IBM and IBM products are registered trademarks of International Business Machines
Corporation.
Macintosh and Power Macintosh are registered trademarks of Apple Computer, Inc.
VINC and VINC products are registered trademarks of V, Inc.
VESA, EDID, DPMS and DDC are registered trademarks of Video Electronics Standards
Association (VESA).
Energy Star is a registered trademark of the US Environmental Protection Agency (EPA).
No part of this document may be copied, reproduced or transmitted by any means for any
purpose without prior written permission from VINC.
FCC INFORMATION
This equipment has been tested and found to comply with the limits of a Class B digital device,
pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses and can radiate radio frequency energy, and if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is
no guarantee that the interference will not occur in a particular installation. If this equipment
does cause unacceptable interference to radio or television reception, which can be
determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures -- reorient or relocate the receiving
antenna; increase the separation between equipment and receiver; or connect the into an
outlet on a circuit different from that to which the receiver is connected.
FCC WARNING
To assure continued FCC compliance, the user must use a grounded power supply cord and
the provided shielded video interface cable with bonded ferrite cores. Also, any unauthorized
changes or modifications to Amtrak products will void the user’s authority to operate this
device. Thus VINC Will not be held responsible for the product and its safety.
CE CERTIFICATION
This device complies with the requirements of the EEC directive 89/336/EEC with regard to
“Electromagnetic compatibility.”
SAFETY CAUTION
Use a power cable that is properly grounded. Always use the AC cords as follows – USA (UL);
Canada (CSA); Germany (VDE); Switzerland (SEV); Britain (BASEC/BS); Japan (Electric
Appliance Control Act); or an AC cord that meets the local safety standards.
VIZIO VX37L HDTV10A Service Manual
Page 4
Chapter 1 Features
1. Built in TV channel selector for TV viewing.
2. Simulatnueous display of PC and TV images.
3. Connectable to PC’s analog RGB port.
4. Built in S-video, HDTV, composite video, HDMI and TV out.
5. Built in auto adjust function for automatic adjument of screen display.
6. Smoothing function enables display of smooth texts and graphics even if image
withresolution lower than 1366x768 is magnified.
7. Advanced video functions for personal favor.
8. Picture In Picture (PIP) funtion to show TV or VCR images.
9. Power saving to reduce consumption power too less than 3W.
10. On Screen Display: user can define display mode (i.e. color, brightness, contrast,
sharpness, backlight), sound setting, PIP, TV channel program, aspect and
gamma or reset all setting.
CONFIDENTIAL – DO NOT COPYPage 1-1
File No. SG-0209
Page 5
Chapter 2 Specification
1. TFT-LCD CHARACTERISTICS
Model Name: LPL LC370WX1-SLA1 (Vendor: LG. Philips LCD Co., Ltd)
Size: 3702inch
Display Size: 37.02 inches (940.3mm) diagonal
Outline Dimension: 877.0 mm (H) x 516.8 mm (V) x 55.5 mm (D) (Typ.)
16. 5-bit data (10-channel) I2S out interface up to 24-bit resolution per channel
20. Peripherals:
1. Two UARTs with a transmitter and a receiver FIFO, one of them has a hardware flow
control
2. Three serial interfaces, one is the master for general purposes, one is the master for
the HDMI key, and the remaining one is the slave for the HDMI EDID data
4. Three PWMs
5. IR blaster and receiver
6. Real-time clock and watchdog controller
7. Smart Card reader
8. PCMCIA/POD/CI interfaces
9. Supports three NOR flash or one NOR and one NAND flash
10. Supports CableCARD host control bus
21. IC Outline:
1. The MT5372 is delivered in 588-ball BGA package
2. 3.3V/1.2V and 2.5V for DDR1; 1.8V for DDR2
CONFIDENTIAL – DO NOT COPYPage 7-8
File No. SG-0209
Page 40
Ⅲ. Electrical Characteristics
1. Absolute Maximum Rating
2. DC Characteristics
3. DDR1 ELECTRICAL Characteristics and DC Operating Condition
CONFIDENTIAL – DO NOT COPYPage 7-9
File No. SG-0209
Page 41
4. DDR1 AC Operating Condition
5. DDR2 ELECTRICAL Characteristics and DC Operating Condition
6. DDR2 AC Operating Condition
CONFIDENTIAL – DO NOT COPYPage 7-10
File No. SG-0209
Page 42
MT5112
1. GENERAL DESCRIPTION
The MT5112BD is a highly integrated single-chip for digital terrestrial HDTV and digital
cable TV de-modulation. The chip is designed specifically for the digital terrestrial HDTV
and CATV receivers, and is fully compliant with ATSC A/53, SCTE DVS-031, and ITU J.83
Annex B standards.
