This manual has been provided for the use of authorized Yamaha Retailers and their service personnel. It has been assumed
that basic service procedures inherent to the industry, and more specifically Yamaha Products, are already known and understood by the users, and have therefore not been restated.
WARNING :Failure to follow appropriate service and safety procedures when servicing this product may result in per-
IMPORTANT :This presentation or sale of this manual to any individual or firm does not constitute authorization certifi-
The data provided is belived to be accurate and applicable to the unit(s) indicated on the cover. The research engineering, and
service departments of Yamaha are continually striving to improve Yamaha products. Modifications are, therefore, inevitable
and changes in specification are subject to change without notice or obligation to retrofit. Should any discrepancy appear to
exist, please contact the distributor’s Service Division.
WARNING :Static discharges can destroy expensive components. Discharge any static electricity your body may have
IMPORTANT :Turn the unit OFF during disassembly and parts replacement. Recheck all work before you apply power
sonal injury, destruction of expensive components and failure of the product to perform as specified. For
these reasons, we advise all Yamaha product owners that all service required should be performed by an
authorized Yamaha Retailer or the appointed service representative.
cation, recognition of any applicable technical capabilities, or establish a principal-agent relationship of
any form.
accumulated by grounding yourself to the ground bus in the unit (heavy gauge black wires connect to
this bus.)
to the unit.
WARNING: CHEMICAL CONTENT NOTICE!
The solder used in the production of this product contains LEAD. In addition, other electrical/electronic and/or plastic (Where
applicable) components may also contain traces of chemicals found by the California Health and Welfare Agency (and possibly
other entities) to cause cancer and/or birth defects or other reproductive harm.
DO NOT PLACE SOLDER, ELECTRICAL/ELECTRONIC OR PLASTIC COMPONENTS IN YOUR MOUTH FOR ANY REASON WHAT
SO EVER!
Avoid prolonged, unprotected contact between solder and your skin! When soldering, do not inhale solder fumes or expose
eyes to solder/flux vapor!
If you come in contact with solder or components located inside the enclosure of this product, wash your hands before handling
food.
WARNING
Components having special characteristics are marked and must be replaced with parts having specification equal to those
originally installed.
PROTECTION OF EYES FROM LASER BEAM DURING SERVICING
When checking the laser diode emission, keep your eyes more than 30 cm away from the objective lens.
WARNING: LASER SAFETY
This product contains a laser beam component. This component may emit invisible, as well as visible radiation,
which may cause eye damage. To protect your eyes and skin from laser radiation, the following precaution
must be used during servicing of the unit.
1) When testing and / or repairing any component within the product, keep your eyes and skin more than
30cm away from the laser pick-up unit at all time. Do not stare the laser beam at any time.
2) Do not attempt readjustment,disassemble and repair of the laser pick-up, unless noted elsewhere in this
manual.
3) CAUTION - Use of controls or readjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.
Laser Diode Properties
* Material : GaAlAs
* Wavelength : 783–789 nm
* Emission Duration : Continuous
* Laser Output Power : Less than 44.6 µW
(Note)
Laser output is measured at a
distance of 20cm from the object
lens on the optical pick-up head.
CAUTION
VARNING
VARO!
VARNING
VORSICHT!
: INVISIBLE LASER RADIATION WHEN OPEN.
AVOID EXPOSURE TO BEAM.
: OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR
ÖPPEND. STRÅLEN ÄR FARLIG.
: NÄKYMÄTÖNTÄ AVATTAESSA OLET ALTTIINA
LESERSÄTEILYLLE. ÄLÄ KATSO SÄTEESEEN.
: OSYNLIG LASERSTRÅLNING NÄR DENNA DEL ÄR
ÖPPNAD. BETRAKTA EJ STRÅLEN.
: UNSICHTBARE LESERSTRAHLUNG WENN ABDECKUNG
GEÖFFNET. NICHT DEM STRAHL AUSSETZEN.
This label is located on the
exterior.
