module

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