FUNCTIONAL BLOCK DIAGRAM
CONFIDENTIAL – DO NOT COPYPage 7-11
File No. SG-0209
Page 43
PIN ASSIGNMENT
CONFIDENTIAL – DO NOT COPYPage 7-12
File No. SG-0209
Page 44
PIN DESCRIPTION
CONFIDENTIAL – DO NOT COPYPage 7-13
File No. SG-0209
Page 45
2. 8-VSB and Clear-QAM Reception
MT5112BD contains a 10-bit A/D converter, an 8-VSB/QAM demodulator, followed by a
trellis-code de-modulation (TCM) decoder and a Reed-Solomon forward error correction
(FEC) decoder. Moreover, an embedded 8-bit microprocessor intelligently handles the
acquisition and tracking to ensure the best receiving performance under various channel
conditions. The microprocessor communicates with the external host controller via an
I2C-compatible interface, and also provides direct control to the RF tuner via another
I2C-compatible interface.
MT5112BD accepts the tuner IF output centered at 44MHz or 43.75MHz, or the low IF
signals from a down-converter. With good adjacent channel immunity, additional IF SAW
filters for adjacent channel rejection can be saved. An on-chip programmable
gain-controlled amplifier (PGA) is designed to provide extra signal gain when the tuner
output level is low. The amplified IF signal is then sample and digitized for further
demodulation process.
MT5112BD keeps A/D input power level at a desired level so as to maximize the received
SNR. It measures the power level of the digitized samples and provide two signals (both
sigma-delta encoded; one delayed and one non-delayed) for front-end gain control
purpose. The signals is low-pass filtered before connected to tuner or IF gain stages.
For the 8-VSB reception, the carrier frequency offset is estimated and compensated by a
fully digital synchronizer. It also controls the rate conversion in the digital re-sampling
device by estimating the sampling frequency offset; hence no external VCXO is required.
The digital synchronizer simultaneously offers very wide frequency acquisition range and
stable tracking capability. This makes MT5112BD robust work under severe impairment
conditions.
The MT5112BD is equipped with a powerful equalizer for mitigating the multi-path effects
due to terrestrial propagation of 8-VSB signals. The delicate equalizer design makes the
MT5112BD boast its ability for strong echo cancellation. With this powerful equalizer, the
MT5112BD can not only easily pass the tests of A74 equalization mask, ATTC channel
ensembles, CRC channel ensembles, but also provide superior capability of live signal
receptions.
CONFIDENTIAL – DO NOT COPYPage 7-14
File No. SG-0209
Page 46
For cable signal reception, the MT5112BD adopts the fully digital modules for timing and
carrier synchronization, with no external VCXO required. Specially designed carrier
synchronization module enables the MT5112BD passing the OpenCable ATP burst and
phase noise tests, while maintaining excellent reception performance under normal
reception conditions.
The MT5112BD also utilizes a powerful equalizer for performing channel equalization in
cable environments. The MT5112BD equipped with this powerful equalizer can easily
pass the SCTE channel tests and offer stable and excellent live signal receptions.
The following FEC decoder corrects most of the errors by the concatenation of the TCM
and Reed-Solomon decoders with an in-between de-interleaver. Specifically for the digital
cable TV reception, the MT5112BD first detects and aligns de-puncturing timing of the
received sequence before TCM decoding. Besides, two synchronization circuits are each
inserted before the de-interleaver and after the Reed-Solomon decoder to automatically
delineate the FEC frames and transport stream packets respectively. An on-chip error rate
estimator can simultaneously monitor the receiving qualities at the three stages: the
equalizer output, the TCM decoder, and the transport stream packets. At the last stage,
the MT5112BD incorporates a buffer to smooth out the uneven arrival time of transport
stream packets. The chip finally outputs the smoothed decoded MPEG-2 transport stream
packets in either the serial or parallel transport stream format.