CLASS 1 LASER PRODUCT
LUOKAN 1 LASERLAITE
KLASS 1 LASERAPPARAT
On USA or Canadian
models do not have this
label.
Klassmärkning för Finland.
• This label is located on
the interior.
• Varningsanvisning för
laserstrålning. Placerad
i apparaten.
SPECIFICATIONS
CDR1000
Recording media
Playback media
Sampling rate
Recording resolution
Converters
Frequency response
Track
Index
SRC (Sampling Rate Converter)
UV22
S/N
Input delay
Fade in/out time
Synchronized recording
20 Hz–20 kHz
Up to 99 tracks
Up to 99 indexes
30 kHz to 50 kHz
16-bit encoding
97 dB
0–4,950 ms
0–10 second
CD, MD, DAT
Repeat playback
Locate
Type
Characters
Time counter
Display
Power requirements
Power consumption
Dimensions (W H D)
Weight
Free-air operating temperature range
Relative humidity
Display mode
Track counter
Index counter
Level meters
××
One track, All track, A–B
PREV, NEXT, INDEX, SEARCH, direct select
VFD (Vacuum Fluorescent Display)
12-character line
Minutes and seconds
Elapse, Remain, Total
0–99
0–99
16 segment with CLIP indicator x2
U.S.A. & Canada 120 V AC, 60 Hz
Europe 230 V AC, 50 Hz
33 W
480 ×
101 × 389 mm (18.9 x 4 x 15.3 inches)
8 kg (17.6 lbs)
5˚ C to 35˚ C (41˚ F to 95˚ F)
10%–95%
C & CMAIN-CN1
C & C7P/L250
C & C5P/L250
B & C10P/L200
C & C
C & C
C & C9P/L350
C & C6P/L160
PSW2P/L340
VR6P/L220
CDRW4P/L600
DO2P/L180
AO4P/L230
MAIN to CDR40P/L120
Parts List
No.
8P/L200FRONT 250
FRONT 260
FRONT 270
FP CN2
8P/L250
3P/L250
OVERALL 410
OVERALL 420
OVERALL 440
OVERALL 450
OVERALL 350
OVERALL 360
OVERALL 370
OVERALL 390
OVERALL 380
OVERALL 400
(CD-R/W Drive)
CN1
CN4CN3CN2CN12
Power Transf ormer
J: XV755
U, C: XV756
H, B: XV757
FP 3/7FP 1/7
CN5
CN2
FL
CN3 CN4
CN1
Front Panel
CN105
CN104
CN6 CN7 CN8
FP 2/7
FP 4/7 FP 5/7 FP 6/7
CN9
FP 7/7
6
CIRCUIT BOARD LAYOUT
MAIN
CDR1000
PS
CRW Unit
FP 3/7
Power
Transformer
FP 1/7
FP 2/7
FP 4/7FP 7/7
FP 5/7FP 6/7
7
CDR1000
DISASSEMBLY PROCEDURE
1. Top Cover
Remove the seven (7) screws marked [320] and
remove the top cover by sliding it rearward.
[320]:Bind Head Tapping Screw-B A3.0x8 MFZN2BL+BindB Tight (VP157000)
2. Circuit Boards and Units
After removing the top cover , remov e the following scre w .
Each circuit board and unit can then be removed. (Fig.1)
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-P 3.0 X MFZN2BL
Jack Socket 17L-003A3
Bind Head Screw A3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B A3.0 X 8 MFZN2BL
Bind Head Tapping Screw-P 3.0 X 8 MFZN2BL
Pan Head Screw SP4.0 X 25 MFZN2BL
Bind Head Tapping Screw-B A4.0 X 8 MFZN2BL
Bind Head Tapping Screw-B A3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B A3.0 X 8 MFZN2BL
3
12
2
1
4
2
2
4
4
4
9
3. Circuit Board in Front Panel Assembly
3-1 Remove the top cover.(See procedure 1.)