In addition to the demodulation of HDTV signal, MT5112BD provides the capability to
remove narrow-band interference such as the co-channel NTSC signal and CW tones
which generally exists in broadcast environment.
To achieve the best reception, an antenna control interface compliant with EIA/CEA-909 is
equipped into the MT5112BD to configure the antenna parameters. Both the unidirectional
mode A and the bi-directional mode B operation schemes are supported.
CONFIDENTIAL – DO NOT COPYPage 7-15
File No. SG-0209
Page 47
3. FEATURES
1. Compliant with ATSC digital television standard
2. Supports SCTE DVS-031 and ITU J.83 Annex B digital CATV standard
3. Accepts direct IF (44 MHz or 43.75MHz) and low IF (5.38MHz)
4. Differential IF input with programmable input signal level: 0.5Vpp to 2Vpp
5. NTSC interference rejection capability
6. Compensate echo up to -35 to +60us range for terrestrial HDTV reception
7. Pass all Brazil fading channel ensembles
8. Meet all ATSC/A74 requirements.
9. On-chip programmable gain amplifier
10. 25MHz crystal for clock generation
11. Excellent adjacent and co-channel rejection capability, only single SAW is required
12. Full-digital timing recovery, no VCXO is required
13. Full-digital frequency offset recovery with wide acquisition range ±1MHz for ATSC
and ±250kHz for CATV reception
14. Dual digital AGC controls for IF and RF respectively
15. MPEG-2 transport stream output in parallel or serial format
16. On-chip error rate estimators for TS packets, TCM decoder, and equalizer
17. EIA/CEA-909 antenna interface, both mode A and mode B are supported
18. Controlled by I2C interface
19. Supports sleep mode to save power consumption
20. Core power supply: 1.8V, peripheral power supply: 3.3V
21. 100-TQFP with lead free package
WM8776
The WM8776 is a high performance, stereo audio codec with five channel input selector.
The WM8776 is ideal for surround sound processing applications for home hi-fi, DVD-RW
and other audiovisual equipment. Etch ADC channel has programmable gain control with
automatic level control. Digital audio output word lengths from 16-32 bits and sampling
rates from 32kHZ to 96KHZ are supported. The DAC has an input mixer allowing an
external analogue signal to be mixed with the DAC signal. There are also Headphone and
line outputs, with control for the headphone.
The WM8776 supports fully independent sample rates for the ADC and DAC. The audio
data interface supports I2S, left justified, right justified and DSP formats.
CONFIDENTIAL – DO NOT COPYPage 7-16
File No. SG-0209
Page 48
1. BLOCK DIAGRAM
Audio sample rate
The master clock forWM8776 supports DAC and ADC audio sampling rates 256fs to 768fs,
where fs is the audio sample frequency (DACLRC or ADCLRC) typically 32KHZ, 44.1KHZ,
48KHZ or 96KHZ (the DAC also supports operation at 128fs and 192fs and 192KHZ
sample rate). The master clock is used to operate the digital filters and the noise shaping
circuits.
In slave mode the WM8776 has a master detection circuit that automatically determines
the relationship between the master clock frequency and the sampling rate (to within +/-
32 system clocks) If there is a greater than 32 clocks error the interface is disabled and
ADCLRC/DACLRC for optical performance, although the WM8776 is tolerant of phase
variations or jitter on this clock.
Table shows the typical master clock frequency inputs for the WM8776.
CONFIDENTIAL – DO NOT COPYPage 7-17
File No. SG-0209
Page 49
2. DIGITAL AUDIO INTERFACE
1. Slave mode
The audio interfaces operations in either slave mode selectable using the MS control bit.
In slave mode DIN is always an input to the WM8776 and DOUT is always an output. The
default is Slave mode. In slave mode (ms=0) ADCLRC, DACLRC, ADCBCLK, DACBCLK
are input to the WM8776.
DIN and DACLRC are sampled by the WM8776 on the rising edge of DACBCLK;
ADCLRC is sampled on the rising edge of ADCBCLK. ADC data is output on DOUT and
changes on the falling edge of ADCBCLK. By setting control bit BCLKINV the polarity of
ADCBCLK and DACBCLK may be reversed so that DIN and DACLRC are sample on the
falling edge of DACBCLK, ADCLRC is sampled on the falling edge of ADCBCLK and
DOUT changes on the rising of ADCBCLK.
Slave mode as shown in the following figure.
CONFIDENTIAL – DO NOT COPYPage 7-18
File No. SG-0209
Page 50
2. 2 Wire serial control mode
The wm8776 supports software control via a 2-wire serial bus. Many devices can be
controlled by the same bus, and each device has a unique 7-bit address (this is not the
same as the 7-bit address of each register in the wm8776). The wm8776 operates as a
slave device only.
2-wire serial interface as shown in the following figure.
The wm8776 has two possible device addresses, which can be selected using the CE pin
In the L32 LCD TV CE pin is LOW (device address is 34h)
In the L32 wm8776 has 2-wire interface
CONFIDENTIAL – DO NOT COPYPage 7-19
File No. SG-0209
Page 51
TDA8946
In L32 TV the TDA8946AJ is a dual-channel audio power amplifier with DC gain control. It
has an output power of 2 10 W at an 8 load and a 12 V supply.
Block diagram
1. Input configuration
The TDA8946AJ inputs can be driven symmetrical (floating) as well as asymmetrical. In
the asymmetrical mode one input pin is connected via a capacitor to the signal source and
the other input is connected to the signal ground. The signal ground should be as close as
possible to the SVR (electrolytic) capacitor ground. Note that the DC level of the input pins
is half of the supply voltage VCC, so coupling capacitors for both pins are necessary.
CONFIDENTIAL – DO NOT COPYPage 7-20
File No. SG-0209
Page 52
2. Output power measurement
The output power as a function of the supply voltage is measured on the output pins at
THD = 10%,in the L32 LCD TV Vcc=12V so we can see as shown in the following figure
output about 7W.
CONFIDENTIAL – DO NOT COPYPage 7-21
File No. SG-0209
Page 53
3. Mode selection
In the L32 LCD TV TDA8946AJ has two functional modes, which can be selected by
applying the proper DC voltage to pin MODE.
1. Mute — In this mode the amplifier is DC-biased but not operational (no audio output).
This allows the input coupling capacitors to be charged to avoid pop-noise. The device is
in mute mode when 3.5 V < VMODE < (VCC 1.5 V).
2. Operating — In this mode the amplifier is operating normally. The operating mode is
activated at VMODE<1.0V.
Flash: MX29LV320BTTC
The MX29LV320AT/B is a 32-mega bit Flash memory organized as 4M bytes of 8 bits and
2M words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable
read/write non-volatile random access memory.
The MX29LV320AT/B is packaged in 48-pin TSOP and 48-ball CSP. It is designed to be
reprogrammed and erased in system or in standard EPROM programmers. The standard
MX29LV320AT/B offers access time as fast as 70ns, allowing operation of high-speed
microprocessors without wait states. To eliminate bus contention, the MX29LV320AT/B
has separate chip enable (CE) and output enable (OE) controls.
MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure
and programming. The MX29LV320AT/B uses a command register to manage this
functionality. MXIC Flash technology reliably stores memory contents even after 100,000
erase and program cycles.
CONFIDENTIAL – DO NOT COPYPage 7-22
File No. SG-0209
Page 54
The MXIC cell is designed to optimize the erase and program mechanisms. In addition, the
combination of advanced tunnel oxide processing and low internal electric fields for erase
and programming operations produces reliable cycling.
The MX29LV320AT/B uses a 2.7V to 3.6V VCC supply to perform the High Reliability
Erase and auto Program/Erase algorithms.
The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi
process. Latch-up protection is proved for stresses up to 100 milliamperes on address and
data pin from -1V to VCC + 1V.
CONFIDENTIAL – DO NOT COPYPage 7-23
File No. SG-0209
Page 55
BLOCKDIAGRAM
CONFIDENTIAL – DO NOT COPYPage 7-24
File No. SG-0209
Page 56
BUS OPERATION-1
Legend:
L=Logic LOW=VIL, H=Logic High=VIH, VID=12.00.5V, VHH=11.5 -12.5V, X=Don't Care,
AIN=Address IN, DIN=Data IN,DOUT=Data OUT
Notes:
1. When the WP/ACC pin is at VHH, the device enters the accelerated program mode. See
"Accelerated Program Operations" for more information.
2. The sector group protect and chip unprotect functions may also be implemented via
programming equipment. See the "Sector Group Protection and Chip Unprotection"
section.