3-2 After removing the front panel assembly, remove the
following screw. Each circuit board in the front panel
assembly can then be removed. (Fig. 2)
Bind Head Tapping Screw-B A3.0 X 8 MFZN2BL
Knob
Knob
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Hexagonal Nut 9.0
Hexagonal Nut 9.0
Hexagonal Nut 9.0
Bind Head Screw A3.0 X 6 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
Bind Head Tapping Screw-B 3.0 X 8 MFZN2BL
4
1
1
2
1
2
1
2
4
2
2
8
CDR1000
[160][120][160]
[30]
[50]
[40]
[60]
[160][90][90] [80]
[120]
[120]
[120]
[80][160]
[120]
[70][200]
[190]
FP 7/7
FP 6/7
FP 4/7
FP 6/7
FP 3/7
FP 1/7
FP 2/7
FP 5/7FP 6/7
FP 4/7FP 7/7
Tray panel [230]
Tray [220b]
[250]
[A]
CDR angle [240]
Front panel [220a]
Stopper pin
Cover
4.CRW Unit
4-1. Remove the four (4) screws marked [250], and the
angle can be removed.
4-2. Remove the two (2) screws marked [A] and push in
the four (4) hooks on both side.
Then the cover can be removed.
4-3. Remove the front panel marked [220a] of the unit
and then the tray marked [220b].
Push up the stopper located on the left side of the
tray a little, and the tray can be removed.
[100]
[60]
[100]
[110]
〈
TOP VIEW
〈
FRONT VIEW
[190][100]
[530]
〉
〉
[100]
[120]
[320]
[100]
[320]
MAIN
Power
Transformer
[320]
[130]
[260]
[260]
CRW Unit
[300]
[300]
[320]
[260]
Fig.1
[130] [280]
[180] [530]
PS
[300]
[320]
[300]
[150]
[160]
[130]
[160]
[150]
[160]
[300]
[320]
[320]
〈
A VIEW
〉〈
B VIEW
〉
Fig.2
Fig.3
9
CDR1000
AK4520A-VF-E2 (XT802A00) DAC&ADC
PIN
NO.
NAMEI/OFUNCTION
PIN
NO.
NAMEI/OFUNCTION
1 VREFHI
Positive Voltage Reference Input, VA
15MCLKIMaster Clock Input
2VREFLI
Negative Voltage Reference Input, AGND
16DEM0I
De-emphasis Frequency Select
3AINR+I
Rch Analog Positive Input
17DEM1I
De-emphasis Frequency Select
4AINR-I
Rch Analog Negative Input
18TST3I/O
5AINL+I
Lch Analog Positive Input
19TST2I/OTest Pins (Pull Down Pins)
6AINL-I
Lch Analog Negative Input
20TST1I
7VA -
Analog Power Supply
21VD-Digital Power Supply
8AGND-
Analog Ground
22DGND-Digital Ground
9DIF0I
Audio Data Interface Format
23 /PWDAIDAC Power-Down Mode
10DIF1I
Audio Data Interface Format
24 /PWADIADC Power-Down Mode
11LRCKI
Input/Output Channel Clock
25 CMODEI
Master Clock Select (“H”:384fs,“L”:256fs)
12SCLKI
Audio Serial Data Clock
26 AOUTLOLch Analog Output
13SDTII
Audio Serial Data Input
27 AOUTRORch Analog Output
14SDTOO
Audio Serial Data Output
28VCOMOCommon Voltage Output, VA/2
YM3436 (XG948A00) DIR2 (Digital Format Interface)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
DAUX
HDLT
DOUT
VFL
OPT
SYNC
MCC
WC
MCB
MCA
SKSY
XI
XO
P256
LOCK
Vss
TC
DIM1
DIM0
DOM1
DOM0
KM1
I
O
O
O
O
O
O
O
O
O
I
I
O
O
O
O
I
I
I
I
I
Auxiliary input for audio data
Asynchronous buffer operation flag
Audio data output
Parity flag output
Fs 1 Synchronous output signal for DAC
Fs 1 Synchronous output signal for DSP
Fs 64 Bit clock output
Fs 1 Word clock output
Fs 128 Bit clock output
Fs 256 Bit clock output
Clock Synchronous control input
Crystal oscillator connection or external clock input
Crystal oscillator connector
VCO oscillating clock connection
PLL lock flag
Logic section power
PLL time constant switching output
Data input mode selection
Data input mode selection
Data output mode selection
Data output mode selection
Clock mode switching input 1
System reset input
VCO section power (+5V)
VCO control input N
PLL phase comparison output
VCO control input P
VCO section power (GND)
Test terminal. Open for normal use
Clock mode switching input 2
Clock mode switching input 0
Channel status sampling frequency display output 1
Channel status sampling frequency display output 0
Channel status output method selection
External synchronous auxiliary input word clock
EIAJ (AES/EBU) data input
PLL word clock output
Logic section power (+5V)
Data error flag output
Channel status emphasis control code output
3-wire type microcomputer interface data output
3-wire type microcomputer interface clock input
3-wire type microcomputer interface load input
PIN
No.