3. If WP/ACC=VIL, the two outermost boot sectors remain protected. If WP/ACC=VIH, the
two outermost boot sector protection depends on whether they were last protected or
unprotected using the method described in "Sector/Sector Block Protection and
Unprotection". If WP/ACC=VHH, all sectors will be unprotected.
4. DIN or Dout as required by command sequence, data polling, or sector protection
algorithm.
5. Address are A20:A0 in word mode (BYTE=VIH), A20:A-1 in byte mode (BYTE=VIL).
CONFIDENTIAL – DO NOT COPYPage 7-25
File No. SG-0209
Page 57
BUS OPERATION-2
Notes:
1.Code=00h means unprotected, or code=01h protected.
2.Code=99 means factory locked, or code=19h not factory locked.
WRITE COMMANDS/COMMAND SEQUENCES
To program data to the device or erase sectors of memory , the system must drive WE and
CE to VIL, and OE to VIH.An erase operation can erase one sector, multiple sectors , or the
entire device. A "sector address" consists of the address bits required to uniquely select a
sector. Writing specific address and data commands or sequences into the command
register initiates device operations. Table A defines the valid register command sequences.
Writing incorrect address and data values or writing them in the improper sequence resets
the device to reading array data. Section has details on erasing a sector or the entire chip, or
suspending/resuming the erase operation.
After the system writes the Automatic Select command sequence, the device enters the
Automatic Select mode. The system can then read Automatic Select codes from the internal
register (which is separate from the memory array) on Q7-Q0. Standard read cycle timings
apply in this mode. Refer to the Automatic Select Mode and Automatic Select Command
Sequence section for more information.ICC2 in the DC Characteristics table represents the
active current specification for the write mode. The "AC Characteristics" section contains
timing specification table and timing diagrams for write operations.
CONFIDENTIAL – DO NOT COPYPage 7-26
File No. SG-0209
Page 58
TABLE A. MX29LV320AT/B COMMAND DEFINITIONS
Legend:
X=Don't care
RA=Address of the memory location to be read.
RD=Data read from location RA during read operation.
PA=Address of the memory location to be programmed.
Addresses are latched on the falling edge of the WE or CE pulse.
PD=Data to be programmed at location PA. Data is latched on the rising edge of WE or CE
pulse.
SA=Address of the sector to be erased or verified. Address bits A20-A12 uniquely select any
sector.
ID=22A7h(Top), 22A8h(Bottom)
Notes:
1.All values are in hexadecimal.
2.Except when reading array or Automatic Select data, all bus cycles are write operation.
3.The Reset command is required to return to the read mode when the device is in the
Automatic Select mode or if Q5 goes high.
4.The fourth cycle of the Automatic Select command sequence is a read cycle.
5.The data is 99h for factory locked and 19h for not factory locked.
6.The data is 00h for an unprotected sector/sector block and 01h for a protected
sector/sector block. In the third cycle of the command sequence, address bit A20=0 to
verify sectors 0~31, A20=1 to verify sectors 32~70 for Top Boot device.
CONFIDENTIAL – DO NOT COPYPage 7-27
File No. SG-0209
Page 59
7.Command is valid when device is ready to read array data or when device is in Automatic
Select mode.
8.The system may read and program functions in non-erasing sectors, or enter the
Automatic Select mode, when in the erase Suspend mode. The Erase Suspend command
is valid only during a sector erase operation.
9.The Erase Resume command is valid only during the Erase Suspend mode.
STANDBY MODE
MX29LV320AT/B can be set into Standby mode with two different approaches. One is
using both CE and RESET pins and the other one is using RESET pin only.
When using both pins of CE and RESET, a CMOS Standby mode is achieved with both
pins held at Vcc ±0.3V. Under this condition, the current consumed is less than 0.2uA
(typ.). If both of the CE and RESET are held at VIH, but not within the range of VCC ± 0.3V,
the device will still be in the standby mode, but the standby current will be larger. During
Auto Algorithm operation, Vcc active current (ICC2) is required even CE = "H" until the
operation is completed. The device can be read with standard access time (tCE) from
either of these standby modes.
When using only RESET, a CMOS standby mode is achieved with RESET input held at
Vss 0.3V, Under this condition the current is consumed less than 1uA (typ.). Once the
RESET pin is taken high, the device is back to active without recovery delay.In the standby
mode the outputs are in the high impedance state, independent of the OE
input.MX29LV320AT/B is capable to provide the Automatic Standby Mode to restrain
power consumption during readout of data. This mode can be used effectively with an
application requested low power consumption such as handy terminals.
To active this mode, MX29LV320AT/B automatically switch themselves to low power
mode when MX29LV320AT/B addresses remain stable during access time of tACC+30ns.
It is not necessary to control CE, WE, and OE on the mode. Under the mode, the current
consumed is typically 0.2uA (CMOS level).
RESET OPERATION
01The RESET pin provides a hardware method of resetting the device to reading array
data. When the RESET pin is driven low for at least a period of tRP, the device
immediately terminates any operation in progress, tristates all output pins, and ignores all
read/write commands for the duration of the RESET pulse. The device also resets the
internal state machine to reading array data. The operation that was interrupted should be
reinitiated once the device is ready to accept another command sequence, to ensure data
integrity.
CONFIDENTIAL – DO NOT COPYPage 7-28
File No. SG-0209
Page 60
Current is reduced for the duration of the RESET pulse. When RESET is held at
VSS0.3V, the device draws CMOS standby current (ICC4). If RESET is held at VIL but
not within VSS0.3V, the standby current will be grea ter.The RESET pin may be tied to
system reset circuitry. A system reset would that also reset the Flash memory, enabling
the system to read the boot-up firm-ware from the Flash memory.
If RESET is asserted during a program or erase operation, the RY/BY pin remains a "0"
(busy) until the internal reset operation is complete, which requires a time of tREADY
(during Embedded Algorithms). The system can thus monitor RY/BY to determine whether
the reset operation is complete. If RESET is asserted when a program or erase operation
is not executing (RY/BY pin is "1"), the reset operation is completed within a time of
tREADY (not during Embedded Algorithms). The system can read data tRH after the
RESET pin returns to VIH. Refer to the AC Characteristics tables for RESET parameters
and to Figure 14 for the timing diagram.
WRITE PROTECT (WP)
The write protect function provides a hardware method to protect boot sectors without
using VID.
If the system asserts VIL on the WP/ACC pin, the device disables program and erase
functions in the two "outermost" 8 Kbyte boot sectors independently of whether those
sectors were protected or unprotected using the method described in Sector/Sector Group
Protection and Chip Unprotection". The two outermost 8 Kbyte boot sectors are the two
sectors containing the lowest addresses in a bottom-boot-configured device, or the two
sectors containing the highest addresses in a top-boot-configured device.
If the system asserts VIH on the WP/ACC pin, the device reverts to whether the two
outermost 8K Byte boot sectors were last set to be protected or unprotected. That is,
sector protection or unprotection for these two sectors depends on whether they were last
protected or unprotected using the method described in "Sector/Sector Group Protection
and Chip Unprotection".
Note that the WP/ACC pin must not be left floating or unconnected; inconsistent behavior
of the device may result.
CONFIDENTIAL – DO NOT COPYPage 7-29
File No. SG-0209
Page 61
SOFTWARE COMMAND DEFINITIONS :
Device operations are selected by writing specific address and data sequences into the
command register. Writing incorrect address and data values or writing them in the
improper sequence will reset the device to the read mode. Table 3 defines the valid
register command sequences. Note that the Erase Suspend (B0H) and Erase Resume
(30H) commands are valid only while the Sector Erase operation is in progress. Either of
the two reset command sequences will reset the device (whenapplicable).
All addresses are latched on the falling edge of WE or CE, whichever happens later. All
data are latched on rising edge of WE or CE, whichever happens first.
WRITE OPERATION STATUS
The device provides several bits to determine the status of a write operation: Q2, Q3, Q5,
Q6, Q7, and RY/BY.Table B and the following subsections describe the functions of these
bits. Q7, RY/BY, and Q6 each offer a method for determining whether a program or erase
operation is complete or in progress. These three bits are discussed first.
Table B. Write Operation Status
Notes:
1.Performing successive read operations from the erase-suspended sector will cause Q2
to toggle.
2.Performing successive read operations from any address will cause Q6 to toggle.
3.Reading the byte/word address being programmed while in the erase-suspend program
mode will indicate logic "1" at the Q2 bit.