NAME I/OFUNCTION
PIN
No.
NAME I/OFUNCTION
TC4053BF (XB738A00)
IC43
MULTIPLEXER
SN75124NS (XN976A00)
IC31
LINE RECEIVER
NJM5532M (XC011A00)
IC46, IC47
OP AMP
1Switches IN/OUT
Y1
2
3
4
5
6
7
8
do Y0
do Z1
Commons IN/OUT 7
Z
Switches IN/OUT
Z0
Control Inhibit
DC Voltage Supply
do
V
DD
Y
X
X1
X0
A
B
C
9
10
11
12
13
14
15
16
+DC Voltage Supply
Commonsl OUT/IN Y
do X
Switches IN/OUT X1
do X0
Control Input A
do B
do C
Y1
Y0
Z1
Z
Z0
INH
VEE
V
SS
1
2
3
4
5
6
7
1A
1B
2R
2S
2A
2B
2Y
8
GND
16
10
11
12
14
15
3R
9
3Y
3S
3A
1Y
1R
1S
13
Vcc
1
2
3
4
8
7
6
5
A OUT
A+IN
V+
B OUT
B+IN
A IN
V
B IN
LSI PIN DESCRIPTION
YSS228E-F (XQ962D00) DSP3 (Digital Signal Processor)IC1
PIN
NAME
NO.
1
2
3
4
/SYNCI
5
/SYNCO
6
7
CKO
8
CKSL
9
10
MCKS
11
/SSYNC
12
13
/TEST
14
BTYP
15
16
TRIG
17
18
19
20
21
22
23
24
25
26
27
28
29
30
CA0/CD15
31
CD14
32
CD13
33
CD12
34
CD11
35
CD10
36
CD09
37
CD08
38
CD07
39
CD06
40
41
42
CD05
43
CD04
44
CD03
45
CD02
46
CD01
47
CD00
48
/DTACK
49
50
51
52
53
54
55
56
57
58
10
59
60
61
62
63
64
65
66
67
DB00
68
DB01
69
DB02
70
DB03
71
DB04
72
DB05
73
DB06
74
DB07
75
DB08
76
DB09
77
DB10
78
DB11
79
DB12
80
I/O
VSS
XI
XO
VDD
CKI
VSS
/IC
/IRQ
VDD
VSS
/CS
/DS
R/W
CA7
CA6
CA5
CA4
CA3
CA2
CA1
I
I
O
I
O
I
I
I
I
I
I
O
I/O
I
I
I
I
I
I
I
I
I
I
I/O
Ground
System master clock input (60 M or30 MHz)
System master clock input (60 M or30 MHz)
Power supply
System synch. input
System synch. output
System clock input (30 MHz)
System clock output (30 MHz)
System master clock select (0:60 M,1:30 MHz)
Ground
Master clock for serial I/O(128 xFs)
Synch. signal for serial I/O
Initial clear
Test mode setting
CPU data bus 8/16 bit select(0:8,1:16)
Interrupt request
Trigger signal
Power supply
Ground
Chip select
Data strobe
Read/Write select