However, successive reads from the erase-suspended sector will cause Q2 to toggle.
CONFIDENTIAL – DO NOT COPYPage 7-30
File No. SG-0209
Page 62
Fig C. COMMAND WRITE OPERATION
Fig D. READ TIMING WAVEFORMS
CONFIDENTIAL – DO NOT COPYPage 7-31
File No. SG-0209
Page 63
Fig E. RESET TIMING WAVEFORM
CONFIDENTIAL – DO NOT COPYPage 7-32
File No. SG-0209
Page 64
DRAM: (NT5DS16M16CS)
The 256Mb DDR SDRAM is a high-speed CMOS, dynamic random-access memory
containing 268, 435, 456 bits. The 256Mb DDR SDRAM is internally configured as a
quad-bank DRAM.
The 256Mb DDR SDRAM uses a double-data-rate architecture to achieve high-speed
operation. The double-data-rate architecture
is essentially a 2n prefetch architecture, with an interface designed to transfer two data
words per clock cycle at the I/O pins. A single read or write access for the 256Mb DDR
SDRAM consists of a single 2n-bit wide, one clock cycle data transfer at
the internal DRAM core and two corresponding n-bit wide, one-half clock cycle data
transfers at the I/O pins.
Read and write accesses to the DDR SDRAM are burst oriented; accesses start at a
selected location and continue for a programmed number of locations in a programmed
sequence. Accesses begin with the registration of an Active command, which is then
followed by a Read or Write command.
The address bits registered coincident with the Active command are used to select the bank
and row to be accessed (BA0, BA1 select the bank; A0-A12 select the row). The address
bits registered coincident with the Read or Write command are used to select the starting
column location for the burst access.
Prior to normal operation, the DDR SDRAM must be initialized. The following sections
provide detailed information covering device initialization, register definition, command
descriptions and device operation.
CONFIDENTIAL – DO NOT COPYPage 7-33
File No. SG-0209
Page 65
1. Pin Configuration
CONFIDENTIAL – DO NOT COPYPage 7-34
File No. SG-0209
Page 66
2. Input/Output Functional Description
CONFIDENTIAL – DO NOT COPYPage 7-35
File No. SG-0209
Page 67
3. Block Diagram
4. Initialization
Only one of the following two conditions must be met.
• No power sequencing is specified during power up or power down given the following
criteria:
VDD and VDDQ are driven from a single power converter output
VTT meets the specification
A minimum resistance of 42 ohms limits the input current from the VTT supply into any
pin and VREF tracks VDDQ /2 or The following relationships must be followed:
VDDQ is driven after or with VDD such that VDDQ < VDD + 0.3V
VTT is driven after or with VDDQ such that VTT < VDDQ + 0.3V
VREF is driven after or with VDDQ such that VREF < VDDQ + 0.3V
CONFIDENTIAL – DO NOT COPYPage 7-36
File No. SG-0209
Page 68
The DQ and DQS outputs are in the High-Z state, where they remain until driven in normal
operation (by a read access). After all power supply and reference voltages are stable, and
the clock is stable, the DDR SDRAM requires a 200µs delay prior to applying an
executable command.
Once the 200µs delay has been satisfied, a Deselect or NOP command should be applied,
and CKE must be brought HIGH. Following the NOP command, a Precharge ALL
command must be applied. Next a Mode Register Set command must be issued for the
Extended Mode Register, to enable the DLL, then a Mode Register Set command must be
issued for the Mode Register, to reset the DLL, and to program the operating parameters.
200 clock cycles are required between the DLL reset and any read command.
A Precharge ALL command should be applied, placing the device in the “all banks idle”
state Once in the idle state, two auto refresh cycles must be performed. Additionally, a
Mode Register Set command for the Mode Register, with the reset DLL bit deactivated (i.e.
to program operating parameters without resetting the DLL) must be performed.
Following these cycles, the DDR SDRAM is ready for normal operation.
DDR SDRAM’s may be reinitialized at any time during normal operation by asserting a
valid MRS command to either the base or extended mode registers without affecting the
contents of the memory array. The contents of either the mode register or extended mode
register can be modified at any valid time during device operation without affecting the
state of the internal address refresh counters used for device refresh.
CONFIDENTIAL – DO NOT COPYPage 7-37
File No. SG-0209
Page 69
5. Register Definition
6. Burst Definition
CONFIDENTIAL – DO NOT COPYPage 7-38
File No. SG-0209
Page 70
Notes:
1. For a burst length of two, A1-A i selects the two-data-element block; A0 selects the first
access within the block.
2. For a burst length of four, A2-A i selects the four-data-element block; A0-A1 selects the
first access within the block.
3. For a burst length of eight, A3-A i selects the eight-data- element block; A0-A2 selects
the first access within the block.
4. Whenever a boundary of the block is reached within a given sequence above, the
following access wraps within the block.
Burst Type
Accesses within a given burst may be programmed to be either sequential or interleaved;
this is referred to as the burst type and is selected via bit A3. The ordering of accesses
within a burst is determined by the burst length, the burst type and the starting column
address, as shown in Burst Definition on page 11.
Read Latency
The Read latency, or CAS latency, is the delay, in clock cycles, between the registration of
a Read command and the availability of the first burst of output data. The latency can be
programmed 2 or 2.5 clocks.
If a Read command is registered at clock edge n, and the latency is m clocks, the data is
available nominally coincident with clock edge n + m. Reserved states should not be used
as unknown operation or incompatibility with future versions may result.
Operating Mode
The normal operating mode is selected by issuing a Mode Register Set Command with
bits A7-A12 to zero, and bits A0-A6 set to the desired values. A DLL reset is initiated by
issuing a Mode Register Set command with bits A7 and A9-A12 each set to zero, bit A8
set to one, and bits A0-A6 set to the desired values. A Mode Register Set command
issued to reset the DLL should always be followed by a Mode Register Set command to
select normal operating mode. All other combinations of values for A7-A12 are reserved
for future use and/or test modes. Test modes and reserved states should not be used as
unknown operation or incompatibility with future versions may result.
CONFIDENTIAL – DO NOT COPYPage 7-39
File No. SG-0209
Page 71
DLL Enable/Disable
The DLL must be enabled for normal operation. DLL enable is required during power up
initialization, and upon returning to normal operation after having disabled the DLL for the
purpose of debug or evaluation.
The DLL is automatically disabled when entering self refresh operation and is automatically
re-enabled upon exit of self refresh operation. Any time the DLL is enabled, 200 clock cycles
must occur to allow time for the internal clock to lock to the externally applied clock before a
Read command can be issued.
This is the reason for introducing timing parameter tXSRD for DDR SDRAM’s (Exit Self
Refresh to Read Command). Non- Read commands can be issued 2 clocks after the DLL is
enabled via the EMRS command (tMRD) or 10 clocks after the DLL is enabled via self
refresh exit command (tXSNR, Exit Self Refresh to Non-Read Command).
CONFIDENTIAL – DO NOT COPYPage 7-40
File No. SG-0209
Page 72
7. Simplified State Diagram
CONFIDENTIAL – DO NOT COPYPage 7-41
File No. SG-0209
Page 73
8. Absolute Maximum Ratings
9. Capacitance
CONFIDENTIAL – DO NOT COPYPage 7-42
File No. SG-0209
Page 74
10. DC Electrical Characteristics and Operating Conditions
(0°C £ TA £ 70×C; VDDQ = 2.5V ± 0.2V, VDD = + 2.5V ± 0.2V, see AC Characteristics)
CONFIDENTIAL – DO NOT COPYPage 7-43
File No. SG-0209
Page 75
11. AC Characteristics
1. All voltages referenced to VSS.
2. Tests for AC timing, IDD, and electrical, AC and DC characteristics, may be conducted at
nominal reference/supply voltage levels, but the related specifications and device
operation are guaranteed for the full voltage range specified.
3. Outputs measured with equivalent load. Refer to the AC Output Load Circuit below.
4. AC timing and IDD tests may use a VIL to VIH swing of up to 1.5V in the test environment,
but input timing is still referenced to VREF (or to the crossing point for CK, CK), and
parameter specifications are guaranteed for the specified AC input levels under normal
use conditions. The minimum slew rate for the input signals is 1V/ns in the range between
VIL(AC) and VIH(AC).
5. The AC and DC input level specifications are as defined in the SSTL_2 Standard (i.e. the
receiver effectively switches as a result of the signal crossing the AC input level, and
remains in that state as long as the signal does not ring back above (below) the DC input